TW202002139A - Wafer frame carrier - Google Patents

Abstract

This invention discloses a wafer frame carrier. The wafer frame carrier comprises a container which is constructed by opening, a top plate, a bottom plate, a posterior plate and two sideboards. Each of the sideboards comprises a cassette structure and an anti-crash metal unit which is configured behind of the cassette structure, preventing the particle occurs and the container damage which is caused by the insertion of wafer frames.

Description

Wafer frame carrier

A wafer frame carrier, in particular a wafer frame carrier with a metal anti-collision part behind a cassette structure.

In the semiconductor carrier industry, the storage or delivery of various semiconductor components or semi-finished semiconductor products has become a very important issue. In the case of automated machines that have been commonly used, how to transport the required materials or semiconductor components to the desired place will test the properties of the vehicle, such as reducing the generation of tiny particles, antistatic or Is the nature of air tightness.

Common semiconductor components that need to be stored or transported include wafers, substrates, photomasks or wafer frames (Wafer Frame), etc. Moreover, the sizes used in different semiconductor manufacturing processes are different, so different sizes of carriers of various sizes are also derived.

Among them, the wafer frame (Wafer Frame) can also be called a bonding frame (Tape Frame), and its main function is used as a semiconductor device for fixing the wafer during dicing. The wafer frames are mostly transported through special carriers.

However, the traditional wafer frame carrier is mostly made of a polymer box body. When the wafer frame is placed, it is often hit by the wafer frame and hits the stopper. When the metal collides with the polymer, the hardness of the metal is usually higher. So over time, even if it is a polymer material with high hardness and wear resistance, it is easy to break or produce small particles.

Furthermore, the wafer frame itself is a heavier metal. Therefore, when the wafer frame carrier is transported through the crown crane, it is easy to cause stress and deformation of the wafer frame carrier due to the weight. Once the box is deformed, it may cause the originally required airtightness of the box to disappear.

On the door panel of such containers, there is usually a support for supporting the plate-shaped sheet in the box. However, if the support is protruding too much on the door panel, it is likely to cause the robot arm to scratch the crystal when moving the door panel up and down during the lid opening operation. The opening of the round frame carrier. Therefore, the conventional wafer frame carrier has many inconveniences in use and needs to be improved urgently.

In order to solve the problems mentioned in the prior art, the present invention provides a wafer frame carrier. The wafer frame carrier mainly includes a box body, a two-cassette structure, two metal anti-collision parts and a door panel.

Wherein, the box body includes an opening, a top plate, a bottom plate, a rear plate and two side plates to form a receiving space. The two cassette structures are arranged on the two side plates in the accommodating space, and the two metal anti-collision parts are arranged in sequence behind the cassette structure near one side of the rear plate. The door panel is closed with the opening. Wherein, the two metal anti-collision parts are sequentially fixed on the two side plates through a plurality of locking elements.

The above brief description of the present invention aims to provide a basic description of several aspects and technical features of the present invention. The brief description of the invention is not a detailed description of the invention, so its purpose is not to specifically list the key or important elements of the invention, nor to define the scope of the invention, but to present several concepts of the invention in a concise manner.

In order to understand the technical features and practical effects of the present invention, and to implement it in accordance with the contents of the specification, the preferred embodiments as shown in the drawings are further described in detail below:

First, please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 is a schematic diagram of the appearance and structure of an embodiment of the present invention; FIG. 2 is a schematic diagram of the internal structure of the embodiment of the present invention after opening the cover. As shown in FIGS. 1 and 2, the wafer frame carrier 10 mainly includes a box body 100 and two cassette structures 106 (another cassette structure 106 not shown in FIG. 2 is disposed inside the side plate 105 opposite to 106 in FIG. 2) 2. A two-metal anti-collision portion 107 (another metal anti-collision portion 107 not shown in FIG. 2 is provided inside the side plate 105 opposite to 106 in FIG. 2) and the door panel 200.

The box body 100 includes an opening 101, a top plate 102, a bottom plate 103, a rear plate 104, and two side plates 105 to form an accommodating space. The cassette structure 106 is disposed on the two side plates 105 in the accommodating space. More specifically, it is on the upper side plates 105 of the accommodating space. The metal anti-collision parts 107 are sequentially arranged behind the cassette structure 106 and close to one side of the rear plate 104. The door panel 200 can be closed with the opening 101. In addition, the metal anti-collision portions 107 on the left and right sides are sequentially fixed to the two side plates 105 through a plurality of locking elements 108.

Through the design in the embodiment of FIGS. 1 and 2, the metal anti-collision portions 107 on the left and right sides can replace the side plate 105 of the entire box 100 to withstand the impact of the wafer frame when the cassette structure 106 is placed in the wafer frame . Since the metal anti-collision portion 107 can be designed as high hardness metal such as stainless steel, high speed steel or aluminum alloy, it can further prevent the metal wafer frame from colliding with the box body 100, causing damage and resulting in poor air tightness or tiny The risk of particles. In order to facilitate the handling by the technical personnel, at least one handle 500 is further provided on the top plate 102 of the cassette body 10 of the wafer frame carrier 10 in this embodiment.

In addition, as shown in FIG. 2, in this embodiment, a deformation prevention member 300 is further provided on the side of the top plate 102 near the opening. In this embodiment, the anti-deformation member 300 is a metal strip, and the metal strip is provided with a plurality of fixing holes (not shown in the figure, a plurality of fixing elements 301 have passed through), and a plurality of fixing elements 301 pass through the A plurality of fixing holes fix the metal strip to the side of the top plate 102 near the opening 101. The design of the anti-deformation element 300 is mainly due to the fact that the wafer frames carried by the wafer frame carrier 10 are mostly made of heavy metals. Therefore, when the wafer frame carrier 10 is fully loaded, the crown crane lifts the wafer frame carrier 10, which may easily cause the opening 101 to be deformed.

Once the opening 101 is deformed, the adhesion between the box 100 of the wafer frame carrier 10 and the door panel 200 is not good, and the airtight effect cannot be achieved. Through the setting of the anti-deformation member 300, this phenomenon can be effectively minimized. In addition, when a plurality of fixing elements 301 pass through the plurality of fixing holes to fix the metal strip to the side of the top plate 102 close to the opening 101, the plurality of fixing elements 301 will not penetrate the top plate 102; instead, they are fixed in a similar way by embedding In the top plate 102, it is further ensured that the airtightness of the case 100 is not affected.

Since the wafer frames of different sizes require different container sizes, the weight of the loaded wafer frames is also different. Therefore, in other possible embodiments, the anti-deformation member 300 provided on the box body 100 may be designed in the form of a metal cage, and the opening 101, the top plate 102, the bottom plate 103, the rear plate 104, or both side plates on the box body 100 105 surrounds and reinforces, so that the box body 100 is less likely to be deformed, and the present invention is not limited. On the other hand, the box body 100 can also be designed with a plurality of anti-deformation ribs on the one-piece design to further stabilize its structure.

Of course, the door panel 200 in this embodiment is provided with a pair of latches 202, and the door panel 200 can be fixed to the opening 101 through the rotation locking method, so that the cassette body 100 of the wafer frame carrier 10 achieves the airtight effect.

Please refer to FIG. 3, FIG. 4 and FIG. 5 at the same time. FIG. 3 is a schematic diagram of the resisting structure of the embodiment of the present invention; FIG. 4 is a partial schematic diagram of the resisting structure of the embodiment of the present invention; Schematic diagram of relatively convex areas.

As shown in FIG. 3, the inner side of the door panel 200 of this embodiment is further provided with a resisting portion 201, and the resisting portion 201 includes a main board 2011. In order to better understand the structure of the resisting portion 201, please refer to the portion of the circular dashed line in FIG. 3 for an enlarged view of the detailed structure of this portion, please refer to FIG. As shown in FIG. 4, the resisting portion 201 in this embodiment includes a main board 2011, a plurality of through holes 2012, a plurality of support members 2013, and a plurality of engaging elements 2014.

Among them, a plurality of through holes 2012 are provided on the main board 2011, and the plurality of through holes 2012 are gourd-shaped. Therefore, after the engaging element 2014 passes through the larger hole in the gourd-shaped through hole 2012, it slides in the direction shown by the arrow in FIG. 4 to engage the main board 2011 in the smaller gourd-shaped through hole 2012 The hole is further fixed to the inner surface of the door panel 200, and the entire resisting portion 201 is fixed to the door panel 200.

In addition to the convenience of installation, the above structure allows technicians to replace the resisting portion 201 with different configurations as needed to meet different needs. In addition, the engaging element 2014 does not penetrate the door panel 200, and is embedded in the door panel 200, which further ensures the airtightness of the cassette body 100 of the wafer frame carrier 10. In a better embodiment, the engaging element 2014 may also be a part of the inner surface of the door panel 200 that is integrally formed, reducing the cost of the embedding operation.

As for the plurality of supporting members 2013, which are provided on the main board 2011, they are mainly responsible for resisting and supporting the wafer frame when the door panel 200 is closed on the opening 101, to prevent the door panel 200 from being unable to be closed or even damaged due to shaking or vibration hitting the door panel 200. In this embodiment, the support member 2013 is designed as a bat-like structure, and the bat-like structure has a concave structure, which can further withstand and slow down the swing amplitude of the wafer frame when shaking up and down along the box 100.

Before the wafer frame carrier 10 is taken out or put into the wafer frame, the door 200 often needs to be opened by a mechanical arm. After opening, the door panel 200 is moved up and down to expose the opening 101 before the subsequent wafer frame pick-and-place operation can be performed. Therefore, in order to avoid the plurality of supporting members 2013 from being scratched to the opening 101 when the door panel is moved, thereby causing damage. As shown in FIG. 5, a plurality of support members 2013 in this embodiment are designed to protrude from the door panel 200 by no more than 0.5 cm. In order to avoid damage to the structure near the plurality of support members 2013 or the opening 101 of the box 100 when the robot arm moves the door panel 200 to open and close, resulting in a large amount of minute particles.

Please refer to FIG. 6 and FIG. 7 at the same time. FIG. 6 is a cross-sectional view of a box body according to an embodiment of the present invention; FIG. 7 is a schematic diagram of an embedded structure of a locking element according to an embodiment of the present invention. As shown in FIG. 6, FIG. 6 is a cross-sectional view of the embodiment shown in FIGS. 1 and 2 taken along a plane in which a pair of metal bumpers 107 are configured. Through the illustration of FIG. 6, it can be clearly seen that the transparent window 400 is provided on the board 104 after this embodiment.

In this embodiment, the transparent window 400 may be selected from glass or plastic doped with metal ions. Moreover, the color can be made transparent or colorless or orange according to needs, and the invention is not limited thereto. The partial structure shown by the dotted line in FIG. 6 is explained in an enlarged manner in FIG. 7.

As shown in FIG. 7, in the present embodiment, the plurality of locking elements 108 fix the metal collision part 107 through the plurality of embedded elements 109 embedded in the side plates 105. In addition, a plurality of airtight ribs 1051 are further provided on the outer surface of the side wall 105 corresponding to the metal anti-collision portion 107. Through such a structural design, the purpose of installing the metal collision part 107 can be achieved while maintaining airtightness and structural stability. The provision of the airtight ribs 1051 can further prevent the risk of the metal collision portion 107 falling off due to the deformation of the side plate 105.

However, the above are only preferred embodiments of the present invention, and the scope of implementation of the present invention cannot be limited by this, that is, simple changes and modifications made according to the patent application scope and description of the present invention are still within the present invention. Covered.

10‧‧‧wafer frame carrier 100‧‧‧Box 101‧‧‧ opening 102‧‧‧Top board 103‧‧‧Bottom plate 104‧‧‧Back 105‧‧‧Side board 1051‧‧‧Airtight ribs 106‧‧‧ Cassette structure 107‧‧‧Metal Anti-collision Department 108‧‧‧Locking element 109‧‧‧Buried components 200‧‧‧door panel 201‧‧‧Resistance Department 2011‧‧‧ Motherboard 2012‧‧‧Pierce hole 2013‧‧‧Support 2014‧‧‧Snap element 202‧‧‧ latch 300‧‧‧Anti-deformation 301‧‧‧Fixed components 400‧‧‧transparent window 500‧‧‧handle

FIG. 1 is a schematic diagram of the appearance and structure of an embodiment of the present invention. 2 is a schematic diagram of the internal structure of the embodiment of the present invention after opening the cover. FIG. 3 is a schematic diagram of a resisting structure of an embodiment of the present invention. FIG. 4 is a partial schematic diagram of a resisting structure according to an embodiment of the invention. 5 is a schematic diagram of the resisting structure and the relatively protruding area of the door panel according to an embodiment of the present invention. 6 is a cross-sectional view of a box body according to an embodiment of the invention. 7 is a schematic diagram of the embedded structure of the locking element according to an embodiment of the invention.

10‧‧‧wafer frame carrier

100‧‧‧Box

101‧‧‧ opening

102‧‧‧Top board

103‧‧‧Bottom plate

104‧‧‧Back

105‧‧‧Side board

106‧‧‧ Cassette structure

107‧‧‧Metal Anti-collision Department

108‧‧‧Locking element

200‧‧‧door panel

202‧‧‧ latch

300‧‧‧Anti-deformation

301‧‧‧Fixed components

500‧‧‧handle

Claims (10)

A wafer frame carrier, comprising: a box body including an opening, a top plate, a bottom plate, a rear plate and two side plates to form an accommodating space; 　 a two-cassette structure provided in the accommodating space On both sides of the board; 　 two metal anti-collision parts, which are arranged behind the cassette structure in sequence close to one side of the rear plate; and a door plate, which covers the opening; The locking element is fixed on the two side plates. The wafer frame carrier according to claim 1, wherein the door panel further includes a resisting portion. The wafer frame carrier according to claim 2, wherein the resisting portion includes: a main board; a plurality of through holes provided on the main board, the plurality of through holes being gourd-shaped; a plurality of support members, It is arranged on the main board; and a plurality of engaging elements are inserted through the plurality of through holes and then slidably engaged to fix the resisting portion on the door panel. The wafer frame carrier according to claim 1, wherein a side of the top plate near the opening is further provided with an anti-deformation member. The wafer frame carrier according to claim 4, wherein the deformation prevention member is a metal strip, and the metal strip is provided with a plurality of fixing holes, and a plurality of fixing elements pass through the plurality of fixing holes to connect the metal strip It is fixed on the side of the top plate close to the opening. The wafer frame carrier according to claim 1, wherein at least one transparent window is further provided on the rear panel. The wafer frame carrier according to claim 1, wherein at least one handle is further provided on the top plate. The wafer frame carrier according to claim 1, wherein at least one latch is further provided on the door panel. The wafer frame carrier according to claim 1, wherein the plurality of locking elements fix the two-metal anti-collision portion through the plurality of embedded elements embedded in the two side plates. The wafer frame carrier according to claim 9, wherein the two metal anti-collision portions are provided with a plurality of airtight ribs corresponding to the outer surfaces of the two side plates.

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