TWM573077U - Wafer frame carrier - Google Patents

Abstract

This utility model discloses a wafer frame carrier. The wafer frame carrier comprises a container which is constructed by opening, a top plate, a bottom plate, a posterior plate and two sideboards. Each of the sideboards comprises a cassette structure and an anti-crash metal unit which is configured behind of the cassette structure, preventing the particle occurs and the container damage which is caused by the insertion of wafer frames.

Description

Wafer frame carrier

A wafer frame carrier, in particular a wafer frame carrier having a metal bumper behind a cassette structure.

In the semiconductor transfer industry, the storage or transfer of various semiconductor components or semiconductor semi-finished products has become a very important issue. In the case where automated machines are already in common use, how to transport the required materials or semiconductor components to the desired location will test the properties of the vehicle, such as reducing the generation of tiny particles, antistatic or It is a property such as air tightness.

Common semiconductor components that need to be stored or shipped include wafers, substrates, reticle or wafer frames, and the like. And the sizes used in different semiconductor processes are different, so vehicles of various sizes, large and small, are also derived.

Among them, the wafer frame (Wafer Frame) can also be called a tape frame, and its main function is as a semiconductor component for fixing during wafer dicing. Most of the wafer frames are transported through special vehicles.

However, most of the conventional wafer frame carriers are integrally formed of a polymer case, and when placed in the wafer frame, the wafer frame is often hit by the wafer frame. The hardness of the metal is usually higher when the metal collides with the polymer. Therefore, over time, even if it is a polymer material with high hardness and wear resistance, it is prone to breakage or generation of minute particles.

Furthermore, the wafer frame itself is a heavier metal. Therefore, when the wafer frame carrier is transported through the overhead crane, it is easy to cause stress deformation of the wafer frame carrier due to the weight. Once the box is deformed, it may cause the required airtightness of the box to disappear.

Such a container door panel usually has a support member for supporting the plate-shaped sheet in the box. However, if the support member protrudes from the door panel too much, it is likely to cause the robot arm to scratch the crystal when the door panel is moved up and down. The opening of the round frame carrier. Therefore, the conventional wafer frame carrier has many inconveniences in use and is in urgent need of improvement.

To solve the problems mentioned in the prior art, the present invention provides a wafer frame carrier. The wafer frame carrier mainly comprises a box body, a two-clip structure, a two-metal anti-collision portion and a door panel.

The box body comprises an opening, a top plate, a bottom plate, a rear plate and two side plates together to form an accommodation space. The two latch structures are disposed on the two sides of the accommodating space, and the two metal bumpers are sequentially disposed behind the latch structure near one side of the rear panel. The door panel is covered with the opening. The two metal bumpers are sequentially fixed to the two side plates through a plurality of locking components.

The above brief description of this creation aims to provide a basic explanation of several aspects of the creation and technical features of the creation. The new brief description is not a detailed description of the creation, so its purpose is not to specifically list the key or important elements of the creation, nor to define the scope of the creation, but to present several concepts of the creation in a concise manner.

In order to understand the technical features and practical functions of the present invention, and to implement according to the contents of the specification, the following further describes the preferred embodiment as shown in the following figure:

First, please refer to FIG. 1 and FIG. 2 at the same time. FIG. 1 is a schematic structural view of the present embodiment. FIG. 2 is a schematic view of the present invention after opening the cover and the internal structure. As shown in FIG. 1 and FIG. 2, the wafer frame carrier 10 mainly includes a casing 100 and a two-clamp structure 106 (an other card structure 106 not shown in FIG. 2 is disposed inside the side plate 105 opposite to the 106 in FIG. 2). The two metal collision preventing portion 107 (the other metal collision preventing portion 107 not shown in FIG. 2 is provided inside the side plate 105 opposite to the surface 106 in FIG. 2) and the door panel 200.

The case body 100 includes an opening 101, a top plate 102, a bottom plate 103, a rear plate 104, and two side plates 105 to form an accommodation space. The cassette structure 106 is disposed on the two side plates 105 in the accommodating space. Furthermore, it is placed on the upper side plates 105 in the space. The metal collision preventing portion 107 is sequentially disposed behind the cassette structure 106 on one side of the rear plate 104. The door panel 200 can be covered with the opening 101. The metal anti-collision portions 107 on the left and right sides are sequentially fixed to the side plates 105 through a plurality of locking members 108.

Through the design in the embodiment of FIG. 1 and FIG. 2, the metal anti-collision portions 107 on the left and right sides can replace the side plate 105 of the entire casing 100 to withstand the impact of the wafer frame when the cassette structure 106 is placed in the wafer frame. . Since the metal anti-collision portion 107 can be designed as a high-hardness metal such as stainless steel, high-speed steel or aluminum alloy, it is possible to further prevent the wafer frame made of metal from colliding with the casing 100, causing damage and causing poor airtightness or minuteness. The risk of particles. For the convenience of the technician, the top plate 102 of the wafer frame carrier 10 of the present embodiment is further provided with at least one handle 500.

In addition, as shown in FIG. 2, in the embodiment, an anti-deformation member 300 is further disposed on a side of the top plate 102 adjacent to the opening. In this embodiment, the deformation preventing member 300 is a metal strip, and the metal strip is provided with a plurality of fixing holes (not shown, which have been passed by the plurality of fixing members 301), and the plurality of fixing members 301 pass through the A plurality of fixing holes fix the metal strip to the side of the top plate 102 near the opening 101. The design of the deformation preventing member 300 is mainly because the wafer frame carried by the wafer frame carrier 10 is mostly composed of a relatively heavy metal. Therefore, when the wafer frame carrier 10 is fully loaded, the crane lifts the wafer frame carrier 10, which easily causes the opening 101 to be deformed.

Once the opening 101 is deformed, the adhesion between the wafer frame carrier 10 and the door panel 200 is poor, and the airtight effect cannot be achieved. Through the setting of the deformation preventing member 300, this phenomenon can be effectively minimized. In addition, when a plurality of fixing members 301 are fixed to the side of the top plate 102 near the opening 101 through the plurality of fixing holes, the plurality of fixing members 301 do not penetrate the top plate 102; instead, they are fixed in a similar manner to the embedded plate. In the top plate 102, it is further ensured that the airtightness of the casing 100 is not affected.

Due to the different sizes of containers required for different sizes of wafer frames, the weight of the wafer frame to be loaded is also different. Therefore, in other possible embodiments, the deformation preventing member 300 disposed on the casing 100 may be designed in the form of a metal cage, and the opening 101, the top plate 102, the bottom plate 103, the rear plate 104 or both side plates on the casing 100 105 surrounds the reinforcement, making the casing 100 less susceptible to deformation, and the creation is not limited. On the other hand, the box body 100 can be designed with a plurality of anti-deformation ribs in the integrally formed design to further stabilize the structure.

Of course, the door panel 200 in this embodiment is provided with a pair of latches 202 for fixing the door panel 200 to the opening 101 through a rotational locking manner, so that the casing 100 of the wafer frame carrier 10 can achieve airtightness.

Referring to FIG. 3, FIG. 4 and FIG. 5, FIG. 3 is a schematic diagram of the resisting structure of the present embodiment; FIG. 4 is a partial schematic view of the resisting structure of the present embodiment; FIG. 5 is a resisting structure and a door panel of the present creative embodiment. A schematic representation of the relative convex area.

As shown in FIG. 3 , the inner side of the door panel 200 of the embodiment further includes a resisting portion 201 , and the resisting portion 201 includes a main board 2011 . In order to better understand the structure of the resisting portion 201, please refer to the portion of the circular dotted line in FIG. 3, and the detailed structure of the portion is shown in FIG. As shown in FIG. 4 , the abutting portion 201 in this embodiment includes a main board 2011 , a plurality of through holes 2012 , and a plurality of supporting members 2013 to form a plurality of engaging elements 2014 .

The plurality of through holes 2012 are disposed on the main board 2011, and the plurality of through holes 2012 are in the shape of a gourd. Therefore, the engaging member 2014 can be passed through the larger hole in the gourd-shaped through hole 2012, and then slid in the direction indicated by the arrow in FIG. 4 to engage the main board 2011 in the gourd-shaped through hole 2012. The hole is further fixed to the inner surface of the door panel 200, and the entire abutting portion 201 is fixed to the door panel 200.

The advantages of the above structure, in addition to the convenience of installation, allow the technician to replace the resisting portions 201 of different configurations as needed to meet different needs. In addition to this, the engaging member 2014 is not embedded in the door panel 200, and is embedded in the door panel 200, thereby further ensuring the airtightness of the casing 100 of the wafer frame carrier 10. In a more preferred embodiment, the snap element 2014 can also be an integral part of the inner surface of the door panel 200, reducing the cost of the burying operation.

As for the plurality of support members 2013 disposed on the main board 2011, it is mainly responsible for resisting and supporting the wafer frame when the door panel 200 is covered by the opening 101 to prevent the door panel 200 from being intimate or even damaged due to shaking or vibration. In the present embodiment, the support member 2013 is designed as a slap-like structure, and the slap-like structure has a concave structure, which can further withstand and slow down the swing amplitude of the wafer frame as it sways up and down along the casing 100.

The wafer frame carrier 10 often needs to be opened by the robot arm before being taken out or placed in the wafer frame. After being opened, the door panel 200 is removed in the up and down direction, so that the opening 101 is exposed before the subsequent wafer frame pick and place operation can be performed. Therefore, in order to prevent the plurality of support members 2013 from scraping the opening 101 when the door panel moves, damage is caused. As shown in FIG. 5, the plurality of support members 2013 in the present embodiment are designed to protrude from the door panel 200 by no more than 0.5 cm. It is greatly avoided that when the mechanical arm moves the door panel 200 to open and close, the structure of the plurality of support members 2013 or the opening 101 of the casing 100 is damaged, resulting in a large amount of fine particles.

Please refer to FIG. 6 and FIG. 7 at the same time. FIG. 6 is a cross-sectional view of the box body of the present embodiment. FIG. 7 is a schematic view showing the embedding structure of the locking component of the present embodiment. As shown in Fig. 6, Fig. 6 is a cross-sectional view of the embodiment of Figs. 1 and 2 taken along a plane of a pair of metal collision avoidance portions 107. Through the illustration of Fig. 6, it can be clearly seen that the transparent window 400 is provided on the board 104 after the embodiment.

In this embodiment, the transparent window 400 may be selected from glass or plastic doped with metal ions. The color can be made transparent or colorless as needed, and the creation is not limited. The partial structure shown by a circular dashed line in Fig. 6 is explained in an enlarged manner in Fig. 7.

As shown in FIG. 7, in the present embodiment, the plurality of latching elements 108 fix the metal bumper 107 through a plurality of embedded elements 109 embedded in the side plates 105. Further, the metal collision preventing portion 107 is further provided with a plurality of airtight ribs 1051 corresponding to the outer surface of the side plate 105. Through such a structural design, the purpose of mounting the metal bumper 107 can be achieved while maintaining airtightness and structural stability. The provision of the airtight ribs 1051 can further prevent the risk of the metal collision preventing portion 107 falling off due to deformation of the side plates 105.

However, the above is only the preferred embodiment of the present invention. When it is not possible to limit the scope of the creation of the present invention, the simple changes and modifications made according to the scope and description of the patent application are still the creation. Within the scope of coverage.

10‧‧‧ Wafer Frame Vehicle

100‧‧‧ box

101‧‧‧ openings

102‧‧‧ top board

103‧‧‧floor

104‧‧‧ Back panel

105‧‧‧ side panels

1051‧‧‧ airtight ribs

106‧‧‧Carcass structure

107‧‧‧Metal anti-collision department

108‧‧‧Locking components

109‧‧‧Embedded components

200‧‧‧ door panel

201‧‧‧Resistance Department

2011‧‧‧ motherboard

2012‧‧‧With holes

2013‧‧‧Support

2014‧‧‧Card components

202‧‧‧Latch

300‧‧‧Anti-deformation parts

301‧‧‧Fixed components

400‧‧‧Transparent window

500‧‧‧提提

FIG. 1 is a schematic view showing the appearance of the present embodiment. FIG. 2 is a schematic view showing the structure after opening the cover and the internal structure of the present embodiment. FIG. 3 is a schematic diagram of a resistive structure of the present embodiment. FIG. 4 is a partial schematic view showing the resisting structure of the present embodiment. FIG. 5 is a schematic view showing the resisting structure and the relatively protruding area of the door panel in the present embodiment. Figure 6 is a cross-sectional view of the cartridge of the present embodiment. Fig. 7 is a schematic view showing the embedding structure of the locking component of the present embodiment.

Claims (10)

A wafer frame carrier comprising: a box body, comprising an opening, a top plate, a bottom plate, a rear plate and two side plates together to form a receiving space; the second card structure is disposed in the receiving space a two metal anti-collision portion, which is disposed in the rear of the cassette structure and is adjacent to one side of the rear plate; and a door panel that is covered with the opening; wherein the two metal anti-collision portions are sequentially passed through the plurality of The locking elements are fixed to the two side plates. The wafer frame carrier of claim 1, wherein the door panel further comprises a resisting portion. The wafer frame carrier of claim 2, wherein the resisting portion comprises: a main board; a plurality of through holes provided on the main board, the plurality of through holes are gourd-shaped; a plurality of supporting members, The card is disposed on the main board; and the plurality of engaging elements pass through the plurality of through holes and are slidably engaged to fix the abutting portion to the door panel. The wafer frame carrier of claim 1, wherein a side of the top plate adjacent to the opening is further provided with a deformation preventing member. The wafer frame carrier of claim 4, wherein the deformation preventing member is a metal strip, and the metal strip is provided with a plurality of fixing holes, and the plurality of fixing members pass the metal strip through the plurality of fixing holes Fixed to the side of the top plate adjacent to the opening. The wafer frame carrier of claim 1, wherein the rear panel further comprises at least one transparent window. The wafer frame carrier of claim 1, wherein the top plate is further provided with at least one handle. The wafer frame carrier of claim 1, wherein the door panel is further provided with at least one door latch. The wafer frame carrier of claim 1, wherein the plurality of latching components secure the two metal bumpers through a plurality of embedded components embedded in the two side plates. The wafer frame carrier of claim 9, wherein the two metal bumpers are further provided with a plurality of airtight ribs corresponding to the outer surfaces of the two side plates.