JP2009200247A - Packing method and packing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a packing method of properly and rapidly packing a substrate in a high density. <P>SOLUTION: In the packing method, a substrate 50 is housed in a housing region 65 extending along a vertical direction by using a transport device 20 which has a sucking portion 25 capable of sticking to the substrate to hold it by sucking. The packing method includes: a step for making the sucking portion stick to at least one side region of the substrate to hold it by sucking; a step for evaluating warping of the substrate; a step for positioning the substrate above the housing region so that the substrate is positioned in the housing region in a top view along the vertical direction; and a step for transporting the substrate to the housing region. The warping of the substrate is evaluated in a state where the substrate is held while the portion sucked by the sucking portion of the one side region is along the vertical direction. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a packing method and a packing device for packing a substrate by storing the substrate in a predetermined storage area, and more particularly to a packing method and a packing device that can pack a substrate accurately and quickly at a high density.

  For example, as disclosed in Patent Document 1, there is known a method and apparatus for transporting a substrate (a plate-like member) and storing (packing) it in a storage position.

In the method and apparatus disclosed in Patent Document 1, the substrate (wafer) is transported so that its plate surface is along the horizontal direction, and is stored in a predetermined storage position in a storage box (wafer carrier). It has become. Further, in the method and apparatus disclosed in Patent Document 1, while the substrate is being transported, the amount of deflection of the substrate maintained in a horizontal posture is measured, and the vertical position of the substrate is determined according to the measured amount of deflection. Adjustment is made for the storage area. Thereby, the collision with a board | substrate and a storage box can be prevented.
JP-A-11-251401

  Recently, however, the size of substrates used in various technical fields is increasing. In particular, the size of substrates used in flat panel displays, such as the back plate of plasma display panels, is rapidly increasing.

  When a large-sized substrate is handled using the method and apparatus disclosed in Patent Document 1, the amount of bending of the substrate is increased as a whole. Further, the substrate vibrates during transportation, and the amount of bending of the substrate cannot be measured accurately.

  When the amount of bending of the substrate increases, when the substrate is stored, the substrate is likely to be damaged by colliding with the wall surface of the storage region, and further, the substrate cannot be stored in the storage region. In addition, even when the amount of deflection is not accurately measured, a non-defective substrate will be discarded as a defective product with a too large amount of deflection, or when storing the substrate, the substrate will collide with the wall surface of the storage area. May damage the board. On the other hand, in order to accurately measure the amount of bending of the substrate, if the amount of bending of the substrate is measured after the vibration of the substrate is sufficiently attenuated, the time required to pack one substrate becomes extremely long.

  In order to solve such a problem, it is necessary to widen the opening of the storage area where the substrate is to be stored. In this case, the substrate is packed (stored) at a low density, which causes another problem that the packing body packed with the substrate becomes bulky.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide a packing method and a packing apparatus capable of packing a substrate accurately and quickly at a high density.

  The packing method according to the present invention is a packing method for storing the substrate in a storage region extending along a vertical direction using a transport device that has a suction portion that can suck the substrate and can hold the substrate. A step of adsorbing the adsorbing portion to at least one side region in the vicinity of one edge of the substrate of one surface of the substrate and adsorbing and holding the substrate; and The step of evaluating the warpage of the substrate while being held by the transfer device so as to be along the vertical direction in the portion adsorbed by the adsorbing unit, and the adsorbing unit in a top view along the vertical direction A step of positioning the substrate above the storage region based on the evaluation result of the warp so that the sucked substrate is located in the storage region, and moving the suction part downward along the vertical direction, in front Characterized in that it comprises a step of transporting the substrate to the storage region.

  In the step of sucking and holding the substrate of the packing method according to the present invention, the suction includes a plurality of suction pieces each having a longitudinal direction and arranged at intervals in a direction orthogonal to the longitudinal direction. A portion extending from one side of the substrate toward the other side of the substrate opposite to the one side so that the longitudinal direction of the suction piece is adsorbed to the substrate. In a state where the portion adsorbed by the adsorbing portion of the side region is held along the vertical direction, the longitudinal direction of the adsorbing piece may be along the vertical direction.

  Further, in the step of evaluating the warpage of the substrate in the packing method according to the present invention, the substrate may be stationary.

  Further, in the step of evaluating the warpage of the substrate in the packing method according to the present invention, the warpage to be evaluated is held so that the substrate is along the vertical direction in a portion where the substrate is adsorbed by the adsorption portion. Of the substrate in a state where the substrate is held along the vertical direction in a portion along the vertical direction of the substrate and the portion of the one side region adsorbed by the adsorption unit. You may make it be at least any one of the bending along a horizontal direction.

  Further, in the step of evaluating the warpage of the substrate in the packing method according to the present invention, the relative to the suction portion on the other side of the substrate or the vicinity of the edge which is the opposite side along the vertical direction from the one side. You may make it evaluate the curvature of the said board | substrate by measuring a position.

  Further, in the step of positioning the substrate of the packing method according to the present invention above the storage area, movement along the horizontal direction, rotation about the axis parallel to the horizontal direction, and axis parallel to the vertical direction By performing at least one of the rotations about the center with respect to the substrate, the substrate may be positioned in the storage area in a top view along the vertical direction.

  Further, in the step of evaluating the warpage of the substrate in the packing method according to the present invention, it is determined whether or not the warpage of the substrate is too large in consideration of the size of the storage area, and it is not determined that the warpage is too large. Only the substrate may be transferred to the storage area.

  Further, the packing method according to the present invention moves a storage box including a plurality of storage areas arranged in parallel in the horizontal direction, and a storage area in which a substrate is to be stored next to the storage area included in the storage box. You may make it further provide the process of arrange | positioning in a predetermined position.

  Furthermore, in the packing method according to the present invention, the substrate is a back plate of a plasma display panel having a plate-like member and a rib formed on one surface of the plate-like member, and one surface of the substrate May be the other surface opposite to the one surface of the plate member.

  A packing device according to the present invention is a packing device that stores a substrate in a storage region extending along a vertical direction, and at least one side region in the vicinity of one edge of the substrate of one surface of the substrate. A transfer device having an adsorbable adsorbing portion and capable of adsorbing and holding the substrate; and a portion of the one side region of the substrate adsorbed by the adsorbing portion along a vertical direction. A detection unit configured to detect warpage of the substrate in a state of being sucked and held by the transfer device; and a control device connected to the transfer device and the detection unit, wherein the control device is arranged along a vertical direction. Based on the detection result of the detection means, the substrate is positioned above the storage area so that the substrate sucked by the suction part in the top view is positioned in the storage area, and then the suction part It is moved downward along the vertical direction, and controls the transport unit to transport the substrate into the housing area.

  In the packing device according to the present invention, the suction portion includes a plurality of suction pieces each having a longitudinal direction, and includes a plurality of suction pieces arranged at intervals in a direction orthogonal to the longitudinal direction, The portion is configured to adsorb to the substrate such that the longitudinal direction of the adsorption piece extends from one side of the substrate to the other side of the substrate opposite to the one side, When detecting the warping of the substrate by the detecting means, the suction is performed in a state where the substrate is sucked and held by the transport device so as to be along the vertical direction at a portion sucked by the suction portion of the one side region. The longitudinal direction of the piece may be configured along the vertical direction.

  In the packaging device according to the present invention, the control device may control the transport device so that the transport device stops the substrate when the detection device detects the warp of the substrate.

  Furthermore, in the packing apparatus according to the present invention, the detection means is configured so that the substrate is held in the vertical direction in a state where the substrate is held along the vertical direction in the portion adsorbed by the adsorption portion of the one side region. And a bend along the horizontal direction of the substrate in a state where the substrate is held along the vertical direction in the portion adsorbed by the adsorbing portion of the one side region. It may be configured to detect either one of them.

  Furthermore, in the packing apparatus according to the present invention, the detection means includes a detection sensor that detects a position of an edge of the other side of the substrate that is opposite to the one side along the vertical direction or a position near the edge. It may be.

  Furthermore, in the packing apparatus according to the present invention, when the transport device positions the substrate above the storage area, the transport device moves along a horizontal direction, rotates around an axis parallel to the horizontal direction, and vertical. The control device performs at least one of rotations about an axis parallel to the direction with respect to the substrate, and the control device transfers the substrate so that the substrate is positioned in the storage area in a top view along a vertical direction. The device may be controlled.

  Furthermore, in the packing apparatus according to the present invention, the control device determines whether or not the warpage of the substrate is excessively large in consideration of the size of the storage area, and only the substrates that are not determined to be excessively warped. The transport device may be controlled so as to be transported to the storage area.

  Furthermore, the packing apparatus according to the present invention moves the storage box including a plurality of storage areas arranged in parallel in the horizontal direction, and the storage area in which the substrate is to be stored next to the storage area included in the storage box. It may be further provided with transfer means for placing the at a predetermined position.

  Further, in the packaging device according to the present invention, the substrate is a back plate of a plasma display panel having a plate-like member and a rib formed on one surface of the plate-like member, and one surface of the substrate May be the other surface opposite to the one surface of the plate member.

  According to the present invention, the substrate can be packed accurately and quickly at a high density.

BEST MODE FOR CARRYING OUT THE INVENTION

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale and vertical / horizontal dimension ratios are appropriately changed and exaggerated from those of the actual ones.

  In the following embodiment, an example will be described in which a back plate of a plasma display panel (hereinafter also referred to as “PDP”) is stored and packed in each storage region of a storage box (packaging box). However, the present invention is not limited to the application to the back plate of the PDP, and the present invention can also be applied to the case of packing a substrate other than the back plate of the PDP. The back plate of the PDP is described in various prior documents, for example, Japanese Patent Laid-Open No. 10-32148, and detailed description thereof is omitted here.

  1 to 9 are diagrams for explaining an embodiment of a packing method and an inspection apparatus according to the present invention. 1 is a perspective view showing a schematic configuration of the packaging device, FIGS. 2 to 5 are diagrams for explaining a method of measuring the deformation amount of the substrate, and FIGS. 6 and 7 are methods for positioning the substrate. FIG. 8 is a perspective view for explaining, FIG. 8 is a view showing a state of storing a substrate, and FIG. 9 is a perspective view showing a storage box having a storage area.

  As shown in FIGS. 1 to 9, the packing apparatus 10 includes an adsorption unit 25 that can adsorb to the substrate 50, the conveyance device 20 that can adsorb and hold the substrate 50, and the adsorption unit 25 of the substrate 50. The detection means 15 for detecting the warp of the substrate 50 in a state where the portion adsorbed by the suction is held by the conveyance device 20 along the vertical direction, and the control connected to the conveyance device 20 and the detection means 15 And a device 30 (not shown except for FIG. 1). The packing device 10 stores and packs the substrate 50 in each storage area of the storage box 60.

  As described above, the substrate 50 is a PDP back plate, and usually includes a plate-like member including a glass substrate and ribs formed on one surface of the plate-like member. Usually, as the image display area of a display device (typically, a plasma television) including a PDP has a quadrangular shape, the substrate 50 also has a quadrangular shape (rectangular shape). As described above, for details of the back plate for the plasma display panel, refer to, for example, JP-A-10-32148.

  As shown in FIG. 1, the transport device 20 includes a base 21, a first arm 22 having one end connected to the end of the base 21, and a second having one end connected to the other end of the first arm 22. And an arm 23. A suction part 25 is connected to the other end of the second arm 23. The first arm 22 can be rotated (rotated) with respect to the base 21 about an axis 18a parallel to the vertical direction. Further, the first arm 22 can swing (rotate) with respect to the base 21 about an axis 18b parallel to the horizontal direction. The second arm 23 can swing (turn) with respect to the first arm 22 about an axis 18c parallel to the horizontal direction. The suction portion 25 can swing (turn) with respect to the second arm 23 about an axis 18d parallel to the horizontal direction. Further, the suction portion 25 can be rotated (rotated) about a shaft 18e perpendicular to the swing shaft 18d with respect to the second arm 23.

  In the present embodiment, as shown in FIG. 1, the suction portion 25 includes two suction pieces 26 and 27 (a first suction member 26 and a second suction member 27). Each suction piece 26, 27 extends in an elongated shape and has a longitudinal direction. The two adsorbing pieces 26 and 27 are arranged at intervals in a direction orthogonal to the longitudinal direction so that the longitudinal directions thereof are parallel to each other. As shown in FIG. 3, each suction piece 26, 27 is formed in a square cylinder shape whose both ends are blocked, and the inside of each suction piece 26, 27 communicates with a suction mechanism 29. In addition, a large number of suction holes 26 and 27a are formed on the surfaces of the suction pieces 26 and 27 that face the substrate 50. The large number of suction holes 26 and 27a are regularly arranged along the longitudinal direction of the suction pieces 26 and 27 (equally spaced in the illustrated example).

  The adsorbing part 25 is adsorbed on one surface 50 a of the substrate 50. As described above, the substrate 50 which is the PDP back plate usually has a plate-like member and a rib protruding from one surface of the plate-like member. And the adsorption | suction part 25 comes to adsorb | suck to the flat surface (one surface of the board | substrate 50) 50a in which the rib is not formed on the opposite side to the surface of one side of a plate-shaped member.

  Further, as well shown in FIG. 3, the suction pieces 26 and 27 extending in the longitudinal direction are arranged on one side of the substrate 50 along the plate surface of the substrate 50 when sucked on one surface 50 a of the substrate 50. From the edge portion 50b, it extends toward the other side opposite to the one side. Therefore, the adsorption part 25 comes to be adsorbed to at least one side region 51 in the vicinity of the edge part 50b on one side of the substrate 50 of the one surface 50a of the substrate 50. In the present embodiment, as shown in FIG. 3, the suction pieces 26 and 27 of the suction portion 25 are formed from the one side edge portion 50b of the substrate toward the other side edge portion 50c facing the one side edge portion 50b. 50, and in the direction connecting the one side edge portion 50b and the other side edge portion 50c, it is adsorbed to a wide area between the one side edge portion 50b and the other side edge portion 50c.

  The suction part 25 exhibits a function of correcting warp deformation such as bending or twisting of the substrate 50 by being sucked onto the substrate 50. Therefore, as shown in FIG. 3, as long as the capability of the suction mechanism 29 permits, the length L that the suction portion 25 extends from the one side edge portion 50b toward the other side edge portion 50c is equal to one side edge. It is preferable that the length is set larger than the total length La of the substrate 50 in the direction connecting the portion 50b and the other side edge portion 50c.

  The transport device 20 as described above is connected to the control device 30, and the operation of the transport device 20 is controlled by the control device 30.

  Next, the detection means 15 will be described. As described above, the detection unit 15 is used to detect the warp of the substrate 50 in a state where the portion adsorbed by the adsorption unit 25 of the substrate 50 is adsorbed and held by the transport device 20 along the vertical direction. It is done. Here, the “warp” refers to deformation such as bending or twisting of the substrate 50 from the flat plate shape. Therefore, “warping” includes, for example, bending of the plate surface of the substrate about a direction parallel to any edge of the substrate having a quadrangular shape.

  As shown in FIG. 1, the detection means 15 includes a detection sensor 16 held on the base portion 21 of the transport device 20 and a controller 17 (not shown except for FIG. 1) connected to the detection sensor 16. ing. The detection sensor 16 is fixed to the base 21 of the transport device 20. The controller 17 receives the detection signal from the detection sensor 16 and processes this signal. And the curvature of the board | substrate 50 comes to be specified based on the process data processed by the controller. As shown in FIG. 1, the controller 17 is connected to the control device 30, and the processing data derived by the controller 17 is transmitted to the control device 30.

  As shown in FIG. 2, in the present embodiment, the detection unit 15 detects the warpage of the substrate 50 in a state where the transfer device 20 stops the substrate 50. Then, when the transfer device 20 holds the substrate 50 to be inspected in a stationary state at a predetermined position, the detection sensor 16 of the detecting means 15 faces a predetermined position on the plate surface of the substrate 50. Specifically, as shown in FIGS. 3 to 5, the detection sensor 16 faces the other side edge 50 c of the substrate 50 and a part in the other side region 52 in the vicinity of the other side edge 50 c. Become.

  By the way, the board | substrate 50 arrange | positioned to the position which faces the detection sensor 16 is hold | maintained by the conveying apparatus 20 so that the direction which ties the one side edge part 50b and the other side edge part 50c follows a vertical direction. That is, when the warpage of the substrate 50 is evaluated, the longitudinal direction of the suction pieces 26 and 27 of the transport device 20 is along the vertical direction. At this time, the substrate 50 is positioned such that one side edge portion 50b of the substrate 50 is positioned upward in the vertical direction and the other side edge portion 50c of the substrate 50 is positioned downward in the vertical direction.

  In the present embodiment, the detection means 15 is configured to be able to detect the relative position of the other side edge portion 50 c or the other side region 52 facing the detection sensor 16 with respect to the suction portion 25. In the illustrated example, the detection sensor 16 extends along the other side edge portion 50 c of the substrate 50. The detection sensor 16 is configured to be able to detect the position (and further the contour) of the other side edge portion 50c or the other side region 52 of the substrate 50 with reference to the position of the detection sensor 16. Such a detection sensor 16 may be configured by a commercially available laser type or ultrasonic type displacement sensor.

  By the way, as described above, the substrate 50 is stored and packed in the storage area 65 of the storage box (packing box) 60 by the packing device 10. Here, the storage box 60 will be described. As shown in FIG. 9, the storage box 60 includes a box body 61 and a partition member 62 disposed in the box body 61. The box body 61 has a rectangular parallelepiped shape with one surface opened. The partition member 62 extends from each of the pair of opposing side surfaces of the box body 61 toward different side surfaces. A space in the box body 61 is partitioned by a pair of partition members 62 facing each other, and a plurality of storage areas 65 are defined in the box body 61.

  That is, the storage box 60 includes a plurality of storage areas 65 in which the substrates 50 are to be stored, and is configured to be able to store a plurality of substrates 50 simultaneously. In the present embodiment, the substrates 50 are stored in the storage box 60 side by side with their plate surfaces facing each other. And when the board | substrate 50 is accommodated in the accommodation area | region 65, the partition member 62 will come to face the area | region of the both edge parts in the horizontal direction among the plate surfaces of the board | substrate 50. FIG.

  In the present embodiment, the box body 61 and the partition member 62 are integrally configured. Such a box main body 61 and the partition member 62 may be made of, for example, a material having a buffering action (for example, foamed polystyrene).

  As shown in FIG. 1, the storage box 60 is disposed such that each storage area 65 extends in the vertical direction in the packaging arrangement and in the subsequent normal handling. Therefore, the substrate 50 packed in the storage box 60 is vertically placed and stored with its plate surface extending in a substantially vertical direction. That is, each partition member 62 extends along the vertical direction.

  Next, an embodiment of a method for packing the substrate 50 using the packing device 10 having the above configuration will be described.

  As shown in FIGS. 1 to 8, in the present embodiment, the packing method includes a step of sucking and holding the substrate 50 by the transfer device 20, a step of evaluating warpage of the sucked and held substrate 50, and a warpage evaluation result. And the step of positioning the substrate 50 vertically above the storage region 65 and the step of transporting the substrate 50 downward in the vertical direction and storing it in the storage region 65. Hereinafter, each step will be described in detail.

  First, the process of holding the substrate 50 by the transfer device 20 will be described in detail. As shown in FIG. 1, a substrate (PDP back plate) 50 to be packed flows on a transport line 75 disposed in the vicinity of the transport device 20. Based on the control signal from the control device 30, the suction unit 25 of the transfer device 20 moves to a position facing the one surface 50 a of the substrate 50. Then, the suction mechanism 29 operates, and the suction unit 25 is sucked on one surface of the substrate 50.

  As described above, the suction portion 25 includes a plurality of suction pieces 26 and 27 each having a longitudinal direction, and a plurality of suction pieces 26 and 27 arranged at intervals in a direction orthogonal to the longitudinal direction. Yes. When the suction unit 25 sucks the substrate 50, each suction piece 26, 27 is placed on one surface 50 a of the substrate 50 on the other side of the substrate 50 that is opposite to the one side from the one side of the substrate 50. It extends toward the side. Accordingly, the suction portion 25 is suctioned to the one side region 51 in the vicinity of at least one side edge portion 50b of the one surface 50a of the substrate 50. As shown in FIG. 3, the suction pieces 26 and 27 have a length that occupies most of the length from one side edge 50 b to the other side edge 50 c of the substrate 50. By adsorbing the suction pieces 26 and 27 to the substrate 50, warping that has occurred in at least a portion of the region along the plate surface of the substrate 50 sucked by the suction portion 25 is corrected. become.

  In this way, after the suction unit 25 is sucked onto the substrate 50, the transfer device 20 lifts the substrate 50 from the transfer line 75 and holds the substrate 50 by suction.

  Next, a process for evaluating the warpage of the substrate 50 held by suction will be described. The substrate 50 sucked and held by the transport device 20 is evaluated for warpage using the detection means 15. In the present embodiment, the warpage of the substrate 50 is held at a position (warp evaluation position) facing the detection sensor 16 of the detection means 15 and is evaluated in a stationary state. More specifically, the warpage of the substrate 50 is evaluated in a state where the portion of the substrate 50 that is adsorbed by the adsorbing unit 25 is held along the vertical direction. Therefore, when the warpage of the substrate 50 is evaluated, the suction pieces 26 and 27 of the suction portion 25 that sucks and holds the substrate 50 are arranged such that the longitudinal direction thereof is along the vertical direction. In particular, in the present embodiment, as shown in FIGS. 3 and 4, the one side region 51 of the substrate 50 is positioned upward in the vertical direction, and the other side region 52 of the substrate 50 is positioned downward in the vertical direction. Thus, the substrate 50 is held.

  When the substrate 50 is held in such a manner that the plate surface of the substrate 50 is substantially along the vertical direction, the vibration of the substrate 50 accompanying the conveyance of the substrate 50 is attenuated in a short time by the weight of the substrate 50, and the predetermined position The substrate 50 can be stopped in a short time. From this point, when the substrate 50 is transported from the transport line 75 to the warp inspection position, it is preferable to transport the substrate 50 with the plate surface in a substantially vertical direction. In this case, the occurrence of the vibration of the substrate 50 caused by the conveyance can be significantly suppressed by the own weight of the substrate 50.

  Next, the magnitude of warpage is evaluated using the detection means 15 for the substrate 50 held in a stationary state at a position facing the detection sensor 16 of the detection means 15 (warpage evaluation position). Specifically, as indicated by dotted arrows in FIGS. 4 and 5, a signal wave is transmitted from the detection sensor 16 of the inspection unit 15 toward the facing portion of the substrate 50. This signal wave is reflected by the substrate 50 and received by the detection sensor 16 again. The controller 17 of the detection unit 15 analyzes the signal wave received by the detection sensor 16 and specifies the relative position of the other side edge portion 50c of the substrate 50 or the other side region 52 of the substrate 50 with respect to the detection sensor 16.

  Here, when the warpage of the substrate 50 is measured, the suction portion 25 sucked on the substrate 50 is disposed at a fixed position. That is, when the warpage of the substrate 50 is measured, the relative position between the adsorption unit 25 that adsorbs to the substrate 50 and the detection sensor is always constant. Therefore, the controller 17 can specify the relative position of the other side edge portion 50c of the substrate 50 or the other side region 52 of the substrate 50 with respect to the suction portion 25. As a result, as shown in FIG. 4, the bending magnitude Cv along the vertical direction of the substrate 50 in a state where the portion adsorbed by the suction portion 25 of the substrate 50 is held along the vertical direction. It becomes possible to measure.

  As shown in FIG. 5, the detection sensor 16 extends along the other side edge portion 50 c of the substrate 50. Therefore, the position of the substrate 50 can be specified at each position along the other side edge portion 50c. As a result, as shown in FIG. 5, in the other side edge portion 50 c or the other side region 52 of the substrate 50 in a state where the portion adsorbed by the adsorption unit 25 of the substrate 50 is held along the vertical direction. It is possible to measure the magnitude Ch of the bending of the substrate 50 along the horizontal direction. FIG. 5 shows a projection of one side edge 50b of the substrate 50 along the vertical direction.

  Next, the process of positioning the substrate 50 in the vertical direction above the storage area 65 based on the warpage evaluation result will be described. As shown in FIG. 6, the substrate 50 whose warpage has been evaluated is first moved above the storage area 65 in which the substrate 50 is to be stored by the transfer device 20. Thereafter, the substrate 50 is positioned with respect to the storage area 65 above the storage area 65 in the vertical direction. Specifically, as shown in FIG. 7, the control device 30 is based on the measurement result of the warp so that the substrate 50 adsorbed by the adsorption unit 25 enters the storage area 65 in a top view along the vertical direction. Then, the suction unit 25 of the transport device 20 is moved.

  Note that the substrate 50 adsorbed by the adsorption unit 25 can be positioned by various methods in the storage area 65 in a top view along the vertical direction. For example, as shown in FIG. 6, the substrate 50 is moved along the horizontal direction above the storage area 65 (arrow A), or rotated around an axis parallel to the horizontal direction (arrow B). ), Or rotated about an axis parallel to the vertical direction (arrow C), or positioned above the storage area 65 by a combination of these operations.

  By the way, in the process of evaluating the warp described above, it is determined whether the warp size of the substrate 50 is too large in consideration of the size of the storage area 65. If the warpage of the substrate 50 is so large that the substrate 50 does not fit into one storage area 65 in a top view, the substrate 50 is brought into this step (step of positioning the substrate 50). I can't. That is, the control device 30 moves the transfer device 20 so that only the substrate 50 that is determined to be positioned and can enter one storage region 65 when viewed from above is transferred above the storage region of the storage box 60. To control.

  Next, a process of transporting the substrate 50 downward in the vertical direction and storing it in the storage area 65 will be described. As described above, the substrate 50 is positioned above the storage area 65 in the vertical direction so as to enter the storage area 65 in a top view. Therefore, when the positioned substrate 50 is moved relative to the storage box 60 in the vertical direction as it is, the substrate 50 is brought into the storage region 65 without colliding with the partition member 62 that defines the storage region 65. Can be transported.

  As shown in FIGS. 7 and 8, the attracting part 25 attracted on one surface of the substrate 50 moves between a pair of partition members 62. That is, the portion of the wall surface that defines the storage area 65 that corresponds to the movement path of the suction portion 25 that is sucked onto the substrate 50 is excluded. According to such an embodiment, it is not necessary to design the storage area 65 larger than the size according to the shape of the substrate 50 according to the configuration of the transfer device 20. Therefore, the storage area 65 can be set narrow and the substrates 50 can be packed with high density. Thereby, the space required for packing can be reduced in size, and the handling such as storage and transportation of the packed substrate 50 can be reduced.

  As described above, the single substrate 50 can be stored and packed in the storage region 65 extending in the vertical direction using the packing device 10. The substrate 50 to be packed next can be packed in the storage area 65 by the packing device 10 by the same method.

  According to the present embodiment as described above, the suction unit 25 sucked on the substrate 50 of the transfer device 20 that sucks and holds the substrate 50 is moved downward along the vertical direction, and the substrate 50 is stored in the storage region of the storage box 60. It is designed to be transported into 65. That is, the substrate 50 is moved downward in the vertical direction so that the plate surface of the substrate 50 is substantially along the vertical direction, and the substrate 50 is stored in the storage area 65 defined by the partition member 62 extending along the vertical direction. It has become. Accordingly, when the substrate 50 is stored in the storage area 65, the warpage of the substrate 50 can be automatically corrected by the weight of the substrate 50. In the present embodiment, the warpage of the substrate 50 is evaluated before the substrate 50 is stored in the storage region 65, and the substrate 50 is relative to the storage region 65 in the top view along the vertical direction according to the evaluation result. The position is properly positioned. For these reasons, the area of the storage area 65 in the top view along the vertical direction can be reduced, and the space of the storage area 65 can be saved.

  Moreover, the board | substrate 50 conveyed by adsorption holding | maintenance by the conveying apparatus 20 has taken the attitude | position which follows a substantially vertical direction. Therefore, the vibration of the substrate 50 is greatly suppressed by the dead weight of the substrate 50. As described above, since the vibration of the substrate 50 is greatly suppressed, when the substrate 50 is stored in the storage region 65, the substrate 50 is transferred to an element that defines the storage region 65 (the partition member 62 in the present embodiment). Can be significantly suppressed from colliding and damaging the substrate 50. Thereby, the yield of the substrate 50 can be improved, and the life of the storage box 60 that is normally used repeatedly can be extended. Further, the warpage of the substrate 50 can be evaluated while the substrate 50 is stationary, and the warpage of the substrate 50 can be accurately evaluated. Therefore, it is possible to further suppress the substrate 50 from colliding with the elements that define the storage area 65. In addition, it is possible to accurately determine whether or not the substrate 50 can be stored in the storage region 65, thereby improving the yield of the substrate 50.

  From the above, according to the present embodiment, the substrate 50 can be packed accurately and quickly at a high density.

  Further, according to the present embodiment, the suction includes a plurality of suction pieces 26 and 27 each having a longitudinal direction and arranged at intervals in a direction orthogonal to the longitudinal direction. The portion 25 is adsorbed to the substrate 50 such that the longitudinal direction of the adsorbing pieces 26 and 27 extends from one side of the substrate 50 to the other side. Moreover, when evaluating the curvature of the board | substrate 50, the adsorption | suction pieces 26 and 27 attracted | sucked to the board | substrate 50 are arrange | positioned so that the longitudinal direction may follow a perpendicular direction. According to the present embodiment, the suction unit 25 has a function of correcting the warp of the substrate 50. Further, it is possible to suppress the occurrence of vibration on the substrate 50. As a result, the area of the storage area 65 in the top view along the vertical direction can be further reduced, and the space of the storage area 65 can be further reduced.

  Furthermore, according to the present embodiment, when the warpage of the substrate 50 is evaluated, it is determined whether the warpage of the substrate 50 is too large considering the size of the storage area 65. Only the substrate 50 that has not been determined to be excessively warped is transferred to the storage area 65. On the other hand, the board | substrate 50 judged that curvature is too large is discarded, for example. According to the present embodiment, the substrate 50 having excessive warpage is not stored in the storage area 65. Therefore, the size of the storage area 65 is set to an appropriate size, the ratio of the substrates 50 that can be stored is kept high, and the substrates 50 are arranged close to each other and packed at a high density. be able to.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, an example of modification will be described.

  For example, as shown by a two-dot chain line in FIG. 6, the packing apparatus 10 may further include transport means 40 that moves the storage box 60 including the plurality of storage regions 65 arranged in parallel in the horizontal direction. . When such a packing apparatus 10 is used, when the substrate 50 is stored in one storage region 65 of the storage box 60, the substrate 50 is stored in parallel with the transport, warpage evaluation or positioning of the substrate 50 to be stored next. The transfer means 40 can horizontally move the storage box 60 so that the storage area 65 in which the substrate 50 is to be stored next to the storage area 65 included in the box 60 is located at a fixed position in a top view. According to such an example, the configuration and control of the transport device 20 can be simplified. In addition, as such a transfer means 40, the apparatus (for example, what is called a conveyor) which conveys the storage box 60 linearly can be used as shown by a two-dot chain line in FIG. Or the apparatus which has a turntable which can rotate in the state which supported the storage box 60 from the lower part, and conveys the storage box 60 in curve shape can also be used as a transfer means.

  In the above-described embodiment, the example in which the warpage of the substrate 50 is evaluated in a state where the substrate 50 is stationary has been described. However, the present invention is not limited to this, and the warpage of the substrate 50 during the transfer of the substrate 50 is shown. May be evaluated.

  Furthermore, in the above-described embodiment, the example in which the detection unit 15 includes the detection sensor 16 disposed at a position facing the other side edge portion 50c or the other side region 52 of the substrate 50 has been described. In this example, the detection sensor 16 functions as a sensor that detects the relative position of the other side edge portion 50c of the substrate 50 or the other side region 52 with respect to the suction portion 25. However, the configuration of the detection unit 15 that can evaluate the warpage of the substrate 50 is not limited to the configuration described in the above-described embodiment, and various known configurations can be employed. For example, as indicated by a two-dot chain line in FIG. 3, the detection sensor 16 may be disposed at a position facing an edge other than one side edge of the substrate 50, or the detection sensor described above. 16 may scan along the vertical direction. According to these examples, the warpage of the substrate 50 can be grasped in more detail. Further, the detection sensor 16 may be arranged only at positions facing the four corners of the substrate 50. Furthermore, although an example in which a displacement sensor is used as the detection sensor 16 has been shown, the present invention is not limited to this, and other types of sensors may be used as the detection sensor 16.

  Furthermore, although the example which has the two elongate adsorption pieces 26 and 27 in which the adsorption | suction part 25 was arrange | positioned in parallel was shown in embodiment mentioned above, it is not restricted to this, The adsorption | suction part 25 has a different structure. May be. For example, the suction part 25 may have only one suction piece, or may have three or more suction pieces. Furthermore, you may make it the adsorption | suction part 25 have an adsorption | suction piece which has shapes other than elongate shape.

  Furthermore, in the above-described embodiment, an example in which the transport device 20 is configured to include the base portion 21, the first arm 22, the second arm 23, and the suction portion 25 has been described. However, such a configuration is merely an example, and various known transfer devices can be used.

  Further, in the above-described embodiment, the example in which the detection unit 15 is configured to include the detection sensor 16 and the controller 17 that processes the detection signal of the detection sensor 16 is shown. However, such a configuration is merely an example and can be changed as appropriate. For example, the controller 17 may be incorporated in the control device 30 and form a part of the control device 30.

  Furthermore, in the above-described embodiment, an example of the storage box 60 has been described mainly with reference to FIG. 9. However, the present invention is not limited to this, and the storage box 65 having various configurations has a storage area 65 extending in the vertical direction. The substrate 50 may be stored. For example, in the above-described embodiment, an example in which the box body 61 and the partition member 62 of the storage box 60 are integrally configured has been shown. However, the present invention is not limited to this, and the box body 61 and the partition member 62 are separated. You may be comprised from another material as a body. Further, the storage box 60 may further include a frame material made of, for example, wood or corrugated paper, and the box body 61 may be accommodated in the frame material.

FIG. 1 is a perspective view showing an embodiment of a packing apparatus according to the present invention. FIG. 2 is a perspective view corresponding to FIG. 1, and is a perspective view showing a state when the warpage of the substrate is evaluated. FIG. 3 is a plan view of the substrate in the state shown in FIG. 2, and is a diagram for explaining a method for attracting the substrate by the attracting unit and a method for evaluating the warpage of the substrate by the detecting means. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 3 and is a view for explaining a method for adsorbing a substrate by an adsorbing portion and a method for evaluating the warpage of a substrate by a detecting means. FIG. 5 is a cross-sectional view taken along the line V-V in FIG. 3 and is a view for explaining a method for evaluating the warpage of the substrate by the detecting means. FIG. 6 is a perspective view corresponding to FIG. 1 for explaining a substrate positioning method. FIG. 7 is a top view for explaining a substrate positioning method in a top view along the vertical direction. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7 and is a view for explaining a method of storing the substrate in the storage region. FIG. 9 is a perspective view showing a storage box having a plurality of storage areas arranged in parallel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Packing apparatus 15 Detection means 16 Detection sensor 17 Controller 20 Conveyance apparatus 25 Adsorption part 26,27 Adsorption piece 30 Control apparatus 40 Transfer means 50 Substrate 50a One surface 50b One side edge part 50c Other side edge part 51 One side area 52 Other Side area 60 Storage box 65 Storage area

Claims (18)

In a packaging method for storing the substrate in a storage region extending along the vertical direction using a transfer device that has a suction portion that can be suctioned to the substrate and can hold the substrate by suction,
Adsorbing the adsorbing portion to at least one side region in the vicinity of one edge of the substrate of one surface of the substrate, and adsorbing and holding the substrate;
A step of evaluating warpage of the substrate in a state where the substrate is held by the transfer device so as to be along a vertical direction in a portion adsorbed by the adsorption portion of the one side region;
A step of positioning the substrate above the storage region based on the evaluation result of warpage so that the substrate sucked by the suction portion is positioned in the storage region in a top view along the vertical direction;
And a step of moving the suction part downward along the vertical direction and transporting the substrate to the storage area. In the step of sucking and holding the substrate, a suction portion including a plurality of suction pieces each having a longitudinal direction and arranged at intervals in a direction orthogonal to the longitudinal direction, the suction piece So that the longitudinal direction of the substrate extends from one side of the substrate to the other side of the substrate opposite to the one side, and is adsorbed to the substrate,
The longitudinal direction of the suction piece is along the vertical direction in a state where the substrate is held so as to be along the vertical direction at a portion of the one side region sucked by the suction portion. Item 2. The packaging method according to item 1. The packaging method according to claim 1 or 2, wherein in the step of evaluating warpage of the substrate, the substrate is stationary. In the step of evaluating the warpage of the substrate, the warpage to be evaluated is the warpage of the substrate in a state where the substrate is held so as to be along the vertical direction in the portion adsorbed by the adsorption portion of the one side region. Bending along the vertical direction, and bending along the horizontal direction of the substrate in a state where the substrate is held so as to be along the vertical direction in the portion adsorbed by the adsorption portion of the one side region, The packaging method according to claim 1, wherein the packaging method is at least one of the following. In the step of evaluating the warpage of the substrate, by measuring the relative position with respect to the suction portion near the edge or the edge of the other side of the substrate that is opposite to the one side along the vertical direction, The packaging method according to claim 1, wherein warpage of the substrate is evaluated. In the step of positioning the substrate above the storage area, at least one of movement along a horizontal direction, rotation about an axis parallel to the horizontal direction, and rotation about an axis parallel to the vertical direction 6. The method according to any one of claims 1 to 5, wherein the substrate is positioned in the storage area in a top view along a vertical direction by performing one on the substrate. The packing method described. In the step of evaluating the warpage of the substrate, it is determined whether the warpage of the substrate is too large in consideration of the size of the storage area,
The packaging method according to any one of claims 1 to 6, wherein only a substrate that has not been determined to be excessively warped is transported to the storage area. A step of horizontally moving a storage box including a plurality of storage areas arranged in parallel to arrange a storage area in which a substrate is to be stored next to a predetermined position among the storage areas included in the storage box. The packing method according to any one of claims 1 to 7, further comprising: The substrate is a back plate of a plasma display panel having a plate-like member and a rib formed on one surface of the plate-like member,
The packaging method according to claim 1, wherein one surface of the substrate is the other surface opposite to the one surface of the plate-like member. A packaging device for storing a substrate in a storage area extending along a vertical direction,
A conveying device capable of adsorbing and conveying the substrate by adsorbing and holding the substrate at least on one side region in the vicinity of one edge of the substrate of one surface of the substrate;
Detecting means for detecting warpage of the substrate in a state in which a portion adsorbed by the adsorbing portion of the one side region of the substrate is adsorbed and held by the transfer device in a vertical direction;
A controller connected to the transport device and the detection means,
The controller is
Based on the detection result of the detection means, the substrate is positioned above the storage region so that the substrate adsorbed by the suction unit is positioned in the storage region in a top view along the vertical direction,
After that, the packing device is characterized in that the suction unit is moved downward along the vertical direction, and the transfer device is controlled to transfer the substrate to the storage area. The suction portion is a plurality of suction pieces each having a longitudinal direction, and includes a plurality of suction pieces arranged at intervals in a direction orthogonal to the longitudinal direction,
The adsorption portion is configured to adsorb to the substrate such that a longitudinal direction of the adsorption piece extends from one side of the substrate to the other side of the substrate that is opposite to the one side. ,
When detecting the warp of the substrate by the detection means, the substrate is sucked and held by the transport device so as to be along the vertical direction in the portion sucked by the suction portion of the one side region, The packing device according to claim 10, wherein a longitudinal direction of the suction piece is configured to be along a vertical direction. 12. The packaging apparatus according to claim 10, wherein the control device controls the transport device so that the transport device stops the substrate when the detection device detects the warp of the substrate. . The detection means includes a bending along the vertical direction of the substrate in a state where the substrate is held so as to be along the vertical direction in a portion adsorbed by the adsorption portion of the one side region, and the substrate is To detect at least one of the bending along the horizontal direction of the substrate in the state where the portion adsorbed by the adsorbing portion of the one side region is held along the vertical direction. It is comprised, The packaging apparatus as described in any one of Claims 10 thru | or 12 characterized by the above-mentioned. The detection unit includes a detection sensor that detects a position of an edge of the other side of the substrate that is opposite to the one side along the vertical direction or a position in the vicinity of the edge. The packaging apparatus as described in any one of. When the transfer device positions the substrate above the storage area, the transfer device moves along a horizontal direction, rotates around an axis parallel to the horizontal direction, and centers around an axis parallel to the vertical direction. At least one of the rotations is performed on the substrate, and the control device controls the transport device so that the substrate is positioned in the storage area in a top view along a vertical direction. The packaging device according to any one of claims 10 to 14. The control device determines whether or not the warpage of the substrate is too large in consideration of the size of the storage area, and only the substrates that are not determined to be too large are transported to the storage area. The packing device according to any one of claims 10 to 15, wherein the transport device is controlled. Transfer means for moving a storage box including a plurality of storage areas arranged in parallel in a horizontal direction and arranging a storage area in which a substrate is to be stored next to the storage area included in the storage box at a predetermined position. The packaging device according to claim 10, further comprising: The substrate is a back plate of a plasma display panel having a plate-like member and a rib formed on one surface of the plate-like member,
18. The packaging device according to claim 10, wherein one surface of the substrate is the other surface opposite to the one surface of the plate-like member.

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