201011853 九、發明說明： 【發明所屬之技術領域】 種可以提取 本發明係有關一種容置裝置，尤其是才t 之載盤承載容置裝置與揀選系統。 胃 【先前技術1 半導體製程當中’當晶圓經由沉積、漱、 蝕刻等製程之後，再將該晶圓經過切割彤渡、、微影以及 (Die)，該晶粒係為具有功能之電子元件，成複數個曰曰粒 晶粒經過封裝、測試的動作，才完成整彳^"、後再將這些 對於切割下來之晶粒，會被置放於承^體之製程。 盤結構係為矩形結構且其表面具有複數個办中’該承載 被切割完畢之晶粒，關晶輯輸送、敌:置槽可以容置 置的進行。其中將晶粒放置於該承載盤之、封裝以及側 而負責從該承載盤取出或是置放晶粒之I作稱為置晶’ 檢選裝置（Chip·㈣來達成。動作収藉由晶粒 請參閱圖- A至- C所示，該圖係為 存放裝置示意圖。在習用技術申，晶片# 日日 盤 它格】 日日月載盤存放裝置10固 二t載台11 1，當晶圓經過檢測以及分級的過程之 放置到對應的晶片承載盤上。當晶片承載盤已滿 =移2置f曰片的時候，藉由自動化的機制可將晶片承載 亥晶片在盤存放裝置内。請參所示，移 、12會由晶片载盤存放裝置1()之底側開口向上移 起已經放置在支撐元件13上之複數個承載盤9〇， 、12的上下移動使得晶片承載盤⑽可以堆疊在— 201011853 起，形成如圖一c的狀態。在習用技術中，當晶片承載盤 堆疊到一定的數量時，需要由操作人員將相互堆疊的晶片 承載盤取出，以利後續之存放作業。但是上述 處理堆疊的晶片承载盤存在著許多問題：4之_人 結構保護，因:操二承载盤無額外 心的碰撞，⑽得料的a κ 日的抖動’或者是不小 2.因為堆疊的晶片；裁盤„’造成嚴重損失。 此不方便進行任何的標* ’由於沒有㈣之故，因 片承載盤堆疊進行辨識，因卜—不同晶片品質等級的晶 綜合上述，因此亟需易造成人員的誤分類。 解決習用技術所產生之問題锺承载盤容置裝置與系統，來 【發明内容】 :發明提供—種承裁盤# 之概念，設計出可以存放承 屐，，其係利用可以提取 ❹積到一的程度時，使用者不必之各器，使得當承載盤累 提取存放的容器即可將存放之動成堆的承載盤，而僅要 用自動化設備將整個容置穿疊的承載盤提走或者是利 發生的問題。 ^搬走，以避免人工操作時所 本發明提供一種承载盤容置 之概念，設計出可以存放承 置，其係利用可以提取 對應的辨識元件 ，以確實分類容器，並於容器上設置 置裝置以避免人工的分類錯誤，及標示存玫不同性質的容 本發明提供一種揀選^置’繼而有利於線上生產管理。 其係將元件棟選的機制與 201011853 承載盤容置與分類的機制相互結合，以形 以 管理存放容ί元件的承载盤，進^讓操作人 ，分類 同等級的存放裝置，以力生產線之管理。 識別不 在一實施例中，本發明提供一種 係具有一容置本體，其内具有一容置j盤：置裝置，其 —承載盤，該容置本體之至少—侧且^=提供容Ϊ至少 雜相卡合，其中容置本體之底部更 輿1 ❹ Ο 盤由下往上緊密堆叠’進人承載盤容置〗承栽 係可根據需要選擇與該槽體相卡合或分離罝，该各置本體 在另-實施例中，本發明提供一種棟選 一楝選部，其係楝選一載體上之一元件、系，，包括： 於對應該等级之承载盤上；一承載盤、予以分級以玫置 選部相連接;-承載盤容置部，其“讀：載3與讀楝 連接’該承載盤容置部具有：一承載台f承載盤輪送部相 個槽體；以及複數個容置本體，I 其上设置有複鼓 以提供容置複數個承載盤，每—個容=具有一容置空間 該複數個槽㈣’每-個容置本體之至=體係分別容置於 部，以與對應之槽體相卡合，复;^一侧具有—卡合 —開口，以利承载盤由下往上體之底部更具有 離。"根據需要選擇與該槽體相卡合或分 【實施方式】 為使貝審查委員能董+ ★政 更進一步的認知與瞭解，下，發明之特徵、目⑽及功能有 、 文特將本發明之裝置的相關細 201011853 部結構以及設計的理念原由進行說明，以使得審查委員可 以了解本發明之特點，詳細說明陳述如下： 請參閱圖二所示’該圖係為本發明之承載盤容置裝置 實施例立體示意圖。在本實施例中，該承載盤容置襞置2 包括有一容置本體20,其内具有一容置空間2〇〇以提供容 ' 置至少一承載盤90，該容置本體20之一側具有一卡合部 21以與一槽體相卡合，該容置本體係可根據需要選擇二該 槽體相卡合或分離。該本體20基本上是由第—板體 ❹及第二板體202所構成，該第一板體201與該第二板體2〇2 之間相距一段距離，且第一板體2〇1與第二板體2〇2上分 別具有相對應之凹槽以形成該容置空間。由於兩板體2〇1 與202相距一距離，因此在該容置本體2〇之頂部以及底部 形成有一開口，以利承載盤由下往上緊密堆疊，進入承載 盤容置裝置。在底部開口之一側具有該卡合部21。 本實施例中之卡合部21具有複數個嵌合構件21〇、 211、212與213，其中嵌合構件210與211呈現一凹字形 ❹ 分別與該兩板體201與202之側面相連接。喪合構件 - 210〜213之外形與數量並不以本發明的實施例為限，因為 • 這是熟悉此項技術之人可以根據實際上之需要設計不同的 嵌合構件形式。此外，嵌合構件210~213也可以與容置本 體20 —體成型’這都是熟悉此項技術之人可以根據本發明 之精神與以致換。在嵌合構件210與211之凹部内設置有 複數個支撐元件22，其係與該容置本體20之底部開口相 對應，以提供支撐承載至少一承載盤9〇。該承載盤go，在 本實施例中可以提供容置複數個元件，例如：晶片、陶莞 8 201011853 疋件、被動兀件專但不以此為限。在第 第二板體202之上方分別設置有一手把纟士體2〇丨以及該 者提拿該承載盤容置裴置2。另外，為霉23，以利使用 容置本體上（例如：第一板體或者是第二識，在該 有一辨識元件24，以利操作者對於已可以設置 載板容置裝置2内所容置的承载板90的種類體之承 行辨識。在—般的實施例中，該賴元件24 ^疋分級進 的辨識元件，例如：無線射頻識 =為電子式 媒體。如此，使用者便可利用手提式=== 子讀寫裝置來讀取辨識元件内之内容 辨識。此外，容置本體上更可以類、祕與 為不同等級元㈣分_識。 $㈣顏色’作 載盤Ϊ = 2圖三_示’其中圖三A係為與該承 置裝置相、、Ό σ之槽體立體示意圖 =與槽體結合示意圖。在圖三Α中 其係由一第-框體3。丨以及-第二框鏡 所構成。该第一框體3〇1鱼嗜篦— 提供容置該承載盤容一框體302形成一空間以 έ士人座Ή & % 置裝置2。在该固定部30内具有一對 ^之m ^ 該對結合座31與32分別設置於槽體3 以及該第二框體302上。每一結合座 樞接於對應U至/ 一支撐架310 ’其係與一彈性體311 传可扭讲Γ #圭31或32之側壁上’該複數個支撐架310 恭般p ?暫時存放承载盤，待存放在該支標架⑽上的承 健番f確定不需要在進行製程的時候，可以-起藉由移 戟裝置（如圖一 L之私唬12的結構，其係屬習用技術，在 201011853 此不作贅述）一起移放置該承載盤容置裝置2内。如三8所 示，當該承載盤容置裝置2嵌入該槽體3内時，結合座3ι 與32係與承載盤容置裝置2之底面相抵靠，以提供支撐承 載該承載盤容置裝置2。當然該槽體3容置該承載盤^置 . 裝置2時，亦可藉由定位元件的抵靠使得定位元件得以將 • 該承載盤容置裝置2之位置維持在定位。至於定位元件的 設置與結構係屬於習用之技術，並非本發明之重點，熟悉 此項技術之人可以使用很多習用之定位元件例如：銷等元 ❹ 件與該承載盤容置裝置2相抵靠。 請參閱圖四所示，該圖係為本發明之壓板實施例立體 禾意圖。在本實施例中，該壓制結構4的設計係可提供固 定存放於該承載板容置裝置内的複數個相互堆疊的承载 板。由於承載盤堆疊的高度如果太高，雖然可增加生產的 效率，但是堆疊太高的狀態下，承載盤還是容易晃動。雖 然在本發明中有第一板體以及第二板體所形成之容置本體 砰以保護堆疊的承载盤，但是為了增加穩定性，在本發明 φ 中設計的壓制結構4 ’以提供一壓制力於堆疊的承載盤上， . 增加承載盤的穩定性。在本實施例中，該壓制結構4具有 一彈性板體40，其兩端具有一柱體41與42，其係分別失 持該彈性板體40 ’該兩柱體41與42中心的距離係小於介 於該兩枉體中心41與42的彈性板體40長度。該壓制結構 4上更具有一拉桿43，其係與該彈性板體4〇相連接。連接 方式為在該彈性板體40上開設兩的孔洞401與402，該拉 桿之一部份通過過該兩孔洞4〇1與402與彈性板體40相連 接。可提供一作用力於該彈性板體4〇上使該彈性板體4〇 201011853 對最上方之承載盤產生壓制力以固定該複數個承載盤。請 參閱圖五A所示，在圖五八之狀態下，表示該彈性板體4〇 在該拉桿43所提供的向上的作用力，使個彈性板體仙因 受力而呈現下凹的狀態。此狀態下該壓制結構並不會提供 壓制力於承載板上，因此屬於鬆放的狀態。反之，如圖五 B所不，當該拉桿提43供一向下的作用力於該彈性板體4〇 上時，該彈性板體40因受力而變形成凹向上的狀態凹向 上的最低點位置會與該承載盤90相抵靠，以提供一壓制力 ❹固定堆疊的承載盤90 。藉由本發明之壓制結構以使相互堆 疊之該至少一承載盤中的元件不會因該承載盤容置裝置移 動或傾倒而使該至少一承載盤令的元件掉出。 請參閱圖六所示，該圖係為本發明之揀選系統實施例 立體示意圖。該揀選系統5具有承載盤容置部5〇、一揀選 部51以及一承載盤輸送部52。該承載盤容置部50具有一 承載台501以及複數個承載盤容置裝置5〇2。每一個承載 盤容置裝置502具有一容置本體5020。其中，該承載台 φ 501 ’其上設置有複數個槽體503，以分別提供容置該複數 個承載盤容置裝置502。每一個容置本體5020内’其係分 別具有一容置空間以提供容置至少一承載盤513,每一個 容ί本體5020係分別容置於該複數個槽體5〇3内，每一個 容置本體5020之一側具有一卡合部504，以與對應之槽體 503相卡合。每一個槽體503以及容置本體5020的結構係 容同前面之裂置2與槽體3所述，在此不作贅述。該揀選 部51係由—载體上楝選一元件並予以分級以放置於對應 該等級之承載盤上。在本實施例中，該載體510係為一膠 201011853 膜或具有勒著力之基材，並 件5100係為晶片、陶究元件/=1數 =件5_。該元 為限。為了方便辨識存放部同等7;·^元件^不以此 在每一容置本體5020之’…承載盤的谷置本體， 操作者對於已經提取離開槽體之置有辨識元件，以利 容置的承裁板的種類„戈者:^承载板容置褒置5〇2内所 體测上㈣彳_。料，容置本 的分類辨識。 同的顏色’作為不同等級元件 而該楝選部51包括有一衿 裝置512、—第二影像掏取裝二第1像擷取 裝置515。該拾取部5U，其 以及一第二影像擷取 5100。在本實施例中，拾取部川^體510上之元件 以及一負壓承載台5111。註 有拾取兀件5110 ❹ 平面運動(γ，ζ)以及-旋轉運：70件5110係可進行二維 體51 〇上之元件5刚。兮^動（WZ)，並利用負壓力吸附載 圖六中係僅為示意，並；;件511G係屬於習用技術， 台5m射提供附加圖=為限。該貞墨承載 内具有—頂出結構5112 ,體51Q，該負壓承載台5111 議。同樣地，該負壓承^可頂出載體510上之元件 不作贅述。該第一景,後7台5111係屬於習用技術，在此 圖之影像1二=2置512’其係可擷取該元件 判斷依據，以及拾取元件牛5110拾取70件51GG與否之 對位。而該第三影像錄裝=拾取元件_之位置是否 影像，以判斷該元件5100裝置係可操取該元件5100之底面 該第-影像擷取裝置512j^底面是否有損傷。-般而言，201011853 IX. Description of the invention: [Technical field to which the invention pertains] The invention can be extracted. The invention relates to a accommodating device, in particular to a carrier carrying device and a picking system. Stomach [Prior Art 1 Semiconductor Process] After the wafer is processed by deposition, germanium, etching, etc., the wafer is subjected to dicing, lithography, and (Die), which is a functional electronic component. After a plurality of granules have been packaged and tested, the ruthenium is finished, and then the dies that are cut are placed in the process of the body. The disc structure is a rectangular structure and has a plurality of surfaces on the surface thereof. The crystals are cut and transported, and the entrainment is carried out. Wherein the die is placed on the carrier, the package and the side, and the I is responsible for removing or placing the die from the carrier, which is called a chipping device (Chip·(4)). Please refer to the figure - A to -C, which is a schematic diagram of the storage device. In the conventional technology application, the wafer #日日盘格格 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日The wafer is placed on the corresponding wafer carrier by the process of inspection and classification. When the wafer carrier is full=shifted, the wafer can be carried in the disk storage device by an automated mechanism. As shown, the shifting, 12 will be moved up and down by the bottom side opening of the wafer carrier storage device 1 (), and the upper and lower movements of the plurality of carriers 9 and 12 which have been placed on the supporting member 13 cause the wafer carrier to be moved. (10) It can be stacked in the state of 201011853 to form the state as shown in Figure 1. In the conventional technology, when the wafer carrier trays are stacked to a certain number, the wafer carrier trays stacked on each other need to be taken out by the operator for subsequent storage. Homework, but the above There are many problems with the stacked wafer carrier disk: 4 _ human structure protection, because: the operation of the second carrier disk without additional heart collision, (10) the expected a κ day of the jitter 'or not small 2. Because of the stacked wafer The cutting plate „'causes serious damage. This is not convenient for any standard*' because there is no (4), because the chip carrier stack is identified, because of the different crystal quality levels of the above, it is not easy to cause personnel Misclassification. Solving the problems caused by the conventional technology, the carrying device and the system, the invention provides the concept of the invention, which can be used to store the bearing. When hoarding to a degree, the user does not have to use the various devices, so that when the carrier tray is taken up and stored, the container can be stored in a stack of carrier trays, and only the automated device is used to stack the entire stack. The problem of taking out is a problem. ^When moving away to avoid manual operation, the present invention provides a concept of carrying a disk, which can be designed to be stored and can be extracted. The identification component should be used to accurately classify the container, and the device is arranged on the container to avoid manual classification errors, and to indicate the different properties of the storage. The invention provides a sorting and selection, which in turn facilitates online production management. The mechanism of component selection is combined with the mechanism of 201011853 carrier disk storage and classification to manage the storage disk of the storage component, to allow the operator to classify the storage device of the same level, and to manage the production line. In an embodiment, the present invention provides a receiving body having a receiving device: a mounting device, the carrying tray, the at least one side of the receiving body and the at least one of the receiving bodies The phase is engaged, wherein the bottom of the receiving body is more than 1 ❹ Ο The tray is closely stacked from bottom to top. The loading tray is accommodated. The bearing system can be selected to be engaged or separated from the tank according to requirements. In another embodiment, the present invention provides a selection and selection unit, which selects one component and system on a carrier, and includes: a carrier on a corresponding level; a carrier tray, The grading portion is connected to the arranging portion; the accommodating disc accommodating portion, the "reading: the carrying 3 and the reading 楝 connection", the carrying tray accommodating portion has: a carrying platform f carrying the disc wheeling portion of the tank; And a plurality of accommodating bodies, wherein the tamping drum is disposed to provide a plurality of carrying trays, each of which has a accommodating space, and the plurality of slots (four) each of the accommodating bodies to the system respectively The receiving portion is arranged to be engaged with the corresponding groove body, and the side has a snap-opening to facilitate the carrying plate to be further separated from the bottom of the upper body. "Select or match with the tank according to the needs [Embodiment] In order to enable the Beck Review Committee to further understand and understand the policy, the characteristics, objectives (10) and functions of the invention will be The structure of the related structure of the device of the present invention and the concept of the design are originally explained, so that the reviewing committee can understand the characteristics of the present invention, and the detailed description is as follows: Please refer to FIG. 2, which is the carrier disk of the present invention. A perspective view of an embodiment of the accommodating device. In this embodiment, the receiving tray accommodating device 2 includes a receiving body 20 having an accommodating space 2 提供 to provide at least one carrying tray 90, one side of the accommodating body 20 The utility model has a latching portion 21 for engaging with a slot body, and the receiving system can select two slots to be engaged or separated according to requirements. The body 20 is basically composed of a first plate body and a second plate body 202. The first plate body 201 and the second plate body 2〇2 are separated by a distance, and the first plate body 2〇1 Corresponding grooves are respectively formed on the second plate body 2〇2 to form the accommodating space. Since the two plates 2〇1 and 202 are separated by a distance, an opening is formed at the top and the bottom of the receiving body 2〇, so that the carrier trays are closely stacked from bottom to top and enter the carrier receiving device. The engaging portion 21 is provided on one side of the bottom opening. The engaging portion 21 in this embodiment has a plurality of fitting members 21, 211, 212 and 213, wherein the fitting members 210 and 211 have a concave shape and are respectively connected to the sides of the two plates 201 and 202. The shape and number of the components - 210 to 213 are not limited to the embodiment of the present invention because: • This is a form in which a person skilled in the art can design different fitting members according to actual needs. Further, the fitting members 210 to 213 can also be integrally molded with the housing body 20, which is a person skilled in the art and can be replaced according to the spirit of the present invention. A plurality of support members 22 are disposed in the recesses of the fitting members 210 and 211, corresponding to the bottom opening of the receiving body 20 to provide support for carrying at least one carrier disk 9〇. In this embodiment, the carrier can be provided with a plurality of components, such as a wafer, a ceramic, and a passive component, but not limited thereto. A hand gripper 2 is disposed above the second plate body 202, and the carrier tray housing 2 is lifted by the handle. In addition, it is a mold 23, so as to facilitate the use of the receiving body (for example, the first plate or the second identification, there is an identification element 24, so that the operator can set the contents of the carrier receiving device 2 The identification of the type of the carrier plate 90 is carried out. In a general embodiment, the identification component of the device 24 is classified into, for example, radio frequency identification = electronic media. Thus, the user can The portable type=== sub-reading device is used to read the content identification in the identification component. In addition, the accommodating body can be classified into different classes (four). _ (4) color 'for the carrier Ϊ = 2 Figure 3_ shows 'Figure 3A is a schematic diagram of the tank body with the mounting device, Ό σ = joint with the tank body. In Figure 3, it is a frame-frame 3. And a second frame mirror. The first frame body 3〇1 is hobby-provided to provide a space for housing the frame body 302 to form a space for the gentleman seat amp & % setting device 2. The fixing portion 30 has a pair of m ^ ^ The pair of coupling seats 31 and 32 are respectively disposed on the groove body 3 and the second frame 302 Each of the joints is pivotally connected to the corresponding U to / a support frame 310' and the elastic body 311 can be twisted and twisted. #圭31 or 32 on the side wall of the plurality of support frames 310 The disk, which is to be stored on the support frame (10), is determined not to need to be moved by the device when the process is performed (as shown in Figure 1 of the structure of the private frame 12, which is a conventional technique) In 201011853, the details are not described herein). The carrier tray accommodating device 2 is placed together. As shown in FIG. 3, when the carrier accommodating device 2 is embedded in the slot body 3, the coupling seats 3 and 32 are combined with the carrier tray. The bottom surface of the accommodating device 2 abuts to provide support for carrying the accommodating disc accommodating device 2. Of course, the trough body 3 accommodates the accommodating disc. When the device 2 is used, the locating member can also be positioned by the abutment of the positioning member. The position of the carrier receiving device 2 can be maintained in position. As for the arrangement and structure of the positioning component, it is not a focus of the present invention, and those skilled in the art can use many conventional positioning components such as: Pin and other components and the carrier 2 is abutted. Please refer to FIG. 4, which is a perspective view of the embodiment of the pressure plate of the present invention. In this embodiment, the design of the pressing structure 4 can be fixedly stored in the carrier receiving device. The plurality of carrier boards stacked on each other. Since the height of the stack of the carrier tray is too high, although the production efficiency can be increased, the carrier tray is still easily shaken in a state where the stack is too high. Although there is a first board in the present invention. And a receiving body formed by the second plate body to protect the stacked carrier disks, but in order to increase stability, the pressing structure 4' designed in the φ of the invention provides a pressing force on the stacked carrier disks, In the present embodiment, the pressing structure 4 has an elastic plate body 40 having a column body 41 and 42 at both ends thereof, which respectively lose the elastic plate body 40'. The two columns 41 The distance from the center of 42 is less than the length of the elastic plate 40 between the centers of the two bodies 41 and 42. The pressing structure 4 further has a tie rod 43 connected to the elastic plate body 4b. The connecting manner is to open two holes 401 and 402 in the elastic plate body 40, and a part of the pulling rod is connected to the elastic plate body 40 through the two holes 4〇1 and 402. A force can be provided on the elastic plate body 4 to cause the elastic plate body 4〇 201011853 to generate a pressing force on the uppermost carrier tray to fix the plurality of carrier disks. Referring to FIG. 5A, in the state of FIG. VIII, the upward force provided by the elastic plate body 4 at the pull rod 43 is shown, so that the elastic plate body is depressed by the force. . In this state, the pressed structure does not provide a pressing force on the carrier plate, and thus is in a loose state. On the other hand, as shown in FIG. 5B, when the pull rod 43 is provided with a downward force on the elastic plate body 4, the elastic plate body 40 is deformed into a concave upward state by the force. The position will abut against the carrier disk 90 to provide a pressing force to secure the stacked carrier disk 90. By the pressing structure of the present invention, the components of the at least one carrier tray stacked on each other are prevented from falling out due to the movement or dumping of the carrier receiving device. Please refer to FIG. 6, which is a perspective view of an embodiment of the picking system of the present invention. The picking system 5 has a carrier accommodating portion 5A, a picking portion 51, and a carrier tray transport portion 52. The carrier receiving portion 50 has a carrying platform 501 and a plurality of carrier receiving devices 5〇2. Each of the carrier accommodating devices 502 has a receiving body 5020. The plurality of slots 503 are disposed on the carrier φ 501 ′ to accommodate the plurality of carrier accommodating devices 502 respectively. Each of the accommodating bodies 5020 has an accommodating space for accommodating at least one platter 513. Each of the accommodating bodies 5020 is respectively received in the plurality of slots 5 〇 3, each of which is accommodated. One side of the body 5020 has an engaging portion 504 to engage with the corresponding groove 503. The structure of each of the trough body 503 and the receiving body 5020 is the same as that of the front cracking 2 and the trough body 3, and will not be described herein. The picking unit 51 selects an element from the carrier and classifies it to be placed on the carrier tray corresponding to the level. In the present embodiment, the carrier 510 is a film of 201011853 or a substrate having a tensile force, and the component 5100 is a wafer, a ceramic component /=1 number = a piece 5_. This element is limited. In order to facilitate the identification of the storage unit equivalent 7; · ^ element ^ not in each of the receiving body 5020 '... carrying the valley of the body of the tray, the operator has removed the identification of the component has been removed from the slot to facilitate accommodation The type of the board is „戈者:^The load-bearing board is placed in the 5〇2 body measurement (4)彳_. Material, the classification identification of the housing. The same color 'as different grade components and the selection The portion 51 includes a stacking device 512, a second image capturing device, and a first image capturing device 515. The picking portion 5U, and a second image capturing device 5100. In the embodiment, the picking portion is formed. Element on 510 and a negative pressure bearing table 5111. Noted with picking element 5110 ❹ Planar motion (γ, ζ) and - Rotary transport: 70 pieces of 5110 can carry out two-dimensional body 51 元件 on the component 5 兮 ^ 兮 ^ Actuation (WZ), and the use of negative pressure adsorption is shown in Figure 6 only; and; 511G is a conventional technique, and the 5m shot provides an additional map = limit. The enamel bearing has an ejector structure 5112 , the body 51Q, the negative pressure bearing platform 5111. Similarly, the negative pressure bearing can eject the components on the carrier 510 For the first scene, the last 7 sets of 5111 are of the conventional technology. In this figure, the image 1 2 = 2 sets 512', the system can draw the judgment basis of the component, and the picking component cow 5110 picks up 70 pieces of 51GG or not. In the third video recording, whether the position of the pickup component _ is an image, to determine whether the component 5100 device can operate the bottom surface of the component 5100 to detect damage to the bottom surface of the first image capturing device 512j^. In general,
乙興第三影像擷取裝置515係為CCD 201011853 ΐη件。至於該第二影像擷取裝置514，其俜 513之影像，⑽軸承㈣⑽之位置 -杜^影像摘取裝置514更可以在拾取元件5110將 =0。放置在*裁盤513上時，梅取元件 將 Γ=Γ是否有損傷。一般而言，該第二影像擁取 裝置514係為CCD或者是CM0S的元件。The Eixing third image capturing device 515 is a CCD 201011853 件n piece. As for the second image capturing device 514, the image of the 513, (10) the position of the bearing (4) (10) - the image capturing device 514 can be =0 at the pickup element 5110. When placed on the * platter 513, the plucking component will be Γ = Γ if there is damage. In general, the second image capturing device 514 is a CCD or an element of a CMOS.
❹ ^承载盤輸送部52與53，其係連接該揀選部5ι以及 ^$置部5〇 ’以輸送承載元件5⑽之承載盤513。兑 承载盤輸送部52係輸送空的承載盤，以讓拾取元件5ιι〇 =^件5刪置放。#承健513放滿或者是要被放置 =盤容置部50中之承載盤容置裝置5〇2内存放時，承 載=輪送部53便會將承載盤513移駐該承載盤容置部 〇中=的承韻容置裝置5G2存放。此時，承载盤輸送 # 52又會將另一個空的承載盤輸送至定位，以利拾取元件 511〇放置元件5100。該承載盤輸送部52與53亦可整人 一個輪送部，其係屬於習用技術，在此不作贅述。本;施 例之系統中的每-個容置本體分別代表不同存放等級因 此可與自動化的承載盤輸送部52結合，以於線上進行自 化的檢測分類製程。 惟以上所述者，僅為本發明之實施例，當不能以之限 制本發明範圍。即大凡依本發明申請專利範圍所做之均等 ^化及修飾，減不失本發明之要義所在，亦不脫離本發 之精神和範圍，故都應視為本發明的進一步實施狀況。 本發明的精神在於利用可以提取的設計，改變習用固定式 的設計，使得操作者在容置空間内的承載盤堆疊至—定^ 201011853 度後可以直接將容置裝置整的提走，而不需要直接搬動内 部所堆疊的承載盤。 綜合上述，本發明提供之承載盤容置裝置與系統，具 有方便使用者提取以及保護承載盤免於外力碰撞而傾倒的 問題，此外可以藉由辨識元件或顏色的輔助對於每一個不 ' 同的承載盤容置裝置進行辨識分類。因此已經可以提高該 產業之競爭力以及帶動週遭產業之發展，誠已符合發明專 利法所規定申請發明所需具備之要件，故爰依法呈提發明 ⑩ 專利之申請，謹請貴審查委員允撥時間惠予審視，並賜 准專利為轉。 14 201011853 【圖式簡單說明】 圖一 A以及圖一 C係為習用之晶片載盤存放裝置示意圖。 圖二係為本發明之承載盤容置裝置實施例立體示意圖。 圖三A係為與該承載盤容置裝置相結合之槽體立體示意 圖。 * 圖三B為承載盤容置本體與槽體結合示意圖。 圖四係為本發明之壓板實施例立體示意圖。 圖五A與圖五B係為本發明之壓制結構動作示意圖。 ❹ 圖六係為本發明之棟選系統實施例立體示意圖。 【主要元件符號說明】 10- 晶片載盤存放裝置 11- 承載台 12- 移載裝置 13- 支撐元件 2-承載盤容置裝置 20- 容置本體 200- 容置空間 201- 第一板體 202- 第二板體 21- 卡合部 210〜213-嵌合構件 22- 支撐元件 24-識別元件 3-槽體 15 201011853 30-固定部 301- 第一框體 302- 第二框體 31與32-結合座 ' 310-支撐架 ' 311-彈性體 4- 該壓制結構 40-彈性板體 〇 41、42-柱體 5- 棟選系統 50-承載盤容置部 501- 承載台 502- 承載盤容置裝置 5020-容置本體 503- 槽體 504- 卡合部 ❹ 51-揀選部 • 510-載體 . 5100-元件 511- 拾取部 5110- 拾取元件 5111- 負壓承載台 5112- 頂出結構 512- 第一影像擷取裝置 513- 承載盤 16 201011853 514- 第二影像擷取裝置 515- 第三影像擷取裝置 52、53-承載盤輸送部 ❹ ❹ 17❹ ^ Carrying tray conveying portions 52 and 53, which are connected to the picking portion 5i and the mounting portion 5'' to transport the carrier 513 of the carrier member 5 (10). The carrier tray conveying portion 52 conveys an empty carrier tray to allow the pickup member 5 to be removed. When the bearing 513 is full or is to be placed in the carrier accommodating device 5 〇 2 in the disk accommodating portion 50, the carrier=wheeling portion 53 moves the carrier 513 to the carrier accommodating portion. 〇中=The bearing device 5G2 is stored. At this point, the carrier transport #52 in turn transports another empty carrier to the location for picking up the component 511 and placing the component 5100. The carrier-carrying portions 52 and 53 may also be a single-passing portion, which is a conventional technique and will not be described herein. Each of the accommodating bodies in the system of the embodiment represents a different storage level and thus can be combined with the automated carrier tray transporting portion 52 to perform an automated detection and classification process on the line. However, the above is only an embodiment of the present invention, and the scope of the present invention is not limited thereto. That is, the equivalents and modifications of the scope of the present invention are not limited to the spirit and scope of the present invention, and should be considered as further implementation of the present invention. The spirit of the present invention is to use a design that can be extracted to change the conventional fixed design, so that the operator can directly carry the receiving device after stacking the carrier tray in the accommodating space until the time of 201011853 It is necessary to directly move the carrier trays stacked inside. In summary, the present invention provides a carrier disk accommodating device and system, which has the problem that the user can extract and protect the carrier disk from being impacted by external force collision, and can also be used for each component by identifying components or colors. The carrier disk accommodating device performs identification classification. Therefore, it has been possible to improve the competitiveness of the industry and to promote the development of the surrounding industries. Cheng has already met the requirements for applying for inventions as stipulated in the invention patent law. Therefore, the application for invention 10 patents is submitted in accordance with the law. Time will be reviewed and patents will be granted. 14 201011853 [Simple description of the diagram] Figure 1 A and Figure 1 C is a schematic diagram of a conventional wafer carrier storage device. FIG. 2 is a perspective view of an embodiment of a carrier disk accommodating device of the present invention. Figure 3A is a perspective view of the trough body combined with the carrier receiving device. * Figure 3B is a schematic diagram of the combination of the receiving body and the tank body. Figure 4 is a perspective view of an embodiment of the pressure plate of the present invention. Figure 5A and Figure 5B are schematic views of the action of the pressed structure of the present invention. ❹ Figure 6 is a perspective view of an embodiment of the building system of the present invention. [Description of main component symbols] 10-wafer carrier storage device 11 - carrier 12 - transfer device 13 - support member 2 - carrier accommodating device 20 - accommodating body 200 - accommodating space 201 - first plate 202 - Second plate body 21 - Engagement portions 210 to 213 - Fitting member 22 - Support member 24 - Identification member 3 - Slot 15 201011853 30 - Fixing portion 301 - First frame 302 - Second frame 31 and 32 - Combination seat '310-support frame' 311 - Elastomer 4 - The pressing structure 40 - Elastic plate body 〇 41, 42 - Column 5 - Build system 50 - Carrier accommodating portion 501 - Carrier 502 - Carrier tray Locating device 5020 - accommodating body 503 - trough body 504 - engaging portion ❹ 51 - picking portion • 510 - carrier. 5100 - element 511 - picking portion 5110 - picking member 5111 - negative pressure carrying table 5122 - ejecting structure 512 - First image capturing device 513 - Carrier disk 16 201011853 514 - Second image capturing device 515 - Third image capturing device 52, 53 - Carrier disk conveying portion ❹ 17