TWI591008B - Electronic components inspection methods and devices - Google Patents

Electronic components inspection methods and devices Download PDF

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TWI591008B
TWI591008B TW105122078A TW105122078A TWI591008B TW I591008 B TWI591008 B TW I591008B TW 105122078 A TW105122078 A TW 105122078A TW 105122078 A TW105122078 A TW 105122078A TW I591008 B TWI591008 B TW I591008B
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inspection
carrier
component
inspected
rail
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TW105122078A
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TW201802016A (en
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han-sheng Lin
Guan-Zhi Guo
rui-ming Chen
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All Ring Tech Co Ltd
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Description

電子元件之檢查方法及裝置Electronic component inspection method and device

本發明係有關於一種檢查方法及裝置,尤指一種對電子元件各側面所進行的檢查,及在檢查過程中以載盤對電子元件進行搬送之電子元件之檢查方法及裝置。The present invention relates to an inspection method and apparatus, and more particularly to an inspection method and apparatus for inspecting each side of an electronic component and electronic components that carry the electronic component by the carrier during the inspection.

按,一般電子元件中的基板加工製程通常需要進行品質檢查,這些檢查依製程別有不同的需求,但通常需藉助搬送裝置來協助以使檢查的過程可以自動化方式來進行;以在基板上已設有晶片並在晶片上方已覆設有散熱片的基板為例,由於時下的封裝製程以BGA(球柵陣列封裝Ball Grid Array)封裝為盛行,此類封裝後的基板通常必須檢查反面(底部)的錫球焊點的漏銅(又稱漏底銅)狀況,也必須檢查基板上方(正面)的散熱片是否刮傷、規格銘標是否無損,另散熱片封裝時的溢膠則需由基板四周側的檢查得知。Press, the substrate processing process in general electronic components usually requires quality inspection. These inspections have different requirements depending on the process, but usually need to be assisted by the conveying device so that the inspection process can be carried out in an automated manner; For example, a substrate having a wafer and having a heat sink over the wafer is used. Since the current packaging process is prevalent in a BGA (Ball Grid Array) package, such a packaged substrate usually has to be inspected ( At the bottom of the solder ball solder joint, the copper leakage (also known as the bottom copper), you must also check whether the heat sink on the top of the substrate (front) is scratched, the specification mark is not damaged, and the overflow of the heat sink package needs to be It is known from the inspection of the peripheral side of the substrate.

這些基板在進行檢查時,常複數個以矩陣方式排列置於一載盤中複數個定位區間中,每一個基板在一個定位區間中以散熱片朝上置放著,以便於整個載盤搬送及定位;載盤上盤面、下盤面在同一位置分別各設有對應之定位區間,故複數個載盤間可相互上、下堆疊、定位。When these substrates are inspected, they are often arranged in a matrix arrangement in a plurality of positioning intervals in a carrier tray, and each substrate is placed with a heat sink facing upward in a positioning interval to facilitate the entire carrier transport and Positioning; the disk surface on the carrier plate and the lower disk surface are respectively provided with corresponding positioning sections at the same position, so that a plurality of carrier disks can be stacked and positioned on each other.

先前技術中,在進行檢查時,常以人工方式逐一將載盤中基板取出置於顯微鏡下進行檢查,然而在大量檢查需求中,採自動化為必然趨勢,如何在進行檢查時於一機台上有效而妥善規劃基板的搬送及提供檢查的功能,以提高檢查效率及降低成本、節省廠房空間,乃為值得研究的重要課題。In the prior art, when inspecting, the substrate in the carrier is often taken out manually and placed under a microscope for inspection. However, in a large number of inspection requirements, automation is an inevitable trend, and how to perform inspection on a machine. It is an important subject worthy of study to effectively and properly plan the transfer of substrates and provide inspection functions to improve inspection efficiency, reduce costs, and save plant space.

爰是,本發明的目的,在於提供一種可以自動化進行電子元件檢查的電子元件檢查方法。Accordingly, it is an object of the present invention to provide an electronic component inspection method that can automatically perform electronic component inspection.

本發明的另一目的,在於提供一種可以自動化進行電子元件檢查的電子元件檢查裝置。Another object of the present invention is to provide an electronic component inspection apparatus that can automatically perform electronic component inspection.

本發明的又一目的,在於提供一種使用如所述電子元件檢查方法之裝置。It is still another object of the present invention to provide an apparatus using the electronic component inspection method as described.

依據本發明目的之電子元件之檢查方法,包括:提供一載盤,盛載待檢查元件;並在一機台台面上執行:使載盤上待檢查元件被一第一搬送裝置搬送並以一第一檢視單元進行待檢查元件反面檢查;使盛載待檢查元件的載盤被一翻轉機構自第一搬送裝置保持後翻轉至一第二搬送裝置受搬送,並以一第二檢視單元進行待檢查元件正面檢查;使載盤上待檢查元件被一移載機構自第二搬送裝置提取並被搬送,並以一第三檢視單元進行待檢查元件四周側面檢查。The method for inspecting an electronic component according to the object of the present invention comprises: providing a carrier tray for holding the component to be inspected; and performing on a table top: causing the component to be inspected on the carrier to be transported by a first conveying device and The first inspection unit performs a reverse inspection of the component to be inspected; the carrier carrying the component to be inspected is held by the inverting mechanism from the first conveying device, and then turned over to a second conveying device, and is carried by a second inspection unit. Checking the front side of the component; the component to be inspected on the carrier is extracted by a transfer mechanism from the second transfer device and transported, and the side inspection of the component to be inspected is performed by a third inspection unit.

依據本發明目的之另一電子元件之檢查方法,包括:提供一載盤,盛載待檢查元件;並執行:一反面檢查步驟,使載有反面朝上待檢查元件之載盤經第一搬送裝置被輸送至一第一載台處,並受一第一檢視單元對載盤中各待檢查元件反面逐一進行檢查;檢查完後,載盤受輸送至該第二載台處;一翻轉步驟,使翻轉機構將一原保持的空載盤置於第二載台上的已完成反面檢查步驟的載盤上方,並將二載盤保持在翻轉座中進行翻轉及位移至一第二搬送裝置的第三載台上;一正面檢查步驟,載盤被第二搬送裝置輸送至一第四載台處以受一第二檢視單元對載盤中各待檢查元件正面進行檢查;檢查完後,載盤受輸送至一第五載台處;一側面檢查步驟,載盤受一移載機構自載盤上提取已完成正面檢查的待檢查元件,將該待檢查元件移至一第三檢視單元進行四周側面之檢查。Another method for inspecting an electronic component according to the object of the present invention comprises: providing a carrier tray for holding the component to be inspected; and performing: a reverse inspection step of first carrying the carrier carrying the reverse facing component to be inspected The device is transported to a first stage, and is inspected one by one by a first inspection unit on the opposite side of each component to be inspected in the carrier; after the inspection, the carrier is transported to the second stage; Having the inverting mechanism place an originally held empty tray on top of the tray on the second stage that has completed the reverse inspection step, and hold the two trays in the flip holder for inversion and displacement to a second transport device On the third stage; a front inspection step, the carrier is transported by the second transfer device to a fourth stage to be inspected by a second inspection unit on the front side of each component to be inspected in the carrier; The disc is transported to a fifth stage; a side inspection step, the tray is subjected to a transfer mechanism to extract the component to be inspected that has completed the front inspection from the loading tray, and the component to be inspected is moved to a third inspection unit. Surrounding side an examination.

依據本發明另一目的之電子元件之檢查裝置,包括:在一機台台面上設有:一第一搬送裝置,形成一搬送載盤之傳送流路;一第一檢視單元,位於該第一搬送裝置上方,設有由上往下檢視之鏡頭;一第二搬送裝置,形成一搬送載盤之傳送流路;一第二檢視單元,位於該第二搬送裝置上方,設有由上往下檢視之鏡頭;一翻轉機構,設有一翻轉座可受驅動位移於第一搬送裝置、第二搬送裝置間並進行翻轉;一第三檢視單元,位於該第二搬送裝置一側,設有由下往上檢視之鏡頭;一移載機構,設有可被驅動位移於第二搬送裝置、第三檢視單元間的一第一提取組件。According to another aspect of the present invention, an inspection apparatus for an electronic component includes: a first transfer device on a machine table; a transfer flow path for forming a transfer carrier; and a first inspection unit located at the first Above the conveying device, there is a lens for viewing from top to bottom; a second conveying device forms a conveying flow path for conveying the carrier; and a second inspection unit is located above the second conveying device, and is provided with a top to bottom a lens for inspection; an inverting mechanism provided with a flipping seat that can be driven to be displaced between the first conveying device and the second conveying device and turned over; a third viewing unit located on the side of the second conveying device, provided with a lower a lens for viewing upwards; a transfer mechanism having a first extraction component that can be driven to be displaced between the second transport device and the third view unit.

依據本發明又一目的之電子元件之檢查裝置,包括:使用如所述電子元件之檢查方法的裝置。An inspection apparatus for an electronic component according to still another object of the present invention includes: an apparatus using an inspection method of the electronic component.

本發明實施例電子元件之檢查方法及裝置,由於第一搬送裝置、翻轉機構、第二搬送裝置、移載機構、第三搬送裝置循序將載盤傳送,故可在整個傳送流路中完成基板的反、正、四周側面等六面檢查;並藉由翻轉機構E的第一保持組件、第二保持組件之對抵或對夾轉換,使基板順利轉換於二載盤間並被穩定輸送;同時配合第一搬送裝置之供料機構、第二搬送裝置之收料機構、第三搬送裝置之供料機構及收料機構之設計,使載盤可順利的供、收,甚至作盛載不同規格基板之載盤的分別供、收,其所獲得的檢查、輸送效益確大幅提昇產能效率。In the method and device for inspecting an electronic component according to the embodiment of the present invention, since the first transporting device, the inverting mechanism, the second transporting device, the transfer mechanism, and the third transporting device sequentially transport the carrier, the substrate can be completed in the entire transport flow path. The six sides of the reverse, positive, and four sides are inspected; and by the first holding component of the inverting mechanism E, the second holding component is offset or the clamping is reversed, the substrate is smoothly converted between the two carriers and stably transported; At the same time, with the design of the feeding mechanism of the first conveying device, the receiving mechanism of the second conveying device, the feeding mechanism of the third conveying device and the receiving mechanism, the carrier can be smoothly supplied, received, and even loaded. The supply and acceptance of the carrier plates of the specification substrate have greatly improved the productivity efficiency of the inspection and transportation benefits obtained.

請參閱圖1〜3,本發明實施例在進行搬送時,採用一載盤A,該載盤A大致呈一長方形之盤狀,其四個側邊之周緣設有朝上凸設之框緣A1,並在兩側長側邊之框緣A1上以相隔間距設有二微凹之扣緣A2,及在兩側短側邊之框緣A1外分別各設有一外凸之扣肋A3,框緣A1內設有一平設之盤面A4,並在盤面A4上以矩陣排列複數組凸設的定位部A5,每一組定位部A5分別各提供一可供置放基板B等之待檢查元件的定位區間A51,各基板B呈矩陣排列;該基板B可為採BGA方式已植設晶片及散熱片者,其置於載盤A中時,採散熱片朝上方式,該散熱片上表面為正面,基板B下方表面為反面。Referring to FIG. 1 to FIG. 3, in the embodiment of the present invention, a carrier A is used, and the carrier A is substantially in the shape of a rectangular disk, and the periphery of the four sides is provided with a frame edge protruding upward. A1, and a two-concave buckle edge A2 is arranged at a distance from the frame edge A1 of the long sides of the two sides, and a convex buckle rib A3 is respectively arranged outside the frame edge A1 of the short side edges of the two sides. A flat disk surface A4 is disposed in the frame edge A1, and a plurality of positioning portions A5 protruding in a matrix are arranged in a matrix on the disk surface A4. Each of the positioning portions A5 respectively provides a component to be inspected for placing the substrate B and the like. The positioning interval A51, the substrates B are arranged in a matrix; the substrate B can be a BGA-type implanted wafer and a heat sink, and when placed in the carrier A, the heat sink is facing upward, and the upper surface of the heat sink is On the front side, the lower surface of the substrate B is the reverse side.

請參閱圖2、4〜5,本發明實施例可以圖中之裝置實施例來說明,該裝置可適用分別載有二種不同規格基板B之二種載盤A同時置入裝置中,依序分別進行檢查,該裝置包括: 一第一搬送裝置C,設於一機台台面Y上,呈X軸向設置並偏靠機台台面Y一側邊Y1,該第一搬送裝置C包括相互對設的第一軌道C1及第二軌道C2,第一軌道C1搬送起點設有一供料機構C3,該供料機構C3層層疊置載有反面朝上基板B之載盤A,並由上往下對第一軌道C1逐件供應所述載盤A;第二軌道C2中設有相隔間距且分別各設於定位但可作Z軸向上下昇降的第一載台C21、第二載台C22,及可受驅動用以進行輸送形成傳送流路的皮帶C23;其中,第二載台C22鄰靠該第二軌道C2輸送終點並設有夾持機構C221;待檢查元件之基板B以反面朝上置於載盤A並由供料機構C3經第一軌道C1往第二軌道C2輸送; 一第二搬送裝置D,與第一搬送裝置C平行且相隔間距倂設於機台台面Y上,呈X軸向設置並位於相對機台台面Y之側邊Y1的第一搬送裝置C另一側,該第二搬送裝置D包括相互對設的第三軌道D1及第四軌道D2,第四軌道D2輸送終點設有一收料機構D3,該收料機構D3用以收集完成檢查載有正面朝上基板B良品之載盤A,並由下往上自第四軌道D2逐件承收所述載盤A作層層疊置;第三軌道D1中設有相隔間距且分別各設於定位但可作Z軸向上下昇降的第三載台D11、第四載台D12,及可受驅動用以進行輸送形成傳送流路的皮帶D13,第四軌道D2中設有可作Z軸向上下昇降的第五載台D22,其位於一第四軌道D2中下方軌座D21上可受驅動作X軸向位移並設有一夾持機構D221;其中,第三載台D11鄰靠該第三軌道D1輸送起點並設有一夾持機構D111,待檢查元件之基板B以正面朝上置於載盤A並由第三軌道D1經第四軌道D2往收料機構D3輸送; 一翻轉機構E,設於機台台面Y上,位於第一搬送裝置C之第二軌道C2輸送終點外,及第二搬送裝置D之第三軌道D1輸送起點外,其設有一可受驅動件E1作Z軸向上、下位移、Y軸向左、右位移及以一X軸向轉軸E2為軸心受驅動件E3驅動作對稱性旋轉的翻轉座E4,其設於一立設之機座E5上,該機座E5設於一Y軸向軌座E6 並受驅動件E7驅動而在軌座E6上作Y軸向位移,使翻轉座E4可反復位移於第一搬送裝置C之第二軌道C2與第二搬送裝置D之第三軌道D1之間上方;   一第一檢查機構F,位於機台台面Y上,設有以一Y軸向橫設於第一搬送裝置C的第二軌道C2及第二搬送裝置D的第三軌道D1上方的第一軌座F1,第一軌座F1兩端分別設於相併設的第一搬送裝置C、第二搬送裝置D兩外側所架高平行設置的X軸向第二軌座F2、第三軌座F3上,第一軌座F1可在第二軌座F2、第三軌座F3上受驅動作X軸向位移;第一軌座F1上設有可受驅動作Z軸向位移的第一檢視單元F11,其可獨立受驅動在第一軌座F1上作Y軸向位移,並對下方被輸送至第一搬送裝置C之第二軌道C2中第一載台C21上載盤A以反面朝上放置之待檢查元件基板B的上表面進行檢查,該第一檢視單元F11設有一由上往下進行檢視之CCD鏡頭;第一軌座F1上另設有可受驅動作Z軸向位移的第二檢視單元F12,其可獨立受驅動在第一軌座F1上作Y軸向位移,並對下方被輸送至第二搬送裝置D之第三軌道D1中第四載台D12上載盤A以正面朝上放置之待檢查元件基板B進行上表面檢查,該第二檢視單元F12設有一由上往下進行檢視之CCD鏡頭; 一第三搬送裝置G,其傳送流路與第一搬送裝置C、第二搬送裝置D的傳送流路相互平行且相隔間距倂設於機台台面Y上,且呈X軸向設置並位於偏靠相對機台台面Y之側邊Y1的另一側機台台面Y之側邊Y2,該第三搬送裝置G包括相互對設的第五軌道G1及第六軌道G2,第五軌道G1上設有一供料機構G3,該供料機構G3由上往下對第五軌道G1供應空載盤A,第六軌道G2輸送終點設有一收料機構G4,該收料機構G4由下往上自第六軌道G2回收經檢測為不良品而撿置其上之正面朝上待檢查元件基板B的載盤A;第六軌道G2中設有可作Z軸向上下昇降且位於一第六軌道G2中下方軌座G21上可受驅動作X軸向位移的第六載台G5,第六載台G5在Y軸向位置對應第二搬送裝置D之第四軌道D2中第五載台D22並設有夾持機構G51,空載盤A由第五軌道G1經第六軌道G2往收料機構G4輸送; 一第二檢查機構H,設有一第三檢視單元H1及一第四檢視單元H2,其在X軸向相隔間距設置於機台台面Y上,並位於第二搬送裝置D之第四軌道D2與第三搬送裝置G之第六軌道G2間,其分別各設有由下往上進行檢視之CCD鏡頭,用以對待檢查元件基板B之四周側面進行檢視; 一移載機構K,設有相向、相互平行並設於機台台面Y上的第一移載軌座K1、第二移載軌座K2,該第一移載軌座K1、第二移載軌座K2分別各被架高呈Y軸向設置,其傳送流路與第一搬送裝置C、第二搬送裝置D的傳送流路相互垂直;第一移載軌座K1上設有可受驅動作Y軸向及Z軸向位移的第一提取組件K11,第一提取組件K2可被驅動在第一移載軌座K1上移送於第二搬送裝置D之第四軌道D2中第五載台D22、第二檢查機構H的第三檢視單元H1及第三搬送裝置G之第六軌道G2的第六載台G5間;第二移載軌座K2設有可受驅動作Y軸向及Z軸向位移的第二提取組件K21,第二提取組件K21可被驅動移送於第二搬送裝置D之第四軌道D2中第五載台D22、第二檢查機構H之第四檢視單元H2及第三搬送裝置G之第六軌道G2的第六載台G5間。Referring to FIG. 2 and FIG. 4 to FIG. 5, the embodiment of the present invention can be illustrated by the device embodiment in the figure. The device can be applied to two types of carriers A respectively carrying two different specifications of the substrate B, and simultaneously placed in the device, in order. The first conveying device C is disposed on a table top Y, and is disposed in the X-axis direction and is biased against the side Y1 of the machine table surface Y. The first conveying device C includes the opposite sides. The first track C1 and the second track C2 are provided, and a feeding mechanism C3 is disposed at the starting point of the first track C1, and the feeding mechanism C3 is stacked with the carrier A on the reverse side facing the substrate B, and is turned from top to bottom. The first carrier C1 is supplied to the first track C1 one by one; the second track C2 is provided with a first stage C21 and a second stage C22 which are spaced apart from each other and are respectively disposed at positions but can be vertically moved up and down in the Z axis. And a belt C23 that can be driven to transport to form a conveying flow path; wherein the second stage C22 is adjacent to the second rail C2 and conveys an end point and is provided with a clamping mechanism C221; the substrate B of the component to be inspected faces upwards Placed on the carrier A and transported by the feeding mechanism C3 via the first track C1 to the second track C2; And D is disposed in parallel with the first conveying device C and spaced apart from each other on the machine table surface Y, and is disposed on the other side of the first conveying device C opposite to the side Y1 of the machine table surface Y in the X-axis direction. The second conveying device D includes a third rail D1 and a fourth rail D2 which are opposite to each other. The fourth rail D2 is provided with a receiving mechanism D3 at the end of the conveying. The receiving mechanism D3 is used for collecting and completing the inspection and carrying the front facing substrate B. The carrier A is loaded from the fourth track D2 one by one, and the carrier A is layered one by one; the third track D1 is provided with a spacing and is respectively disposed at the position but can be used as the Z axis. a third stage D11 and a fourth stage D12 that are vertically moved up and down, and a belt D13 that can be driven to transport to form a conveying flow path, and a fourth stage that can be raised and lowered in the Z-axis is provided in the fourth track D2. D22, which is located on the lower rail seat D21 of a fourth track D2, can be driven to X-axis displacement and is provided with a clamping mechanism D221; wherein the third stage D11 is adjacent to the third track D1 to convey the starting point and is provided with a The clamping mechanism D111, the substrate B of the component to be inspected is placed face up on the carrier A and is guided by the third track D1 via the fourth track D2 is transported to the receiving mechanism D3; an inverting mechanism E is disposed on the table top Y, outside the transport destination of the second rail C2 of the first transport device C, and the third track D1 of the second transport device D is transported outside the starting point The utility model is provided with a flip seat E4 which can be driven by the driving member E1 for the Z-axis up and down displacement, the Y-axis left and right displacement, and the X-axis rotation axis E2 as the axis to be driven to rotate symmetrically by the driving member E3. It is disposed on a stand E5. The stand E5 is disposed on a Y-axis rail seat E6 and is driven by the driving member E7 to be displaced in the Y-axis on the rail seat E6, so that the flip seat E4 can be repeatedly displaced. a second track C2 of the first conveying device C and a third track D1 of the second conveying device D; a first inspection mechanism F located on the machine table Y, provided with a Y-axis transversely The second rail C2 of the transport device C and the first rail mount F1 above the third rail D1 of the second transport device D, the first rail mount F1 is disposed at the opposite ends of the first transport device C and the second transport The two outer sides of the device D are arranged in parallel with the X-axis second rail seat F2 and the third rail seat F3. The first rail seat F1 can be in the second rail seat F2 and the third. The seat F3 is driven to be X-axis displacement; the first rail seat F1 is provided with a first inspection unit F11 that can be driven to be displaced by the Z-axis, which can be independently driven to the Y-axis on the first rail seat F1. Displacement, and inspecting the upper surface of the substrate B to be inspected on the first stage C21 in the second track C2 conveyed to the first conveying device C, the upper stage C21 is placed on the reverse side, the first inspection unit F11 A CCD lens is provided for viewing from top to bottom; the first rail seat F1 is further provided with a second inspection unit F12 that can be driven for Z-axis displacement, and can be independently driven on the first rail seat F1 for Y. The axial displacement, and the upper surface inspection of the component substrate B to be inspected, which is placed on the fourth stage D12 in the third track D1 of the second conveying device D, is placed on the upper surface of the object to be inspected, which is placed face up, the second inspection unit F12 is provided with a CCD lens for viewing from top to bottom; a third conveying device G, the conveying flow path is parallel to the conveying path of the first conveying device C and the second conveying device D, and is spaced apart from each other at the machine The table top Y is disposed in the X-axis direction and is located on the side Y1 of the opposite machine table Y The third side conveying device G includes a fifth rail G1 and a sixth rail G2 which are opposite to each other, and the fifth rail G1 is provided with a feeding mechanism G3. The feeding mechanism G3 is provided on the side Y2 of the other machine table surface Y. The fifth rail G1 is supplied with the empty tray A from the top to the bottom, and the sixth rail G2 is provided with a receiving mechanism G4 at the end of the conveyance. The receiving mechanism G4 is recovered from the sixth rail G2 and is detected as a defective product. The carrier A is placed on the front side of the component substrate B to be inspected; the sixth rail G2 is provided with a Z-axis up and down and is located on a lower rail G21 in a sixth rail G2 and can be driven as an X-axis. The displacement of the sixth stage G5, the sixth stage G5 corresponds to the fifth stage D22 of the fourth track D2 of the second transfer device D in the Y-axis position, and is provided with a clamping mechanism G51, and the empty tray A is The fifth track G1 is transported to the receiving mechanism G4 via the sixth track G2; a second inspection mechanism H is provided with a third viewing unit H1 and a fourth viewing unit H2, which are disposed at the machine table in the X-axis spacing. And located between the fourth track D2 of the second conveying device D and the sixth track G2 of the third conveying device G, each of which is provided from bottom to top The CCD lens for inspection is used to inspect the side surface of the component substrate B to be inspected; a transfer mechanism K is provided with a first transfer rail seat K1 and a second direction which are opposite to each other and are disposed on the machine table Y. The transfer rail base K2, the first transfer rail base K1 and the second transfer rail base K2 are respectively disposed in the Y-axis direction by the height, and the conveying flow path is combined with the first conveying device C and the second conveying device D. The conveying flow path is perpendicular to each other; the first transfer rail base K1 is provided with a first extraction component K11 that can be driven to be displaced in the Y-axis and the Z-axis, and the first extraction component K2 can be driven on the first transfer rail base. K1 is transferred between the fifth stage D22 of the fourth track D2 of the second conveying device D, the third inspection unit H1 of the second inspection mechanism H, and the sixth stage G5 of the sixth track G2 of the third transfer device G. The second transfer rail base K2 is provided with a second extraction component K21 that can be driven to be displaced in the Y-axis and the Z-axis, and the second extraction component K21 can be driven to be transferred to the fourth rail D2 of the second transport device D. The fifth stage D22, the fourth inspection unit H2 of the second inspection mechanism H, and the sixth stage G5 of the sixth track G2 of the third transfer device G.

請參閱圖4、6〜7,該第一搬送裝置C的第一軌道C1係在一座板C11上設有二相隔間距並相互平行的架高側架C12,二側架C12相對應之內側分別設有受驅動的皮帶C13,該皮帶C13形成所述輸送載盤A的傳送流路,二側架C12間的一端下方座板C11上設有一鏤空的工作區間C111;所述供料機構C3與第三搬送裝置G中第五軌道G1上供料機構G3相同,茲以供料機構C3作說明,供料機構G3同理可推,茲不贅述,該供料機構C3包括一載料架C31及一昇降架C32;其中, 該載料架C31包括一設有可供載盤A移經之長方形鏤空移載區間C311的載座C312,該移載區間C311與工作區間C111上、下對應;載座C312下方兩側分別各設有可跨設於第一軌道C1二側架C12兩外側之側座C313,使載座C312被架高於第一軌道C1二側架C12上方一間距高度;該移載區間C311外的四角落處分別於載座C312上各設有角架桿C314,在載座C312下方設有由四個可受驅動作前後凸伸或縮入之卡掣件C3151所組成的第一嵌抵組件C315,其在長方形鏤空移載區間C311二長側邊外的二角架桿C314間分別各設有二個卡掣件C3151;在載座C312上方設有由四個被立架C3161距離載座C312一間距下架高的可受驅動作前後凸伸或縮入之卡掣件C3162所組成的第二嵌抵組件C316,其在長方形鏤空移載區間C311二長側邊外的二角架桿C314間分別各設有二個卡掣件C3162;該第一嵌抵組件C315與第二嵌抵組件C316間供疊置第一種規格的載有反面朝上基板B之載盤A,該第二嵌抵組件C316上方供疊置第二種規格的載有反面朝上基板B之載盤A; 該昇降架C32包括一固定架C321及一移動架C322所組成;該固定架C321由上固定座C3211、下固定座C3212及其間複數支撐桿C3213組成,並以上固定座C3211設於該第一軌道C1的座板C11下方;上固定座C3211、下固定座C3212間設有一長條狀定位件C3214,其上設有分別設於上、下兩定位之感應器C3215;該移動架C322由位於上固定座C3211上方的上撐座C3221、位於上固定座C3211下方並位於各支撐桿C3213間的驅動座C3222及其間複數支撐桿C3223組成;該上撐座C3221設有二個並相隔間距,每一個上撐座C3221各位於二支撐桿C3223上端;該驅動座C3222受一驅動件C3224所驅動的螺桿C3225作用,可作上下位移並藉支撐桿C3223連動上撐座C3221上下位移進出移載區間C311與工作區間C111;驅動座C3222一側設有一感應片C3226可受該感應器C3215感應。Referring to FIG. 4, FIG. 6 to FIG. 7 , the first rail C1 of the first conveying device C is disposed on a single plate C11 on the upper side frame C12 with two spaced intervals and parallel to each other, and the inner side of the two side frames C12 respectively A belt C13 is provided, the belt C13 forms a conveying flow path of the conveying tray A, and a hollow working section C111 is disposed on the lower side plate C11 between the two side frames C12; the feeding mechanism C3 and In the third conveying device G, the feeding mechanism G3 is the same on the fifth rail G1, and the feeding mechanism C3 is used for description. The feeding mechanism G3 can be similarly pushed. It is not mentioned that the feeding mechanism C3 includes a loading rack C31. And a lifting frame C32; wherein the loading frame C31 comprises a carrier C312 provided with a rectangular hollow transfer section C311 for the carrier A to move, and the transfer section C311 corresponds to the upper and lower working sections C111; The side of the lower side of the carrier C312 is respectively provided with a side seat C313 which can be disposed on both outer sides of the two side frames C12 of the first track C1, so that the carrier C312 is framed higher than a height above the first track C1 and the two side frames C12; The four corners outside the transfer section C311 are respectively provided with a corner rod C314 on the carrier C312, and the carrier C312 is mounted on the carrier C312. The first indentation component C315 is composed of four clamping members C3151 which can be driven to protrude or retract in front and rear, and the double-angled rod C314 outside the two long sides of the rectangular hollow transfer section C311 There are two clamping members C3151 respectively; and four clamping members C3121 are arranged above the carrier C312 at a distance from the carrier C312, and can be driven to protrude forward or backward. The second indentation component C316 composed of C3162 is respectively provided with two latching members C3162 between the two angled rods C314 outside the two long sides of the rectangular hollow transfer section C311; the first indentation component C315 and Between the second indentation component C316, a carrier A carrying the reverse-facing substrate B of the first specification is stacked, and the second inlay component C316 is disposed above the second-type reverse-loaded substrate B. The mounting plate C32 comprises a fixing frame C321 and a moving frame C322. The fixing frame C321 is composed of an upper fixing base C3211, a lower fixing base C3212 and a plurality of supporting rods C3213 therebetween, and the fixing base C3211 is provided. Below the seat plate C11 of the first track C1; between the upper mount C3211 and the lower mount C3212 The strip-shaped positioning member C3214 is provided with sensors C3215 respectively disposed on the upper and lower sides; the movable frame C322 is located above the upper fixing base C3211 and above the upper fixing base C3211. The driving base C3222 between the support rods C3213 and the plurality of support rods C3223 are formed; the upper support C3221 is provided with two spaced apart intervals, and each upper support C3221 is located at the upper end of the two support rods C3223; the drive base C3222 is driven by a drive The screw C3225 driven by C3224 acts as a vertical displacement and is supported by the support rod C3223 to move the upper support C3221 up and down into the transfer section C311 and the working section C111; on the side of the drive base C3222, an inductive piece C3226 can be received by the sensor C3215 induction.

請參閱圖2、8〜10,該第一嵌抵組件C315與第二嵌抵組件C316間疊置的第一種規格載有反面朝上基板B之載盤A,其下方受凸伸的第一嵌抵組件C315所阻抵而定位在第一嵌抵組件C3152的卡掣件C3151上方(圖8);當欲作入料於第一軌道C1時,昇降架C32被驅動上移以上撐座C3221抵於載有反面朝上基板B之載盤A下方,第一嵌抵組件C315的卡掣件C3151被驅動縮入,使載盤A循載座C312下方兩側分別各設的導引件C317間之限制區間落置於上撐座C3221上(圖9);第一嵌抵組件C315的卡掣件C3151被驅動凸伸以限制其上方載盤A不致續落,昇降架C32被驅動下移以上撐座C3221將載盤A降至二側架C12相對應內側皮帶C13上,使載盤A受第一軌道C1之該皮帶C13所形成的傳送流路進行輸送(圖10);若係第一種規格載有反面朝上基板B之載盤A欲作入料於第一軌道C1時,則同理方式執行;在本實施例中,第一種規格載有反面朝上基板B之載盤A將被優先執行完後再執行第二種規格載有反面朝上基板B之載盤A入料檢查作業。Referring to FIGS. 2 and 8 to 10, the first type of overlap between the first indentation component C315 and the second indentation component C316 carries the carrier A of the reverse-facing substrate B, and the lower portion thereof is protruded. An intrusion component C315 is resisted and positioned above the latching C3151 of the first indentation component C3152 (Fig. 8); when it is intended to be fed to the first rail C1, the lifting frame C32 is driven up to the upper bracket C3221 is pressed under the carrier A carrying the reverse-facing substrate B, and the clamping member C3151 of the first fitting component C315 is driven to be retracted, so that the guiding members of the carrier A are respectively arranged on the lower sides of the carrier C312. The restriction interval between C317 falls on the upper support C3221 (Fig. 9); the latch C3151 of the first intrusion component C315 is driven to protrude to restrict the upper carrier A from falling, and the crane C32 is driven. Moving the upper support C3221 to lower the carrier A to the inner side belt C13 of the two side frames C12, so that the carrier A is transported by the conveying flow path formed by the belt C13 of the first track C1 (Fig. 10); When the first type of carrier A carrying the reverse-facing substrate B is to be fed to the first track C1, it is performed in the same manner; in this embodiment, the first specification There tails disc substrate B are set to A is executed after completion of the second specification takes precedence containing tails of the substrate carrier plate B A feeding and inspection work.

請參閱圖11〜12,該第二搬送裝置D之第四軌道D2及收料機構D3與第三搬送裝置G之第六軌道G2及收料機構G4相同,茲以第二搬送裝置D之第四軌道D2及收料機構D3作說明,第六軌道G2及收料機構G4同理可推,茲不贅述; 該第二搬送裝置D之第四軌道D2包括在一座板D23上設有二相隔間距並相互平行的架高側架D24,二側架D24相對應之內側分別設有受驅動的皮帶D25,該皮帶D25形成所述輸送載盤A的傳送流路,二側架D24間的一端下方座板D23上設有一鏤空的工作區間D231;該設有夾持機構D221並位於軌座D21上可作Z軸向上下昇降的第五載台D22係位於二側架D24間,並於一側對應該第五載台D22的側架D24上設有迫推機構D26,以迫推移至第五載台D22上的載盤A朝一側之側架D24偏靠定位; 該收料機構D3包括一載料架D31及一昇降架D32;其中,該載料架D31包括一設有可供載盤A移經之長方形鏤空移載區間D311的載座D312,該移載區間D311與工作區間D231上、下對應;載座D312下方兩側分別各設有可跨設於第四軌道D2二側架D24兩外側之側座D313,使載座D312被架高於第四軌道D2二側架D24上方一間距高度;該移載區間D311外的四角落處分別於載座D312上各設有角架桿D314,在載座D312上表面上設有由四個可由下往上旋撥或受彈性(或重力作用)回復呈水平定位之卡掣件D3151所組成的第一嵌抵組件D315,其在長方形鏤空移載區間D311二長側邊外的二角架桿D314間分別各設有二個卡掣件D3151;在第一嵌抵組件D315上方設有由四個被立座D3161距離第一嵌抵組件D315一上下間距下架高的由四個可由下往上旋撥或受彈性(或重力作用)回復呈水平定位之卡掣件D3162所組成的第二嵌抵組件D316,其在長方形鏤空移載區間D311二長側邊外的二角架桿D314間分別各設有二個卡掣件D3162;其中,該第二嵌抵組件D316上方供疊置第一種規格的載有正面朝上被檢查為良品的基板B之載盤A,第一嵌抵組件D315與第二嵌抵組件D316間供疊置第二種規格的載有正面朝上被檢查為良品的基板B之載盤A; 該昇降架D32包括一固定架D321及一移動架D322所組成;該固定架D321由上固定座D3211、下固定座D3212及其間複數支撐桿D3213組成,並以上固定座D3211設於該第四軌道D2的座板D23下方;上固定座C3211、下固定座C3212間設有一長條狀定位件D3214,其上設有分別設於上、下兩定位之感應器D3215;該移動架D322由位於上固定座D3211上方的上撐座D3221、位於上固定座D3211下方並位於各支撐桿D3213間的驅動座D3222及其間複數支撐桿D3223組成;該驅動座D3222受一驅動件D3224所驅動的螺桿D3225作用,可作上下位移並藉支撐桿D3223連動上撐座D3221上下位移進出移載區間D311與工作區間D111;驅動座D3222一側設有一感應片D3226可受該感應器D3215感應。Referring to FIGS. 11 to 12, the fourth rail D2 and the receiving mechanism D3 of the second conveying device D are the same as the sixth rail G2 and the receiving mechanism G4 of the third conveying device G, and the second conveying device D is The four-track D2 and the receiving mechanism D3 are described. The sixth track G2 and the receiving mechanism G4 can be similarly pushed, and the description is omitted. The fourth track D2 of the second conveying device D includes two spaced-aparts on a board D23. The elevated side frame D24 spaced apart from each other and the inner side of the two side frames D24 are respectively provided with a driven belt D25, the belt D25 forms a conveying flow path of the conveying carrier A, and one end between the two side frames D24 The lower seat plate D23 is provided with a hollow working section D231; the fifth stage D22 which is provided with the clamping mechanism D221 and is located on the rail seat D21 for lifting up and down in the Z-axis is located between the two side frames D24, and is The side frame D24 corresponding to the fifth stage D22 is provided with an urging mechanism D26 for forcedly shifting to the side of the carrier A of the fifth stage D22 toward the one side of the side frame D24; the receiving mechanism D3 includes a loading rack D31 and a lifting frame D32; wherein the loading rack D31 comprises a rectangular frame provided for the carrier A to move through The carrier D312 of the transfer section D311, the transfer section D311 corresponds to the upper and lower sections of the working section D231; the lower sides of the carrier D312 are respectively provided with side seats which can be disposed on both outer sides of the two side frames D24 of the fourth track D2. D313, the carrier D312 is arranged higher than a height above the second rail D2 of the fourth rail D2; the four corners outside the shifting section D311 are respectively provided with a corner rod D314 on the carrier D312, in the carrier The upper surface of the D312 is provided with a first inlaying component D315 composed of four latching members D3151 which can be rotated from bottom to top or horizontally positioned by elasticity (or gravity), and is in the rectangular hollow transfer section D311. Two latching members D3151 are respectively disposed between the two long side rails D314; and a top spacer D3151 is disposed above and below the first indented component D315. The second indented component D316 consisting of four latching members D3162 which can be rotated from bottom to top or horizontally positioned by elastic (or gravity), and which are long in the rectangular hollow transfer section D311 Two latching members D3162 are respectively disposed between the two side frame rods D314 of the side edges; wherein The second inlay component D316 is disposed above the first type of the carrier A carrying the substrate B which is inspected as a good product facing up, and the second indentation component D315 and the second indentation component D316 are stacked second. The type of the carrier A carrying the substrate B which is inspected as a good product facing up; the lifting frame D32 comprises a fixing frame D321 and a moving frame D322; the fixing frame D321 is composed of an upper fixing base D3211 and a lower fixing base The D3212 is composed of a plurality of support rods D3213, and the upper fixed seat D3211 is disposed under the seat plate D23 of the fourth track D2; and an elongated positioning member D3214 is disposed between the upper fixed seat C3211 and the lower fixed seat C3212. The sensors D3215 are respectively disposed on the upper and lower sides; the movable frame D322 is composed of an upper support D3221 located above the upper mount D3211, a drive seat D3222 located below the upper mount D3211 and located between the support rods D3213, and a plurality thereof The support rod D3223 is composed of the screw D3225 driven by a driving member D3224, and can be displaced up and down, and the upper rod D3221 is moved up and down by the support rod D3223 to move in and out of the transfer interval D311 and the working interval D111; the driving seat D3222 One side A sensor D3226 is provided to be sensed by the sensor D3215.

請參閱圖2、13〜15,當第二種規格的載有正面朝上被檢查為良品的基板B之載盤A被第四軌道D2之皮帶D25形成的傳送流路移送至該收料機構D3之載料架D31下方時(圖13),昇降架D32被驅動上移以上撐座D3221抵於載有正面朝上基板B之載盤A下方並承托上移至抵及第一嵌抵組件D315的卡掣件D3151,使卡掣件D3151被由下往上旋撥(圖14),使載盤A上移通過兩側卡掣件D3151後,卡掣件D3151受彈性(或重力作用)回復呈水平定位,昇降架D32被驅動下移使載盤A下移落置於第一嵌抵組件D315的卡掣件D3151上(圖15);若係第一種規格的載有正面朝上被檢查為良品的基板B之載盤A被第四軌道D2之皮帶D25形成的傳送流路移送至該收料機構D3之載料架D31下方,則同理被移送落置第二嵌抵組件D316的卡掣件D3162上方;在本實施例中,第一種規格的載有正面朝上被檢查為良品的基板B之載盤A將被優先執行,故載盤A移送落置第二嵌抵組件D316的卡掣件D3162上方將被先執行。Referring to FIGS. 2, 13 to 15, when the second type of carrier A carrying the substrate B which is inspected as good as the front side is transported by the transport path formed by the belt D25 of the fourth track D2, the receiving mechanism is transferred to the receiving mechanism. When D3 is below the loading rack D31 (Fig. 13), the lifting frame D32 is driven up to move the upper bracket D3221 below the carrier A carrying the front facing substrate B and supported to move up to the first inset The latching member D3151 of the component D315 causes the latching member D3151 to be rotated from the bottom to the top (Fig. 14), and after the loading tray A is moved up through the latching member D3151 on both sides, the latching member D3151 is subjected to elasticity (or gravity) The return is horizontally positioned, and the lifting frame D32 is driven downward to move the carrier A down to the latching member D3151 of the first intrusion component D315 (Fig. 15); if the first specification is loaded with a front facing The carrier A of the substrate B, which is inspected as good, is transported to the lower side of the carrier D31 of the receiving mechanism D3 by the transport path formed by the belt D25 of the fourth track D2, and is similarly transferred to the second embedded Above the cartridge D3162 of the component D316; in the present embodiment, the carrier A of the first type of the substrate B carrying the face up as being checked as a good product will be preferentially executed. A transfer platen so that the top of the second insert is set off against the engaging member assembly D316 D3162 will be executed first.

請參閱圖16〜19,該翻轉機構E的翻轉座E4具有一呈長方形的框體E41, 內部具有較載盤A大的長方形鏤空狀操作區間E411,框體E41一側受機座E5上所設感應器E8所感應定位,使框體E41每一次翻轉皆保持在一水平狀態;框體E41兩相對應的短邊側設有一組第一保持組件E42,框體E41兩相對應的長邊側設有二組相隔間距的第二保持組件E43;翻轉座E4上並設有震盪器E44及朝操作區間E411檢測是否有載盤A之感應器E45; 該組第一保持組件E42包括位於鄰靠轉軸E2的框體E41短邊側之第一對抵件E421以及相對轉軸E2的框體E41另一短邊側之第二對抵件E422;其中,第一對抵件E421以二樞桿E4211(圖中未示)樞設於框體E41,並受框體E41下方一驅動件E423作用,以驅動件E423之驅動桿E4231凸伸出力方向,作為向操作區間E411內前抵執行對抵之施力;第二對抵件E422以二樞桿E4221樞設於框體E41,並受框體E41下方一驅動件E424作用,該驅動件E424之驅動桿E4241朝框體E41聯結一連動件E4242,連動件E4242則連動二樞桿E4221,以驅動件E424之驅動桿E4241凸伸出力方向之反向,作為向操作區間E411內前抵執行對抵之施力; 每一組第二保持組件E43各包括位於框體E41一長邊側之第一對夾件E431以及框體E41另一長邊側之第二對夾件E432;其中,第一對夾件E431、第二對夾件E432分別各以二樞桿E433樞設於框體E41,並受框體E41下方一驅動件E434作用,該驅動件E434之驅動桿E435朝框體E41外聯結一連動件E436,連動件E436則連動二樞桿E433,以驅動件E434之驅動桿E435凸伸出力方向之反向,作為向操作區間E411內前抵執行對抵之施力;第一對夾件E431及第二對夾件E432分別各設有可受驅動在一Z軸向滑軌E437上作滑移以進行上下開啟或閉靠之二夾爪E438,二夾爪E438一側並設有一定位件E439,其中,該二夾爪E438前端較定位件E439前端朝操作區間E411前伸。Referring to FIGS. 16-19, the inverting seat E4 of the inverting mechanism E has a rectangular frame E41 having a rectangular hollow operation section E411 larger than the carrier A, and the frame E41 side is received by the frame E5. The sensor E8 is inductively positioned to keep the frame E41 in a horizontal state every time; the corresponding short side of the frame E41 is provided with a set of first holding components E42, and the corresponding long sides of the frame E41 Two sets of second holding assemblies E43 spaced apart from each other are disposed on the side; the flipping E4 is provided with an oscillator E44 and an inductor E45 for detecting whether there is a carrier A toward the operating section E411; the first holding component E42 of the group includes the adjacent a first opposing member E421 on the short side of the frame E41 of the rotating shaft E2 and a second opposing member E422 on the other short side of the frame E41 of the rotating shaft E2; wherein the first opposing member E421 has two pivots E4211 (not shown) is pivoted to the frame E41, and is acted upon by a driving member E423 under the frame E41, and the driving rod E4231 of the driving member E423 is protruded in the direction of the force, and is forwarded to the front in the operating section E411. The second pair of E422 is pivoted to the frame E41 by two pivots E4221 and is framed. A driving member E424 is operated under the E41, the driving rod E4241 of the driving member E424 is coupled with a linking member E4242 to the frame E41, and the linking member E4242 is coupled with the two pivot rods E4221, so that the driving rod E4241 of the driving member E424 protrudes in the direction of the protruding force. In the operation section E411, the biasing force is applied to the front side; each of the second holding units E43 includes the first pair of clips E431 located on one long side of the frame E41 and the other long side of the frame E41. The second pair of clips E432 on the side; wherein the first pair of clips E431 and the second pair of clips E432 are respectively pivoted to the frame E41 by two pivots E433, and acted by a driving member E434 below the frame E41. The driving rod E435 of the driving member E434 is coupled with a linking member E436 to the outer frame E41, and the linking member E436 is coupled with the two pivot rods E433, and the driving rod E435 of the driving member E435 is protruded in the opposite direction of the direction of the force, as the operating interval E411. The first pair of clips E431 and the second pair of clips E432 are respectively provided to be driven to slide on a Z-axis slide rail E437 for opening or closing up or down. Two jaws E438, two jaws E438 side and a positioning member E439, wherein the two clips The front end of the claw E438 extends forward from the front end of the positioning member E439 toward the operation section E411.

請參閱圖20〜21,該組第一保持組件E42之第一對抵件E421以及第二對抵件E422用以對抵載盤A兩側短側邊框緣A1外分別各設之外凸的扣肋A3;請參閱圖22〜23,該二組第二保持組件E43之第一對夾件E431以及第二對夾件E432分別各以二夾爪E437對載盤A兩側長側邊之框緣A1上相隔間距所設二微凹之扣緣A2(參閱圖3)進行上下對夾扣合,且在本實施例中,該二組第二保持組件E43之第一對夾件E431以及第二對夾件E432以同時進行二載盤A之上下對夾扣合為原則。Referring to FIGS. 20-21, the first pair of members E421 and the second pair of members E42 of the first holding assembly E42 are respectively configured to be convex outwardly on the outer side edges A1 of the two sides of the offset tray A. The rib A3; referring to FIGS. 22-23, the first pair of clips E431 and the second pair of clips E432 of the two sets of second holding assemblies E43 are respectively disposed on the long sides of the two sides of the carrier A by the two jaws E437 The two edges of the frame edge A1 are spaced apart from each other by a flange A2 (see FIG. 3), and in the embodiment, the first pair of clips E431 of the two sets of second holding components E43 are The second pair of clips E432 is based on the principle that the two pairs of trays A are simultaneously clamped and closed.

本發明實施例之電子元件之檢查方法,在實施上包括: 一送空盤步驟,使一空載盤A先由供料機構C3或直接置於第一搬送裝置C的第一軌道C1之皮帶C13被輸送至第二軌道C2中第二載台C22處,並受夾持機構C221夾抵定位,及受第二載台C22頂抵連動上昇至預定高度定位,使翻轉機構E的翻轉座E4移至第二載台C22的空載盤A上方,並下移以第一保持組件E42將空載盤A保持在翻轉座E4中,翻轉座E4再上移待命; 一反面檢查步驟,使載有反面朝上待檢查元件基板B之載盤A由供料機構C3經第一搬送裝置C的第一軌道C1被輸送至第二軌道C2中第一載台C21處,並受第一載台C21頂抵連動上昇至預定高度定位,以受第一檢查機構F的第一檢視單元F11對載盤A中各待檢查元件基板B反面逐一進行漏底銅檢查;檢查完後,第一載台C21連動載盤A下移回復原位,載盤A再受皮帶C13輸送至第二軌道C2中第二載台C22處,並受夾持機構C221夾抵定位; 一翻轉步驟,完成反面檢查步驟的載盤A受第二載台C22頂抵連動上昇至預定高度定位;使翻轉機構E的翻轉座E4移至第二載台C22的上方,並下移以第一保持組件E42之翻轉座E4中原保持的空載盤A置於第二載台C22上的已完成反面檢查步驟的載盤A上方,並在解除第一保持組件E42對抵保持後,改以該二組第二保持組件E43之第一對夾件E431以及第二對夾件E432同時進行二載盤A之上下對夾扣合,將二載盤A保持在翻轉座E4中,翻轉座E4並進行翻轉一百八十度及位移至第二搬送裝置D的第三軌道D1中已上昇至預定高度定位的第三載台D11上方,此時載盤A中原反面朝上的基板B已被翻轉改為正面朝上並改置於原空轉盤A上,並使震盪器E44啟動而令翻轉座E4受震動以連動載盤A中基板B充份落置轉載,翻轉座E4下移將已載有正面朝上待檢查元件基板B且位於下方之轉盤A置於第三載台D11上受夾持機構D111夾持,翻轉座E4並改以第一保持組件E42之第一對抵件E421及第二對抵件E422對抵保持上方已轉載完畢的空載盤A,翻轉座E4並上移反復於第一搬送裝置C與第二搬送裝置D間作前述翻轉作業; 一正面檢查步驟,完成翻轉步驟的載盤A在第三載台D11下降回位後被第二搬送裝置D的第三軌道D1輸送至第四載台D12處,載盤A受第四載台D12頂抵連動上昇至預定高度定位,以受第一檢查機構F的第二檢視單元F12對載盤A中各待檢查元件基板B正面逐一進行散熱片表面檢查;檢查完後,第四載台D12連動載盤A下移回復原位,載盤A再受皮帶D25輸送至第四軌道D2中第五載台D22處,並受夾持機構D221夾抵定位;       一側面檢查步驟,完成正面檢查步驟的載盤A受第五載台D22頂抵連動上昇至預定高度定位,移載機構K的第一提取組件K11、第二提取組件K21分別自載盤A上提取已完成正面檢查的基板B,若該基板B經正、反面檢查後已確定為不良品,則第一提取組件K11、第二提取組件K21將分別經第一移載軌座K1、第二移載軌座K2將該基板B不良品直接移至第三搬送裝置G之第六軌道G2中第六載台G5上之空載盤A上置放;若該基板B經正、反面檢查後已確定為良品,則第一提取組件K11、第二提取組件K21將分別經第一移載軌座K1、第二移載軌座K2將該基板B良品分別移至第二檢查機構H的第三檢視單元H1及第四檢視單元H2進行四周側面之溢膠檢查,基板B檢查後若為良品,則回送於第五載台D22的載盤A中,基板B檢查後若為不良品,則移至第三搬送裝置G之第六軌道G2中第六載台G5之空載盤A上;        一良品收集步驟,完成側面檢查步驟的第五載台D22上盛載基板B良品的載盤A下移回復原位,夾持機構D221解除夾抵定位,載盤A再受皮帶D25輸送至收料機構D3處收集;       一不良品收集步驟,第三搬送裝置G之第五軌道G1上供料機構G3供應空載盤A循第五軌道G1輸送至第六軌道G2之第六載台G5處,並被夾持機構G51夾持定位及受第六載台G5頂抵連動上昇至預定高度定位,完成側面檢查步驟的第六載台G5上盛載基板B不良品的載盤A,隨第六載台G5下移回復原位,並受第六軌道G2輸送至收料機構G4收集。The method for inspecting an electronic component according to an embodiment of the present invention includes: an empty tray step, such that an empty carrier A is first placed by the feeding mechanism C3 or directly on the belt of the first rail C1 of the first conveying device C. The C13 is conveyed to the second stage C22 of the second track C2, and is clamped and positioned by the clamping mechanism C221, and is raised by the second stage C22 to rise to a predetermined height to make the flipping seat E4 of the turning mechanism E Move to the upper tray A of the second stage C22, and move down to the first holding unit E42 to hold the empty tray A in the flip seat E4, and the flip seat E4 to move up again; a reverse inspection step to enable The carrier A having the reverse facing element substrate B to be inspected is transported by the feeding mechanism C3 via the first rail C1 of the first conveying device C to the first stage C21 of the second rail C2, and is subjected to the first stage C21 is abutted to a predetermined height position, and is subjected to a leaky copper inspection on the opposite side of each of the substrates B to be inspected in the carrier A by the first inspection unit F11 of the first inspection mechanism F; after the inspection, the first stage C21 linkage carrier A moves down to return to the original position, and carrier A is transported by belt C13 to second track C2. The second stage C22 is clamped and positioned by the clamping mechanism C221; in a turning step, the loading tray A which completes the reverse inspection step is raised by the second loading stage C22 to a predetermined height position; the turning seat of the turning mechanism E is turned E4 is moved to the upper side of the second stage C22, and is moved down to the empty tray A originally held in the flip holder E4 of the first holding unit E42 to be placed above the carrier A on the second stage C22 which has completed the reverse inspection step. And after the first holding component E42 is released, the first pair of clips E431 and the second pair of clips E432 of the two sets of second holding components E43 are simultaneously subjected to the upper and lower clips of the two carriers A. Holding the second carrier A in the flip seat E4, flipping the seat E4 and performing the flipping of the one-eighty-eight degrees and shifting to the third stage D11 of the third track D1 of the second conveying device D that has risen to a predetermined height. Above, at this time, the substrate B with the original reverse side facing up in the carrier A has been flipped to face up and placed on the original empty turntable A, and the oscillator E44 is activated to cause the flip seat E4 to be vibrated to interlock the carrier A. The middle substrate B is fully placed and reloaded, and the flipping seat E4 is moved down to carry the face up to be inspected. The turntable A of the substrate B and located below is placed on the third stage D11 and clamped by the clamping mechanism D111, and the seat E4 is turned over and replaced with the first pair of the first member E421 and the second pair of the first member E42. Retaining the empty tray A that has been reloaded above, flipping the seat E4 and moving up and repeating the above-mentioned turning operation between the first conveying device C and the second conveying device D; a front inspection step, the loading tray A completing the turning step is After the third stage D11 is lowered back, it is transported to the fourth stage D12 by the third track D1 of the second conveying device D, and the carrier A is raised by the fourth stage D12 to the predetermined height to be positioned. The second inspection unit F12 of the inspection mechanism F performs the surface inspection of the fins one by one on the front side of each of the substrates B to be inspected in the carrier A; after the inspection, the fourth stage D12 moves the carrier A down to return to the original position, and the carrier A is again transported by the belt D25 to the fifth stage D22 of the fourth track D2, and is clamped by the clamping mechanism D221; a side inspection step, the carrier A that completes the front inspection step is offset by the fifth stage D22 The first extraction group of the transfer mechanism K is moved up to a predetermined height position K11, the second extraction component K21 extracts the substrate B that has been subjected to the front inspection from the carrier A, and if the substrate B has been determined to be defective after the front and back inspections, the first extraction component K11 and the second extraction component K21 The substrate B defective product is directly moved to the empty carrier A on the sixth stage G5 in the sixth track G2 of the third transfer device G via the first transfer rail base K1 and the second transfer rail base K2, respectively. If the substrate B has been determined to be good after being inspected by the front and back sides, the first extraction component K11 and the second extraction component K21 will be respectively passed through the first transfer rail base K1 and the second transfer rail base K2. The substrate B is moved to the third inspection unit H1 and the fourth inspection unit H2 of the second inspection mechanism H to perform the overflow inspection on the four sides, and if the substrate B is in good condition after inspection, the carrier is returned to the fifth carrier D22. In A, if the substrate B is defective after inspection, it is moved to the empty tray A of the sixth stage G5 in the sixth track G2 of the third conveying device G; a good product collecting step, the fifth step of the side inspection step is completed. The carrier A carrying the substrate B on the stage D22 is moved down to the original position, and the clamping mechanism D221 is solved. In addition to the pinch-in position, the carrier A is transported by the belt D25 to the receiving mechanism D3 for collection; a defective product collecting step, the feeding mechanism G3 of the third rail G1 of the third conveying device G supplies the empty tray A. The rail G1 is transported to the sixth stage G5 of the sixth track G2, and is clamped and positioned by the clamping mechanism G51, and is raised by the sixth stage G5 to the predetermined height, and the sixth stage of the side inspection step is completed. The carrier A carrying the defective material of the substrate B on the G5 is moved back to the original position with the sixth stage G5, and is transported to the receiving mechanism G4 by the sixth track G2.

本發明實施例電子元件之檢查方法及裝置,由於第一搬送裝置C、翻轉機構E、第二搬送裝置D、移載機構K、第三搬送裝置G循序將載盤A傳送,故可在整個傳送流路中完成基板B的反、正、四周側面等六面檢查;並藉由翻轉機構E的第一保持組件E42、第二保持組件E43之對抵或對夾轉換,使基板B順利轉換於二載盤A間並被穩定輸送;同時配合第一搬送裝置C之供料機構C3、第二搬送裝置D之收料機構D3、第三搬送裝置G之供料機構G3及收料機構G4之設計,使載盤A可順利的供、收,甚至作盛載不同規格基板B之載盤A的分別供、收,其所獲得的檢查、輸送效益確大幅提昇產能效率。In the method and apparatus for inspecting an electronic component according to the embodiment of the present invention, since the first transporting device C, the inverting mechanism E, the second transporting device D, the transfer mechanism K, and the third transporting device G sequentially transport the carrier A, the entire method can be The six-sided inspection of the reverse, positive, and four sides of the substrate B is completed in the transport flow path; and the substrate B is smoothly converted by the first or second holding component E42 and the second holding component E43 of the inverting mechanism E. Between the two trays A and stably transported; at the same time, the feeding mechanism C3 of the first conveying device C, the receiving mechanism D3 of the second conveying device D, the feeding mechanism G3 of the third conveying device G, and the receiving mechanism G4 The design enables the carrier A to be smoothly supplied and received, and even for the supply and receiving of the carrier A carrying the different specifications of the substrate B. The inspection and transportation benefits obtained by the carrier plate have greatly improved the productivity efficiency.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

A‧‧‧載盤
A1‧‧‧框緣
A2‧‧‧扣緣
A3‧‧‧扣肋
A4‧‧‧盤面
A5‧‧‧定位部
A51‧‧‧定位區間
B‧‧‧基板
C‧‧‧第一搬送裝置
C1‧‧‧第一軌道
C11‧‧‧座板
C111‧‧‧工作區間
C12‧‧‧側架
C13‧‧‧皮帶
C2‧‧‧第二軌道
C21‧‧‧第一載台
C22‧‧‧第二載台
C221‧‧‧夾持機構
C23‧‧‧皮帶
C3‧‧‧供料機構
C31‧‧‧載料架
C311‧‧‧移載區間
C312‧‧‧載座
C313‧‧‧側座
C314‧‧‧角架桿
C315‧‧‧第一嵌抵組件
C3151‧‧‧卡掣件
C316‧‧‧第二嵌抵組件
C3161‧‧‧立架
C3162‧‧‧卡掣件
C317‧‧‧導引件
C32‧‧‧昇降架
C321‧‧‧固定架
C3211‧‧‧上固定座
C3212‧‧‧下固定座
C3213‧‧‧支撐座
C3214‧‧‧定位件
C3215‧‧‧感應器
C322‧‧‧移動架
C3221‧‧‧上撐座
C3222‧‧‧驅動座
C3223‧‧‧支撐桿
C3224‧‧‧驅動件
C3225‧‧‧螺桿
C3226‧‧‧感應片
D‧‧‧第二搬送裝置
D1‧‧‧第三軌道
D11‧‧‧第三載台
D111‧‧‧夾持機構
D12‧‧‧第四載台
D13‧‧‧皮帶
D2‧‧‧第四軌道
D21‧‧‧軌座
D22‧‧‧第五載台
D221‧‧‧夾持機構
D23‧‧‧座板
D231‧‧‧工作區間
D24‧‧‧側架
D25‧‧‧皮帶
D26‧‧‧迫推機構
D3‧‧‧收料機構
D31‧‧‧載料機構
D311‧‧‧移載區間
D312‧‧‧載座
D313‧‧‧側座
D314‧‧‧角架桿
D315‧‧‧第一嵌抵組件
D3151‧‧‧卡掣件
D316‧‧‧第二嵌抵組件
D3161‧‧‧立座
D32‧‧‧昇降架
D321‧‧‧固定架
D3211‧‧‧上固定座
D3212‧‧‧下固定座
D3213‧‧‧支撐桿
D3214‧‧‧定位件
D3215‧‧‧感應器
D322‧‧‧移動架
D3221‧‧‧上撐座
D3222‧‧‧ 驅動座
D3223‧‧‧支撐座
D3224‧‧‧驅動件
D3225‧‧‧螺桿
D3226‧‧‧感應片
E‧‧‧翻轉機構
E1‧‧‧驅動件
E2‧‧‧轉軸
E3‧‧‧驅動件
E4‧‧‧翻轉框
E41‧‧‧框體
E411‧‧‧操作區間
E42‧‧‧第一保持組件
E421‧‧‧第一對抵件
E4211‧‧‧樞桿
E422‧‧‧第二對抵件
E4221‧‧‧樞桿
E423‧‧‧驅動件
E4231‧‧‧驅動桿
E424‧‧‧ 驅動件
E4241‧‧‧驅動桿
E4242‧‧‧連動件
E43‧‧‧第二保持組件
E431‧‧‧第一對夾件
E432‧‧‧第二對夾件
E433‧‧‧樞桿
E434‧‧‧ 驅動件
E435‧‧‧驅動桿
E436‧‧‧連動件
E437‧‧‧滑軌
E438‧‧‧夾爪
E439‧‧‧定位件
E44‧‧‧震盪器
E45‧‧‧感應器
E5‧‧‧機座
E6‧‧‧軌座
E7‧‧‧驅動件
E8‧‧‧感應器
F‧‧‧第一檢查機構
F1‧‧‧第一軌座
F11‧‧‧第一檢視單元
F2‧‧‧第二軌座
F12‧‧‧第二檢視單元
F3‧‧‧第三軌座
G‧‧‧第三搬裝置
G1‧‧‧第五軌道
G2‧‧‧第六軌道
G3‧‧‧供料機構
G4‧‧‧收料機構
G5‧‧‧第六載台
G51‧‧‧夾持機構
H‧‧‧第二檢查機構
H1‧‧‧第三檢視單元
H2‧‧‧第四檢視單元
K‧‧‧移載機構
K1‧‧‧第一移載軌座
K11‧‧‧第一提取組件
K2‧‧‧第二移載軌座
K21‧‧‧第二提取組件
Y‧‧‧機台台面
Y1‧‧‧側邊
Y2‧‧‧側邊
A‧‧‧ Carrier
A1‧‧‧ frame
A2‧‧‧ buckle
A3‧‧‧ ribbing
A4‧‧‧ disk
A5‧‧‧ Positioning Department
A51‧‧‧ Positioning interval
B‧‧‧Substrate
C‧‧‧First conveyor
C1‧‧‧ first track
C11‧‧‧ seat board
C111‧‧‧Working interval
C12‧‧‧ side frame
C13‧‧‧Land
C2‧‧‧second track
C21‧‧‧First stage
C22‧‧‧Second stage
C221‧‧‧Clamping mechanism
C23‧‧‧Belt
C3‧‧‧Feeding agency
C31‧‧‧Loading rack
C311‧‧‧Transfer interval
C312‧‧‧ Carrier
C313‧‧‧ side seat
C314‧‧‧ angle pole
C315‧‧‧First embedded component
C3151‧‧‧Cardware
C316‧‧‧Second inset component
C3161‧‧‧ Stand
C3162‧‧‧ Card Condition
C317‧‧‧Guide
C32‧‧‧lifting frame
C321‧‧‧ fixing frame
C3211‧‧‧上固定座
C3212‧‧‧ lower mount
C3213‧‧‧ support
C3214‧‧‧ positioning parts
C3215‧‧‧ sensor
C322‧‧‧Mobile rack
C3221‧‧‧Upper support
C3222‧‧‧ drive seat
C3223‧‧‧Support rod
C3224‧‧‧ drive parts
C3225‧‧‧ screw
C3226‧‧‧Sensor
D‧‧‧Second transport device
D1‧‧‧ third track
D11‧‧‧ third stage
D111‧‧‧Clamping mechanism
D12‧‧‧ fourth stage
D13‧‧‧Land
D2‧‧‧ fourth track
D21‧‧‧ rail seat
D22‧‧‧ fifth stage
D221‧‧‧Clamping mechanism
D23‧‧‧ seat board
D231‧‧‧Working area
D24‧‧‧Side frame
D25‧‧‧Belt
D26‧‧‧ Pushing mechanism
D3‧‧‧ receiving agency
D31‧‧‧Loading mechanism
D311‧‧‧Transfer interval
D312‧‧‧ Carrier
D313‧‧‧ side seat
D314‧‧‧ angle pole
D315‧‧‧First embedded component
D3151‧‧‧ Card Condition
D316‧‧‧Second inset component
D3161‧‧‧ seats
D32‧‧‧ lifting frame
D321‧‧‧ Fixing frame
D3211‧‧‧上固定座
D3212‧‧‧ lower mount
D3213‧‧‧Support rod
D3214‧‧‧ positioning parts
D3215‧‧‧ sensor
D322‧‧‧Mobile rack
D3221‧‧‧Upper support
D3222‧‧‧ drive seat
D3223‧‧‧ support
D3224‧‧‧ drive parts
D3225‧‧‧ screw
D3226‧‧‧Sensor
E‧‧‧ flip mechanism
E1‧‧‧ drive parts
E2‧‧‧ shaft
E3‧‧‧ drive parts
E4‧‧‧Flip box
E41‧‧‧ frame
E411‧‧‧Operation interval
E42‧‧‧First holding component
E421‧‧‧ first pair of parts
E4211‧‧‧ pivot
E422‧‧‧Second pair of parts
E4221‧‧‧ pivot
E423‧‧‧ drive parts
E4231‧‧‧ drive rod
E424‧‧‧ Drives
E4241‧‧‧ drive rod
E4242‧‧‧ linkages
E43‧‧‧Second holding assembly
E431‧‧‧ first pair of clips
E432‧‧‧Second pair of clips
E433‧‧‧ pivot
E434‧‧‧ Drive parts
E435‧‧‧ drive rod
E436‧‧‧ linkages
E437‧‧‧rails
E438‧‧‧claw
E439‧‧‧ positioning parts
E44‧‧‧ oscillator
E45‧‧‧ sensor
E5‧‧‧ machine base
E6‧‧‧ rail seat
E7‧‧‧ drive parts
E8‧‧‧ sensor
F‧‧‧First inspection agency
F1‧‧‧First rail seat
F11‧‧‧First inspection unit
F2‧‧‧Second rail seat
F12‧‧‧Second inspection unit
F3‧‧‧ third rail seat
G‧‧‧ third moving device
G1‧‧‧ fifth track
G2‧‧‧ sixth track
G3‧‧‧Feeding agency
G4‧‧‧ receiving agency
G5‧‧‧ sixth stage
G51‧‧‧Clamping mechanism
H‧‧‧Second inspection agency
H1‧‧‧ Third inspection unit
H2‧‧‧Fourth Viewing Unit
K‧‧‧Transportation mechanism
K1‧‧‧First transfer rail seat
K11‧‧‧First extraction component
K2‧‧‧Second transfer rail seat
K21‧‧‧Second extraction component
Y‧‧‧ machine table
Y1‧‧‧ side
Y2‧‧‧ side

圖1係本發明實施例中載盤之立體示意圖。 圖2係本發明實施例中基板盛載於載盤之立體示意圖。 圖3係本發明實施例中載盤之側面示意圖。 圖4係本發明實施例中各機構配置在一機台台面上之俯視示意圖。 圖5係本發明實施例中各機構配置在一機台台面上之立體示意圖。 圖6係本發明實施例中第一搬送裝置之第一軌道及供料機構立體示意圖。 圖7係本發明實施例中第一搬送裝置之第一軌道及供料機構之立體分解示意圖。 圖8係本發明實施例中第一搬送裝置中供料機構供料操作之示意圖(一)。 圖9係本發明實施例中第一搬送裝置中供料機構供料操作之示意圖(二)。 圖10係本發明實施例中第一搬送裝置中供料機構供料操作之示意圖(三)。 圖11係本發明實施例中第二搬送裝置之第四軌道及收料機構立體示意圖。 圖12係本發明實施例中第二搬送裝置之第四軌道及收料機構之立體分解示意圖。 圖13係本發明實施例中第二搬送裝置中收料機構收料操作之示意圖(一)。圖14係本發明實施例中第二搬送裝置中收料機構收料操作之示意圖(二)。 圖15係本發明實施例中第二搬送裝置中收料機構收料操作之示意圖(三)。 圖16係本發明實施例中翻轉機構之立體示意圖。 圖17係本發明實施例中翻轉框的背側立體示意圖。 圖18係本發明實施例中翻轉框的第一保持組件之第二對抵件立體示意圖。 圖19係本發明實施例中翻轉框的第二保持組件之第一、二對夾件立體示意圖。 圖20係本發明實施例中翻轉框的第一保持組件之第一、二對抵件進行對載盤保持之示意圖(一)。 圖21係本發明實施例中翻轉框的第一保持組件之第一、二對抵件進行對載盤保持之示意圖(二)。 圖22係本發明實施例中翻轉框的第二保持組件之第一、二對夾件進行對載盤保持之示意圖(一)。 圖23係本發明實施例中翻轉框的第二保持組件之第一、二對夾件進行對載盤保持之示意圖(二)。1 is a schematic perspective view of a carrier in an embodiment of the present invention. 2 is a schematic perspective view of a substrate carried on a carrier in the embodiment of the present invention. Figure 3 is a side elevational view of the carrier in the embodiment of the present invention. 4 is a top plan view showing the arrangement of each mechanism on a machine table in the embodiment of the present invention. FIG. 5 is a schematic perspective view showing the arrangement of each mechanism on a machine table in the embodiment of the present invention. 6 is a perspective view of the first rail and the feeding mechanism of the first conveying device in the embodiment of the present invention. 7 is a perspective exploded view of the first rail and the feeding mechanism of the first conveying device in the embodiment of the present invention. Figure 8 is a schematic view (1) of the feeding operation of the feeding mechanism in the first conveying device in the embodiment of the present invention. Figure 9 is a schematic view (2) of the feeding operation of the feeding mechanism in the first conveying device in the embodiment of the present invention. Figure 10 is a schematic view (3) of the feeding operation of the feeding mechanism in the first conveying device in the embodiment of the present invention. Figure 11 is a perspective view showing the fourth track and the receiving mechanism of the second conveying device in the embodiment of the present invention. Figure 12 is a perspective exploded view of the fourth track and the receiving mechanism of the second conveying device in the embodiment of the present invention. Figure 13 is a schematic view (1) of the receiving operation of the receiving mechanism in the second conveying device in the embodiment of the present invention. Figure 14 is a schematic view (2) of the receiving operation of the receiving mechanism in the second conveying device in the embodiment of the present invention. Figure 15 is a schematic view (3) of the receiving operation of the receiving mechanism in the second conveying device in the embodiment of the present invention. Figure 16 is a perspective view of the inverting mechanism in the embodiment of the present invention. Figure 17 is a perspective view showing the back side of the flip frame in the embodiment of the present invention. FIG. 18 is a perspective view showing the second pair of the first holding component of the flip frame in the embodiment of the present invention. 19 is a perspective view of the first and second pairs of clips of the second holding assembly of the flip frame in the embodiment of the present invention. FIG. 20 is a schematic view (1) of the first and second opposing members of the first holding component of the flip frame according to the embodiment of the present invention. Figure 21 is a schematic view (2) of the first and second opposing members of the first holding assembly of the flip frame in the embodiment of the present invention. Figure 22 is a schematic view (1) of holding the first and second pairs of clips of the second holding assembly of the flip frame in the embodiment of the present invention. FIG. 23 is a schematic view (2) of holding the first and second pairs of the second holding components of the flip frame of the embodiment of the present invention. FIG.

C‧‧‧第一搬送裝置 C‧‧‧First conveyor

C1‧‧‧第一軌道 C1‧‧‧ first track

C2‧‧‧第二軌道 C2‧‧‧second track

C21‧‧‧第一載台 C21‧‧‧First stage

C22‧‧‧第二載台 C22‧‧‧Second stage

C221‧‧‧夾持機構 C221‧‧‧Clamping mechanism

C3‧‧‧供料機構 C3‧‧‧Feeding agency

D‧‧‧第二搬送裝置 D‧‧‧Second transport device

D1‧‧‧第三軌道 D1‧‧‧ third track

D11‧‧‧第三載台 D11‧‧‧ third stage

D111‧‧‧夾持機構 D111‧‧‧Clamping mechanism

D12‧‧‧第四載台 D12‧‧‧fourth stage

D2‧‧‧第四軌道 D2‧‧‧ fourth track

D21‧‧‧軌座 D21‧‧‧ rail seat

D22‧‧‧第五載台 D22‧‧‧ fifth stage

D221‧‧‧夾持機構 D221‧‧‧Clamping mechanism

D3‧‧‧收料機構 D3‧‧‧ receiving agency

E‧‧‧翻轉機構 E‧‧‧ flip mechanism

E1‧‧‧驅動件 E1‧‧‧ drive parts

E2‧‧‧轉軸 E2‧‧‧ shaft

E3‧‧‧驅動件 E3‧‧‧ drive parts

E4‧‧‧翻轉框 E4‧‧‧Flip box

E5‧‧‧機座 E5‧‧‧ machine base

E6‧‧‧軌座 E6‧‧‧ rail seat

E7‧‧‧驅動件 E7‧‧‧ drive parts

F‧‧‧第一檢查機構 F‧‧‧First inspection agency

G‧‧‧第三搬裝置 G‧‧‧ third moving device

G1‧‧‧第五軌道 G1‧‧‧ fifth track

G2‧‧‧第六軌道 G2‧‧‧ sixth track

G3‧‧‧供料機構 G3‧‧‧Feeding agency

G4‧‧‧收料機構 G4‧‧‧ receiving agency

G5‧‧‧第六載台 G5‧‧‧ sixth stage

G51‧‧‧夾持機構 G51‧‧‧Clamping mechanism

H‧‧‧第二檢查機構 H‧‧‧Second inspection agency

K‧‧‧移載機構 K‧‧‧Transportation mechanism

Y‧‧‧機台台面 Y‧‧‧ machine table

Y1‧‧‧側邊 Y1‧‧‧ side

Y2‧‧‧側邊 Y2‧‧‧ side

Claims (13)

一種電子元件之檢查方法,包括: 提供一載盤,盛載待檢查元件;並在一機台台面上執行:       使載盤上待檢查元件被一第一搬送裝置搬送並以一第一檢視單元進行待檢查元件反面檢查;       使盛載待檢查元件的載盤被一翻轉機構自第一搬送裝置保持後翻轉至一第二搬送裝置受搬送,並以一第二檢視單元進行待檢查元件正面檢查;       使載盤上待檢查元件被一移載機構自第二搬送裝置提取並被搬送,並以一第三檢視單元進行待檢查元件四周側面檢查。A method for inspecting an electronic component, comprising: providing a carrier tray for carrying the component to be inspected; and performing on a machine table: causing the component to be inspected on the carrier to be transported by a first conveying device and using a first viewing unit Performing a reverse inspection of the component to be inspected; the carrier carrying the component to be inspected is held by the inverting mechanism from the first conveying device, and then turned over to a second conveying device, and the front inspection of the component to be inspected is performed by a second inspection unit. The component to be inspected on the carrier is extracted by a transfer mechanism from the second transfer device and transported, and the side inspection of the component to be inspected is performed by a third inspection unit. 一種電子元件之檢查方法,包括: 提供一載盤,盛載待檢查元件;並執行: 一反面檢查步驟,使載有反面朝上待檢查元件之載盤經第一搬送裝置被輸送至一第一載台處,並受一第一檢視單元對載盤中各待檢查元件反面逐一進行檢查;檢查完後,載盤受輸送至該第二載台處; 一翻轉步驟,使翻轉機構將一原保持的空載盤置於第二載台上的已完成反面檢查步驟的載盤上方,並將二載盤保持在翻轉座中進行翻轉及位移至一第二搬送裝置的第三載台上; 一正面檢查步驟,載盤被第二搬送裝置輸送至一第四載台處以受一第二檢視單元對載盤中各待檢查元件正面進行檢查;檢查完後,載盤受輸送至一第五載台處;       一側面檢查步驟,載盤受一移載機構自載盤上提取已完成正面檢查的待檢查元件,將該待檢查元件移至一第三檢視單元進行四周側面之檢查。A method for inspecting an electronic component, comprising: providing a carrier tray for holding the component to be inspected; and performing: a reverse inspection step of causing the carrier carrying the reverse facing component to be inspected to be transported to the first through the first conveying device a loading station, and is inspected one by one by a first inspection unit on the opposite side of each component to be inspected in the carrier; after the inspection, the carrier is transported to the second stage; a flipping step causes the turning mechanism to The originally held empty tray is placed above the carrier on the second stage that has completed the reverse inspection step, and the two trays are held in the flip holder for flipping and displacement to the third stage of a second transfer device. a front inspection step, the carrier is transported by the second transport device to a fourth stage to be inspected by a second inspection unit on the front side of each component to be inspected in the carrier; after the inspection, the carrier is transported to a first a five-station stage; a side inspection step, the carrier is extracted by a transfer mechanism from the loading tray to the component to be inspected that has completed the front inspection, and the component to be inspected is moved to a third inspection unit for inspection of the side surfaces . 如申請專利範圍第1或2項所述電子元件之檢查方法,其中,該第三檢視單元檢查後為良品時,移載機構使待檢查元件被移載回送至第二搬送裝置被搬送收集;若為不良品,則移至一第三搬送裝置被搬送收集。The method for inspecting an electronic component according to claim 1 or 2, wherein, when the third inspection unit is a good product after inspection, the transfer mechanism causes the component to be inspected to be transferred back to the second conveying device to be transported and collected; If it is a defective product, it moves to a third conveying device and is transported and collected. 如申請專利範圍第1或2項所述電子元件之檢查方法,其中,該 待檢查元件經正、反面檢查後已確定為不良品,則經移載機構將該不良品直接移至一第三搬送裝置被搬送收集。The method for inspecting an electronic component according to claim 1 or 2, wherein the component to be inspected is determined to be a defective product after being inspected by the front and back sides, and the defective product is directly moved to a third by the transfer mechanism. The transport device is transported and collected. 一種電子元件之檢查裝置,包括:       在一機台台面上設有:       一第一搬送裝置,形成一搬送載盤之傳送流路;一第一檢視單元,位於該第一搬送裝置上方,設有由上往下檢視之鏡頭;       一第二搬送裝置,形成一搬送載盤之傳送流路;一第二檢視單元,位於該第二搬送裝置上方,設有由上往下檢視之鏡頭;       一翻轉機構,設有一翻轉座可受驅動位移於第一搬送裝置、第二搬送裝置間並進行翻轉;       一第三檢視單元,位於該第二搬送裝置一側,設有由下往上檢視之鏡頭;       一移載機構,設有可被驅動位移於第二搬送裝置、第三檢視單元間的一第一提取組件。An inspection device for an electronic component, comprising: a first conveying device: a first conveying device forming a conveying flow path for conveying the carrier; a first inspection unit located above the first conveying device; a lens for viewing from top to bottom; a second conveying device forming a conveying flow path for conveying the carrier; a second inspection unit located above the second conveying device, providing a lens for viewing from top to bottom; The mechanism is provided with a flipping seat that can be driven to be displaced between the first conveying device and the second conveying device and turned over; a third viewing unit is located on the side of the second conveying device, and is provided with a lens for viewing from bottom to top; A transfer mechanism is provided with a first extraction component that can be driven to be displaced between the second transfer device and the third view unit. 如申請專利範圍第5項所述電子元件之檢查裝置,其中,該第一搬送裝置包括相互對設的第一軌道及第二軌道,第一軌道設有一供料機構,第二軌道中設有第一載台、第二載台。The apparatus for inspecting an electronic component according to claim 5, wherein the first conveying device comprises a first rail and a second rail disposed opposite to each other, the first rail is provided with a feeding mechanism, and the second rail is provided with The first stage and the second stage. 如申請專利範圍第5項所述電子元件之檢查裝置,其中,該第二搬送裝置包括相互對設的第三軌道及第四軌道,第三軌道中設有第三載台、第四載台,第四軌道中設有第五載台及一收料機構。The apparatus for inspecting an electronic component according to claim 5, wherein the second conveying device comprises a third rail and a fourth rail disposed opposite to each other, and the third rail and the fourth loading rack are disposed in the third rail A fifth stage and a receiving mechanism are arranged in the fourth track. 如申請專利範圍第5項所述電子元件之檢查裝置,其中,該移載機構之第一提取組件可被驅動位移於包括第二搬送裝置、第三檢視單元間及一第三搬送裝置間,該第三搬送裝置形成一搬送載盤之傳送流路。The apparatus for inspecting an electronic component according to claim 5, wherein the first extraction component of the transfer mechanism is driven to be displaced between the second transfer device, the third view unit, and the third transfer device. The third conveying device forms a conveying flow path of the conveying tray. 如申請專利範圍第5項所述電子元件之檢查裝置,其中,該移載機構設有第一移載軌座、第二移載軌座,第一移載軌座上設該第一提取組件,第二移載軌座上設有第二提取組件,第二提取組件可被驅動移送於第二搬送裝置、一第四檢視單元及第三搬送裝置間。The inspection device for an electronic component according to claim 5, wherein the transfer mechanism is provided with a first transfer rail base and a second transfer rail mount, and the first transfer component is disposed on the first transfer rail mount A second extraction assembly is disposed on the second transfer rail seat, and the second extraction assembly is driven to be transferred between the second transfer device, the fourth view unit, and the third transfer device. 如申請專利範圍第8或9項所述電子元件之檢查裝置,其中,該 第一、二、三搬送裝置其中之一以皮帶進行載盤搬送。An inspection apparatus for an electronic component according to the above-mentioned item 8, wherein the first, second, and third conveying devices are carried by a carrier by a belt. 如申請專利範圍第8或9項所述電子元件之檢查裝置,其中,該 第三搬送裝置包括:相互對設的第五軌道及第六軌道,第五軌道上設有一供料機構,第六軌道設有一收料機構。The apparatus for inspecting an electronic component according to claim 8 or 9, wherein the third conveying device comprises: a fifth rail and a sixth rail which are opposite to each other, and a feeding mechanism is provided on the fifth rail, sixth The track is provided with a receiving mechanism. 如申請專利範圍第5項所述電子元件之檢查裝置,其中,該翻轉機構的翻轉座具有一框體,框體內部具有鏤空狀操作區間,框體兩相對應短邊側設有第一保持組件,框體兩相對應的長邊側設有第二保持組件。The apparatus for inspecting an electronic component according to claim 5, wherein the inverting seat of the inverting mechanism has a frame body, the frame body has a hollow operation section, and the first short side of the frame body is provided with a first hold. The component, the corresponding long side of the frame body is provided with a second holding component. 一種電子元件之檢查裝置,包括:使用如申請專利範圍第1至4項任一項所述電子元件之檢查方法的裝置。An apparatus for inspecting an electronic component, comprising: an apparatus using an inspection method of an electronic component according to any one of claims 1 to 4.
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