TW201802016A - Electronic component inspection method and device capable of inspecting all sides of a to-be-inspected component and improving inspection and conveying efficiency - Google Patents

Abstract

The present invention provides an electronic component inspection method and device. The method includes: providing a carrier plate for carrying a to-be-inspected component; performing the following procedures on a machine table: conveying the to-be-inspected component on the carrier plate by a first conveying device and inspecting the reverse side of the to-be-inspected component by a first inspection unit; flipping the carrier plate which carries the to-be-inspected component by a flipping mechanism from the first conveying device to a second conveying device for conveyance, and inspecting the front side of the to-be-inspected component by a second inspection unit; picking and conveying the to-be-inspected component on the carrier plate from the second conveying device by a moving mechanism, and inspecting side surfaces of the to-be-inspected component by a third inspection unit.

Description

Method and device for inspecting electronic components

The invention relates to an inspection method and device, in particular to an inspection method and device for inspecting various sides of an electronic component, and an electronic component for carrying the electronic component by a carrier during the inspection process.

In general, the substrate processing process in general electronic components usually requires quality inspection. These inspections have different requirements depending on the process, but usually need to be assisted by a transport device so that the inspection process can be performed in an automated manner; As an example, there is a substrate with a chip and a heat sink over it. As the current packaging process is prevalent with BGA (Ball Grid Array) packaging, such packaged substrates must usually be inspected on the reverse side ( Bottom) The leakage of copper (also called bottom leakage copper) of the solder ball solder joints must also be checked whether the heat sink above the substrate (front side) is scratched, and the specifications are not damaged. In addition, the overflow of glue when the heat sink is packaged needs to be checked. It is known from the inspection of the peripheral side of the substrate.

When these substrates are inspected, a plurality of substrates are often arranged in a matrix and placed in a plurality of positioning sections in a carrier disk. Each substrate is placed in a positioning section with a heat sink facing upwards to facilitate the entire carrier disk transportation and Positioning: The upper and lower surfaces of the carrier disks are respectively provided with corresponding positioning sections at the same position, so a plurality of carrier disks can be stacked and positioned on each other.

In the prior art, during the inspection, the substrates in the carrier tray were often taken out one by one under the microscope for inspection. However, in a large number of inspection requirements, automation is an inevitable trend. How to perform inspection on a machine Effective and proper planning of substrate transfer and inspection functions to improve inspection efficiency, reduce costs, and save plant space are important topics worthy of study.

That is, an object of the present invention is to provide an electronic component inspection method that can automatically perform electronic component inspection.

Another object of the present invention is to provide an electronic component inspection device capable of performing electronic component inspection automatically.

Another object of the present invention is to provide a device using the electronic component inspection method.

The method for inspecting electronic components according to the purpose of the present invention includes: providing a carrier plate for holding the components to be inspected; and performing on a machine table surface: causing the components to be inspected on the carrier plate to be transported by a first conveying device and conveyed by a The first inspection unit inspects the reverse side of the component to be inspected; the carrier tray containing the component to be inspected is held by a reversing mechanism from the first conveying device to a second conveying device to be transferred, and a second inspection unit is used to wait The front inspection of the inspection component; the components on the carrier tray to be inspected are picked up by a transfer mechanism from the second conveying device and transported, and a third inspection unit is used to perform side inspections around the inspection components.

Another method for inspecting electronic components according to the purpose of the present invention includes: providing a carrier disk to hold the component to be inspected; and performing a reverse inspection step, so that the carrier disk carrying the component to be inspected with the reverse side upward is transported first The device is transported to a first carrier, and is inspected by a first inspection unit on the reverse side of each component to be inspected in the carrier. After the inspection, the carrier is transported to the second carrier; a turning step , So that the turning mechanism places a previously held empty load plate above the second loaded platform and has completed the reverse inspection step, and keeps the two load plates in the turning seat for turning and displacement to a second conveying device On the third carrier; a front inspection step, the carrier is transported by a second conveying device to a fourth carrier to be inspected by a second inspection unit on the front of each component to be inspected in the carrier; The tray is conveyed to a fifth carrier; a side inspection step, the tray is received by a transfer mechanism from the tray to extract the components to be inspected from the front, and the components to be inspected are moved to a third inspection unit. All sides an examination.

An inspection device for an electronic component according to another object of the present invention includes: a machine table is provided with: a first conveying device forming a conveying flow path for conveying a carrier disk; a first inspection unit located on the first Above the conveying device, there is a lens viewed from top to bottom; a second conveying device forms a conveying flow path of the conveying tray; a second viewing unit is located above the second conveying device and is provided from top to bottom Inspection lens; a reversing mechanism provided with a reversing seat which can be driven to be displaced between the first conveying device and the second conveying device and reversed; a third inspection unit, which is located on the side of the second conveying device, is provided with A lens viewed upwards; a transfer mechanism provided with a first extraction assembly that can be driven to move between the second transfer device and the third viewing unit.

An inspection device for an electronic component according to another object of the present invention includes a device using the inspection method for an electronic component as described above.

According to the method and device for inspecting electronic components according to the embodiments of the present invention, since the first transfer device, the turning mechanism, the second transfer device, the transfer mechanism, and the third transfer device sequentially transfer the carrier disk, the substrate can be completed in the entire transfer flow path. Inspection of the six sides including the reverse, front, and sides; and the first holding component and the second holding component of the turning mechanism E are used to resist or clamp the conversion, so that the substrate is smoothly transferred between the two carriers and is stably conveyed; At the same time, with the design of the feeding mechanism of the first conveying device, the receiving mechanism of the second conveying device, and the feeding mechanism and receiving mechanism of the third conveying device, the tray can be smoothly supplied, received, and even loaded. The inspection and transportation benefits of the separate supply and collection of the carrier disks of the standard substrates have indeed greatly improved the production efficiency.

Please refer to FIGS. 1 to 3. In the embodiment of the present invention, when carrying, a carrier plate A is used. The carrier plate A is substantially a rectangular disk shape, and the edges of the four sides are provided with frame edges protruding upward. A1, and two slightly concave buckle edges A2 are provided on the frame edge A1 of the long side of the two sides at an interval, and a convex buckle rib A3 is provided outside the frame edge A1 of the short side of the two sides, A flat disk surface A4 is provided in the frame edge A1, and a plurality of positioning portions A5 convexly arranged in a matrix are arranged on the disk surface A4. Each group of positioning portions A5 respectively provides a component to be inspected, such as a substrate B, etc. In the positioning interval A51, the substrates B are arranged in a matrix. The substrate B may be a BGA-type wafer and a heat sink that have been planted. When it is placed in the carrier A, the heat sink faces upward. The upper surface of the heat sink is The front surface and the lower surface of the substrate B are the reverse surfaces.

Please refer to FIGS. 2, 4 to 5. The embodiment of the present invention can be illustrated by the device embodiment in the figure. The device can be applied to two kinds of carrier disks A carrying two different specifications of substrates B and simultaneously placed in the device. The inspection is performed separately. The device includes: a first conveying device C, which is arranged on a table surface Y, is arranged in the X-axis direction and is biased against the side Y1 of the table surface Y. The first conveying device C includes The first track C1 and the second track C2 are set, and the starting point of the first track C1 is provided with a feeding mechanism C3. The feeding mechanism C3 is stacked on top of the carrier tray A with the substrate B facing upward, and from top to bottom. The carrier A is supplied to the first track C1 one by one; the second track C2 is provided with a first carrier C21 and a second carrier C22 spaced apart from each other and positioned respectively, but capable of vertical movement in the Z axis. And a belt C23 that can be driven to form a conveying flow path; wherein, the second stage C22 is adjacent to the end of the second track C2 and is provided with a clamping mechanism C221; the substrate B of the component to be inspected faces upward It is placed on the carrier tray A and transported by the feeding mechanism C3 via the first track C1 to the second track C2; D, which is parallel to the first conveying device C and is spaced apart from each other on the table surface Y. It is arranged in the X-axis direction and is located on the other side of the first conveying device C opposite to the side Y1 of the table surface Y. The second conveying device D includes a third track D1 and a fourth track D2 which are opposite to each other. A delivery mechanism D3 is provided at the end point of the fourth track D2. The receiving mechanism D3 is used to collect and inspect the good products bearing the substrate B facing up. The carrier A is received from the fourth track D2 from the bottom to the top, and the carrier A is stacked one by one; the third track D1 is provided with a spaced apart space and is located in each position but can be used in the Z axis. A third carrier D11, a fourth carrier D12, and a belt D13 that can be driven to form a conveying flow path while being moved up and down. A fourth carrier D2 is provided with a fifth carrier that can move up and down in the Z axis. D22, which is located on a lower rail base D21 of a fourth rail D2 and can be driven for X-axis displacement and is provided with a clamping mechanism D221; wherein the third carrier D11 is adjacent to the starting point of the third rail D1 and is provided with a The clamping mechanism D111, the substrate B of the component to be inspected is placed on the tray A with the front side facing up, and the third track D1 passes the fourth track D2 is conveyed to the receiving mechanism D3; a turning mechanism E is provided on the machine table Y, outside the end of the second track C2 of the first conveying device C, and outside the start point of the third track D1 of the second conveying device D It is provided with a turning seat E4 which can be driven by the driving member E1 for Z-axis upward and downward displacement, Y-axis left and right displacement, and an X-axis rotation axis E2 as the axis and driven by the driving member E3 for symmetrical rotation. It is set on a stand E5, which is set on a Y-axis rail E6 and driven by a driver E7 to make Y-axis displacement on the rail base E6, so that the flip base E4 can be repeatedly displaced on Above the second track C2 of the first conveying device C and the third track D1 of the second conveying device D; a first inspection mechanism F, which is located on the machine table Y, and is provided with a Y-axis transversely arranged on the first The first track base F1 above the second track C2 of the first conveying device C and the third track D1 of the second conveying device D, and the two ends of the first track base F1 are respectively arranged next to each other in the first conveying device C and the second conveying device. On the X-axis second rail base F2 and the third rail base F3, which are arranged in parallel on both sides of the device D, the first rail base F1 can be on the second rail base F2 and the third rail base. The first track base F1 is provided with a first viewing unit F11 that can be driven for Z-axis displacement, and can be driven independently for the Y-axis direction on the first track base F1. The first inspection unit F11, and inspect the upper surface of the component substrate B to be inspected placed on the first stage C21 on the second track C2 of the first conveying device C below the first carrier C21 and the tray A facing upward. A CCD lens for inspection from top to bottom is provided; a second inspection unit F12 which can be driven for Z-axis displacement is additionally provided on the first track base F1, which can be driven independently as Y on the first track base F1 Axial displacement and upper surface inspection of the component substrate B to be inspected placed on the fourth stage D12 on the third track D1 of the second conveying device D and the loading plate A placed on the front side facing upward, the second inspection unit F12 is provided with a CCD lens for viewing from top to bottom; a third conveying device G, the conveying flow path of which is parallel to the conveying flow path of the first conveying device C and the second conveying device D and is arranged on the machine at a distance from each other; On the table surface Y, which is arranged in the X-axis direction and is located on the side Y1 opposite to the table surface Y of the machine The other side Y2 of the machine table Y on the other side, the third conveying device G includes a fifth track G1 and a sixth track G2 opposite to each other. The fifth track G1 is provided with a feeding mechanism G3, and the feeding mechanism G3 An empty tray A is supplied to the fifth track G1 from the top to the bottom, and a receiving mechanism G4 is provided at the end point of the sixth track G2. The receiving mechanism G4 collects from the sixth track G2 from the bottom to the top and collects it as a defective product. Carrier disk A with the front side facing upward of the substrate B of the component to be inspected; the sixth track G2 is provided with a Z axis that can be raised and lowered vertically and located on a lower rail seat G21 in a sixth track G2 and can be driven as an X axis The sixth stage G5, which is displaced in the Y direction, corresponds to the fifth stage D22 in the fourth track D2 of the second conveying device D, and is provided with a clamping mechanism G51. The five tracks G1 are conveyed to the receiving mechanism G4 via the sixth track G2. A second inspection mechanism H is provided with a third inspection unit H1 and a fourth inspection unit H2, which are arranged on the table surface Y at a distance in the X axis. And is located between the fourth track D2 of the second conveying device D and the sixth track G2 of the third conveying device G, each of which is provided from bottom to top The inspection CCD lens is used to inspect the sides of the substrate B to be inspected. A transfer mechanism K is provided with a first transfer rail base K1, which is opposite to each other and is arranged on the table surface Y of the machine. The transfer rail base K2, the first transfer rail base K1, and the second transfer rail base K2 are respectively arranged in the Y-axis direction, and the conveying flow path is the same as that of the first transfer device C and the second transfer device D. The transfer flow paths are perpendicular to each other; the first transfer module K1 is provided with a first extraction module K11 which can be driven for Y-axis and Z-axis displacement, and the first extraction module K2 can be driven on the first transfer module K1 is transferred between the fifth stage D22 in the fourth track D2 of the second transfer device D, the third inspection unit H1 in the second inspection mechanism H, and the sixth stage G5 in the sixth track G2 of the third transfer device G. ; The second transfer rail base K2 is provided with a second extraction component K21 that can be driven for Y-axis and Z-axis displacement, and the second extraction component K21 can be driven and transferred to the fourth track D2 of the second transfer device D The fifth stage D22, the fourth inspection unit H2 of the second inspection mechanism H, and the sixth stage G5 of the sixth track G2 of the third conveying device G.

Please refer to FIGS. 4 and 6 to 7. The first track C1 of the first conveying device C is provided with two elevated side frames C12 spaced apart and parallel to each other on a plate C11, and the inner sides corresponding to the two side frames C12 are respectively A driven belt C13 is provided. The belt C13 forms the conveying flow path of the conveying tray A. A hollow working section C111 is provided on the seat plate C11 below one end between the two side frames C12; the feeding mechanism C3 and The feeding mechanism G3 on the fifth track G1 in the third conveying device G is the same, and the feeding mechanism C3 will be described here. The feeding mechanism G3 can be pushed for the same reason, and will not be repeated. The feeding mechanism C3 includes a carrier C31. And a lifting frame C32; wherein the carrier C31 includes a carrier C312 provided with a rectangular hollow-out transfer section C311 through which the tray A can be moved, and the transfer section C311 corresponds to the upper and lower working sections C111; Sides C313 on both sides below the carrier C312 can be placed on the two outer sides of the first rail C1 two side frame C12, so that the carrier C312 is racked higher than the first rail C1 two side frame C12 by a space height; Four corners outside the transfer section C311 are respectively provided with angle bracket rods C314 on the carrier C312, and the carrier C312 A first engaging component C315 is composed of four engaging members C3151 which can be driven to protrude or retract in the front and back. The corner frame rod C314 is located outside the two long sides of the rectangular hollow transfer area C311. There are two latches C3151 each in the space. Above the base C312, there are four latches C3161, which are lower than the base C312 by a distance, which can be driven to project forward or backward. The second indentation component C316 composed of C3162 is provided with two latching members C3162 between the two corner frames C314 outside the two long sides of the rectangular hollow transfer area C311; the first indentation component C315 and The second mating component C316 is used for stacking the carrier plate A of the first specification carrying the substrate B facing upward, and the second mating component C316 is used for stacking the second specification of the carrier plate B facing the upwardly facing substrate B. Carrying plate A; The lifting frame C32 includes a fixed frame C321 and a moving frame C322. The fixed frame C321 is composed of an upper fixed seat C3211, a lower fixed seat C3212 and a plurality of supporting rods C3213, and the upper fixed seat C3211 is provided. Located below the seat plate C11 of the first track C1; between the upper fixing seat C3211 and the lower fixing seat C3212 A long-shaped positioning member C3214 is provided with sensors C3215 provided on the upper and lower positions respectively; the moving frame C322 is formed by an upper support C3221 located above the upper fixed base C3211 and located below the upper fixed base C3211 and located at each The support base C3222 between the support rods C3213 and a plurality of support rods C3223 are formed; the upper support base C3221 is provided with two spaced apart, each upper support base C3221 is located at the upper end of the two support bases C3223; the drive base C3222 is driven by one The screw C3225 driven by the piece C3224 can be moved up and down and can be moved up and down by the support rod C3223 to move up and down into the transfer zone C311 and the work zone C111. A sensor piece C3226 on the side of the drive base C3222 can be received by the sensor C3215 induction.

Please refer to FIGS. 2, 8 to 10. The first specification of the first mating component C315 and the second mating component C316 is superimposed on the carrier plate A with the substrate B facing upwards. An engagement component C315 resists and is positioned above the latch C3151 of the first engagement component C3152 (Figure 8); when it is intended to feed into the first track C1, the lifting frame C32 is driven upward to move above the support C3221 abuts under the carrier plate A carrying the substrate B with the reverse side facing upward, and the latching member C3151 of the first engaging member C315 is driven and retracted, so that the carrier plate A follows the guides provided on both sides below the carrier seat C312, respectively. The restricted section between C317 is placed on the upper support C3221 (Fig. 9); the latch C3151 of the first engaging member C315 is driven to protrude to limit the carrier A above it from falling, and the lifter C32 is driven. Move the upper support C3221 to lower the carrier A to the inner belt C13 corresponding to the side frame C12, so that the carrier A is transported by the conveying flow path formed by the belt C13 of the first track C1 (Figure 10); When the carrier A of the first specification carrying the substrate B with the reverse side facing up is intended to be fed into the first track C1, the same method is implemented; in this embodiment, the first specification There tails disc substrate B are set to A is executed after completion of the second specification takes precedence containing tails of the substrate carrier plate B A feeding and inspection work.

Please refer to FIGS. 11 to 12. The fourth track D2 and the receiving mechanism D3 of the second conveying device D are the same as the sixth track G2 and the receiving mechanism G4 of the third conveying device G. The four tracks D2 and the receiving mechanism D3 will be described. The sixth track G2 and the receiving mechanism G4 can be pushed in the same way, and will not be repeated. The fourth track D2 of the second conveying device D includes two plates on a plate D23. Elevated side frames D24 spaced and parallel to each other, and corresponding inner sides of the two side frames D24 are respectively provided with driven belts D25. The belts D25 form the conveying flow path of the carrying tray A, and one end between the two side frames D24 The lower seat plate D23 is provided with a hollow working section D231; the fifth carrier D22, which is provided with a clamping mechanism D221 and is located on the rail seat D21, can be raised and lowered in the Z axis, is located between the two side frames D24, and The side frame D24 corresponding to the fifth carrier D22 is provided with a pushing mechanism D26 to force the carrier A on the fifth carrier D22 to be biased toward the side frame D24 on one side; the receiving mechanism D3 includes A loading rack D31 and a lifting rack D32; wherein, the loading rack D31 includes a rectangular opening with a tray A through which it can be moved. The carrier D312 in the transfer interval D311 corresponds to the upper and lower parts of the work interval D231. The lower sides of the carrier D312 are respectively provided with side seats that can span the two outer sides of the two side frames D24 of the fourth track D2. D313, make the carrier D312 be higher than the fourth track D2 two side frames D24 above a space height; four corners outside the transfer interval D311 are provided on the carrier D312 angle bracket rods D314, respectively, in the carrier The first surface of D312 is provided with a first engaging component D315 composed of four latching pieces D3151 which can be turned downward or upward or restored by elasticity (or gravity action) to be horizontally positioned. Two brackets D3151 are set between the two corner brackets D314 outside the two long sides. Above the first engagement member D315, there are four vertical seats D3161 and an upper and lower distance from the first engagement member D315. A second indentation component D316 consisting of four latching elements D3162 that can be turned down or turned back elastically (or under the action of gravity) to return to a horizontal position, which is lowered in the rack height. It is two long in the rectangular hollow transfer area D311. Each of the two corner bracket rods D314 outside the side is respectively provided with two latching members D3162; The first mating component D316 is used for stacking the first type of carrier plate A carrying the substrate B which has been inspected as a good product facing up. The first mating component D315 and the second mating component D316 are stacked for the second. Carrier tray A carrying a substrate B with the front side being inspected as a good product. The lifting frame D32 includes a fixed frame D321 and a moving frame D322. The fixed frame D321 is composed of an upper fixing base D3211 and a lower fixing base. D3212 and a plurality of supporting rods D3213 are formed, and the upper fixing seat D3211 is located below the seat plate D23 of the fourth track D2; an upper fixing seat C3211, a lower fixing seat C3212 is provided with a long-shaped positioning member D3214, which is provided with The upper and lower positioning sensors D3215 are respectively located; the moving frame D322 is composed of an upper support D3221 located above the upper fixed base D3211, a drive base D3222 located below the upper fixed base D3211 and located between the support rods D3213, and a plurality thereof. Supported by a support rod D3223; the drive block D3222 is driven by a screw D3225 driven by a drive member D3224, which can be moved up and down, and supported by the support rod D3223 to move the upper support D3221 up and down into and out of the transfer section D311 and the work section D111; the drive block D3222 One side A sensor D3226 is provided for sensing by the sensor D3215.

Please refer to FIGS. 2, 13 to 15. When the second type of the carrier plate A carrying the substrate B, which is inspected as a good product facing up, is transferred to the receiving mechanism by the conveying flow path formed by the belt D25 of the fourth track D2. When the loading rack D31 of D3 is below (Fig. 13), the lifting rack D32 is driven upward to move the upper support D3221 under the loading tray A carrying the substrate B facing up and supporting the moving up to the first indentation. The latching piece D3151 of the component D315 causes the latching piece D3151 to be turned from bottom to top (Figure 14), so that the carrier A is moved up through the latching pieces D3151 on both sides, and the latching piece D3151 is subject to elasticity (or gravity). ) Return to the horizontal position, the lifting frame D32 is driven to move down so that the carrier plate A is moved down and placed on the latching member D3151 of the first indentation component D315 (Figure 15); The carrier A of the substrate B that has been inspected as a good product is transported by the conveying flow path formed by the belt D25 of the fourth track D2 to the carrier D31 of the receiving mechanism D3, and is similarly transferred to the second indentation. Above the latch D3162 of the module D316; in this embodiment, the first specification of the carrier plate A carrying the substrate B, which is inspected as a good face up, will be executed first. A transfer platen so that the top of the second insert is set off against the engaging member assembly D316 D3162 will be executed first.

Please refer to FIGS. 16 to 19, the turning base E4 of the turning mechanism E has a rectangular frame E41, and has a rectangular hollow-shaped operating section E411 larger than the carrier plate A. The side of the frame E41 is received by the base E5. The sensor E8 is positioned so that the frame E41 is maintained at a horizontal level each time the frame E41 is turned over. A pair of first holding components E42 are provided on the short sides of the frame E41, and the corresponding long sides of the frame E41 are provided. There are two sets of spaced second holding components E43 on the side; the flip base E4 is provided with an oscillator E44 and a sensor E45 to detect whether there is a disk A toward the operation area E411; the first holding component E42 of this group includes The first pair of contact pieces E421 on the short side of the frame E41 on the rotation axis E2 and the second pair of contact pieces E422 on the other short side of the frame E41 on the rotation axis E2; E4211 (not shown) is pivoted on the frame E41, and is acted by a driving member E423 under the frame E41. The driving rod E4231 of the driving member E423 protrudes in the direction of the protruding force, and is used as a forward push into the operation interval E411 to perform a counteract. The second pair of resisting pieces E422 are pivoted on the frame E41 by two pivot rods E4221, and receive the frame. A driving member E424 under E41 functions. A driving member E4241 of the driving member E424 is connected to a connecting member E4242 toward the frame E41, and the connecting member E4242 is connected to a second pivot rod E4221. The driving rod E4241 of the driving member E424 projects in the opposite direction of the protruding force. The direction is used as a forward force to perform the resistance in the direction of the operation interval E411. Each set of the second holding components E43 includes a first pair of clamps E431 located on one long side of the frame E41 and the other long side of the frame E41. The second pair of clips E432 on the side; among them, the first pair of clips E431 and the second pair of clips E432 are respectively pivoted to the frame E41 with two pivot rods E433, and are acted by a drive member E434 below the frame E41. The driving rod E435 of the driving member E434 is connected with a link E436 to the outside of the frame E41, and the link E436 links the two pivots E433. The driving force of the driving rod E435 of the driving member E434 is opposite to the direction of the protruding force. The inner front is used to perform the opposing force; the first pair of clamps E431 and the second pair of clamps E432 are each provided with a Z-axis slide rail E437 that can be driven to slide up and down or open and close. Two clamping jaws E438, one side of the two clamping jaws E438 is provided with a positioning member E439, wherein the two clamping jaws The front end of the claw E438 extends forward toward the operation section E411 than the front end of the positioning member E439.

Please refer to FIGS. 20 to 21. The first pair of abutment pieces E421 and the second pair of abutment pieces E422 of the first holding component E42 of the set are respectively provided with convex protrusions on the short side frame edges A1 on both sides of the resisting plate A. Buckle rib A3; please refer to FIGS. 22 to 23, the first pair of clamping members E431 and the second pair of clamping members E432 of the two sets of second retaining components E43 respectively use two clamping jaws E437 to each of the long sides of the two sides of the carrier A Two slightly concave buckle edges A2 (see FIG. 3) provided on the frame edge A1 at a distance from each other are fastened up and down, and in this embodiment, the first pair of clips E431 of the two sets of second retaining components E43 and The second pair of clips E432 is based on the principle of simultaneously performing two upper and lower paired clips of the two carrier plates A.

The method for inspecting electronic components according to the embodiment of the present invention includes the following steps: a step of sending an empty tray, so that an empty tray A is first placed by the feeding mechanism C3 or the belt placed directly on the first track C1 of the first conveying device C C13 is transported to the second stage C22 in the second track C2, and is clamped and positioned by the clamping mechanism C221, and is raised to a predetermined height by the second stage C22, so as to position the tilting seat E4 of the tilting mechanism E Move over the empty tray A of the second carrier C22, and move down to hold the empty tray A in the flip base E4 with the first holding component E42, and the flip base E4 moves up again to stand by; a reverse inspection step makes the load The tray A with the substrate B of the component to be inspected facing upward is transported by the feeding mechanism C3 via the first track C1 of the first conveying device C to the first stage C21 in the second track C2, and is received by the first stage C21 rises up to a predetermined height, and is subject to the first inspection unit F11 of the first inspection mechanism F to inspect the bottom copper of each component substrate B to be inspected in the tray A one by one; after the inspection, the first stage C21 moves the carrier plate A down to return to the original position, and the carrier plate A is transported to the second track C2 by the belt C13. At the second carrier C22, it is clamped and positioned by the clamping mechanism C221; During the reversing step, the carrier A, which has completed the reverse inspection step, is raised to the predetermined height by the second carrier C22, and the reversing seat of the reversing mechanism E E4 moves above the second carrier C22, and moves down to the empty carrier A originally held in the reversing seat E4 of the first holding unit E42, and is placed above the carrier A on the second carrier C22 that has completed the reverse inspection step. After the first holding component E42 is released from holding, the first pair of clips E431 and the second pair of clips E432 of the two sets of the second holding component E43 are simultaneously used to fasten the upper and lower clips of the two carriers A. , The second carrier A is held in the turning base E4, the turning base E4 is turned 180 degrees and moved to the third carrier D11 which has been positioned to a predetermined height in the third track D1 of the second conveying device D Above, at this time, the substrate B with the original reverse side facing up in the carrier A has been turned upside down and placed on the original idler A, and the oscillator E44 is activated to cause the flip E4 to be vibrated to link the carrier A The base plate B is fully reprinted, and the flip base E4 is moved down to carry the front side up to be inspected. The turntable A of the substrate B and the lower part is placed on the third stage D11 and clamped by the clamping mechanism D111. The seat E4 is turned over and changed to the first pair of resisting members E421 and the second pair of resisting members E422 of the first holding member E42. Aiming at holding the reloaded empty loader A, the reversing seat E4 is moved upward to repeat the aforementioned reversing operation between the first conveying device C and the second conveying device D; a front inspection step, and the tray A that has completed the reversing step is in the The third carrier D11 is lowered and returned to the fourth carrier D12 by the third track D1 of the second transfer device D, and the carrier A is raised to a predetermined height by the fourth carrier D12 and then moved to a predetermined height for positioning. The second inspection unit F12 of an inspection mechanism F inspects the surface of the heat sink one by one on the front surface of the substrate B of each component to be inspected in the carrier plate A. After the inspection, the fourth carrier D12 moves the carrier plate A down to return to the original position. A is conveyed by the belt D25 to the fifth stage D22 in the fourth track D2, and is clamped and positioned by the clamping mechanism D221. A side inspection step, and the carrier plate A that has completed the front inspection step is abutted by the fifth stage D22. The first extraction component K11 of the transfer mechanism K is moved up to a predetermined height for positioning The second extraction module K21 extracts the substrate B that has been inspected from the front plate A respectively. If the substrate B has been determined to be defective after the front and back inspection, the first extraction module K11 and the second extraction module K21 will be respectively Through the first transfer rail base K1 and the second transfer rail base K2, the defective product of the substrate B is directly moved to the empty tray A on the sixth carrier G5 in the sixth track G2 of the third transfer device G. ; If the substrate B has been determined to be a good product after the front and back inspection, the first extraction component K11 and the second extraction component K21 will pass the first transfer rail base K1 and the second transfer rail base K2 to the substrate B, respectively. The good products are moved to the third inspection unit H1 and the fourth inspection unit H2 of the second inspection mechanism H to perform overflow inspection on the sides of the periphery. If the substrate B is inspected, it will be returned to the carrier disk A of the fifth carrier D22. If the substrate B is defective after inspection, it is moved to the empty tray A of the sixth stage G5 in the sixth track G2 of the third conveying device G; a good product collection step, and the fifth stage of the side inspection step is completed D22, which is a good product of substrate B on D22, moves down to its original position, and the clamping mechanism D221 releases the clamping. Position, the tray A is transported to the receiving mechanism D3 by the belt D25 for collection; a defective product collecting step, the empty tray A is supplied by the feeding mechanism G3 on the fifth track G1 of the third conveying device G to follow the fifth track G1 Go to the sixth carrier G5 of the sixth track G2, and be clamped and positioned by the clamping mechanism G51 and rise to a predetermined height by the sixth carrier G5 against the sixth carrier G5 to complete the side inspection step. The carrier A carrying the defective product of the substrate B is returned to the original position as the sixth carrier G5 moves down, and is transported to the receiving mechanism G4 by the sixth track G2 for collection.

According to the method and device for inspecting electronic components according to the embodiments of the present invention, since the first transfer device C, the reversing mechanism E, the second transfer device D, the transfer mechanism K, and the third transfer device G sequentially transfer the carrier disk A, it can be carried throughout In the conveying flow path, the six sides of the substrate B, including the reverse, front, and sides, are inspected; and the first holding component E42 and the second holding component E43 of the turning mechanism E are opposed or clamped to convert the substrate B smoothly. It is conveyed stably between the two carrier trays A; at the same time, it cooperates with the feeding mechanism C3 of the first conveying device C, the receiving mechanism D3 of the second conveying device D, the feeding mechanism G3 and the receiving mechanism G4 of the third conveying device G The design enables the carrier A to be smoothly supplied and received, and even used as a separate carrier for different loading and unloading of the carrier A with different specifications of the substrate B. The inspection and transportation benefits obtained have indeed greatly improved the production efficiency.

However, the above are only the preferred embodiments of the present invention. When the scope of implementation of the present invention cannot be limited by this, that is, the simple equivalent changes and modifications made according to the scope of the patent application and the description of the invention, All are still within the scope of the invention patent.

A‧‧‧carriage
A1‧‧‧Frame margin
A2‧‧‧button margin
A3‧‧‧Rib
A4‧‧‧pan
A5‧‧‧Positioning Department
A51‧‧‧Positioning interval
B‧‧‧ substrate
C‧‧‧The first conveying device
C1‧‧‧First track
C11‧‧‧seat
C111‧‧‧Working interval
C12‧‧‧Side Frame
C13‧‧‧Belt
C2‧‧‧Second Track
C21‧‧‧First Carrier
C22‧‧‧Second carrier
C221‧‧‧Clamping mechanism
C23‧‧‧Belt
C3‧‧‧feeding agency
C31‧‧‧Carrier
C311‧‧‧ transfer interval
C312‧‧‧carriage
C313‧‧‧Side Seat
C314‧‧‧Angle pole
C315‧‧‧The first embedded component
C3151 ‧‧‧ detent
C316‧‧‧Second inset assembly
C3161‧‧‧ stand
C3162 ‧‧‧ detent
C317‧‧‧Guide
C32‧‧‧lifting frame
C321‧‧‧Fixed frame
C3211‧‧‧Upper mount
C3212‧‧‧lower mount
C3213‧‧‧Support
C3214‧‧‧Positioning
C3215‧‧‧Sensor
C322‧‧‧mobile stand
C3221‧‧‧ Upper Support
C3222‧‧‧Drive Seat
C3223 ‧‧‧ support rod
C3224‧‧‧Driver
C3225‧‧‧Screw
C3226‧‧‧Sensor
D‧‧‧Second transfer device
D1‧‧‧ Third Track
D11‧‧‧Third carrier
D111‧‧‧Clamping mechanism
D12‧‧‧The fourth carrier
D13‧‧‧Belt
D2‧‧‧ Fourth track
D21‧‧‧rail mount
D22‧‧‧ fifth carrier
D221‧‧‧Clamping mechanism
D23‧‧‧seat
D231‧‧‧Working area
D24‧‧‧Side Frame
D25‧‧‧Belt
D26‧‧‧Forcing agency
D3‧‧‧Receiving organization
D31‧‧‧Loading mechanism
D311‧‧‧ Transfer interval
D312‧‧‧carriage
D313‧‧‧Side Seat
D314‧‧‧Angle pole
D315‧‧‧The first embedded component
D3151‧‧‧Lock
D316‧‧‧Second inset assembly
D3161‧‧‧stand
D32‧‧‧Lifting frame
D321‧‧‧Fixed frame
D3211‧‧‧Upper mount
D3212‧‧‧ Lower mounting base
D3213‧‧‧Support rod
D3214‧‧‧Positioning
D3215‧‧‧Sensor
D322‧‧‧mobile stand
D3221‧‧‧ Upper Support
D3222‧‧‧Drive Seat
D3223‧‧‧Support
D3224‧‧‧Driver
D3225‧‧‧Screw
D3226‧‧‧Sensor
E‧‧‧turning mechanism
E1‧‧‧Driver
E2‧‧‧Shaft
E3‧‧‧Driver
E4‧‧‧ Flip Box
E41‧‧‧Frame
E411‧‧‧operation interval
E42‧‧‧First holding component
E421‧‧‧First pair
E4211‧‧‧ Pivot
E422‧‧‧The second pair
E4221‧‧‧ Pivot
E423‧‧‧Driver
E4231‧‧‧Driver
E424‧‧‧Driver
E4241‧‧‧Driver
E4242‧‧‧ Linkage
E43‧‧‧Second holding component
E431‧‧‧The first pair of clamps
E432‧‧‧Second pair of clamps
E433‧‧‧ Pivot
E434‧‧‧Driver
E435‧‧‧Driver
E436‧‧‧ Linkage
E437‧‧‧Slide
E438‧‧‧Jaw
E439‧‧‧Positioning
E44‧‧‧Oscillator
E45‧‧‧Sensor
E5‧‧‧base
E6‧‧‧rail mount
E7‧‧‧Driver
E8‧‧‧Sensor
F‧‧‧The first inspection agency
F1‧‧‧First rail seat
F11‧‧‧First viewing unit
F2‧‧‧Second rail seat
F12‧‧‧Second viewing unit
F3‧‧‧Third rail seat
G‧‧‧Third moving device
G1‧‧‧Fifth track
G2‧‧‧ Sixth Track
G3‧‧‧feeding agency
G4‧‧‧Receiving organization
G5‧‧‧ sixth carrier
G51‧‧‧Clamping mechanism
H‧‧‧Second Inspection Agency
H1‧‧‧Third viewing unit
H2‧‧‧Fourth viewing unit
K‧‧‧ transfer agency
K1‧‧‧The first transfer rail seat
K11‧‧‧First extraction component
K2‧‧‧Second Transfer Rail Base
K21‧‧‧Second extraction component
Y‧‧‧machine table top
Y1‧‧‧side
Y2‧‧‧side

FIG. 1 is a schematic perspective view of a carrier disk in an embodiment of the present invention. FIG. 2 is a schematic perspective view of a substrate carried on a carrier disk in the embodiment of the present invention. FIG. 3 is a schematic side view of a carrier disk in an embodiment of the present invention. FIG. 4 is a schematic plan view of each mechanism disposed on a machine table in the embodiment of the present invention. FIG. 5 is a schematic perspective view of various mechanisms arranged on a machine table in the embodiment of the present invention. 6 is a schematic perspective view of a first track and a feeding mechanism of a first conveying device in an embodiment of the present invention. FIG. 7 is an exploded perspective view of the first track and the feeding mechanism of the first conveying device in the embodiment of the present invention. FIG. 8 is a schematic diagram (1) of the feeding operation of the feeding mechanism in the first conveying device in the embodiment of the present invention. FIG. 9 is a schematic diagram (2) of the feeding operation of the feeding mechanism in the first conveying device in the embodiment of the present invention. FIG. 10 is a schematic diagram (No. 3) of the feeding operation of the feeding mechanism in the first conveying device in the embodiment of the present invention. FIG. 11 is a schematic perspective view of a fourth track and a receiving mechanism of the second conveying device in the embodiment of the present invention. FIG. 12 is a schematic exploded perspective view of a fourth track of a second conveying device and a receiving mechanism in an embodiment of the present invention. FIG. 13 is a schematic diagram (1) of a receiving operation of a receiving mechanism in a second conveying device according to an embodiment of the present invention. FIG. 14 is a schematic diagram (2) of the feeding operation of the receiving mechanism in the second conveying device in the embodiment of the present invention. FIG. 15 is a schematic diagram (three) of the receiving operation of the receiving mechanism in the second conveying device according to the embodiment of the present invention. FIG. 16 is a schematic perspective view of a turning mechanism in the embodiment of the present invention. FIG. 17 is a schematic perspective view of the rear side of the flip frame in the embodiment of the present invention. 18 is a schematic perspective view of a second pair of abutment members of a first holding component of a flip frame in an embodiment of the present invention. FIG. 19 is a schematic perspective view of the first and second pairs of clips of the second holding component of the flip frame in the embodiment of the present invention. FIG. 20 is a schematic diagram (1) of holding the carrier disk by the first and second pairs of abutment members of the first holding component of the flip frame in the embodiment of the present invention. FIG. 21 is a schematic diagram (2) of holding the carrier disk by the first and second pairs of abutment members of the first holding component of the flip frame in the embodiment of the present invention. FIG. 22 is a schematic diagram (1) of the first and second pairs of clips holding the carrier disk by the second holding component of the flip frame in the embodiment of the present invention. FIG. 23 is a schematic diagram (2) of holding the carrier disk by the first and second pairs of clips of the second holding component of the flip frame in the embodiment of the present invention.

C‧‧‧The first conveying device

C1‧‧‧First track

C2‧‧‧Second Track

C21‧‧‧First Carrier

C22‧‧‧Second carrier

C221‧‧‧Clamping mechanism

C3‧‧‧feeding agency

D‧‧‧Second transfer device

D1‧‧‧ Third Track

D11‧‧‧Third carrier

D111‧‧‧Clamping mechanism

D12‧‧‧The fourth carrier

D2‧‧‧ Fourth track

D21‧‧‧rail mount

D22‧‧‧ fifth carrier

D221‧‧‧Clamping mechanism

D3‧‧‧Receiving organization

E‧‧‧turning mechanism

E1‧‧‧Driver

E2‧‧‧Shaft

E3‧‧‧Driver

E4‧‧‧ Flip Box

E5‧‧‧base

E6‧‧‧rail mount

E7‧‧‧Driver

F‧‧‧The first inspection agency

G‧‧‧Third moving device

G1‧‧‧Fifth track

G2‧‧‧ Sixth Track

G3‧‧‧feeding agency

G4‧‧‧Receiving organization

G5‧‧‧ sixth carrier

G51‧‧‧Clamping mechanism

H‧‧‧Second Inspection Agency

K‧‧‧ transfer agency

Y‧‧‧machine table top

Y1‧‧‧side

Y2‧‧‧side

Claims (13)

An electronic component inspection method includes: providing a carrier plate for holding the components to be inspected; and performing on a machine table: causing the components to be inspected on the carrier plate to be transported by a first transfer device and using a first inspection unit Carry out the reverse inspection of the component to be inspected; turn the carrier containing the component to be inspected by a reversing mechanism from the first conveying device to the second conveying device for conveyance, and perform a front inspection of the component to be inspected with a second inspection unit ; The component to be inspected on the carrier tray is picked up by a transfer mechanism from the second transfer device and transported, and a third inspection unit is used to perform side inspection around the component to be inspected. A method for inspecting electronic components includes: providing a carrier disc to hold the components to be inspected; and performing: a reverse inspection step, so that the carrier carrying the components to be inspected with the reverse side upwards is transported to a first via a first conveying device; A carrier and a first inspection unit inspect the reverse side of each component in the carrier one by one. After the inspection, the carrier is transported to the second carrier. A reversing step causes the reversing mechanism to The original empty tray is placed above the second tray that has completed the reverse inspection step, and the second tray is held in the turning base for overturning and displacement to the third carrier of a second transfer device. A front inspection step, the carrier is transported to a fourth carrier by the second conveying device to be inspected by a second inspection unit on the front of each component to be inspected in the carrier; after the inspection, the carrier is transported to a first At the fifth loading platform; a side inspection step, the carrier is subjected to a transfer mechanism to extract the components to be inspected from the front of the carrier, and the components to be inspected are moved to a third inspection unit for side inspections. For example, the method for inspecting electronic components described in item 1 or 2 of the scope of patent application, wherein when the third inspection unit is a good product after inspection, the transfer mechanism causes the component to be inspected to be transferred back to the second transfer device to be collected; If it is a defective product, it is moved to a third conveying device and is conveyed and collected. If the method for inspecting electronic components described in item 1 or 2 of the scope of patent application, wherein the component to be inspected has been determined to be a defective product after the front and back inspections, the defective product is directly moved to a third by the transfer mechanism The transport device is transported and collected. An inspection device for electronic components includes: a first conveying device is provided on a machine table surface to form a conveying flow path for a conveying tray; a first inspection unit is provided above the first conveying device and is provided with: A lens viewed from top to bottom; a second conveying device forming a conveying flow path of a conveying tray; a second viewing unit located above the second conveying device and provided with a lens viewed from top to bottom; a flip The mechanism is provided with a flip base which can be driven to be displaced between the first transfer device and the second transfer device and reversed; a third viewing unit, which is located on the side of the second transfer device, is provided with a lens for viewing from bottom to top; A transfer mechanism is provided with a first extraction component which can be driven and displaced between the second conveying device and the third inspection unit. For example, the inspection device for electronic components described in item 5 of the scope of patent application, wherein the first conveying device includes a first track and a second track opposite to each other, the first track is provided with a feeding mechanism, and the second track is provided with First carrier and second carrier. For example, the inspection device for electronic components described in item 5 of the patent application scope, wherein the second conveying device includes a third track and a fourth track opposite to each other, and the third track is provided with a third carrier and a fourth carrier. There is a fifth carrier and a receiving mechanism in the fourth track. For example, the inspection device for an electronic component described in item 5 of the scope of the patent application, wherein the first extraction component of the transfer mechanism can be driven and moved to include a second transfer device, a third inspection unit, and a third transfer device. The third transfer device forms a transfer flow path of a transfer tray. For example, the inspection device for an electronic component described in item 5 of the scope of patent application, wherein the transfer mechanism is provided with a first transfer rail base, a second transfer rail base, and the first transfer rail base includes the first extraction component. A second extraction component is arranged on the second transfer rail base, and the second extraction component can be driven and transferred between the second conveying device, a fourth inspection unit and the third conveying device. For example, the inspection device for an electronic component according to item 8 or 9 of the scope of application for a patent, wherein one of the first, second, and third conveying devices is used to carry a tray by a belt. For example, the inspection device for an electronic component described in item 8 or 9 of the scope of the patent application, wherein the third conveying device includes a fifth track and a sixth track opposite to each other, a feeding mechanism is provided on the fifth track, and the sixth The track is provided with a receiving mechanism. For example, the inspection device for an electronic component described in item 5 of the scope of patent application, wherein the turning base of the turning mechanism has a frame body, the frame body has a hollow-shaped operation section, and the two corresponding short sides of the frame body are provided with first holdings. Component, two corresponding long holding sides of the frame body are provided with a second holding component. An electronic component inspection device includes a device using the inspection method for an electronic component according to any one of claims 1 to 4 of the scope of patent application.