TWI356908B - - Google Patents
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- TWI356908B TWI356908B TW096134691A TW96134691A TWI356908B TW I356908 B TWI356908 B TW I356908B TW 096134691 A TW096134691 A TW 096134691A TW 96134691 A TW96134691 A TW 96134691A TW I356908 B TWI356908 B TW I356908B
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- tray
- holding
- head
- test
- electronic component
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
1356908 九、發明說明: 【發明所屬之技術領域】 本發明係有關於在令半導體積 1 一 ^ 电硌70件等之各種雷 子心以下亦代表性地稱為Ic組件)的輸出 = 氣式接觸測試頭之接觸部,並測試1〇組件電子元件= 置,用.錢運可收容IC組件之把盤的Μ搬運及H 該裝置之電子元件測試裝置。 夏及具有 【先前技術】 在組件等之電子元件的製程,為了 測試1C組件之性能或功能而使用子 教之狀t 電子元件測試裝置之處理器(h ’貝、式裝置。構成 式展置之處理盗(handier),包括 以及卸載部。 科丨至4 —處理器之裝載部從用以收容測試前的IC虹件或㈣ 2了之]c組件的托盤(以下稱為訂製托盤),將K組件換 裝於在電子元件測試裝置内被循環搬運的托盤(以下稱為 測S式用托盤)’並將該測試用托盤搬人室部。 接著,在處理器之室部,施加高溫或低溫的_試後, ,各1C組件電氣式接觸測試頭之連接部,而令電子元件測 試裝置本體u下,稱測試器(Tester))進行測試。 接著,將已裝載測試完了之10組件的測試用托盤從室 部搬至卸載部,並在卸载部將IC組件換裝於因應於測試結 姻寺製托盤,藉此分類成良品或不良品之種類。 處理器的錯存部將已收容測試前之1C組件供給裝載 2247-9l47-PF;Ahddub 5 1356908 二’由以下之構件構成:儲存部·,係儲存已裝載測試 刖的ic、卫件或測試後之Ic組件的訂製托盤⑽;裝載部 3〇〇,係將從儲存部所供給之1(:組件換裝於測試用二 盤m並送入室部1〇〇;室部1〇〇,係包含有測試頭5,並 在被裝載於測試用托盤TST之狀態測試Ic組件;以及卸載 部400’係從室㈣〇搬出測試完了的ic组件並在分類 後移至訂製托盤KST。 設置於測試頭5的插座50經由第!圖所示之電境7和 測試器6連接,並將與插座5()以電氣式連接的π組件經 由電魔7和測試器6連接,再根據來自該測試器6之測試 信號測試IC組件。此外,如第j圖所示,將空間8設置於 處理器1之下部的-部分,並在此空間"交換地配置測 試頭5’、經由在處理器!之主基座所形成的貫穿孔,可使 ic組件和職頭5上之插座5G以電氣式接觸。在更換 組件之種類時’更換成具有適合該種類的1C組件之形狀、 接腳數等的插座之其他的測試頭。 以下,詳述處理器1之各部。 〈儲存部200> 第4圖及第5圖係表不本實施形態的電子元件測試裝 置之儲存部的正視圖㈣視圖,帛6圖係表示在本實施形 態的電子元件測試裝置所使用之IC儲存器的分解立體 圖’第7圖係表*在本實施形態的電子元件 用之訂製托盤的立體圖。 罝 儲存部200如第4圖及第5圖所示,包括:儲存器21〇, 10 2247-9l47-PF;Ahddub 1356908 =存訂製托盤KST;昇降裝^ 220,係可保持訂製托盤 τ =可昇降;以及托盤移送裝置23〇,係為了在錯存器 盤和升降裝置220之間交換訂製托盤脱’而保持訂製托 並可沿著上下方向及水平方向移動。1356908 IX. OBJECTS OF THE INVENTION: 1. Field of the Invention The present invention relates to an output of a semiconductor product, which is also referred to as an Ic component, and is typically referred to as an Ic component. Contact the contact part of the test head, and test the 1〇 component electronic component = set, use the money to carry the handle of the IC component, and the electronic component test device of the device. Xiahe has [previous technology] In the process of electronic components such as components, in order to test the performance or function of the 1C component, the processor of the electronic component test device is used (h' shell, type device. Handling, including and unloading. Coco to 4 - the loading part of the processor is from a tray for accommodating the IC rainbow before the test or the component of the c component (hereinafter referred to as a custom pallet). The K component is replaced with a tray (hereinafter referred to as a S-type tray) that is circulated and transported in the electronic component testing device, and the test tray is moved to the chamber portion. Next, a high temperature is applied to the chamber portion of the processor. Or after the low temperature test, each 1C component electrically contacts the connection portion of the test head, and the electronic component test device body u, called the tester, is tested. Next, the test tray in which the tested 10 components have been loaded is transported from the chamber portion to the unloading portion, and the IC assembly is replaced in the unloading portion in response to the test of the marriage tray, thereby classifying into a good or defective product. kind. The faulty part of the processor supplies the 1C component before loading the test to the load 2247-9l47-PF; Ahddub 5 1356908 2' consists of the following components: the storage part, which stores the ic, guard or test loaded with the test 刖The ordering tray (10) of the rear Ic assembly; the loading unit 3〇〇 is supplied from the storage unit 1 (: the assembly is replaced with the test disc 2 and sent to the chamber 1; the chamber 1〇〇 The test head 5 is included, and the Ic component is tested in a state of being loaded on the test tray TST; and the unloading section 400' carries out the tested ic component from the chamber (4) and moves to the custom tray KST after sorting. The socket 50 disposed on the test head 5 is connected to the tester 6 via the environment 7 shown in the figure of FIG. 3, and the π component electrically connected to the socket 5 () is connected via the electric magic 7 and the tester 6, and then according to The test signal from the tester 6 tests the IC component. Further, as shown in Fig. j, the space 8 is placed in the - portion of the lower portion of the processor 1, and the test head 5' is exchanged in this space. The through hole formed in the main base of the processor! can insert the ic component and the head 5 The seat 5G is electrically contacted. When the type of the component is replaced, it is replaced with another test head having a socket suitable for the shape of the 1C component of this type, the number of pins, etc. Hereinafter, each part of the processor 1 will be described in detail. 4 and 5 are a front view (four) view of a storage unit of the electronic component testing apparatus of the present embodiment, and FIG. 6 is a view showing an IC storage used in the electronic component testing apparatus of the present embodiment. FIG. 7 is a perspective view of a custom tray for an electronic component according to the present embodiment. As shown in FIGS. 4 and 5, the storage unit 200 includes: a reservoir 21〇, 10 2247- 9l47-PF; Ahddub 1356908 = custom-made tray KST; lifting and lowering device 220, which can hold the customized tray τ = can be raised and lowered; and the tray transfer device 23 〇 for exchanging between the erroneous tray and the lifting device 220 Customize the tray off' while maintaining the custom tray and moving in the up and down direction and horizontal direction.
:此外,在本實施形態之儲存器210相當於在本發明的 儲存手段之-,在本㈣形§之昇降裝置22q相當於在本 發明的保持手段之-,在本實施形態之托盤移送裝置230 相當於在本發明的移送手段之一。 儲存器21G,如第2圖~第4圖所示,包括:測試前儲 存器211,係儲存已裝載測試前之1(:組件的訂製托盤《a丨 及測試完儲存器212,係裝載因應於測試結果所分類的ic 組件。 測試前儲存器2n及測試完儲存器212各自如第6圖 所不,包括:框形之托盤支持框213;及昇降機214,係可 從此托盤支持框213之下部進入並往上部昇降。在托盤支 持C 213堆疊複數訂製托盤kst,並利用昇降機gw僅上 下地移動此堆疊的訂製托盤KST。 在本實施形態,訂製托盤KST如第?圖所示,雖然用 以收容1C組件之60個收容部91排列成1〇列“行,但是 實際上因應於I c組件之種類而存在各種排列的變化。 因為測試前儲存器211和測試完儲存器212之構造相 同,所以可因應於需要而將測試前儲存器211和測試完儲 存器212各自之個數設定為適當數量。 在本實施形態,如第2圖〜第4圖所示,在測試前儲存 2247-9147-PF;Ahddub 11 1356908 •器211設置1個儲存器STK—B。另一方面,在測試完儲存 器212設置8個儲存器STK_ 1、STK— 2.....STK- 8,以 • 因應於測試結果可分類成最多8種並儲存的方式構成, : 即,除了良品 '不良品之區別以外,即使在良品中亦可分 - 類成動作速度係南速的' 中速的、低速的,或者即使不户 品之中亦可分類成需要再測試的等。 在測試完儲存器212,在STK— 4和STK— 5之間設置! 個空托盤儲存器STK—E。在此空托盤儲存器STK-Ε,堆聶 ® 被送至卸載部400之空的訂製托盤KST。 本實施形態之電子元件測試裝置如第4圖所示,包括 6台昇降裝置220’在裝載部300於主基座1〇1開口的2個 窗部306、及在卸載部400於主基座1〇1開口的4個窗部 406之共6個窗部,各自配置各1台。 各昇降裝置220如第5圖所示,由以下之構件構成,z 軸方向軌道221,係設置成從主基座101下垂;及工作台 泰 222,係設置成可沿著此z軸方向軌道221昇降,工作台 222可在第1規定位置η,和第2規定位置ih之間昇降。 第1規定位置Hi係工作台222之Z軸方向的上限,工 -作台222位於此第1規定位置Hl時,經由在主基座ι〇1所 形成的窗部306(或窗部406),訂製托盤KST面臨裝載部 300(或卸載部400)。 而,第2規定位置Hz係工作台222之Z軸方向的下限, 在工作台222位於此第2規定位置H2之狀態,在和托盤移 送裝置230之間交換訂製托盤KST。 2247-9147-PF;Ahddub υδ 如此’昇降裝置220藉由將訂_KST保持於工作 台222上並昇降,而可在儲存部2〇〇和裂載部贱或 部400)間移動訂製托盤KST。 托盤移送裝置230如第4圖及第5圖所示,包括 轴方向軌道231,係在主基座1〇1和儲存器2ι〇之間沿著乂 軸方向設置;可動頭232,係在此χ轴方向軌道231上产 著X轴方向移動;z轴方向軌道233a、233b,係設置於可 動頭饥上;以及保持頭234A、mB,係在z轴方向 233A、233B上各自設置成可沿著Z軸方向移動。各保持頭 234A、234B 可沿菩 7 〇_ 伸 考Z軸方向彼此獨立地移動,而且為了 持訂製把盤KST而在下側具有開閉式的握持爪235。此外, 」個保持頭234A、234B因為經由z軸方向軌道233A、2咖 安裝於!個可動頭232,所以在水平方向無法獨立地移動以 此托盤移送裝置230可從已下降之昇降裝置22〇的工 作台挪握持訂製托盤说並移至儲存器如,或從 益210將訂製托盤m移至昇降裝置⑽的工作台μ。 在本實施形態之托盤移送裝置230如第4圖及第5圖 所示,具有可令_ 23“,朝向水平方向移 個可移動位置H。第〗可移動位置“ 裝置220的第1限制位置和第2限制位置匕之 間。而’第2可移動位置M2位於昇降裝置22〇的 …和儲存器210之間。在本實施形態,在儲存二 :=2規定…的工作台222之間,形成把盤移送 裝置230之保持頭234Α、234β可通過的大小之空間。 2247-9147-PF;Ahddub 13 1356908 本實施形態,令雙方之保持頭23〇、2綱位於第1 移動位置Μ,(或第2可移動位置Μ2)上之狀態朝向水平方 =動’在令一方之保持頭234Α位於第1可移動位置叫或 二可移動位置Μ〇而且令另-方之保持頭234Β位於第2 :動位置Μ2(或第!可移動位置Μι)之狀態,可令雙方的 保持碩234Α、234Β朝向水平方向移動。 又’例如在昇降裝置22〇昇降之期間,可在第2可移 動位置M2令第1及第 和' 弟及第2保持碩234A、234B水平移動,並 /貝J »式剛儲存器211或測★式穿棟左„。〇 ^ 〇 飞利忒兀*儲存益212上移動,而因為 可々保持頭襲、_沿著水平方向移動,而和昇降裝置 作《 222的位置無關,所以可縮短托盤搬運作業。 此外,在本發明,保持頭之個數未限定為2個,可移 動位置的個數亦未限定A ? a 疋為2個’亦可具備3词以上的保持 頭,亦可具備3個以上的可移動位置。 第8圖係表示本發日月夕& 本發明之其他的實施形態之電子元件測 =置的托盤搬運裝置之正視圖。在本發明之其他的實施 道第8圓所示’在托盤移送裝置⑽之^方向軌 ” 設置可沿著X軸方向獨立地移動的2個可動頭 觀、助,保持頭咖、2綱不僅2轴方向而且可严 著X轴方向彼此獨立地移動。 第9圖係表示本發明 Μ番m 發月之另外的實施形態之電子元件測 試裝置的托盤搬運裝置之正視圖。在本發明之其他的實施 形態’如第9圓所示,托盤蒋详护 1 丁托盤移送裝置23〇之各保持Further, the storage device 210 of the present embodiment corresponds to the storage means of the present invention, and the lifting device 22q of the present invention corresponds to the holding means of the present invention, and the tray transfer device of the present embodiment 230 is equivalent to one of the transfer means of the present invention. The storage 21G, as shown in FIG. 2 to FIG. 4, includes: a pre-test storage 211, which stores the loaded pre-test 1 (: the component's customized tray "a" and the tested storage 212, is loaded The ic component classified according to the test result. The pre-test storage 2n and the test-out storage 212 are each as shown in FIG. 6, including: a frame-shaped tray support frame 213; and an elevator 214 from which the tray support frame 213 The lower part enters and moves up and down. The pallet support C 213 stacks a plurality of custom pallets kst, and uses the elevator gw to move the stacked custom pallet KST up and down only. In this embodiment, the custom pallet KST is as shown in the figure. It is shown that although the 60 housing portions 91 for accommodating the 1C assembly are arranged in a row, there are actually various variations in the arrangement depending on the type of the Ic component. Because the pre-test storage 211 and the test storage are completed. Since the configuration of 212 is the same, the number of each of the pre-test storage 211 and the test storage 212 can be set to an appropriate number as needed. In the present embodiment, as shown in FIGS. 2 to 4, the test is performed. Pre-storage 2247-91 47-PF; Ahddub 11 1356908 • The device 211 is provided with one storage STK_B. On the other hand, eight storage units STK_1, STK-2.....STK-8 are set in the test storage 212 to • According to the test results, they can be classified into up to 8 types and stored. That is, in addition to the difference between the good products and the defective products, even in the good products, the speed of action can be classified as the medium speed of the south speed. Low speed, or even if it is not in the household, can be classified into the need to retest. After testing the storage 212, set between STK-4 and STK-5! Empty pallet storage STK-E. The empty tray storage unit STK-Ε, the stacking unit is sent to the empty custom tray KST of the unloading unit 400. The electronic component testing device of the present embodiment includes six lifting devices 220' at the loading unit as shown in Fig. 4 Each of the two window portions 306 which are open to the main base 1〇1 and the four window portions 406 which are opened in the main base 1〇1 of the unloading unit 400 are disposed in a total of six windows. As shown in FIG. 5, the device 220 is composed of the following members, and the z-axis direction rail 221 is disposed to hang down from the main base 101; The Taitung 222 is installed so as to be movable up and down along the z-axis direction rail 221, and the table 222 can be moved up and down between the first predetermined position η and the second predetermined position ih. The first predetermined position Hi is the Z of the table 222. The upper limit of the axial direction, when the work-station 222 is located at the first predetermined position H1, the customized tray KST faces the loading portion 300 via the window portion 306 (or the window portion 406) formed in the main base ι 1 (or The unloading unit 400). The second predetermined position Hz is a lower limit in the Z-axis direction of the table 222, and the table 211 is exchanged with the tray transfer device 230 in a state where the table 222 is located at the second predetermined position H2. . 2247-9147-PF; Ahddub υδ such that the lifting device 220 can move the customized tray between the storage portion 2〇〇 and the split portion 贱 or portion 400 by holding the _KST on the table 222 and moving up and down KST. As shown in FIGS. 4 and 5, the tray transfer device 230 includes an axial direction rail 231 disposed between the main base 1〇1 and the reservoir 2ι in the x-axis direction; the movable head 232 is here. The x-axis direction movement is produced on the x-axis direction rail 231; the z-axis direction rails 233a, 233b are set on the movable head; and the holding heads 234A, mB are respectively arranged along the z-axis directions 233A, 233B. Move in the Z axis direction. Each of the holding heads 234A, 234B is movable independently of each other in the Z-axis direction, and has an opening-and-closing grip claw 235 on the lower side for holding the disc KST. In addition, the "holding heads 234A, 234B are mounted on the rails 233A, 2 via the z-axis direction! The movable head 232 can not be moved independently in the horizontal direction. The tray transfer device 230 can hold the customized tray from the table of the lowered lifting device 22, and move to the storage unit, or from the benefit 210. The customized tray m is moved to the table μ of the lifting device (10). As shown in FIGS. 4 and 5, the tray transfer device 230 of the present embodiment has a position that can be moved to a movable position H in the horizontal direction. The first movable position "the first limit position of the device 220" Between the second limit position and the second limit position. And the 'second movable position M2 is located between the ... of the lifting device 22 and the reservoir 210. In the present embodiment, a space of a size through which the holding heads 234, 234β of the disk transfer device 230 can pass is formed between the table 222 storing the two:=2 specifications. 2247-9147-PF; Ahddub 13 1356908 In this embodiment, the state in which the holding heads 23〇 and 2 are located in the first moving position Μ, (or the second movable position Μ2) is oriented horizontally = moving 'in the order One of the holding heads 234 is located in the first movable position or the second movable position, and the other holding head 234 is in the second: moving position Μ 2 (or the movable position Μ ι), so that both sides can Keep the 234 Α, 234 Β moving horizontally. Further, for example, during the lifting and lowering of the lifting device 22, the first and the second and the second holdings 234A and 234B can be horizontally moved in the second movable position M2, and the storage device 211 or测★式穿栋左„.〇^ 〇飞利忒兀*Storage benefit 212 moves, and because it can keep head-on, _ moves in the horizontal direction, and the lifting device does not matter the position of 222, so Further, in the present invention, the number of holding heads is not limited to two, and the number of movable positions is not limited to A? a 疋 is two 'may also have three or more holding heads, and Fig. 8 is a front elevational view showing a tray transporting apparatus for measuring electronic components according to another embodiment of the present invention. Another embodiment of the present invention is shown. As shown in the eighth circle, the "direction of the tray transfer device (10)" is provided with two movable heads that can be independently moved in the X-axis direction, and the headgear and the two classes are not only in the two-axis direction but also can be strictly The X-axis directions move independently of each other. Fig. 9 is a front elevational view showing the pallet transporting apparatus of the electronic component measuring apparatus according to another embodiment of the present invention. In the other embodiment of the present invention, as shown in the ninth circle, each of the trays is transferred to the tray transfer device.
234B可同時握持3片 頌^34A 乃托盤KSTi-3,而且各昇降裝置22〇 2247-9147-PF;Ahddub 14 1356908 之作σ 222可保持2片訂製托盤KST2、訂製托盤KSTa。 因而,可減少托盤移送裝置230在和儲存器21〇之間交換 訂製托盤KST的次數。 此外在保持頭234A、234B保持的3片訂製托盤KSTi-3 之中最上段的訂製托盤KSTi,係為了防止IC組件從第2段 的訂製托盤KST2分散而用作蓋之空的訂製托盤。因而,保 持頭234A、234B將3片訂製托盤KSIV3移載至工作a M2234B can hold 3 pieces of 颂^34A at the same time as tray KSTi-3, and each lifting device 22〇 2247-9147-PF; Ahddub 14 1356908 σ 222 can hold 2 pieces of custom pallet KST2, custom pallet KSTa. Thus, the number of times the tray transfer device 230 exchanges the customized tray KST with the reservoir 21A can be reduced. Further, the uppermost custom tray KSTi among the three custom-made trays KSTi-3 held by the holding heads 234A, 234B is used as a cover for preventing the IC assembly from being dispersed from the second-stage custom tray KST2. Making trays. Thus, the holding heads 234A, 234B transfer the three custom-made trays KSIV3 to the work a M2
後,僅拿掉最上段的訂製托盤肌。在第9圖表示 H 保持頭234A拿掉最上段的訂製托盤KSL之狀態。順便地, 將此被拿掉之空的訂製托盤抓送回至空托盤儲存器抓 -E。 此外,在本發明,托盤移送裝置230的各保持頭234A、 234B同時保持之訂製托盤m的個數未限定為3個,亦可 作成可同時保持4個訂製托盤KST。一樣地,昇降裝置220 之工作台222同時保持之訂製托盤m的個數未限定為2 亦可作成可同時保持3個以上的訂製托盤〖Μ。 〈裝載部300> 第1〇圆係表示在本發明之實施形態的電子元件測試 裝置所使用之測試用托盤的分解立體圖。 上述之訂製托盤KST,利用設置於儲存部2〇〇和主基 座ιοί之間的乾盤移送裝置230,從主基座1〇1的下側搬 至裝載部3GG之2處的窗部3G6。接著,在此裝載部3〇〇, 組件搬運裝置310被裝入訂製托盤KST之1C組件-度移至 才义正盗(preclser)305’在此修正IC组件彼此之位置關 15 2247-9147-PF;Ahddub 係。然後,組件搬運裝晉 之1C組件換f於信+ 再將被移送至此校正器305 測·^用杠、;。裴载部30〇的測試用托盤tst» 測試用托盤TST如坌Ί n f3 Ρ ,Λ, ^ 第10圖所示,將框條13平行且蓉 間隔地設置於方形框. 卞仃且專 相對向的框12 U 19在框條W之兩側及和框條13 片“。利用這-框條二,各自等間隔地突出形成多片安裝 2片安裝片14,構成插之間或框條13和邊12a之間、及 得成插入件收容部15。 入件容部15 ’各自收容1個插入件16,此插 什丄b使用固定件〗7 ,、,、一一 午17以净動狀態安裝於2片安裝片14。 因而,在插入件 之兩鳊部,形成用以將該插入件16安 裝於安裝片14的安#不丨ϊ0 > 女 _ 裝孔19。這種插入件16如第1〇圖所 Γ在1個測試用托盤加安裝Μ個,並排列成4列16 行0 此外,將插入件16設為同一形狀、同一尺寸,在各你 件16收谷ic |且件。插入件16的Ic收容部18係因肩 於所收容之K組件的形狀而決定,在第1〇圖所示之例子 成為方形的凹部。 裝載。ί5 300如第2圖所示,包括組件搬運裝置31〇, ”將I c組件從訂製托盤KST換裝於測試用托盤丁灯。組件 搬運裝置310由以下之構件構成,2支γ軸方向軌道3", 係沿著Υ轴方向架設於主基座101上;可動臂312,儀可 沿著Υ轴方向在此γ轴方向軌道311上往復移動;可動頭 313’係由該可動臂312支持參可沿著χ軸方向移動;以及 吸附襯墊(未圖示),係在可動頭313朝下地排列成2列8 2247-9147-PF;Ahddub 16 器可上下移動,可 換裝於測試用托盤After that, only remove the uppermost custom tray muscle. Fig. 9 shows a state in which the H holding head 234A removes the uppermost custom tray KSL. By the way, the empty customized tray is taken back to the empty tray storage to catch -E. Further, in the present invention, the number of the customized trays m held by the respective holding heads 234A and 234B of the tray transfer device 230 is not limited to three, and four custom trays KST can be held at the same time. Similarly, the number of the customized trays m held by the table 222 of the lifting device 220 is not limited to two, and it is also possible to maintain three or more custom trays at the same time. <Loading Unit 300> The first round line shows an exploded perspective view of the test tray used in the electronic component testing apparatus according to the embodiment of the present invention. The above-described custom tray KST is moved from the lower side of the main base 1〇1 to the window part of the loading unit 3GG by the dry tray transfer device 230 provided between the storage unit 2〇〇 and the main base ιοί. 3G6. Next, at this loading portion 3, the component handling device 310 is loaded into the 1C assembly of the customized tray KST - the degree is moved to the preclser 305' where the corrected IC components are positioned relative to each other 15 2247-9147 -PF; Ahddub system. Then, the component handling device 1C component is replaced by the letter + and will be transferred to the corrector 305 for measurement and control. The test tray tst» of the load compartment 30〇TST»Test tray TST such as 坌Ί n f3 Ρ , Λ, ^ As shown in Fig. 10, the frame strips 13 are arranged in parallel and spaced apart in a square frame. The frame 12 U 19 is on both sides of the frame strip W and the frame strip 13 ". With this - frame strip 2, each of the two pieces of the mounting piece 14 is protruded at equal intervals to form an inter-plug or a frame strip. Between the 13 and the side 12a, and the insert receiving portion 15. The receiving portion 15' each accommodates one insert 16, and the inserted b uses a fixing member 〖7,,,, The movable state is attached to the two mounting pieces 14. Thus, at both ends of the insert, an insert is formed for mounting the insert 16 to the mounting piece 14. As shown in the first drawing, the piece 16 is attached to one test tray and arranged in four rows and 16 rows. In addition, the inserts 16 are set to the same shape and the same size, and each of the pieces 16 is received by the valley. The Ic accommodating portion 18 of the insert 16 is determined by the shape of the K component housed in the shoulder, and the example shown in Fig. 1 is a square recess. Loading ί5 3 00, as shown in Fig. 2, includes a component handling device 31, "replaces the Ic component from the custom tray KST to the test tray." The component handling device 310 is composed of the following members: two γ-axis directions 3" are mounted on the main base 101 along the x-axis direction; and the movable arm 312 can be tracked in the γ-axis direction along the z-axis direction. The movable head 313' is reciprocally moved; the movable head 313' is supported by the movable arm 312 so as to be movable along the x-axis direction; and the suction pad (not shown) is arranged in the movable head 313 downwardly in two rows of 8 2247-9147 -PF; Ahddub 16 can be moved up and down, can be replaced with test tray
行。各吸附襯墊利用未特別圖示的致動 5時將16個1 C組件從訂製托盤KST TST。 >如第2圖及第3圖所示,將校正器3〇5設置於 ::托盤KST和測試用托盤TST之間。校正器305雖未特 圍圖不…具有比較深的凹部,而此凹部之周邊由傾斜面包 。因!此,在令要從訂製托盤KST換裝於測 的1C組件移至測試用托盤m之前,因為藉由-度落入此 校正益305 ’而可正择地決u組件之彼此的位置關係, 所以可將IC組件尚精度地換裴於測試用托盤TST。 將1C組件收容於測試用托盤TST之全部的收容部^ 8 時,利用托盤搬運裝置102將,該測試用托盤TST搬入室部 10 0 内。 另一方面,訂製托盤KST所裝載之全部的1(:組件被換 裝於測試用牦盤TST時,昇降裝置220令該空的訂製托盤 KST下降,並將此空托盤交給托盤移送裝置23〇。托盤移送 裝置230將此空托盤暫時儲存於空托盤儲存器STK—E ,在 測試完儲存器212的訂製托盤KST裝滿1C組件後,將空托 盤供給該測試完儲存器212。 〈室部100> 上述之測试用托盤TST,在裝載部3q 〇被裝入I仁組件 後’被送入室部1〇〇’並在已被裝載於該測試用托盤TST 之狀態測試各IC組件。 室部100如第2圖及第3圖所示,由以下之構件構成, 2247-9147-PF;Ahddub 17 1356908 soak室11 〇,係對被裝入測試用托盤TST的Ic組件,施加 目標之高溫或低溫的熱應力;測試室丨2〇,係使在此扣以 室110處於被施加熱應力之狀態的IC組件接觸測試頭5; 以及unsoak室130,係從在測試室12.0已完成測試的ic 組件除去熱應力。 此外,unsoak室130係與soak室11〇或測試室12〇 熱絕緣較佳,實際上將soak室!〗0和測試室i 2〇之區域保Row. Each of the adsorption pads utilizes actuations 5 not specifically illustrated 5 to take 16 1 C components from the custom tray KST TST. > As shown in Figs. 2 and 3, the corrector 3〇5 is disposed between the ::tray KST and the test tray TST. Although the corrector 305 does not have a specific view, it has a relatively deep concave portion, and the periphery of the concave portion is made of a slanted bread. Because of this, before moving the 1C component to be tested from the custom pallet KST to the test tray m, since the correction factor 305' falls by the degree, the components of the u can be positively determined. Positional relationship, so the IC component can be accurately replaced with the test tray TST. When the 1C module is housed in all of the accommodating portions 8 of the test tray TST, the test tray TST is carried into the chamber portion 10 by the tray transport device 102. On the other hand, when all of the 1 loaded in the custom tray KST (the assembly is replaced with the test tray TST), the lifting device 220 lowers the empty customized tray KST, and delivers the empty tray to the tray. The device 23 is. The tray transfer device 230 temporarily stores the empty tray in the empty tray storage STK-E, and after the custom tray KST of the storage container 212 is filled to fill the 1C assembly, the empty tray is supplied to the test storage 212. <Room part 100> The test tray TST described above is loaded into the chamber portion 1〇〇 after the loading unit 3q is loaded into the I-in unit, and is tested in the state of being loaded on the test tray TST. IC component. As shown in Fig. 2 and Fig. 3, the chamber portion 100 is composed of the following members: 2247-9147-PF; Ahddub 17 1356908 soak chamber 11 〇, which is the Ic component that is loaded into the test tray TST. Applying the high temperature or low temperature thermal stress of the target; the test chamber 丨2〇 is such that the IC component in which the chamber 110 is in a state of being applied with thermal stress contacts the test head 5; and the unsoak chamber 130 is from the test chamber 12.0. The ic component that has been tested removes thermal stress. In addition, the unsoak room 130 11〇 or soak chamber and test chamber 12〇 preferred thermal insulation, actually soak chamber! 0〗 security area and the test chamber i 2〇
持高溫或低溫,雖然unsoak室13〇和這些熱絕緣,但是權 宜上將這些總稱為室部1 〇 0。 soak室110配置成比測試室12〇更向上方突出。而且 如第3圖之示意圖所示,將垂直搬運裝置設置於此s〇ak室 11〇的内部,在至測試室120變空為止之間,複數測試用 托盤TST -面由此垂直搬運裝置支持—面等待。主要在此 等待中對1C組件施加約— 55]50t之高溫或低溫的熱應 力。 • 纟測試室120,將測試頭5配置於其中央部,將測試 用托盤m搬至測試頭5之上方,並使_件的輸出入端 •子和測試頭5之插座5〇的接觸端子以電氣式接觸,藉此實 . 施IC組件之測試。 ·. ㈣對測試用托盤TST所附加的識㈣碼和在測試用 托盤TST之内部所指派的IC組件之號碼所決定的位址,將 此測試結果記憶於電子元件測試裝置之記憶裝置。 _〇心130亦和soak室1U) 一樣,配置成比測試 室120更向上方突出,如第3圖之示意圖所示,設置垂直 2247-9147-PF;Ahddub 18 1356908Holding high temperature or low temperature, although the unsoak chamber is 13 inches and these are thermally insulated, these are generally referred to as chambers 1 〇 0. The soak chamber 110 is configured to protrude upward from the test chamber 12A. Further, as shown in the schematic view of Fig. 3, the vertical conveying device is disposed inside the 〇〇ak chamber 11A, and between the test chamber 120 and the empty space, the plurality of test trays TST-surface are supported by the vertical conveying device. - Waiting. Mainly during this waiting, a high stress or low temperature thermal stress of about -55] 50t is applied to the 1C component. • 纟 test chamber 120, the test head 5 is placed at the center, the test tray m is moved above the test head 5, and the output terminal of the _ piece and the contact terminal of the socket 5 of the test head 5 are Electrically contacted to test the IC components. (4) The test result is stored in the memory device of the electronic component test device by determining the address of the identification (4) code attached to the test tray TST and the number of the IC component assigned to the inside of the test tray TST. _〇心130 is also arranged to protrude upward from the test chamber 120, as in the soak chamber 1U), as shown in the schematic diagram of Fig. 3, set vertical 2247-9147-PF; Ahddub 18 1356908
. 搬運裝置。而’在此unsoak室130,在soak室110對IC 組件已施加高溫的情況’利用送風將IC組件冷卻而回到室 . 溫後,將該已除熱的1C組件搬至卸載部4〇〇。另一方面, . 在soak室110對Ϊ C組件已施加低溫的情況,利用暖風或 • 加熱器萼將IC組件加熱至降到不會發生結露之程度的溫 度為止後,將該已除熱的1C組件搬至卸載部400。 在soak室110之上部,形成用以從主基座1〇1搬入測 。式用托盤TST的入口。一樣地,在uns〇ak室13〇之上部’ 攀 亦形成用以將測試用托盤TST搬至主基座101上的出口。 而,在主基座101上,設置用以經由這些入口或出口使測 試用托盤TST從室部100出入的托盤搬運裝置1〇2。此托 盤搬運裝置102例如由轉動滾輪等構成。利用此托盤搬運 裝置102,將從unsoak室130所搬出之測試用托盤TST, 、.’i由卸載部4〇〇及裝載部3〇〇送回soak室11 〇。 〈卸載部400> • 卸載部400係將測試完了之1C組件,從被搬至卸載部 400的測試用托盤TST,換裝於因應於測試結果的訂製托盤 KST 〇 :" 2圖所示,在卸載部400之主基座1〇1形成4個 .窗部406,其配置成從儲存部200被搬入卸載部4〇〇的訂 製托盤KST面臨主基座101之上面。 卸載部400包括組件搬運裝置41〇,其將測試完了之 1C組件從測試用托盤TST換裝於訂製托#如。此組件搬 、震置41 G由以下之構件構成,2支γ軸方向執道*】丄,係 2247-9!47-PF;Ahddub 19 1356908 沿者γ神 1 〜汚 m ί'τ、q 著Y轴方向在此Y轴方向軌违^ 视暹411上往復移動;可動頭 413’係由可動臂412支持成可丨儿装v + 取口著X軸方向移動;以及 16個吸附襯墊(未圖示),係在可叙 1宁在可動碩413朝下地按照2列 8行配置。各吸附襯墊利用夫牲 _ 王们用木特別圖不的致動器可沿著z 軸方向上下移動,可同時將16個τ r h μ μ ,. Handling device. In the case where the unsoak chamber 130 has applied high temperature to the IC module in the soak chamber 110, the IC assembly is cooled by the air supply and returned to the chamber. After the temperature, the de-heated 1C assembly is moved to the unloading unit 4 . On the other hand, in the case where the soak chamber 110 has applied a low temperature to the ΪC component, the heat is removed by using a warm air or a heater 萼 to heat the IC assembly to a temperature that does not cause condensation to occur. The 1C component is moved to the unloading unit 400. In the upper portion of the soak chamber 110, it is formed to carry in the measurement from the main base 1〇1. The entrance of the tray TST. Similarly, an upper portion of the uns〇ak chamber 13 is also formed as an outlet for moving the test tray TST to the main base 101. On the main base 101, a tray transporting device 1A2 for taking in and out of the test tray TST from the chamber portion 100 via these inlets or outlets is provided. This tray transporting device 102 is constituted by, for example, a rotating roller or the like. With the pallet transport device 102, the test trays TST, .'i carried out from the unsoak chamber 130 are returned to the soak chamber 11 by the unloading unit 4〇〇 and the loading unit 3〇〇. <Unloading Unit 400> The unloading unit 400 reloads the tested 1C component from the test tray TST moved to the unloading unit 400 to the custom pallet KST 〇:" in accordance with the test result. In the main base 1〇1 of the unloading unit 400, four window portions 406 are disposed, and the custom tray KST placed in the unloading portion 4 from the storage unit 200 faces the upper surface of the main base 101. The unloading portion 400 includes a component handling device 41 that replaces the tested 1C component from the test tray TST to a customized tray. This component is moved and dislocated 41 G consists of the following components, 2 γ-axis directions * 丄, 2247-9! 47-PF; Ahddub 19 1356908 γ 神 神 1 ~ 污 m ί'τ, q The Y-axis direction reciprocates in the Y-axis direction on the Si 411; the movable head 413' is supported by the movable arm 412 to be movable in the X-axis direction; and 16 adsorption pads (not shown), it is arranged in two rows and eight rows in the movable 413 downwards. Each of the absorbing pads can be moved up and down along the z-axis by an actuator that is specially illustrated by the wood. The τ r h μ μ can be simultaneously
個ι c組件 < 測試用托盤TsT 換裝於訂製托盤KST » 如第4圖及第5圖所示,在各個窗部406之下側,設 •置用以令訂製托盤kst昇降之昇降裝s 22〇,在此,放置 裝滿測試完了之ic組件的訂製托盤KST再下降,並將此滿 載托盤交給托盤移送裝置230。 順便地,在本實施形態的電子元件測試裝置,雖然可 分類之種類最多係8種,但是因為在卸載部4〇〇僅在4處 形成窗部406,所以在卸載部4〇〇最多只能配置4個訂製 托盤KST。因此,可即時分類之種類被限制成4種。一般, 籲雖然將良品分類成動作速度為高速、中速、低速之3種, 再加上不良品共4種即夠了,但是有不常發生之例如需要 再測試等不屬於上述的種類之情況。 - 如此,在發生被分類成被指派給在卸載部400之窗部 • 406所配置之4個訂製把盤KST以外的種類之1(:組件的情 況,從卸載部400將1個訂製托盤KST送回儲存部2〇〇, 替代之,將被指派新產生之種類的訂製托盤KST轉送至卸 载部400,並儲存IC組件即可。但,在此情況,必須將分 類作業中斷,而有生產力降低的問題。因而,在本實施形 2247-9i47-PF;Ahddub 20 1356908 態之電子元件測試裝置’作成將緩衝部4〇5設置於卸載部 4〇〇之測試用托盤TST和窗冑4()6之間,並將不常發生之 種類的IC組件暫存於此緩衝部4 〇 5。 又,在實施形態,因為托盤移送裴置23〇和昇降裝置 220可同時移動而不會發生彼此干涉,.所以在為了切換被 指派給窗部406之種類而更換訂製托盤—時,亦可縮短 托盤搬運時間。 ,'人說明在本發明之實施形態的電子元件測試裝置 之托盤搬運方法。 第11A圖〜第iil圖係表示本實施形態之托盤搬運方法 的第1例之模式圖(之卜12)。首先,參照第…圖〜第m 圖’說明將在圖中利用最左側之第!昇降裝置22Qa保持並 位於窗部406之滿載的訂製托盤肌回收於測試完了儲存 器STK-2’巾且從空托盤儲存器STK—E將空的訂製托盤 KSTe供給該第1窗部4〇6a之例子。此外,在以下之說明,The ι c component < test tray TsT is replaced by the custom tray KST » As shown in Figs. 4 and 5, on the lower side of each window portion 406, the setting is used to make the custom tray kst lift The lifting device s 22 〇, here, the custom tray KST filled with the tested ic component is lowered again, and the full loading tray is delivered to the tray transfer device 230. By the way, in the electronic component testing device of the present embodiment, the number of types that can be classified is up to eight. However, since the window portion 406 is formed only at four places in the unloading portion 4, the unloading portion 4 can only be used at most. Configure 4 custom pallets KST. Therefore, the types that can be sorted in real time are limited to four types. In general, although the quality is classified into three types of high-speed, medium-speed, and low-speed, and four types of defective products are sufficient, there are some types that do not often occur, such as retesting. Happening. - In the case where one of the types of the four custom pallets KST assigned to the window portion 406 of the unloading unit 400 is generated (in the case of a component, one is ordered from the unloading unit 400). The tray KST is sent back to the storage unit 2, and instead, the custom-made tray KST assigned to the newly generated type is transferred to the unloading unit 400, and the IC component is stored. However, in this case, the sorting operation must be interrupted. In the present embodiment, the electronic component testing device of the state 2247-9i47-PF; Ahddub 20 1356908 is configured to provide the buffer portion 4〇5 to the test tray TST and the window of the unloading portion 4〇〇. Between 4()6, the IC component of the type that does not occur frequently is temporarily stored in the buffer portion 4〇5. Further, in the embodiment, since the tray transfer device 23〇 and the lifting device 220 can be simultaneously moved without Interference with each other occurs. Therefore, when the order tray is replaced in order to switch the type assigned to the window portion 406, the tray conveyance time can be shortened. "The person describes the tray of the electronic component test device according to the embodiment of the present invention. Handling method. Figure 11A~ The iil diagram shows a schematic diagram of a first example of the pallet transport method according to the present embodiment (b). First, the first to third embodiment of the lift device 22Qa will be described with reference to the first to fourth views. The custom-made tray muscle held and placed at the window portion 406 is recovered from the test STK-2' towel and supplied to the first window portion 4〇6a from the empty tray storage STK-E. An example. In addition, in the following description,
將第11A圖〜第12N圖中所示的4台昇降裝置從左側依序稱 為第1~第4昇降裝置22〇a〜22〇d,將該圖中所示的2個保 持頭從左側依序稱為第卜第2保持頭234A、234B。 心出第1昇降裝置220a所保持之訂製托盤KST的更換 要求時’首先mu圖所示,帛i昇降裝置22〇a開始 下降在此第1昇降裝置220a下降之期間,如第11B圖所 不’第1保持頭234A開始上昇,而且第2保持頭234B開 始下降第1昇降褒置220a下降至第2限制位置H2後停 止,而第i保持頭234A上昇至第丄可移動位置1後停止。 2247-9147-PF;Ahddub 21 1356908 又,第2保持頭234B下降至空托盤儲存器STK_E後停止, 並握持位於最上段之空的訂製托盤KSTe。 如此,在本實施形態,因為令第】昇降裝置22〇a和第 1及第2保持頭234A、23仙同時移動,所以可縮短托盤搬 運時間》 接著,如第11C圊所示,第2保持頭234B上昇至第2 可移動位置m2後,如第11D圖所示,第】及第2保持頭 234A、234B沿著水平方向移動,以使第i保持頭234八位 於第1昇降裝置220a之上方。此時,如該圖所示,第“呆 持頭234A在第!可移動位置⑷朝向水平方向移動,而且 第2保持頭234B在第2可移動位置朝向水平方向移動。 然後,如第11E圖所示,第1保持頭234A下降,並從 第1昇降裝置220a接受滿載的訂製托盤,而且 持頭咖上昇至第1可移動位置^止。在此’在本實 2態,因為令第1保持頭灿和第2保持頭mB同時 移動,所以可縮短托盤搬運時間。如第UF圖所示, =降裝W滿載的訂製把盤饥後,第i保持頭 34A亦上昇至第1可移動位置M,為止。The four lifting devices shown in FIGS. 11A to 12N are sequentially referred to as first to fourth lifting devices 22〇a to 22〇d from the left side, and the two holding heads shown in the drawing are from the left side. It is referred to as a second second holding head 234A, 234B. When the request for replacement of the order tray KST held by the first lifting device 220a is requested, the first lifting device 22A starts to descend during the lowering of the first lifting device 220a as shown in FIG. 11B. The first holding head 234A starts to rise, and the second holding head 234B starts to descend, and the first lifting head 220a is lowered to the second restriction position H2, and then stops, and the i-th holding head 234A rises to the third movable position 1 and then stops. . 2247-9147-PF; Ahddub 21 1356908 Further, the second holding head 234B is lowered to the empty tray accumulator STK_E, and is stopped, and the custom tray KSTe located in the uppermost space is held. In this embodiment, the first lifting device 22A and the first and second holding heads 234A and 23 are simultaneously moved, so that the pallet conveying time can be shortened. Next, as shown in FIG. 11C, the second holding is performed. After the head 234B is raised to the second movable position m2, as shown in FIG. 11D, the first and second holding heads 234A, 234B are moved in the horizontal direction so that the i-th holding head 234 is located in the first lifting device 220a. Above. At this time, as shown in the figure, the "holding head 234A moves in the horizontal direction in the first! movable position (4), and the second holding head 234B moves in the horizontal direction in the second movable position. Then, as shown in Fig. 11E As shown in the figure, the first holding head 234A is lowered, and the fully loaded custom tray is received from the first lifting device 220a, and the head coffee is raised to the first movable position. Here, in the second state, because (1) The head holding can be moved at the same time as the second holding head mB, so that the tray handling time can be shortened. As shown in the UF figure, the ith holding head 34A is also raised to the first one after the aging of the full-loading Move position M, so far.
接著,如第11G圖所示,第丨及笛 .m 乐1及第2保持頭234A、234B 在第1可移動位置Mi朝向水平方向& # y 万向移動,以使第2保持頭 234B位於第!昇降裝置2心之 碩 於坌ism# 第2保持頭234B位 於第1昇降裝置220a之上方後,如 竖0 j 第1 Η圖所示,第1及 第2保持頭234Α、234Β開始 及 5 ^ . ⑨第1保持頭234Α下降 至第2可移動位置後停止。又, 矛Ζ保持頭234Β下降 2247-9l47-PF;Ahddub 22 1356908 =i ::裝置22〇a後停止,並將空的訂製托 ;:=L?22Ga。在此,在本實施形態,因為令第! 盤搬運時間第2保持頭2綱同時移動,所以可縮短托 可㈣接㈣广㈣1 9ς,Λ 第UJ圖所不,第1及第2保持頭 於二34B朝向水平方向移動,以使第1保持頭難位 二測式元了儲存器STK—2之上方。此時,如該圖所示,第 1保持頭234A在第2可銘會μ ± *第2了移動位置I朝向水平方向移動,而 第2保持頭234Β在第i可移動位置Mi朝向水平方向移動。 /第1保持頭234A位於測試完了儲存n STK - 2之上方 後,如第ιικ圖所示,第!及第2保持頭234Α、234β下降, :亡第1昇降裝置220a上昇。第1保持頭⑽下降至測 ^了儲存器饥—2後停止,並將滿載的訂製托盤肌 乂給測試完了儲存器STK—2。第2保持頭 可移動位置心後停止。 如此’在本實施形態’因為令第】昇降裝置2心和第 及第2保持頭234A、234B同時移動,所以可縮短托盤搬 運時間。 〇然後’如第11L圖所示,第1保持頭234A上昇至第2 可移動位i M2為止,而且第i昇降裝置上昇至第】 J位置Hi為止。在此狀態,因為空的訂製托盤π。由第 1昇降裝置220“呆持’並經由窗部4〇6面臨卸載部4〇〇, 而且滿載的訂製托盤以1儲存於測試完了儲存器stk_2, 2247-9i47-pF;Ahddub 23 ^56908 所以完成—連串之托盤搬運作業。 法J12A圖〜第卿係表示在本實施形態之托盤搬運方 Γ:圖二之模式圖(之卜14)。其次,參照… 之滿恭月將利用第2昇降裝置2施保持並位於窗部406 ’的訂製托盤抓回收於测試完了儲存器STK—2,而 ,窗=托盤、存器STK—E將空的訂製托盤抓供給該第2 _ 40 6b之例子。 如第12A圖所示’首先’第2昇降裝置22此開始下降。 :此第2昇降裝置拠下降之期間,如第m圖所示,位 =托盤儲存器STK—E之上方的第2保持頭測亦開始 。第2昇降裝置22Gb下降至第2限制位置化後停止。 又,第2保持頭234B下降至空把盤儲存器抓―e後停止, 並握持位於最上段之空的訂製托盤KSTe。 如此’在本實施形態’因為即使第1保持頭234A位於 第严昇降裝置220b之正下’第2昇降褒置⑽和第"呆 持頭234B亦不會發生干涉,而可令第2昇降裝置2撕下 降’又,因為令第2昇降裝置22Gb和第2保持頭234β同 時移動,所以可縮短托盤搬運時間。 、順便地’在未具有第2可移動位置M2之以往的托盤搬 運裳置,若不是在第2保持頭234B從空托盤儲存器STK_ E接受空的訂製托盤抓’。及第2保持頭234a、難 再從第2昇降裝置22Gb之正下退避後,第2昇降裝置襲 無法開始下降,這成為在托盤搬運作業的等待時間。 接著,如第12C圖所示,第2保持頭2346上昇至第2 2247-9147-PF;Ahddub 24 1356908 可移動位置Ms後,如第19n 234A,沿著水平方向:動 離第2昇降裝置22〇b 1保持頭234A脫 234A、234B都在第2可移此時’第1及第2保持頭 移動位置Mz朝向水平方向移動。 然後’如第12E圖所示,埜,Λ α士 可蒋叙仞番Μ 第1保持頭234Α上昇至第夏Next, as shown in FIG. 11G, the second and second holding heads 234A and 234B are moved in the horizontal direction &# y in the first movable position Mi so that the second holding head 234B is moved. Located in the first! The second holding head 234B is located above the first lifting device 220a, and as shown in the first figure, the first and second holding heads 234Α, 234Β start and 5^ . 9 The first holding head 234 Α is lowered to the second movable position and then stopped. Also, the spear keeps the head 234Β down 2247-9l47-PF; Ahddub 22 1356908 =i: after the device 22〇a stops, and the empty order is placed;:=L?22Ga. Here, in the present embodiment, since the second holding head 2 is moved at the same time, the tray can be shortened, and the fourth and second holding heads can be shortened. The second 34B is moved in the horizontal direction so that the first holding head is difficult to be positioned above the reservoir STK-2. At this time, as shown in the figure, the first holding head 234A moves in the horizontal direction at the second immovable position μ±*, and the second holding head 234 is oriented in the horizontal direction at the i-th movable position Mi. mobile. / The first holding head 234A is located after the test is stored above n STK - 2, as shown in the figure ικ, first! The second holding heads 234A and 234β are lowered, and the first lifting device 220a is lowered. The first holding head (10) is lowered to stop after the storage hunger-2, and the fully loaded custom tray muscles are tested to the storage STK-2. The second holding head can be moved after the position is stopped. Thus, in the present embodiment, since the first lifting device 2 and the second holding heads 234A and 234B are simultaneously moved, the tray transporting time can be shortened. Then, as shown in Fig. 11L, the first holding head 234A rises to the second movable position i M2, and the i-th lifting device rises to the seventh position Hi. In this state, because of the empty custom tray π. The first lifting device 220 is "stayed" and faces the unloading portion 4 via the window portion 4〇6, and the fully loaded customized tray is stored in the tested memory stk_2, 2247-9i47-pF; Ahddub 23 ^ 56908 Therefore, the completion - a series of pallet handling operations. The method of the J12A to the syllabary is shown in the pallet transporting method of the present embodiment: the pattern diagram of Fig. 2 (b. 14). Secondly, the reference is made by the full moon. 2 The lifting tray 2 holds and the customized tray located at the window portion 406' is recovered and recovered in the tested storage STK-2, and the window=tray, the storage STK-E supplies the empty customized tray to the second _ 40 6b example. As shown in Fig. 12A, 'first' the second lifting device 22 starts to descend. : During the lowering of the second lifting device, as shown in the mth figure, the position = tray storage STK-E The second holding head is also started. The second lifting device 22Gb is lowered to the second limit position and then stopped. Further, the second holding head 234B is lowered to the empty disk storage device, and then stopped and held. The uppermost empty custom tray KSTe. Thus 'in this embodiment' because even the first holding head 234 A is located immediately below the stern lifting device 220b. The second lifting device (10) and the "holding head 234B" do not interfere, and the second lifting device 2 can be torn off. Again, because the second lifting device is made Since the 22Gb and the second holding head 234β move at the same time, the pallet transport time can be shortened. By the way, the conventional pallet transporting without the second movable position M2 is stored in the empty tray unless the second holding head 234B is stored. When the STK_E receives the empty custom-made tray gripper. and the second holding head 234a is difficult to retreat from the second lifting device 22Gb, the second lifting device cannot start to descend, which becomes a waiting for the pallet handling operation. Next, as shown in Fig. 12C, the second holding head 2346 rises to the 2nd 2247-9147-PF; the Ahddub 24 1356908 moves the position Ms, as in the 19n 234A, along the horizontal direction: the second lift The device 22〇b 1 holds the head 234A off 234A and 234B at the second movable position. The first and second holding head moving positions Mz move in the horizontal direction. Then, as shown in Fig. 12E, the wild, Λα士Can Jiang Xuan Panyu the first to keep head 234 Α rise to the summer
了移動位置Μ,後,如第12F 234A ' έ 斤不第1及第2保持頭 d4A 234B朝向水平方向蒋叙,,v社# m 移動U使第1保持頭位 :第昇降裝置魏的上方。此時, 持頭234A在第!可移動 弟1保 保持頭咖在第水平方向移動’而第2 弘矛z j移動位置齒— £M2朝向水平方向移動。 第2昇第⑽圖所示,第1保持頭234A下降,並從 捭涵„ 2〇b接党滿載的訂製托盤KSTf,而且第2伴 t頭2糾上昇至第1可移動…為止。在此,:二 沪叙α 和第2保持頭234Β同時 =,所以可縮短托盤搬運時間。如帛 . 保持頭234Α從第2昇降裝置22 斤丁第1 後,嗲篦1 & & 接又滿載的訂製托盤KSTf 俊及第1保持頭234A亦上昇至坌! π 接莫“ I上昇至第1可移動位置Μ,為止。 接者,如第121圖所示,第丨及第 在第丨兄教& 夂弟2保持頭234Α' 234Β 移動位置Μι朝向水平方向移叙、 2S4R ^ 〇 動’以使第2保持頭 234B位於第2昇降裝置2m之上 於第2昇降裝置㈣之上方後,如第i第^呆持頭_位 第2保持頭234Α、23_始 所不,第1及 5 ^ ο -Γ ^ ^ 乐1保持頭234Α下降 至第2可移動位置Μ2後停止。又, 5 ^ 9 = ^ 保持頭234Β下降 至第2昇降裝置220b後停止,並將★ 肘二的訂製托盤KSTe交 2247-9l47-pF;Ahddub 25 1356908 給第2昇降裝置22〇b。 保持頭234… Μ在本貫施形態,因為令第i 盤搬運時間。 _移動’所以可縮短括 可移二如/⑽圖所示’第^持…上昇至第丨 移動位置1後,如第m圖所示 234A ' ?^au i 第1及第2保持頭 朝向水平方向移動,以使第i 於測t式士 τ杜— 保持頭234Α位 !保:= 2之上方。此時,如該圖所示,第 第2俾拉 可移動位置Μ2朝向水平方向移動,而 第2:持—第i可移動位置Μι朝向水平方向移動。 第1保持頭234A位於測試完了儲存器STK—2之上方 第⑽圖所示’第1及第2保持頭234A、234B下降, =第2昇降裝置22〇b上昇。第i保持頭繼下降至測 =了儲hSTK-2後停止,並將滿載的訂製托盤抓 二::5“了儲存器STK—2。第2保持頭綱下降至第2 可移動位置&後停止。 如此’在本實施形態’因為令第2昇降裝置⑽和第 =第2保持頭234A、襲同時移動,所以可縮短 運時間。 然後,如第12N圖所示,fl保持頭234八上昇至第2 可移動位i M2為止’而且第2昇降裝置2鳩上昇至第丄 限制位置Η,為止。在此狀態’因為空的訂製托盤〖π由第 2昇降裝置220b保持,並經由窗部_面臨卸載部4〇〇, 而且滿載的訂製托盤!^心儲存於測試完了儲存器STK—2, 所以完成一連串之托盤搬運作業。 2247-9147-PF;Ahddub 26 1356908 具有=方托盤移送裝置230 向移動之在垂直方向的2個可移動位置 Μ”所以托㈣送裝置23Q和昇降裝置220可同時移動, 而不會發生干涉’並可縮短托盤搬運時間。 此外,以上所說明之實施形態係為了易於理解本發明 =:Γ不是用以限定本發明的。因此,在上述之實施 圍;;入的各元件,係亦包含有屬於本發明之技術性範 圍的王部之設計變更或相當物的主旨。 例如亦可以如下的f 拔士、 鬆_構_ W式構成’將如浮動接頭或上鎖及 ,曰距變換機構設置於保持頭234a ,保持頭二 測, 置220或儲存器21G ’而將各保持頭234A、 - 昇降裝置22G或儲存器210。因而,第i 頭234A和第2保持頭234B可同時接近昇降# 、、 在g 9ln J N旰接近昇降裝置220或儲 ’而可更縮短托盤搬運時間。 【圖式簡單說明】 第1圖係表示本發明之實施形態的電 之整體的側視圖。 仟m置 第2圖係第1圖之電子元件測試震置的立體圖。 第3圖係表示在第1圖 件測試裝置的托盤之 處理方法的示意圖。 之係表示本發明之實施形態的電子元件測試裝置 之儲存部的正視圖。 27 2247-9147-PF;Ahddub 1356908 第5圖係表示本發明之實施形態的電子元件測試裝置 之儲存部的側視圖。 第6圖係表示在本發明之實施形態的電子元件測試裝 置所使用之ic儲存器的分解立體圖。 第 圖係表示在本發明之實施形態的電子元件測試事 置所使用之訂製托盤的立體圖。 、 第8圖係表示本發明之其他的實施形態之電子元件測 试裝置的儲存部之正視圖。 第9圖係表示本發明之另外的實施形態之電子元件測 試裝置的儲存部之正視圖。 第10圖係表示在本發明之實施形態的電子元件測試 裝置所使用之測試用托盤的分解立體圖。 第11A圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝晉+ 4 吐Λ ^ 心展罝的托盤搬運方法之第〗例的模式圖(之After moving the position Μ, after the 12F 234A ' έ 斤 不 不 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 . At this point, hold the head 234A at the first! The movable brother 1 keeps the head coffee moving in the horizontal direction' while the 2nd Hong spear z j moves the position tooth - the £M2 moves in the horizontal direction. As shown in the second liter (10), the first holding head 234A is lowered, and the custom tray KSTf that is fully loaded is attached from the 捭 „ 2〇b, and the second accompaniment t head 2 is corrected to the first movable position. Here, the two-segment α and the second holding head 234 are simultaneously =, so that the pallet handling time can be shortened. For example, the head 234 is held from the second lifting device 22, after the first one, 嗲篦1 && The fully loaded custom tray KSTf and the first holding head 234A also rise to 坌! π "I rise to the first movable position Μ". As shown in Fig. 121, the third and the second brothers & brother 2 keep the head 234 Α ' 234 Β move position Μ move toward the horizontal direction, 2S4R ^ ' ' to make the second hold head 234B Located on the second lifting device 2m above the second lifting device (4), if the i-th holding head _ position second holding head 234Α, 23_ is not, first and fifth ^ ο -Γ ^ ^ The music 1 keeps the head 234 Α down to the second movable position Μ 2 and stops. Further, 5 ^ 9 = ^ holds the head 234 Β down to the second lifting device 220b, and then stops the custom tray KSTe of the elbow two 2247-9l47-pF; Ahddub 25 1356908 to the second lifting device 22〇b. Keeping the head 234... It is in the form of the present, because the i-th disk is transported. _Move' so can be shortened as shown in the figure / (10) as shown in the figure below, after the first move to the first position, as shown in the mth figure, 234A '?^au i the first and second heads are oriented Move in the horizontal direction so that the i-th is measured by the t-type τ Du - keep the head 234 !! Guarantee: = 2 above. At this time, as shown in the figure, the second movable position Μ2 is moved in the horizontal direction, and the second:-i-th movable position is moved in the horizontal direction. The first holding head 234A is located above the tested memory STK-2. The first and second holding heads 234A and 234B are lowered as shown in the figure (10), and the second lifting device 22〇b is raised. The i-th holding head continues to descend to the test = stop after storing hSTK-2, and the fully loaded custom tray is grabbed two:: 5 "storage STK-2. The second holding head descends to the second movable position & In the present embodiment, the second lifting device (10) and the second holding head 234A are simultaneously moved, so that the running time can be shortened. Then, as shown in Fig. 12N, the holding head 234 is held. 8 is raised until the second movable position i M2' and the second lifting device 2 is raised to the second limit position Η. In this state, the empty custom tray π is held by the second lifting device 220b, and Through the window portion _ facing the unloading portion 4〇〇, and the fully loaded customized tray is stored in the tested STK-2, a series of pallet handling operations are completed. 2247-9147-PF; Ahddub 26 1356908 has = square The tray transfer device 230 moves to the two movable positions in the vertical direction, so that the tray (four) feeding device 23Q and the lifting device 220 can be simultaneously moved without interference, and the tray handling time can be shortened. Further, the embodiments described above are for easy understanding of the present invention =: not intended to limit the present invention. Therefore, the components included in the above-mentioned embodiments include the design changes or equivalents of the kings belonging to the technical scope of the present invention. For example, the following f-battery, loose-fitting, and the like may be configured such that the floating joint or the locking mechanism, the pitch-changing mechanism is disposed on the holding head 234a, and the head is measured, 220 or the reservoir 21G' Each holding head 234A, - lifting device 22G or reservoir 210. Therefore, the i-th head 234A and the second holding head 234B can approach the lift # at the same time, and approach the lifting device 220 or the storage at g 9ln J N旰 to shorten the pallet carrying time. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a side view showing the entirety of an electric power according to an embodiment of the present invention.仟m setting Fig. 2 is a perspective view of the electronic component test of the first figure. Fig. 3 is a view showing a method of processing the tray of the test apparatus of the first drawing. The front view of the storage unit of the electronic component testing device according to the embodiment of the present invention is shown. 27 2247-9147-PF; Ahddub 1356908 Fig. 5 is a side view showing a storage portion of the electronic component testing device according to the embodiment of the present invention. Fig. 6 is an exploded perspective view showing an ic storage device used in the electronic component testing device according to the embodiment of the present invention. The drawing is a perspective view showing a custom tray used in the electronic component test of the embodiment of the present invention. Fig. 8 is a front view showing a storage portion of an electronic component measuring apparatus according to another embodiment of the present invention. Fig. 9 is a front elevational view showing the storage portion of the electronic component measuring apparatus according to another embodiment of the present invention. Fig. 10 is an exploded perspective view showing a test tray used in the electronic component testing device according to the embodiment of the present invention. Fig. 11A is a schematic view showing the first example of the tray transporting method of the electronic component testing device according to the embodiment of the present invention.
第11C圖係表示本發明 置之托盤搬運裝置的托盤搬 3)0 之實知形態的電子元件測試裝 運方法之第1例的模式圖(之 第11Β圖係表示本發明 置之托盤搬運裝置的托盤搬2)。 之實施形態的電子元件測試裝 運方法之第1例的模式圖(之 的電子元件測試裝 1例的模式圖(之 第π D圖係表示本發明之實施形態 置之托盤搬運裝置的托盤搬運方法之第 4)。 2247-9l47-PF;Ahddub 28 1356908 ' 第11E圖係表示本發明之實施形態的電子元件測試事 置之托盤搬運裝置的托盤搬運方法之第1例的模式圖(之 • 5) ° *· 第11F圖係表示本發明之實施形態的電子元件測試茫 • 置之托盤搬運裝置的托盤搬運方法之第1例的模式圖 6) ° 第11G圖係表示本發明之實施形態的電子元件測試事 置之托盤搬運裝置的托盤搬運方法之第丨例的模式圖(之 • 7)。 第11Η圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第丨例的模式圖(之 8) ° 第111圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第i例的模式圖(之 9) ° 鲁第11J圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第J例的模式圖(之 10) ° .第11K圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第丨例的模式圖 11) ° 第11L圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第〗例的模式圖(之 12) 〇 2247-9147-PF;Ahddub 29 1356908 的電子元件測試裝 2 ·例的模式圖(之 的電子元件測試裝 2例的模式圖(之 第i2A圖係表示本發明之實施形態 置之托盤搬運裝置的托盤搬運方法之第 1)。 第12B圖係表示本發明之實施形態 置之托盤搬運裝置的托盤搬運方法之第 2)。 弟仏圖係表示本發明之實施形態的電子元件測11C is a schematic view showing a first example of a known electronic component test and shipping method of the tray transporting device 3) of the present invention (the 11th drawing shows the tray transporting device of the present invention) Tray transfer 2). A schematic diagram of a first example of an electronic component test and shipping method of the embodiment (a schematic diagram of an example of an electronic component test package (the πth diagram shows a tray conveyance method of the tray conveyance device according to an embodiment of the present invention) 4th). 2247-9l47-PF; Ahddub 28 1356908' Fig. 11E is a schematic view showing a first example of the tray transporting method of the pallet transporting device of the electronic component testing device according to the embodiment of the present invention (5th aspect) Fig. 11F is a schematic view showing a first example of the method of transporting the electronic component of the embodiment of the present invention. Fig. 11G is a view showing an embodiment of the present invention. A schematic diagram of the example of the pallet handling method of the pallet handling device for electronic component testing (7). FIG. 11 is a schematic view showing a third example of a tray transporting method of a pallet transporting device of an electronic component testing device according to an embodiment of the present invention. FIG. 111 is a view showing an electronic component testing apparatus according to an embodiment of the present invention. Mode of the first example of the tray transporting method of the pallet transporting device (9) ° FIG. 11J is a view showing the mode of the J example of the pallet transporting method of the pallet transporting device of the electronic component testing device according to the embodiment of the present invention. Fig. 11A is a schematic view showing a third example of the tray transporting method of the pallet transporting device of the electronic component testing device according to the embodiment of the present invention. FIG. 11L is a view showing an embodiment of the present invention. Schematic diagram of the example of the tray handling method of the pallet handling device of the electronic component testing device (12) 〇 2247-9147-PF; Ahddub 29 1356908 electronic component test device 2 · Example of the schematic diagram (the electronic component of the electronic component A schematic diagram of two examples of test equipment (the i2A diagram shows the first embodiment of the tray transport method of the pallet transport device according to the embodiment of the present invention). Fig. 12B shows the present invention. The second tray conveying method of the embodiment of the pallet conveying apparatus according to the set). The figure shows the electronic component measurement of the embodiment of the present invention.
置之托盤搬運裝置的托盤搬運方法之帛2例的模式圖(: 3)。 第12D圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(之 4) 。 第12E圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(之 5) 。 第12F圖係表示本發明之實施形態的電子元件測試褒 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(之 6 ) 〇 ' 第1 2 G圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(之 7)。 第12H圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(之 8)。 2247-9147-PF;Ahddub 30 1356908 第121圖係表示本發明之實施形態的電子元件測試裝 之 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(、 9 ) ° 第12J圖係表示本發明之實施形態的電子元件測試裝 之 置之托盤搬運裝置的托盤搬運方法之第2例的模式圖(、 10)。 、 第12K圖係表示本發明之實施形態的電子元件測試裝A schematic diagram of two examples of pallet handling methods for pallet handling equipment (: 3). Fig. 12D is a schematic view showing a second example of the tray transporting method of the pallet transporting device of the electronic component testing apparatus according to the embodiment of the present invention (4). Fig. 12E is a schematic view (No. 5) showing a second example of the tray transporting method of the pallet transporting device of the electronic component testing apparatus according to the embodiment of the present invention. Fig. 12F is a schematic view showing a second example of the tray transporting method of the tray transporting device of the electronic component testing device according to the embodiment of the present invention (6). Fig. 1 2G is a view showing an embodiment of the present invention. A schematic diagram (No. 7) of the second example of the tray transporting method of the pallet transporting device of the electronic component testing device. Fig. 12H is a schematic view (No. 8) showing a second example of the tray transporting method of the pallet transporting apparatus of the electronic component testing apparatus according to the embodiment of the present invention. 2247-9147-PF; Ahddub 30 1356908 Fig. 121 is a schematic view showing a second example of the tray transporting method of the electronic component test device according to the embodiment of the present invention (Fig. 9) A schematic view (10) of a second example of the tray transport method of the tray transport device in the electronic component test device according to the embodiment of the present invention. 12K shows an electronic component test device according to an embodiment of the present invention
置之托盤搬運裝置的托盤搬運古法0 J 盟微連方法之第2例的模式圖(之 11)° 第12L圖係表示本發明之實施形態的電子元件測試裝 置之托盤搬運裝置的托盤搬運方法之帛2例的模式圖(: 12)。 第12Μ圖係表示本發明之實施形態的電子元件測試襄(1) of the second example of the method of the tray transporting apparatus. The 12L diagram shows the pallet transport of the pallet transport apparatus of the electronic component test apparatus according to the embodiment of the present invention. The method is based on a pattern of 2 cases (: 12). Figure 12 is a diagram showing an electronic component test according to an embodiment of the present invention.
置之托盤搬運裝置的托盤搬運方法之帛2例的模式圖J 13)。 ^ 第12Ν圖係表示本發明之實施形態的電子元件測試裝 1 置)之托盤搬運裝置的托盤搬運方法之帛2例的模式圖(: 主要元件符號說明】 1〜處理器; 200〜儲存部; 220〜昇降裝置; 2 2 2〜工作台; 1 0 0〜室部; 210〜儲存器; 221〜Ζ軸方向軌道; 230〜托盤移送裝置; 31 2247-9147-PF;Ahddub 1356908 231~X軸方向軌道; 233A、233B〜Z軸方向執道 235〜保持爪; 4 0 0 '•卸載部; TST〜測試用托盤; 232〜可動頭; 234A、234B〜保持頭.; 300〜裝載部; 5~測試頭; KST〜訂製托盤。The pattern diagram of the tray handling method of the pallet handling device is shown in Fig. J 13). Fig. 12 is a schematic view showing two examples of the tray transporting method of the pallet transporting device of the electronic component testing apparatus according to the embodiment of the present invention (: main component symbol description) 1 to processor; 200 to storage section 220 ~ lifting device; 2 2 2 ~ table; 1 0 0 ~ room part; 210 ~ storage; 221 ~ axis direction track; 230 ~ tray transfer device; 31 2247-9147-PF; Ahddub 1356908 231~X Axis direction track; 233A, 233B to Z axis direction way 235~holding claw; 4 0 0 '•unloading section; TST~testing tray; 232~ movable head; 234A, 234B~ holding head; 300~loading section; 5~ test head; KST~ custom tray.
2247-9147-PF;Ahddub 322247-9147-PF; Ahddub 32
Claims (1)
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PCT/JP2006/320401 WO2008044305A1 (en) | 2006-10-12 | 2006-10-12 | Tray transfer apparatus and electronic component testing apparatus provided with the same |
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TW200834097A TW200834097A (en) | 2008-08-16 |
TWI356908B true TWI356908B (en) | 2012-01-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096134691A TW200834097A (en) | 2006-10-12 | 2007-09-17 | Tray transfer apparatus and electronic component testing apparatus provided with the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5022375B2 (en) |
KR (1) | KR101104291B1 (en) |
TW (1) | TW200834097A (en) |
WO (1) | WO2008044305A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101040308B1 (en) | 2008-10-24 | 2011-06-10 | 세크론 주식회사 | Apparatus for transferring trays |
KR101334765B1 (en) * | 2012-04-18 | 2013-11-29 | 미래산업 주식회사 | Handling System for Semiconductor device |
KR102231407B1 (en) * | 2014-11-07 | 2021-03-25 | (주)테크윙 | Electric device sorting equipment |
KR102631908B1 (en) * | 2018-08-21 | 2024-01-31 | (주)테크윙 | Handler and automation system comprising the same |
JP3227434U (en) | 2020-03-12 | 2020-08-27 | 株式会社アドバンテスト | Electronic component handling device and electronic component testing device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100206644B1 (en) * | 1994-09-22 | 1999-07-01 | 오우라 히로시 | Method and apparatus for automatic inspection of semiconductor device |
JPH11297791A (en) * | 1998-04-14 | 1999-10-29 | Advantest Corp | Tray transfer arm, transfer device for tray using the same, id test device and tray transfer method |
JP4041594B2 (en) * | 1998-09-02 | 2008-01-30 | 株式会社アドバンテスト | Component testing apparatus and chamber opening / closing method |
AU2003241977A1 (en) * | 2003-05-30 | 2005-01-21 | Advantest Corporation | Electronic component test instrument |
JP2005062090A (en) | 2003-08-19 | 2005-03-10 | Renesas Technology Corp | Semiconductor testing device |
-
2006
- 2006-10-12 WO PCT/JP2006/320401 patent/WO2008044305A1/en active Application Filing
- 2006-10-12 JP JP2008538542A patent/JP5022375B2/en not_active Expired - Fee Related
- 2006-10-12 KR KR1020097008270A patent/KR101104291B1/en active IP Right Grant
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2007
- 2007-09-17 TW TW096134691A patent/TW200834097A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2008044305A1 (en) | 2008-04-17 |
JPWO2008044305A1 (en) | 2010-02-04 |
TW200834097A (en) | 2008-08-16 |
KR101104291B1 (en) | 2012-01-12 |
JP5022375B2 (en) | 2012-09-12 |
KR20090086956A (en) | 2009-08-14 |
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