WO2008044305A1 - Tray transfer apparatus and electronic component testing apparatus provided with the same - Google Patents

Tray transfer apparatus and electronic component testing apparatus provided with the same Download PDF

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Publication number
WO2008044305A1
WO2008044305A1 PCT/JP2006/320401 JP2006320401W WO2008044305A1 WO 2008044305 A1 WO2008044305 A1 WO 2008044305A1 JP 2006320401 W JP2006320401 W JP 2006320401W WO 2008044305 A1 WO2008044305 A1 WO 2008044305A1
Authority
WO
WIPO (PCT)
Prior art keywords
tray
holding
test
transfer
movable
Prior art date
Application number
PCT/JP2006/320401
Other languages
French (fr)
Japanese (ja)
Inventor
Yuji Kaneko
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2006/320401 priority Critical patent/WO2008044305A1/en
Priority to KR1020097008270A priority patent/KR101104291B1/en
Priority to JP2008538542A priority patent/JP5022375B2/en
Priority to TW096134691A priority patent/TW200834097A/en
Publication of WO2008044305A1 publication Critical patent/WO2008044305A1/en

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2893Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to an IC device by electrically contacting input / output terminals of various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) to a contact portion of a test head.
  • the present invention relates to an electronic component test apparatus to be tested, and more particularly to a tray transfer apparatus for transferring a tray that can accommodate an IC device, and an electronic component test apparatus including the tray transfer apparatus.
  • an electronic component testing apparatus In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of an Ic device in a knocked state.
  • a handler constituting the electronic component testing apparatus includes a storage unit, a loader unit, a chamber unit, and an unloader unit.
  • the handler loader section is circulated and transported in the electronic component testing apparatus from a tray (hereinafter referred to as a customer tray) for storing pre-test IC devices or test-tested IC devices.
  • the IC device is reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
  • each IC device is brought into electrical contact with the contact portion of the test head, and the electronic component test apparatus main body (hereinafter referred to as the main part) , Called Tester).
  • test tray loaded with the tested IC device is carried out to the unloader section with the force of the chamber section, and the IC device is mounted on the customer tray according to the test result in the unloader section. Sorting into categories such as non-defective products and defective products is performed.
  • the storage unit of the handler supplies the customer tray storing the IC device before the test to the loader unit, and accepts the customer tray in which the IC devices after the test are classified and stored from the unloader unit.
  • the storage unit stores a plurality of customer trays in a stacked state, and lifts and lowers the lifting force that can hold and move the customer train and move up and down.
  • a tray transfer device that is movable in the vertical and horizontal directions to pass the customer tray to and from the force.
  • An object of the present invention is to provide a tray transport apparatus capable of shortening the tray transport time and an electronic component testing apparatus including the same.
  • a tray transport apparatus for transporting a first tray capable of accommodating an electronic device under test, which stores the first tray.
  • Means a holding means capable of holding the first tray and capable of moving along a first direction, and the first means between the storage means and the holding means.
  • the first tray can be held and moved along the first direction and a second direction different from the first direction.
  • the transfer means has a plurality of movable positions in the first direction at which the transfer means can move along the second direction.
  • a feeding device is provided (see claim 1).
  • the transfer means has a plurality of movable positions in the first direction in which the transfer means can move along the second direction.
  • the transfer means and the holding means can move simultaneously without interfering with each other, so that the tray transport time can be shortened.
  • the transfer means is in the second direction without interfering with the holding means in at least one movable position regardless of the position of the holding means. It is preferable to be movable (see claim 2).
  • the holding means is movable along the first direction between a first restricting position and a second prescribed position
  • the movable position includes a first movable position where the transfer means can move along the second direction between the first restricted position and the second defined position; and And a second movable position where the transfer means can move along the second direction between a second prescribed position and the storage means. (See claim 3).
  • a space through which the transfer means can pass is formed between the storage means and the holding means located at the second specified position.
  • the second movable position is provided in the space (see claim 4).
  • the transfer means is capable of holding the first tray and is capable of moving along the first direction independently of each other.
  • the holding means has a holding head, and the transfer means is capable of simultaneously moving the plurality of holding heads along the second direction (see claim 5).
  • the transfer means is capable of holding the first tray and independent of each other along the first direction and the second direction. It is preferable to have a plurality of movable holding heads (see claim 6).
  • the transfer means is located at the first movable position V, the one holding head, and the second movable position, It is preferable that the other holding head can be simultaneously moved along the second direction (refer to claim 7).
  • the transfer means includes a plurality of the first toner. It is possible to hold a ray and move it simultaneously, and the holding means also includes a plurality of the first
  • one tray can be held and moved simultaneously (see claim 8).
  • the input / output terminal of the electronic device under test is used for testing the electronic device under test by making electrical contact with the contact portion of the test head.
  • an electronic component testing apparatus comprising any one of the above-described tray conveyance devices (see claim 9).
  • a loader unit for transferring the electronic device under test to the first tray and a second tray, and the electronic device under test carried in from the loader unit are A test part that is pressed against the contact part of the test head in a state where it is mounted on the second tray, and the tested electronic components that have been tested are transferred to the second tray carder and the first tray according to the test result.
  • the second tray in which the second load is accommodated is also received by the unloader force (see claim 10).
  • FIG. 1 is a side view showing an entire electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of the electronic device test apparatus shown in FIG.
  • FIG. 3 is a conceptual diagram showing a tray handling method in the electronic component testing apparatus of FIG.
  • FIG. 4 is a front view showing a storage portion of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 5 is a side view showing a storage portion of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 7 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 8 is a front view showing a storage portion of an electronic component testing apparatus according to another embodiment of the present invention.
  • FIG. 9 is a front view showing a storage part of an electronic component test apparatus according to still another embodiment of the present invention.
  • FIG. 10 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11A is a schematic diagram (No. 1) illustrating a first example of a tray transport method by a tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11B is a schematic diagram (No. 2) showing the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11C is a schematic diagram (No. 3) illustrating a first example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 11D is a schematic diagram (No. 4) illustrating a first example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 11E is a schematic diagram (No. 5) showing the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11F is a schematic diagram (No. 6) illustrating a first example of a tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11G is a schematic diagram (No. 7) showing the first example of the tray carrying method by the tray carrying device of the electronic device testing apparatus according to the embodiment of the present invention.
  • FIG. 11H is a schematic diagram (No. 8) illustrating the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 111 is a schematic diagram (No. 9) showing the first example of the tray transport method by the tray transport device of the electronic device testing apparatus according to the embodiment of the present invention.
  • FIG. 11J is a schematic diagram (No. 10) showing the first example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11K is a schematic view (No. 11) showing the first example of the tray transfer method by the tray transfer device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11L is a schematic diagram (No. 12) illustrating the first example of the tray transport method by the tray transport device of the electronic component testing device according to the embodiment of the present invention.
  • FIG. 12A is a schematic diagram (No. 1) showing a second example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 12B is a schematic diagram (No. 2) showing a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12C is a schematic diagram (No. 3) illustrating a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12D is a schematic diagram (No. 4) illustrating the second example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 12E is a schematic diagram (No. 5) illustrating the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12F is a schematic diagram (No. 6) showing a second example of the tray conveying method by the tray conveying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12G is a schematic diagram (No. 7) illustrating a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12H is a schematic diagram (No. 8) illustrating the second example of the tray transport method by the tray transport device of the electronic component testing device according to the embodiment of the present invention.
  • FIG. 121 is a schematic diagram (No. 9) illustrating the second example of the tray transport method by the tray transport device of the electronic device testing apparatus according to the embodiment of the present invention.
  • FIG. 12J is a schematic diagram (No. 10) showing a second example of the tray conveying method by the tray conveying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12K is a schematic diagram (No. 11) showing the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12L is a schematic diagram (No. 12) showing the second example of the tray carrying method by the tray carrying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12M is a schematic diagram (No. 13) showing the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12N is a schematic diagram (No. 14) showing the second example of the tray carrying method by the tray carrying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 1 is a side view showing an entire electronic component testing apparatus according to an embodiment of the present invention
  • FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1
  • FIG. 3 is a tray in the electronic component testing apparatus of FIG. It is a conceptual diagram which shows the handling method of No ..
  • FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment.
  • the members arranged side by side in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.
  • the electronic device test apparatus tests (inspects) whether or not the IC device operates properly in a state where a high temperature or low temperature stress is applied to the IC device, and the test result is obtained. It is a device that classifies IC devices based on it, and consists of handler 1, test head 5 and tester 6. The IC device test using this electronic component test equipment is performed by replacing the IC device from the customer tray KST to the test tray TST.
  • the handler 1 in this embodiment includes a storage unit 200 that stores a pre-test IC device and a customer tray KST loaded with a post-test IC device
  • the chamber unit 100 includes a loader unit 300 for transferring the IC device sent from the storage unit 200 to the test tray TST and feeding it to the chamber unit 100, and the test head 5 and testing the IC device in a state mounted on the test tray TST.
  • the unloader unit 400 is configured to unload the tested IC devices from the chamber unit 100 and transfer them to the customer tray KST while sorting them.
  • the socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. Connect and test the IC device with the test signal from the tester 6 concerned.
  • a space 8 is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in the space 8, and a through-hole formed in the main base of the handler 1 is formed. It is possible to make electrical contact between the IC device and the socket 50 on the test head 5 via the connector.
  • it is replaced with another test head having a socket suitable for the shape, number of pins, etc. of the IC device of that type.
  • FIG. 4 and 5 are a front view and a side view showing a storage portion of the electronic component test apparatus according to this embodiment
  • FIG. 6 shows an IC stocker used for the electronic component test apparatus according to this embodiment
  • FIG. 7 is an exploded perspective view
  • FIG. 7 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the present embodiment.
  • the storage unit 200 includes a stock force 210 for storing the customer tray KST, a lifting device 220 that can hold the customer tray KST and can be lifted and lowered.
  • a tray transfer device 230 that holds the customer tray KST and is movable in the vertical and horizontal directions is provided.
  • the stocker 210 in the present embodiment corresponds to an example of a storage unit in the present invention
  • the lifting device 220 in the present embodiment corresponds to an example of a holding unit in the present invention
  • the tray transfer device 230 in the present embodiment corresponds to an example of the transfer means in the present invention.
  • the stocker 210 is equipped with pre-test IC devices and pre-test stock force 211 for storing the installed customer tray KST, and IC devices classified according to the test results. And tested stock force 212.
  • each of the pre-test stock force 211 and the tested stock force 212 is a frame-like tray support frame 213 and the lower force of the tray support frame 213 also enters and moves upward and downward.
  • an elevator 214 that can be used.
  • a plurality of customer trays KST are stacked on the tray support frame 213, and only the stacked customer trays KST are moved up and down by the elevator 214! /.
  • the customer train KST is a force in which 60 accommodating portions 91 for accommodating IC devices are arranged in 10 rows x 6 columns as shown in FIG. There are various arrangement variations depending on the variety.
  • the number of each of the pre-test stock 211 and the test stock 212 is appropriately set as necessary. It can be done.
  • one stocker ST K-B is provided for the pre-test stock force 211.
  • eight stockers STK-1, STK 2, ..., STK-8 are provided in the tested stock force 212, and are classified into a maximum of eight categories according to the test results. Can be stored. In other words, in addition to non-defective products and defective products, it can be classified into non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It becomes.
  • one empty tray stock force STK-E is provided between STK-4 and STK-5.
  • the empty tray tray force STK-E is stacked with empty customer trays KST sent to the unloader section 400! /.
  • the electronic component testing apparatus includes six lifting devices 220, which are opened in the loader unit 300 and opened in the main base 101! /, The two window portions 306 and the four window portions 406 opened to the main base 101 in the unloader portion 400 are arranged one by one in each of the six window portions in total.
  • each elevating device 220 is provided with a Z-axis direction rail 221 provided so as to hang from the main base 101, and capable of elevating along the Z-axis direction rail 221.
  • the table 222 can be moved up and down between the first specified position H and the second specified position H.
  • the first specified position H is an upper limit in the Z-axis direction of the table 222.
  • the window portion 306 or the window portion formed in the main base 101 is used. Via 406), the customer train KST faces the loader unit 300 (or the unloader unit 400).
  • the second specified position H is the lower limit of the table 222 in the Z-axis direction.
  • Tamatre KST is delivered.
  • the lifting device 220 moves the customer tray KST between the storage unit 200 and the loader unit 300 (or the unloader unit 400) by holding and lifting the customer tray KST on the table 222. It becomes possible to move!
  • the tray transfer device 230 includes an X-axis direction rail 231 provided along the X-axis direction between the main base 101 and the stock force 210, and the X-axis direction.
  • a movable head 232 capable of moving along the X-axis direction on the rail 231, two Z-axis direction rails 233A and 233B provided on the movable head 232, and each Z-axis direction rail 233A and 233B Holding heads 234A and 234B provided on the upper side so as to be movable along the Z-axis direction.
  • Each of the holding heads 234A and 234B can move independently along the Z-axis direction, and has an open / close-type gripping claw 235 on the lower side for gripping the customer tray KST. Yes.
  • the two holding heads 234A and 234B cannot be moved independently in the horizontal direction because they are attached to one movable head 232 via Z-axis direction rails 2 33A and 233B. .
  • This tray transfer device 230 grips the customer tray KST from the lowered table 222 of the lifting device 220 and moves it to the stocker 210, or moves the customer tray KST from the stocker 210 to the table 222 of the lifting device 220. It is possible to make it.
  • the tray transfer device 230 in the present embodiment has two movable positions M in the Z-axis direction that can move the holding heads 234A and 234B in the horizontal direction.
  • the first movable position M is the first movable position of the lifting device 220.
  • the active position M is located between the second restricting position H of the lifting device 220 and the stock force 210.
  • both holding heads 234A and 234B are moved in the horizontal direction while being positioned on the first movable position M (or the second movable position M), or one of the holding heads 234A and 234B is moved in the horizontal direction.
  • the holding head 234A is positioned at the first movable position M (or the second movable position M).
  • Both holding heads 234A and 234B can be moved in the horizontal direction while being positioned at the position M).
  • the first and second holding heads 234A and 234B can be moved horizontally on the pre-test stock force 211 and the test stock force 212, regardless of the position of the table 222 of the lifting device 220. Since the holding heads 234A and 234B can be moved in the horizontal direction, the tray transfer operation can be shortened. [0051]
  • the number of holding heads is not limited to two, the number of movable positions is not limited to two, and three or more holding heads may be provided, or three or more. May be provided with a movable position.
  • FIG. 8 is a front view showing a tray transfer device of an electronic component testing apparatus according to another embodiment of the present invention.
  • two movable heads 232A, 232B that are movable independently of each other along the X-axis direction on the X-axis direction rail 231 of the tray transfer device 230.
  • the holding heads 234A and 234B can be moved independently of each other along the X-axis direction in addition to the Z-axis direction.
  • FIG. 9 is a front view showing a tray transfer device of an electronic component test apparatus according to still another embodiment of the present invention.
  • each of the holding heads 234A and 234B of the tray transfer device 230 has three customer trays KST.
  • each lifting / lowering device 220 can hold two force stapling trays KST and KST. This allows tray transfer
  • the upper customer tray KST has IC devices discrete from the second customer tray KST.
  • the holding heads 234A and 234B transfer three customer trays KST to the table 222.
  • the left holding head 234A shows the state in which the uppermost customer tray KST is removed. Incidentally, the removed empty customer tray KST is returned to the empty tray force STK-E.
  • the number of customer trays KST simultaneously held by the holding heads 234A, 234B of the tray transfer device 230 is not limited to three, and four or more customer trays KST can be held simultaneously. It is also good.
  • the number of customer trays KST simultaneously held by the tables 222 of the lifting devices 220 is not limited to two, and three or more customer trays KST may be simultaneously held.
  • FIG. 10 is an exploded perspective view showing a test tray used in the electronic device testing apparatus according to the embodiment of the present invention.
  • the customer tray KST described above is provided with a tray transfer device 230 provided between the storage unit 200 and the main base 101. Lower force is also carried.
  • the IC device loaded in the customer tray KST is transferred by the device transport device 310 to the pre-processor ( ⁇ 61 ") 305, where the mutual positional relationship of the IC devices is determined. Thereafter, the IC device transferred to the precursor 305 is reloaded onto the test tray TST stopped at the loader unit 300 by the device transport device 310.
  • the test tray TST is provided with crosspieces 13 in parallel and equidistant on the rectangular frame 12, and on both sides of the crosspieces 13 and on the side 12a of the frame 12 facing the crosspieces 13.
  • a plurality of mounting pieces 14 are formed so as to protrude at equal intervals.
  • An insert receiving portion 15 is configured by the space between these bars 13 or between the bars 13 and the side 12a and the two mounting pieces 14.
  • Each insert receiving portion 15 is configured to receive one insert 16, and this insert 16 is attached to the two attachment pieces 14 in a floating state using fasteners 17. .
  • attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16.
  • 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
  • inserts 16 have the same shape and the same dimensions, and an IC device is accommodated in each insert 16.
  • the IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular recess in the example shown in FIG.
  • the loader unit 300 includes a device transfer device 310 that reloads IC devices from the customer tray KST to the test tray TST.
  • the device transport device 310 includes two Y-axis rails 311 installed on the main base 101 along the Y-axis direction, and a movable device capable of reciprocating along the Y-axis direction on the Y-axis direction rails 311. Arm 312 and movable arm 312 are supported by movable arm 312 so as to be movable along the X-axis direction.
  • the moving head 313 is provided with suction pads (not shown) arranged in 2 rows and 8 columns downward. Each suction pad can be moved up and down by an actuator (not shown), and 16 IC devices can be transferred from the customer tray KST to the test tray TST at a time.
  • a precursor 305 is provided between the customer tray KST and the test tray TST.
  • the precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, the IC device mutual position relationship can be accurately determined by dropping the IC device to be transferred to the test tray TST onto the precursor 305 before moving it to the test tray TST. It is possible to accurately transfer devices to the test tray TST.
  • test tray TST When the IC devices are stored in all the storage units 18 of the test tray TST, the test tray TST is carried into the chamber unit 100 by the tray transfer device 102.
  • the empty customer tray KST is lowered by the lifting device 220, and this empty tray is transferred to the tray transfer device 230.
  • the tray transfer device 230 stores the empty tray in the empty tray force STK-E and stores the empty tray in the tested stock force 212 when it is fully loaded with the customer tray KST force C device of the tested stock force 212. Supply.
  • test tray TST is loaded into the chamber section 100 after IC devices are loaded by the loader section 300, and each IC device is tested in a state of being mounted on the test tray TST.
  • the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature stress to the IC device loaded on the test tray TST, and the soak chamber 110.
  • the test chamber 120 that contacts the IC device in the state where thermal stress is applied with the test head 5 and the unsoak chamber 130 that also removes the thermal stress from the IC device force that has been tested are configured. .
  • the unsoak chamber 130 is thermally connected to the soak chamber 110 and the test chamber 120. In practice, it is preferable to insulate the area of the soak chamber 110 and test chamber 120 at a high or low temperature, and the unsoak chamber 130 is thermally insulated from these forces. Collectively called chamber part 100.
  • the soak chamber 110 is disposed so as to protrude above the test chamber 120.
  • a vertical transfer device is provided inside the soak chamber 110, and a plurality of test tray TST force vertical transfer devices are provided until the test chamber 120 is empty. Waiting while being supported. Mainly during this standby period — high or low temperature stress of about 55 to 150 ° C is applied to the IC device.
  • test head 5 is disposed in the center of the test chamber 120, the test tray TST is carried above the test head 5, and the input / output terminals of the IC device are connected to the socket 50 of the test head 5. IC devices are tested by making electrical contact with the contact pins.
  • the result of this test is stored in the storage device of the electronic component test apparatus at an address determined by the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST. Is done.
  • the unsoak chamber 130 is also arranged so as to protrude upward from the test chamber 120, and a vertical transfer device is provided as conceptually shown in FIG.
  • a vertical transfer device is provided as conceptually shown in FIG.
  • the IC device when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air, and then the heat-removed IC device is carried out to the unloader unit 400. To do.
  • a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return to a temperature at which condensation does not occur, and then the removed IC device is unloaded. Carry out to part 400.
  • an inlet for carrying the test tray TST from the main base 101 is formed in the upper part of the unsoak chamber 130.
  • the main base 101 is provided with a tray transfer device 102 for taking the test tray TST in and out of the chamber portion 100 through these inlets and outlets.
  • This tray conveyor 1 02 is composed of, for example, a rotating roller.
  • the tray conveying device 102 returns the soak chamber 110 to the soak chamber 110 via the test tray TST force unloader unit 400 and the loader unit 300 carried out of the ann soak chamber 130.
  • the unloader unit 400 reloads the IC device that has been tested with the test tray TST force carried to the unloader unit 400 into the customer tray KST according to the test result.
  • the main base 101 in the unloader unit 400 is arranged so as to face the upper surface of the customer train KST force main base 101 carried from the storage unit 200 force to the unloader unit 400.
  • Four window portions 406 are formed.
  • the unloader unit 400 includes a device transfer device 410 that transfers a tested IC device from the test tray TST to the customer tray KST.
  • This device transport apparatus 410 is capable of reciprocating along the Y-axis direction on two Y-axis direction rails 411 constructed on the main base 101 along the Y-axis direction.
  • Each suction pad can be moved up and down along the Z-axis by an actuator (not shown), and it is possible to transfer 16 IC devices to the customer tray KST as well as the test tray TST force at a time.
  • an actuator not shown
  • an elevating device 220 for elevating and lowering the customer tray KST is provided below each window 406.
  • a tested IC device is installed.
  • the loaded customer tray KST is loaded and lowered, and this full tray is transferred to the tray transfer device 230.
  • the unloader 400 has only four windows 406, so the unloader 400 has a maximum of four. Only customer train KST can be placed. Therefore, the categories that can be sorted in real time are limited to four categories. In general, good products are classified into three categories: high speed, medium speed, and low speed, and in addition to defective products, four categories are sufficient. For example, retesting is required. Like those that do A category that does not belong may occur in rare cases.
  • the tray transfer device 230 and the lifting device 220 can move simultaneously without interfering with each other, the customer train is used to switch the category assigned to the window 406. Tray transport time can be shortened when replacing KST.
  • FIG. 11A to FIG. 11L are schematic views (parts 1 to 12) showing a first example of the tray transport method in the present embodiment.
  • the four lifting devices shown in FIGS. 11A to 12N are also referred to as the first to fourth lifting devices 220a to 220d in order from the left side force, and the two holding heads shown in FIG.
  • the first and second holding heads 234A and 234B are referred to in order from the left side.
  • the first lifting device 220a starts to descend as shown in FIG. 11A. While the first elevating device 220a is descending, as shown in FIG. 11B, the first holding head 234A starts to rise and the second holding head 234B starts to descend. 1st lifting equipment The device 220a stops when it is lowered to the second restriction position H, and the first holding head 234A
  • the second holding head 234B stops when it is lowered to the empty trust force STK-E, and holds the empty customer tray KST located at the uppermost stage.
  • the tray transport time can be shortened.
  • the second holding head 234B is moved to the second movable position H.
  • the first and second holding heads 234A move along the horizontal direction so that the first holding head 234A is positioned above the first lifting device 220a.
  • the first holding head 234A moves in the horizontal direction at the first movable position M
  • the second holding head 234B moves horizontally at the second movable position M. Move in the direction.
  • the first holding head 234A is lowered to receive the full customer tray KST from the first lifting device 220a, and the second holding head 234B is the first holding head 234B.
  • the first holding head 234A Upon receipt, the first holding head 234A is also raised to the first movable position M.
  • the first and second holding heads 234A, 234B are arranged such that the second holding head 234B is positioned above the first lifting device 220a. Moves horizontally at the movable position M.
  • the first and second holding heads 234A and 234B start to descend as shown in FIG. 11H.
  • the first holding head 234A moves down to the second movable position M.
  • the tray conveyance time can be shortened.
  • the second holding head 234B moves to the first movable position M.
  • the first and second holding heads 234A, 234B move horizontally so that the first holding head 234A is positioned above the tested stock force STK-2. To do.
  • the first holding head 234A moves in the horizontal direction at the second movable position M, and the second holding head 234B moves at the first movable position M.
  • the first holding head 234A When the first holding head 234A is positioned above the tested stock force STK-2, as shown in FIG. 11K, the first and second holding heads 234A and 234B are lowered and the first raising and lowering is performed. Device 220a is raised. When the first holding head 234A descends to the tested stock force STK-2, it stops and delivers the full customer tray KST to the tested stock force STK-2. F
  • the second holding head 234B stops when it is lowered to the second movable position M.
  • the tray transport time can be shortened.
  • the first holding head 234A moves to the second movable position M.
  • the first elevating device 220a rises to the first restricting position H as it rises at 2. In this state, an empty customer tray KST is held by the first lifting device 220a and the window e
  • FIGS. 12A to 12N are schematic views (Nos. 1 to 14) showing a second example of the tray transport method in the present embodiment.
  • the second lifting device 220b starts to descend. While the second raising / lowering device 220b is descending, as shown in FIG. 12B, the second holding head 234B positioned above the empty tray stocks force STK-E also begins to descend. The second lifting device 220 b stops when it is lowered to the second restriction position H. The second holding device 234B is empty.
  • the second lifting device 220b and the first holding head 234B can be lowered without interference, and the second lifting / lowering device 220b and the second holding head 234B can be moved at the same time. It is out.
  • the first and second holding heads 234A and 234B move in the horizontal direction so that the first holding head 234A comes off from directly below the second lifting device 220b. At this time, the first and second holding heads 234A and 234B both move in the horizontal direction at the second movable position M.
  • the first holding head 234A is lowered to receive the full customer tray KST from the second lifting device 220b, and the second holding head 234B is the first holding head 234B.
  • the first holding head 234A When received from the second lifting device 220b, the first holding head 234A is also movable in the first position. Ascend to the active position.
  • the first and second holding heads 234 ⁇ and 234 ⁇ are arranged so that the second holding head 234 ⁇ is positioned above the second lifting device 220b. Move horizontally at movable position M.
  • the first and second holding heads 234A and 234B start to descend as shown in FIG. 12J.
  • the first holding head 234A is lowered to the second movable position M.
  • the second holding head 234B stops when it is lowered to the second lifting device 220b, and hands over the empty customer tray KST to the second lifting device 220b.
  • the tray conveyance time can be shortened.
  • the second holding head 234B stops when it is lowered to the second movable position M.
  • the tray transport time can be shortened.
  • the second elevating device 220b is raised to the first restriction position H.
  • an empty customer tray KST is held by the second lifting / lowering device 220b and the window e
  • the tray transfer device 230 has two movable positions M and M in the vertical direction that can move along the horizontal direction. G
  • the lay transfer device 230 and the lifting device 220 can move simultaneously without interfering with each other, and the tray transport time is shortened.
  • a pitch changing mechanism such as a floating joint or a lock-and-free mechanism is provided between the holding heads 234A and 234B so that the pitch between the holding heads 234A and 234B can be changed.
  • the holding heads 234A and 234B may be positioned relative to the lifting device 220 by contacting the lifting force 210 with the lifting force 220.
  • the first holding head 234A and the second holding head 234B can simultaneously approach the lifting device 220 and the stocking force 210, and the tray transport time can be further shortened.

Abstract

A tray transfer apparatus is provided with a stocker (210) for storing a customer tray (KST); a lifting apparatus (220) which holds the customer tray (KST) and vertically moves; and a tray transfer apparatus (230), which holds the customer tray (KST) and moves in a vertical direction and a horizontal direction, for transferring and receiving the customer tray (KST) between the stocker (210) and the lifting apparatus (220). The tray transfer apparatus (230) has a plurality of movable positions (M1, M2) in the vertical direction, at which the tray transfer apparatus (230) can shift along the horizontal direction.

Description

明 細 書  Specification
トレイ搬送装置及びそれを備えた電子部品試験装置  Tray transfer device and electronic component testing apparatus including the same
技術分野  Technical field
[0001] 本発明は、半導体集積回路素子等の各種電子部品(以下、代表的に ICデバイスと も称する。 )の入出力端子をテストヘッドのコンタクト部に電気的に接触させて ICデバ イスを試験する電子部品試験装置にぉ 、て、 ICデバイスを収容可能なトレィを搬送 するためのトレイ搬送装置、及び、それを備えた電子部品試験装置に関する。  [0001] The present invention relates to an IC device by electrically contacting input / output terminals of various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) to a contact portion of a test head. The present invention relates to an electronic component test apparatus to be tested, and more particularly to a tray transfer apparatus for transferring a tray that can accommodate an IC device, and an electronic component test apparatus including the tray transfer apparatus.
背景技術  Background art
[0002] ICデバイス等の電子部品の製造過程においては、ノ ッケージングされた状態で I cデバイスの性能や機能を試験するために電子部品試験装置が用いられて 、る。こ の電子部品試験装置を構成するハンドラ (Handler)は、格納部、ローダ部、チャンバ 部及びアンローダ部を備えて 、る。  In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of an Ic device in a knocked state. A handler constituting the electronic component testing apparatus includes a storage unit, a loader unit, a chamber unit, and an unloader unit.
[0003] ハンドラのローダ部は、試験前の ICデバイスを収納したり、試験済みの ICデバイス を収容するためのトレィ (以下、カスタマトレイと称する。)から、電子部品試験装置内 を循環搬送されるトレイ(以下、テストトレイと称する。 )に ICデバイスを積み替え、その テストトレィをチャンバ部に搬入する。  [0003] The handler loader section is circulated and transported in the electronic component testing apparatus from a tray (hereinafter referred to as a customer tray) for storing pre-test IC devices or test-tested IC devices. The IC device is reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
[0004] 次いで、ハンドラのチャンバ部において、 ICデバイスに高温又は低温の熱ストレス を印加した後、各 ICデバイスをテストヘッドのコンタクト部に電気的に接触させて、電 子部品試験装置本体 (以下、テスタ (Tester)と称する。)に試験を行わせる。  [0004] Next, after applying high or low temperature heat stress to the IC device in the chamber portion of the handler, each IC device is brought into electrical contact with the contact portion of the test head, and the electronic component test apparatus main body (hereinafter referred to as the main part) , Called Tester).
[0005] 次いで、試験の完了した ICデバイスを搭載したテストトレィをチャンバ部力らアン口 ーダ部に搬出して、アンローダ部において試験結果に応じたカスタマトレイに ICデバ イスを載せ替えることで、良品や不良品といったカテゴリへの仕分けが行われている。  [0005] Next, the test tray loaded with the tested IC device is carried out to the unloader section with the force of the chamber section, and the IC device is mounted on the customer tray according to the test result in the unloader section. Sorting into categories such as non-defective products and defective products is performed.
[0006] ハンドラの格納部は、試験前の ICデバイスを収納したカスタマトレィをローダ部に供 給すると共に、試験後の ICデバイスが分類して収納されたカスタマトレィをアンローダ 部から受け入れる。  [0006] The storage unit of the handler supplies the customer tray storing the IC device before the test to the loader unit, and accepts the customer tray in which the IC devices after the test are classified and stored from the unloader unit.
[0007] この格納部は、複数のカスタマトレィを積層した状態で格納して 、るストツ力と、カス タマトレィを保持すると共に上下動させることが可能な昇降装置と、昇降装置とストツ 力との間でカスタマトレィを受け渡すために上下方向及び水平方向に沿って移動可 能なトレィ移送装置と、を備えている。 [0007] The storage unit stores a plurality of customer trays in a stacked state, and lifts and lowers the lifting force that can hold and move the customer train and move up and down. A tray transfer device that is movable in the vertical and horizontal directions to pass the customer tray to and from the force.
[0008] この従来の格納部では、トレイ移送装置が昇降装置の真下に位置している状態で 昇降装置が下降すると、昇降装置とトレイ移送装置とが干渉するため、トレイ移送装 置が昇降装置の真下力 退避した後でなければ昇降装置を下降させることができな い。  In this conventional storage unit, when the lifting device is lowered while the tray transfer device is located directly below the lifting device, the lifting device and the tray transfer device interfere with each other. The lifting device can only be lowered after retraction.
[0009] また、昇降装置が昇降している間にトレィ移送装置が水平移動する場合にも、昇降 装置とトレイ移送装置とが干渉する場合があるため、昇降装置の昇降動作が完了し た後でなければトレイ移送装置を移動させることができない。  [0009] In addition, even when the tray transfer device moves horizontally while the lifting device is moving up and down, the lifting device and the tray transfer device may interfere with each other. Otherwise, the tray transfer device cannot be moved.
[0010] 以上のような理由により、トレイ搬送作業に多くの待ち時間が発生している。同時測 定数の増加が図られる電子部品試験装置にお 、ては、こうした待ち時間の存在はス ループット向上の妨げになりかねない。 [0010] For the reasons described above, a lot of waiting time is generated in the tray transporting operation. In electronic component testing equipment that can increase the simultaneous measurement constant, such a waiting time may hinder throughput improvement.
発明の開示  Disclosure of the invention
[0011] 本発明は、トレイ搬送時間を短縮することが可能なトレイ搬送装置及びそれを備え た電子部品試験装置を提供することを目的とする。  An object of the present invention is to provide a tray transport apparatus capable of shortening the tray transport time and an electronic component testing apparatus including the same.
[0012] 上記目的を達成するために、本発明によれば、被試験電子部品を収容可能な第 1 のトレィを搬送するためのトレイ搬送装置であって、前記第 1のトレイを格納する格納 手段と、前記第 1のトレイを保持することが可能であると共に、第 1の方向に沿って移 動することが可能な保持手段と、前記格納手段と前記保持手段との間で前記第 1のト レイの受け渡しを行うために、前記第 1のトレイを保持して前記第 1の方向、及び、前 記第 1の方向とは異なる第 2の方向に沿って移動させることが可能な移送手段と、を 備え、前記移送手段は、前記移送手段が前記第 2の方向に沿って移動することが可 能な、前記第 1の方向における移動可能位置を複数有することを特徴とするトレィ搬 送装置が提供される (請求項 1参照)。  [0012] In order to achieve the above object, according to the present invention, there is provided a tray transport apparatus for transporting a first tray capable of accommodating an electronic device under test, which stores the first tray. Means, a holding means capable of holding the first tray and capable of moving along a first direction, and the first means between the storage means and the holding means. In order to deliver the tray, the first tray can be held and moved along the first direction and a second direction different from the first direction. And the transfer means has a plurality of movable positions in the first direction at which the transfer means can move along the second direction. A feeding device is provided (see claim 1).
[0013] 本発明では、移送手段は、当該移送手段が第 2の方向に沿って移動することが可 能な、第 1の方向における移動可能位置を複数有する。これにより、移送手段と保持 手段とが互いに干渉することなく同時に移動することが可能となるので、トレイ搬送時 間を短縮することができる。 [0014] 上記発明においては特に限定されないが、前記移送手段は、前記保持手段の位 置に関わらず、少なくとも一つの前記移動可能位置で、前記保持手段に干渉するこ となく前記第 2の方向に移動可能であることを特徴とすることが好ま 、 (請求項 2参 照)。 In the present invention, the transfer means has a plurality of movable positions in the first direction in which the transfer means can move along the second direction. As a result, the transfer means and the holding means can move simultaneously without interfering with each other, so that the tray transport time can be shortened. [0014] In the above invention, although not particularly limited, the transfer means is in the second direction without interfering with the holding means in at least one movable position regardless of the position of the holding means. It is preferable to be movable (see claim 2).
[0015] 上記発明においては特に限定されないが、前記保持手段は、第 1の規制位置と第 2の規定位置との間で前記第 1の方向に沿って移動可能となっており、前記複数の 移動可能位置は、前記第 1の規制位置と前記第 2の規定位置との間を前記第 2の方 向に沿って前記移送手段が移動することが可能な第 1の移動可能位置と、前記第 2 の規定位置と前記格納手段との間を前記第 2の方向に沿って前記移送手段が移動 することが可能な第 2の移動可能位置と、を含むことを特徴とすることが好ま ヽ (請 求項 3参照)。  [0015] Although not particularly limited in the above invention, the holding means is movable along the first direction between a first restricting position and a second prescribed position, The movable position includes a first movable position where the transfer means can move along the second direction between the first restricted position and the second defined position; and And a second movable position where the transfer means can move along the second direction between a second prescribed position and the storage means. (See claim 3).
[0016] 上記発明においては特に限定されないが、前記格納手段と、前記第 2の規定位置 に位置している前記保持手段との間に、前記移送手段が通過可能な空間が形成さ れており、前記第 2の移動可能位置は、前記空間に設けられていることを特徴とする ことが好ま 、 (請求項 4参照)。  [0016] Although not particularly limited in the above invention, a space through which the transfer means can pass is formed between the storage means and the holding means located at the second specified position. Preferably, the second movable position is provided in the space (see claim 4).
[0017] 上記発明においては特に限定されないが、前記移送手段は、前記第 1のトレィを保 持可能であり、且つ、相互に独立して前記第 1の方向に沿って移動可能な複数の保 持ヘッドを有し、前記移送手段は、前記複数の保持ヘッドを前記第 2の方向に沿って 同時に移動させることが可能であることを特徴とすることが好ましい(請求項 5参照)。  [0017] Although not particularly limited in the above invention, the transfer means is capable of holding the first tray and is capable of moving along the first direction independently of each other. Preferably, the holding means has a holding head, and the transfer means is capable of simultaneously moving the plurality of holding heads along the second direction (see claim 5).
[0018] 上記発明においては特に限定されないが、前記移送手段は、前記第 1のトレィを保 持可能であり、且つ、前記第 1の方向及び前記第 2の方向に沿って相互に独立して 移動可能な複数の保持ヘッドを有することを特徴とすることが好まし 、 (請求項 6参照 [0018] Although not particularly limited in the above invention, the transfer means is capable of holding the first tray and independent of each other along the first direction and the second direction. It is preferable to have a plurality of movable holding heads (see claim 6).
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[0019] 上記発明においては特に限定されないが、前記移送手段は、前記第 1の移動可能 位置に位置して V、る一の前記保持ヘッドと、前記第 2の移動可能位置に位置して 、 る他の前記保持ヘッドとを、前記第 2の方向に沿って同時に移動させることが可能で あることを特徴とすることが好ま 、 (請求項 7参照)。  [0019] Although not particularly limited in the above invention, the transfer means is located at the first movable position V, the one holding head, and the second movable position, It is preferable that the other holding head can be simultaneously moved along the second direction (refer to claim 7).
[0020] 上記発明においては特に限定されないが、前記移送手段は、複数の前記第 1のト レイを保持して同時に移動させることが可能であり、前記保持手段も、複数の前記第[0020] Although not particularly limited in the above invention, the transfer means includes a plurality of the first toner. It is possible to hold a ray and move it simultaneously, and the holding means also includes a plurality of the first
1のトレイを保持して同時に移動させることが可能であることを特徴とすることが好まし い (請求項 8参照)。 It is preferable that one tray can be held and moved simultaneously (see claim 8).
[0021] 上記目的を達成するために本発明によれば、被試験電子部品の入出力端子をテ ストヘッドのコンタクト部に電気的に接触させて前記被試験電子部品のテストを行うた めに用いられる電子部品試験装置であって、上記の何れかのトレィ搬送装置を備え ていることを特徴とする電子部品試験装置が提供される (請求項 9参照)。  [0021] In order to achieve the above object, according to the present invention, the input / output terminal of the electronic device under test is used for testing the electronic device under test by making electrical contact with the contact portion of the test head. There is provided an electronic component testing apparatus comprising any one of the above-described tray conveyance devices (see claim 9).
[0022] 上記発明においては特に限定されないが、前記被試験電子部品を前記第 1のトレ イカ 第 2のトレイに積み替えるローダ部と、前記ローダ部から搬入された前記被試 験電子部品を前記第 2のトレイに搭載したままの状態で前記テストヘッドのコンタクト 部に押し付けるテスト部と、試験結果に応じて、試験済みの前記被試験電子部品を 前記第 2のトレイカ 前記第 1のトレイに積み替えるアンローダ部と、を備えており、前 記トレイ搬送装置は、試験前の前記被試験電子部品が収容された前記第 1のトレイ を前記ローダ部に供給し、試験後の前記被試験電子部品が収容された前記第 2のト レイを前記アンローダ部力も受け取ることを特徴とすることが好まし 、(請求項 10参照 [0022] In the above invention, although not particularly limited, a loader unit for transferring the electronic device under test to the first tray and a second tray, and the electronic device under test carried in from the loader unit are A test part that is pressed against the contact part of the test head in a state where it is mounted on the second tray, and the tested electronic components that have been tested are transferred to the second tray carder and the first tray according to the test result. An unloader unit, wherein the tray transport device supplies the first tray in which the electronic device under test before testing is accommodated to the loader unit, and the electronic device under test after the test. Preferably, the second tray in which the second load is accommodated is also received by the unloader force (see claim 10).
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図面の簡単な説明  Brief Description of Drawings
[0023] [図 1]図 1は、本発明の実施形態に係る電子部品試験装置の全体を示す側面図であ る。  FIG. 1 is a side view showing an entire electronic component testing apparatus according to an embodiment of the present invention.
[図 2]図 2は、図 1の電子部品試験装置の斜視図である。  FIG. 2 is a perspective view of the electronic device test apparatus shown in FIG.
[図 3]図 3は、図 1の電子部品試験装置におけるトレイの取り廻し方法を示す概念図 である。  FIG. 3 is a conceptual diagram showing a tray handling method in the electronic component testing apparatus of FIG.
[図 4]図 4は、本発明の実施形態に係る電子部品試験装置の格納部を示す正面図で ある。  FIG. 4 is a front view showing a storage portion of the electronic device test apparatus according to the embodiment of the present invention.
[図 5]図 5は、本発明の実施形態に係る電子部品試験装置の格納部を示す側面図で ある。  FIG. 5 is a side view showing a storage portion of the electronic component test apparatus according to the embodiment of the present invention.
[図 6]図 6は、本発明の実施形態に係る電子部品試験装置に用いられる ICストッカを 示す分解斜視図である。 [図 7]図 7は、本発明の実施形態に係る電子部品試験装置に用いられるカスタマトレ ィを示す斜視図である。 FIG. 6 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention. FIG. 7 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.
[図 8]図 8は、本発明の他の実施形態に係る電子部品試験装置の格納部を示す正面 図である。  FIG. 8 is a front view showing a storage portion of an electronic component testing apparatus according to another embodiment of the present invention.
[図 9]図 9は、本発明のさらに他の実施形態に係る電子部品試験装置の格納部を示 す正面図である。  FIG. 9 is a front view showing a storage part of an electronic component test apparatus according to still another embodiment of the present invention.
[図 10]図 10は、本発明の実施形態に係る電子部品試験装置に用いられるテストトレ ィを示す分解斜視図である。  FIG. 10 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.
[図 11A]図 11Aは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 1)である。  FIG. 11A is a schematic diagram (No. 1) illustrating a first example of a tray transport method by a tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 11B]図 11Bは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 2)である。  FIG. 11B is a schematic diagram (No. 2) showing the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
[図 11C]図 11Cは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 3)である。  FIG. 11C is a schematic diagram (No. 3) illustrating a first example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
[図 11D]図 11Dは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 4)である。  FIG. 11D is a schematic diagram (No. 4) illustrating a first example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
[図 11E]図 11Eは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 5)である。  FIG. 11E is a schematic diagram (No. 5) showing the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
[図 11F]図 11Fは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 6)である。  FIG. 11F is a schematic diagram (No. 6) illustrating a first example of a tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
圆 11G]図 11Gは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 7)である。 [11G] FIG. 11G is a schematic diagram (No. 7) showing the first example of the tray carrying method by the tray carrying device of the electronic device testing apparatus according to the embodiment of the present invention.
圆 11H]図 11Hは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 8)である。 [11H] FIG. 11H is a schematic diagram (No. 8) illustrating the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
[図 111]図 111は、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置によ るトレイ搬送方法の第 1例を示す模式図(その 9)である。  FIG. 111 is a schematic diagram (No. 9) showing the first example of the tray transport method by the tray transport device of the electronic device testing apparatus according to the embodiment of the present invention.
[図 11J]図 11Jは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置によ るトレイ搬送方法の第 1例を示す模式図(その 10)である。 [図 11K]図 11Kは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 11)である。 FIG. 11J is a schematic diagram (No. 10) showing the first example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention. FIG. 11K is a schematic view (No. 11) showing the first example of the tray transfer method by the tray transfer device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 11L]図 11Lは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 1例を示す模式図(その 12)である。  FIG. 11L is a schematic diagram (No. 12) illustrating the first example of the tray transport method by the tray transport device of the electronic component testing device according to the embodiment of the present invention.
[図 12A]図 12Aは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 2例を示す模式図(その 1)である。  FIG. 12A is a schematic diagram (No. 1) showing a second example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
[図 12B]図 12Bは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 2)である。  FIG. 12B is a schematic diagram (No. 2) showing a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 12C]図 12Cは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 3)である。  FIG. 12C is a schematic diagram (No. 3) illustrating a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 12D]図 12Dは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 4)である。  FIG. 12D is a schematic diagram (No. 4) illustrating the second example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
[図 12E]図 12Eは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 5)である。  FIG. 12E is a schematic diagram (No. 5) illustrating the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
圆 12F]図 12Fは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 6)である。 [12F] FIG. 12F is a schematic diagram (No. 6) showing a second example of the tray conveying method by the tray conveying device of the electronic component testing apparatus according to the embodiment of the present invention.
圆 12G]図 12Gは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 7)である。 [12G] FIG. 12G is a schematic diagram (No. 7) illustrating a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
圆 12H]図 12Hは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレイ搬送方法の第 2例を示す模式図(その 8)である。 [12H] FIG. 12H is a schematic diagram (No. 8) illustrating the second example of the tray transport method by the tray transport device of the electronic component testing device according to the embodiment of the present invention.
[図 121]図 121は、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置によ るトレイ搬送方法の第 2例を示す模式図(その 9)である。  FIG. 121 is a schematic diagram (No. 9) illustrating the second example of the tray transport method by the tray transport device of the electronic device testing apparatus according to the embodiment of the present invention.
圆 12J]図 12Jは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置によ るトレイ搬送方法の第 2例を示す模式図(その 10)である。 [12J] FIG. 12J is a schematic diagram (No. 10) showing a second example of the tray conveying method by the tray conveying device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 12K]図 12Kは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 2例を示す模式図(その 11)である。  FIG. 12K is a schematic diagram (No. 11) showing the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 12L]図 12Lは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 2例を示す模式図(その 12)である。 [図 12M]図 12Mは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置 によるトレイ搬送方法の第 2例を示す模式図(その 13)である。 FIG. 12L is a schematic diagram (No. 12) showing the second example of the tray carrying method by the tray carrying device of the electronic component testing apparatus according to the embodiment of the present invention. FIG. 12M is a schematic diagram (No. 13) showing the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
[図 12N]図 12Nは、本発明の実施形態に係る電子部品試験装置のトレイ搬送装置に よるトレィ搬送方法の第 2例を示す模式図(その 14)である。  FIG. 12N is a schematic diagram (No. 14) showing the second example of the tray carrying method by the tray carrying device of the electronic component testing apparatus according to the embodiment of the present invention.
符号の説明  Explanation of symbols
[0024] 1…ハンドラ [0024] 1 ... Handler
100· ··チャンバ部  100 ··· Chamber section
200…格納部  200 ... storage
210· ··ストッカ  210 ··· Stocker
220…昇降装置  220 ... Lifting device
221· ··Ζ軸方向レール  221 ··· Axial rail
222…テープノレ  222… Tape Nore
230· ··トレイ移送装置  230 ··· Tray transfer device
231· ··Χ軸方向レール  231 ···· Axial rail
232…可動ヘッド  232 ... movable head
233Α、 233Β· ··Ζ軸方向レーノレ  233mm, 233mm
234Α、 234Β· ··保持ヘッド  234Α, 234Β ··· Holding head
235…保持爪  235 ... Holding claw
300· ··ローダ咅  300 ··· Loader
400· ··アンローダ咅  400 ... unloader
5…テストヘッド  5 ... Test head
TST…テストトレイ  TST ... Test tray
KST…カスタマトレィ  KST ... Customer train
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0025] 以下、本発明の実施形態を図面に基づいて説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0026] 図 1は本発明の実施形態に係る電子部品試験装置の全体を示す側面図、図 2は 図 1の電子部品試験装置の斜視図、図 3は図 1の電子部品試験装置におけるトレイ の取り廻し方法を示す概念図である。 [0027] なお、図 3は本実施形態に係る電子部品試験装置におけるトレイの取り廻しの方法 を理解するための図であり、実際には上下方向に並んで配置されている部材を平面 的に示した部分もある。従って、その機械的 (三次元的)構造は図 2を参照して説明 する。 FIG. 1 is a side view showing an entire electronic component testing apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1, and FIG. 3 is a tray in the electronic component testing apparatus of FIG. It is a conceptual diagram which shows the handling method of No .. FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment. In practice, the members arranged side by side in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.
[0028] 本実施形態に係る電子部品試験装置は、 ICデバイスに高温又は低温の温度ストレ スを与えた状態で ICデバイスが適切に動作する力否かを試験 (検査)し、当該試験 結果に基づいて ICデバイスを分類する装置であり、ハンドラ 1、テストヘッド 5及びテ スタ 6から構成されている。この電子部品試験装置による ICデバイスのテストは、カス タマトレィ KSTからテストトレイ TSTに ICデバイスを載せ替えて実施される。  [0028] The electronic device test apparatus according to the present embodiment tests (inspects) whether or not the IC device operates properly in a state where a high temperature or low temperature stress is applied to the IC device, and the test result is obtained. It is a device that classifies IC devices based on it, and consists of handler 1, test head 5 and tester 6. The IC device test using this electronic component test equipment is performed by replacing the IC device from the customer tray KST to the test tray TST.
[0029] このため、本実施形態におけるハンドラ 1は、図 1〜図 3に示すように、試験前の IC デバイスや試験後の ICデバイスを搭載したカスタマトレィ KSTを格納する格納部 20 0と、格納部 200から送られる ICデバイスをテストトレイ TSTに載せ替えてチャンバ部 100に送り込むローダ部 300と、テストヘッド 5を含み、テストトレイ TSTに搭載した状 態で ICデバイスのテストを行うチャンバ部 100と、試験済みの ICデバイスをチャンバ 部 100から搬出し、分類しながらカスタマトレィ KSTに移し替えるアンローダ部 400と 、力 構成されている。  For this reason, as shown in FIGS. 1 to 3, the handler 1 in this embodiment includes a storage unit 200 that stores a pre-test IC device and a customer tray KST loaded with a post-test IC device, The chamber unit 100 includes a loader unit 300 for transferring the IC device sent from the storage unit 200 to the test tray TST and feeding it to the chamber unit 100, and the test head 5 and testing the IC device in a state mounted on the test tray TST. The unloader unit 400 is configured to unload the tested IC devices from the chamber unit 100 and transfer them to the customer tray KST while sorting them.
[0030] テストヘッド 5に設けられているソケット 50は、図 1に示すケーブル 7を通じてテスタ 6 に接続され、ソケット 50に電気的に接続された ICデバイスを、ケーブル 7を介してテ スタ 6に接続し、当該テスタ 6からの試験信号により ICデバイスをテストする。なお、図 1に示すように、ハンドラ 1の下部の一部に空間 8が設けられており、この空間 8にテス トヘッド 5が交換可能に配置され、ハンドラ 1のメインベースに形成された貫通孔を介 して ICデバイスとテストヘッド 5上のソケット 50とを電気的に接触させることが可能とな つている。 ICデバイスの品種交換の際には、その品種の ICデバイスの形状、ピン数 等に適したソケットを有する他のテストヘッドに交換される。  [0030] The socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. Connect and test the IC device with the test signal from the tester 6 concerned. As shown in FIG. 1, a space 8 is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in the space 8, and a through-hole formed in the main base of the handler 1 is formed. It is possible to make electrical contact between the IC device and the socket 50 on the test head 5 via the connector. When changing the type of IC device, it is replaced with another test head having a socket suitable for the shape, number of pins, etc. of the IC device of that type.
[0031] 以下に、ハンドラ 1の各部について詳述する。  [0031] Each part of the handler 1 will be described in detail below.
[0032] <格納部 200 >  [0032] <Storage unit 200>
図 4及び図 5は本実施形態に係る電子部品試験装置の格納部を示す正面図及び 側面図、図 6は本実施形態に係る電子部品試験装置に用 、られる ICストッカを示す 分解斜視図、図 7は本実施形態に係る電子部品試験装置に用いられるカスタマトレ ィを示す斜視図である。 4 and 5 are a front view and a side view showing a storage portion of the electronic component test apparatus according to this embodiment, and FIG. 6 shows an IC stocker used for the electronic component test apparatus according to this embodiment. FIG. 7 is an exploded perspective view, and FIG. 7 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the present embodiment.
[0033] 格納部 200は、図 4及び図 5に示すように、カスタマトレィ KSTを格納するストツ力 2 10と、カスタマトレィ KSTを保持することが可能であると共に昇降可能な昇降装置 22 0と、ストッカ 210と昇降装置 220との間でカスタマトレィ KSTを受け渡すためにカスタ マトレイ KSTを保持して上下方向及び水平方向に沿って移動可能なトレイ移送装置 230と、を備えている。 As shown in FIGS. 4 and 5, the storage unit 200 includes a stock force 210 for storing the customer tray KST, a lifting device 220 that can hold the customer tray KST and can be lifted and lowered. In order to deliver the customer tray KST between the stocker 210 and the lifting device 220, a tray transfer device 230 that holds the customer tray KST and is movable in the vertical and horizontal directions is provided.
[0034] なお、本実施形態におけるストッカ 210が本発明における格納手段の一例に相当 し、本実施形態における昇降装置 220が本発明における保持手段の一例に相当し、 本実施形態におけるトレイ移送装置 230が本発明における移送手段の一例に相当 する。  It should be noted that the stocker 210 in the present embodiment corresponds to an example of a storage unit in the present invention, the lifting device 220 in the present embodiment corresponds to an example of a holding unit in the present invention, and the tray transfer device 230 in the present embodiment. Corresponds to an example of the transfer means in the present invention.
[0035] ストッカ 210は、図 2〜図 4に示すように、試験前の ICデバイスと搭載したカスタマト レイ KSTを格納する試験前ストツ力 211と、試験結果に応じて分類された ICデバイス を搭載した試験済ストツ力 212と、を備えている。  [0035] As shown in FIGS. 2 to 4, the stocker 210 is equipped with pre-test IC devices and pre-test stock force 211 for storing the installed customer tray KST, and IC devices classified according to the test results. And tested stock force 212.
[0036] 試験前ストツ力 211及び試験済ストツ力 212はそれぞれ、図 6に示すように、枠状の トレイ支持枠 213と、このトレィ支持枠 213の下部力も進入して上部に向力つて昇降 可能となっているエレベータ 214と、を備えている。トレイ支持枠 213には、カスタマト レイ KSTが複数積み重ねられており、この積み重ねられたカスタマトレィ KSTのみが エレベータ 214によって上下に移動されるようになって!/、る。 [0036] As shown in Fig. 6, each of the pre-test stock force 211 and the tested stock force 212 is a frame-like tray support frame 213 and the lower force of the tray support frame 213 also enters and moves upward and downward. And an elevator 214 that can be used. A plurality of customer trays KST are stacked on the tray support frame 213, and only the stacked customer trays KST are moved up and down by the elevator 214! /.
[0037] 本実施形態では、カスタマトレィ KSTは、図 7に示すように、 ICデバイスを収容する ための 60個の収容部 91が 10行 X 6列に配列されている力 実際には ICデバイスの 品種に応じて様々な配列のバリエーションが存在する。 [0037] In the present embodiment, the customer train KST is a force in which 60 accommodating portions 91 for accommodating IC devices are arranged in 10 rows x 6 columns as shown in FIG. There are various arrangement variations depending on the variety.
[0038] 試験前ストツ力 211と試験済ストツ力 212とは同一構造となっているので、試験前スト ッカ 211と試験済ストツ力 212のそれぞれの数を、必要に応じて適宜数に設定するこ とがでさる。 [0038] Since the pre-test stock force 211 and the pre-test stock force 212 have the same structure, the number of each of the pre-test stock 211 and the test stock 212 is appropriately set as necessary. It can be done.
[0039] 本実施形態では、図 2〜図 4に示すように、試験前ストツ力 211に 1個のストッカ ST K— Bが設けられている。一方、試験済ストツ力 212に、 8個のストッカ STK— 1、 STK 2、 · ··、 STK— 8が設けられており、試験結果に応じて最大 8つの分類に仕分けし て格納できるように構成されている。つまり、良品と不良品の別の他に、良品の中でも 動作速度が高速なもの、中速なもの、低速なもの、或いは、不良の中でも再試験が必 要なもの等に仕分けすることが可能となって 、る。 In the present embodiment, as shown in FIGS. 2 to 4, one stocker ST K-B is provided for the pre-test stock force 211. On the other hand, eight stockers STK-1, STK 2, ..., STK-8 are provided in the tested stock force 212, and are classified into a maximum of eight categories according to the test results. Can be stored. In other words, in addition to non-defective products and defective products, it can be classified into non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It becomes.
[0040] また、試験済ストツ力 212において、 STK— 4と STK— 5との間には、空トレイストツ 力 STK—Eが 1つ設けられている。この空トレイストツ力 STK—Eには、アンローダ部 4 00に送られる空のカスタマトレィ KSTが積み重ねられて!/、る。  [0040] Further, in the tested stock force 212, one empty tray stock force STK-E is provided between STK-4 and STK-5. The empty tray tray force STK-E is stacked with empty customer trays KST sent to the unloader section 400! /.
[0041] 本実施形態に係る電子部品試験装置は、図 4に示すように、 6つの昇降装置 220を 備えており、ローダ部 300にお!/、てメインベース 101に開口して!/、る 2つの窓部 306 と、アンローダ部 400においてメインベース 101に開口している 4つの窓部 406と、の 合計 6つの窓部にそれぞれ 1つずつ配置されている。  [0041] As shown in FIG. 4, the electronic component testing apparatus according to the present embodiment includes six lifting devices 220, which are opened in the loader unit 300 and opened in the main base 101! /, The two window portions 306 and the four window portions 406 opened to the main base 101 in the unloader portion 400 are arranged one by one in each of the six window portions in total.
[0042] 各昇降装置 220は、図 5に示すように、メインベース 101から垂下するように設けら れた Z軸方向レール 221と、この Z軸方向レール 221に沿って昇降可能に設けられて いるテーブル 222と、から構成されており、テーブル 222が第 1の規定位置 Hと第 2 の規定位置 Hとの間を昇降することが可能となっている。  As shown in FIG. 5, each elevating device 220 is provided with a Z-axis direction rail 221 provided so as to hang from the main base 101, and capable of elevating along the Z-axis direction rail 221. The table 222 can be moved up and down between the first specified position H and the second specified position H.
2  2
[0043] 第 1の規定位置 Hは、テーブル 222の Z軸方向の上限であり、この第 1の規定位置 Hにテーブル 222が位置すると、メインベース 101に形成された窓部 306 (又は窓部 406)を介して、カスタマトレィ KSTがローダ部 300 (又はアンローダ部 400)に臨むよ うになつている。  [0043] The first specified position H is an upper limit in the Z-axis direction of the table 222. When the table 222 is positioned at the first specified position H, the window portion 306 (or the window portion) formed in the main base 101 is used. Via 406), the customer train KST faces the loader unit 300 (or the unloader unit 400).
[0044] これに対し、第 2の規定位置 Hは、テーブル 222の Z軸方向の下限であり、この第 2  On the other hand, the second specified position H is the lower limit of the table 222 in the Z-axis direction.
2  2
の規定位置 Hにテーブル 222が位置した状態で、トレイ移送装置 230との間でカス  With the table 222 positioned at the specified position H of the
2  2
タマトレィ KSTの受け渡しが行われる。  Tamatre KST is delivered.
[0045] このように、昇降装置 220は、テーブル 222上にカスタマトレィ KSTを保持して昇降 することで、格納部 200とローダ部 300 (又はアンローダ部 400)との間でカスタマトレ ィ KSTを移動させることが可能となって!/、る。  [0045] In this manner, the lifting device 220 moves the customer tray KST between the storage unit 200 and the loader unit 300 (or the unloader unit 400) by holding and lifting the customer tray KST on the table 222. It becomes possible to move!
[0046] トレイ移送装置 230は、図 4及び図 5に示すように、メインベース 101とストツ力 210と の間に X軸方向に沿って設けられた X軸方向レール 231と、この X軸方向レール 231 上を X軸方向に沿って移動することが可能な可動ヘッド 232と、可動ヘッド 232上に 設けられた 2つの Z軸方向レール 233A、 233Bと、各 Z軸方向レール 233A、 233B 上にそれぞれ Z軸方向に沿って移動可能に設けられた保持ヘッド 234A、 234Bと、 を備えている。各保持ヘッド 234A、 234Bは、 Z軸方向に沿って相互に独立して移 動可能になっていると共に、カスタマトレィ KSTを把持するために開閉式の把持爪 2 35を下側に有している。なお、 2つの保持ヘッド 234A、 234Bは、 Z軸方向レール 2 33A、 233Bを介して、 1つの可動ヘッド 232に取り付けられているため、水平方向に は独立して移動することはできな!、。 As shown in FIGS. 4 and 5, the tray transfer device 230 includes an X-axis direction rail 231 provided along the X-axis direction between the main base 101 and the stock force 210, and the X-axis direction. A movable head 232 capable of moving along the X-axis direction on the rail 231, two Z-axis direction rails 233A and 233B provided on the movable head 232, and each Z-axis direction rail 233A and 233B Holding heads 234A and 234B provided on the upper side so as to be movable along the Z-axis direction. Each of the holding heads 234A and 234B can move independently along the Z-axis direction, and has an open / close-type gripping claw 235 on the lower side for gripping the customer tray KST. Yes. The two holding heads 234A and 234B cannot be moved independently in the horizontal direction because they are attached to one movable head 232 via Z-axis direction rails 2 33A and 233B. .
[0047] このトレィ移送装置 230は、下降した昇降装置 220のテーブル 222からカスタマトレ ィ KSTを把持してストッカ 210に移動させたり、ストッカ 210から昇降装置 220のテー ブル 222にカスタマトレィ KSTを移動させることが可能となっている。  [0047] This tray transfer device 230 grips the customer tray KST from the lowered table 222 of the lifting device 220 and moves it to the stocker 210, or moves the customer tray KST from the stocker 210 to the table 222 of the lifting device 220. It is possible to make it.
[0048] 本実施形態におけるトレイ移送装置 230は、図 4及び図 5に示すように、保持ヘッド 234A、 234Bを水平方向に移動させることが可能な、 Z軸方向における 2つの移動 可能位置 M、 Mを有している。第 1の移動可能位置 Mは、昇降装置 220の第 1の  As shown in FIGS. 4 and 5, the tray transfer device 230 in the present embodiment has two movable positions M in the Z-axis direction that can move the holding heads 234A and 234B in the horizontal direction. Have M. The first movable position M is the first movable position of the lifting device 220.
1 2 1  1 2 1
規制位置 Hと第 2の規制位置 Hとの間に位置している。これに対し、第 2の移動可  It is located between the restriction position H and the second restriction position H. In contrast, the second moveable
1 2  1 2
能位置 Mは、昇降装置 220の第 2の規制位置 Hとストツ力 210との間に位置してい  The active position M is located between the second restricting position H of the lifting device 220 and the stock force 210.
2 2  twenty two
る。本実施形態では、ストッカ 210と、第 2の規定位置 Hに位置しているテーブル 22  The In the present embodiment, the stocker 210 and the table 22 located at the second specified position H
2  2
2との間に、トレイ移送装置 230Aの保持ヘッド 234A、 234Bが通過可能な大きさの 空間が形成されている。  2 is formed with a space that allows the holding heads 234A and 234B of the tray transfer device 230A to pass therethrough.
[0049] 本実施形態では、両方の保持ヘッド 234A、 234Bを第 1の移動可能位置 M (又は 第 2の移動可能位置 M )上に位置させた状態で水平方向に移動させたり、一方の保 [0049] In the present embodiment, both holding heads 234A and 234B are moved in the horizontal direction while being positioned on the first movable position M (or the second movable position M), or one of the holding heads 234A and 234B is moved in the horizontal direction.
2  2
持ヘッド 234Aを第 1の移動可能位置 M (又は第 2の移動可能位置 M )に位置させ  The holding head 234A is positioned at the first movable position M (or the second movable position M).
1 2  1 2
ると共に他方の保持ヘッド 234Bを第 2の移動可能位置 M (又は第 1の移動可能位  And the other holding head 234B is moved to the second movable position M (or the first movable position).
2  2
置 M )に位置させた状態で、両方の保持ヘッド 234A、 234Bを水平方向に移動させ ることが可能となっている。  Both holding heads 234A and 234B can be moved in the horizontal direction while being positioned at the position M).
[0050] また、例えば、昇降装置 220が昇降している間に、第 2の移動可能位置 Mにおい [0050] Further, for example, while the elevating device 220 is moving up and down, the second movable position M
2 て第 1及び第 2の保持ヘッド 234A、 234Bを水平移動させて試験前ストツ力 211や試 験済ストツ力 212上を移動させることができ、昇降装置 220のテーブル 222の位置に 関わらず、保持ヘッド 234A、 234Bを水平方向に沿って移動させることが可能となつ ているので、トレイ搬送作業を短縮することができる。 [0051] なお、本発明においては保持ヘッドの数は 2つに限定されず、移動可能位置の数 も 2つに限定されず、 3つ以上の保持ヘッドを備えても良いし、 3つ以上の移動可能 位置を備えても良い。 The first and second holding heads 234A and 234B can be moved horizontally on the pre-test stock force 211 and the test stock force 212, regardless of the position of the table 222 of the lifting device 220. Since the holding heads 234A and 234B can be moved in the horizontal direction, the tray transfer operation can be shortened. [0051] In the present invention, the number of holding heads is not limited to two, the number of movable positions is not limited to two, and three or more holding heads may be provided, or three or more. May be provided with a movable position.
[0052] 図 8は本発明の他の実施形態に係る電子部品試験装置のトレイ搬送装置を示す正 面図である。本発明の他の実施形態では、図 8に示すように、トレイ移送装置 230の X軸方向レール 231上に、 X軸方向に沿って相互に独立して移動可能な 2つの可動 ヘッド 232A、 232Bが設けられており、保持ヘッド 234A、 234B力 Z軸方向に加え て X軸方向に沿って相互に独立して移動することが可能となっている。  FIG. 8 is a front view showing a tray transfer device of an electronic component testing apparatus according to another embodiment of the present invention. In another embodiment of the present invention, as shown in FIG. 8, two movable heads 232A, 232B that are movable independently of each other along the X-axis direction on the X-axis direction rail 231 of the tray transfer device 230. The holding heads 234A and 234B can be moved independently of each other along the X-axis direction in addition to the Z-axis direction.
[0053] 図 9は本発明のさらに他の実施形態に係る電子部品試験装置のトレイ搬送装置を 示す正面図である。本発明のさらに他の実施形態では、図 9に示すように、トレィ移 送装置 230の各保持ヘッド 234A、 234B力 3枚のカスタマトレィ KST を同時に  FIG. 9 is a front view showing a tray transfer device of an electronic component test apparatus according to still another embodiment of the present invention. In yet another embodiment of the present invention, as shown in FIG. 9, each of the holding heads 234A and 234B of the tray transfer device 230 has three customer trays KST.
1〜3 把持することが可能となって 、ると共に、各昇降装置 220のテーブル 222は 2枚の力 スタマトレイ KST、 KSTを保持することが可能となっている。これにより、トレイ移送  In addition, the table 222 of each lifting / lowering device 220 can hold two force stapling trays KST and KST. This allows tray transfer
2 3  twenty three
装置 230がストツ力 210との間でカスタマトレィ KSTの受け渡しを行う回数を減らすこ とがでさる。  It is possible to reduce the number of times that the device 230 exchanges the customer train KST with the stock force 210.
[0054] なお、保持ヘッド 234A、 234Bが保持する 3枚のカスタマトレィ KST のうちで最  [0054] Of the three customer trays KST held by the holding heads 234A and 234B,
1〜3 上段のカスタマトレィ KSTは、 2段目のカスタマトレィ KSTから ICデバイスが離散す  1 to 3 The upper customer tray KST has IC devices discrete from the second customer tray KST.
1 2  1 2
るのを防止するためにカバーとして用いられて!/、る空のカスタマトレイである。そのた め、保持ヘッド 234A、 234Bは、テーブル 222に 3枚のカスタマトレィ KST を移載  An empty customer tray used as a cover to prevent Therefore, the holding heads 234A and 234B transfer three customer trays KST to the table 222.
1〜3 した後に、最上段のカスタマトレィ KSTのみを取り除く。図 9において左側の保持へ ッド 234Aが最上段のカスタマトレィ KSTを取り除いた状態を示している。因みに、こ の取り除かれた空のカスタマトレィ KSTは、空トレイストツ力 STK—Eに返送される。  After 1-3, remove only the top customer tray KST. In Fig. 9, the left holding head 234A shows the state in which the uppermost customer tray KST is removed. Incidentally, the removed empty customer tray KST is returned to the empty tray force STK-E.
[0055] なお、本発明においては、トレイ移送装置 230の各保持ヘッド 234A、 234Bが同 時に保持するカスタマトレィ KSTの数は 3枚に限定されず、 4枚以上のカスタマトレィ KSTを同時に保持可能としても良い。同様に、各昇降装置 220のテーブル 222が同 時に保持するカスタマトレィ KSTの数は 2枚に限定されず、 3枚以上のカスタマトレィ KSTを同時に保持可能としても良い。  [0055] In the present invention, the number of customer trays KST simultaneously held by the holding heads 234A, 234B of the tray transfer device 230 is not limited to three, and four or more customer trays KST can be held simultaneously. It is also good. Similarly, the number of customer trays KST simultaneously held by the tables 222 of the lifting devices 220 is not limited to two, and three or more customer trays KST may be simultaneously held.
[0056] <ローダ部 300 > 図 10は本発明の実施形態に係る電子部品試験装置に用いられるテストトレィを示 す分解斜視図である。 [0056] <Loader unit 300> FIG. 10 is an exploded perspective view showing a test tray used in the electronic device testing apparatus according to the embodiment of the present invention.
[0057] 上述したカスタマトレィ KSTは、格納部 200とメインベース 101との間に設けられた 卜レイ移送装置 230【こよって口ーダ咅 の 2筒所の窓咅 【こ、メインベース 101 の下側力も運ばれる。そして、このローダ部 300において、カスタマトレィ KSTに積み 込まれた ICデバイスを、デバイス搬送装置 310がプリサィサ (^61") 305にー且移 送し、ここで、 ICデバイスの相互の位置関係を修正する。その後、このプリサイサ 305 に移送された ICデバイスを、デバイス搬送装置 310が、ローダ部 300に停止している テストトレイ TSTに再び積み替える。  [0057] The customer tray KST described above is provided with a tray transfer device 230 provided between the storage unit 200 and the main base 101. Lower force is also carried. In the loader section 300, the IC device loaded in the customer tray KST is transferred by the device transport device 310 to the pre-processor (^ 61 ") 305, where the mutual positional relationship of the IC devices is determined. Thereafter, the IC device transferred to the precursor 305 is reloaded onto the test tray TST stopped at the loader unit 300 by the device transport device 310.
[0058] テストトレイ TSTは、図 10に示すように、方形フレーム 12に桟 13が平行且つ等間 隔に設けられ、桟 13の両側、及び、桟 13と対向するフレーム 12の辺 12aに、それぞ れ複数の取付片 14が等間隔に突出して形成されている。これら桟 13の間又は桟 13 と辺 12aとの間と、 2つの取付片 14とによって、インサート収容部 15が構成されている  [0058] As shown in FIG. 10, the test tray TST is provided with crosspieces 13 in parallel and equidistant on the rectangular frame 12, and on both sides of the crosspieces 13 and on the side 12a of the frame 12 facing the crosspieces 13. A plurality of mounting pieces 14 are formed so as to protrude at equal intervals. An insert receiving portion 15 is configured by the space between these bars 13 or between the bars 13 and the side 12a and the two mounting pieces 14.
[0059] 各インサート収容部 15には、それぞれ 1個のインサート 16が収容されるようになつ ており、このインサート 16はファスナ 17を用いて 2つの取付片 14にフローティング状 態で取り付けられている。このために、インサート 16の両端部には、当該インサート 1 6を取付片 14に取り付けるための取付孔 19が形成されている。こうしたインサート 16 は、図 10に示すように、 1枚のテストトレイ TSTに 64個取り付けられており、 4行 16列 に配列されている。 [0059] Each insert receiving portion 15 is configured to receive one insert 16, and this insert 16 is attached to the two attachment pieces 14 in a floating state using fasteners 17. . For this purpose, attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16. As shown in FIG. 10, 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
[0060] なお、インサート 16は、同一形状、同一寸法とされており、それぞれのインサート 16 に ICデバイスが収容される。インサート 16の IC収容部 18は、収容する ICデバイスの 形状に応じて決められ、図 10に示す例では方形の凹部となっている。  Note that the inserts 16 have the same shape and the same dimensions, and an IC device is accommodated in each insert 16. The IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular recess in the example shown in FIG.
[0061] ローダ部 300は、図 2に示すように、カスタマトレィ KSTからテストトレイ TSTに ICデ バイスを積み替えるデバイス搬送装置 310を備えている。デバイス搬送装置 310は、 メインベース 101上に Y軸方向に沿つて架設された 2本の Y軸方向レール 311と、こ の Y軸方向レール 311上を Y軸方向に沿って往復移動可能な可動アーム 312と、可 動アーム 312に X軸方向に沿って移動可能に支持されて 、る可動ヘッド 313と、可 動ヘッド 313に下向きに 2行 8列に配列された吸着パッド (不図示)と、を備えている。 各吸着パッドは、特に図示しないァクチユエータにより上下動可能となっており、一度 に 16個の ICデバイスをカスタマトレィ KSTからテストトレイ TSTに積み替えることが可 能となっている。 [0061] As shown in FIG. 2, the loader unit 300 includes a device transfer device 310 that reloads IC devices from the customer tray KST to the test tray TST. The device transport device 310 includes two Y-axis rails 311 installed on the main base 101 along the Y-axis direction, and a movable device capable of reciprocating along the Y-axis direction on the Y-axis direction rails 311. Arm 312 and movable arm 312 are supported by movable arm 312 so as to be movable along the X-axis direction. The moving head 313 is provided with suction pads (not shown) arranged in 2 rows and 8 columns downward. Each suction pad can be moved up and down by an actuator (not shown), and 16 IC devices can be transferred from the customer tray KST to the test tray TST at a time.
[0062] なお、図 2及び図 3に示すように、カスタマトレィ KSTとテストトレイ TSTとの間には プリサイサ 305が設けられている。プリサイサ 305は、特に図示しないが、比較的深い 凹部を有し、この凹部の周縁が傾斜面で囲まれている。従って、カスタマトレィ KST 力もテストトレイ TSTに積み替える ICデバイスを、テストトレイ TSTに移動させる前に、 このプリサイサ 305にー且落とし込むことにより、 ICデバイス相互位置関係を正確に 定めることができるので、 ICデバイスをテストトレイ TSTに精度良く積み替えることが 可能となっている。  [0062] As shown in FIGS. 2 and 3, a precursor 305 is provided between the customer tray KST and the test tray TST. Although not shown in the drawing, the precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, the IC device mutual position relationship can be accurately determined by dropping the IC device to be transferred to the test tray TST onto the precursor 305 before moving it to the test tray TST. It is possible to accurately transfer devices to the test tray TST.
[0063] テストトレイ TSTの全ての収容部 18に ICデバイスが収容されると、トレイ搬送装置 1 02により当該テストトレイ TSTがチャンバ部 100内に搬入される。  When the IC devices are stored in all the storage units 18 of the test tray TST, the test tray TST is carried into the chamber unit 100 by the tray transfer device 102.
[0064] 一方、カスタマトレィ KSTに搭載されていた全ての ICデバイスがテストトレイ TSTに 積み替えられると、当該空のカスタマトレィ KSTを昇降装置 220が下降させて、この 空トレィをトレイ移送装置 230に受け渡す。トレイ移送装置 230は、この空トレイを空ト レイストツ力 STK - Eにー且格納し、試験済ストツ力 212のカスタマトレィ KST力 Cデ バイスで満載となったらその試験済ストツ力 212に空トレイを供給する。  [0064] On the other hand, when all the IC devices mounted on the customer tray KST are loaded onto the test tray TST, the empty customer tray KST is lowered by the lifting device 220, and this empty tray is transferred to the tray transfer device 230. Deliver. The tray transfer device 230 stores the empty tray in the empty tray force STK-E and stores the empty tray in the tested stock force 212 when it is fully loaded with the customer tray KST force C device of the tested stock force 212. Supply.
[0065] <チャンバ部 100 >  [0065] <Chamber part 100>
上述したテストトレイ TSTは、ローダ部 300で ICデバイスが積み込まれた後にチヤ ンバ部 100に送り込まれ、当該テストトレイ TSTに搭載された状態で各 ICデバイスが テストされる。  The above-described test tray TST is loaded into the chamber section 100 after IC devices are loaded by the loader section 300, and each IC device is tested in a state of being mounted on the test tray TST.
[0066] チャンバ部 100は、図 2及び図 3に示すように、テストトレイ TSTに積み込まれた IC デバイスに、 目的とする高温又は低温の熱ストレスを印加するソークチャンバ 110と、 このソークチャンバ 110で熱ストレスが印加された状態にある ICデバイスをテストへッ ド 5に接触させるテストチャンバ 120と、試験が終了した ICデバイス力も熱ストレスを除 去するアンソークチャンバ 130と、力 構成されている。  As shown in FIGS. 2 and 3, the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature stress to the IC device loaded on the test tray TST, and the soak chamber 110. The test chamber 120 that contacts the IC device in the state where thermal stress is applied with the test head 5 and the unsoak chamber 130 that also removes the thermal stress from the IC device force that has been tested are configured. .
[0067] なお、アンソークチャンバ 130は、ソークチャンバ 110やテストチャンバ 120と熱的に 絶縁することが好ましぐ実際には、ソークチャンバ 110とテストチャンバ 120との領域 が高温又は低温に維持され、アンソークチャンバ 130はこれらとは熱的に絶縁されて いる力 便宜的にこれらをチャンバ部 100と総称する。 [0067] The unsoak chamber 130 is thermally connected to the soak chamber 110 and the test chamber 120. In practice, it is preferable to insulate the area of the soak chamber 110 and test chamber 120 at a high or low temperature, and the unsoak chamber 130 is thermally insulated from these forces. Collectively called chamber part 100.
[0068] ソークチャンバ 110は、テストチャンバ 120より上方に突出するように配置されている 。そして、図 3に概念的に示すように、このソークチャンバ 110の内部には垂直搬送 装置が設けられており、テストチャンバ 120が空く迄の間、複数枚のテストトレイ TST 力 の垂直搬送装置に支持されながら待機している。主として、この待機中において — 55〜150°C程度の高温又は低温の熱ストレスが ICデバイスに印加される。  [0068] The soak chamber 110 is disposed so as to protrude above the test chamber 120. As conceptually shown in FIG. 3, a vertical transfer device is provided inside the soak chamber 110, and a plurality of test tray TST force vertical transfer devices are provided until the test chamber 120 is empty. Waiting while being supported. Mainly during this standby period — high or low temperature stress of about 55 to 150 ° C is applied to the IC device.
[0069] テストチャンバ 120には、その中央部にテストヘッド 5が配置されており、テストヘッド 5の上方にテストトレイ TSTが運ばれて、 ICデバイスの入出力端子をテストヘッド 5の ソケット 50のコンタクトピンに電気的に接触させることにより、 ICデバイスのテストが実 施される。  [0069] The test head 5 is disposed in the center of the test chamber 120, the test tray TST is carried above the test head 5, and the input / output terminals of the IC device are connected to the socket 50 of the test head 5. IC devices are tested by making electrical contact with the contact pins.
[0070] この試験の結果は、テストトレイ TSTに付された識別番号と、テストトレイ TST内に 割り当てられた ICデバイスの番号と、で決定されるアドレスで、電子部品試験装置の 記憶装置に記憶される。  [0070] The result of this test is stored in the storage device of the electronic component test apparatus at an address determined by the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST. Is done.
[0071] アンソークチャンバ 130も、ソークチャンバ 110と同様に、テストチャンバ 120より上 方に突出するように配置され、図 3に概念的に示すように垂直搬送装置が設けられて いる。このアンソークチャンバ 130では、ソークチャンバ 110で ICデバイスに高温を印 カロした場合には、 ICデバイスを送風により冷却して室温に戻した後に、当該除熱され た ICデバイスをアンローダ部 400に搬出する。一方、ソークチャンバ 110で ICデバイ スに低温を印加した場合は、 ICデバイスを温風又はヒータ等で加熱して結露を生じ ない程度の温度まで戻した後に、当該除熱された ICデバイスをアンローダ部 400に 搬出する。  [0071] Like the soak chamber 110, the unsoak chamber 130 is also arranged so as to protrude upward from the test chamber 120, and a vertical transfer device is provided as conceptually shown in FIG. In this unsoak chamber 130, when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air, and then the heat-removed IC device is carried out to the unloader unit 400. To do. On the other hand, when a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return to a temperature at which condensation does not occur, and then the removed IC device is unloaded. Carry out to part 400.
[0072] ソークチャンバ 110の上部には、メインベース 101からテストトレイ TSTを搬入する ための入口が形成されている。同様に、アンソークチャンバ 130の上部には、メイン ベース 101にテストトレイ TSTを搬出するための出口が形成されている。そして、メイ ンベース 101には、これら入口及び出口を通じてテストトレイ TSTをチャンバ部 100 力も出し入れするためのトレィ搬送装置 102が設けられている。このトレィ搬送装置 1 02は、例えば回転ローラ等で構成されている。このトレィ搬送装置 102によって、ァ ンソークチャンバ 130から搬出されたテストトレイ TST力 アンローダ部 400及びロー ダ部 300を介して、ソークチャンバ 110に返送される。 [0072] In the upper part of the soak chamber 110, an inlet for carrying the test tray TST from the main base 101 is formed. Similarly, an outlet for carrying out the test tray TST to the main base 101 is formed in the upper part of the unsoak chamber 130. The main base 101 is provided with a tray transfer device 102 for taking the test tray TST in and out of the chamber portion 100 through these inlets and outlets. This tray conveyor 1 02 is composed of, for example, a rotating roller. The tray conveying device 102 returns the soak chamber 110 to the soak chamber 110 via the test tray TST force unloader unit 400 and the loader unit 300 carried out of the ann soak chamber 130.
[0073] <アンローダ部 400 >  [0073] <Unloader unit 400>
アンローダ部 400は、アンローダ部 400に運び出されたテストトレイ TST力も試験済 みの ICデバイスを、試験結果に応じたカスタマトレィ KSTに積み替える。  The unloader unit 400 reloads the IC device that has been tested with the test tray TST force carried to the unloader unit 400 into the customer tray KST according to the test result.
[0074] 図 2に示すように、アンローダ部 400におけるメインベース 101には、格納部 200力 らアン口ーダ部 400に運び込まれたカスタマトレィ KST力メインベース 101の上面に 臨むように配置される 4つの窓部 406が形成されて 、る。  [0074] As shown in FIG. 2, the main base 101 in the unloader unit 400 is arranged so as to face the upper surface of the customer train KST force main base 101 carried from the storage unit 200 force to the unloader unit 400. Four window portions 406 are formed.
[0075] アンローダ部 400は、試験済みの ICデバイスをテストトレイ TSTからカスタマトレィ K STに積み替えるデバイス搬送装置 410を備えている。このデバイス搬送装置 410は 、メインベース 101上に Y軸方向に沿って架設された 2本の Y軸方向レール 411と、こ の Y軸方向レール 411上を Y軸方向に沿って往復移動可能な可動アーム 412と、可 動アーム 412に X軸方向に沿って移動可能に支持されている可動ヘッド 413と、可 動ヘッド 413に下向きに 2行 8列で配置された 16個の吸着パッド (不図示)と、を備え ている。各吸着パッドは、特に図示しないァクチユエータにより、 Z軸方向に沿って上 下動可能となっており、一度に 16個の ICデバイスをテストトレイ TST力もカスタマトレ ィ KSTに積み替えることが可能となって 、る。  [0075] The unloader unit 400 includes a device transfer device 410 that transfers a tested IC device from the test tray TST to the customer tray KST. This device transport apparatus 410 is capable of reciprocating along the Y-axis direction on two Y-axis direction rails 411 constructed on the main base 101 along the Y-axis direction. Movable arm 412, movable head 413 supported by movable arm 412 so as to be movable along the X-axis direction, and 16 suction pads (not aligned) arranged in two rows and eight columns downward on movable head 413 As shown). Each suction pad can be moved up and down along the Z-axis by an actuator (not shown), and it is possible to transfer 16 IC devices to the customer tray KST as well as the test tray TST force at a time. And
[0076] 図 4及び図 5に示すように、それぞれの窓部 406の下側には、カスタマトレィ KSTを 昇降させるための昇降装置 220が設けられており、ここでは、試験済みの ICデバイス が積み込まれた満載となったカスタマトレィ KSTを載せて下降し、この満載トレィをト レイ移送装置 230に受け渡す。  [0076] As shown in FIGS. 4 and 5, an elevating device 220 for elevating and lowering the customer tray KST is provided below each window 406. Here, a tested IC device is installed. The loaded customer tray KST is loaded and lowered, and this full tray is transferred to the tray transfer device 230.
[0077] 因みに、本実施形態では、仕分け可能なカテゴリが最大で 8種類であるものの、ァ ンローダ部 400には窓部 406が 4箇所しか形成されていないため、アンローダ部 400 には最大 4枚のカスタマトレィ KSTしか配置することができない。従って、リアルタイム に仕分けできるカテゴリは 4分類に制限される。一般的には、良品を動作速度が高速 なもの、中速なもの、低速なものの 3つのカテゴリに分類し、これに不良品を加えて 4 つのカテゴリで十分ではある力 例えば再試験を必要とするもの等のように、これらに 属さないカテゴリが稀に発生する場合がある。 [0077] Incidentally, in this embodiment, although the maximum number of categories that can be sorted is eight, the unloader 400 has only four windows 406, so the unloader 400 has a maximum of four. Only customer train KST can be placed. Therefore, the categories that can be sorted in real time are limited to four categories. In general, good products are classified into three categories: high speed, medium speed, and low speed, and in addition to defective products, four categories are sufficient. For example, retesting is required. Like those that do A category that does not belong may occur in rare cases.
[0078] このように、アンローダ部 400の窓部 406に配置された 4つのカスタマトレィ KSTに 割り当てられたカテゴリ以外のカテゴリに分類される ICデバイスが発生した場合には 、アンローダ部 400から 1枚のカスタマトレィ KSTを格納部 200に戻し、これに代えて 、新たに発生したカテゴリが割り当てられたカスタマトレィ KSTをアンローダ部 400に 転送して ICデバイスを格納すれば良い。但し、この場合には仕分け作業を中断しな ければならず、スループットが低下するといつた問題がある。そのため、本実施形態 では、アンローダ部 400のテストトレイ TSTと窓部 406との間にバッファ部 405を設け 、このバッファ部 405に、稀にし力発生しないカテゴリの ICデバイスを一時的に預かる ようにしている。  [0078] As described above, when an IC device classified into a category other than the category assigned to the four customer trays KST arranged in the window 406 of the unloader unit 400 is generated, one IC is generated from the unloader unit 400. The customer tray KST is returned to the storage unit 200, and instead, the customer tray KST assigned with the newly generated category is transferred to the unloader unit 400 to store the IC device. However, in this case, the sorting operation must be interrupted, and there is a problem when the throughput decreases. Therefore, in the present embodiment, a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and an IC device of a category that rarely generates force is temporarily stored in the buffer unit 405. ing.
[0079] また、本実施形態では、トレイ移送装置 230と昇降装置 220とが互いに干渉するこ となく同時に移動することができるため、窓部 406に割り当てられているカテゴリを切り 替えるためにカスタマトレィ KSTを交換する際にも、トレイ搬送時間を短縮することが できる。  [0079] Further, in this embodiment, since the tray transfer device 230 and the lifting device 220 can move simultaneously without interfering with each other, the customer train is used to switch the category assigned to the window 406. Tray transport time can be shortened when replacing KST.
[0080] 次に、本発明の実施形態に係る電子部品試験装置におけるトレイ搬送方法につい て説明する。  Next, a tray conveying method in the electronic component testing apparatus according to the embodiment of the present invention will be described.
[0081] 図 11A〜図 11Lは、本実施形態におけるトレイ搬送方法の第 1例を示す模式図(そ の 1〜 12)である。先ず、図 11A〜図 11Lを参照して、図中において最左側の第 1の 昇降装置 220aにより保持されて窓部 406に位置している満載のカスタマトレィ KST  FIG. 11A to FIG. 11L are schematic views (parts 1 to 12) showing a first example of the tray transport method in the present embodiment. First, referring to FIG. 11A to FIG. 11L, a fully loaded customer tray KST held by the first lifting device 220a on the leftmost side in the figure and positioned in the window 406.
f を試験済ストツ力 STK— 2に回収すると共に、空トレイストツ力 STK—Eから当該第 1 の窓部 406aに空のカスタマトレィ KSTを供給する例について説明する。なお、以下  An example will be described in which f is recovered to the tested stock force STK-2 and the empty customer tray KST is supplied from the empty tray stock force STK-E to the first window 406a. The following
e  e
の説明にお 、て、図 11 A〜図 12N中に示される 4つの昇降装置を左側力も順に第 1 〜第 4の昇降装置 220a〜220dと称し、同図中に示される 2つの保持ヘッドを左側か ら順に第 1〜第 2の保持ヘッド 234A、 234Bと称する。  In the explanation, the four lifting devices shown in FIGS. 11A to 12N are also referred to as the first to fourth lifting devices 220a to 220d in order from the left side force, and the two holding heads shown in FIG. The first and second holding heads 234A and 234B are referred to in order from the left side.
[0082] 第 1の昇降装置 220aに保持されて 、るカスタマトレィ KSTの交換要求が発せられ ると、先ず、図 11Aに示すように第 1の昇降装置 220aが下降を開始する。この第 1の 昇降装置 220aが下降をしている間に、図 11Bに示すように、第 1の保持ヘッド 234A が上昇を開始すると共に、第 2の保持ヘッド 234Bが下降を開始する。第 1の昇降装 置 220aは、第 2の規制位置 Hまで下降したら停止し、第 1の保持ヘッド 234Aは、第 [0082] When a customer tray KST replacement request is issued and held by the first lifting device 220a, first, the first lifting device 220a starts to descend as shown in FIG. 11A. While the first elevating device 220a is descending, as shown in FIG. 11B, the first holding head 234A starts to rise and the second holding head 234B starts to descend. 1st lifting equipment The device 220a stops when it is lowered to the second restriction position H, and the first holding head 234A
2  2
1の移動可能位置 Mまで上昇したら停止する。また、第 2の保持ヘッド 234Bは、空ト レイストツ力 STK—Eまで下降したら停止して、最上段に位置している空のカスタマト レイ KSTを把持する。  Stop when you reach the movable position M of 1. Further, the second holding head 234B stops when it is lowered to the empty trust force STK-E, and holds the empty customer tray KST located at the uppermost stage.
e  e
[0083] このように、本実施形態では、第 1の昇降装置 220aと第 1及び第 2の保持ヘッド 23 Thus, in the present embodiment, the first lifting device 220a and the first and second holding heads 23
4A、 234Bを同時に移動させるので、トレイ搬送時間を短縮することができる。 Since 4A and 234B are moved simultaneously, the tray transport time can be shortened.
[0084] 次に、図 11Cに示すように、第 2の保持ヘッド 234Bが第 2の移動可能位置 Hまで Next, as shown in FIG. 11C, the second holding head 234B is moved to the second movable position H.
2 上昇したら、図 11Dに示すように、第 1の保持ヘッド 234Aが第 1の昇降装置 220aの 上方に位置するように、第 1及び第 2の保持ヘッド 234Aが水平方向に沿って移動す る。この際、同図に示すように、第 1の保持ヘッド 234Aは、第 1の移動可能位置 M において水平方向に移動すると共に、第 2の保持ヘッド 234Bは第 2の移動可能位 置 Mにおいて水平方向に移動する。  2 When lifted, as shown in FIG. 11D, the first and second holding heads 234A move along the horizontal direction so that the first holding head 234A is positioned above the first lifting device 220a. . At this time, as shown in the figure, the first holding head 234A moves in the horizontal direction at the first movable position M, and the second holding head 234B moves horizontally at the second movable position M. Move in the direction.
2  2
[0085] 次に、図 11Eに示すように、第 1の保持ヘッド 234Aが下降して、第 1の昇降装置 2 20aから満載のカスタマトレィ KSTを受け取ると共に、第 2の保持ヘッド 234Bが第 1 f  [0085] Next, as shown in FIG. 11E, the first holding head 234A is lowered to receive the full customer tray KST from the first lifting device 220a, and the second holding head 234B is the first holding head 234B. f
の移動可能位置 Mまで上昇する。ここで、本実施形態では、第 1の保持ヘッド 234A と第 2の保持ヘッド 234Bを同時に移動させるので、トレイ搬送時間を短縮することが できる。図 11Fに示すように、満載のカスタマトレィ KSTを第 1の昇降装置 220aから f  Ascend to moveable position M. Here, in this embodiment, since the first holding head 234A and the second holding head 234B are moved simultaneously, the tray transport time can be shortened. As shown in Figure 11F, load the full customer tray KST from the first lifting device 220a to f
受け取ったら、第 1の保持ヘッド 234Aも第 1の移動可能位置 Mまで上昇する。  Upon receipt, the first holding head 234A is also raised to the first movable position M.
[0086] 次に、図 11Gに示すように、第 1及び第 2の保持ヘッド 234A、 234Bは、第 2の保 持ヘッド 234Bが第 1の昇降装置 220aの上方に位置するように、第 1の移動可能位 置 Mにおいて水平方向に移動する。第 2の保持ヘッド 234Bが第 1の昇降装置 220 aの上方に位置したら、図 11Hに示すように、第 1及び第 2の保持ヘッド 234A、 234 Bが下降を開始する。第 1の保持ヘッド 234Aは、第 2の移動可能位置 Mまで下降し Next, as shown in FIG. 11G, the first and second holding heads 234A, 234B are arranged such that the second holding head 234B is positioned above the first lifting device 220a. Moves horizontally at the movable position M. When the second holding head 234B is positioned above the first lifting device 220a, the first and second holding heads 234A and 234B start to descend as shown in FIG. 11H. The first holding head 234A moves down to the second movable position M.
2 たら停止する。また、第 2の保持ヘッド 234Bは、第 1の昇降装置 220aまで下降したら 停止して、空のカスタマトレィ KSTを第 1の昇降装置 220aに引き渡す。ここで、本実 e  2 Stop. Further, the second holding head 234B stops when it is lowered to the first lifting device 220a, and hands over the empty customer tray KST to the first lifting device 220a. Where real e
施形態では、第 1の保持ヘッド 234Aと第 2の保持ヘッド 234Bを同時に移動させるの で、トレイ搬送時間を短縮することができる。  In the embodiment, since the first holding head 234A and the second holding head 234B are moved simultaneously, the tray conveyance time can be shortened.
[0087] 次に、図 111に示すように、第 2の保持ヘッド 234Bが第 1の移動可能位置 Mまで 上昇したら、図 11Jに示すように、第 1及び第 2の保持ヘッド 234A、 234Bは、第 1の 保持ヘッド 234Aが試験済ストツ力 STK— 2の上方に位置するように、水平方向に移 動する。この際、同図に示すように、第 1の保持ヘッド 234Aは、第 2の移動可能位置 Mにおいて水平方向に移動し、第 2の保持ヘッド 234Bは、第 1の移動可能位置 M[0087] Next, as shown in FIG. 111, the second holding head 234B moves to the first movable position M. Once raised, as shown in FIG. 11J, the first and second holding heads 234A, 234B move horizontally so that the first holding head 234A is positioned above the tested stock force STK-2. To do. At this time, as shown in the figure, the first holding head 234A moves in the horizontal direction at the second movable position M, and the second holding head 234B moves at the first movable position M.
2 1 にお!、て水平方向に移動する。 2 Move to 1! And move horizontally.
[0088] 第 1の保持ヘッド 234Aが試験済ストツ力 STK— 2の上方に位置したら、図 11Kに 示すように、第 1及び第 2の保持ヘッド 234A、 234Bが下降すると共に、第 1の昇降 装置 220aが上昇する。第 1の保持ヘッド 234Aは、試験済ストツ力 STK— 2まで下降 したら停止して、満載のカスタマトレィ KSTを試験済ストツ力 STK— 2に引き渡す。第 f [0088] When the first holding head 234A is positioned above the tested stock force STK-2, as shown in FIG. 11K, the first and second holding heads 234A and 234B are lowered and the first raising and lowering is performed. Device 220a is raised. When the first holding head 234A descends to the tested stock force STK-2, it stops and delivers the full customer tray KST to the tested stock force STK-2. F
2の保持ヘッド 234Bは、第 2の移動可能位置 Mまで下降したら停止する。  The second holding head 234B stops when it is lowered to the second movable position M.
2  2
[0089] このように、本実施形態では、第 1の昇降装置 220aと第 1及び第 2の保持ヘッド 23 Thus, in this embodiment, the first lifting device 220a and the first and second holding heads 23
4A、 234Bを同時に移動させるので、トレイ搬送時間を短縮することができる。 Since 4A and 234B are moved simultaneously, the tray transport time can be shortened.
[0090] 次いで、図 11Lに示すように、第 1の保持ヘッド 234Aが第 2の移動可能位置 Mま Next, as shown in FIG. 11L, the first holding head 234A moves to the second movable position M.
2 で上昇すると共に、第 1の昇降装置 220aが第 1の規制位置 Hまで上昇する。この状 態において、空のカスタマトレィ KSTが第 1の昇降装置 220aにより保持されて、窓 e  The first elevating device 220a rises to the first restricting position H as it rises at 2. In this state, an empty customer tray KST is held by the first lifting device 220a and the window e
部 406を介して、アンローダ部 400に臨んでいると共に、満載のカスタマトレィ KST f が試験済ストツ力 STK— 2に格納されているので、一連のトレイ搬送作業が完了する  It faces the unloader section 400 via the section 406, and the full customer tray KST f is stored in the tested stock force STK-2, thus completing a series of tray transport operations.
[0091] 図 12A〜図 12Nは、本実施形態におけるトレイ搬送方法の第 2例を示す模式図( その 1〜14)である。次に、図 12A〜図 12Nを参照して、第 2の昇降装置 220bにより 保持されて窓部 406に位置して!/、る満載のカスタマトレィ KSTを試験済ストツ力 STK f FIGS. 12A to 12N are schematic views (Nos. 1 to 14) showing a second example of the tray transport method in the present embodiment. Next, referring to FIGS. 12A to 12N, a fully loaded customer train KST held by the second lifting / lowering device 220b and positioned in the window 406!
—2に回収すると共に、空トレイストツ力 STK—Eから当該第 1の窓部 406bに空の力 スタマトレイ KSTを供給する例について説明する。  An example in which the empty force stapling tray KST is supplied to the first window 406b from the empty tray stocking force STK-E while being collected in -2.
e  e
[0092] 図 12Aに示すように、先ず、第 2の昇降装置 220bが下降を開始する。この第 2の昇 降装置 220bが下降している間に、図 12Bに示すように、空トレイストツ力 STK— Eの 上方に位置している第 2の保持ヘッド 234Bも下降を開始する。第 2の昇降装置 220 bは、第 2の規制位置 Hまで下降したら停止する。また、第 2の保持装置 234Bは、空  [0092] As shown in FIG. 12A, first, the second lifting device 220b starts to descend. While the second raising / lowering device 220b is descending, as shown in FIG. 12B, the second holding head 234B positioned above the empty tray stocks force STK-E also begins to descend. The second lifting device 220 b stops when it is lowered to the second restriction position H. The second holding device 234B is empty.
2  2
トレイストツ力 STK— Eまで下降したら、最上段に位置している空のカスタマトレィ KS Tを把持する。 When the tray strike force STK— E is lowered, the empty customer tray KS located at the top Hold T
e  e
[0093] このように、本実施形態では、第 2の昇降装置 220bの真下に第 1の保持ヘッド 234 Aが位置して 、ても、第 2の昇降装置 220bと第 1の保持ヘッド 234Bとが干渉すること なぐ第 2の昇降装置 220bを下降させることができ、また、第 2の昇降装置 220bと第 2の保持ヘッド 234Bを同時に移動させることもできるので、トレイ搬送時間を短縮す ることがでさる。  Thus, in the present embodiment, even if the first holding head 234A is located directly below the second lifting device 220b, the second lifting device 220b and the first holding head 234B The second lifting / lowering device 220b can be lowered without interference, and the second lifting / lowering device 220b and the second holding head 234B can be moved at the same time. It is out.
[0094] 因みに、第 2の移動可能位置 Mを有しな 、従来のトレイ搬送装置の場合には、第  [0094] Incidentally, in the case of a conventional tray transport device that does not have the second movable position M, the first
2  2
2の保持ヘッド 234Bが空ストッカトレイ STK—Eから空のカスタマトレィ KSTを受け  2 holding head 234B receives empty customer tray KST from empty stocker tray STK-E
e 取り、さらに、第 1及び第 2の保持ヘッド 234A、 234Bが第 2の昇降装置 220bの真下 力も退避した後でなければ、第 2の昇降装置 220bの下降を開始することができず、こ れがトレイ搬送作業における待ち時間となっていた。  In addition, if the first and second holding heads 234A, 234B have not retracted the force directly below the second lifting device 220b, the second lifting device 220b cannot start to move down. This was a waiting time in the tray transfer work.
[0095] 次に、図 12Cに示すように、第 2の保持ヘッド 234Bが第 2の移動可能位置 Mまで [0095] Next, as shown in FIG. 12C, the second holding head 234B moves to the second movable position M.
2 上昇したら、図 12Dに示すように、第 1の保持ヘッド 234Aが第 2の昇降装置 220bの 真下から外れるように、第 1及び第 2の保持ヘッド 234A、 234Bが水平方向に移動す る。この際、第 1及び第 2の保持ヘッド 234A、 234Bは、いずれも第 2の移動可能位 置 Mにおいて水平方向に移動する。  2 When lifted, as shown in FIG. 12D, the first and second holding heads 234A and 234B move in the horizontal direction so that the first holding head 234A comes off from directly below the second lifting device 220b. At this time, the first and second holding heads 234A and 234B both move in the horizontal direction at the second movable position M.
2  2
[0096] 次に、図 12Eに示すように、第 1の保持ヘッド 234Aが第 1の移動可能位置 Mまで 上昇したら、図 12Fに示すように、第 1及び第 2の保持ヘッド 234A、 234Bは、第 1の 保持ヘッド 234Aが第 2の昇降装置 220の上方に位置するように、水平方向に移動 する。この際、同図に示すように、第 1の保持ヘッド 234Aは、第 1の移動可能位置 M において水平移動し、第 2の保持ヘッド 234Bは、第 2の移動可能位置 Mにおいて Next, as shown in FIG. 12E, when the first holding head 234A rises to the first movable position M, as shown in FIG. 12F, the first and second holding heads 234A, 234B Then, the first holding head 234A moves in the horizontal direction so as to be positioned above the second lifting device 220. At this time, as shown in the figure, the first holding head 234A moves horizontally at the first movable position M, and the second holding head 234B moves at the second movable position M.
1 2 水平移動する。 1 2 Move horizontally.
[0097] 次に、図 12Gに示すように、第 1の保持ヘッド 234Aが下降して、第 2の昇降装置 2 20bから満載のカスタマトレィ KSTを受け取ると共に、第 2の保持ヘッド 234Bが第 1  Next, as shown in FIG. 12G, the first holding head 234A is lowered to receive the full customer tray KST from the second lifting device 220b, and the second holding head 234B is the first holding head 234B.
f  f
の移動可能位置 Mまで上昇する。ここで、本実施形態では、第 1の保持ヘッド 234A と第 2の保持ヘッド 234Bを同時に移動させるので、トレイ搬送時間を短縮することが できる。図 12Hに示すように、第 1の保持ヘッド 234Aが満載のカスタマトレィ KSTを  Ascend to moveable position M. Here, in this embodiment, since the first holding head 234A and the second holding head 234B are moved simultaneously, the tray transport time can be shortened. As shown in Figure 12H, the customer tray KST packed with the first holding head 234A
f 第 2の昇降装置 220bから受け取ったら、当該第 1の保持ヘッド 234Aも第 1の移動可 能位置 まで上昇する。 f When received from the second lifting device 220b, the first holding head 234A is also movable in the first position. Ascend to the active position.
[0098] 次に、図 121に示すように、第 1及び第 2の保持ヘッド 234Α、 234Βは、第 2の保持 ヘッド 234Βが第 2の昇降装置 220bの上方に位置するように、第 1の移動可能位置 Mにおいて水平方向に移動する。第 2の保持ヘッド 234Bが第 2の昇降装置 220b の上方に位置したら、図 12Jに示すように、第 1及び第 2の保持ヘッド 234A、 234B が下降を開始する。第 1の保持ヘッド 234Aは、第 2の移動可能位置 Mまで下降した [0098] Next, as shown in FIG. 121, the first and second holding heads 234Β and 234Β are arranged so that the second holding head 234Β is positioned above the second lifting device 220b. Move horizontally at movable position M. When the second holding head 234B is positioned above the second lifting / lowering device 220b, the first and second holding heads 234A and 234B start to descend as shown in FIG. 12J. The first holding head 234A is lowered to the second movable position M.
2  2
ら停止する。また、第 2の保持ヘッド 234Bは、第 2の昇降装置 220bまで下降したら 停止して、空のカスタマトレィ KSTを第 2の昇降装置 220bに引き渡す。ここで、本実 e  Stop. The second holding head 234B stops when it is lowered to the second lifting device 220b, and hands over the empty customer tray KST to the second lifting device 220b. Where real e
施形態では、第 1の保持ヘッド 234Aと第 2の保持ヘッド 234Bを同時に移動させるの で、トレイ搬送時間を短縮することができる。  In the embodiment, since the first holding head 234A and the second holding head 234B are moved simultaneously, the tray conveyance time can be shortened.
[0099] 次に、図 12Kに示すように、第 2の保持ヘッド 234Bが第 1の移動可能位置 Mまで 上昇したら、図 12Lに示すように、第 1及び第 2の保持ヘッド 234A、 234Bは、第 1の 保持ヘッド 234Aが試験済ストツ力 STK— 2の上方に位置するように、水平方向に移 動する。この際、同図に示すように、第 1の保持ヘッド 234Aは、第 2の移動可能位置 Mにおいて水平方向に移動し、第 2の保持ヘッド 234Bは、第 1の移動可能位置 MNext, as shown in FIG. 12K, when the second holding head 234B rises to the first movable position M, as shown in FIG. 12L, the first and second holding heads 234A, 234B Then, the first holding head 234A is moved horizontally so that it is positioned above the tested stock force STK-2. At this time, as shown in the figure, the first holding head 234A moves in the horizontal direction at the second movable position M, and the second holding head 234B moves at the first movable position M.
2 1 にお!、て水平方向に移動する。 2 Move to 1! And move horizontally.
[0100] 第 1の保持ヘッド 234Aが試験済ストツ力 STK—Eの上方に位置したら、図 12Mに 示すように、第 1及び第 2の保持ヘッド 234A、 234Bが下降すると共に、第 2の昇降 装置 220bが上昇する。第 1の保持ヘッド 234Aは、試験済ストツ力 STK— 2まで下降 したら停止して、満載のカスタマトレィ KSTを試験済ストツ力 STK— 2に引き渡す。第 f [0100] When the first holding head 234A is positioned above the tested stock force STK-E, as shown in FIG. 12M, the first and second holding heads 234A and 234B are lowered and the second lifting and lowering is performed. Device 220b is raised. When the first holding head 234A descends to the tested stock force STK-2, it stops and delivers the full customer tray KST to the tested stock force STK-2. F
2の保持ヘッド 234Bは、第 2の移動可能位置 Mまで下降したら停止する。  The second holding head 234B stops when it is lowered to the second movable position M.
2  2
[0101] このように、本実施形態では、第 1の昇降装置 220aと第 1及び第 2の保持ヘッド 23 Thus, in the present embodiment, the first elevating device 220a and the first and second holding heads 23
4A、 234Bを同時に移動させるので、トレイ搬送時間を短縮することができる。 Since 4A and 234B are moved simultaneously, the tray transport time can be shortened.
[0102] 次いで、図 12Nに示すように、第 1の保持ヘッド 234Aが第 2の移動可能位置 Mま [0102] Next, as shown in FIG. 12N, the first holding head 234A moves to the second movable position M.
2 で上昇すると共に、第 2の昇降装置 220bが第 1の規制位置 Hまで上昇する。この状 態において、空のカスタマトレィ KSTが第 2の昇降装置 220bにより保持されて、窓 e  At the same time, the second elevating device 220b is raised to the first restriction position H. In this state, an empty customer tray KST is held by the second lifting / lowering device 220b and the window e
部 406を介して、アンローダ部 400に臨んでいると共に、満載のカスタマトレィ KST f が試験済ストツ力 STK— Eに格納されているので、一連のトレイ搬送作業が完了する [0103] 以上のように、本実施形態では、トレイ移送装置 230が、水平方向に沿って移動す ることが可能な、垂直方向における 2つの移動可能位置 M、 Mを有しているので、ト Through the unit 406, the unloader unit 400 is faced, and the full customer tray KST f is stored in the tested stock force STK-E. [0103] As described above, in the present embodiment, the tray transfer device 230 has two movable positions M and M in the vertical direction that can move along the horizontal direction. G
1 2  1 2
レイ移送装置 230と昇降装置 220とが互いに干渉することなく同時に移動することが でき、トレイ搬送時間を短縮する。  The lay transfer device 230 and the lifting device 220 can move simultaneously without interfering with each other, and the tray transport time is shortened.
[0104] なお、以上説明した実施形態は、本発明の理解を容易にするために記載されたも のであって、本発明を限定するために記載されたものではない。したがって、上記の 実施形態に開示された各要素は、本発明の技術的範囲に属する全ての設計変更や 均等物をも含む趣旨である。  [0104] The embodiment described above is described for facilitating the understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment includes all design changes and equivalents belonging to the technical scope of the present invention.
[0105] 例えば、保持ヘッド 234A、 234Bの間にフローティングジョイントやロックアンドフリ 一機構のようなピッチ変更機構を設けて、保持ヘッド 234A、 234B間のピッチを変更 可能とし、保持ヘッド 234A、 234Bが昇降装置 220ゃストツ力 210に接触することで 、昇降装置 220ゃストツ力 210に対して各保持ヘッド 234A、 234Bを位置決めするよ うに構成しても良い。これにより、第 1の保持ヘッド 234Aと第 2の保持ヘッド 234Bが 、昇降装置 220ゃストツ力 210に同時に接近することが可能となり、トレイ搬送時間を 更に短縮することができる。  For example, a pitch changing mechanism such as a floating joint or a lock-and-free mechanism is provided between the holding heads 234A and 234B so that the pitch between the holding heads 234A and 234B can be changed. The holding heads 234A and 234B may be positioned relative to the lifting device 220 by contacting the lifting force 210 with the lifting force 220. Thus, the first holding head 234A and the second holding head 234B can simultaneously approach the lifting device 220 and the stocking force 210, and the tray transport time can be further shortened.

Claims

請求の範囲 The scope of the claims
[1] 被試験電子部品を収容可能な第 1のトレイを搬送するためのトレィ搬送装置であつ て、  [1] A tray transport device for transporting a first tray capable of accommodating an electronic device under test,
前記第 1のトレイを格納する格納手段と、  Storage means for storing the first tray;
前記第 1のトレイを保持することが可能であると共に、第 1の方向に沿って移動する ことが可能な保持手段と、  Holding means capable of holding the first tray and capable of moving along the first direction;
前記格納手段と前記保持手段との間で前記第 1のトレイの受け渡しを行うために、 前記第 1のトレイを保持して前記第 1の方向、及び、前記第 1の方向とは異なる第 2の 方向に沿って移動させることが可能な移送手段と、を備え、  In order to transfer the first tray between the storage means and the holding means, the first tray is held and the second direction is different from the first direction and the first direction. Transportation means capable of moving along the direction of
前記移送手段は、前記移送手段が前記第 2の方向に沿って移動することが可能な 、前記第 1の方向における移動可能位置を複数有することを特徴とするトレィ搬送装 置。  The tray transport apparatus according to claim 1, wherein the transfer means has a plurality of movable positions in the first direction, in which the transfer means can move along the second direction.
[2] 前記移送手段は、前記保持手段の位置に関わらず、少なくとも一つの前記移動可 能位置で、前記保持手段に干渉することなく前記第 2の方向に移動可能であることを 特徴とする請求項 1記載のトレイ搬送装置。  [2] The transfer means is capable of moving in the second direction without interfering with the holding means at at least one movable position regardless of the position of the holding means. The tray transfer device according to claim 1.
[3] 前記保持手段は、第 1の規制位置と第 2の規定位置との間で前記第 1の方向に沿 つて移動可能となっており、  [3] The holding means is movable along the first direction between a first restricted position and a second prescribed position,
前記複数の移動可能位置は、  The plurality of movable positions are:
前記第 1の規制位置と前記第 2の規定位置との間を前記第 2の方向に沿って前記 移送手段が移動することが可能な第 1の移動可能位置と、  A first movable position where the transfer means can move along the second direction between the first restricted position and the second defined position;
前記第 2の規定位置と前記格納手段との間を前記第 2の方向に沿って前記移送手 段が移動することが可能な第 2の移動可能位置と、を含むことを特徴とする請求項 1 又は 2記載のトレイ搬送装置。  And a second movable position where the transfer means can move along the second direction between the second prescribed position and the storage means. The tray transfer device according to 1 or 2.
[4] 前記格納手段と、前記第 2の規定位置に位置している前記保持手段との間に、前 記移送手段が通過可能な空間が形成されており、 [4] A space through which the transfer means can pass is formed between the storage means and the holding means located at the second specified position,
前記第 2の移動可能位置は、前記空間に設けられていることを特徴とする請求項 3 記載のトレイ搬送装置。  4. The tray transport device according to claim 3, wherein the second movable position is provided in the space.
[5] 前記移送手段は、前記第 1のトレイを保持可能であり、且つ、相互に独立して前記 第 1の方向に沿って移動可能な複数の保持ヘッドを有し、 [5] The transfer means is capable of holding the first tray and is independent of each other. A plurality of holding heads movable along the first direction;
前記移送手段は、前記複数の保持ヘッドを前記第 2の方向に沿って同時に移動さ せることが可能であることを特徴とする請求項 1〜4の何れかに記載のトレイ搬送装置  5. The tray transport device according to claim 1, wherein the transfer unit is capable of simultaneously moving the plurality of holding heads along the second direction.
[6] 前記移送手段は、前記第 1のトレイを保持可能であり、且つ、前記第 1の方向及び 前記第 2の方向に沿って相互に独立して移動可能な複数の保持ヘッドを有すること を特徴とする請求項 1〜4の何れかに記載のトレイ搬送装置。 [6] The transfer means has a plurality of holding heads capable of holding the first tray and movable independently of each other along the first direction and the second direction. The tray transport device according to any one of claims 1 to 4, wherein
[7] 前記移送手段は、前記第 1の移動可能位置に位置している一の前記保持ヘッドと 、前記第 2の移動可能位置に位置している他の前記保持ヘッドとを、前記第 2の方向 に沿って同時に移動させることが可能であることを特徴とする請求項 5又は 6記載のト レイ搬送装置。  [7] The transfer means may include the one holding head positioned at the first movable position and the other holding head positioned at the second movable position. The tray transfer device according to claim 5 or 6, wherein the tray transfer device can be moved simultaneously along the direction of.
[8] 前記移送手段は、複数の前記第 1のトレイを保持して同時に移動させることが可能 であり、  [8] The transfer means is capable of holding and moving a plurality of the first trays simultaneously,
前記保持手段も、複数の前記第 1のトレイを保持して同時に移動させることが可能 であることを特徴とする請求項 1〜7の何れかに記載のトレイ搬送装置。  8. The tray transport device according to claim 1, wherein the holding unit is also capable of holding and moving a plurality of the first trays simultaneously.
[9] 被試験電子部品の入出力端子をテストヘッドのコンタクト部に電気的に接触させて 前記被試験電子部品のテストを行うために用いられる電子部品試験装置であって、 請求項 1〜8の何れかに記載のトレイ搬送装置を備えていることを特徴とする電子 部品試験装置。 [9] An electronic component testing apparatus used for testing the electronic device under test by bringing an input / output terminal of the electronic device under test into electrical contact with a contact portion of a test head, An electronic component test apparatus comprising the tray transfer device according to any one of the above.
[10] 前記被試験電子部品を前記第 1のトレイから第 2のトレイに積み替えるローダ部と、 前記ローダ部から搬入された前記被試験電子部品を前記第 2のトレイに搭載したま まの状態で前記テストヘッドのコンタクト部に押し付けるテスト部と、  [10] A loader unit for transferring the electronic device under test from the first tray to the second tray, and the electronic device under test loaded from the loader unit mounted on the second tray. A test part pressed against the contact part of the test head in a state;
試験結果に応じて、試験済みの前記被試験電子部品を前記第 2のトレイから前記 第 1のトレイに積み替えるアンローダ部と、を備えており、  An unloader section that reloads the tested electronic components from the second tray to the first tray according to a test result,
前記トレィ搬送装置は、試験前の前記被試験電子部品が収容された前記第 1のト レイを前記ローダ部に供給し、試験後の前記被試験電子部品が収容された前記第 2 のトレイを前記アンローダ部力 受け取ることを特徴とする請求項 9記載の電子部品 試験装置。  The tray transport device supplies the first tray in which the electronic device under test before the test is accommodated to the loader unit, and the second tray in which the electronic device under test after the test is accommodated. 10. The electronic component testing apparatus according to claim 9, wherein the unloader unit force is received.
PCT/JP2006/320401 2006-10-12 2006-10-12 Tray transfer apparatus and electronic component testing apparatus provided with the same WO2008044305A1 (en)

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