WO2008044305A1 - Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau - Google Patents

Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau Download PDF

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Publication number
WO2008044305A1
WO2008044305A1 PCT/JP2006/320401 JP2006320401W WO2008044305A1 WO 2008044305 A1 WO2008044305 A1 WO 2008044305A1 JP 2006320401 W JP2006320401 W JP 2006320401W WO 2008044305 A1 WO2008044305 A1 WO 2008044305A1
Authority
WO
WIPO (PCT)
Prior art keywords
tray
holding
test
transfer
movable
Prior art date
Application number
PCT/JP2006/320401
Other languages
English (en)
Japanese (ja)
Inventor
Yuji Kaneko
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to KR1020097008270A priority Critical patent/KR101104291B1/ko
Priority to JP2008538542A priority patent/JP5022375B2/ja
Priority to PCT/JP2006/320401 priority patent/WO2008044305A1/fr
Priority to TW096134691A priority patent/TW200834097A/zh
Publication of WO2008044305A1 publication Critical patent/WO2008044305A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Definitions

  • the present invention relates to an IC device by electrically contacting input / output terminals of various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) to a contact portion of a test head.
  • the present invention relates to an electronic component test apparatus to be tested, and more particularly to a tray transfer apparatus for transferring a tray that can accommodate an IC device, and an electronic component test apparatus including the tray transfer apparatus.
  • an electronic component testing apparatus In the manufacturing process of electronic components such as IC devices, an electronic component testing apparatus is used to test the performance and function of an Ic device in a knocked state.
  • a handler constituting the electronic component testing apparatus includes a storage unit, a loader unit, a chamber unit, and an unloader unit.
  • the handler loader section is circulated and transported in the electronic component testing apparatus from a tray (hereinafter referred to as a customer tray) for storing pre-test IC devices or test-tested IC devices.
  • the IC device is reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
  • each IC device is brought into electrical contact with the contact portion of the test head, and the electronic component test apparatus main body (hereinafter referred to as the main part) , Called Tester).
  • test tray loaded with the tested IC device is carried out to the unloader section with the force of the chamber section, and the IC device is mounted on the customer tray according to the test result in the unloader section. Sorting into categories such as non-defective products and defective products is performed.
  • the storage unit of the handler supplies the customer tray storing the IC device before the test to the loader unit, and accepts the customer tray in which the IC devices after the test are classified and stored from the unloader unit.
  • the storage unit stores a plurality of customer trays in a stacked state, and lifts and lowers the lifting force that can hold and move the customer train and move up and down.
  • a tray transfer device that is movable in the vertical and horizontal directions to pass the customer tray to and from the force.
  • An object of the present invention is to provide a tray transport apparatus capable of shortening the tray transport time and an electronic component testing apparatus including the same.
  • a tray transport apparatus for transporting a first tray capable of accommodating an electronic device under test, which stores the first tray.
  • Means a holding means capable of holding the first tray and capable of moving along a first direction, and the first means between the storage means and the holding means.
  • the first tray can be held and moved along the first direction and a second direction different from the first direction.
  • the transfer means has a plurality of movable positions in the first direction at which the transfer means can move along the second direction.
  • a feeding device is provided (see claim 1).
  • the transfer means has a plurality of movable positions in the first direction in which the transfer means can move along the second direction.
  • the transfer means and the holding means can move simultaneously without interfering with each other, so that the tray transport time can be shortened.
  • the transfer means is in the second direction without interfering with the holding means in at least one movable position regardless of the position of the holding means. It is preferable to be movable (see claim 2).
  • the holding means is movable along the first direction between a first restricting position and a second prescribed position
  • the movable position includes a first movable position where the transfer means can move along the second direction between the first restricted position and the second defined position; and And a second movable position where the transfer means can move along the second direction between a second prescribed position and the storage means. (See claim 3).
  • a space through which the transfer means can pass is formed between the storage means and the holding means located at the second specified position.
  • the second movable position is provided in the space (see claim 4).
  • the transfer means is capable of holding the first tray and is capable of moving along the first direction independently of each other.
  • the holding means has a holding head, and the transfer means is capable of simultaneously moving the plurality of holding heads along the second direction (see claim 5).
  • the transfer means is capable of holding the first tray and independent of each other along the first direction and the second direction. It is preferable to have a plurality of movable holding heads (see claim 6).
  • the transfer means is located at the first movable position V, the one holding head, and the second movable position, It is preferable that the other holding head can be simultaneously moved along the second direction (refer to claim 7).
  • the transfer means includes a plurality of the first toner. It is possible to hold a ray and move it simultaneously, and the holding means also includes a plurality of the first
  • one tray can be held and moved simultaneously (see claim 8).
  • the input / output terminal of the electronic device under test is used for testing the electronic device under test by making electrical contact with the contact portion of the test head.
  • an electronic component testing apparatus comprising any one of the above-described tray conveyance devices (see claim 9).
  • a loader unit for transferring the electronic device under test to the first tray and a second tray, and the electronic device under test carried in from the loader unit are A test part that is pressed against the contact part of the test head in a state where it is mounted on the second tray, and the tested electronic components that have been tested are transferred to the second tray carder and the first tray according to the test result.
  • the second tray in which the second load is accommodated is also received by the unloader force (see claim 10).
  • FIG. 1 is a side view showing an entire electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view of the electronic device test apparatus shown in FIG.
  • FIG. 3 is a conceptual diagram showing a tray handling method in the electronic component testing apparatus of FIG.
  • FIG. 4 is a front view showing a storage portion of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 5 is a side view showing a storage portion of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 7 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 8 is a front view showing a storage portion of an electronic component testing apparatus according to another embodiment of the present invention.
  • FIG. 9 is a front view showing a storage part of an electronic component test apparatus according to still another embodiment of the present invention.
  • FIG. 10 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11A is a schematic diagram (No. 1) illustrating a first example of a tray transport method by a tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11B is a schematic diagram (No. 2) showing the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11C is a schematic diagram (No. 3) illustrating a first example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 11D is a schematic diagram (No. 4) illustrating a first example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 11E is a schematic diagram (No. 5) showing the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11F is a schematic diagram (No. 6) illustrating a first example of a tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11G is a schematic diagram (No. 7) showing the first example of the tray carrying method by the tray carrying device of the electronic device testing apparatus according to the embodiment of the present invention.
  • FIG. 11H is a schematic diagram (No. 8) illustrating the first example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 111 is a schematic diagram (No. 9) showing the first example of the tray transport method by the tray transport device of the electronic device testing apparatus according to the embodiment of the present invention.
  • FIG. 11J is a schematic diagram (No. 10) showing the first example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11K is a schematic view (No. 11) showing the first example of the tray transfer method by the tray transfer device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 11L is a schematic diagram (No. 12) illustrating the first example of the tray transport method by the tray transport device of the electronic component testing device according to the embodiment of the present invention.
  • FIG. 12A is a schematic diagram (No. 1) showing a second example of a tray transport method by the tray transport device of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 12B is a schematic diagram (No. 2) showing a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12C is a schematic diagram (No. 3) illustrating a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12D is a schematic diagram (No. 4) illustrating the second example of the tray transport method by the tray transport device of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 12E is a schematic diagram (No. 5) illustrating the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12F is a schematic diagram (No. 6) showing a second example of the tray conveying method by the tray conveying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12G is a schematic diagram (No. 7) illustrating a second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12H is a schematic diagram (No. 8) illustrating the second example of the tray transport method by the tray transport device of the electronic component testing device according to the embodiment of the present invention.
  • FIG. 121 is a schematic diagram (No. 9) illustrating the second example of the tray transport method by the tray transport device of the electronic device testing apparatus according to the embodiment of the present invention.
  • FIG. 12J is a schematic diagram (No. 10) showing a second example of the tray conveying method by the tray conveying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12K is a schematic diagram (No. 11) showing the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12L is a schematic diagram (No. 12) showing the second example of the tray carrying method by the tray carrying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12M is a schematic diagram (No. 13) showing the second example of the tray transport method by the tray transport device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 12N is a schematic diagram (No. 14) showing the second example of the tray carrying method by the tray carrying device of the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 1 is a side view showing an entire electronic component testing apparatus according to an embodiment of the present invention
  • FIG. 2 is a perspective view of the electronic component testing apparatus of FIG. 1
  • FIG. 3 is a tray in the electronic component testing apparatus of FIG. It is a conceptual diagram which shows the handling method of No ..
  • FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment.
  • the members arranged side by side in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.
  • the electronic device test apparatus tests (inspects) whether or not the IC device operates properly in a state where a high temperature or low temperature stress is applied to the IC device, and the test result is obtained. It is a device that classifies IC devices based on it, and consists of handler 1, test head 5 and tester 6. The IC device test using this electronic component test equipment is performed by replacing the IC device from the customer tray KST to the test tray TST.
  • the handler 1 in this embodiment includes a storage unit 200 that stores a pre-test IC device and a customer tray KST loaded with a post-test IC device
  • the chamber unit 100 includes a loader unit 300 for transferring the IC device sent from the storage unit 200 to the test tray TST and feeding it to the chamber unit 100, and the test head 5 and testing the IC device in a state mounted on the test tray TST.
  • the unloader unit 400 is configured to unload the tested IC devices from the chamber unit 100 and transfer them to the customer tray KST while sorting them.
  • the socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. Connect and test the IC device with the test signal from the tester 6 concerned.
  • a space 8 is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in the space 8, and a through-hole formed in the main base of the handler 1 is formed. It is possible to make electrical contact between the IC device and the socket 50 on the test head 5 via the connector.
  • it is replaced with another test head having a socket suitable for the shape, number of pins, etc. of the IC device of that type.
  • FIG. 4 and 5 are a front view and a side view showing a storage portion of the electronic component test apparatus according to this embodiment
  • FIG. 6 shows an IC stocker used for the electronic component test apparatus according to this embodiment
  • FIG. 7 is an exploded perspective view
  • FIG. 7 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the present embodiment.
  • the storage unit 200 includes a stock force 210 for storing the customer tray KST, a lifting device 220 that can hold the customer tray KST and can be lifted and lowered.
  • a tray transfer device 230 that holds the customer tray KST and is movable in the vertical and horizontal directions is provided.
  • the stocker 210 in the present embodiment corresponds to an example of a storage unit in the present invention
  • the lifting device 220 in the present embodiment corresponds to an example of a holding unit in the present invention
  • the tray transfer device 230 in the present embodiment corresponds to an example of the transfer means in the present invention.
  • the stocker 210 is equipped with pre-test IC devices and pre-test stock force 211 for storing the installed customer tray KST, and IC devices classified according to the test results. And tested stock force 212.
  • each of the pre-test stock force 211 and the tested stock force 212 is a frame-like tray support frame 213 and the lower force of the tray support frame 213 also enters and moves upward and downward.
  • an elevator 214 that can be used.
  • a plurality of customer trays KST are stacked on the tray support frame 213, and only the stacked customer trays KST are moved up and down by the elevator 214! /.
  • the customer train KST is a force in which 60 accommodating portions 91 for accommodating IC devices are arranged in 10 rows x 6 columns as shown in FIG. There are various arrangement variations depending on the variety.
  • the number of each of the pre-test stock 211 and the test stock 212 is appropriately set as necessary. It can be done.
  • one stocker ST K-B is provided for the pre-test stock force 211.
  • eight stockers STK-1, STK 2, ..., STK-8 are provided in the tested stock force 212, and are classified into a maximum of eight categories according to the test results. Can be stored. In other words, in addition to non-defective products and defective products, it can be classified into non-defective products that have a high operating speed, medium-speed products, low-speed products, or defective products that require retesting. It becomes.
  • one empty tray stock force STK-E is provided between STK-4 and STK-5.
  • the empty tray tray force STK-E is stacked with empty customer trays KST sent to the unloader section 400! /.
  • the electronic component testing apparatus includes six lifting devices 220, which are opened in the loader unit 300 and opened in the main base 101! /, The two window portions 306 and the four window portions 406 opened to the main base 101 in the unloader portion 400 are arranged one by one in each of the six window portions in total.
  • each elevating device 220 is provided with a Z-axis direction rail 221 provided so as to hang from the main base 101, and capable of elevating along the Z-axis direction rail 221.
  • the table 222 can be moved up and down between the first specified position H and the second specified position H.
  • the first specified position H is an upper limit in the Z-axis direction of the table 222.
  • the window portion 306 or the window portion formed in the main base 101 is used. Via 406), the customer train KST faces the loader unit 300 (or the unloader unit 400).
  • the second specified position H is the lower limit of the table 222 in the Z-axis direction.
  • Tamatre KST is delivered.
  • the lifting device 220 moves the customer tray KST between the storage unit 200 and the loader unit 300 (or the unloader unit 400) by holding and lifting the customer tray KST on the table 222. It becomes possible to move!
  • the tray transfer device 230 includes an X-axis direction rail 231 provided along the X-axis direction between the main base 101 and the stock force 210, and the X-axis direction.
  • a movable head 232 capable of moving along the X-axis direction on the rail 231, two Z-axis direction rails 233A and 233B provided on the movable head 232, and each Z-axis direction rail 233A and 233B Holding heads 234A and 234B provided on the upper side so as to be movable along the Z-axis direction.
  • Each of the holding heads 234A and 234B can move independently along the Z-axis direction, and has an open / close-type gripping claw 235 on the lower side for gripping the customer tray KST. Yes.
  • the two holding heads 234A and 234B cannot be moved independently in the horizontal direction because they are attached to one movable head 232 via Z-axis direction rails 2 33A and 233B. .
  • This tray transfer device 230 grips the customer tray KST from the lowered table 222 of the lifting device 220 and moves it to the stocker 210, or moves the customer tray KST from the stocker 210 to the table 222 of the lifting device 220. It is possible to make it.
  • the tray transfer device 230 in the present embodiment has two movable positions M in the Z-axis direction that can move the holding heads 234A and 234B in the horizontal direction.
  • the first movable position M is the first movable position of the lifting device 220.
  • the active position M is located between the second restricting position H of the lifting device 220 and the stock force 210.
  • both holding heads 234A and 234B are moved in the horizontal direction while being positioned on the first movable position M (or the second movable position M), or one of the holding heads 234A and 234B is moved in the horizontal direction.
  • the holding head 234A is positioned at the first movable position M (or the second movable position M).
  • Both holding heads 234A and 234B can be moved in the horizontal direction while being positioned at the position M).
  • the first and second holding heads 234A and 234B can be moved horizontally on the pre-test stock force 211 and the test stock force 212, regardless of the position of the table 222 of the lifting device 220. Since the holding heads 234A and 234B can be moved in the horizontal direction, the tray transfer operation can be shortened. [0051]
  • the number of holding heads is not limited to two, the number of movable positions is not limited to two, and three or more holding heads may be provided, or three or more. May be provided with a movable position.
  • FIG. 8 is a front view showing a tray transfer device of an electronic component testing apparatus according to another embodiment of the present invention.
  • two movable heads 232A, 232B that are movable independently of each other along the X-axis direction on the X-axis direction rail 231 of the tray transfer device 230.
  • the holding heads 234A and 234B can be moved independently of each other along the X-axis direction in addition to the Z-axis direction.
  • FIG. 9 is a front view showing a tray transfer device of an electronic component test apparatus according to still another embodiment of the present invention.
  • each of the holding heads 234A and 234B of the tray transfer device 230 has three customer trays KST.
  • each lifting / lowering device 220 can hold two force stapling trays KST and KST. This allows tray transfer
  • the upper customer tray KST has IC devices discrete from the second customer tray KST.
  • the holding heads 234A and 234B transfer three customer trays KST to the table 222.
  • the left holding head 234A shows the state in which the uppermost customer tray KST is removed. Incidentally, the removed empty customer tray KST is returned to the empty tray force STK-E.
  • the number of customer trays KST simultaneously held by the holding heads 234A, 234B of the tray transfer device 230 is not limited to three, and four or more customer trays KST can be held simultaneously. It is also good.
  • the number of customer trays KST simultaneously held by the tables 222 of the lifting devices 220 is not limited to two, and three or more customer trays KST may be simultaneously held.
  • FIG. 10 is an exploded perspective view showing a test tray used in the electronic device testing apparatus according to the embodiment of the present invention.
  • the customer tray KST described above is provided with a tray transfer device 230 provided between the storage unit 200 and the main base 101. Lower force is also carried.
  • the IC device loaded in the customer tray KST is transferred by the device transport device 310 to the pre-processor ( ⁇ 61 ") 305, where the mutual positional relationship of the IC devices is determined. Thereafter, the IC device transferred to the precursor 305 is reloaded onto the test tray TST stopped at the loader unit 300 by the device transport device 310.
  • the test tray TST is provided with crosspieces 13 in parallel and equidistant on the rectangular frame 12, and on both sides of the crosspieces 13 and on the side 12a of the frame 12 facing the crosspieces 13.
  • a plurality of mounting pieces 14 are formed so as to protrude at equal intervals.
  • An insert receiving portion 15 is configured by the space between these bars 13 or between the bars 13 and the side 12a and the two mounting pieces 14.
  • Each insert receiving portion 15 is configured to receive one insert 16, and this insert 16 is attached to the two attachment pieces 14 in a floating state using fasteners 17. .
  • attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16.
  • 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
  • inserts 16 have the same shape and the same dimensions, and an IC device is accommodated in each insert 16.
  • the IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular recess in the example shown in FIG.
  • the loader unit 300 includes a device transfer device 310 that reloads IC devices from the customer tray KST to the test tray TST.
  • the device transport device 310 includes two Y-axis rails 311 installed on the main base 101 along the Y-axis direction, and a movable device capable of reciprocating along the Y-axis direction on the Y-axis direction rails 311. Arm 312 and movable arm 312 are supported by movable arm 312 so as to be movable along the X-axis direction.
  • the moving head 313 is provided with suction pads (not shown) arranged in 2 rows and 8 columns downward. Each suction pad can be moved up and down by an actuator (not shown), and 16 IC devices can be transferred from the customer tray KST to the test tray TST at a time.
  • a precursor 305 is provided between the customer tray KST and the test tray TST.
  • the precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, the IC device mutual position relationship can be accurately determined by dropping the IC device to be transferred to the test tray TST onto the precursor 305 before moving it to the test tray TST. It is possible to accurately transfer devices to the test tray TST.
  • test tray TST When the IC devices are stored in all the storage units 18 of the test tray TST, the test tray TST is carried into the chamber unit 100 by the tray transfer device 102.
  • the empty customer tray KST is lowered by the lifting device 220, and this empty tray is transferred to the tray transfer device 230.
  • the tray transfer device 230 stores the empty tray in the empty tray force STK-E and stores the empty tray in the tested stock force 212 when it is fully loaded with the customer tray KST force C device of the tested stock force 212. Supply.
  • test tray TST is loaded into the chamber section 100 after IC devices are loaded by the loader section 300, and each IC device is tested in a state of being mounted on the test tray TST.
  • the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature stress to the IC device loaded on the test tray TST, and the soak chamber 110.
  • the test chamber 120 that contacts the IC device in the state where thermal stress is applied with the test head 5 and the unsoak chamber 130 that also removes the thermal stress from the IC device force that has been tested are configured. .
  • the unsoak chamber 130 is thermally connected to the soak chamber 110 and the test chamber 120. In practice, it is preferable to insulate the area of the soak chamber 110 and test chamber 120 at a high or low temperature, and the unsoak chamber 130 is thermally insulated from these forces. Collectively called chamber part 100.
  • the soak chamber 110 is disposed so as to protrude above the test chamber 120.
  • a vertical transfer device is provided inside the soak chamber 110, and a plurality of test tray TST force vertical transfer devices are provided until the test chamber 120 is empty. Waiting while being supported. Mainly during this standby period — high or low temperature stress of about 55 to 150 ° C is applied to the IC device.
  • test head 5 is disposed in the center of the test chamber 120, the test tray TST is carried above the test head 5, and the input / output terminals of the IC device are connected to the socket 50 of the test head 5. IC devices are tested by making electrical contact with the contact pins.
  • the result of this test is stored in the storage device of the electronic component test apparatus at an address determined by the identification number assigned to the test tray TST and the IC device number assigned in the test tray TST. Is done.
  • the unsoak chamber 130 is also arranged so as to protrude upward from the test chamber 120, and a vertical transfer device is provided as conceptually shown in FIG.
  • a vertical transfer device is provided as conceptually shown in FIG.
  • the IC device when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air, and then the heat-removed IC device is carried out to the unloader unit 400. To do.
  • a low temperature is applied to the IC device in the soak chamber 110, the IC device is heated with warm air or a heater to return to a temperature at which condensation does not occur, and then the removed IC device is unloaded. Carry out to part 400.
  • an inlet for carrying the test tray TST from the main base 101 is formed in the upper part of the unsoak chamber 130.
  • the main base 101 is provided with a tray transfer device 102 for taking the test tray TST in and out of the chamber portion 100 through these inlets and outlets.
  • This tray conveyor 1 02 is composed of, for example, a rotating roller.
  • the tray conveying device 102 returns the soak chamber 110 to the soak chamber 110 via the test tray TST force unloader unit 400 and the loader unit 300 carried out of the ann soak chamber 130.
  • the unloader unit 400 reloads the IC device that has been tested with the test tray TST force carried to the unloader unit 400 into the customer tray KST according to the test result.
  • the main base 101 in the unloader unit 400 is arranged so as to face the upper surface of the customer train KST force main base 101 carried from the storage unit 200 force to the unloader unit 400.
  • Four window portions 406 are formed.
  • the unloader unit 400 includes a device transfer device 410 that transfers a tested IC device from the test tray TST to the customer tray KST.
  • This device transport apparatus 410 is capable of reciprocating along the Y-axis direction on two Y-axis direction rails 411 constructed on the main base 101 along the Y-axis direction.
  • Each suction pad can be moved up and down along the Z-axis by an actuator (not shown), and it is possible to transfer 16 IC devices to the customer tray KST as well as the test tray TST force at a time.
  • an actuator not shown
  • an elevating device 220 for elevating and lowering the customer tray KST is provided below each window 406.
  • a tested IC device is installed.
  • the loaded customer tray KST is loaded and lowered, and this full tray is transferred to the tray transfer device 230.
  • the unloader 400 has only four windows 406, so the unloader 400 has a maximum of four. Only customer train KST can be placed. Therefore, the categories that can be sorted in real time are limited to four categories. In general, good products are classified into three categories: high speed, medium speed, and low speed, and in addition to defective products, four categories are sufficient. For example, retesting is required. Like those that do A category that does not belong may occur in rare cases.
  • the tray transfer device 230 and the lifting device 220 can move simultaneously without interfering with each other, the customer train is used to switch the category assigned to the window 406. Tray transport time can be shortened when replacing KST.
  • FIG. 11A to FIG. 11L are schematic views (parts 1 to 12) showing a first example of the tray transport method in the present embodiment.
  • the four lifting devices shown in FIGS. 11A to 12N are also referred to as the first to fourth lifting devices 220a to 220d in order from the left side force, and the two holding heads shown in FIG.
  • the first and second holding heads 234A and 234B are referred to in order from the left side.
  • the first lifting device 220a starts to descend as shown in FIG. 11A. While the first elevating device 220a is descending, as shown in FIG. 11B, the first holding head 234A starts to rise and the second holding head 234B starts to descend. 1st lifting equipment The device 220a stops when it is lowered to the second restriction position H, and the first holding head 234A
  • the second holding head 234B stops when it is lowered to the empty trust force STK-E, and holds the empty customer tray KST located at the uppermost stage.
  • the tray transport time can be shortened.
  • the second holding head 234B is moved to the second movable position H.
  • the first and second holding heads 234A move along the horizontal direction so that the first holding head 234A is positioned above the first lifting device 220a.
  • the first holding head 234A moves in the horizontal direction at the first movable position M
  • the second holding head 234B moves horizontally at the second movable position M. Move in the direction.
  • the first holding head 234A is lowered to receive the full customer tray KST from the first lifting device 220a, and the second holding head 234B is the first holding head 234B.
  • the first holding head 234A Upon receipt, the first holding head 234A is also raised to the first movable position M.
  • the first and second holding heads 234A, 234B are arranged such that the second holding head 234B is positioned above the first lifting device 220a. Moves horizontally at the movable position M.
  • the first and second holding heads 234A and 234B start to descend as shown in FIG. 11H.
  • the first holding head 234A moves down to the second movable position M.
  • the tray conveyance time can be shortened.
  • the second holding head 234B moves to the first movable position M.
  • the first and second holding heads 234A, 234B move horizontally so that the first holding head 234A is positioned above the tested stock force STK-2. To do.
  • the first holding head 234A moves in the horizontal direction at the second movable position M, and the second holding head 234B moves at the first movable position M.
  • the first holding head 234A When the first holding head 234A is positioned above the tested stock force STK-2, as shown in FIG. 11K, the first and second holding heads 234A and 234B are lowered and the first raising and lowering is performed. Device 220a is raised. When the first holding head 234A descends to the tested stock force STK-2, it stops and delivers the full customer tray KST to the tested stock force STK-2. F
  • the second holding head 234B stops when it is lowered to the second movable position M.
  • the tray transport time can be shortened.
  • the first holding head 234A moves to the second movable position M.
  • the first elevating device 220a rises to the first restricting position H as it rises at 2. In this state, an empty customer tray KST is held by the first lifting device 220a and the window e
  • FIGS. 12A to 12N are schematic views (Nos. 1 to 14) showing a second example of the tray transport method in the present embodiment.
  • the second lifting device 220b starts to descend. While the second raising / lowering device 220b is descending, as shown in FIG. 12B, the second holding head 234B positioned above the empty tray stocks force STK-E also begins to descend. The second lifting device 220 b stops when it is lowered to the second restriction position H. The second holding device 234B is empty.
  • the second lifting device 220b and the first holding head 234B can be lowered without interference, and the second lifting / lowering device 220b and the second holding head 234B can be moved at the same time. It is out.
  • the first and second holding heads 234A and 234B move in the horizontal direction so that the first holding head 234A comes off from directly below the second lifting device 220b. At this time, the first and second holding heads 234A and 234B both move in the horizontal direction at the second movable position M.
  • the first holding head 234A is lowered to receive the full customer tray KST from the second lifting device 220b, and the second holding head 234B is the first holding head 234B.
  • the first holding head 234A When received from the second lifting device 220b, the first holding head 234A is also movable in the first position. Ascend to the active position.
  • the first and second holding heads 234 ⁇ and 234 ⁇ are arranged so that the second holding head 234 ⁇ is positioned above the second lifting device 220b. Move horizontally at movable position M.
  • the first and second holding heads 234A and 234B start to descend as shown in FIG. 12J.
  • the first holding head 234A is lowered to the second movable position M.
  • the second holding head 234B stops when it is lowered to the second lifting device 220b, and hands over the empty customer tray KST to the second lifting device 220b.
  • the tray conveyance time can be shortened.
  • the second holding head 234B stops when it is lowered to the second movable position M.
  • the tray transport time can be shortened.
  • the second elevating device 220b is raised to the first restriction position H.
  • an empty customer tray KST is held by the second lifting / lowering device 220b and the window e
  • the tray transfer device 230 has two movable positions M and M in the vertical direction that can move along the horizontal direction. G
  • the lay transfer device 230 and the lifting device 220 can move simultaneously without interfering with each other, and the tray transport time is shortened.
  • a pitch changing mechanism such as a floating joint or a lock-and-free mechanism is provided between the holding heads 234A and 234B so that the pitch between the holding heads 234A and 234B can be changed.
  • the holding heads 234A and 234B may be positioned relative to the lifting device 220 by contacting the lifting force 210 with the lifting force 220.
  • the first holding head 234A and the second holding head 234B can simultaneously approach the lifting device 220 and the stocking force 210, and the tray transport time can be further shortened.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

La présente invention se rapporte à un appareil de transfert de plateau qui est doté d'un chargeur mécanique (210) pour stocker un plateau client (KST) ; d'un appareil de levage (220) qui supporte le plateau client (KST) et le déplace verticalement ; ainsi que d'un appareil de transfert de plateau (230) qui supporte le plateau client (KST) et le déplace dans une direction verticale et dans une direction horizontale, pour transférer et recevoir le plateau client (KST) entre le chargeur mécanique (210) et l'appareil de levage (220). L'appareil de transfert de plateau (230) a une pluralité de positions mobiles (M1, M2) dans la direction verticale, auxquelles l'appareil de transfert de plateau (230) peut se déplacer le long de la direction horizontale.
PCT/JP2006/320401 2006-10-12 2006-10-12 Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau WO2008044305A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020097008270A KR101104291B1 (ko) 2006-10-12 2006-10-12 트레이 반송장치 및 이를 구비한 전자부품 시험장치
JP2008538542A JP5022375B2 (ja) 2006-10-12 2006-10-12 トレイ搬送装置及びそれを備えた電子部品試験装置
PCT/JP2006/320401 WO2008044305A1 (fr) 2006-10-12 2006-10-12 Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau
TW096134691A TW200834097A (en) 2006-10-12 2007-09-17 Tray transfer apparatus and electronic component testing apparatus provided with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/320401 WO2008044305A1 (fr) 2006-10-12 2006-10-12 Appareil de transfert de plateau et appareil de test de composant électronique doté de cet appareil de transfert de plateau

Publications (1)

Publication Number Publication Date
WO2008044305A1 true WO2008044305A1 (fr) 2008-04-17

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JP (1) JP5022375B2 (fr)
KR (1) KR101104291B1 (fr)
TW (1) TW200834097A (fr)
WO (1) WO2008044305A1 (fr)

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KR101040308B1 (ko) 2008-10-24 2011-06-10 세크론 주식회사 트레이 이송 장치
CN103372542A (zh) * 2012-04-18 2013-10-30 未来产业株式会社 半导体元件分选系统
US11353502B2 (en) 2020-03-12 2022-06-07 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
KR102231407B1 (ko) * 2014-11-07 2021-03-25 (주)테크윙 전자부품 분류 장비
KR102631908B1 (ko) * 2018-08-21 2024-01-31 (주)테크윙 핸들러 및 이를 포함하는 오토메이션 시스템

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JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ｉｃ試験装置並びにトレイの取り廻し方法
JP2000074996A (ja) * 1998-09-02 2000-03-14 Advantest Corp 部品試験装置およびチャンバ入り口の開閉方法
WO2004106945A2 (fr) * 2003-05-30 2004-12-09 Advantest Corp Dispositif d'essai de partie electronique

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US5788084A (en) * 1994-09-22 1998-08-04 Advantest Corporation Automatic testing system and method for semiconductor devices
JP2005062090A (ja) 2003-08-19 2005-03-10 Renesas Technology Corp 半導体検査装置

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JPH11297791A (ja) * 1998-04-14 1999-10-29 Advantest Corp トレイ移送アーム及びこれを用いたトレイの移載装置、ｉｃ試験装置並びにトレイの取り廻し方法
JP2000074996A (ja) * 1998-09-02 2000-03-14 Advantest Corp 部品試験装置およびチャンバ入り口の開閉方法
WO2004106945A2 (fr) * 2003-05-30 2004-12-09 Advantest Corp Dispositif d'essai de partie electronique

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101040308B1 (ko) 2008-10-24 2011-06-10 세크론 주식회사 트레이 이송 장치
CN103372542A (zh) * 2012-04-18 2013-10-30 未来产业株式会社 半导体元件分选系统
US11353502B2 (en) 2020-03-12 2022-06-07 Advantest Corporation Electronic component handling apparatus and electronic component testing apparatus

Also Published As

Publication number Publication date
KR101104291B1 (ko) 2012-01-12
TW200834097A (en) 2008-08-16
KR20090086956A (ko) 2009-08-14
JP5022375B2 (ja) 2012-09-12
JPWO2008044305A1 (ja) 2010-02-04
TWI356908B (fr) 2012-01-21

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