WO2007135709A1 - Appareil de contrôle de composants électroniques - Google Patents

Appareil de contrôle de composants électroniques Download PDF

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Publication number
WO2007135709A1
WO2007135709A1 PCT/JP2006/309954 JP2006309954W WO2007135709A1 WO 2007135709 A1 WO2007135709 A1 WO 2007135709A1 JP 2006309954 W JP2006309954 W JP 2006309954W WO 2007135709 A1 WO2007135709 A1 WO 2007135709A1
Authority
WO
WIPO (PCT)
Prior art keywords
tray
test
transfer arm
transfer
electronic device
Prior art date
Application number
PCT/JP2006/309954
Other languages
English (en)
Japanese (ja)
Inventor
Koya Karino
Akihiko Ito
Kazuyuki Yamashita
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2006/309954 priority Critical patent/WO2007135709A1/fr
Priority to TW096117227A priority patent/TW200815774A/zh
Publication of WO2007135709A1 publication Critical patent/WO2007135709A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • Component conveying device and electronic component testing device are Component conveying device and electronic component testing device
  • the present invention relates to an electronic component test in which various electronic components such as semiconductor integrated circuit elements (hereinafter also referred to as IC devices) are electrically contacted with a contact portion of a test head to test the IC device.
  • IC devices semiconductor integrated circuit elements
  • the customer tray is also used to transfer the IC device to the test tray or the IC device from the test tray to the customer tray, and the electronic component testing apparatus equipped with the same About.
  • an electronic component testing apparatus is used to test the performance and function of the Ic device in the knocked state.
  • a handler constituting an electronic component testing apparatus includes a loader unit, a chamber unit, and an unloader unit.
  • the loader section of the handler circulates and conveys the IC device before the test from the tray (hereinafter referred to as a customer tray) for storing the IC device that has been tested. IC devices are reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
  • a customer tray for storing the IC device that has been tested.
  • IC devices are reloaded onto the tray (hereinafter referred to as the test tray), and the test tray is loaded into the chamber.
  • each IC device is brought into electrical contact with the contact portion of the test head, and the electronic component test apparatus main body (hereinafter referred to as the main part) , Referred to as a tester).
  • test tray loaded with the IC device for which the test has been completed is carried out from the chamber part to the unloader part, and the IC device is mounted on the customer tray according to the test result in the unloader part.
  • Good products are classified into defective products and categories! /
  • An object of the present invention is to provide a component transport device capable of improving throughput while maintaining the size of the electronic component test device, and an electronic component test device including the component transport device.
  • an electronic component test apparatus for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head
  • a component conveying device used for transferring the electronic device under test accommodated in a first tray to a second tray, a direction substantially parallel to a main surface of the first tray
  • a plurality of transports capable of holding the electronic device under test accommodated in the first tray by simultaneously approaching the same first tray.
  • a parts conveying device provided with means (see claim 1).
  • a component transporting device that transfers electronic devices under test to the first tray and the second tray is provided with a plurality of transporting means that can be independently and simultaneously approached to the same first tray.
  • the carrying capacity can be increased while keeping the size of the component carrying device equal to that of the conventional one, so that the throughput can be improved while maintaining the size of the electronic component testing device.
  • the plurality of transport means can be independently moved in a direction substantially parallel to the main surface of the second tray, and the same Simultaneously approach the second tray and place the electronic device under test on the second tray. (See claim 2).
  • a plurality of conveying means can be made to approach the same second tray independently and simultaneously. As a result, the throughput can be further improved while maintaining the size of the electronic component testing apparatus.
  • an electronic component test for testing the electronic device under test by bringing the electronic device under test into electrical contact with the contact portion of the test head.
  • a component conveying device used for transferring the electronic component to be tested housed in a first tray to a second tray, substantially with respect to a main surface of the second tray
  • a plurality of transports that can move independently in parallel directions, and can simultaneously approach the same second tray and place the electronic device under test on the second tray.
  • a parts conveying device provided with means (see claim 3).
  • the component conveying device that transfers the electronic devices under test to the first tray and the second tray is provided with a plurality of conveying means that can simultaneously and independently approach the same second tray. .
  • a plurality of conveying means that can simultaneously and independently approach the same second tray.
  • the transport means is a transport arm having a holding unit for holding the electronic device under test, and the component transport device is capable of moving the transport arm.
  • the plurality of transfer arms are supported by the same support means, and each of the transfer arms can move independently on the support means. ⁇ (See claim 4).
  • the support means supports the transfer arm so as to be movable in a predetermined direction, and the plurality of transfer arms are attached to the same support means. It is preferable that they are arranged side by side along the predetermined direction (see claim 5).
  • each of the transfer arms is assigned with a corresponding area in the same first tray or the second tray that can be simultaneously accessed. (See claim 6).
  • the first tray is one of a customer tray and a test tray
  • the second tray is the other of the test tray and the customer tray. (See claim 7).
  • an electronic component test apparatus used for testing an electronic device under test by bringing the electronic device under test into electrical contact with a contact portion of a test head
  • An electronic component test apparatus including a loader unit having any one of the above-described component transfer devices for transferring the electronic device under test before the test from a customer tray to a test tray (see claim 8).
  • an electronic component used for testing the electronic device under test by bringing the electronic device under test into electrical contact with the contact portion of the test head.
  • An electronic component testing apparatus comprising an unloader unit having any one of the above-described component conveying devices for transferring a tested electronic component to be tested to a test tray force customer tray is provided (see claim 9). ).
  • the apparatus further includes detection means for detecting a lot end of the electronic component under test
  • the component transfer device includes a first transfer arm and a second transfer arm.
  • the first area is assigned to the first transfer arm as the area in charge of the first transfer arm
  • the second transfer arm is in charge of the customer tray.
  • the detection means detects a lot end
  • the parts transfer apparatus determines that the first area is based on the detection result!
  • the electronic device under test When the lot end of the electronic device under test is processed, the electronic device under test is packed in one of the first region or the second region, so that the first region is stored in the customer tray. It is possible to prevent a missing portion between the second region and the second region.
  • the component transfer device determines that both the first and second transfer arms are based on the detection result.
  • the first transfer arm and the second transfer arm may be controlled such that the first transfer arm and the second transfer arm are controlled (see claim 11).
  • the component transfer device determines whether one of the first transfer arm or the second transfer arm is based on the detection result.
  • the electronic device under test is transported from the test tray to one of the first region or the second region, and the other of the second transport arm or the first transport arm transports the electronic device under test.
  • the first transfer arm and the second transfer arm may be controlled so as to stop the operation (see claim 12).
  • the unloader unit includes a buffer unit provided separately from the test tray and the customer tray for temporarily storing the electronic device under test, and the detection unit
  • the component transport device causes the second transport arm to transport the electronic component to be tested to the test tray, and to the buffer unit.
  • the first transfer arm and the second transfer arm are controlled so that the stored electronic device under test is transferred to one of the first area or the second area by the first transfer arm. (See claim 13).
  • the parts carrying device when the detection means detects a lot end, the parts carrying device, based on the detection result, the first carrying arm or the second carrying arm. At least one of the first transfer arm and the second transfer arm so that the electronic device under test is transferred from the second region or the first region to the first region or the second region. May be controlled (see claim 14).
  • FIG. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention.
  • FIG. 3 is a conceptual diagram showing tray handling in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention.
  • FIG. 7 is a plan view showing a loader unit and an unloader unit of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 8 is a plan view showing a loader unit of the electronic component test apparatus according to the embodiment of the present invention.
  • FIG. 9 is a plan view showing an unloader unit of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 10 is a schematic diagram showing a first example of a lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 11 is a block diagram showing delivery of a lot end signal in the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 12 is a schematic diagram showing a second example of a lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 13 is a schematic diagram showing a third example of the lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 14 is a schematic diagram showing a fourth example of the lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.
  • FIG. 1 is a schematic sectional view showing an electronic component testing apparatus according to an embodiment of the present invention
  • FIG. 2 is a perspective view showing an electronic component testing apparatus according to an embodiment of the present invention
  • FIG. 3 is an embodiment of the present invention. It is a conceptual diagram which shows the handling of the tray in the electronic component testing apparatus which concerns on this.
  • FIG. 3 is a view for understanding the tray handling method in the electronic component testing apparatus according to the present embodiment.
  • the members arranged side by side in the vertical direction are planarly shown. Some parts are shown. Therefore, its mechanical (three-dimensional) structure will be explained with reference to FIG.
  • the electronic device test apparatus tests (inspects) whether or not the IC device operates properly in a state where a high temperature or low temperature stress is applied to the IC device, and the test result is It is a device that classifies IC devices based on it, and consists of handler 1, test head 5 and tester 6. IC device testing using this electronic component testing equipment The IC device is transferred from the Tamatre KST to the test tray TST.
  • the handler 1 in the present embodiment includes a storage unit 200 that stores a customer tray KST in which an IC device before the test and an IC device after the test are mounted,
  • the chamber unit 100 includes a loader unit 300 for transferring the IC device sent from the storage unit 200 to the test tray TST and feeding it to the chamber unit 100, and the test head 5 and testing the IC device in a state mounted on the test tray TST.
  • the unloader unit 400 is configured to unload the tested IC devices from the chamber unit 100 and transfer them to the customer tray KST while sorting them.
  • the socket 50 provided in the test head 5 is connected to the tester 6 through the cable 7 shown in FIG. 1, and the IC device electrically connected to the socket 50 is connected to the tester 6 through the cable 7. Connect and test the IC device with the test signal from the tester 6 concerned.
  • a space is provided in a part of the lower portion of the handler 1, and the test head 5 is replaceably disposed in this space, and through a through-hole formed in the device base of the handler 1.
  • the IC device and the socket 50 on the test head 5 can be brought into electrical contact.
  • the test head is replaced with another test head having a socket suitable for the shape and number of pins of the IC device of that type.
  • FIG. 4 is an exploded perspective view showing an IC stocker used in the electronic component testing apparatus according to the embodiment of the present invention
  • FIG. 5 is a perspective view showing a customer tray used in the electronic component testing apparatus according to the embodiment.
  • the storage unit 200 includes a pre-test IC stocker 201 that stores pre-test IC devices, and a tested IC stocker 202 that stores IC devices classified according to the test results! / RU
  • these stockers 201 and 202 include a frame-like tray support frame 203 and an elevator 204 that can be moved up and down by the lower force of the tray support frame 203 also entering the upper part. And. A plurality of customer trays KST are stacked on the tray support frame 203, and only the stacked customer trays KST are moved up and down by the elevator 204. Moved.
  • the customer train KST is a force in which 60 accommodating portions 33 for accommodating IC devices are arranged in 10 rows X 6 columns. There are various array variations depending on the device type.
  • the number of the pre-test IC stocker 201 and the tested IC stocker 202 is set to an appropriate number as necessary. can do.
  • tray stockers STK-1, STK-2, ..., STK-8 are installed in the tested IC stocker 202 next to the empty tray stock force STK-E. It is configured so that it can be sorted and stored in up to 8 categories. In other words, in addition to non-defective products and defective products, it is possible to sort non-defective products into high-speed, medium-speed, low-speed, or defective products that require retesting. It has become.
  • FIG. 6 is an exploded perspective view showing a test tray used in the electronic component testing apparatus according to the embodiment of the present invention
  • FIG. 7 is a plan view showing the loader unit and the unloader unit of the electronic component testing apparatus according to the embodiment of the present invention
  • FIG. 8 is a plan view showing a connector part of the electronic device test apparatus according to the embodiment of the present invention.
  • the above-described customer tray KST is transported from the lower side of the device base 101 to the two window portions 306 of the loader unit 300 by the tray transfer arm 205 provided between the storage unit 200 and the device base 101. It is.
  • the IC device loaded on the customer tray KST is transferred by the device transfer device 310 to the precursor 305, where the mutual positional relationship of the IC devices is corrected. Thereafter, the IC device transferred to the precursor 305 is transferred again to the test tray TST stopped at the loader unit 300 by the transfer device 310.
  • the test tray TST has bars 13 provided in parallel to the rectangular frame 12 at equal intervals.
  • Both sides of the bars 13 and the side 12a of the frame 12 facing the bars 13 are A plurality of mounting pieces 14 are formed so as to protrude at equal intervals.
  • An insert accommodating portion 15 is constituted by the crosspieces 13 or between the crosspiece 13 and the side 12a and the two attachment pieces 14.
  • Each insert accommodating portion 15 accommodates one insert 16, and this insert 16 is attached to two attachment pieces 14 in a floating state using fasteners 17. .
  • attachment holes 19 for attaching the insert 16 to the attachment piece 14 are formed at both ends of the insert 16.
  • 64 of these inserts 16 are attached to one test tray TST and arranged in 4 rows and 16 columns.
  • Each insert 16 has the same shape and the same dimensions, and an IC device is accommodated in each insert 16.
  • the IC accommodating portion 18 of the insert 16 is determined according to the shape of the IC device to be accommodated, and is a rectangular concave portion in the example shown in FIG.
  • the loader unit 300 includes a device transfer device 310 that transfers IC devices from the customer tray KST to the test tray TST.
  • the device transfer device 310 includes two rails 311 erected along the Y-axis direction on the device base 101, and a first transfer arm 320 and a first transfer arm 320 that can reciprocate along the Y-axis direction on the rail 311. It consists of two transfer arms 330 and a force.
  • the rail 311 in the present embodiment corresponds to an example of the support means in the claims, and the first transfer arm 320 and the second transfer arm 330 in the present embodiment are examples of the transfer arm in the claims. Equivalent to.
  • the first transfer arm 320 reciprocates on the rail 311 between the two customer trays KST located in the two window portions 306 and the test tray TST located in the loader portion 300.
  • Movable arm 321 movably provided, movable head 322 supported by movable arm 321 so as to be movable along the X-axis direction, and 16 pieces arranged in 2 rows and 8 columns downward on movable head 322
  • Each suction pad 323 can be moved up and down along the Z-axis direction by an actuator (not shown), and 16 IC devices can be transferred to the customer tray KST force test tray TST at a time. It has become.
  • the second transfer arm 330 reciprocates on the rail 311 between the customer tray KST located in the two window portions 306 and the test tray TST located in the loader portion 300.
  • Each suction pad 323 can be moved up and down along the Z-axis direction by an actuator (not shown), and 16 IC devices can be transferred to the customer tray KST force test tray TST at a time. It has become.
  • the first transfer arm 320 and the second transfer arm 330 are supported by the same set of rails 311.
  • the first transfer arm 320 and the second transfer arm 330 are arranged so that the first transfer arm 320 is positioned on the lower side and the second transfer arm 330 is positioned on the upper side in FIG. They are arranged in parallel along the Y-axis direction and can move independently on the rail 311. Since the first and second transfer arms 320 and 330 cannot cross each other on the rail 311, the first transfer arm 320 is positioned on the upper side and the second transfer arm 330 is set on the lower side in FIG. Never be located.
  • the same customer tray KST located in the first transfer arm 320, the second transfer arm 330, and the force window 306 can be simultaneously accessed. Yes.
  • the first transfer arm 320 has a lower half of the first area 31 (in the customer tray KST in FIG. Half 30 rows of 6 rows and 5 columns 33) are allocated.
  • the second transfer arm 330 has an upper half of the second area 32 (the customer tray KST in FIG. 30 holding parts 33) of 6 rows and 5 columns in the left half are assigned. Note that two customer trays KST are located in the loader unit 300! /, And the first and second areas 31 and 32 are allocated to each customer tray KST.
  • the first transfer arm 320 and the second transfer arm 330 can simultaneously approach the same test tray TST located in the order section 300. . Then, in the test tray TST, the first transfer arm 320 has a lower half of the first area 21 (in the test tray TST shown in FIG. 6) as the area handled by the first transfer arm 320. In other words, 32 storage units 18) of 2 rows and 16 columns in the lower right half are allocated. Further, in the test tray TST, the second transfer arm 330 has an upper half of the second region 22 (the test tray TST shown in FIG. The upper left half has 32 rows 18) in 2 rows and 16 columns.
  • the first transport arm 320 and the second transport arm 330 are simultaneously approaching the same customer tray KST or the same test tray TST. Is possible.
  • the first transfer arm 320 sucks 16 IC devices from the first area 31 of the customer tray KST by the suction pad 323, moves the IC devices, and moves the first IC device of the test tray TST.
  • the suction of the suction pad 323 is released in area 21, and the second transfer arm 330 absorbs 16 IC devices from the second area 32 of the customer tray KST by the suction pad 333 and moves the IC devices.
  • the customer tray KST force can also simultaneously load 32 IC devices on the test tray TST.
  • the device carrying device 310 can be doubled in its carrying capacity while keeping the size of the device carrying device 310 equivalent to that of the conventional device, so that the throughput can be improved while maintaining the size of the electronic component testing device.
  • a precursor 305 is provided between the customer tray KST and the test tray TST.
  • each precursor 305 has a relatively deep recess, and the periphery of the recess is surrounded by an inclined surface. Therefore, the IC device to be transferred from the customer tray KST to the test tray TST is dropped into the Preciseer 305 before being moved to the test tray TST, so that the mutual positional relationship of the IC devices is accurately determined. It is now possible to accurately transfer to the tray TST.
  • the lower precursor 305 in Fig. 8 is dedicated to the first transfer arm 320. This is a precursor, and the upper precursor 305 in the figure is a precursor exclusively for the second transfer arm 330.
  • the tray conveying device 1 02 When the IC devices are accommodated in all the accommodating portions 18 of the test tray TST, the tray conveying device 1 02, the test tray TST is carried into the chamber part 100.
  • the empty customer tray KST is lowered by the lifting table, and the tray transfer device 205 receives the empty tray. hand over.
  • the tray transfer device 205 stores the empty tray in the empty tray force STK-E, and supplies the empty tray to the stocker 202 when it is fully loaded with the customer tray KST force C device of the tested IC stocker 202.
  • test tray TST is loaded into the chamber section 100 after IC devices are loaded by the loader section 300, and each IC device is tested in a state of being mounted on the test tray TST.
  • the chamber unit 100 includes a soak chamber 110 that applies a target high or low temperature thermal stress to the IC device loaded on the test tray TST, and the soak chamber 110.
  • the test chamber 120 that contacts the IC device in the state where thermal stress is applied with the test head 5 and the unsoak chamber 130 that also removes the thermal stress from the IC device force that has been tested are configured. .
  • the unsoak chamber 130 is thermally insulated from the soak chamber 110 and the test chamber 120.
  • the region between the soak chamber 110 and the test chamber 120 is maintained at a high temperature or a low temperature.
  • the unsoak chamber 130 is thermally insulated from these chambers. For convenience, these are collectively referred to as the chamber portion 100.
  • the soak chamber 110 is disposed so as to protrude upward from the test chamber 120.
  • a vertical transfer device is provided in the soak chamber 110, and a plurality of test trays TST are supported by the vertical transfer device until the test chamber 120 is empty. Waiting while being. Mainly, high-temperature or low-temperature thermal stress of about 55 to 150 ° C. is applied to the IC device during this standby.
  • the test head 5 is arranged at the center thereof, and the test tray TST is carried above the test head 5, and the input / output terminals of the IC device are electrically connected to the contact bin of the test head 5. IC devices are tested by contacting them.
  • the result of this test is the identification number assigned to the test tray TST and the test tray TST.
  • the assigned IC device number and the address determined by are stored in the storage device of the electronic component testing device.
  • the unsoak chamber 130 is also arranged so as to protrude upward from the test chamber 120, and a vertical transfer device is provided as conceptually shown in FIG.
  • a vertical transfer device is provided as conceptually shown in FIG.
  • the IC device when a high temperature is applied to the IC device in the soak chamber 110, the IC device is cooled to the room temperature by blowing air, and then the heat-removed IC device is carried out to the unloader unit 400.
  • the IC device is heated with warm air or a heater to return it to a temperature at which condensation does not occur, and then the IC device with the heat removed is unloaded. Transport to part 400.
  • an inlet for carrying the test tray TST from the apparatus base 101 is formed in the upper part of the soak chamber 110 in the upper part of the soak chamber 110 .
  • an outlet for carrying out the test tray TST to the apparatus base 101 is formed at the upper part of the unsoak chamber 130 .
  • the apparatus base 101 is provided with a tray transfer apparatus 102 for taking the test tray TST out of and out of the chamber section 100 through these inlets and outlets.
  • the tray conveying device 102 is composed of, for example, a rotating roller.
  • the test tray TST unloaded from the unsoaked tank 130 by the tray transfer device 102 is returned to the soak chamber 110 via the unloader unit 400 and the loader unit 300.
  • FIG. 9 is a plan view showing an unloader unit of the electronic device test apparatus according to the embodiment of the present invention.
  • the unloader unit 400 reloads the IC device that has been tested for the test tray TST force carried to the unloader unit 400 into the customer tray KST corresponding to the test result.
  • the apparatus base 101 in the unloader unit 400 has four windows in which the customer tray KST carried from the storage unit 200 to the unloader unit 400 is arranged as desired on the upper surface of the apparatus base 101.
  • a portion 406 is formed.
  • the unloader unit 400 transfers the tested IC device from the test tray TST to the customer tray K.
  • a device transfer device 410 for transshipment to ST is provided.
  • Device transfer device 410 As shown in FIG. 7, two rails 411 erected on the apparatus base 101 along the Y-axis direction, a first transfer arm 420 and a first transfer arm 420 that can reciprocate on the rail 411 along the axis direction. Two transfer arms 430 and force are also configured.
  • the rail 411 in the present embodiment corresponds to an example of the support means in the claims
  • the first transport arm 420 and the second transport arm 430 in the present embodiment correspond to the transport arm in the claims. It corresponds to an example.
  • the first transfer arm 420 has two test trays TST located in the unloader section 400 and four window sections 406; and four standing customer trays KST.
  • Movable arm 421 that can be moved back and forth on rail 411, movable head 422 supported by movable arm 421 so as to be movable along the X-axis direction, and two rows downward on movable head 422 16 suction pads 423 arranged in 8 rows.
  • Each suction pad 423 can be moved up and down along the Z-axis by an actuator (not shown), and 16 IC devices can be transferred from the test tray TST to the customer tray KST at a time. ing.
  • the second transfer arm 430 has two test trays TST located in the unloader section 400 and four windows 406 respectively; ⁇ four customer trays standing up KST A movable arm 431 that can be moved back and forth on the rail 411, a movable head 432 supported by the movable arm 431 so as to be movable along the X-axis direction, and a downward movement of the movable head 432 2 16 suction pads 433 arranged in 8 rows and 8 columns. Each suction pad 433 can be moved up and down along the Z-axis direction by an actuator (not shown), and 16 IC devices can be loaded from the test tray TST to the customer tray KST at a time. Become.
  • the first transfer arm 420 and the second transfer arm 430 are supported by the same rail 411.
  • the first transfer arm 420 and the second transfer arm 430 are arranged so that the first transfer arm 420 is positioned on the lower side and the second transfer arm 430 is positioned on the upper side in FIG. They are arranged in parallel along the Y-axis direction, and each can move independently on the rail 411.
  • the first and second transfer arms 420 and 430 cannot cross each other on the rail 411.
  • the first transfer arm 420 is not positioned on the upper side
  • the second transfer arm 430 is not positioned on the lower side.
  • the first transfer arm 420 has a lower half of the first area 21 (in the test tray TST shown in FIG. The lower half has 32 rows and 2 columns and 16 columns.
  • the second transfer arm 430 has an upper half of the second area 22 (in the test tray TST shown in FIG. In the upper left half, 32 storage units 18) of 2 rows and 16 columns are allocated.
  • the unloader unit 400 has a force at which two test trays TST are positioned.
  • the first and second regions 21 and 22 are assigned to each test tray TST.
  • the first transfer arm 420 and the second transfer arm 430 can simultaneously approach the same customer tray KST located in the window portion 406.
  • the first transfer arm 420 is assigned to the first area 31 in the lower half as the area handled by the first transfer arm 420 (in the customer train KST in FIG. 5). In other words, 30 holding parts 33) of 6 rows and 5 columns in the right half are assigned.
  • the second transfer arm 430 has an upper half of the second area 32 (in the customer tray KST in FIG. 30 holding parts 33) of 6 rows and 5 columns in the left half are assigned. Note that four customer trays KST are located in the unloader unit 400, and first and second areas 31 and 32 are allocated to each customer tray KST.
  • the first transport arm 420 and the second transport arm 430 can simultaneously approach the same customer tray KST or the same test tray TST. Become.
  • the first transfer arm 420 sucks the IC device from the first area 21 of the test tray TST by the suction pad 423, moves the IC device, and sucks it in the first area 31 of the customer tray KST.
  • the second transfer arm 430 Sucks the IC device from the second area 22 of the test tray TST by the suction pad 433, moves the IC device, and releases the suction of the suction pad 433 in the second area 32 of the customer tray KST.
  • Test tray TST power Customer tray Up to 32 IC devices can be loaded into KST at the same time.
  • the device transport apparatus 410 can be doubled in capacity while maintaining the size of the device transport apparatus 410 as before, so that the throughput can be improved while maintaining the size of the electronic component test apparatus.
  • the apparatus base 101 of the unloader section 400 has only four windows 406 formed therein.
  • the unloader section 400 only a maximum of 4 customer trays KST can be placed. Therefore, the categories that can be sorted in real time are limited to 4 categories.
  • non-defective products are classified into three force categories: high speed, medium speed, and low speed, and the power that is sufficient in the four categories with the defective products in this category, for example, retesting. There may be rare categories that do not belong to these categories, such as what you need.
  • a buffer unit 405 is provided between the test tray TST of the unloader unit 400 and the window unit 406, and an IC device of a category that rarely generates force is provided in the buffer unit 405. The vice is temporarily deposited.
  • FIG. 10 is a schematic diagram showing a first example of a lot end processing method in the unloader section of the electronic component testing apparatus according to the embodiment of the present invention
  • FIG. 11 is an electronic section according to the embodiment of the present invention. It is a block diagram which shows delivery of the lot end signal in a goods test apparatus.
  • the first area 31 is used when the lot of IC devices is completed. At the end of the IC, there is a case where an IC device is accommodated and a tooth missing portion 3 la is generated.
  • the first region 31 is formed in the lot end of the IC device without generating a tooth-missing portion between the first region 31 and the second region 32 by the method described below.
  • the device transfer device 410 of the unloader unit 400 controls the first and second transfer arms 420 and 430 so as to be fully loaded with IC devices.
  • the control unit 412 of the device transport apparatus 410 moves the IC device to the test tray TST as shown in FIG.
  • the first and second transfer arms 420 and 430 are both transferred to the first area 31 of the customer tray KST when moving the IC device to the customer tray KST according to the test result. And the second transfer arms 420 and 430 are controlled.
  • the first transport arm 420 moves the IC device to the first region 31 of the customer tray TST, and the second transport arm 430 also moves the first transport arm TST of the customer tray TST.
  • the IC device is moved to the region 32 so that the tooth-missing portion 3 la is not generated between the first region 31 and the second region 32.
  • the lot end of the IC device is, for example, a customer stored in the pre-test IC stocker 201 by a detection device 206 that is also configured with a sensor equal force provided in the storage unit 200. This is detected based on the absence of the tray KST, and the detection device 206 sends it to the device transfer device 410 of the unloader unit 400 as a lot end signal.
  • the detection timing as the lot end is not limited to the time when the customer tray KST stored in the pre-test IC stocker 201 becomes zero.
  • the customer tray KST stored in the pre-test IC stocker 201 is used.
  • it may be the time when the number becomes less than a predetermined number, for example, two or three.
  • the lot end detection method is not limited to physical detection by a sensor or the like. For example, even if it is detected on a program incorporated in the node 1 good.
  • FIG. 12 is a schematic diagram showing a second example of the lot end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.
  • the above-described processing method is excellent in that a quick lot end processing is possible.
  • the first transfer arm 420 is inferior in that it requires a space for retraction.
  • the second example of the processing method shown in FIG. 12 that does not require a space for the first transfer arm 420 to retreat may be applied.
  • the control unit of the device transport device 410 As shown in FIG. 12, when the IC device is moved from the test tray TST to the customer tray KST corresponding to the test result, only the first transfer arm 420 is placed in the first area 31 of the customer tray KST.
  • the second transfer arm 430 controls the first and second transfer arms 420 and 430 to stop the transfer of the IC device to the customer tray KST.
  • the second transfer arm 430 stops transferring the IC device, and only the first transfer arm 420 moves from the test tray TST to the first area 31 of the customer tray KST. The device is moved so as not to generate a tooth missing portion 31 a between the first region 31 and the second region 32.
  • the first transfer arm 420 is configured so that the first area 21 and the second area of the test tray TST are
  • the IC device can be transferred from the test tray TST to the first area 31 of the customer tray KST only by the second transfer arm 430. good.
  • FIG. 13 is a schematic diagram showing a third example of the rod end processing method in the unloader section of the electronic device test apparatus according to the embodiment of the present invention.
  • the numbers attached to the arrows in Fig. 13 Indicates the order in which the transfer arms 420 and 430 move.
  • the control unit of the device transport device 410 As shown in FIG. 13, when the IC device is moved from the test tray TST to the customer tray KST according to the test result, the second transfer arm 430 force is transferred to the second area 32 of the customer tray KST as shown in FIG.
  • the first and second IC devices are transported to the buffer unit 405, and the IC device stored in the buffer unit 405 is transported to the first area 31 of the customer tray KST.
  • the transfer arm controls the 430.
  • the second transfer arm 430 transfers the IC device to the buffer unit 405, and then the first transfer arm 420 force is temporarily stored in the buffer unit 405.
  • the IC device thus moved is moved to the first area 31 of the customer tray KST so as not to generate the tooth-missing portion 3 la between the first area 31 and the second area 32.
  • FIG. 14 is a schematic diagram showing a fourth example of a lot end processing method in the unloader section of the electronic device testing apparatus according to the embodiment of the present invention. Note that the numbers attached to the arrows in FIG. 14 also indicate the order in which the transfer arms 420 and 430 move.
  • the control unit of the device transfer device 410 As shown in FIG. 14, when the IC device is moved from the test tray TST to the customer tray KST according to the test result, the second transfer arm 430 is moved to the second area 32 of the customer tray KST as usual. Control the first and second transfer arms 420 and 430 so that the first transfer arm 420 transfers the IC device from the second region 32 to the first region 31 after the IC device is transferred to the first region 31. .
  • the second transfer arm 430 transfers the IC device from the test tray TST to the second area 32 of the customer tray KST as usual, and then fills the missing portion 31a.
  • the first transfer arm 420 moves to the last tail of the first area 31 in the second area 32 of the customer train KST.
  • the force provided with two transport arms 320, 330, 420, and 430 in each of the device transport apparatuses 310 and 410 is not particularly limited in the present invention, and three or more A transfer arm may be provided.
  • transfer arm 320, 420 is provided in the device transfer apparatus 310, 410, and a plurality of movable heads 322, 422 (holding unit) are arranged in the X-axis direction on the transfer arm 320, 420 (transfer arm).
  • a plurality of movable heads may be provided so as to be independently movable along the X-axis direction. As a result, the throughput can be improved while maintaining the size of the electronic component testing apparatus.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un appareil servant à contrôler des composants électroniques, à savoir, des composants de circuit imprimé, ce qui consiste à mettre ces derniers en contact avec la partie contact d'une tête d'essai (5). On utilise des dispositifs de transfert (310, 410) de composants afin de transférer les composants de circuit imprimé d'un plateau client (KST) à un plateau d'essai (TST) ou du plateau d'essai (TST) au plateau client (KST). Le dispositif de transfert de composants comporte une pluralité de bras de transfert (320, 330, 420, 430) pouvant se déplacer individuellement dans des sens pratiquement parallèles vers le plan principal du plateau client (KST) ou du plateau d'essai ((TST), se rapprocher simultanément dudit plateau client (KST) ou dudit plateau d'essai (TST), maintenir les composants de circuit imprimé dans le plateau client (KST) ou le plateau d'essai (TST) ou placer lesdits composants sur ledit plateau d'essai (TST) ou ledit plateau client (KST).
PCT/JP2006/309954 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques WO2007135709A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2006/309954 WO2007135709A1 (fr) 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques
TW096117227A TW200815774A (en) 2006-05-18 2007-05-15 Electronic component transfer and testing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/309954 WO2007135709A1 (fr) 2006-05-18 2006-05-18 Appareil de contrôle de composants électroniques

Publications (1)

Publication Number Publication Date
WO2007135709A1 true WO2007135709A1 (fr) 2007-11-29

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TW (1) TW200815774A (fr)
WO (1) WO2007135709A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI736454B (zh) * 2020-10-23 2021-08-11 美商第一檢測有限公司 晶片測試系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000162268A (ja) * 1998-11-27 2000-06-16 Advantest Corp 電子部品の温度印加方法および電子部品試験装置
JP2003270295A (ja) * 2002-03-14 2003-09-25 Yamaha Motor Co Ltd 電子部品検査装置
JP2006090731A (ja) * 2004-09-21 2006-04-06 Yamaha Corp Ｉｃハンドラ及びコンタクタ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000162268A (ja) * 1998-11-27 2000-06-16 Advantest Corp 電子部品の温度印加方法および電子部品試験装置
JP2003270295A (ja) * 2002-03-14 2003-09-25 Yamaha Motor Co Ltd 電子部品検査装置
JP2006090731A (ja) * 2004-09-21 2006-04-06 Yamaha Corp Ｉｃハンドラ及びコンタクタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI736454B (zh) * 2020-10-23 2021-08-11 美商第一檢測有限公司 晶片測試系統

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TW200815774A (en) 2008-04-01
TWI352815B (fr) 2011-11-21

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