TW200815774A - Electronic component transfer and testing apparatus - Google Patents

Abstract

An electronic component testing apparatus is provided for testing IC devices by electrically bringing the IC devices into contact with the contact section of a test head (5). Component transfer apparatuses (310, 410) are used for transferring the IC devices from a customer tray (KST) to a test tray (TST) or from the test tray (TST) to the customer tray (KST). The component transfer apparatus is provided with a plurality of transfer arms (320, 330, 420, 430), which can individually move in substantially parallel directions to the main plane of the customer tray (KST) or the test tray (TST), come close to the same customer tray (KST) or the test tray (TST) at the same time, hold the IC devices stored in the customer tray (KST) or the test tray (TST) or place the IC devices on the test tray (TST) or the customer tray (KST).

Description

200815774 IX. EMBODIMENT OF THE INVENTION: TECHNICAL FIELD The present invention relates to an electronic component testing device for a component handling device, and various kinds of bun components for placing a semi-conducting garment on a liver and a v-volume circuit component (hereinafter) Collectively referred to as Ic sub-total, yak) 接触 test head contact electric ten contact 'with the κ component of the electronic component test device 1C component from the passenger end of the dragon (four) Bu test carrier moved to the client Carrier disk. Battle - Gemen "Parts from the test [previous technique] In the I c component 荨 electronic component potential 'P»t ^ m. In the righteous private, use the electronic component test I set to test the packaged shape] The performance or function of the 1C component of the heart. The processor that constitutes the electronic component testing device includes: the loading unit, the empty room unit, and the unloading unit. To the loading unit of the processor, I

One will use 1C 70 pieces to accommodate the pre-test! The C component 'or the storage tray of the ΤΓ 疋 收纳 ( ( ( 以下 ( ( ( ( ( ( ( ( ( ; ; ; ; ; 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子Test the carrier tray) and transport the test carrier to the empty chamber. , in the empty chamber of the processor, apply high temperature or low I, I, [I, after the force, make the Ic & contact with the contact portion of the test head, the electronic component test device body ( Hereinafter referred to as the test device) Execution test 0, followed by the test carrier disk carrying the IC component that completed the test from the empty

224 7-8847-PF 5 200815774 The room is transported to the unloading R / & 卩 卩 Transfer the ic component to the passenger carrier plate corresponding to the test result in the unloading section, gossip to good and not The distinction between good product categories is 0. The test device hopes to further increase its processing capacity. …:work! , only increase the number of measurements in the empty chamber (can be the same as the number of IC components in 4 test methods) Η Ding machine ^ ν number) 疋 not enough, but must be improved after the test 以 to carry η ^ μ, 70 cattle The ability to transfer between the guest carrier and the test carrier. For the capacity of the device, first consider the number of 1C components that can be maintained while moving or moving the device (hereinafter, % is the number of simultaneous maintenance). However, in the county, the 4 k 2 method has a problem in that the position determines the precise acoustic sub-M-Μ or the conveying speed is slow due to the mechanical limitation, and there are restrictions on the two conveying speeds. Other ways to improve the handling capacity m ^ m ^ Η Method, test 1 set 2 sets of transport devices. However, according to this method, the increase is about 2 times, and the electron element strain is an area of the 70-electron 70-test device that is loaded into the unloading portion. SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component transposition having the 7C transport device, which maintains the size of the electronic component: 4 device and can increase the processing amount. In order to achieve the above object, according to the present invention, there is provided an electronic component testing device for electrically contacting a contact portion of a test electronic component with a test head to test the electronic component to be tested. 2247-8847-PF 6 200815774 The tested electronic component of the nanometer is transferred to the mth', which can be in parallel with the main disk of the first carrier disk, and maintains the same as the first carrier application patent r : ;: (4) The electronic component to be tested (see tt: Ming, in the component handling device that displaces the electronic component to be tested from the first carrier, and the carrier 2 of the carrier 2): The Γ carrier can be accessed independently and at the same time. Thereby, the size of the & can be set to be the same as in the past, and the carrying capacity can be increased. Thus, the size of the electronic component testing device can be maintained, and the processing can be improved. It is not particularly limited, but it is preferable that the plurality of movements can be independently moved in the direction substantially parallel to the main surface of the second carrier tray while simultaneously approaching the same second carrier tray and The = electronic component is placed in the The second carrier tray (see Application No. 2 in the present invention) can make the plurality of handling devices the same:: can be independently and simultaneously approached. Thereby, the electronic components can be maintained: the size of the device and the processing amount can be increased In order to achieve the above object, in accordance with the present invention, an element is provided for electrically contacting a contact portion of a test electronic component with a test head. Μ An electronic component test device for testing the electronic component to be tested is made 224 7 -884 7-PF 7 1 The tested electronic component housed in the carrier tray is transferred to the second carrier tray, which includes a plurality of handling devices, which can be respectively in the direction parallel to the main face of the second carrier disk 200815774 Independently moving, simultaneously approaching the same second carrier, and driving the tested electronic device to 70 pieces on the second carrier (see the third item of the patent application scope). In the present invention, The test electronic component housed in the carrier 1 is placed in a 70-piece transport device of the second carrier-like taxi from the private battle a, and is provided with a plurality of transport devices.

It can be set up independently and simultaneously for the same 笫9 莽_6/L ^ 祖 Z carrier. By this, the size of the component handling device 1 can be made the same as in the past, and the handling ability can be increased. Therefore, the size of the electronic component testing device can be maintained and the amount of processing can be increased. In the invention described above, it is not particularly limited, but it is preferable to carry the transport arm that holds the maintenance portion of the electronic component to be tested, and the component transport device has the support device and is in violation of the evacuation arm to be movable. The 5 hoisting arm is supported by the 5th support device after the same operation, and the handling is 'independent and can be in the fourth item of the patent scope. The support device is moved (see the application invention is not particularly limited, but it is preferable to support the transport arm so that it can be moved in the direction of ^^, ώπ, 疋, the plural transport #, by the same The supporting device is arranged side by side along the direction of the initial number ^ β Φ ^ 4 4!- 耆 疋 (see the fifth paragraph of the patent application scope). In the above invention, it is not particularly limited, and the brazing arm can be simultaneously accessed. The τ is assigned to each of the pallets and assigned to the responsible district/bearer item. 4 See the scope of the patent patent section β is not particularly limited in the above invention, and it is preferable to:

2247-8847-PF 8 200815774 The carrier is one of the passenger carrier or the test carrier, the second bearing is the material «or the other of the test carrier (see, please refer to the patent scope 7) . In order to achieve the above object, according to the present invention, an electronic component test is widely used for electrically contacting a contact portion of a test electronic component with a test head. The test electronic component includes a load portion having a The tested electronic component before the test, you can install any of the above-mentioned component handling devices to the test bearing 5, and the above-mentioned (see the application for the patent scope, the eighth work, j, in order to achieve the above purpose, according to the present invention, The component test device 'is used to contact the electronic component to be tested with the tester to test the electronic component to be tested, #include the unloader 2: = the tested test component is moved from the test carrier to the guest <any of the above-mentioned components handling of the carrier disk item 9) / see the patent scope of the invention is not particularly limited in the above invention, but it is preferable that the device 'checks the batch of the electronic component to be tested: Including the first! The transport arm and the second transport arm are assigned to the first area of the area in which the i-th transfer arm is responsible, and the transport arm 'is the second arm of the area responsible for the second transport arm. 1 The second transfer arm is dispensed, and when the detecting device checks the end of the batch: = the transport device according to the detection controls the ith transport: the transport arm is placed so that the tested electronic component is placed 2 The younger one of the second regions (see the patent application section "Magic Zone" or 2247-8847-PF 9 200815774 when the batch component handling the electronic component under test is placed in the first domain or the first: zone: two , the test electronics can make it not in the first area of the client carrier disk = the vacancy part. ^ 9 between the specific statement, for example, when the detection device checks the component handling device according to the detection, ..., the second Carrying the arm so that the first transport arm and the test electronic component are sent from the test carrier to the i-th party will be ordered (see the patent scope of item u) ° _ 2nd district other A specific example is when the checkout device is checked _ transporting According to the detection result, the second carrier arm is controlled such that the first carrier arm and the second carrier arm and the electronic component to be tested are sent from the test carrier to the second carrier. One of the two areas, and the second transport arm or the other one stops the transport of the tested electronic components (= 12 of the transport arm). a specific example is that the unloading portion of the test carrier and the guest carrier are separately provided: a punching portion, which is associated with the electronic component to be tested, and when the detecting device checks and stores the device, according to the detection result, Controlling, at the end of the tail, the meta-transport arm causes the second transport arm to transport the measured second arm and the n-carrier plate to the buffer portion, and the first component is from the test The electronic component to be tested is transported to the first region or the buffer portion (see the 13th article of the patent application). 2247-8847-ρρ 10 200815774 in the 2 region, there are other specific examples, when the detection is performed When the device checks the batch, the component handling device is based on the inspection person, The tail and the second transport f are such that one of the first transport arm and the second transport arm is small, and the electronic component to be tested is placed in the first region or the first region from the second region or the first region 2 area (refer to the 14th item of the patent application). The embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view showing the processing of the carrier of the electronic component testing apparatus according to the embodiment of the present invention. FIG. 3 is a conceptual diagram showing the processing of the carrier of the electronic component testing apparatus according to the embodiment of the present invention. The conceptual diagram of the processing of the carrier disk of the electronic component testing device according to the embodiment of the present invention has a portion in which elements arranged in the vertical direction and the direction are actually displayed in a planar manner. Therefore, the mechanical (three-dimensional) structure is explained with reference to Fig. 2. The electronic component testing device of the present invention is a device for testing (checking) whether an Ic component is properly operated in a state where a temperature of a temperature of a temperature or a low temperature is applied to an Ic component, and classifying the IC component according to the test result, It consists of a processor 1, a test head 5, and a test device β. The test of the ic component of the electronic component test device is performed by moving the Ic component from the guest carrier KST to the test carrier TST. Therefore, the processor 1 of the present embodiment, as shown in FIGS. 1 to 3, is transported by the lower 2247-8847-PF 11 200815774::: 2 〇°, which accommodates the 1 c component or the test 2 承载 before the test. The client ^ disk KST; the planting department · will be sent from the storage department and the case to the test carrier TST and sent to the empty department 1!: 亍 2: 4 master 5, in the state of being carried on the test carrier m : The empty chamber portion 10 of the test. Unloading section 4. 0, will be removed from the empty room, sorted and moved to the client:

: Test stand 5 on test head 5 again. The wire H shown in Figure i is connected to the K device 6, and is electrically connected to the test device 透过 through the wire 7 and the 70C member is connected to the test device 6, and the test device is used to test the signal. Moreover, as shown in the first figure, there is a space at a portion of the lower portion of the machine 1 in which the through hole formed on the basis of the device of the processing machine 1 is replaced by a replaceable test head 5'. The 1C component and the test socket 5G on the test head 5 are electrically contacted. When the type of the varnish is alternated, it is replaced with a test head having a test seat suitable for the shape of the lc element of this type, the number of pins, and the like. The following is a detailed description of each part of the processor 1. [Storage Portion 200] Fig. 4 is an exploded perspective view showing the 1C storage of the electronic component testing apparatus of the embodiment of the present invention, and Fig. 5 is an exploded perspective view of the guest carrier tray using the electronic component testing apparatus of the embodiment of the present invention. The storage unit 2G0 includes: a pre-test Ic storage 2G1 for accommodating a passenger carrying tray carrying the test ic element; a test Ic warehousing 2 〇 2 for accommodating the I c categorized corresponding to the test result Component test bearer

224 7~88 4 7-PF 200815774

The storage racks 201 and 202, as shown in FIG. 4, include: a frame-shaped carrier tray support frame 203; and a lifting platform 204 that can be lifted up and down from the lower portion of the tray support frame 203, and overlaps in the tray support frame 203. The plurality of guest carrying trays KST are accumulated, and only the overlapping cumulative carrier trays KST are moved up and down by the lifting platform 204. In the present embodiment, as shown in FIG. 5, the guest carrying tray KST is provided with 60 rows and 6 columns of 60 housing portions 33 for accommodating 1C elements, but actually there are corresponding types of IC components. The configuration of various variations. The pre-test 1C warehousing 201 and the testing 1C warehousing 202 are generally of the same construction. Therefore, the appropriate number of individual Ic warehousing 201 and test ic warehousing 202 can be set as needed. In the present embodiment, as shown in Figs. 2 and 3, the pre-test Ic storage 201 is provided with two storage STK-Bs, and an empty carrier storage STK-E is arranged beside it. The individual empty carrier disk storage STK-E cumulatively overlaps the empty guest carrier disk kst transmitted by the unloading unit 400. Next to the empty carrier storage STK-E, there are 8 storage STK-1, STK-2.....STI-8 in the test Bi Ware Warehousing 202, which can correspond to the test results and can be divided into 8 types of storage. In addition to the difference between good and bad products, good products can be divided into high-speed products, medium-speed products, low-speed products, or defective products can be divided into those who need to be tested. [Loading Unit 300] Fig. 6 is an exploded perspective view showing a 2247-8847-pf 13 200815774 承载 type carrier disk using the electronic component testing device of the embodiment of the present invention, and Fig. 7 is a view showing an electronic component testing device according to an embodiment of the present invention. A plan view of the loading portion and the unloading portion, and Fig. 8 shows a plan view of the loading portion of the electronic component testing device according to the embodiment of the present invention. The above-mentioned guest carrier KST is transported from the lower side of the device substrate 1〇1 to the two window portions of the loading unit 3 by the carrier moving arm 205 provided between the housing unit 200 and the device base 101. 306. And, in the loading section

The Xintian component handling device 310 transfers the IC piece accumulated in the guest carrier tray KST to the aligner 305, thereby correcting the mutual position of the 1C components therein.

After the relationship, the handling device 310 accumulates the 1C component transferred to the aligner 305 to the test carrier tray tst where the loading section 3 is stopped. The test carrier tray TST, as shown in Fig. 6, is flat in the square frame 12.

The pallets 3 are arranged at equal intervals, and the mounting sheets 14 are formed at equal intervals on both sides of the pallets 3 and the sides 12a of the square frames 12 opposite to the pallet W. Between the pallets 13 or between the pallets 13 and the sides, the insert accommodating portions 15 and the insert accommodating portions 15 are formed by the two slats 14 and each of the inserts 16 is accommodated. The insert 16 is placed in the two mounting pieces 14 in a floating state using the fastener 丨7. Therefore, mounting holes 18 for mounting the insert 16 to the mounting tabs 4 are formed at both end portions of the insert 16. This insert 16, as shown in Fig. 6, is provided with 64 on one test carrier TST, and is arranged in four rows and 16 columns. Further, each of the inserts 16 has the same shape and the same size, and the 1C elements are housed in the individual inserts 16 respectively. The ic storage portion 18 of the insert μ, 2247-8847-PF 14 200815774 is determined in accordance with the shape of the shape of the ic piece to be accommodated, and is a square recess in the example shown in Fig. 6. The loading unit 300, as shown in Fig. 7, has a component handling device to transfer the iC component from the guest to the KST and accumulates in the test carrier TST. The component handling device 310 " It is composed of the following: • 2 ancient support roads 311 disposed on the device base plate 1〇1 along the Y-axis direction, in the track 311

The J-state is moved back and forth along the Y-axis direction. The moving arm 1 and the second transport arm 330 are also provided. Moreover, the support device of the third embodiment of the present embodiment is as follows. In the range, the first transfer arm 320 and the second transfer arm 330 of the yoke example correspond to one of the transfer arms of the application for the second child 2 moving the temple, and the transport arm 320 includes: /rl ^ sigh The 9 guest carrying trays KST located at the window portion 306 at 2 and the obligate m between the loading portions 306 can be moved to the movable cylinder 321 of the carrying tray TST. The movable head 322 which can be moved in the axial direction under the movable column; the 16 adsorption targets 3 arranged in the movable head 322 in 2 rows and 8 columns, by means of The figure does not particularly show the movement of each adsorption pad, but it is possible to place 16 iC elements from the guest end _ KST# on the test carrier TST in the direction of the 2 axes. The windward KST shifting the second transport arm 330 is also a phase _ Included • The two passenger carrying trays located at 2 #3〇6 and the rails between the carriers tst located at the load ^ μ σ 〇〇 The movable arm of the test bearing 11 can be moved back and forth. Supported on the movable arm 331, H331, qq〇· H- moving in the direction of the vehicle, arranged in 2 rows and 8 columns downwards in the movable head 3, σ head 333. Each of the adsorption pads 333 can be moved up and down along the 2237-8847-pf 15 200815774 in the Z-axis direction by an actuator not specifically shown in the adsorption pad pattern, and 16 1C components can be taken from the guest carrier tray. The KST is placed on the test carrier m. The first transfer arm 320 and the second transfer arm 33A are supported by the same group of lanes 311. In the seventh drawing, the first transport arm 320 and the second transport arm 30 are located on the lower side of the first transport arm 320, and the second transport #330 is located on the upper side, and are arranged side by side in the γ-axis direction on the rail 311. Independently moves on the track 311. Moreover, the first and second handling

'320, 330 cannot be crossed on the track 311. Therefore, in the seventh figure, the first transfer arm 320 is not located on the upper side and the second transfer arm 330 is located on the lower side. In the present embodiment, as shown in Fig. 8, The first transfer arm 32A and the second transfer arm 330' can simultaneously approach the same guest carrier KST located at the window portion 306. Further, in the guest carrying tray KST, the first area 31 of the lower half (for the guest carrying tray KST in Fig. 5, is the right half of the row 5歹J of the 30 supporting portions 3 3 ) is assigned to the Jth transport arm 3 2 〇 as the area responsible for the first transport '320. Moreover, the second area 32 of the upper half of the upper end of the passenger carrying tray a? (for the passenger carrying tray m in Fig. 5) is the support section of the left half of the 6 rows and 5 columns. 33) The second transfer arm 33G is assigned to the area responsible for the second transfer arm 33 (). Further, two load carriers m are provided in the loading unit 300, but the i-th and second areas 31 and 32 are allocated to the individual passenger-receiving disks KST. Similarly, in the present embodiment, the first transfer arm 320 and the second transfer arm 330 can simultaneously approach the same test-carrying tray TST. Moreover, in the test carrier tray tst, the i-th region of the lower half 21 2247-8847-PF 16 200815774 (for the test carrier m in FIG. 6 , is the row 2 of 16 in the lower right half 32 The storage unit 18) is assigned to the first transport arm 32 as the area responsible for the first transport arm 320. Further, in the test carrier TST, the half (four) second region 22 (for the test carrier TST in Fig. 6 'is the 32 storage portions 18 of the upper left half of the two rows and 16 columns) is assigned to the first The transfer arm 330 serves as a responsible area of the second transfer arm 330. - In the component handling device 310, the first transport can simultaneously approach the same passenger carrier

The arm 320 and the second transfer arm 330 KST or the test carrier tray tst in the above embodiment are as described above. In other words, the first transfer arm 320 adsorbs 16 1C elements from the first region 31 of the guest tray KST by the adsorption pad 323, and moves the 1C element to measure the adsorption of the first region $21 of the carrier tray TST. While the adsorption of the crucible 323 is released, the second transport arm 33G adsorbs 16 1C components from the second region 32 of the guest carrier KST by the adsorption crucible 333, and moves the IC component to the test carrier TST. The suction (four) 333 of the second region 22 is released by the transfer of '32 IC pieces simultaneously from the guest carrier tray KST to the test carrier tray TST. As a result, the size of the component carrying device 31 is doubled as in the past, and the carrying capacity is doubled. Therefore, the size of the electronic component testing device can be maintained and the amount of processing can be increased. As shown in Figures 1 and 8, the passenger carrier KST and the test carrier TST are provided with the aligner 3 〇 5. Each of the aligners 305, although θ is not H 7F ′ has a relatively deep recess, the periphery of the recess is inclined

Face to face. Therefore, the 1C component that is moved from the guest carrier KST to the test carrier TST is dropped into the aligner 305 before moving to the test carrier TST.

22 4 7-8 847-PF 17 200815774 This makes it possible to correctly determine the positional relationship between b3 and 匕1 in the ic component phase, so that the IC component can be finely moved to the test carrier TST. Further, in the present embodiment, two aligners 3〇5 are provided between the guest carrier tray KST and the test carrier tray m, but the alignment H 305 on the lower side in Fig. 8 is the first conveyance. The aligner dedicated to the arm 320 is the aligner dedicated to the second transport arm 33A in the upper side of the figure. The IC component is housed in all the housing portions 18 of the test carrier tray tst

At this time, the test carrier m is carried into the empty chamber portion 100 by the carrier tray transporting device 102. On the other hand, all of the Ic components carried on the passenger carrying tray KST are moved to the test carrier m_, which ejects the empty passenger carrier KST, which is moved to the carrier transfer device 2〇5. The carrier tray transfer device 205 moves the empty carrier tray to the empty carrier tray storage stk two test 1C storage 202 client carrier disk KST full load 1 (: component, ^ empty carrier disk is supplied to test 1C warehouse 202 [Empty Chamber] The above test carrier TST is mounted after the loading unit 300 Ic is mounted

It is fed into the empty chamber portion 100, and each IC component is tested while being carried on the test load: =. The empty chamber portion 100, as shown in Figs. 2 and 3, is composed of the following: an impact chamber 110 for applying the target south or low temperature heat to the IC mounted on the test carrier TST. Pressure; test chamber 120, the IC component in the state where the impact chamber 11 〇, % is under thermal pressure is in contact with the test head 5, and is removed from the impact chamber 130 to remove the heat pressure from the 1C component of the end test. . 2247-8847-PF 18 200815774 Moreover, it is preferable that the de-shock chamber 130' is thermally insulated from the impact chamber 11A or the test chamber 12, in fact, the area of the impingement chamber 110 and the test chamber 120 is maintained at a temperature or a low temperature, The impact chamber 130 is thermally insulated from it, but these are collectively referred to as empty chamber portions. The impact chamber 110' is configured to protrude above the test chamber 120. Further, as shown in the conceptual diagram of Fig. 3, the inside of the impact chamber 11A is provided with a period in which the vertical carrying clothes are vacated to the type 45 chamber 120, and the plurality of test carriers are supported by the vertical carrying device while being in standby. in. It is mainly 55 to 15 Celsius in the aircraft. The high temperature or low temperature heat of the spectrum: in 1C components. In the test room 120, straight Zhongzhuo Magu, Mesh, 丨4 1", and Shuo 5, the test bearing ^ is transported to the top of the test head 5, so that the output of the piece enters the terminal shell. The electrical contact of the contact foot, thereby implementing 1 (: the result of the test of the component, is based on the ^ address attached to the test carrier τ code, and the number of the specified component in the test carrier m, stored In the storage device of the electronic component testing device, 12D protrudes: the chamber 13° is also the same as the impact chamber 110: it is arranged larger than the test chamber, and the upper display 'as shown in the conceptual diagram of Fig. 3' is provided with a vertical moving device. In the de-impact chamber 130, in the case where the impact chamber (1) is at a high temperature, the element cooling is returned to Y by the air supply, and the IC element that has been warmed back is carried out to the unloading unit 400. In the case where the impact chamber 110 applies a low temperature to the 1C element, it is heated to a temperature at which no condensed water is generated by heating τ r - μ l / dish wind or adding ..., 1C 70 pieces, and then 2247-8847-pp 19 200815774 The reheated ic element is carried out to the unloading unit 400. At the upper portion of the impact chamber 110, a test carrier tray is formed. The inlet of the TST is carried in from the stacking base 101. Similarly, in the upper portion of the impingement chamber 130, a test for carrying out the test carrier TST to the device base J 01 is formed, and at the device base plate 1〇1, a carrier tray is provided. The conveying device 102 is configured to pass the test tray TST from the empty chamber portion (10) through the inlet and the outlet: for example, the tray conveying device 102 is constituted by a rotating roller, etc. By disposing the carrier 1 i 2G2, The test carrier tray TST carried out by the impact chamber 13G is sent back to the impact chamber 110 through the unloading portion_ and the passenger portion 3GG. [Unloading unit 400], Fig. 9 shows the unloading portion of the electronic component testing device according to the embodiment of the present invention. Plane P. 400, the Ic element after the test carrier disk $K sent to the unloading section 4 is moved to the guest carrier KST ° corresponding to the test result, as shown in Fig. 2, the unloading section The customer carrying tray formed on the apparatus base plate 1〇1 from the accommodating portion 2GQ to the unloading portion 4GG is visibly disposed on the device base plate 101. The unloading portion 40 has the component carrying device 41〇 to test the humiliation Yun F burdock's type carrier tray TST shift To the guest carrier KST. The component #101 is formed along the γ: square 1::, and is widely composed of the following: on the device base, the arm 430 can be carried along the two tracks 411, and the second arm 430. 1 transport arm 420 and track 411 of the second pick-up yoke example, which is equivalent to applying for a spear

2247-884 7-PF 20 200815774 An example of a support device in the range, % 2 M 'S m only the first transfer arm 420 and the ang z transfer arm 430 are equivalent to the application of the straight brake ^ 丄 ^ Λ An example of a handling arm in the middle. n J. 42° contains: 2 measurements located at 400 in (4)

::Load: such as the 4 passenger carrying trays KST on the 4 windows, the movable arm 421, the supportable movable head 422; the 6 rows of 423 placed on the movable head 422 Adsorption pad 423. Each of the adsorption pads: can be placed two times in the Z direction by an actuator not specifically shown in the drawing, and that 16 elements can be moved from the test carrier m to the respective carrier trays KST. The second transport arm 43. Also the same 'includes: movable armature 7 which can be reciprocated on the road 411 between the unloading section _ one of the test trays TST and the four trays KST of the four window sections 4G6; supported on the movable arm On the 431, the movable head 'movable in the X-axis direction of the X uranium a 4' 4q9. 0 / 〇 can be arranged in 2 rows and 8 columns downwards in the movable head like 塾 塾 = 3. Each of the adsorption crucibles 433 can be moved up and down in the z-axis direction by an actuator not specifically shown in the drawing, and the 16 components can be moved from the measurement=carrier tray TST to the guest carrier tray KST at a time. ^ The first transfer arm 420 and the second transfer arm 430 are supported on the same road 411. In the first drawing arm 420 and the second transfer arm 43A, in the seventh drawing, the first transfer arm 420 is located on the lower side, and the second transfer arm 43 is at the upper side, and the ij is arranged in parallel along the Y-axis direction on the track 411. U moves independently on the track 411. And, the first! Since the second transfer arms 420 and 430 cannot intersect with the rail 411 at 2247-8847-PF 21 200815774 m, the first transport arm 420 is located on the upper side and the second transport is not present in the seventh embodiment. The arm 430 is located on the lower side. In the present embodiment, as shown in Fig. 9, the f 1 transport arm 42 and the second transport arm 430 can simultaneously approach the same test carrier TST located at the unloading portion 4A. Further, in the test carrier TST, the lower work area 21 (the test storage tray TST in Fig. 6 is the 32 storage units 18 of 2 rows and 16 columns in the lower right half) is assigned to The first transfer arm "Ο is the area responsible for the first transfer arm 420. Further, in the test carrier tray _ TST, the second region 22 of the upper half (the test carrier TST in Fig. 6 is έ, which is the 32 storage units 18 of the upper left half of the 2 rows and 16 columns) The second transfer arm 430 is used as a responsible area of the second transfer arm 430. Further, two unloading units 400 are provided with two test carriers TST, but the first and second regions 21 and 22 are allocated to the individual test carriers TST. Similarly, in the present embodiment, the i-th transfer arm 42A and the second transfer arm 430' can simultaneously approach the same guest carrier disk kst located at the window portion 406. Further, in the guest carrier KST, the j-th area 31 of the lower half (for the guest carrier KST in Fig. 5, the support portion 33 of the 6-row and 5-column of the right half) is allocated. The first transfer arm 420 is used as a region responsible for the first transfer arm 420. Further, in the guest carrier KST, the second region 32 of the upper half (for the guest carrier KST in Fig. 5, is the support portion 33 of the left half of the 6 rows and 5 columns) The second transfer arm 430 is assigned to the area responsible for the second transfer arm 430. Further, four unloading portions 400 are provided with the four passenger carrying trays kst. However, the first and second regions 31 and 32 are allocated to the individual guest carrying trays KST. 2247-8847-PF 22 200815774 In the component handling device 410 of the above embodiment, the first transfer arm 420 and the second transfer 劈F〇T ' 430 can simultaneously approach the same guest carrier KST or test carrier TST. Further, the first transport arm 420 is attached to the first region 21 of the test carrier TST by the adsorption pad 423, and the Ic element is moved by the first region 21 of the test carrier TST, and the Ic element is moved at the guest: the first region of the KST: The second transfer arm 430 of the adsorption 423 of 31 adsorbs the 1C element from the 2 region 22 of the test carrier TST by the adsorption pad 433, and moves the 1C element by the carrier carrying disk KST. The adsorption of the adsorption pad 433 of the second region 32 is released, and the size of the C component is placed on the passenger carrier. The size of the component handling device 410 is the same as in the past. U Day plus its handling capacity, because of &, can maintain the size of electronic component testing equipment, and increase the processing volume. - Although the drawings are omitted, the lower part of the individual window portions 4〇6 is provided with a lifting platform for lifting and lowering the passenger carrying tray KST, where the passenger carrying the post-test 1C component loaded with the displacement is carried. The carrier tray KST is lowered, and the fully loaded carrier tray is sent to the carrier tray transfer arm 205. Therefore, in the electronic component testing device of the present embodiment, the categories that can be distinguished are at most eight types, but only four window portions 406 are formed on the device substrate ι ι of the unloading portion 400, and therefore, the unloading portion 4 is the most Only 4 guest bearers kst can be configured. Therefore, categories that can be distinguished instantly are limited to four categories. Generally speaking, the speed of good products is divided into three categories: high-speed products, medium-speed products, and low-speed products. In addition, if there are defective products, four categories are sufficient, but sometimes there are rare things such as need to be Testers, etc. do not belong to 2247-8847-PF 23 200815774 items in these categories. In this way, in the case of generating 1 unit that is classified as a category other than the category specified by the window part y client-receiving discs KST of the unloading section _, 1 guest-bearing disc is removed from the unloading section 400 Sending Recycling = 200' Instead, the newly generated class = disc KST can be forwarded to the unloading section to accommodate the K: component. However, in this case, it is necessary to interrupt the classification operation problem, and the buffer of the test carrier m and the window of the electronic component test of the present embodiment is provided, in the buffer: 4.5, temporarily placed A component of a category that is only occasionally produced. / FIG. 10 is a schematic view showing an example of the method for processing the end of the electronic component =: carrier portion according to the embodiment of the present invention, and Vn is transmitted and received according to the end of the batch of the electronic component (4) test device according to the embodiment of the present invention. Block diagram. m: two = in the unloading section 40° of the present embodiment, 'the client bearer:: the bundle domain 31 and the second zone (four). At the end of the brother 1 region 31, there are cases where the profit is received, and the IC is generated. The vacant portion 31a of the piece. In the second embodiment, the second transport arm 42 is controlled by the method described below. At the end of the batch where the second transfer arm 43 is not produced, the first region 31 and the second region 32 are vacant, and the first region 31 is fully loaded with the 1C element. When receiving the component carrying device 410 of the unloading portion in the embodiment, the control unit of the component carrying device 41 is 2247-8847-pp 24 200815774 41 2 as shown in FIG. 1 ^ 1 ' a When you move from the test to the passenger carrying tray KST, the second and second transfer arms 420, 430 are controlled so that the first and second transfer arms 420, 430 will The IC 70 is transported to the first area 31 of the passenger carrying tray KST. According to the control signal '帛1, the transport arm 420 transports the 1C component to the guest carrier KST! At the same time as the area 3, the second transport arm 43〇 conveys the 1C element to the second area 32 of the guest carrier KST, so that no gaps 31& are formed between the first region 31 and the second region 32 of the Rush. : and, at the end of the batch of the chemical component, as shown in Figure u, for example, the sensor of the two 2GG sensors is detected, and the passenger carrier disk stored in the DI storage bin 201 is detected. The Π 奘罟 戟 UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT UT Ping war. ρ 2:2: The time at which the end of the second checkout is not limited to the 1C bin before the test:::Save: When the client carrier KST is zero, for example, it can also be φ^^^2()1 _Material KST is 2 or 3, etc. Physical detection such as the following sub-sensors, for example, may not be limited to detection by the program "文" in the processor 1 of the first 2 is a schematic view showing two examples of an electronic component testing device L.j, λ,. brother of the batch end processing method of the unloading portion according to the present invention. The phase processing method has the ability to quickly batch, but the 帛2 carrying arm 43〇 will be ΙΓ ^ - the end of the man's processing (10)! In the area 31, it is necessary to: transport to the passenger carrying tray, to make the first carrying arm

2247-8847-PF 25 200815774 420 The shortcomings of avoiding space. In the case where the speed of the batch end processing is not required, the second example of the avoidance space of the second transport arm 42〇 can be grasped. In the second example of the method of processing the end of the batch of the unloading unit of the electronic component testing apparatus in the present embodiment, the component conveying device 41 of the unloading unit 400 receives the T-end signal, and controls the component handling device 410. The portion 412, as shown in FIG. 12, corresponds to the test result, and moves the ic element from the test carrier m to the client carrier disk KST, and controls the second carrier arm (four), 430 so that only the first carrier arm 420. The IC component is transported. / / each end bearing - the region K of the M KST is transported. The transport arm is transported to the guest carrier KST. According to the control signal, the second child Z carrier arm 430 stops the movement of the Ic component.

Yun 'only brother 1 carrying arm 4 2 fi riding τ Γ - AL, c 搬运 从 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试There is no vacancy between the two regions 32. At this time, the first transfer arm 420 can be connected to the ^21 and the second region 22 = the proximity to the test carrier TST -^ 1 r οι λ, It is also possible to transport the 1C component from the brother 1 area 21 of the test carrier 1 . Further, the first transport can be performed, and only the second transport arm 43 can be used. 1 (: 1 〇 stop the removal of the 1 C component, ] ^ FQT 70 pieces of the i-th region 31 of the passenger carrying tray KST are transported from the test carrier TST. Fig. 13 is a schematic view showing a third example of the batch end processing unit (1) element testing device of the unloading portion according to the present invention. ,

2247-8847-PF 26 200815774 The number indicated by the arrow in Fig. 13 indicates the order of movement of the transport arm 42〇. In the case where the speed of the batch end processing is not required, the third example shown in Fig. 13 of the avoidance space of the i-th transport arm may be used. In the third example of the method of processing the end of the batch of the unloading section of the electronic component testing apparatus in the present embodiment, when the component carrying device 41 of the unloading section 4〇 receives the batch end signal, the component handling device is loaded. The control section of 41〇', as shown in Fig. 13, corresponds to the test result, and the κ component is moved from the screaming, tray tst to the guest carrier KST, and the second and second 潫420 430 ' The second transfer arm 430 sends the 1C component to be transported to the second region 32 of the guest carrier KST to the buffer portion 4〇5, and then the first transfer arm 42G is stored in the buffer portion 4Q5@ic device. Go to the first area 31 of the guest carrier KST. According to the control signal, first, the $2 transport arm 43〇胄K element φ=buffer portion 405, and then the i-th transfer arm seems to be temporarily stored therein, and the 1C component of the punch 405 is sent to the guest carrier KST. The first region μ is such that no gap 31a is generated between the fi region 31 and the second region. Figure 14 shows a schematic diagram of the fourth example of the batch end processing method of the unloading section of the electronic component testing device according to the 日 发 发 = = = 。 。 。 。. Further, the numbers indicated by the arrows in the figure indicate the order of movement of the transport arms 420, 430. In the case where the number of IG pieces to be processed at the end of the lot is small, the fourth example shown in Fig. 14 may be used.

2247-8847-PF 27 200815774: In the fourth example of the batch squeezing and processing method of the unloading portion of the electronic component testing device in the embodiment, the component of the unloading unit 4 is moved 2 to the subtraction material, (4) Moving (4) Setting 41 When moving to the guest carrying tray KST, the first and second carrying arms 420, 43A are controlled as in the usual method, so that the second carrying arm 43〇 transports the 1C to the guest carrying tray. After the second region 32 of the KST, the first transport arm is caused to transfer the Ic element from the second region 32 to the i-th region 31. - According to the control signal, the second transport arm 430 displaces the π element from the test carrier TST to the second area of the guest carrier KST as in the usual manner, after that, the first! The carrying arm 42〇 is removed from the second area of the passenger carrying tray (10) = the rear end moves to the first! The last tail of the area 31 is to be vacant. Furthermore, the above-described embodiments are described to make it easy to understand that each month is not used to limit the present invention. Therefore, in the above embodiment

Each element of the disclosure includes all design or equivalents belonging to the technical field of the present invention. For example, in the above-described embodiment, two transport arms 32G, 33G, 42G, and 43 are provided in the component transporting devices 31A and 41B, but the present invention is particularly limited to this. arm. Further, in the component transporting devices 310 and 410, only one of the transport arms 320 and 420 is provided, and the transporting arms 32A and 42B (transporting arms) are provided with a plurality of movable heads 322 and 422 (supporting portions). It can move along the axis, to: move vertically, or it can also be provided with multiple movable objects on a plurality of carrying arms.

2247-8847-PF 28 200815774 The head makes it possible to move independently along the axis of the station. In this way, on the one hand, the ρ 捭Ύ of the electronic component test device has a size that can be increased and the amount of processing can be increased. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view of an electronic component test apparatus according to an embodiment of the present invention. The straight view of the stereoscopic figure 2 shows that the electronic component test of each + & month target is installed according to the invention. The figure 3 is not based on the invention. The electronic component test device &; Conceptual diagram of the handling of the carrier disk. Fig. 4 shows an exploded perspective view of the storage using the present invention. An exploded perspective view of a customer carrying tray of an electronic component testing apparatus using the electronic component testing embodiment of the present invention. FIG. 6 shows an electronic component test mounting and carrying using the present invention. An exploded perspective view of the disc. Figure 7 of the fly display shows a plan view of the loading device and the unloading portion of the electronic component test device according to the present invention. FIG. 8 shows a loading portion according to an embodiment of the present invention. Floor plan. Figure 9 of the electronic component testing device shows a plan view of the actual unloading portion in accordance with the present invention. The first diagram of the electronic test unit of the electronic unit 70 shows the batch end processing unit of the unloading unit according to the present invention: a 70-piece test apparatus of the electronic unit. 2247-8347-pf 29 200815774 Electronic component test device Electronic component test device Example diagram. A schematic diagram of an example of an electronic component test device. A schematic diagram of an example of an electronic component test device. Figure 11 is a block diagram showing the transmission and reception of the "end" of the Du Ren according to the embodiment of the present invention. Fig. 12 is a view showing the second end of the batch processing method of the unloading portion according to the embodiment of the present invention. The third figure 14 of the batch end processing method of the unloading section of the example shows the fourth part of the batch end processing method of the unloading section according to the embodiment of the present invention. [Main component symbol description] 1 Processor 100 Empty chamber section 200 Storage section 300 Loading unit 310 Transporting device 311 Track 320 First transport arm 330 Second transport arm 400 Unloading unit 411 Road 412 Control unit 420 First transport arm 430 Second transport arm 5 Test head 2247-8847-PF 30 200815774 6 Test Device TST test carrier 21 first area 22 second area KST guest carrier disk 31 first area 32 second area

2247-8847-PF

Claims (1)

200815774 X. Patent application scope: 1. The component handling device is used to test the electronic component test device of the tested electronic component. The first electronic device is placed on the second carrier tray, and the electronic device includes a plurality of moving devices, which can be substantially parallel to the main i-bearing disk. In the direction of the face, the 气 气 气 上 别 别 别 别 别 别 别 别 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立 独立2. The device for transporting a plurality of components as described in item j of the patent scope can be independently moved to be independently moved in the direction parallel to the main direction of the second carrier. The second carrier is in the same state as the %, and the electronic component to be tested is placed on the second carrier. Disk 3. If you apply for a patent range! The component transporting device according to the item, wherein the transporting device is a transporting device having a holding portion for maintaining the electronic component to be tested, the member transporting device has support, and the transporting arm is supported to support the plurality of transporting arms by the same support. Supported by the shock, each of the transport arms is independently moved. The month b is sufficient to move on the support device. 4. The component handling device according to claim 3, wherein the support device supports the transfer arm to enable the VL to move in a specific direction, the plurality of transfer arms, (4) - Set it to side by side. / 特疋方2247-8847-PF 32 200815774 Each moving i/: Please refer to the component handling device described in item 1 of the patent scope, in which the respective transfer arms 'can be simultaneously placed close to the wide position, and the hauling trays are respectively assigned to them. Responsible area. The first component of the component handling device of the first aspect of the invention is the one of the guest carrier disk or the test carrier disk. (4) The 2 carrier disk is another test head of the guest carrier disk or the test carrier disk: contact: = handling device 'is used to place the tested electronic component and the test component, so that the first carrier disk is accommodated in the test = Electricity: transferred to the second carrier tray, the irrigation electronic device includes a plurality of carrier devices, and the main surface of the disk is independently moved parallel to the second carrier m wheel cutter, and is close to the same The second carrier, the electronic component to be tested is carried on the second carrier. The component handling device according to claim 7, wherein the device has the arm to be maintained, The transport of the 70-piece maintenance unit is movable, and the support device has support means for supporting the transport arm so that the plurality of transport arms are supported by the same support device. 4 Each of the transfer arms is independently movable on the support device. 9. The component transfer support device according to claim 8 supports the transfer arm to be movable in a specific direction, 33 2247-8847 -PF 200815774 The multiple carrying arms, Apl - are arranged side by side. The device and the device are moved along the specific side, as in the component handling device described in claim 7 of the patent scope, and the respective transfer arms are respectively disposed on the same carrier, and are respectively assigned to the two carriers. Responsible for::...the carrier or the component handling device described in the second=T7 item, which is the t-bearer of the known carrier disk or the test carrier disk. The heart 2 carrier disk is the other of the guest carrier disk or the test carrier disk. - The contact part of the electronic component test device and the test head is a #雷经饭W electronic device household electricity〗 〖Life contact to test the tested The electronic unit includes the loading unit, JL and the ancient face, the sundial 42' / ~, the test electronic component to be tested, your alpha carrier disk (four) job application (four) (four) the second - item Component handling device. 1 item 13 • An electronic component test device for testing the electronic component to be tested: the contact portion of the head is electrically contacted to test the electronic component to be tested, ... the unloading portion 'which has the test to be tested The component handling device described in any one of the patent application scopes of the test tray is transferred to the client carrier disk. 14. The electronic component test device end 匕3 detected in the thirteenth article of the patent application scope, wherein the device is inspected, and the component transfer device includes the first transfer arm and the second transfer arm. In the 4th passenger carrying tray, the 2247-8847-pf 200815774 first area which is the area responsible for the first transport arm is assigned to the second area n' of the third carrying responsible area and will serve as the second carrying arm. The domain is assigned to the second transport arm, and the detecting device checks the result of the detection, and when the controller ends, the component transporting device is controlled by the transport arm and the second transport arm. The electronic components are placed to make the waiter. "Two of the first area or the second area: the electronic money-sending device inspection described in item 14 of the patent application scope", the component handling device controls the carrier 1 and the second The transport arm is configured such that both the first arm and the second transporter I send the electronic component to be tested from the test carrier to one of the first region or the second region. 16 · If the application device is in the scope of patent application, when the detection device is at the end of the batch of the electronic component test device described in item 4, the component handling device controls the first carrier arm according to the detection result. And the second transfer arm, wherein the one of the first transfer arm and the second transfer arm sends the electronic component under test from the test carrier to one of the first region or the second region, and The second transfer arm 澎 # Ί , , , 1 1 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 搬运 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子 电子The buffer portion is disposed separately from the test carrier tray and the guest carrier tray for temporarily storing the tested electronic component. When the detecting device detects the end of the batch, the component handling device is based on the detection result. Controlling the 胄"like arm and the second transfer arm such that the second transfer arm transports the hard-to-test electronic component from the test carrier to 2247-8847-PF 35 200815774: buffer portion, 'the i-th transfer arm The one to be stored in the buffer One of the first region or the second region is transferred to the first region or the second region. The component carrier device is the end of the detection result of the electronic component test item referred to in item 14 According to the first transport arm and the =1 transport arm and the second transport arm, the sub-element is controlled to be electrically connected to the second region from at least one of the second region or the arm. Placed in the first area or 2247-8847-PF 36