KR20180034112A - Apparatus for testing sensor - Google Patents

Abstract

The present invention relates to a sensor inspection apparatus comprising: a tray transfer part moving a tray in a column (m) direction; a sensor pick-up transfer part sequentially picking up and moving a plurality of sensors arranged on the tray in a row (n) direction; an index having a plurality of sensor receiving holes in the radius direction and receiving the sensors picked up by the sensor pick-up transfer part in the sensor receiving holes in a line to rotate the sensors; a sensor inspection part inspecting whether the sensors received in the sensor receiving holes are defective; a defective product transfer part picking up a defective sensor in the sensor receiving holes and discharging the defective sensor to the outside when there is a defective product among the sensors inspected by the sensor inspection part; and a sensor packaging part packaging a sensor, a good product, of the sensors inspected by the sensor inspection part. According to the present invention, defective products and good products can be automatically divided according to quality states of the sensors. That is, when a sensor is of bad quality, the sensor can be discharged through a separation and discharge part, and when a sensor is of good quality, the sensor can be automatically packaged, thereby fundamentally blocking a defective product from being mixed among good sensors.

Description

Apparatus for testing sensor

The present invention relates to a sensor inspecting apparatus, and more particularly, to a sensor inspecting apparatus that can test a quality state of a sensor and automatically classify and store the sensor according to the quality state of the sensor.

Generally, a sensor detects information from the outside concerning a physical quantity, and outputs a signal by applying a signal. The sensor includes a temperature sensor, a pressure sensor, a flow sensor, a geomagnetic sensor, an optical sensor, an acceleration sensor, a gyro sensor, Sensors.

In particular, a geomagnetic sensor outputs a sensor signal in response to the magnetic flux density of the surrounding ground magnetic field, and is mainly used for position and direction detection in a navigation system of an electronic compass, an aircraft, and the like.

The acceleration sensor measures the dynamic force of an object such as acceleration, vibration, impact, and the like, and can detect the motion state of the object in detail. Therefore, the acceleration sensor can be applied to various transportation means such as an automobile, a train, a ship, Which is an essential sensor in a control system or the like.

In addition, the gyro sensor detects the angular velocity and can measure the angular velocity with respect to a rotating object, and is mainly used for various transportation means such as automobiles, trains, ships, airplanes, and the like.

In addition, fingerprint sensors are widely used for user recognition in smart terminals. Since fingerprints vary from person to person, in order to accurately sense a fingerprint of a user, the fingerprint sensor can be suitably performed without any defect in the sensitivity and quality of the fingerprint sensor.

The geomagnetic sensor, the acceleration sensor, the gyro sensor and the fingerprint sensor as described above are required to perform a performance test before being introduced into a product. At this time, the performance of the sensor can be confirmed by directly applying a physical quantity to the sensor and measuring the electrical output.

Since these sensors usually need to be checked individually one by one using a measuring device, it is cumbersome and takes a long time to measure, which leads to a decrease in efficiency, which leads to a decrease in production efficiency, and a defect is mixed with a good product, .

(Korea Unexamined Patent Publication No. 2008-0001557, sensor inspection device, June 04, 2008)

An object of the present invention is to provide a sensor inspection apparatus capable of automatically classifying a sensor according to defective and good products by confirming the quality state of the sensor housed in a tray formed with a plurality of rows (n) × rows (m).

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, a sensor inspection apparatus for inspecting a sensor accommodated in a tray formed with a plurality of rows (n) × rows (m) according to an embodiment of the present invention includes a tray A tray transfer unit for moving the tray; A sensor pickup transferring unit for sequentially gripping and moving a plurality of sensors arranged in the row (n) direction on a tray; An index which has a plurality of sensor accommodation holes in the radial direction and receives the sensor held by the sensor pickup in the sensor accommodation hole in a line and rotationally drives the sensor; A sensor inspecting unit for inspecting whether or not a plurality of sensors housed in the sensor accommodating holes are defective; A defective product transferring unit for inserting the defective product sensor in the sensor storage hole and discharging the defective product to the outside when the defective product is detected in the sensor inspecting unit; And a sensor packaging unit for packaging the sensor, which is good among the sensors inspected by the sensor inspection unit.

Here, the index is a rotation disk on which a plurality of sensor storage holes are formed and rotate; And a driving unit for driving the rotating disk. The sensor receiving hole may be provided with a sensor fixing hole on the upper surface thereof so that the sensor can be aligned in one direction along the radial direction on the rotating disk.

Here, the sensor inspecting unit may include a contact unit disposed in a downward direction of the sensor accommodating hole to move toward the sensor accommodating hole, contact the sensor disposed along the radial direction of the sensor fixing hole, and apply an electrical signal to determine whether the sensor is defective. And a contact portion for moving the contact portion from the lower side to the upper side to contact the sensor and moving from the upper side to the lower side toward the sensor fixing hole to prevent the upward movement of the sensor by contacting the upper side of the sensor.

Here, the sensor pickup transfer part includes a vertical support part; A guide disposed in a direction crossing the upper end of the vertical support portion and having a rail along a crossing direction; A moving part moving in a horizontal direction along the rail; And a supply pickup unit which is coupled to the moving unit and moves in the vertical direction and which picks up a plurality of sensors housed in the tray transfer unit in accordance with the movement of the moving unit and seats a plurality of the gripped sensors in the sensor storage holes.

The sensor inspection unit may further include a good product transfer unit having a good product discharge guide for sequentially moving the good sensor in order to package the good sensor in the sensor inspected by the sensor inspecting unit. The sensor packing unit is disposed in a direction crossing the good product discharge guide And a package conveyance unit for successively arranging the sensors sequentially conveyed in the good conveyance unit along one direction.

The sensor inspection apparatus according to the present invention can automatically separate the sensor into defective and good products according to the quality state of the sensor. That is, if the quality of the sensor is defective, the sensor can be discharged through the separating and discharging unit. In the case of good products, the defective products can be blocked from being mixed by automatically wrapping.

1 is a plan view of a sensor inspection apparatus according to an embodiment of the present invention.
Fig. 2 is a view in the "A" direction in Fig.
3 is a side view of a tray transfer unit of a sensor inspection apparatus according to an embodiment of the present invention.
4 is a side view of the sensor pickup transfer of the sensor inspection apparatus according to the embodiment of the present invention.
5 is a side view of an index and a sensor inspection unit of a sensor inspection apparatus according to an embodiment of the present invention.
6 is a plan view of a defective product transferring unit of a sensor inspection apparatus according to an embodiment of the present invention.
7 is a plan view of a genuine transfer part and a sensor packing part of a sensor inspection apparatus according to an embodiment of the present invention.
8 is a front view of a sensor packaging unit of a sensor testing apparatus according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that, in the drawings, the same components are denoted by the same reference symbols as possible. Further, the detailed description of known functions and configurations that may obscure the gist of the present invention will be omitted. For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated.

Also, throughout the specification, when an element is referred to as "including" an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise. Also, throughout the specification, the term " on " means located above or below a target portion, and does not necessarily mean that the target portion is located on the upper side with respect to the gravitational direction.

A sensor inspecting apparatus according to an embodiment of the present invention is an apparatus for inspecting a sensor housed in a tray formed with a plurality of rows (n) and rows (m), wherein grooves formed in the tray are formed in a matrix shape . In the present invention, row (n) means the x-axis direction and column (m) means the y-axis direction.

FIG. 1 is a plan view of a sensor inspection apparatus according to an embodiment of the present invention, and FIG. 2 is a view in the "A" direction in FIG.

The sensor inspection apparatus 10 according to an embodiment of the present invention includes a tray transfer unit 100, a sensor pickup transfer unit 200, an index 300, a sensor inspection unit 400, A defective product transferring unit 500 and a sensor packing unit 700. The tray transfer unit 100, the sensor pickup transfer unit 200, the index 300, the sensor inspection unit 400, the defective product transfer unit 500, the good product transfer unit 600, and the sensor package unit 700 are mounted on the flat support plate 800 And the details of the support plate 800 will be omitted below.

The tray transfer unit 100 serves to move the tray t along the row (n) direction. At this time, the tray transfer unit 100 moves the tray t having a plurality of rows (n) by rows (m) along the longitudinal direction (column direction) of the tray (t) And moves the deployed sensor. In the present invention, the row (n) of the tray (t) is formed by 10 rows and the row (m) is formed by 4 rows. It is not.

The sensor pickup transfer unit 200 sequentially grips and moves a plurality of sensors arranged in the row (n) direction on the tray (t). In the present embodiment, the sensor pickup transfer unit 200 has been described as an example in which four sensors are transferred at one time. However, it is also possible to use a plurality of sensors arranged in the row (n) .

The index 300 has a plurality of sensor accommodation holes 311 in the radial direction and rotates the sensor holding the sensor held by the sensor unit 200 in the sensor accommodation hole 311 in a row.

The sensor inspecting unit 400 inspects whether or not a plurality of sensors housed in the sensor accommodating hole 311 are defective.

The defective product transferring unit 500 serves to grasp the defective product sensor in the sensor storage hole 311 and discharge the defective product to the outside when there is a defective product among the sensors inspected by the sensor inspection unit 400. [

The sensor packaging unit 700 serves to package a good sensor among the sensors inspected by the sensor inspection unit 400.

Hereinafter, the tray transfer unit 100, the sensor pickup transfer unit 200, the index 300, the sensor inspection unit 400, the defective product transfer unit 500, and the sensor packaging unit 700 will be described in more detail.

3 is a side view of a tray transfer part of a sensor inspection apparatus according to an embodiment of the present invention.

The tray transfer unit 100 includes a conveyor 110 and a camera 120. The conveyor 110 is disposed on the upper surface of the support plate 800 and serves to move the tray t along one direction a. The conveyor 110 is provided with a column 111 so as to be spaced upward from the support plate 800 , And a driving motor (not shown).

At this time, the camera 120 is disposed on the upper side of the conveyor 110 to photograph whether the sensor is normally stored in the tray t moving in one direction. If the camera 120 shoots the tray t and confirms that the sensor is not stored, the supply pickup unit 240 of the sensor pickup-up transfer unit 200, which will be described later, It may not work so as not to feed it. Therefore, the transport efficiency of the sensor pickup transport unit 200 can be increased. The camera 120 may be supported on the camera support 121 and spaced upwards from the conveyor 110.

4 is a side view of a sensor pickup of a sensor inspection apparatus according to an embodiment of the present invention.

The sensor pickup transport unit 200 includes a vertical support unit 210, a guide unit 220, a moving unit 230, a supply pickup unit 240, and an alignment unit 250.

The vertical support portion 210 is fixed to the upper surface of the support plate 800 and extends upward. The guide portion 220 is coupled to the vertical supporting portion 210 in a direction intersecting the end of the vertical supporting portion 210 and has a rail 221 along an intersecting direction of the vertical supporting portion 210. The moving part 230 slides along the rail 221 of the guide part 220. Accordingly, the moving unit 230 moves the sensor to the index 300 in a state in which the sensor located in the tray transfer unit 100 is picked up by the supply pickup unit 240 described later.

The supply pick-up unit 240 is coupled to the moving unit 230 and moves up and down to pick up a plurality of sensors housed in the tray transfer unit 100, It plays a role. At this time, the supply pick-up unit 240 picks up the sensor through the air suction at the end, thereby preventing foreign matter from attaching at the time of picking up the sensor. When the supply pickup unit 240 is positioned above the tray transfer unit 100 by the movement of the moving unit 230, the supply pickup unit 240 moves downward to pick up the sensor. When the moving part 230 is positioned on the upper side of the sensor storage hole 311 along the rail 221 in the state where the pick-up is completed, the supply pickup part 240 moves the sensor held in the downward direction to the sensor storage hole 311).

At this time, the aligning part 250 may be disposed on one side of the sensor accommodating hole 311 in the moving direction of the moving part 230. The alignment unit 250 is formed with grooves corresponding to the number and shape of the sensors so that the sensors can be aligned. Therefore, the aligning unit 250 can align the sensor picked up by the air pick-up unit 240 with the air pick-up unit 240 so that there is no left and right clearance before inserting the sensor into the accommodation hole 311 and securely accommodate the sensor in the sensor fixing hole 312. The sensor gripped by the air supply pick-up unit 240 at the supply pick-up unit 240 may be in an irregular grip state at the end of the supply pickup unit 240. When the sensor is directly received in the sensor storage hole 311 It can be irregularly aligned while the left and right clearances are generated in the sensor accommodation hole 311. That is, the aligning unit 250 can align the sensor with the left and right clearances before the sensor is received in the sensor receiving hole 311 and securely receive the sensor in the fixing hole 312, thereby improving the inspection result of the sensor during the sensor inspection .

5 is a side view of an index and a sensor inspection unit of a sensor inspection apparatus according to an embodiment of the present invention.

The index 300 includes a rotating disk 310 and a driving unit 320.

The rotary disk 310 has sensor storage holes 311 formed at intervals of 45 degrees toward the radial direction and a hole 315 formed between the sensor storage holes 311. The perforation 315 can increase the rotation efficiency of the rotating disk 310 by reducing the weight of the rotating disk 310.

The sensor accommodation hole 311 may include a sensor fixing hole 312 for aligning the sensor picked up by the supply pickup part 240 in one direction along the radial direction. The sensor fixing holes 312 are formed adjacent to each other along the radial direction so that the sensors can be independently arranged.

One end of the driving unit 320 is fixed to the upper surface of the supporting plate 800 and the other end of the driving unit 320 is coupled to the rotating disc 310 by rotating the rotating disc 310 clockwise or counterclockwise, And moves the sensor housed in the hole 312 to the sensor inspection unit 400, the defective product transfer unit 500, or the good product transfer unit 600.

The sensor inspecting unit 400 generates a predetermined time difference after placing the sensor in the sensor fixing hole 312 in the sensor pickup transfer unit 200 by arranging the sensor pickup up to 90 degrees with respect to the transmitting unit 200, And includes a support column 410, a contact portion 420, and a tight contact portion 430. [

The support pillars 410 are fixed to the upper surface of the support plate 800 and extend upward. The contact portion 430 and the contact portion 420 are sequentially disposed from the upper end of the support column 410 and the rotation disc 310 is disposed in a space formed between the contact portion 430 and the contact portion 420.

The contact portion 420 is disposed below the sensor accommodation hole 311 and moves toward the sensor accommodation hole 311 to contact the sensor disposed in the sensor fixing hole 312 along the radial direction to apply an electrical signal The contact pin 421 and the contact lift 422 are provided to determine whether the sensor is defective or not. The contact part 420 contacting with the sensor can simultaneously inspect the plurality of sensors arranged along one direction to increase the inspection efficiency.

The contact pins 421 are electrically connected to the sensors disposed in the sensor fixing holes 312, respectively. The contact pins 421 are formed of gold and formed of a plurality of pins and are provided in the same manner as the sensors disposed in the sensor fixing holes 312. As described above, since the contact pin 421 is formed of a plurality of pins, it is possible to further facilitate the measurement of the fingerprint sensor having a high sensitivity as a whole.

That is, the plurality of pins provided on the contact pins 421 form a plurality of point contacts on the sensor, and the electrical signal characteristics generated through the contact pins 421 are analyzed, . If the contact pin is formed as a surface, the contact pin is made to be a surface contact with the sensor, so that it can not induce a uniform contact as a whole, and it is impossible to effectively check whether the fingerprint sensor has a high sensitivity . The contact elevating portion 422 serves to lift the contact pin 421 so that the sensor and the contact pin 421 can be brought into close contact with each other.

The contact portion 430 moves from the upper side to the lower side toward the sensor fixing hole 312 when the contact portion 420 moves from the lower side to the upper side and comes into contact with the sensor and comes into contact with the upper side of the sensor, A cylinder 431 can be provided. That is, when the contact pin 421 moves upward in order to make contact with the lower surface of the sensor, the tight contact part 430 moves down the tight contact part 430 through the cylinder 421 and is brought into close contact with the upper surface of the sensor The upward movement of the sensor is prevented so that the contact between the contact pin 421 and the sensor is induced to be uniform so that it is possible to more precisely measure whether or not the sensor is defective.

6 is a plan view of a defective product transferring unit of a sensor inspection apparatus according to an embodiment of the present invention.

When the quality of the sensor detected by the sensor inspecting unit 400 is less than the set range, the defective product transferring unit 500 regards the sensor as a defective sensor and discharges it to the outside to prevent mixing with the good product A support pillar 510, a defective article discharge guide 520, and a defective article pickup section 530.

The support pillars 510 are fixed to the upper surface of the support plate 800 and extend upward. The defect discharge guide 520 is formed with a rail and is coupled to the end of the supporting column 510. The defective product pickup portion 530 includes one air adsorbing portion and is fixed to the discharge guide 520 to move along the rail. At this time, since the air adsorption unit is provided as one unit, the probability that at least two defective sensors are arranged among the sensors arranged in one direction is relatively low compared to the probability that three or more good products are arranged. Therefore, by providing one air adsorption unit for discharging defective products, the defective product sensor can be efficiently discharged to the outside.

FIG. 7 is a plan view of a genuine transfer unit and a sensor packing unit of a sensor testing apparatus according to an embodiment of the present invention, and FIG. 8 is a front view of a sensor packing unit of a sensor testing apparatus according to an embodiment of the present invention.

7 and 8, the good product transfer unit 600 of the sensor inspection apparatus according to the embodiment of the present invention transfers the good sensor from the sensor inspected by the sensor inspection unit 400 to the sensor packaging unit 700 And includes a support post 610, a good output guide 620, and a good product pick-up unit 630. [

The support pillars 610 are fixed to the upper surface of the base plate 800 and extend upward. The good discharge guide 620 is formed with a rail and is coupled to the end of the supporting column 610. The good-quality pick-up unit 630 may have the same number of air adsorbing units as the supply pick-up unit 240.

It is preferable that the sensor has the same number of air adsorption units as the supply pickup unit 240 because the probability of a good sensor is relatively higher than the probability of a bad sensor. At this time, the sensor adsorbed through the good-quality pick-up unit 630 is sequentially placed on the sensor packaging unit 700 (which will be described later in detail). That is, the good-quality pick-up unit 630 does not secure the air-adsorbed sensor to the package conveyance unit 720 at the same time, but sequentially moves the sensor along the sensor packing unit 700 arranged in the direction crossing the good- So that the sensors can be packed in a row.

The sensor packaging unit 700 includes a carrier tape supply unit 710, a package transfer unit 720, a cover tape supply unit 730, a missing check unit 730, (740) and a winding unit (750).

The carrier tape supply unit 710 is disposed at a lower portion of the support unit 800 and includes a connection hole Ta connected to the sprocket 722 and a groove Tb for receiving the sensor, And has a housing case 711 for housing therein. The carrier tape supply part 710 serves to supply the carrier tape T 1 to the package conveying part 720 in accordance with the rotation of the sprocket 722. At this time, a hole (not shown) is formed in the support part 800 so that the carrier tape CT1 can be supplied to the package conveying part 720.

The package conveying unit 720 includes a conveying guide 721 arranged in a direction crossing the good output guide 620 and a pair of sprockets 722 at both ends of the conveying guide 721, And the supplied sensors are sequentially arranged in the grooves Tb of the carrier tape T1. The connection hole Ta of the first carrier tape CT is connected to the sprocket 722 to move the carrier tape T1 along the conveying guide 721 in one direction in accordance with the rotation of the sprocket 722. [ A projection 721a is formed on one side of the transfer guide 721. [ The protrusion 721a may be connected to the connection hole Ta of the carrier tape CT1 moving along one direction to guide the carrier tape CT1 so as not to move along one direction.

On the other hand, the cover tape supply unit 730 supplies the cover tape T2 from the rear end of the conveyance guide 721. [ Here, the cover tape T2 may be formed in the same shape as the carrier tape CT1.

The heat-sealed portion 723 is disposed at the rear end of the conveying guide 721 and serves to seal and pack the sensor by coupling both side surfaces of the carrier tape T1 and the cover tape T2 which are adjacent to each other by thermal fusion.

At this time, the missing check unit 740 may be disposed on the upper side of the rear end of the conveyance guide 721. The missing check unit 740 may be provided as a DSLR camera and is disposed on the upper side of the conveyance guide 721 just before the carrier tape T1 and the cover tape T2 meet to form the groove Tb of the carrier tape T1 ), It can be photographed whether or not the sensor is accommodated or missing, and whether foreign substances are attached to the sensor.

If the sensor is missing or the foreign substance is attached to the sensor through the missing confirmation unit 740, the alarm is temporarily activated and the operation is temporarily stopped. At this time, the operator can place the good sensor at the missing position, remove the foreign matter, and press the operation button (not shown) so that the sensor package is operated again. Therefore, the sensor is disposed on the continuously supplied carrier tape (T1), thereby preventing the carrier tape (T1) from missing the sensor. At this time, the total number of packed sensors can be grasped by calculating the moving distance of the carrier tape (T1) by grasping the motor rotation number of the tape supply part or the sprocket (722) supplying the carrier tape (T1) .

On the other hand, the take-up part 750 serves to wrap the carrier tape T1 and the second carrier tape to complete the packaging, and may be disposed at the rear end of the cover tape supply part 730.

As described above, the sensor inspection apparatus according to the embodiment of the present invention can automatically separate the sensor into defective and good products according to the quality state of the sensor. In addition, it is possible to prevent impurities from entering when packaging the good sensor, and to prevent the good quality sensor from being damaged during transportation.

It should be noted that the embodiments of the present invention disclosed in the present specification and drawings are only illustrative of the present invention in order to facilitate description of the present invention and to facilitate understanding of the present invention and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

100: tray feeder 110: conveyor
120: camera 200: sensor pickup is sent
210: vertical support 220:
230: moving part 240: supply pickup part
300: index 310: rotating disc
320: driving unit 400: sensor inspection unit
410: Support column 420:
430: tight contact part 500: defective part transfer part
510: Support column 520: Discharge guide
600: Good-quality conveying part 610: Supporting column
620: Good article discharge guide 630: Good article pickup part
700: Sensor packing part 710: Carrier tape supply part
720: Packet transfer section 730: Cover tape supply section
740: Missing confirmation part 750: Winding part
800: Support plate

Claims (5)

A sensor inspection apparatus for inspecting a sensor accommodated in a tray formed with grooves in a plurality of rows (n) x (m), comprising:
A tray transfer unit for moving the tray along a direction of heat m;
A sensor pickup transferring unit for sequentially holding and transferring a plurality of sensors arranged in the row (n) direction on the tray;
An index that has a plurality of sensor accommodation holes in the radial direction and receives the sensor held by the sensor pickup in the sensor accommodation hole in a line and rotationally drives the sensor;
A sensor inspecting unit for inspecting whether or not a plurality of sensors housed in the sensor accommodating holes are defective;
A defective product transferring unit for inserting the defective product sensor in the sensor storage hole and discharging the defective product to the outside when defective products are detected from the sensors inspected by the sensor inspecting unit; And
And a sensor packaging unit for packaging a good sensor out of the sensors inspected by the sensor inspecting unit. The method according to claim 1,
The index,
A rotation disk on which the plurality of sensor storage holes are formed and rotate; And
And a driving unit for driving the rotating disk,
The sensor accommodation hole
And a sensor fixing hole is disposed on an upper surface of the rotation disc so that the sensor can be aligned in one direction along the radial direction of the rotation disc. 3. The method of claim 2,
A contact portion disposed in a lower direction of the sensor accommodation hole and moving toward the sensor accommodation hole to contact the sensor disposed along the radial direction of the sensor fixing hole to determine whether the sensor is defective by applying an electrical signal; And
And a contact part which moves from the lower side to the upper side toward the sensor fixing hole when the contact part moves from the lower side to the upper side and contacts the sensor and prevents the upward movement of the sensor by contacting the upper side of the sensor, And the sensor inspection apparatus. The method according to claim 1,
The sensor pickup transferring unit includes:
A vertical support;
A guide disposed in a direction intersecting with an upper end of the vertical support portion and having a rail along an intersecting direction;
A moving unit moving in a horizontal direction along the rail; And
And a supply pick-up unit that is coupled to the moving unit and moves up and down, and grips and picks up a plurality of sensors housed in the tray transfer unit in accordance with the movement of the moving unit, and seats the plurality of sensors in the sensor storage holes And the sensor inspection apparatus. The method according to claim 1,
Further comprising a good product delivery unit including a good product discharge guide for sequentially moving the good sensor in order to package the good sensor in the sensor inspected by the sensor inspecting unit,
The sensor packaging unit includes:
And a package transferring unit arranged in a direction crossing the good product discharge guide and continuously arranging the sensors sequentially transferred in the good product transfer unit along one direction.

Images