CN110620059B - LED module inspection and packaging system - Google Patents
LED module inspection and packaging system Download PDFInfo
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- CN110620059B CN110620059B CN201810767114.7A CN201810767114A CN110620059B CN 110620059 B CN110620059 B CN 110620059B CN 201810767114 A CN201810767114 A CN 201810767114A CN 110620059 B CN110620059 B CN 110620059B
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- 238000007689 inspection Methods 0.000 title claims abstract description 75
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 48
- 238000007599 discharging Methods 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 230000033001 locomotion Effects 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 230000004438 eyesight Effects 0.000 claims description 32
- 239000000523 sample Substances 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 26
- 238000004804 winding Methods 0.000 claims description 19
- 238000003860 storage Methods 0.000 claims description 12
- 230000003287 optical effect Effects 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 6
- 230000000007 visual effect Effects 0.000 claims description 5
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims description 3
- 238000011179 visual inspection Methods 0.000 claims description 3
- 230000002950 deficient Effects 0.000 claims description 2
- 239000002390 adhesive tape Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The invention relates to an LED module inspection and packaging system, comprising: a package supply unit for arranging the LED modules in a row; a disc table part which is used for checking the plurality of LED modules supplied from the packaging supply part by rotating the rotary table, classifying the LED modules according to the characteristics, and discharging the LED modules which do not meet the set reference value to the outside; a tape supply unit for supplying a carrier tape for packaging the LED module; a packaging tape wrapping portion that seals the LED module with the carrier tape; a packaging and conveying part for conveying the LED module passing through the disc workbench to the packaging adhesive tape wrapping part; and a tape discharging part cutting and discharging the conveyor tape sealed with the LED module; the disc table part includes a module separating part having a stopper; the module separating unit further includes a plurality of discharge holes for discharging the plurality of LED modules to the outside when the plurality of LED modules are mixed, and a plurality of movement guide mechanisms disposed above the discharge holes and selectively opening and closing the discharge holes.
Description
Technical Field
The present invention relates to a system for inspecting and packaging LED modules, and more particularly, to a system for inspecting and packaging LED modules, which classifies LED modules according to predetermined characteristics and then packages the classified LED modules in a state of being sealed by a conveyor tape.
Background
Unexpected defects may occur when manufacturing a chip package such as an LED module, and fine particles or defects may have a serious influence on the quality of an integrated circuit in an environment where circuit density is increased.
Therefore, in order to grasp and improve such a problem, a product is manufactured while a defect is inspected by various measuring devices, whereby productivity and reliability of the product can be improved.
A description related to the above-mentioned technology is recorded in korean laid-open patent publication No. 10-2011-0065759, which includes a chip separating unit that separates a chip package supplied in large quantities into individual chips, and a chip inspecting unit that measures and inspects data of the chip package. This makes it possible for the inspection and sorting apparatus for chip packages to solve the technical problem of inspecting and sorting chip packages.
However, when a large amount of the chip packages are loaded into the chip inspection unit, a disturbance phenomenon may occur, which may deteriorate the efficiency of the entire process.
In addition, there arises a problem that a system for packaging a final product passing through a plurality of inspection processes needs to be separately provided.
Further, a phenomenon occurs in which a plurality of LED modules, which are randomly put in, are mixed with each other and get stuck in the system.
Documents of the prior art
Patent document 1
(patent document 1) korean patent laid-open publication: no. 10-2011-0065759 inspection and classification apparatus for chip packages "
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to prevent various obstruction phenomena that may occur when performing various inspections and tape wrapping operations.
Further, the object is to improve durability against a plurality of components constituting the entire system.
Further, it is an object to develop a system for easily inserting an LED module into a carrier tape for performing packaging.
Means for solving the problems
The LED module inspection and packaging system of the present invention comprises: a package supply unit for arranging the LED modules in a row; a disk table part which is used for checking the plurality of LED modules supplied from the packaging supply part by rotating the rotary table, classifying the LED modules according to the characteristics, discharging the LED modules which do not meet the set reference value to the outside, and forming a plurality of accommodating parts outside the rotary table; a tape supply unit for supplying a carrier tape for packaging the LED module; a packaging tape wrapping part for sealing the LED module with the conveying tape; a package carrying part for carrying the LED module passing through the disc worktable to the package adhesive tape wrapping part; and a tape discharging part cutting and discharging the conveyor tape sealed with the LED module; the disc table part includes a module separating part including a stopper for individually and sequentially putting the plurality of LED modules; the module separating unit further includes a plurality of first discharge holes for discharging the plurality of LED modules supplied from the package supplying unit to the outside when the plurality of LED modules are mixed, and a plurality of movement guide mechanisms disposed above the first discharge holes and selectively opening and closing the first discharge holes.
The module separating unit includes a plurality of sensors for detecting the LED module, the plurality of sensors further includes a front sensor unit and a rear sensor unit, the front sensor unit is formed in front of the stopper and the rear sensor unit is formed behind the stopper with respect to a direction in which the LED module is supplied, and the plurality of sensors are interlocked with the stopper such that the stopper selectively opens and closes a traveling path of the LED module.
The rear sensing unit includes a storage detection sensor that detects an LED module stored in the disc table, and a travel detection sensor that detects whether the LED module travels along a predetermined path.
In addition, the package supplying part further includes: a stocker into which a plurality of LED modules are put; a cylindrical rotating container for accommodating the plurality of LED modules supplied from the stocker; and a supply rail connected to the rotary container to convey the plurality of LED modules; the rotating container rotates about a central axis, and a centrifugal force is applied to the plurality of LED modules toward an inner wall of the rotating container to transfer the plurality of LED modules to the supply rail.
In addition, the system of the present invention may further include a vision camera for photographing an appearance of the LED module at a point where the rotating container and the supply rail are in contact with each other.
In addition, the disc table part further includes: a plurality of visual inspection units for inspecting the appearance of the lower surface or the upper surface of each LED module accommodated in the accommodation unit; a plurality of probe inspection parts for measuring data by the probes contacting with the lower surface of the module; a light inspection unit that performs light inspection of the LED module; and a classification discharge unit configured to discharge the data measured by the plurality of vision inspection units, the plurality of probe inspection units, and the light inspection unit to the outside in a classified manner for each characteristic.
In addition, the classification discharge unit further includes a compressed air injection device connected to the receiving unit and injecting compressed air from a lower portion of the rotary disk, and a classification discharge control unit electrically connected to the compressed air injection device and controlling selective operation; the sorting and discharging control unit receives signals from the vision inspection unit, the probe inspection unit, and the light inspection unit.
In addition, the package carrier further includes: a plurality of rotary pickers that attract the LED modules from the disc table section; a carrying part vision camera for performing appearance inspection on the adsorbed LED module; and a second discharge hole for discharging the defective product to the outside; the rotary picker is disposed at the disc table part to be opposite to a position where the LED module is received.
In addition, the rotary pickup is configured in a plurality of numbers by taking a rotating shaft as a center; the conveyance unit vision camera and the second discharge hole are disposed so as to face a path along which the rotary pickup moves by the rotation of the rotary shaft.
In addition, the package carrying part further comprises a module arrangement part for arranging the LED modules adsorbed by the rotary pickup; the module arrangement part makes the corner of the slot formed by the plurality of blocks and the corner of the LED module adsorbed by the rotary pickup coincide.
The package tape wrapping portion further includes a tape supply rail to which the carrier tape is supplied from the tape supply portion and arranged, and a sealing portion provided to face the tape supply rail and seal the LED module accommodated in the carrier tape; the sealing portion applies heat and pressure to the transfer tape to seal.
The sealing tape wrapping portion may further include a pressure control portion that adjusts a pressure applied to the carrier tape in conjunction with the sealing portion, thereby preventing an excessive pressure from being applied to the carrier tape.
The packaging tape wrapping portion is provided with a first visual camera and a second visual camera respectively in front of and behind the sealing portion, at a position opposite to the tape supply rail; the first vision camera shoots whether the LED module is stored or not and the state, and the second vision camera shoots the sealing state of the conveying adhesive tape.
In addition, the adhesive tape discharging part also comprises a winding part which provides power for winding and conveying the adhesive tape; the winding part includes a plurality of separation preventing plates having a pitch greater than or equal to a width value of the carrier tape.
Further, the tape discharging unit includes a cutter unit for cutting the carrier tape wound around the winding unit; the load capacity of the conveying adhesive tape wound by the winding part does not exceed the plurality of anti-drop plates.
The invention has the following beneficial effects:
according to the present invention, it is possible to prevent a disturbance phenomenon that may occur when an LED module is put into a disk table section.
In addition, it is possible to minimize the wear of the front end of the probe for measuring the LED module thrown into the disc table part and to improve the durability of the parts.
Further, inspection, sorting, and packaging of the LED modules can be realized in a single system, and the efficiency of the entire process can be maximized.
Drawings
Fig. 1 is an illustrative view showing an LED module inspection and packaging system according to the present invention.
Fig. 2 is an exemplary view showing a package supply part according to the present invention.
Fig. 3 is an explanatory view showing a disc table portion according to the present invention.
Fig. 4 is a sectional view showing a module separating part according to the present invention.
Fig. 5 is an explanatory view showing a movement guide mechanism of the module separating section according to the present invention.
Fig. 6 is an explanatory view showing a probe inspection part according to the present invention.
Fig. 7 is an exemplary view showing a package carrier according to the present invention.
Fig. 8 is an exemplary view showing a tape supplying part according to the present invention.
Fig. 9 is an explanatory view showing a wrapping portion of a sealing tape according to the present invention.
Fig. 10 is an exemplary view showing a tape discharging part according to the present invention.
Wherein the reference numerals are as follows:
100: package supply unit, 110: stocker, 120: rotation container, 130: supply rail, 140: feed vision camera, 200: disc table portion, 201: storage section, 210: module separation portion, 211: brake, 212: discharge hole, 213: movement guide mechanism, 214: front sensor, 215: rear sensor portion, 220: visual inspection unit, 230: probe inspection unit, 231: probe, 232: up-down driving unit, 233: probe guide mechanism, 240: light inspection unit, 250: classification discharge unit, 300: tape supply unit, 310: tape reel, 320: reel loading mechanism, 330: reel check sensor, 400: packaging tape wrap, 410: tape supply track, 420: sealing portion, 430: pressure control unit, 440: first tape wrap vision camera, 450: second tape wrap visual camera, 500: package conveyance unit, 510: rotary pickup, 511: rotation axis, 520: conveyance part vision camera, 530: discharge hole, 540: module arrangement portion, 541: alignment block, 542: elastomer, 600: tape discharge portion, 610: winding unit, 611: anticreep board, 620: cutting part
Detailed Description
The terms or words used in the specification and claims should not be construed as limited to general or dictionary meanings, but interpreted as meanings and concepts conforming to the technical idea of the present invention on the basis of the principle that the inventor can appropriately define the concept of the terms in order to explain his invention in the most preferable way.
Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely the most preferable embodiments of the present invention and do not represent the entire technical idea of the present invention, and therefore it should be understood that various equivalents and modifications may exist at the time of filing this application.
In the following, before the description with reference to the drawings, in order to highlight the gist of the present invention, it is clear that a known configuration which is obvious to a person skilled in the art and does not show unnecessary matters or does not describe them in detail is added.
Fig. 1 is an illustrative view showing an LED module inspection and packaging system according to the present invention. As shown in fig. 1, the present invention may include: a package supply unit 100 for supplying a plurality of LED modules to be inspected and packaged; a disc table part 200 measuring and classifying characteristics of the LED modules; a tape supply unit 300 for supplying a carrier tape for packaging the LED module; a packaging tape wrapping part 400 for packaging the LED module on the conveying tape; a package carrying part 500 for carrying the LED module by a carrying tape; and a tape discharging unit 600 for individually mass-producing packaged final products. This is a system in which LED modules are respectively put into a conveyor tape having a separate storage space and then sealed, and is a system in which only good-quality modules verified by a plurality of inspection processes before the conveyor tape is put into the LED modules are sealed for mass production.
The package supplying unit 100 is configured to load a plurality of LED modules into the system according to the present invention, and is configured to perform inspection after arranging a plurality of LED modules loaded in an unaligned state in a row, for the purpose of transportation.
For this reason, a rotational force may be applied to the individual receiving bodies performing the plurality of LED modules, and the respective LED modules may be separated from each other on the basis of separation by a centrifugal force.
The disc table 200 is a structure for packing only products, which are supplied from the package supply unit 100 and designated through a plurality of measurement and inspection processes for each characteristic, and is used for transportation.
In order to inspect each LED module, a plurality of kinds of inspections are performed in a state where the LED modules received from the package supplying part 100 are sequentially stored in separate storage parts one by one.
The tape supplying part 300 is a structure for storing a carrier tape wrapping the LED modules and placing the LED modules passing through the disk table part 200 after inspection, and is intended to supply the carrier tape.
The purpose of the packaging tape wrapping portion 400 is to wrap and seal the LED module subjected to the inspection process with a shipping tape, and in this case, sealing may be performed in various ways, but in the present embodiment, a way of applying heat and pressure to seal the LED module within the shipping tape is shown. However, the sealing method is not limited thereto.
The purpose of the package conveying unit 500 is to move only the LED modules that have passed through the disk table 200 to the storage unit of the conveyor tape conveyed by the tape supply unit 300.
Therefore, a structure in which the LED modules are arranged so as to be easily inserted into the housing portion may be included, and a detailed description thereof will be described later with reference to fig. 7.
The tape discharging part 600 is a structure in which the carrier tape, in which the LED module is sealed inside, is carried, and in the present embodiment, a manner in which the carrier tape is wound by a rotational force applied through a separate winding part formed with a motor is adopted.
Fig. 2 is an explanatory view showing the package supplying part 100 according to the present invention. As shown in fig. 2, the package feeder 100 feeds a plurality of LED modules through a stocker 110. At this time, the LED modules are put into the stocker 110 in an unaligned state, and a separate alignment process is required to put them into the disc table part 200, which performs inspection individually. To separate the plurality of LED modules from each other, the end of the storage container 110 is disposed toward the rotary container 120 that rotates around the central axis. Thereby, the plurality of LED modules put in through the stocker 110 are put in the rotary container 120.
The rotating container 120 is configured to rotate on the basis of a central axis, and thus the plurality of LED modules may be pushed against the inner wall of the rotating container 120 by centrifugal force and separated individually. The rotating container 120 may have various shapes, but it is preferably formed in a cylindrical shape as shown in fig. 2 in order to prevent the plurality of LED modules, which need to be separated individually by centrifugal force, from being separated in a specific section.
A supply rail 130 is coupled to the rotary accommodating body 120, and the supply rail 130 is used to convey the LED module to the disk table 200. The LED modules put into the supply rail 130 may be individually arranged in a row and put into the supply rail by the centrifugal force of the rotating container 120. In this case, the supply part vision camera 140 may be disposed at a point where the rotary housing 120 and the supply rail 130 are in contact with each other, so that the LED module put into the supply rail 130 can be observed. This structure facilitates the manager to cope with in various ways when detecting a plurality of LED modules that are put in an unaligned state.
Fig. 3 is an exemplary view illustrating the disc table part 200 according to the present invention. As shown in fig. 3, the disc table part 200 includes: a module separating unit 210 for inputting the LED modules sequentially inputted into the housing unit 201; a vision inspection part 220 for inspecting the appearance of the received LED module; a probe inspection unit 230 for measuring electrical data; an optical inspection unit 240 for performing optical inspection; and a sorting discharge part 250 for selectively discharging the LED modules to the outside according to the characteristics.
The vision inspection unit 220 may be configured with a plurality of vision cameras to inspect the upper and lower surfaces of the LED modules received in the receiving unit 201, respectively, to obtain high reliability data. For the same purpose, the probe inspection unit 230 may be composed of a plurality of detection needles.
The optical inspection unit 240 is in contact with the LED module to perform an optical test, and can measure an electrical characteristic value measured after the module is discharged. In this case, the optical test method performed by the optical inspection unit 240 is not limited to the above, but in the present embodiment, as shown in fig. 3, an integrating sphere optical test method may be employed. The above-described integrating sphere light test method can be employed because the LED module is housed in the housing portion 201 of the disk table 200 and the upper surface of the module is exposed. The light emitted from the light source is captured by integrating-sphere light measurements, which can be uniformly distributed internally by repetitive lambertian reflections.
The sorting and discharging unit 250 discharges the LED modules, which have been measured by the vision inspection unit 220, the probe inspection unit 230, and the light inspection unit 240, with various data to the outside according to characteristic values, and in the embodiment shown in fig. 3, the LED modules are sorted by 8 types of characteristics in total and discharged to the respective storage units.
Fig. 4 is a sectional view illustrating the module separating part 210 according to the present invention. As shown in fig. 4, a separate stopper 211 is disposed on a path through which the LED module passes. The stopper 211 selectively performs ascending and descending motions according to whether or not the LED modules are inserted into the module separating unit 210, and individually discharges the LED modules sequentially inserted into the receiving unit 201.
The vertical movement of the stopper 211 is determined based on signals detected by a plurality of sensors, and the vertical movement of the stopper 211 can be realized by a front sensor 214 and a rear sensor 215, wherein the front sensor 214 is disposed in front of the stopper 211 in a direction in which the LED module is inserted into the housing 201 with reference to the stopper 211, and the rear sensor 215 is disposed behind the stopper 211.
The front sensor unit 214 is a sensor that detects a material disposed at the front end of the stopper 211, and when an electrical activation signal is received from the front sensor unit 214, the stopper 211 performs an upward movement to cut off the supply path of the LED module.
The rear sensor portion 215 may include a sensor for detecting a material between the storage portion 201 and the supply path and a sensor for detecting a material in the storage portion 201, and the ascending and descending movement of the stopper 211 may be performed in response to the detected signal.
Fig. 5 is an exemplary view illustrating the movement guide mechanism 213 of the module separating part 210 according to the present invention. As shown in fig. 5, when a plurality of LED modules facing the housing 201 are mixed with each other and interfere with each other (crosstalk), both sides of a path along which the modules move are opened and discharged to the outside. The discharge to the outside is performed through a plurality of discharge holes 212 connected to the outside, and as shown in (a), the discharge holes 212 are normally closed by the plurality of movement guide mechanisms 213.
When the interference phenomenon occurs, the plurality of movement guide mechanisms 213 move in the direction of the arrow shown in fig. (b), and the discharge holes 212 located at the lower portion of the movement guide mechanisms 213 are opened. Accordingly, the plurality of LED modules blocking the passage are discharged to the outside through the discharge holes 212, and the LED modules can be moved again toward the housing 201.
Fig. 6 is an exemplary view illustrating the probe inspection part 230 according to the present invention. As shown in fig. 6, the probe inspection part 230 may include: a probe 231 that substantially measures the data; an up-down driving part 232 for moving the probe 231 up and down; and a probe guide mechanism 233 for guiding a path of the probe 231 moving up and down.
The up-down driving unit 232 is coupled to the probe 231, and the probe 231 repeatedly performs an up-down motion along a path formed in the probe guide mechanism 233 by the up-down driving unit 232 periodically swinging. At this time, when the LED module is positioned in the upper receiving portion 201 formed in the probe guide mechanism 233, the probe 231 ascends to measure the electrical data of the LED module.
In this embodiment, compared to the conventional system in which the probe 231 passes through the probe guide mechanism 233 in a swing motion, it is possible to prevent the front end of the probe 231 from colliding with the inner wall of the probe guide mechanism 233 due to the up-down driving part 232.
Fig. 7 is a view showing an example of the package carrier 500 according to the present invention. As shown in fig. 7, may include: a rotary picker 510 that sucks and conveys the upper surface of the LED module conveyed from the disk table 200; a carrier vision camera 520 for inspecting the appearance of the LED module sucked by the rotary pickup 510; a conveying part discharge hole 530 for discharging the module which does not conform to the predetermined characteristics to the outside; and a module arranging part 540 for arranging the corner directions of the sucked LED modules.
The rotary pickup 510 is connected to a separate vacuum pump, and can absorb the upper surface of the LED module, and a plurality of rotary pickups 510 are formed centering on the rotation shaft 511. As the rotary shaft 511 rotates, the LED module adsorbed by the rotary pickup 510 takes a mode of moving toward the next structure.
The conveying part vision camera 520 performs an appearance inspection of the LED module sucked by the rotary pickup 510. The carrying part vision camera 520 may perform the appearance inspection of all surfaces of the LED module, as opposed to performing only the appearance inspection of the upper and lower surfaces of the LED module in the vision inspection part 220 of the carousel table part 200. The rotary pickup 510 is configured to suck and support only one surface of the LED module, and thus, the transport unit vision camera 520 can inspect the appearance of all the surfaces of the LED module.
The module arranging part 540 is a structure for arranging the directions of the quadrangular LED modules so that they can be easily received in the receiving part of the carrier tape. For this, in the present embodiment, the 4 arrangement blocks 541 of a quadrangular shape are coupled to each other by the elastic body 542. The width of the individual grooves formed by the plurality of arrangement blocks 541, in which the corners of the LED modules received therein are arranged in a single direction determined by a manager, may be adjusted by the elastic body 542.
Fig. 8 is a view illustrating an example of the tape supplying part 300 according to the present invention. As shown in fig. 8, the tape supply part 300 may include a tape reel 310, a reel loading mechanism 320, and a reel detection sensor 330.
In the present embodiment, the tape supplying part 300 is disposed at the lower part of the system to minimize the entire installation space of the entire system, but the position of the tape supplying part 300 is not limited thereto, and may be disposed at any position as long as it can supply the carrier tape for packing the LED module.
When the reel loading mechanism 320 pulls the carrier tape by tension, the tape reel 310 rotates to supply a certain amount of carrier tape. As shown in fig. 7, the reel loading mechanism 320 may be composed of a plurality of rollers, a spring, and a motor, and the conveyor tape may be supplied to the sealing tape wrapping portion 400 by the power of the motor. In addition, if the reel check sensor 330 detects a signal such that the reel loading mechanism 320 receives an electrically activated signal, the reel loading mechanism 320 may operate.
Fig. 9 is a view showing an example of the wrapping portion 400 of the sealing tape according to the present invention. As shown in fig. 9, the packaging tape wrapping portion 400 includes: a tape supply track 410 for conveying the carrier tape supplied from the tape supply part 300 to a place where the rotary picker 510 is located; the sealing part 420 seals the carrier tape in which the LED module is accommodated.
The sealing part 420 may be thermocompression-sealed at a certain temperature and pressure in order to package the carrier tape in which the LED module is accommodated, and a separate pressure control part 430 for controlling the pressure applied to the carrier tape may be further included for this purpose. The manager can prevent the product from being damaged by applying excessive pressure by controlling the pressure through the pressure control part 430.
In addition, a plurality of vision cameras may be disposed in front of and behind the sealing part 420. The first tape wrapping vision camera 440 checks whether or not the LED module is accommodated in the accommodation portion formed on the conveyor tape, and the first tape wrapping vision camera 440 is disposed in front of the sealing portion 420. The second tape wrapping vision camera 450 may perform an appearance inspection of the sealing state of the carrier tape, the second tape wrapping vision camera 450 being disposed behind the sealing part 420.
Fig. 10 is an illustrative view showing the tape discharging part 600 according to the present invention. As shown in fig. 10, the tape discharge part 600 may include: a winding part 610 for winding the packaged carrier tape; and a cutting unit 620 for cutting a predetermined amount of the carrier tape wound around the winding unit 610.
The winding part 610 is formed with a plurality of retaining plates 611, the retaining plates 611 are used for preventing the carrier tape from being separated from the winding part 610, and the retaining plates 611 have an interval larger than or equal to the width of the carrier tape.
Further, the load of the carrier tape wound around the winding portion 610 is prevented from exceeding the plurality of retaining plates 611.
As described above, the present invention has been explained centering on the preferred embodiments thereof.
The embodiments described in the present specification and the structures shown in the drawings relate to a most preferable embodiment of the present invention, which does not represent the entire technical idea of the present invention, and it should be understood that there may be many equivalents and modified examples that may replace them.
Therefore, the present invention is not limited to the embodiments described above, and various modifications and changes can be made by those skilled in the art within the scope and range of equivalents of the technical idea of the present invention and the technical idea described in the claims below.
Claims (15)
1. An LED module inspection and packaging system, comprising:
a package supply unit (100) for arranging a plurality of LED modules that have been put into a row;
a disc table part (200) which is used for checking a plurality of LED modules supplied from the packaging supply part by rotating the rotary table, classifying the LED modules according to various characteristics, discharging the LED modules which do not meet the set reference value to the outside, and forming a plurality of accommodating parts (201) outside the rotary table;
a tape supply unit (300) for supplying a carrier tape for packaging the LED module;
a packaging tape wrapping section (400) for sealing the LED module with the carrier tape;
a packaging conveyance unit (500) that conveys the LED module that has passed through the disc table unit to the packaging tape wrapping unit; and
a tape discharging part (600) for cutting and discharging the carrier tape sealed with the LED module;
the disc table part (200) comprises a module separating part (210), the module separating part (210) comprises a brake (211), and the brake (211) is used for independently and sequentially throwing the plurality of LED modules;
the module separation unit (210) further includes a plurality of first discharge holes (212) for discharging the plurality of LED modules supplied from the package supply unit (100) to the outside when the plurality of LED modules are mixed, and a plurality of movement guide mechanisms (213) which are disposed above the first discharge holes (212) and selectively open and close the first discharge holes (212).
2. The LED module inspection and packaging system of claim 1,
the module separating part (210) includes a plurality of sensors detecting the LED modules,
the plurality of sensors further include a front sensing part (214) and a rear sensing part (215), the front sensing part (214) is formed in front of the stopper (211) and the rear sensing part (215) is formed behind the stopper (211) with reference to a direction in which the LED module is supplied;
the plurality of sensors are interlocked with the stopper (211) such that the stopper (211) selectively opens and closes a travel path of the LED module.
3. The LED module inspection and packaging system of claim 2,
the rear sensor unit (215) includes a storage detection sensor for detecting an LED module stored in the disc table, and a travel detection sensor for detecting whether or not the LED module has traveled along a predetermined path.
4. The LED module inspection and packaging system of claim 1,
the package supply part (100) further comprises:
a stocker (110) into which a plurality of LED modules are loaded;
a cylindrical rotating container (120) for containing the plurality of LED modules supplied from the stocker (110); and
a supply rail (130) which is connected with the rotary accommodating body (120) and conveys a plurality of LED modules;
the rotating container (120) rotates about a central axis, and the plurality of LED modules are transferred to the supply rail (130) by providing centrifugal force to the plurality of LED modules toward the inner wall of the rotating container (120).
5. The LED module inspection and packaging system of claim 4, further comprising:
and a supply part vision camera (140) which shoots the appearance of the LED module at the point where the rotary accommodating body (120) is contacted with the supply rail (130).
6. The LED module inspection and packaging system of claim 2,
the disc table section (200) further includes:
a plurality of visual inspection units (220) for inspecting the appearance of the lower surface or the upper surface of each LED module accommodated in the accommodation unit (201);
a plurality of probe inspection units (230) for measuring data by the probes in contact with the lower surface of the module;
a light inspection unit (240) that performs light inspection of the LED module; and
and a classification discharge unit (250) which classifies and discharges the data to the outside according to the characteristics based on the data measured by the plurality of vision inspection units (220), the plurality of probe inspection units (230), and the optical inspection unit (240).
7. The LED module inspection and packaging system of claim 6,
the classification discharge unit (250) further comprises a compressed air injection device connected to the housing unit (201) and injecting compressed air from a lower portion of the rotary disk, and a classification discharge control unit electrically connected to the compressed air injection device and controlling selective operation;
the sorting and discharging control unit transmits signals from the vision inspection unit, the probe inspection unit, and the light inspection unit.
8. The LED module inspection and packaging system of claim 1,
the package carrier (500) further comprises: a plurality of rotary pickers (510) that attract LED modules from the disc table section (200); a carrying part vision camera (520) for performing appearance inspection on the sucked LED module; and a second discharge hole (530) for discharging the defective product to the outside;
the rotary picker (510) is disposed at the disc table part (200) to be opposite to a position where the LED module is received.
9. The LED module inspection and packaging system of claim 8,
a plurality of rotary pickers (510) are arranged with a rotation axis (511) as a center;
the conveying part vision camera (520) and the second discharge hole (530) are arranged to face a path along which the rotary pickup (510) moves by the rotation of the rotary shaft (511).
10. The LED module inspection and packaging system of claim 8,
the package transfer unit (500) further comprises a module alignment unit (540), and the module alignment unit (540) aligns the LED modules that are attracted by the rotary pickup (510);
the module arranging part (540) makes the corner of the slot formed by the plurality of blocks (541) coincide with the corner of the LED module sucked by the rotary picker (510).
11. The LED module inspection and packaging system of claim 1,
the packaging tape wrapping part (400) further comprises a tape supply rail (410) and a sealing part (420), wherein the tape supply rail (410) is supplied with the conveying tape from the tape supply part (300) and arranged, and the sealing part (420) is arranged opposite to the tape supply rail (410) and seals the LED module contained by the conveying tape;
the sealing section (420) seals the transfer tape by applying heat and pressure.
12. The LED module inspection and packaging system of claim 11,
the wrapping portion (400) further includes a pressure control portion (430), and the pressure control portion (430) adjusts a pressure applied to the carrier tape in conjunction with the sealing portion (420) to prevent an excessive pressure from being applied to the carrier tape.
13. The LED module inspection and packaging system of claim 11,
the packaging tape wrapping part (400) is opposite to the tape supply track (410), and a first visual camera (440) and a second visual camera (450) are respectively arranged at the front and the rear of the sealing part (420);
the first vision camera (440) photographs the storage or non-storage and state of the LED module,
the second vision camera (450) photographs a sealing state of the carrier tape.
14. The LED module inspection and packaging system of claim 1,
the tape discharging part (600) further comprises a winding part (610), and the winding part (610) provides power for winding and conveying the tape;
the winding part (610) includes a plurality of retaining plates (611), and the retaining plates (611) have a pitch greater than or equal to the width of the carrier tape.
15. The LED module inspection and packaging system of claim 14,
the tape discharging part (600) further comprises a cutting part (620), the cutting part (620) cuts the conveying tape wound around the winding part (610);
the load capacity of the carrier tape wound by the winding unit (610) does not exceed the plurality of retaining plates.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020180070587A KR102101228B1 (en) | 2018-06-20 | 2018-06-20 | LED module inspection and packing system |
KR10-2018-0070587 | 2018-06-20 |
Publications (2)
Publication Number | Publication Date |
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CN110620059A CN110620059A (en) | 2019-12-27 |
CN110620059B true CN110620059B (en) | 2022-12-27 |
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CN201810767114.7A Active CN110620059B (en) | 2018-06-20 | 2018-07-13 | LED module inspection and packaging system |
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KR (1) | KR102101228B1 (en) |
CN (1) | CN110620059B (en) |
MY (1) | MY191564A (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR102165291B1 (en) * | 2020-01-07 | 2020-10-13 | 조상래 | Manufacturing method of twin LED package with different color temperature |
CN112467011B (en) * | 2020-11-29 | 2021-05-18 | 盐城东山精密制造有限公司 | Intelligent assembly production line for LED (light emitting diode) packaging |
CN112974282B (en) * | 2021-04-12 | 2024-09-24 | 杭州思元智能科技有限公司 | Integrated intelligent device for component production and detection |
CN113562406B (en) * | 2021-07-30 | 2023-02-10 | 浙江珵美科技有限公司 | TO9 laser tube packaging method and transfer equipment |
CN116774002B (en) * | 2023-03-21 | 2023-12-29 | 东莞市瑞凯环境检测仪器有限公司 | HAST test box for detecting chip packaging reliability |
CN116374280B (en) * | 2023-05-06 | 2023-12-05 | 昆山谨轩电子包装材料有限公司 | Carrier tape packaging machine |
CN117890021B (en) * | 2024-03-12 | 2024-05-07 | 苏州雷霆光电科技有限公司 | Tightness detection device for LED packaging |
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CN107187680A (en) * | 2017-07-03 | 2017-09-22 | 京东方科技集团股份有限公司 | A kind of adhesive tape adhering device |
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JP5386232B2 (en) * | 2009-05-26 | 2014-01-15 | 日東電工株式会社 | UV irradiation equipment |
KR20110065759A (en) | 2009-12-10 | 2011-06-16 | 주식회사 하이닉스반도체 | Method of operating a non volatile memory device |
KR101106711B1 (en) * | 2010-01-29 | 2012-01-18 | (주)에이피텍 | LED testing and taping apparatus |
KR101098265B1 (en) * | 2010-01-29 | 2011-12-23 | (주)에이피텍 | LED continuous taping method using the LED taping apparatus |
KR101084606B1 (en) * | 2010-01-29 | 2011-11-17 | (주)에이피텍 | LED taping method using the LED testing and taping apparatus |
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2018
- 2018-06-20 KR KR1020180070587A patent/KR102101228B1/en active IP Right Grant
- 2018-07-13 CN CN201810767114.7A patent/CN110620059B/en active Active
- 2018-08-01 MY MYPI2018001385A patent/MY191564A/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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BE662882A (en) * | 1964-04-22 | 1965-10-22 | ||
CN107187680A (en) * | 2017-07-03 | 2017-09-22 | 京东方科技集团股份有限公司 | A kind of adhesive tape adhering device |
Also Published As
Publication number | Publication date |
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CN110620059A (en) | 2019-12-27 |
KR102101228B1 (en) | 2020-04-22 |
KR20190143078A (en) | 2019-12-30 |
MY191564A (en) | 2022-06-30 |
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