TWI354800B - - Google Patents
Download PDFInfo
- Publication number
- TWI354800B TWI354800B TW097105700A TW97105700A TWI354800B TW I354800 B TWI354800 B TW I354800B TW 097105700 A TW097105700 A TW 097105700A TW 97105700 A TW97105700 A TW 97105700A TW I354800 B TWI354800 B TW I354800B
- Authority
- TW
- Taiwan
- Prior art keywords
- test
- electronic component
- tested
- carrier
- storage
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
丄幻480,0 九、發明說明: 【發明所屬之技術領域】 本發明係關於電子元件測試裝置,使用於使半導體積 體電路元件等的各種電子元件(以下統稱之為^元件)和 測試頭的接觸部電性接觸以測試1C元件。 【先前技術】 在1C 70件等的電子元件製造過程中,使 試裝置,以測試已封.肤能夕Tr _ 4 封裝狀態之1[凡件的性能或機能。構成 電子凡件測試裝置之虛理M h么 部。 之處理機包含:載人部、空室部及卸載 處理機之載入部,藉由移載 丨 秒戰裝置將1C兀件從用以容納 測忒則的1C元件,或收納 下魈夕·*Λ凡畢的Κ兀件之承載盤(以 、矣 轉送到電子元件測試裝置内循環運 盤運入空室部。 U承載盤)’並將該測試承載 繼之,在空室部中, 力後,使各ΤΓ _姓b 兀件施加高溫或低溫的熱壓 各IC 70件與測試頭 件測試裝置本體(以下稱之或觸4電性接觸’在電子元 丰體(以下稱之為測試裝置)執行測試。 在IC 7L件的測試完成 件之:則1I 灸,將載有完成測試的I c元 仵之測4承裁盤經從空 L凡 移載裝置將測試完畢的Ic _ i卸載部’在卸載部藉由 於測試結果的客端承載盤二:從測試承載盤轉送至對應 分。 執行良品及不良品類別之區[Technical Field] The present invention relates to an electronic component testing apparatus, which is used for various electronic components (hereinafter collectively referred to as "components") and test heads for semiconductor integrated circuit components and the like. The contacts are electrically contacted to test the 1C component. [Prior Art] In the manufacturing process of electronic components such as 1C 70 pieces, the test device was tested to test the performance or function of the packaged state of the Tr _ 4 package state. It constitutes the imaginary part of the electronic parts testing device. The processor includes: a loading part of the manned part, the empty part part, and the unloading machine, and the 1C element is taken from the 1C component for accommodating the test by the transfer of the leap second warfare device, or is stored in the next day. * The carrier of the Λ 毕 Κ兀 ( ( 以 以 以 ( ( ( ( ( 电子 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载After the force, each of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Test device) Perform the test. In the test completion of the IC 7L piece: 1I moxibustion, will carry the test of the I c element of the completed test 4, and the test will be completed from the empty L-transfer device Ic _ i Unloading Department' in the unloading section by the client bearer 2 of the test result: transfer from the test bearer to the corresponding score. Areas for performing good and defective products
S 224 7-9429-PF1 5 1354800 設置於此種處理機之萤入邱七^ 戰入。卩或卸載部的移載裝置,設 有如8個、12個、16個等禎齡袖 複數個吸附頭,用以吸附維持 1C元件。 因此’在載入部,例如從玄# 2 a 客承載盤同時吸附維持8 個IC元件,並使其直接移動刭屯丨4 ^ 杪動引測武承載盤,而完成承載盤 之間的移載。亦即,載入部的移載 以戟展置,可以藉由在客端 承載盤的單次之升降動作(以下僅溢+ & μ ^、 卜1置柄之為降洛),就可以將 IC.元件吸附維持在所有的吸附頭上。 相對於此’在卸截都,田炎 p因為必須在對應於測試結果進 行分類的同時執行承載盤之問的 # 秋K(間的移载,所以,例如在同樣 的測試結果之ic元件零零落落地位於測試承載盤上的情 況下’必須在測試承載盤執行8次的㈣,才㈣le㈣S 224 7-9429-PF1 5 1354800 The firefly set in this type of processor enters Qiuqi^. The transfer device of the 卩 or unloading section is provided with a plurality of adsorption heads such as 8, 12, 16 and the like, for adsorbing and maintaining the 1C component. Therefore, in the loading section, for example, from the Xuan # 2 a guest carrier, the eight IC components are simultaneously adsorbed and moved, and the susceptor is moved directly to the susceptor. Loaded. That is to say, the loading of the loading part can be expanded, and the lifting operation of the loading tray can be performed by a single lifting operation of the carrier (hereinafter only + & μ ^, and the setting of the handle is reduced) The IC. component adsorption was maintained on all of the adsorption heads. In contrast to this, in the unloading, Tian Yanp has to perform the transfer of the carrier disk at the same time as the classification of the test results. Therefore, for example, the ic component of the same test result is zero. In the case of zero landing on the test carrier, 'must be tested 8 times in the test carrier (four), only (four) le (four)
吸附在全部的吸附頭上,而士、A A 頌上而成為使電子元件測試裝置的產 量降低之一原因。 【發明内容】 發明欲解決的課題 本毛明目的在於提供電子元件測試裝置及電子元件 移載方法’其能夠減少降落次數,並提高產量。 解決課題之手段 (1)為達成上述目的,依據本發明之第i觀點,提供 卜兀件測試裝置,其使被測試電子元件的輸出入端子與 :頭:接觸部電性接觸’以執行該被測試電子元件的 ^"具有·重排裝置,包括:複數個收納部,其可以, 2247-9429-PF1 w I v-f V/f 弟097丨05700號 100年]〇月日修正_ 別收納該被測試電子元件; ^ ψ M ^ W 移動裝置,使該收納部移動· 涿重排裝置,藉由該移動I 秒動, 該收納部之配置。 裝置使該收納部移動,而使重排 在上述發明中雖铁计 …、並未特別加以限定,但以此Α估. 該重排裝置所具有之竽递 為佳. 蒋叙“ 有之该複數個收納部係配置為矩陣狀.今 移動裝置,係將配置於 〇Λ -方向移動。 列或问-行上的該收納部在同 在上述發明中並不牿 置係以鄰接的,收㈣ -以此為佳:該重排裝 部。的該收納部間的間隔為-單位而移動該收納 在上逃發明中並不特別限定,然以此為佳: 置的收納部中,係收納 排裝 重排驻罢壬4 凡畢之该被測試電子元件;該 J裝置重新排列該收納部,使得同一測 试電子元件在同一列或同-行上連續並排特定數 在上述發明中並不转 咕Λ 別限疋,然以此為佳:更包括: 第1 置’其從收納測試完畢之該被測試電子元件的 弟1承载盤,將該被測試電 罨子兀件移載到該重排裝置;第 夕、置’其從該重排震置,維持該被測試電子元件並 將其移載到收柄測$ —显 m“畢之該被測試電子元件的第2承載 盤,該第2移載裝置且右田& 個維㈣ 持該被測試電子元件的瞻 納邱:口二其配置為^ 11行;該重排裝置重新排列該收 、…’使得同一測試結果的該被測試電子元件排列為 η行。 點,提供電Adsorption on all of the adsorption heads, and the addition of A and A A, is one of the reasons for the decrease in the output of the electronic component test apparatus. Disclosure of the Invention Problems to be Solved by the Invention The present invention aims to provide an electronic component testing device and an electronic component transfer method which can reduce the number of landings and increase the yield. Means for Solving the Problem (1) In order to achieve the above object, according to the first aspect of the present invention, a dice test device is provided which electrically contacts an input/output terminal of a tested electronic component with a head: contact portion to perform the The ^"with/rearrangement device of the electronic component to be tested includes: a plurality of storage portions, which can be, 2247-9429-PF1 w I vf V/f, 097 丨05700, 100 years] 〇月日修正_ _ The electronic component to be tested; ^ ψ M ^ W The mobile device moves the storage unit to the rearrangement device, and the storage portion is placed by the movement for one second. The apparatus moves the accommodating portion, and the rearrangement is not particularly limited in the above-described invention, but it is estimated that the rearrangement device has a good hand. The plurality of storage units are arranged in a matrix. The mobile device is arranged to move in the 〇Λ-direction. The storage unit on the column or the question-line is not adjacent to the above invention. (4) - It is preferable that the interval between the accommodating portions is - the unit and the storage is not particularly limited in the case of the escaping invention, and it is preferable that the accommodating portion is provided Storing the re-arrangement of the electronic device; the J device rearranges the accommodating portion so that the same test electronic component is continuously side by side in the same column or on the same line in the above invention and It is better to: 第 : : 疋 : : : : : : : : : : : : : : : : : : : : : : : : : : : 第 第 第 第 第 第 第 第 第 第 第 第 第The rearrangement device; on the eve of the day, it is shaken from the rearrangement to maintain the Test the electronic component and transfer it to the handle to measure the second carrier of the tested electronic component, the second transfer device and the right field & dimension (4) holding the electronic component to be tested Zhan Naiqiu: Port 2 is configured as ^11 rows; the rearrangement device rearranges the receipts, ... so that the tested electronic components of the same test result are arranged in n rows. Point, provide electricity
S (2)為達成上述目的,依據本發明之第2觀 2247-9429-PF]_ 7 弟097105700號 100年10月11曰修] 子元件的移載方法,其依據 將雷;开杜7A電子疋件的測試結果, 將電子兀件從第i承載盤移載到第2 果 1移載步驟’將該被測試電子 /、匕括:第 複數的從該第1承載盤移载到 複數的收納部;重排步驟,1 秋則 V . . _ ,, /、9由移動收納了該被測試雷 子兀件的該收納部,而重新 電 新排列該收納部的配置;第2孩 載步驟,將該被測試電子元件 移 載盤。 h件從該收納部移載至該第2承 在上述發明令並不特別限 ^ ^ . …、以此為佳:在該重排 v驟中,上述複數個收納部 一列戍同一行上的…置為矩陣狀’將配置於同 歹门卩上的該收納部在同_方向移動。 :上述發明中並不特別限定,然以此為佳:在 步驟中,係以鄰接的該 收納部。 π早仅而移動該 在上述發明中並不牿別 、,…丨以此為佳:該收納部 中,係收納測試完畢之該被 ^ ^ iL 乂电于兀件,在該重排步驟 中重新排列該收納部,使得同一 、』4,、,°果之該被測試電子 元件在同-列或同一行上連續並排特定數量。 發明令並不特別限定,然以此為佳:將該被測 s式電子兀件從該收納部移載至該第2承載盤之移載裝置, 具有用以維持該被測試電子元 配置為m列η行之mxn 個維持部,該重排步驟中,重新排列㈣納部,使得同一 測試結果的該被測試電子元件排列“歹“行。 發明之效果 在本發明中,重新排列收納了被測試電子元件的複熟 2247-9429-PF1 8 丄妁480,0 之收納部。藉此’重新排列收納 被測試電子元件和移載褒置的雄W吏付同一測試結果之 了以用卸载部中較少次數的 致,精此 維持在全部的維持部,而能:以將被測試電子元件 量。 耠间電子元件測試裝置的產 【實施方式】 下文配合圖式,說明本發明之實施例。 第1圖顯示依據本發明第丨 置的椭罘1貫施例之電子元件測試裝 置的概略剖面圖’第2圖顯示依 子元件測試震置的斜視圖,第3圖K月第1只施例之電 也乂 ' 圖”肩不依據本發明第1實 施例之電子元件測試裝 月弟1只 $ ^ 罝τ承載盤之處理的概念圖。 者’第3圖係為用以理解雷- 盤之處理方法之圖,實際上二子70件測試裝置中承載 择顯1工 實際上包含並排配置於上下方向之元 件,4不為平面的部分。因 第2圖說明之。 其機械之(立體的)構造參見 =施型態之電子騎測試褒置,係為在對Κ元件施 加二或低溫的溫度壓力的狀態下,測試(檢查爪元件是 否適备地動作,依據該測試处 甘“ U而# IC元件分類的裝置, 其由處理機1、測試頭5及測 J戎褒置6構成。由該電子元S (2) in order to achieve the above object, according to the second aspect of the present invention 2247-9429-PF]_ 7 brother 097105700, 100 years October 11 ] repair] sub-component transfer method, based on the mine; Kai Du 7A The test result of the electronic component transfers the electronic component from the i-th carrier to the second phase 1 transfer step 'the tested electronic/, including: the plural number is transferred from the first carrier to the plural Storage unit; rearrangement step, 1 autumn, V. . _ , , /, 9 by moving the storage unit that accommodates the tested lightning element, and re-arranging the arrangement of the storage unit; second child In the step, the tested electronic component is transferred to the disk. The transfer of the h piece from the storage portion to the second support is not particularly limited to the above invention, and it is preferable that in the rearrangement v, the plurality of storage portions are arranged on the same line. ...in a matrix shape, the storage portion disposed on the same door sill moves in the same direction. The above invention is not particularly limited, but it is preferable that the accommodating portion is adjacent to each other in the step. It is preferable that the π is moved only in the above invention, and it is preferable that the accommodating portion stores the tested portion of the sputum in the rearrangement step. The accommodating portions are rearranged such that the same electronic component of the same, "4,," is continuously side by side in a certain number on the same column or the same row. The invention is not particularly limited, and it is preferable that the s-type electronic component to be transferred from the accommodating portion to the transfer device of the second carrier has a configuration for maintaining the electronic component to be tested as The mxn mxn sustaining portions of the m rows are arranged, and in the rearranging step, the (four) nanoparts are rearranged so that the tested electronic components of the same test result are arranged in a "歹" row. Advantageous Effects of Invention In the present invention, the storage portion of the cooked 2247-9429-PF1 8 丄妁480, 0 in which the electronic component to be tested is housed is rearranged. By 'rearranging the male and female wares that store the electronic component to be tested and the transfer device, the same test result is used to maintain the number of times in the unloading portion, and it is maintained at all the maintenance portions. The amount of electronic components being tested. Production of daytime electronic component testing device [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an elliptical embodiment of the first embodiment of the present invention. FIG. 2 is a perspective view showing a vibration of a sub-element test, and FIG. 3 is the first example of the K-month. The electric power is also not in accordance with the first embodiment of the present invention. The electronic component test is installed in the conceptual diagram of a $^ 承载τ carrier disk. The third figure is used to understand the lightning-disc In the diagram of the processing method, in fact, the load-bearing work in the 70-piece test device actually includes the components arranged side by side in the up and down direction, and the portion 4 is not the flat portion. The second figure illustrates the mechanical (stereoscopic The structure is referred to as the electronic riding test device of the mode type, in which the test is performed in a state in which the temperature of the second element or the low temperature is applied to the element, and it is checked whether the claw element is properly operated, according to the test. #IC component classification device, which is composed of a processor 1, a test head 5, and a measurement unit 6. The electronic element
件測試裝置之IC元件的測試,將丨c % 4 # # , 4將IC 70件從客端承載盤KST 移載到測試承載盤TST而實施。 因此,本實施型態的處理機1,如第1〜3圖所示,由 下列構成:收納部200’其收納承載測試前的以件或測 2247-9429-PF1 9The test of the IC component of the test device is carried out by transferring the IC 70 from the guest carrier KST to the test carrier TST by 丨c % 4 # # , 4 . Therefore, the processor 1 of the present embodiment has the following configuration as shown in Figs. 1 to 3: the accommodating portion 200' accommodates the member before the load test or the test 2247-9429-PF1 9
S 的C TL件的客端承載盤KST ;載入部300,將從收納 200傳送之Ic元件移至測試承載盤tst而送入空室部 3劂試頭5,在承載於測試承載盤TST的狀態下, 執仃K兀件測試的空室部1。〇 ;卸載部40。,將測試完畢 凡件從ι至部100搬出,分類並同時移至客端承載盤 KST。 設於測試頭1上的測試座50,透過第1圖所示之電線 7而連結於測試裝置2 ’透過電線7而使和測試座50電性 L接的C 7G件和測試裝置6連接,藉由該測試裝置6的測 試訊號來測武Ic元件。而且’如第】圖所示,在處理機1 的下部之一部份設有空間8,在該""以可置換的方式 配置測試頭5,透過處理機i的裝置基板上形成的開口, 可以使IC元件及測試頭5上的測試座50電性連接。IC元 件的種類變換時,換成具有適合該種類之ic元件的形狀、 接腳數等的測試座的測試頭。 以下針對處理機1的各部分詳述之。 [收納部200 ] 第4圖顯示使用本發明第1實施例之電子元件測試裝 置的1C倉儲之分解斜視圖’第5圖顯示本發明第i實施例 之電子元件測試裝置使用之的客端承載盤之斜視圖。 …”包含:測試前Ic倉儲2〇1,用以收納承載 測-式則1C兀件的客端承載盤;測試畢IC倉儲撕,用以 收納承載對應於測試結果而被分類之IC元件之測試承載 盤。 10 1 2 2247-9429-PF1 I3548Q0 100年10月11日修正替換頁 第 0’97105700 號 运些倉儲201、202,如第4圖所示,包含:框狀的承 載盤支持框203 ;從該承載盤支持框203的下部進入可向 上部升降的升降台204。在承載盤支持框203疊放了複數 的客端承載盤KST,僅有該疊放的客端承載盤KST藉由升 降台204上下移動。 在本實施例中’客端承載盤KST,如第5圖所示,配 置了 1 0列X 6行之用以收納I c元件的6 0個收納部3 3,但 是實際上對應於1C元件的種類而存在有各種變異的配置 方式。 測試前1C倉儲201及測試畢1C倉儲202為同樣的構 造,因此,可以因應需要設定適當數量為測試前1C倉儲 201及測試畢1C倉儲202個別的個數。 在本實施例中’如第2圖及第3圖所示,測試前Ic倉 儲201上設有2個倉儲STK-B,其旁邊設有空承載盤倉儲 STK-E。個別的空承載盤倉儲STK-E疊放了卸載部4〇〇所傳 送之空的客端承載盤KST。 空承載盤倉儲STK-E的旁邊,在測試畢ic倉儲202 **·«· 有8個倉儲STK-1、STK-2……STK-8 ’可以對應於測試 的結果,最多分為8類儲存,除了良品和不良品的區別之 外’良品中又可以分為西速品、中速品、低速品,戈者 不良品中又可以分為需要再測試者等。 [載入部300 ] 第6圖顯示本發明第1實施例之電子元件、、則4 & 丨卞碉蜮裝置使 用的測試承載盤之分解斜視圖,第7圖顯示依據 '明第The client carrier KST of the C TL component of S; the loading unit 300 moves the Ic component transmitted from the storage 200 to the test carrier tray tst and sends it to the empty chamber section 3劂 test head 5, which is carried on the test carrier TST In the state, the empty chamber part 1 of the K-test is executed. 〇 ; Unloading section 40. After the test is completed, the parts are moved out from the ι to the part 100, sorted and moved to the client carrier KST at the same time. The test stand 50 provided on the test head 1 is connected to the test device 2' through the electric wire 7 shown in FIG. 1 through the electric wire 7 to connect the C 7G piece electrically connected to the test stand 50 to the test device 6. The Ic component is measured by the test signal of the test device 6. Further, as shown in the figure, a space 8 is provided in a portion of the lower portion of the processor 1, and the test head 5 is disposed in a replaceable manner, and is formed on the device substrate of the processor i. The opening allows the IC component and the test socket 50 on the test head 5 to be electrically connected. When the type of the IC element is changed, it is replaced with a test head having a test socket suitable for the shape of the ic element of this type, the number of pins, and the like. The following is a detailed description of each part of the processor 1. [Storage part 200] Fig. 4 is a perspective view showing the 1C storage of the electronic component testing apparatus according to the first embodiment of the present invention. FIG. 5 is a view showing the passenger bearing used in the electronic component testing apparatus of the i-th embodiment of the present invention. Oblique view of the disc. ..."includes: Ic warehousing 2〇1 before the test, for accommodating the passenger carrying disk carrying the test-type 1C component; testing the IC storage tearing, for accommodating the IC component that is classified according to the test result Test the carrier. 10 1 2 2247-9429-PF1 I3548Q0 October 11th, 100th revised replacement page No. 0'97105700, these warehouses 201, 202, as shown in Figure 4, contain: frame-shaped carrier support frame 203. From the lower portion of the carrier support frame 203, the elevator platform 204 can be lifted up and down. A plurality of client carrier disks KST are stacked on the carrier tray support frame 203, and only the stacked client carrier disks KST are borrowed. In the present embodiment, the 'passenger carrier KST, as shown in FIG. 5, is arranged with 10 rows x 6 rows of 60 storage portions 3 3 for accommodating the Ic component, However, in fact, there are various variations in the configuration of the 1C component. The 1C warehousing 201 and the 1C warehousing 202 are the same structure before the test. Therefore, the appropriate number of pre-test 1C warehousing 201 and testing can be set as needed. The number of individual storages in the 1C warehouse is 202. In this embodiment 'As shown in Figure 2 and Figure 3, there are 2 storage STK-Bs on the Ic storage 201 before the test, and there is an empty carrier storage STK-E next to it. The individual empty carrier storage STK-E stacks The empty passenger carrier KST transmitted by the unloading unit 4〇〇. The empty carrier disk storage STK-E next to the test, the ic storage 202 **·«· has 8 storage STK-1, STK-2... ...STK-8 'can correspond to the results of the test, can be divided into 8 categories of storage, in addition to the difference between good and bad products, 'good products can be divided into West speed products, medium speed products, low speed products, bad goods Further, it can be divided into those who need to be retested, etc. [Loading unit 300] Fig. 6 is an exploded perspective view showing the test carrier used for the electronic component of the first embodiment of the present invention, and the 4 & , Figure 7 shows the basis of 'Mingdi
S 2247-9429-PF1 11 135480¾ 097105700 號 100年10月11日修正替換貪 1實施例之電子元件測試裝置的載入部的平面圖。 上述的客端承載盤KST,藉由設於收納部200及裝薏 基板101之間的承載盤移動臂205,從裝置基;^ 101的下 侧運送到載入部300的2個窗部。而且,在該載入部 300 ’當元件搬運裝置304將客端承載盤KST中疊放的Ic 元件轉送到對準器3 0 5,則修正在此之I c元件的相互位置 關係之後,元件搬運裝置304再將轉送到該對準器305 的1 C元件累積在載入部300之停止的測試承載盤TST。 測》式承載盤TST,如第6圖所示,在方形框架12中平 打且等間隔地設置棧板13,該棧板1 3的兩側及和棧板1 3 對向之方形框架12的邊12a上,分別等間隔地突出形成裝 设片14 °該棧板丨3之間或棧板丨3及邊1 2a之間藉由2 個裝设片14而形成插入物收納部} 5。 各插入物收納部1 5中’分別收納1個插入物16,該 插入物16係使用扣件17以浮動狀態設置於裝設片14。因 此’插入物16的兩端部上,形成了用以使該插入物16裝 設於裝設片14的裝設孔1 9 〇此插入物1 6,如第6圖所示, 在1個測試承載盤TST上設有64個,配置為4列16行。 而且,各插入物16為同一形狀同一尺寸,1C元件分 別收納於個別的插入物1 6中。插入物1 6的1C收納部1 8, 對應於收納之IC元件的形狀而決定,在第6圖所示之例中 為方形的凹型。 載入部300,如第7圖所示,具有元件搬運裝置310, 以將IC元件從客端承載盤KST轉·而疊放於測試承載盤 2247-9429-PF1 12 第 0·97105700 號 100年〗〇月〗1日修正替換頁 tst。兀件搬運裝置31〇 ’由下列構成:在裝置基板⑺1上 沿者Υ軸方向設置之2支軌道3"、可以在該執道3"上 沿者Υ抽方向往返移動之第1及第2移載臂·、33〇。 第移裁’ 32。具有.位於2處窗部3〇6之2枚客端 承載盤KST及巧署古 ° ;載入部300之測試承載盤TST之 門而可以在軌道311上往返移動的可動臂如;由可動臂 321支撐並可以沿著χ軸方向移動的可動頭322;在可動頭 +向下配置為2列8行之i 6個吸附頭323。各吸附碩 323藉由並未特別圖示之促動器,而可以沿著Z軸方向上 下移動^而可以—次將16個1(:元件從客端承載盤说轉 置於測試承載盤tst。 A移載4s 330也-樣具有:位於2處窗部辦之2 枚客端承載盤kst及設置在位於載入部3〇〇之測試承載盤 TST之間而可以在執道311上往返移動的可動臂331;由可 動臂_331支擇並可以沿著X轴方向移動的可動頭332;在 可動頭322上向下gp番氣。力丨。 -置為2列8行之16個吸附頭333。各 精由並未特別圖示之促動器,而可以沿著Z軸 方向上下移動’而可以—次將16個ic元件從客端承載盤 KST轉置於測試承載盤TST。 上述第1移載臂320和第2移載臂330係由同一個一 組的軌道3U所支擇。第1移載臂和第2移載臂33〇, 在第7圖中第1移載臂320係設置於下側而第2移載臂330 係,置於上側’在軌道311上沿著方向並列配置。在 本實施型態中的元件移载裝置3财,第】移载臂㈣和 2247-9429-PF1 13 ^ 1354800 第2移載臂330可以同時接近同一個客端承載盤κ§τ或同 一個測試承載盤TST。 亦即,第1移載臂320藉由吸㈣323從客端承載盤 KST吸附16個ic元件,並使該IC元件移動後放開吸附 墊323的吸附而將IC元件放置於測試承載盤。在此同 時,第2移載臂330藉由吸附墊333從同—個客端承載盤 KST吸附16個1C元件,並使該1C元件移動其他的量後, 放開吸附塾333的吸附而將IC元件放置於同—個測試承載 盤TST。藉此,元件移載裝置31〇維持在和過去相同的尺 寸,而能夠使其搬運能力倍增。 …再者’如第1圖和第7圖所示,在客端承載盤KST和 測试承載盤TST之間設有2個對準器3〇5。各個對準器 具有比較深的凹部(圖未顯示),該凹部的周圍邊緣為傾斜S 2247-9429-PF1 11 1354803⁄4 097105700 A plan view of the loading portion of the electronic component testing device of the embodiment of the present invention. The above-described guest carrier KST is transported from the lower side of the device base 101 to the two window portions of the loading unit 300 by the carrier moving arm 205 provided between the housing unit 200 and the mounting substrate 101. Moreover, at the loading portion 300', when the component carrying device 304 transfers the Ic component stacked in the guest carrier tray KST to the aligner 305, the component is corrected after the mutual positional relationship of the components. The handling device 304 then accumulates the 1 C component transferred to the aligner 305 on the test carrier tray TST where the loading unit 300 is stopped. As shown in FIG. 6, the pallet 13 is laid flat and equally spaced in the square frame 12, both sides of the pallet 13 and the square frame 12 opposite to the pallet 13 On the side 12a, the mounting piece 14 is formed at equal intervals, and the interposer receiving portion 5 is formed by the two mounting pieces 14 between the pallets 3 and between the pallets 3 and 1 2a. In each of the insert accommodating portions 15, one insert 16 is accommodated, and the insert 16 is placed on the mounting sheet 14 in a floating state using the fastener 17. Therefore, on both ends of the insert 16, a mounting hole 1 for mounting the insert 16 to the mounting piece 14 is formed. The insert 16 is as shown in Fig. 6, in one There are 64 test carrier trays TST, which are configured as 4 columns and 16 rows. Further, each of the inserts 16 has the same shape and the same size, and the 1C elements are housed in the individual inserts 16 respectively. The 1C housing portion 18 of the insert 16 is determined in accordance with the shape of the IC component to be housed, and is a square concave shape in the example shown in Fig. 6. The loading unit 300, as shown in FIG. 7, has a component handling device 310 for stacking the IC component from the guest carrier KST and stacking it on the test carrier 2247-9429-PF1 12 No. 0.97105700 for 100 years. 〗 〖Yueyue 1st revised replacement page tst. The 搬运 搬运 〇 〇 〇 由 由 由 由 由 由 由 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Transfer arm·, 33〇. The first move is '32. The utility model has two client-side carrier disks KST located at two window portions 3〇6 and a movable arm of the test portion 300 of the test carrier tray TST, which can reciprocate on the track 311; The movable head 322 supported by the arm 321 and movable in the direction of the x-axis; the movable head + downwardly arranged in two rows and eight rows of i 6 adsorption heads 323. Each of the adsorption masters 323 can be moved up and down along the Z-axis direction by means of an actuator not specifically illustrated, and 16 (1) components can be transferred from the guest carrier tray to the test carrier tray tst. The A transfer 4s 330 also has two client-side carrier disks kst located at two window portions and is disposed between the test carrier trays TST located at the loading unit 3, and can be reciprocated on the road 311. The movable movable arm 331; the movable head 332 which is controlled by the movable arm 331 and movable in the X-axis direction; the movable head 322 is downwardly gp. The force is set. - Set to 2 columns and 8 rows of 16 The adsorption head 333 can be moved up and down along the Z-axis by actuators not specifically shown, and the 16 ic elements can be transferred from the passenger carrier KST to the test carrier TST. The first transfer arm 320 and the second transfer arm 330 are selected by the same set of tracks 3U. The first transfer arm and the second transfer arm 33A are firstly transferred in FIG. The arm 320 is disposed on the lower side and the second transfer arm 330 is disposed on the upper side, and is arranged side by side along the direction on the rail 311. In the present embodiment, the component transfer device 3, the first] The carrier arm (4) and the 2247-9429-PF1 13^1354800 2nd transfer arm 330 can simultaneously approach the same guest carrier disk κ§τ or the same test carrier TST. That is, the first transfer arm 320 is sucked by (4) 323 adsorbs 16 ic components from the guest carrier KST, and moves the IC component to release the adsorption of the adsorption pad 323 to place the IC component on the test carrier. At the same time, the second transfer arm 330 is adsorbed. The pad 333 adsorbs 16 1C components from the same guest carrier KST, and moves the 1C component by another amount, then releases the adsorption of the adsorption 塾333 and places the IC components on the same test carrier TST. Thus, the component transfer device 31 is maintained at the same size as in the past, and can be multiplied by its carrying capacity. ... Again, as shown in Figures 1 and 7, on the guest carrier KST and the test carrier There are two aligners 3〇5 between the TSTs. Each aligner has a relatively deep recess (not shown), the peripheral edge of which is inclined
面。因此’在使得從客端承載盤KST移至測試承載盤TST :二兀:牛,在移動到測試承載盤TST之前,只要落入該對 準益3 0 5 ’就能夠正確地決 _ 展碩地决疋1C疋件相互之間的位置關 係,而此夠精確地將κ元件疊放在測試承载盤加。 為第1移#登本實知里態中’在第7圖中下側的對準器305 為第1移載臂320專用 用的對皁盗’而同-圖令上側的對準 305則為第2移載臂330專用的對準器。 當測試承載盤TST的所有的收納部18都㈣了 ^元 件時,則由承載盤搬運裝置1 〇2 到空室部⑽中。 將該測试承載盤TST搬運 另一方面’當承載於客端承裁盤KST的所有ic元件都 2247-9429-PF1surface. Therefore, in moving the client carrier disk KST to the test carrier disk TST: second: cattle, before moving to the test carrier disk TST, as long as it falls into the alignment benefit 3 0 5 ' can be correctly determined _ The positional relationship between the 1C components is determined, and this is enough to accurately stack the κ components on the test carrier. In the first shift, the aligner 305 on the lower side in Fig. 7 is a pair of soap hoppers dedicated to the first transfer arm 320, and the alignment 305 on the upper side of the same pattern is An aligner dedicated to the second transfer arm 330. When all the accommodating portions 18 of the test carrier TST are (four), the carrier carrying device 1 〇 2 is passed into the empty chamber portion (10). Handling the test carrier TST on the other hand 'when all the ic components carried on the guest end panel KST are 2247-9429-PF1
S 14 I3548Q0 已經轉置於測試承載盤TST時 載I κQT τ w汴降D使該空的客端承 降,並將該空的承載盤轉交給承 2〇5。承截殽软…壯姐執i移达裝置 盤倉健將該空的承載盤放到空承載 健STK-E中,當測試畢Ic倉儲2〇2的客端㈣盤^ 放滿了以件時,就將空的承載盤供應給該 [空室部100] 實施例之電子元件測試裝 第8圖顯示依據本發明第 置的控制系統的方塊圖。 上述的測試承載盤TST,在載入部300裝入Ic元件後 送入空室部100,各1(;元件在承載於該測試承載盤TST的 情況下被測試。 空室部100,如第2圖及第3圖所示,由下列構成: 衝擊室11〇,對於裝在測試承載盤TST的Ic元件施以目 標高溫或低溫的熱壓力;測試室12〇,將在該衝擊室ιι〇 被施以熱壓力的狀態下的1C元件和測試頭5接觸;去衝擊 室130 ’將施加的熱壓力從完成測試的ic元件移除。 而且’去衝擊室130,以和衝擊室1丨〇或測試室丄2〇 熱絕緣為佳,實際上,在衝擊室11〇和測試室12〇的區域 維持高溫或低溫,去衝擊室丨3〇和其熱絕緣,不過,為了 方便將這些總稱之為空室部1 〇〇。 衝擊室11 0,係配置為較測試室120突出於上方。而 且如第3圖所示’該衝擊室11()内部設有垂直搬運裝置, 在直到測試室120變空之前’複數個測試承載盤TST由該 垂直搬運裝置支撐並待機。主要是在此待機中將攝氏_55 2247-9429—PF1 1354800 又〜+ 150度之高溫或低溫的熱壓力施加於1(:元件。 在測試室120中,其中央部設有測試頭5,測試承裁 盤tst被搬運到測試頭5上方,使IC元件的輸出入端子和 測試頭5的接觸腳電性接觸,以實行IC元件的測試。 各IC元件的測試結果,如第8圖所示,從測試裝置6 傳送到處理機卜在處理機i的記憶裝置51〇中,分別儲 存於對應於依據測試承載盤TST所附之識別號碼和測試承 載盤TST内分配之IC元件的號碼而決定之位址。 去衝擊室130也和衝擊t 11〇 ,配置為較測試室 犬出於上方,且如第3圖所示,其設有垂直搬運裝置。 在衝擊室U〇將高溫施加於1C元件的情況下,在該去衝擊 至130中,藉由达風冷卻Ic元件使其回到室溫之後,再將 該去除高溫的1C元件搬出到卸載部4〇〇。另一方面,在衝 擊室110中施加低溫的情況下,w溫風或加熱器等加熱Ic 兀件回復到不產生凝結水的溫度後,將該回溫的! C元件搬 出至卸載部400。 在衝擊室11G的上部,形成用以將測試承載盤m從 裝置基板101搬入的入口。同樣地,在去衝擊室13〇的上 部’形成用以將測試承載盤TST搬出至裝置基板i 01的出 而且在裝置基板101上,設有承載盤搬運裝置 用以透過這些入口及出口將測試承載盤TST從空室部100 出入。藉由該承載盤搬運裝置1〇2,從去衝擊$ 13〇搬出 的測試承載盤m’透過卸載部糊及載入部綱送回到 衝擊室110。When the S 14 I3548Q0 has been transferred to the test carrier TST, the I κQT τ w汴D is used to carry the empty passenger and the empty carrier is handed over to the carrier. Inheriting the confusing soft... Zhuang Jie’s i-transfer device Pan Cangjian puts the empty carrier disk into the empty bearer STK-E, when the client (4) of the test Ic warehouse 2〇2 is filled with The empty carrier tray is supplied to the [empty chamber portion 100]. The electronic component test package of the embodiment shows a block diagram of the control system according to the first embodiment of the present invention. The test carrier TST described above is loaded into the empty chamber portion 100 after the loading unit 300 is loaded with the Ic component, and each component is tested. The component is tested while being carried on the test carrier TST. The empty chamber portion 100, as described 2 and 3, which are composed of the following: Impact chamber 11〇, applying the target high temperature or low temperature thermal pressure to the Ic component mounted on the test carrier TST; the test chamber 12〇 will be in the impact chamber The 1C element in a state in which the heat is applied is in contact with the test head 5; the shock chamber 130' removes the applied heat pressure from the ic element that has completed the test. And 'goes the impact chamber 130 to the impact chamber 1' Or the test chamber 丄 2 〇 thermal insulation is better, in fact, in the area of the impact chamber 11 〇 and the test chamber 12 维持 maintain high temperature or low temperature, to impact the chamber 〇 3 〇 and its thermal insulation, however, for the sake of convenience, these are collectively called The chamber 11 is configured to protrude above the test chamber 120. Further, as shown in FIG. 3, the impact chamber 11 is provided with a vertical transport device, up to the test chamber 120. Before the emptying, a plurality of test carrier trays TST are supported by the vertical carrier Standby. Mainly in this standby, apply _55 2247-9429-PF1 1354800 and +150 degrees of high temperature or low temperature thermal pressure to 1 (: component. In the test room 120, the test head is provided at the center. 5. The test receiving tray tst is transported to the top of the test head 5, so that the input and output terminals of the IC component and the contact pins of the test head 5 are electrically contacted to perform the test of the IC component. The test result of each IC component is as shown in the eighth. As shown, the transfer from the test device 6 to the processor is stored in the memory device 51 of the processor i, respectively, in an IC component corresponding to the identification number attached to the test carrier TST and the test carrier TST. The address determined by the number is also the impact chamber 130 and the impact t 11〇, configured to be higher than the test chamber dog, and as shown in Fig. 3, it is provided with a vertical handling device. In the case of application to the 1C element, in the de-impact to 130, after the Ic element is cooled by the air to return to the room temperature, the high-temperature removing 1C element is carried out to the unloading portion 4〇〇. In the case where low temperature is applied in the impact chamber 110 w After heating the Ic member such as a warm air or a heater to return to a temperature at which no condensed water is generated, the reheated C component is carried out to the unloading portion 400. At the upper portion of the impact chamber 11G, a test carrier m is formed. The inlet that is carried in from the device substrate 101. Similarly, the upper portion of the de-impact chamber 13 is formed to carry out the test carrier TST to the device substrate i 01 and is disposed on the device substrate 101. The test tray TST is taken in and out from the empty chamber portion 100 through the inlet and the outlet. By the carrier tray transporting device 1〇2, the test carrier tray m' carried out from the impact of $13〇 is transmitted through the unloading portion paste and the loading portion. The program is sent back to the impact chamber 110.
S 2247-9429-PF1 16 [卸載部4〇〇j 第9圖顯示依據本發明第】實施例 置:卸裁部的平面圖,第i〇圖顯示設置於裝 『的緩衝裝置之平面圖,第 ::之卸 置的斷面圖。 弟10圖之緩衝裝 卸载部_對應於測試結果,將測 從自空室部10〇 π畢的IC TL件, KST〇 運出的挪試承载盤TST轉置於客端承载盤 如第2圖所示’卸載部綱的裝置基板1 個窗部406,使得從收納部2〇〇運 客形成 載盤阶配置為面對裝置基板101上。P4〇〇的客端承 卸載部400包;^ & 結果,—畢:,應於測試 承載盤KST;緩衝f置44n 承载盤TST轉置於客端 測試承載盤TST4 β 田利忒凡畢的1C元件轉置於 重新排Γ和客料細τ之間,則執U元件的 元件移载裝置410,如第9圖& _ 裝置基板1〇1上沿著圖所不,由下列構成:在 軌道⑴可以沿著:軸=架設之2之軌道I使該 第2移載臂430。該 動的第1移載# GO和 遠拉於声畑地 夕載裝置410,如第8圖所示,係 接於處理機i的控制裝置5〇〇 ' 制其動作。 错由該控制裝置500控 部 元件移载裴置410的 4 0 0之2牧測試承載盤 第1移载f 420包括:位於卸載 tst和緩衝裴置44〇之間而可以S 2247-9429-PF1 16 [Unloading Unit 4〇〇j FIG. 9 is a plan view showing the unloading portion according to the first embodiment of the present invention, and the first drawing shows a plan view of the buffer device installed in the apparatus, : A section view of the unloading. The cushion loading and unloading section of the figure 10 corresponds to the test result, and the IC TL piece from the vacant chamber part is measured, and the moving test carrier TST shipped from the KST〇 is transferred to the passenger carrier disk as the second. As shown in the figure, the window portion 406 of the device substrate of the unloading section is arranged such that the carrier is formed from the accommodating portion 2 so as to face the device substrate 101. P4〇〇 passenger loading and unloading department 400 packs; ^ & results, - Bi: should be tested on the carrier KST; buffer f set 44n carrier tray TST transferred to the guest test carrier TST4 β Tian Lifan Fanbi The 1C component is transferred between the re-discharge and the mass τ, and the component transfer device 410 of the U component is constructed as follows, as shown in FIG. 9 & _ device substrate 1〇1, : The second transfer arm 430 can be placed on the track (1) along the track I of the axis = erection 2 . The first transfer # GO of the movement and the sonar device 410 far from the sonar, as shown in Fig. 8, are controlled by the control device 5 of the processor i. The 4th shift test carrier 420 of the control unit 500 is controlled by the component transfer device 410. The first transfer load 420 includes: between the unloading tst and the buffer device 44〇.
S 2247-9429-PF1 17 Ι3548〇α 弟097105700號 100年10月11日修正替換頁. 在軌道411上往返移動的可動臂421 ;由可動臂AM支撐 並可以沿著X軸方向移動的可動頭422 :在可動頭上 向下配置為2列8行之1 6個吸附頭423。各吸附頭423藉 由並未特別圖示之促動器,而可以沿著z軸方向上下移 動,而可以一次將16個IC元件從測試承載盤tst轉置於 緩衝裝置440。再者’在本發明中’帛丄移載臂具有 的吸附頭423的數量係可以任意設定。 第2移載臂430包括:位於緩衝裝置44〇和分別分別 位於4處窗部406之4枚客端承載盤KST之間而可以在軌 道411上往返移動的可動臂431 ;由可動臂431支撐並可 以沿著X軸方向移動的可動頭432 ;在可動頭422上向下 裝設的吸附頭433。 在該第2移載臂430中,和第i移載臂42〇不一樣, 12個吸附頭433以2列6行配置於可動頭432的下側。各 吸附頭433,係由並未特別圖示的促動器,而能夠沿著z 軸方向上下移動,而能夠一次將1 2個I c元件從緩衝裝置 440移至客端承載盤KS1^再者,在本發明中,第2移載臂 430具有的吸附頭433的數量係可以任意設定。 緩衝裝置440,如第1〇及u圖所示,具有4組緩衝 單元450,其由下列構成:直線狀形成可收納IC元件的8 個收納凹部461的移動元件460 ;驅動裝置47〇,其使用滾 珠螺桿使該移動元件460沿著長邊方向移動^ 4組緩衝單 元4 5 0係相互平行地並排配置,其結果為,3 2個收納部4 61 配置為4列8行的矩陣狀。再者,在本發明中,缓衝裴置 2247-9429-PF1 18 第™〇號 loo年ίο月11日修正替換頁 440具有的收納凹部461的數量及配置係可以任意設定, 向及航向均為第!移載臂42〇所具有之吸附頭奶的 數量之整數倍為佳。 α移動疋件460的各收納凹部461,如第U圖所示,凹 4的周圍邊緣為係、為傾斜面所包圍,當K元件藉由元件移 載裝置410落在收納凹部461時,ic元件之間的間隔係大 致為固定。移動元件460的下面,係由具有插入鋼球之母 螺紋的滾珠螺桿轉接器462所固定。 驅動裝置470,如同一圖所示,係由下列構成:形成 :滾珠螺杯轉接器462的母螺紋之公螺紋的驅動軸 471山;使驅動轴471回轉驅動之馬達仍:維持驅動轴d 錢件可以自由回轉的轴承m。藉由在相對的母螺 2公螺紋之間插人鋼球,而由驅動軸471和滾珠螺桿轉 /盗462構成滾珠螺桿構造。馬達化’如第8圖所示, 2接於處理機1的控制裝^00,藉由該控制裝置5〇〇 :制其動作’其能夠以收納凹部461之間的間隔為一單位 2移動元件偏移動。再者,控制裝置能夠獨立 控制4個緩衝單元的各馬達仍。 該緩衝裝置44。,依據儲存於記憶裝置“Ο之各個K 喊結果\重新排列收納凹部461的配列,使得同 列丄致I < IC凡件和第2移载臂430的吸附頭433之配 ::如’在本實施型態中,因為在帛2移載臂43〇配列 1 6订之12個吸附頭433,所以緩衝裝置440驅動各S 2247-9429-PF1 17 Ι3548〇α 097105700 No. 117 of October 100 Correction replacement page. The movable arm 421 that reciprocates on the track 411; the movable head supported by the movable arm AM and movable in the X-axis direction 422: 1 to 6 adsorption heads 423 of 2 columns and 8 rows are arranged downward on the movable head. Each of the adsorption heads 423 can be moved up and down along the z-axis direction by an actuator not specifically shown, and the 16 IC elements can be transferred from the test carrier tray tst to the buffer device 440 at a time. Further, in the present invention, the number of the adsorption heads 423 which the transfer arm has can be arbitrarily set. The second transfer arm 430 includes: a movable arm 431 located between the buffer device 44A and the four guest carrying trays KST respectively located at the four window portions 406, and reciprocally movable on the rail 411; supported by the movable arm 431 And a movable head 432 which is movable in the X-axis direction; and a suction head 433 which is mounted downward on the movable head 422. In the second transfer arm 430, unlike the i-th transfer arm 42A, the twelve adsorption heads 433 are arranged on the lower side of the movable head 432 in two rows and six rows. Each of the adsorption heads 433 can be moved up and down along the z-axis by an actuator (not shown), and can move 12 Ic elements from the buffer device 440 to the guest carrier KS1 at a time. In the present invention, the number of the adsorption heads 433 of the second transfer arm 430 can be arbitrarily set. As shown in FIGS. 1 and 5, the buffer device 440 has four sets of buffer units 450, which are configured by linearly forming a moving member 460 that can accommodate eight housing recesses 461 of the IC component, and a driving device 47A. The moving element 460 is moved in the longitudinal direction by the ball screw, and the buffer unit 4500 is arranged in parallel with each other. As a result, the 32 storage units 4 61 are arranged in a matrix of four rows and eight rows. Furthermore, in the present invention, the number and arrangement of the housing recesses 461 of the buffering device 2247-9429-PF1 18 TM TM loo loo ί ί 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 For the first! It is preferable that the transfer arm 42 has an integral multiple of the amount of the adsorption head milk. Each of the housing recesses 461 of the α-moving member 460 is surrounded by a peripheral surface of the recess 4 as shown in the U-shape. When the K-element is dropped by the component transfer device 410 in the housing recess 461, ic The spacing between the components is substantially fixed. The underside of the moving member 460 is secured by a ball screw adapter 462 having a female thread inserted into the steel ball. The driving device 470, as shown in the same figure, is composed of: a drive shaft 471 forming a male thread of a female screw of the ball screw adapter 462; and a motor for driving the drive shaft 471 to rotate: maintaining the drive shaft d The money piece can be freely rotated by the bearing m. The ball screw structure is constituted by the drive shaft 471 and the ball screw/stolen 462 by inserting a steel ball between the opposing male screw 2 male threads. As shown in Fig. 8, the control unit 5 is connected to the control unit 0 of the processor 1, and the control unit 5 is configured to perform the operation 'which can move by one unit 2 at intervals between the housing recesses 461. The component is shifted. Furthermore, the control device can independently control the motors of the four buffer units. The buffer device 44. According to the arrangement of the storage unit 461 in the memory device, the arrangement of the storage recesses 461 is arranged such that the alignment of the IC and the adsorption head 433 of the second transfer arm 430 are as follows: In the present embodiment, since the 12 adsorption heads 433 are arranged in the 帛 2 transfer arm 43 1, the buffer device 440 drives each
S 2247-9429-PFl 19 135480(^ 097105700號 100年10月11日修正替換頁· 馬達472,使得32個收納凹部461中,收納了同一測試結 果之ic元件的收納凹部461配置為2列6行。 再者在第2移載臂430配置有m列η行之ηιχη個吸 附頭433 &情況下’,緩衝裝置440驅動各馬it 472,使得 配置為p列q行之pxq個收納凹部461中收納了同一測 6式結果之IC元件的收納凹杳P 461配置為m列n行。但m、 n P、q均為自然數,mgp且ngQ。 緩衝裝置440 ’係設置於卸載部4〇〇中測試承載盤 和位於窗部4G6的客端承載盤KST之間’在本實施型態令, 第γ移載臂420將測試完畢的IC元件從測試承載盤tst移 至緩衝裝S 44。的收納凹部461,當緩衝裝χ 44。重新排 歹He TL件之後,第2移載臂,將該元件移載到對 應於測試結果的客端承載盤。 d省略其圖示’各個窗部權的下侧,設有用以使 广承載盤KST升降的升降台,藉此,得滿載了測試完畢 :件之客端承載盤KSTT降’將該滿載的承載盤送 栽盤移送臂205。 軒對在卸載部400中,將測試完畢的 、 ......_ /U 节 /忒承载盤TST移載到客端承載盤KST的方法。 in㈣㈣本發明之電子元件移載方法之第1實施例 件圖,第13A及13β圖顯示依據本發明之電子元 穿置之Μ 1實施例中重新排列收納部之前後的緩衝 衣罝之概略平面圖。 ““式承載盤TST位於卸載部時如第12圖所 2247^9429-PFl 20 出棚0第-_號 100年丨0月]丨日修正替換頁 示’元件移裁裝置410的楚7 # 元件從測試承載盤TST衫☆戴臂420將測試70畢的ic 移載到緩衝裝置4 4 0的各收納凹部 461。此時,第] 載臂420將測試承載盤TST中配置為2 列8行之1 6個j c开杜 ^ 牛’一二人移動到緩衝裝置44〇而不論 1C元件的測試結果。 有在本例中,因為缓衝裝置440 具有的收納凹部4fi丨献@ , 置為4列8行,所以執行2次移载 動作,以使緩衝裝置44G的收納凹部461滿載κ元件。 :繼之’緩衝裝置440重新排列收納凹部461的配置, 使得同一的測試έ士罢沾τ Γ ^ 。果的iC7G件和第2移載臂430具有之吸 附頭433的配列—致。 八體。之,例如第13A圖所示’緩衝裝置440且有之 共32個收納凹部461中,""行、…行' “"行 的收納凹部461中收納了種類2的1(:元件,3列7行的收 :凹:461中收納了種類3的1C元件,而其他的收納凹部 均收納了種類1的IC元件的情況下,如第13B圖 所不’使第2列的緩衝單元45Q向圖中左方向移動i間隔, 並使第3列的緩衝單元45〇向圖中右方向移動】間隔。藉 由此重新排列,如在第13B圖中之虛線所圍的範圍一般, 形成了 2組配置為2歹"行之種類以測試結果之以元件。 題一=祕例如,種類1的1C元件,其測試結果為良品之 頁不向速性能的Ic元件,種類 兀件,其測試結果 為良-之顯示低速性能的IC元件,種類3的】,立 測試結果為不良品之I c元件。 、 繼之’如第12圖所示,元件移載裝置410的第2移載S 2247-9429-PF1 19 135480 (^ 097105700, October 11th, 100th, revised replacement page, motor 472, in which the storage recess 461 of the ic element in which the same test result is accommodated among the 32 housing recesses 461 is arranged in two columns 6 Further, in the case where the second transfer arm 430 is provided with m columns η rows of ηιχη adsorption heads 433 &, the buffer device 440 drives the horses 472 so that the pxq storage recesses are arranged in p columns and q rows. The storage recesses P 461 of the IC elements in which the same type 6 result is stored in 461 are arranged in m rows and n rows. However, m, n P, and q are all natural numbers, mgp and ngQ. The buffer device 440 ' is provided in the unloading section. Between the test carrier and the guest carrier KST located in the window portion 4G6, in the present embodiment, the gamma transfer arm 420 moves the tested IC component from the test carrier tray tst to the buffer device S. 44. The storage recess 461, when the buffer device 44. After the He TL device is re-discharged, the second transfer arm transfers the component to the guest carrier disk corresponding to the test result. On the lower side of the window portion, there is a lifting platform for lifting and lowering the wide tray KST, thereby being fully loaded. Trial completed: the guest carrier KSTT of the piece is transferred to the fully loaded carrier tray to the arm 205. Xuan is in the unloading unit 400, the test is completed, ... _ / U section / 忒A method for transferring a carrier TST to a guest carrier KST. In (4) (d) A first embodiment of the electronic component transfer method of the present invention, and FIGS. 13A and 13β show an electron cell insertion according to the present invention. A schematic plan view of the cushioning vestibule before and after rearranging the accommodating section. "When the type of carrier tray TST is located in the unloading section, as shown in Fig. 12, 2247^9429-PFl 20 shed 0 - _ 100 years 丨 0 month 丨The daily correction replacement page shows that the component 7 of the component transfer device 410 is transferred from the test carrier TST shirt ☆ the arm 420 to the storage recess 461 of the buffer device 480. At this time, The carrier arm 420 moves the sixteen columns of the test carrier TST configured into two columns and eight rows to move the buffer device 44〇 regardless of the test result of the 1C component. In this example, because The buffering device 440 has a housing recess 4f, which is set to 4 rows and 8 rows, so that the transfer operation is performed twice to buffer The accommodating recess 461 of the 44G is fully loaded with the κ element. Then, the damper device 440 rearranges the arrangement of the accommodating recesses 461 so that the same test gentleman is stuck with τ Γ ^. The iC7G member and the second transfer arm 430 have The arrangement of the adsorption heads 433 is such that, for example, the buffer device 440 shown in Fig. 13A and the total of 32 storage recesses 461, ""row,...row" In the 461, the type 1 (: element, 3 rows and 7 rows of the reception: recess: 461 contains the type 1 1C element, and the other storage recesses accommodate the type 1 IC element. In the case of FIG. 13B, the buffer unit 45Q of the second column is shifted by i in the left direction in the drawing, and the buffer unit 45 of the third column is moved to the right in the drawing. By rearranging from this, as in the range enclosed by the broken line in Fig. 13B, two sets of elements are arranged in the form of 2歹" Question 1 = Secret, for example, the 1C component of the type 1 is tested as a result of a low-speed Ic component, a type of component, and the test result is a good-display IC component of low-speed performance, type 3] The test results are the I c components of the defective product. Then, as shown in Fig. 12, the second transfer of the component transfer device 410
S 21 2247-9429-PF1 丄以關 第097105700號 100年10月Π臼修正替換頁 臂430’將配置為2列R >仅 b仃之種類丨的測試結果之1(: 從緩衝裝置440移載至,丨料 哥至】對應於種類1的客端承載盤KST。 此時’可以將種類1的 盤KST。 12個IC儿件一次移載到客端承載 _如上所述,在本實施型態中,藉由使同—測試結果之 1C元件和第2移载臂ΜίΐίΛ n 戰# 430的吸附頭433之配列—致而 得在卸載部400可以兹士 , 稭由一。人的降落而將所有的吸附 433都吸附了 ic开杜 Τ ^ 曰 ,而能夠提高電子元件測試裝置的產 量。 第14Α及14Β圖顯示依據本發明之電子元件移載方法 之弟2實施例中重新排列收納部之前後的緩衝裝置之概略 平面圖。 在本發明電子元件移載方法之第2實施例中,雖缺並 未特別圖示’但第2移載臂43。配置有""行的8個吸 附頭433,此點和第1實雜 乐丄貫%型態不同,其他構成均和 實施型態相同。 在本實施型態令,也和第1實施型態-樣,在卸载部 樹中第1移载臂42〇將測試完畢的IC元件從測試承載盤 m移至緩衝裝置權,當緩衝裝置物重新排列ic元件 之後’第2移載臂430 ’將該ic元件從緩衝裝置⑽移载 到對應於測試結果的客端承载盤KST。 在本實施型態中’當以件重新排列時,如第及 ⑽圖所示’緩衝裝置重新排列收納凹部461的配列, 使得收納了同_測試結果之Ic元件的收納凹部仙S 21 2247-9429-PF1 丄 关 097105700# October 100 Π臼 Correction replacement page arm 430' will be configured as 2 columns R > only b仃 of the type 测试 test result 1 (: from buffer device 440 Transfer to, the 哥 哥 哥 】 corresponds to the type 1 of the passenger carrier KST. At this time 'can be type 1 disk KST. 12 IC pieces are transferred to the client carrier at a time _ as described above, in this In the implementation type, by the arrangement of the 1C component of the same test result and the adsorption head 433 of the 2nd transfer arm ΜίΐίΛ n 战# 430, it is possible to obtain the stalk in the unloading section 400. Landing and absorbing all of the adsorption 433 adsorbs the ic open Τ 曰 曰 曰 曰 曰 曰 曰 曰 曰 能够 能够 能够 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A schematic plan view of the buffer device before and after the accommodating portion. In the second embodiment of the electronic component transfer method of the present invention, the second transfer arm 43 is not particularly illustrated, but the "" 8 adsorption heads 433, this point is different from the first type of solid music type, other In the present embodiment, as in the first embodiment, the first transfer arm 42 in the unloading section tree moves the tested IC component from the test carrier m to The buffer device weight, after the buffer device rearranges the ic element, the 'second transfer arm 430' transfers the ic element from the buffer device (10) to the guest carrier disk KST corresponding to the test result. In this embodiment When the pieces are rearranged, as shown in the figure (10), the cushioning device rearranges the arrangement of the housing recesses 461, so that the housing recessed portion of the Ic component that accommodates the same test result is stored.
S 2247-9429-PF1 22 100年〗0月11日修正替換胃 I3548(KU靡◦號 1列8行。 具體言之,例如第14Α圖所示,緩衝裝置44〇具有之 共32個收納凹部461中,1列8行、2列2行、3列i行、 及4列1行中收納了種類2的IC元件,3列6行中收納了 種類3的IC tl件,而其他的收納凹部461中則均收納了種 類1的ic元件的情況下,如第14B圖所示,使第2列的緩 衝單元450向圖中上方移動1間隔。藉由此重新排列,如 在第14B圖中之虛線所圍的範圍一般,形成了匕组配置為 1列8行之種類1的測試結果之IC元件。 如上所述,在本實施型態中,藉由使同一測試結果之 1C元件和第2移載臂43G的吸附頭挪之配列—致,而使 得在卸載冑400 $以藉由—次的降落而將所有的吸附頭 433都吸附了 ic元件’而能夠提高電子元件測試裝置的 量。 生 再者上述說明的實施例,係記載用以使得容易理解 本發明’並非記載用於限定本發明。因此,上述實施例中 揭露之各要素,包含屬於本發明技術領域内所有的 更或均等物。 社在上述實施例中,在缓衝裝置440中,係使同一測試 結果之IC元件和第2移載臂43〇的吸附頭似之配列— 致:但本發明並不特別限定於此,藉由使同一測試結果之 IC το件和第2移載臂43()的吸附頭似之部分配列一致, 也可以使卸载部中降落的次數減少。 再者,在上述實施型態中,在緩衝褒置44〇,係說明 2247-9429--PF1 23S 2247-9429-PF1 22 100 years 〖August 11th revised replacement stomach I3548 (KU 1 1 column 8 rows. Specifically, for example, as shown in Figure 14 , the buffer device 44 〇 has a total of 32 storage recesses In the 461, the IC element of the type 2 is accommodated in one row, eight rows, two rows, two rows, two rows, and four rows and one row, and the ICs of the type 3 are accommodated in three rows and six rows, and other storages are accommodated. When the ic element of the type 1 is accommodated in each of the recesses 461, as shown in Fig. 14B, the buffer unit 450 of the second row is moved upward by one space in the figure, thereby being rearranged as shown in Fig. 14B. In the range in which the dotted line is generally formed, an IC component in which the test result of the type 1 of the column 1 is arranged in one column and eight rows is formed. As described above, in the present embodiment, the 1C component of the same test result is The adsorption head of the second transfer arm 43G is arranged so that the ic element is adsorbed by all the adsorption heads 433 by unloading the 胄400$ by the gradual landing, and the electronic component test apparatus can be improved. The embodiments described above are described to make the invention easier to understand. Therefore, the elements disclosed in the above embodiments include all the more or equal objects belonging to the technical field of the present invention. In the above embodiment, in the buffer device 440, the IC components of the same test result are The adsorption head of the second transfer arm 43A is arranged as if it were - but the present invention is not particularly limited thereto, and the IC τ of the same test result and the adsorption head of the second transfer arm 43 () are similar. In some embodiments, the number of landings in the unloading portion can be reduced. Further, in the above embodiment, in the buffering device 44, the description is 2247-9429--PF1 23
S :收納…61僅於縱向或橫向之一方向移動但本發明 :特:定於此。例如,藉由可以切換構成縱方向的緩 之收納凹部461之間的連結,以及構成橫方向 ㈣…50之收納凹部461之間的連結,也 ^個緩衝裝置權令使收納凹部461在縱橫兩種方向^ 【圖式簡單說明】 2 1圖顯示依據本發明第i實施例之電子元件 置的概略剖面圖。 教 施例之電子元件測試裝 第2圖顯示依據本發明第1實 置的斜視圖。 第3圖顯示依據本發明第i實施例之 置中承《之處理的概念^ 第4圖顯示使用本發明第i實施例之電 置的:c倉儲之分解斜视圖。 "“裳 用之2圖顯不本發明第1實施例之電子元件測試裝置使 用之的客端承載盤之斜視圖。 置使 第6圖县自 使 .,、、負不本發明第1實施例之電子元件 用的測試㈣k切斜_。S: Storage 61 is only moved in one of the longitudinal direction or the lateral direction. However, the present invention: For example, by arranging the connection between the accommodating recesses 461 constituting the longitudinal direction and the connection between the accommodating recesses 461 constituting the lateral direction (four) ... 50, the damper device constituting the accommodating recess 461 in the vertical and horizontal directions Directions ^ BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing an electronic component according to an i-th embodiment of the present invention. Electronic component test package of the teachings Fig. 2 is a perspective view showing the first embodiment of the present invention. Fig. 3 is a view showing the concept of processing according to the first embodiment of the present invention. Fig. 4 is an exploded perspective view showing the storage of the i-th embodiment using the present invention. "" 2 shows a perspective view of a guest carrying tray used in the electronic component testing apparatus of the first embodiment of the present invention. The sixth drawing of the county is self-contained, and the negative is not the first invention. The test for the electronic component of the embodiment (4) k-cut oblique_.
第7圖齄+ > U μ依據本發明 實施例之電子 置的載人一平。 ^或裝 第8圖顯;# & ^ '、依據本發明第1實施例之電子元件 置的控制系 统的方 塊圖 測試裝 2247-9429-PF1Fig. 7 齄 + > U μ According to the embodiment of the present invention, the electronic one is mounted. Or, Fig. 8 shows the block diagram of the control system of the electronic component according to the first embodiment of the present invention. Test device 2247-9429-PF1
S 24 1354800 第9圖顯示依據本發明第1實施例之電子1 置的卸載部的平面圖。 70件剩試裝 第10圖顯示設置於第9圖所 平面圖。 ,、载°卩的緩衝裝置之 第11圖顯示第1〇圖之緩 裒置的斷面圖。 第12圖顯示依據本發明之 施例之概略平面圖。 夕 方法之第1實 第13A圖顯示依據本發明之電子元件 實施例中重新排列收納部去之弟1 巧j〜%衝裝置之概略 第13B圖顯示依據本發 。 實施例中重新排列收納部去之第1 〜便町緩衝裝置之概略平 第14Λ圖顯示依據本發 。 貫施例中重新排列收納部 之第2 <月』扪鲮衝裝置之概略平 第14B圖顯示依擔太恭0日+办 佤據本發明之電子元件移載方法之S 24 1354800 Fig. 9 is a plan view showing the unloading portion of the electronic device 1 according to the first embodiment of the present invention. 70 pieces of remaining test pieces Figure 10 shows the plan view set in Figure 9. Fig. 11 is a sectional view showing the buffer of the first drawing. Figure 12 shows a schematic plan view of an embodiment in accordance with the present invention. The first embodiment of the method of the present invention is shown in Fig. 13A. Fig. 13B is a view showing the outline of the rearrangement of the storage unit in the embodiment of the electronic component according to the present invention. In the embodiment, the first ~ 便 町 缓冲 缓冲 缓冲 缓冲 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第In the embodiment, the second <month" 扪鲮 扪鲮 之 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 依 依 依 依 依 依 依 依
實施例中重新排列收納A 乐Z J叹納。卩之後的緩衝裝置之概略平面圖。 【主要元件符號說明】 1 0 0〜空室部; 3 0 0〜載入部; 320〜第1移載臂; 322〜可動頭; 330〜第2移載臂; 3 3 2〜可動頭; 4 0 0〜卸載部;In the embodiment, the rearrangement and storage A music Z J sings are arranged. A schematic plan view of the buffer device after the crucible. [Main component symbol description] 1 0 0~ empty chamber portion; 3 0 0 to loading portion; 320 to 1st transfer arm; 322 to movable head; 330 to 2nd transfer arm; 3 3 2 to movable head; 4 0 0~unloading department;
S 1〜處理機; 2 0 0〜收納部; 310〜元件移載裝置; 321〜可動臂; 323〜吸附頭; 33卜可動臂; 333〜吸附頭; 2247-9429-PF1 25 1354800 410〜元件移載裝置; 420〜第1移載臂; 430〜第2移載臂; 440〜緩衝裝置; 450〜緩衝單元; 460〜移動元件; 4 61〜收納凹部; 462~滾珠螺桿轉接器; 470〜驅動裝置; 47卜驅動軸; 4 7 2 ~馬達; 4 7 3 ~袖承; 500~控制裝置; 51 0 ~記憶裝置; 5〜測試頭; 6〜測試裝置。 2247-9429-PF1 26S 1 to processor; 2 0 0 to accommodating portion; 310 to component transfer device; 321 to movable arm; 323 to adsorption head; 33 to movable arm; 333 to adsorption head; 2247-9429-PF1 25 1354800 410 to element Transfer device; 420~1st transfer arm; 430~2nd transfer arm; 440~buffering device; 450~buffering unit; 460~moving element; 4 61~receiving recess; 462~ball screw adapter; ~ drive unit; 47 drive shaft; 4 7 2 ~ motor; 4 7 3 ~ sleeve; 500 ~ control device; 51 0 ~ memory device; 5 ~ test head; 6 ~ test device. 2247-9429-PF1 26
Claims (1)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/054667 WO2008126164A1 (en) | 2007-03-09 | 2007-03-09 | Electronic component testing apparatus and method for transferring electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200907369A TW200907369A (en) | 2009-02-16 |
TWI354800B true TWI354800B (en) | 2011-12-21 |
Family
ID=39863348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097105700A TW200907369A (en) | 2007-03-09 | 2008-02-19 | Electronic component testing apparatus and method for transferring electronic component |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200907369A (en) |
WO (1) | WO2008126164A1 (en) |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08292233A (en) * | 1995-04-25 | 1996-11-05 | Hitachi Ltd | Ic handler |
JPH08334548A (en) * | 1995-06-07 | 1996-12-17 | Tokyo Electron Ltd | Inspection apparatus |
-
2007
- 2007-03-09 WO PCT/JP2007/054667 patent/WO2008126164A1/en active Application Filing
-
2008
- 2008-02-19 TW TW097105700A patent/TW200907369A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200907369A (en) | 2009-02-16 |
WO2008126164A1 (en) | 2008-10-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW378191B (en) | Tray take out device for IC and tray storage device for IC | |
US7876089B2 (en) | Test handler, method for loading and manufacturing packaged chips, and method for transferring test trays | |
JP3759579B2 (en) | RAM bus handler (Rambushandler) | |
TWI337167B (en) | ||
TW200945482A (en) | Test handler, method for unloading and manufacturing packaged chips and method for transferring test trays | |
KR101452111B1 (en) | Test handler | |
US7583076B2 (en) | Test tray and handler using the test tray | |
TWI373626B (en) | ||
TW201000380A (en) | Electronic component handling apparatus, electronic component test apparatus and electronic component holding tray | |
TW200824032A (en) | Customer tray and electronic component testing apparatus | |
CN101246193B (en) | Method of transferring test trays in a handler | |
TWI354800B (en) | ||
KR101216359B1 (en) | Device inspection apparatus | |
US20090153168A1 (en) | Hi-fix board, test tray, test handler, and method for manufacturing packaged chips | |
TWI327224B (en) | ||
KR101973687B1 (en) | Device inspection apparatus | |
TWI490970B (en) | A pallet handling device, and an electronic component testing device provided with the device | |
TWI385750B (en) | An electronic component shifting device and an electronic component testing device having the same | |
JPH11287843A (en) | Ic-tester | |
KR101406184B1 (en) | A Semiconductor Tranferring Device and Test handler using thereof | |
CN100416286C (en) | Electronic component test device | |
TWI398638B (en) | A method of removing the electronic component, and a control program for carrying out the method | |
US11802905B2 (en) | System level test device for memory | |
KR101262208B1 (en) | Hi-Fix Board | |
TW200843020A (en) | Method for replacing tray |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |