TWI354800B - - Google Patents

Description

[Technical Field] The present invention relates to an electronic component testing apparatus, which is used for various electronic components (hereinafter collectively referred to as "components") and test heads for semiconductor integrated circuit components and the like. The contacts are electrically contacted to test the 1C component. [Prior Art] In the manufacturing process of electronic components such as 1C 70 pieces, the test device was tested to test the performance or function of the packaged state of the Tr _ 4 package state. It constitutes the imaginary part of the electronic parts testing device. The processor includes: a loading part of the manned part, the empty part part, and the unloading machine, and the 1C element is taken from the 1C component for accommodating the test by the transfer of the leap second warfare device, or is stored in the next day. * The carrier of the Λ 毕 Κ兀 ( ( 以 以 以 ( ( ( ( ( 电子 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载 承载After the force, each of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Test device) Perform the test. In the test completion of the IC 7L piece: 1I moxibustion, will carry the test of the I c element of the completed test 4, and the test will be completed from the empty L-transfer device Ic _ i Unloading Department' in the unloading section by the client bearer 2 of the test result: transfer from the test bearer to the corresponding score. Areas for performing good and defective products

S 224 7-9429-PF1 5 1354800 The firefly set in this type of processor enters Qiuqi^. The transfer device of the 卩 or unloading section is provided with a plurality of adsorption heads such as 8, 12, 16 and the like, for adsorbing and maintaining the 1C component. Therefore, in the loading section, for example, from the Xuan # 2 a guest carrier, the eight IC components are simultaneously adsorbed and moved, and the susceptor is moved directly to the susceptor. Loaded. That is to say, the loading of the loading part can be expanded, and the lifting operation of the loading tray can be performed by a single lifting operation of the carrier (hereinafter only + & μ ^, and the setting of the handle is reduced) The IC. component adsorption was maintained on all of the adsorption heads. In contrast to this, in the unloading, Tian Yanp has to perform the transfer of the carrier disk at the same time as the classification of the test results. Therefore, for example, the ic component of the same test result is zero. In the case of zero landing on the test carrier, 'must be tested 8 times in the test carrier (four), only (four) le (four)

Adsorption on all of the adsorption heads, and the addition of A and A A, is one of the reasons for the decrease in the output of the electronic component test apparatus. Disclosure of the Invention Problems to be Solved by the Invention The present invention aims to provide an electronic component testing device and an electronic component transfer method which can reduce the number of landings and increase the yield. Means for Solving the Problem (1) In order to achieve the above object, according to the first aspect of the present invention, a dice test device is provided which electrically contacts an input/output terminal of a tested electronic component with a head: contact portion to perform the The ^"with/rearrangement device of the electronic component to be tested includes: a plurality of storage portions, which can be, 2247-9429-PF1 w I vf V/f, 097 丨05700, 100 years] 〇月日修正_ _ The electronic component to be tested; ^ ψ M ^ W The mobile device moves the storage unit to the rearrangement device, and the storage portion is placed by the movement for one second. The apparatus moves the accommodating portion, and the rearrangement is not particularly limited in the above-described invention, but it is estimated that the rearrangement device has a good hand. The plurality of storage units are arranged in a matrix. The mobile device is arranged to move in the 〇Λ-direction. The storage unit on the column or the question-line is not adjacent to the above invention. (4) - It is preferable that the interval between the accommodating portions is - the unit and the storage is not particularly limited in the case of the escaping invention, and it is preferable that the accommodating portion is provided Storing the re-arrangement of the electronic device; the J device rearranges the accommodating portion so that the same test electronic component is continuously side by side in the same column or on the same line in the above invention and It is better to: 第 : : 疋 : : : : : : : : : : : : : : : : : : : : : : : : : : : 第 第 第 第 第 第 第 第 第 第 第 第 第The rearrangement device; on the eve of the day, it is shaken from the rearrangement to maintain the Test the electronic component and transfer it to the handle to measure the second carrier of the tested electronic component, the second transfer device and the right field & dimension (4) holding the electronic component to be tested Zhan Naiqiu: Port 2 is configured as ^11 rows; the rearrangement device rearranges the receipts, ... so that the tested electronic components of the same test result are arranged in n rows. Point, provide electricity

S (2) in order to achieve the above object, according to the second aspect of the present invention 2247-9429-PF]_ 7 brother 097105700, 100 years October 11 ] repair] sub-component transfer method, based on the mine; Kai Du 7A The test result of the electronic component transfers the electronic component from the i-th carrier to the second phase 1 transfer step 'the tested electronic/, including: the plural number is transferred from the first carrier to the plural Storage unit; rearrangement step, 1 autumn, V. . _ , , /, 9 by moving the storage unit that accommodates the tested lightning element, and re-arranging the arrangement of the storage unit; second child In the step, the tested electronic component is transferred to the disk. The transfer of the h piece from the storage portion to the second support is not particularly limited to the above invention, and it is preferable that in the rearrangement v, the plurality of storage portions are arranged on the same line. ...in a matrix shape, the storage portion disposed on the same door sill moves in the same direction. The above invention is not particularly limited, but it is preferable that the accommodating portion is adjacent to each other in the step. It is preferable that the π is moved only in the above invention, and it is preferable that the accommodating portion stores the tested portion of the sputum in the rearrangement step. The accommodating portions are rearranged such that the same electronic component of the same, "4,," is continuously side by side in a certain number on the same column or the same row. The invention is not particularly limited, and it is preferable that the s-type electronic component to be transferred from the accommodating portion to the transfer device of the second carrier has a configuration for maintaining the electronic component to be tested as The mxn mxn sustaining portions of the m rows are arranged, and in the rearranging step, the (four) nanoparts are rearranged so that the tested electronic components of the same test result are arranged in a "歹" row. Advantageous Effects of Invention In the present invention, the storage portion of the cooked 2247-9429-PF1 8 丄妁480, 0 in which the electronic component to be tested is housed is rearranged. By 'rearranging the male and female wares that store the electronic component to be tested and the transfer device, the same test result is used to maintain the number of times in the unloading portion, and it is maintained at all the maintenance portions. The amount of electronic components being tested. Production of daytime electronic component testing device [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a schematic cross-sectional view showing an electronic component testing apparatus according to an elliptical embodiment of the first embodiment of the present invention. FIG. 2 is a perspective view showing a vibration of a sub-element test, and FIG. 3 is the first example of the K-month. The electric power is also not in accordance with the first embodiment of the present invention. The electronic component test is installed in the conceptual diagram of a $^ 承载τ carrier disk. The third figure is used to understand the lightning-disc In the diagram of the processing method, in fact, the load-bearing work in the 70-piece test device actually includes the components arranged side by side in the up and down direction, and the portion 4 is not the flat portion. The second figure illustrates the mechanical (stereoscopic The structure is referred to as the electronic riding test device of the mode type, in which the test is performed in a state in which the temperature of the second element or the low temperature is applied to the element, and it is checked whether the claw element is properly operated, according to the test. #IC component classification device, which is composed of a processor 1, a test head 5, and a measurement unit 6. The electronic element

The test of the IC component of the test device is carried out by transferring the IC 70 from the guest carrier KST to the test carrier TST by 丨c % 4 # # , 4 . Therefore, the processor 1 of the present embodiment has the following configuration as shown in Figs. 1 to 3: the accommodating portion 200' accommodates the member before the load test or the test 2247-9429-PF1 9

The client carrier KST of the C TL component of S; the loading unit 300 moves the Ic component transmitted from the storage 200 to the test carrier tray tst and sends it to the empty chamber section 3劂 test head 5, which is carried on the test carrier TST In the state, the empty chamber part 1 of the K-test is executed. 〇 ; Unloading section 40. After the test is completed, the parts are moved out from the ι to the part 100, sorted and moved to the client carrier KST at the same time. The test stand 50 provided on the test head 1 is connected to the test device 2' through the electric wire 7 shown in FIG. 1 through the electric wire 7 to connect the C 7G piece electrically connected to the test stand 50 to the test device 6. The Ic component is measured by the test signal of the test device 6. Further, as shown in the figure, a space 8 is provided in a portion of the lower portion of the processor 1, and the test head 5 is disposed in a replaceable manner, and is formed on the device substrate of the processor i. The opening allows the IC component and the test socket 50 on the test head 5 to be electrically connected. When the type of the IC element is changed, it is replaced with a test head having a test socket suitable for the shape of the ic element of this type, the number of pins, and the like. The following is a detailed description of each part of the processor 1. [Storage part 200] Fig. 4 is a perspective view showing the 1C storage of the electronic component testing apparatus according to the first embodiment of the present invention. FIG. 5 is a view showing the passenger bearing used in the electronic component testing apparatus of the i-th embodiment of the present invention. Oblique view of the disc. ..."includes: Ic warehousing 2〇1 before the test, for accommodating the passenger carrying disk carrying the test-type 1C component; testing the IC storage tearing, for accommodating the IC component that is classified according to the test result Test the carrier. 10 1 2 2247-9429-PF1 I3548Q0 October 11th, 100th revised replacement page No. 0'97105700, these warehouses 201, 202, as shown in Figure 4, contain: frame-shaped carrier support frame 203. From the lower portion of the carrier support frame 203, the elevator platform 204 can be lifted up and down. A plurality of client carrier disks KST are stacked on the carrier tray support frame 203, and only the stacked client carrier disks KST are borrowed. In the present embodiment, the 'passenger carrier KST, as shown in FIG. 5, is arranged with 10 rows x 6 rows of 60 storage portions 3 3 for accommodating the Ic component, However, in fact, there are various variations in the configuration of the 1C component. The 1C warehousing 201 and the 1C warehousing 202 are the same structure before the test. Therefore, the appropriate number of pre-test 1C warehousing 201 and testing can be set as needed. The number of individual storages in the 1C warehouse is 202. In this embodiment 'As shown in Figure 2 and Figure 3, there are 2 storage STK-Bs on the Ic storage 201 before the test, and there is an empty carrier storage STK-E next to it. The individual empty carrier storage STK-E stacks The empty passenger carrier KST transmitted by the unloading unit 4〇〇. The empty carrier disk storage STK-E next to the test, the ic storage 202 **·«· has 8 storage STK-1, STK-2... ...STK-8 'can correspond to the results of the test, can be divided into 8 categories of storage, in addition to the difference between good and bad products, 'good products can be divided into West speed products, medium speed products, low speed products, bad goods Further, it can be divided into those who need to be retested, etc. [Loading unit 300] Fig. 6 is an exploded perspective view showing the test carrier used for the electronic component of the first embodiment of the present invention, and the 4 & , Figure 7 shows the basis of 'Mingdi

S 2247-9429-PF1 11 1354803⁄4 097105700 A plan view of the loading portion of the electronic component testing device of the embodiment of the present invention. The above-described guest carrier KST is transported from the lower side of the device base 101 to the two window portions of the loading unit 300 by the carrier moving arm 205 provided between the housing unit 200 and the mounting substrate 101. Moreover, at the loading portion 300', when the component carrying device 304 transfers the Ic component stacked in the guest carrier tray KST to the aligner 305, the component is corrected after the mutual positional relationship of the components. The handling device 304 then accumulates the 1 C component transferred to the aligner 305 on the test carrier tray TST where the loading unit 300 is stopped. As shown in FIG. 6, the pallet 13 is laid flat and equally spaced in the square frame 12, both sides of the pallet 13 and the square frame 12 opposite to the pallet 13 On the side 12a, the mounting piece 14 is formed at equal intervals, and the interposer receiving portion 5 is formed by the two mounting pieces 14 between the pallets 3 and between the pallets 3 and 1 2a. In each of the insert accommodating portions 15, one insert 16 is accommodated, and the insert 16 is placed on the mounting sheet 14 in a floating state using the fastener 17. Therefore, on both ends of the insert 16, a mounting hole 1 for mounting the insert 16 to the mounting piece 14 is formed. The insert 16 is as shown in Fig. 6, in one There are 64 test carrier trays TST, which are configured as 4 columns and 16 rows. Further, each of the inserts 16 has the same shape and the same size, and the 1C elements are housed in the individual inserts 16 respectively. The 1C housing portion 18 of the insert 16 is determined in accordance with the shape of the IC component to be housed, and is a square concave shape in the example shown in Fig. 6. The loading unit 300, as shown in FIG. 7, has a component handling device 310 for stacking the IC component from the guest carrier KST and stacking it on the test carrier 2247-9429-PF1 12 No. 0.97105700 for 100 years. 〗 〖Yueyue 1st revised replacement page tst. The 搬运 搬运 〇 〇 〇 由 由 由 由 由 由 由 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Transfer arm·, 33〇. The first move is '32. The utility model has two client-side carrier disks KST located at two window portions 3〇6 and a movable arm of the test portion 300 of the test carrier tray TST, which can reciprocate on the track 311; The movable head 322 supported by the arm 321 and movable in the direction of the x-axis; the movable head + downwardly arranged in two rows and eight rows of i 6 adsorption heads 323. Each of the adsorption masters 323 can be moved up and down along the Z-axis direction by means of an actuator not specifically illustrated, and 16 (1) components can be transferred from the guest carrier tray to the test carrier tray tst. The A transfer 4s 330 also has two client-side carrier disks kst located at two window portions and is disposed between the test carrier trays TST located at the loading unit 3, and can be reciprocated on the road 311. The movable movable arm 331; the movable head 332 which is controlled by the movable arm 331 and movable in the X-axis direction; the movable head 322 is downwardly gp. The force is set. - Set to 2 columns and 8 rows of 16 The adsorption head 333 can be moved up and down along the Z-axis by actuators not specifically shown, and the 16 ic elements can be transferred from the passenger carrier KST to the test carrier TST. The first transfer arm 320 and the second transfer arm 330 are selected by the same set of tracks 3U. The first transfer arm and the second transfer arm 33A are firstly transferred in FIG. The arm 320 is disposed on the lower side and the second transfer arm 330 is disposed on the upper side, and is arranged side by side along the direction on the rail 311. In the present embodiment, the component transfer device 3, the first] The carrier arm (4) and the 2247-9429-PF1 13^1354800 2nd transfer arm 330 can simultaneously approach the same guest carrier disk κ§τ or the same test carrier TST. That is, the first transfer arm 320 is sucked by (4) 323 adsorbs 16 ic components from the guest carrier KST, and moves the IC component to release the adsorption of the adsorption pad 323 to place the IC component on the test carrier. At the same time, the second transfer arm 330 is adsorbed. The pad 333 adsorbs 16 1C components from the same guest carrier KST, and moves the 1C component by another amount, then releases the adsorption of the adsorption 塾333 and places the IC components on the same test carrier TST. Thus, the component transfer device 31 is maintained at the same size as in the past, and can be multiplied by its carrying capacity. ... Again, as shown in Figures 1 and 7, on the guest carrier KST and the test carrier There are two aligners 3〇5 between the TSTs. Each aligner has a relatively deep recess (not shown), the peripheral edge of which is inclined

surface. Therefore, in moving the client carrier disk KST to the test carrier disk TST: second: cattle, before moving to the test carrier disk TST, as long as it falls into the alignment benefit 3 0 5 ' can be correctly determined _ The positional relationship between the 1C components is determined, and this is enough to accurately stack the κ components on the test carrier. In the first shift, the aligner 305 on the lower side in Fig. 7 is a pair of soap hoppers dedicated to the first transfer arm 320, and the alignment 305 on the upper side of the same pattern is An aligner dedicated to the second transfer arm 330. When all the accommodating portions 18 of the test carrier TST are (four), the carrier carrying device 1 〇 2 is passed into the empty chamber portion (10). Handling the test carrier TST on the other hand 'when all the ic components carried on the guest end panel KST are 2247-9429-PF1

When the S 14 I3548Q0 has been transferred to the test carrier TST, the I κQT τ w汴D is used to carry the empty passenger and the empty carrier is handed over to the carrier. Inheriting the confusing soft... Zhuang Jie’s i-transfer device Pan Cangjian puts the empty carrier disk into the empty bearer STK-E, when the client (4) of the test Ic warehouse 2〇2 is filled with The empty carrier tray is supplied to the [empty chamber portion 100]. The electronic component test package of the embodiment shows a block diagram of the control system according to the first embodiment of the present invention. The test carrier TST described above is loaded into the empty chamber portion 100 after the loading unit 300 is loaded with the Ic component, and each component is tested. The component is tested while being carried on the test carrier TST. The empty chamber portion 100, as described 2 and 3, which are composed of the following: Impact chamber 11〇, applying the target high temperature or low temperature thermal pressure to the Ic component mounted on the test carrier TST; the test chamber 12〇 will be in the impact chamber The 1C element in a state in which the heat is applied is in contact with the test head 5; the shock chamber 130' removes the applied heat pressure from the ic element that has completed the test. And 'goes the impact chamber 130 to the impact chamber 1' Or the test chamber 丄 2 〇 thermal insulation is better, in fact, in the area of the impact chamber 11 〇 and the test chamber 12 维持 maintain high temperature or low temperature, to impact the chamber 〇 3 〇 and its thermal insulation, however, for the sake of convenience, these are collectively called The chamber 11 is configured to protrude above the test chamber 120. Further, as shown in FIG. 3, the impact chamber 11 is provided with a vertical transport device, up to the test chamber 120. Before the emptying, a plurality of test carrier trays TST are supported by the vertical carrier Standby. Mainly in this standby, apply _55 2247-9429-PF1 1354800 and +150 degrees of high temperature or low temperature thermal pressure to 1 (: component. In the test room 120, the test head is provided at the center. 5. The test receiving tray tst is transported to the top of the test head 5, so that the input and output terminals of the IC component and the contact pins of the test head 5 are electrically contacted to perform the test of the IC component. The test result of each IC component is as shown in the eighth. As shown, the transfer from the test device 6 to the processor is stored in the memory device 51 of the processor i, respectively, in an IC component corresponding to the identification number attached to the test carrier TST and the test carrier TST. The address determined by the number is also the impact chamber 130 and the impact t 11〇, configured to be higher than the test chamber dog, and as shown in Fig. 3, it is provided with a vertical handling device. In the case of application to the 1C element, in the de-impact to 130, after the Ic element is cooled by the air to return to the room temperature, the high-temperature removing 1C element is carried out to the unloading portion 4〇〇. In the case where low temperature is applied in the impact chamber 110 w After heating the Ic member such as a warm air or a heater to return to a temperature at which no condensed water is generated, the reheated C component is carried out to the unloading portion 400. At the upper portion of the impact chamber 11G, a test carrier m is formed. The inlet that is carried in from the device substrate 101. Similarly, the upper portion of the de-impact chamber 13 is formed to carry out the test carrier TST to the device substrate i 01 and is disposed on the device substrate 101. The test tray TST is taken in and out from the empty chamber portion 100 through the inlet and the outlet. By the carrier tray transporting device 1〇2, the test carrier tray m' carried out from the impact of $13〇 is transmitted through the unloading portion paste and the loading portion. The program is sent back to the impact chamber 110.

S 2247-9429-PF1 16 [Unloading Unit 4〇〇j FIG. 9 is a plan view showing the unloading portion according to the first embodiment of the present invention, and the first drawing shows a plan view of the buffer device installed in the apparatus, : A section view of the unloading. The cushion loading and unloading section of the figure 10 corresponds to the test result, and the IC TL piece from the vacant chamber part is measured, and the moving test carrier TST shipped from the KST〇 is transferred to the passenger carrier disk as the second. As shown in the figure, the window portion 406 of the device substrate of the unloading section is arranged such that the carrier is formed from the accommodating portion 2 so as to face the device substrate 101. P4〇〇 passenger loading and unloading department 400 packs; ^ & results, - Bi: should be tested on the carrier KST; buffer f set 44n carrier tray TST transferred to the guest test carrier TST4 β Tian Lifan Fanbi The 1C component is transferred between the re-discharge and the mass τ, and the component transfer device 410 of the U component is constructed as follows, as shown in FIG. 9 & _ device substrate 1〇1, : The second transfer arm 430 can be placed on the track (1) along the track I of the axis = erection 2 . The first transfer # GO of the movement and the sonar device 410 far from the sonar, as shown in Fig. 8, are controlled by the control device 5 of the processor i. The 4th shift test carrier 420 of the control unit 500 is controlled by the component transfer device 410. The first transfer load 420 includes: between the unloading tst and the buffer device 44〇.

S 2247-9429-PF1 17 Ι3548〇α 097105700 No. 117 of October 100 Correction replacement page. The movable arm 421 that reciprocates on the track 411; the movable head supported by the movable arm AM and movable in the X-axis direction 422: 1 to 6 adsorption heads 423 of 2 columns and 8 rows are arranged downward on the movable head. Each of the adsorption heads 423 can be moved up and down along the z-axis direction by an actuator not specifically shown, and the 16 IC elements can be transferred from the test carrier tray tst to the buffer device 440 at a time. Further, in the present invention, the number of the adsorption heads 423 which the transfer arm has can be arbitrarily set. The second transfer arm 430 includes: a movable arm 431 located between the buffer device 44A and the four guest carrying trays KST respectively located at the four window portions 406, and reciprocally movable on the rail 411; supported by the movable arm 431 And a movable head 432 which is movable in the X-axis direction; and a suction head 433 which is mounted downward on the movable head 422. In the second transfer arm 430, unlike the i-th transfer arm 42A, the twelve adsorption heads 433 are arranged on the lower side of the movable head 432 in two rows and six rows. Each of the adsorption heads 433 can be moved up and down along the z-axis by an actuator (not shown), and can move 12 Ic elements from the buffer device 440 to the guest carrier KS1 at a time. In the present invention, the number of the adsorption heads 433 of the second transfer arm 430 can be arbitrarily set. As shown in FIGS. 1 and 5, the buffer device 440 has four sets of buffer units 450, which are configured by linearly forming a moving member 460 that can accommodate eight housing recesses 461 of the IC component, and a driving device 47A. The moving element 460 is moved in the longitudinal direction by the ball screw, and the buffer unit 4500 is arranged in parallel with each other. As a result, the 32 storage units 4 61 are arranged in a matrix of four rows and eight rows. Furthermore, in the present invention, the number and arrangement of the housing recesses 461 of the buffering device 2247-9429-PF1 18 TM TM loo loo ί ί 11 11 11 11 11 11 11 11 11 11 11 11 11 11 11 For the first! It is preferable that the transfer arm 42 has an integral multiple of the amount of the adsorption head milk. Each of the housing recesses 461 of the α-moving member 460 is surrounded by a peripheral surface of the recess 4 as shown in the U-shape. When the K-element is dropped by the component transfer device 410 in the housing recess 461, ic The spacing between the components is substantially fixed. The underside of the moving member 460 is secured by a ball screw adapter 462 having a female thread inserted into the steel ball. The driving device 470, as shown in the same figure, is composed of: a drive shaft 471 forming a male thread of a female screw of the ball screw adapter 462; and a motor for driving the drive shaft 471 to rotate: maintaining the drive shaft d The money piece can be freely rotated by the bearing m. The ball screw structure is constituted by the drive shaft 471 and the ball screw/stolen 462 by inserting a steel ball between the opposing male screw 2 male threads. As shown in Fig. 8, the control unit 5 is connected to the control unit 0 of the processor 1, and the control unit 5 is configured to perform the operation 'which can move by one unit 2 at intervals between the housing recesses 461. The component is shifted. Furthermore, the control device can independently control the motors of the four buffer units. The buffer device 44. According to the arrangement of the storage unit 461 in the memory device, the arrangement of the storage recesses 461 is arranged such that the alignment of the IC and the adsorption head 433 of the second transfer arm 430 are as follows: In the present embodiment, since the 12 adsorption heads 433 are arranged in the 帛 2 transfer arm 43 1, the buffer device 440 drives each

S 2247-9429-PF1 19 135480 (^ 097105700, October 11th, 100th, revised replacement page, motor 472, in which the storage recess 461 of the ic element in which the same test result is accommodated among the 32 housing recesses 461 is arranged in two columns 6 Further, in the case where the second transfer arm 430 is provided with m columns η rows of ηιχη adsorption heads 433 &, the buffer device 440 drives the horses 472 so that the pxq storage recesses are arranged in p columns and q rows. The storage recesses P 461 of the IC elements in which the same type 6 result is stored in 461 are arranged in m rows and n rows. However, m, n P, and q are all natural numbers, mgp and ngQ. The buffer device 440 ' is provided in the unloading section. Between the test carrier and the guest carrier KST located in the window portion 4G6, in the present embodiment, the gamma transfer arm 420 moves the tested IC component from the test carrier tray tst to the buffer device S. 44. The storage recess 461, when the buffer device 44. After the He TL device is re-discharged, the second transfer arm transfers the component to the guest carrier disk corresponding to the test result. On the lower side of the window portion, there is a lifting platform for lifting and lowering the wide tray KST, thereby being fully loaded. Trial completed: the guest carrier KSTT of the piece is transferred to the fully loaded carrier tray to the arm 205. Xuan is in the unloading unit 400, the test is completed, ... _ / U section / 忒A method for transferring a carrier TST to a guest carrier KST. In (4) (d) A first embodiment of the electronic component transfer method of the present invention, and FIGS. 13A and 13β show an electron cell insertion according to the present invention. A schematic plan view of the cushioning vestibule before and after rearranging the accommodating section. "When the type of carrier tray TST is located in the unloading section, as shown in Fig. 12, 2247^9429-PFl 20 shed 0 - _ 100 years 丨 0 month 丨The daily correction replacement page shows that the component 7 of the component transfer device 410 is transferred from the test carrier TST shirt ☆ the arm 420 to the storage recess 461 of the buffer device 480. At this time, The carrier arm 420 moves the sixteen columns of the test carrier TST configured into two columns and eight rows to move the buffer device 44〇 regardless of the test result of the 1C component. In this example, because The buffering device 440 has a housing recess 4f, which is set to 4 rows and 8 rows, so that the transfer operation is performed twice to buffer The accommodating recess 461 of the 44G is fully loaded with the κ element. Then, the damper device 440 rearranges the arrangement of the accommodating recesses 461 so that the same test gentleman is stuck with τ Γ ^. The iC7G member and the second transfer arm 430 have The arrangement of the adsorption heads 433 is such that, for example, the buffer device 440 shown in Fig. 13A and the total of 32 storage recesses 461, ""row,...row" In the 461, the type 1 (: element, 3 rows and 7 rows of the reception: recess: 461 contains the type 1 1C element, and the other storage recesses accommodate the type 1 IC element. In the case of FIG. 13B, the buffer unit 45Q of the second column is shifted by i in the left direction in the drawing, and the buffer unit 45 of the third column is moved to the right in the drawing. By rearranging from this, as in the range enclosed by the broken line in Fig. 13B, two sets of elements are arranged in the form of 2歹" Question 1 = Secret, for example, the 1C component of the type 1 is tested as a result of a low-speed Ic component, a type of component, and the test result is a good-display IC component of low-speed performance, type 3] The test results are the I c components of the defective product. Then, as shown in Fig. 12, the second transfer of the component transfer device 410

S 21 2247-9429-PF1 丄 关 097105700# October 100 Π臼 Correction replacement page arm 430' will be configured as 2 columns R > only b仃 of the type 测试 test result 1 (: from buffer device 440 Transfer to, the 哥 哥 哥 】 corresponds to the type 1 of the passenger carrier KST. At this time 'can be type 1 disk KST. 12 IC pieces are transferred to the client carrier at a time _ as described above, in this In the implementation type, by the arrangement of the 1C component of the same test result and the adsorption head 433 of the 2nd transfer arm ΜίΐίΛ n 战# 430, it is possible to obtain the stalk in the unloading section 400. Landing and absorbing all of the adsorption 433 adsorbs the ic open Τ 曰 曰 曰 曰 曰 曰 曰 曰 曰 能够 能够 能够 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A schematic plan view of the buffer device before and after the accommodating portion. In the second embodiment of the electronic component transfer method of the present invention, the second transfer arm 43 is not particularly illustrated, but the "" 8 adsorption heads 433, this point is different from the first type of solid music type, other In the present embodiment, as in the first embodiment, the first transfer arm 42 in the unloading section tree moves the tested IC component from the test carrier m to The buffer device weight, after the buffer device rearranges the ic element, the 'second transfer arm 430' transfers the ic element from the buffer device (10) to the guest carrier disk KST corresponding to the test result. In this embodiment When the pieces are rearranged, as shown in the figure (10), the cushioning device rearranges the arrangement of the housing recesses 461, so that the housing recessed portion of the Ic component that accommodates the same test result is stored.

S 2247-9429-PF1 22 100 years 〖August 11th revised replacement stomach I3548 (KU 1 1 column 8 rows. Specifically, for example, as shown in Figure 14 , the buffer device 44 〇 has a total of 32 storage recesses In the 461, the IC element of the type 2 is accommodated in one row, eight rows, two rows, two rows, two rows, and four rows and one row, and the ICs of the type 3 are accommodated in three rows and six rows, and other storages are accommodated. When the ic element of the type 1 is accommodated in each of the recesses 461, as shown in Fig. 14B, the buffer unit 450 of the second row is moved upward by one space in the figure, thereby being rearranged as shown in Fig. 14B. In the range in which the dotted line is generally formed, an IC component in which the test result of the type 1 of the column 1 is arranged in one column and eight rows is formed. As described above, in the present embodiment, the 1C component of the same test result is The adsorption head of the second transfer arm 43G is arranged so that the ic element is adsorbed by all the adsorption heads 433 by unloading the 胄400$ by the gradual landing, and the electronic component test apparatus can be improved. The embodiments described above are described to make the invention easier to understand. Therefore, the elements disclosed in the above embodiments include all the more or equal objects belonging to the technical field of the present invention. In the above embodiment, in the buffer device 440, the IC components of the same test result are The adsorption head of the second transfer arm 43A is arranged as if it were - but the present invention is not particularly limited thereto, and the IC τ of the same test result and the adsorption head of the second transfer arm 43 () are similar. In some embodiments, the number of landings in the unloading portion can be reduced. Further, in the above embodiment, in the buffering device 44, the description is 2247-9429--PF1 23

S: Storage 61 is only moved in one of the longitudinal direction or the lateral direction. However, the present invention: For example, by arranging the connection between the accommodating recesses 461 constituting the longitudinal direction and the connection between the accommodating recesses 461 constituting the lateral direction (four) ... 50, the damper device constituting the accommodating recess 461 in the vertical and horizontal directions Directions ^ BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing an electronic component according to an i-th embodiment of the present invention. Electronic component test package of the teachings Fig. 2 is a perspective view showing the first embodiment of the present invention. Fig. 3 is a view showing the concept of processing according to the first embodiment of the present invention. Fig. 4 is an exploded perspective view showing the storage of the i-th embodiment using the present invention. "" 2 shows a perspective view of a guest carrying tray used in the electronic component testing apparatus of the first embodiment of the present invention. The sixth drawing of the county is self-contained, and the negative is not the first invention. The test for the electronic component of the embodiment (4) k-cut oblique_.

Fig. 7 齄 + > U μ According to the embodiment of the present invention, the electronic one is mounted. Or, Fig. 8 shows the block diagram of the control system of the electronic component according to the first embodiment of the present invention. Test device 2247-9429-PF1

S 24 1354800 Fig. 9 is a plan view showing the unloading portion of the electronic device 1 according to the first embodiment of the present invention. 70 pieces of remaining test pieces Figure 10 shows the plan view set in Figure 9. Fig. 11 is a sectional view showing the buffer of the first drawing. Figure 12 shows a schematic plan view of an embodiment in accordance with the present invention. The first embodiment of the method of the present invention is shown in Fig. 13A. Fig. 13B is a view showing the outline of the rearrangement of the storage unit in the embodiment of the electronic component according to the present invention. In the embodiment, the first ～ 便 町 缓冲 缓冲 缓冲 缓冲 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第In the embodiment, the second <month" 扪鲮 扪鲮 之 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 依 依 依 依 依 依 依 依

In the embodiment, the rearrangement and storage A music Z J sings are arranged. A schematic plan view of the buffer device after the crucible. [Main component symbol description] 1 0 0~ empty chamber portion; 3 0 0 to loading portion; 320 to 1st transfer arm; 322 to movable head; 330 to 2nd transfer arm; 3 3 2 to movable head; 4 0 0~unloading department;

S 1 to processor; 2 0 0 to accommodating portion; 310 to component transfer device; 321 to movable arm; 323 to adsorption head; 33 to movable arm; 333 to adsorption head; 2247-9429-PF1 25 1354800 410 to element Transfer device; 420~1st transfer arm; 430~2nd transfer arm; 440~buffering device; 450~buffering unit; 460~moving element; 4 61~receiving recess; 462~ball screw adapter; ~ drive unit; 47 drive shaft; 4 7 2 ~ motor; 4 7 3 ~ sleeve; 500 ~ control device; 51 0 ~ memory device; 5 ~ test head; 6 ~ test device. 2247-9429-PF1 26

Claims (1)

No. 097105700 X. Patent application scope · · 10 years 1 month 1 day correction replacement page 1. A test for the electronic component test loading and receiving terminal contact element sub-components : placing the electrical contact of the electronic component under test to perform the test of the electronic component to be tested; moving the storage portion to enable a plurality of storage portions to directly receive the mobile device The storage unit is moved; the rearrangement device 'rearranges the arrangement of the storage unit by the mobile device. 2. The electronic component testing device according to the above item (4), wherein the plurality of storage portions of the rearrangement device are arranged in a matrix. The mobile device is disposed in the same column or the same The accommodating portion on the row moves in the same direction. 3. The electronic component testing device according to claim 1, wherein the rearrangement device moves the storage portion in a unit of an interval between the adjacent storage portions. The electronic component testing device according to claim 1, wherein the storage unit of the rearrangement device stores the tested electronic component in the test; the rearrangement device rearranges the storage portion to make the same test As a result, the tested electronic components are successively side by side in a certain number on the same column or on the same line. 5. The electronic component testing device according to any one of claims 1 to 4, further comprising: s 2247-9429-PF1 1354800 No. 097105700, 100 years, 〇月1〗 曰Replacement·Change stomach. 1 transfer device, from the storage test - release from -, 攸 粑 粑 粑 毕 毕 毕 该 该 该 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被 被Transferring the piece to the rearrangement device; ^ from the rearrangement device, maintaining the tested electron to move it to the second carrier of the tested electronic component that has been tested and tested; The transfer device has means for maintaining the electronic component to be tested, which is arranged in m columns and n rows; the rearrangement device rearranges the storage portion such that the tested electronic components are arranged in m columns and n rows in the same test junction. . 6. A transfer unit of an electronic component & 'based on the test result of the tested electronic component, transferring the electronic component from the first carrier to the second carrier, the first transfer step, the tested electronic component Transferring from the first carrier to a plurality of storage portions; and a rearrangement step of rearranging the storage portion by moving the storage portion in which the electronic component to be tested is stored; and the second transfer step The electronic component to be tested is transferred from the storage unit to the second carrier. 7. The method of transferring electronic components according to claim 6, wherein in the rearranging step, the plurality of storage portions are arranged in a matrix, and the storage portions are arranged in the same row or on the same row. Move in the same direction. 8. The transfer method of the electronic component according to claim 6, wherein in the rearranging step, the storage portion is moved by the interval between the adjacent storage portions. S 2247-9429-PF1 28 7]〇57〇〇号1〇〇年】〇月π日修正 replacement page. 9. Transfer method for electronic components as described in claim 6 The test electronic component is stored in the rearrangement step, and the storage portion is rearranged in the rearrangement step, so that the tested electronic components of the same test result are successively side by side in a certain number of 0 on the same column or the same row. The transfer method of the electronic component according to any one of the items 6 to 9, wherein the test electron ^ ^ , ^ ^ ^ ^ ^ ^ ^ ^ 攸 s storage unit is transferred to the second carrier Transferring the device, and the right-hand configuration is useful for maintaining the tested electronic component and configured as mxn maintaining portions of m columns and n rows. In the rearrangement step, Ding Fanzhen rearranges the tested electronic component The components are arranged so that the same test knot "eves" Feng Wei! Column n rows. 2247-9429-PF1 29 S