TW200945482A - Test handler, method for unloading and manufacturing packaged chips and method for transferring test trays - Google Patents

Abstract

A test handler, a method for unloading packaged chips, a method for transferring test trays, and a method for manufacturing packaged chips are provided. The test handler includes: a loading unit having a loading picker performing a loading process on a test tray located at a loading position; a chamber system in which the packaged chips contained in the test tray transferred from the loading unit are connected to a hi-fix board and tested; an unloading unit having at least one unloading buffer moving along an unloading moving path formed over a test tray located at an unloading position and an unloading picker performing an unloading process on the test tray located at the unloading position; a passage site disposed between the loading unit and the unloading unit and connecting the loading unit and the unloading unit to the chamber system; and a transferring unit transferring the test trays. According to this configuration, it is possible to reduce the time for the loading process and the unloading process by reducing the moving distance of the picker, thereby enhancing the efficiency of the loading process and the unloading process.

Description

200945482 IX. Description of the invention: [Technical field of invention] The present invention is based on the classification of the packaged crystals of the quotation of the 测 县 10 10 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测 测, _ test machine test [previous technology] ❹ test test transporter can be used to connect the test chip to the test carrier at the end of the packaging process: ξξξξξ 封装 package transfer _ view field _ process, this She asked Wei Weiling unit rib capacity _ installed " Μ ; disk seal: =::: = __, the test carrier can be used to perform the 峨 process in the test tray in the test tray in the process, in I The pairing machine is used to connect to the high-precision positioning board: it will be connected to the test slot. Mj test whether the wafer operation is normal. The packaged wafer is tested for readout. 7 200945482 The test handler also includes a plurality of chambers for heating or cooling the package to determine if the packaged wafer can be operated at high or low temperatures and f temperature. Ο The test handler can also be used to perform (4) processes. In the unloading process, the process is touched by the 彳(4) County General Assembly 顾 纽 纽 = = = 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 并且 _ _ _ _ _ _ _ _ _ _ _ _ _ _ π pairs of Japanese and Japanese films, which can be difficult to transfer through the hardships, job costs, and in the short-term coffee s 造 Η Η Η Η Η Η Η Η Η Η Η 竞争力 竞争力 竞争力 竞争力 竞争力 竞争力 竞争力Therefore, it is necessary to reduce the cost and strengthen the production. Therefore, there is a need in the art for a loading process, a test process, and a test handler for a package wafer process and an unloading process that are shorter. SUMMARY OF THE INVENTION In order to solve the above problems, the instinct dog provides a test carrier and a tablet unloading method in a short time. Measurement of the unloading process and the unloading process Another object of the invention is to provide a test tray that transmits the test tray and reduces the waiting time of the test tray and the time between the marriage and the unloading process. vLoading Another object of the present invention is to provide a method for manufacturing a packaged crystal material, which is capable of being divided into the following aspects: ❹ ❹ - The aspect of the month is to provide a test The carrier includes: a loading unit. The loading unit includes a loading picker for performing a splitting process on the loading tray 4, which is a test tray and a wafer. When the test tray is in the position, the chamber system, in the cavity, the valley in the test tray transferred from the loading unit = connected _ _ _ gamma; _ this unloading unit > An unloading buffer and an unloading picker, the unloading buffer is along the /, and the unloading secret located above the unloading shop is when the unloading position is separated from the tested package wafer on the slave tray The location where the test tray is located 'Unloading and picking up H Jiacai is located in the unloading position (10) on the test tray, but the carrier is privately owned; and the location of the unloading unit is set next to the fresh element; the access position is configured in the loading and unloading unit between Connecting the loading unit and the unloading unit to the system so that the test tray containing the sealed wafer to be tested can be transferred from the loading unit to the chamber (four) and after receiving the post-loading test tray can be transferred from the chamber system to And an unloading unit; and a transfer unit for transferring the test tray from the loading unit to the path position, transferring the test tray from the path position to the unloading unit, and transferring the test tray from the unloading unit to the loading unit. Another aspect of the present invention is to provide a method for unloading a packaged wafer, which comprises 200945482. The following unloading causes the second unloading pick-up to be separated from the unloaded tray, and the tested sealed wafer is When the packaged wafer after the test is separated on the test tray, the tray is disposed 4; and at least one of the unloading buffers of the plurality of unloading buffers is moved along the unloading movement path formed above the unloading position_test tray, so that At least one unloading buffer is located above the test tray at the unloading position; causing the second unloading picker to receive the tested packaged wafer into the unloading buffer; so that the package after receiving the test; Moving along the unloading movement path to the first-stage pick-up, the position of the packaged wafer after picking up the violent type from the unloading punch; and making the _unloading pick-up after unloading the buffer in the county after picking up _ The picked package (9) is housed in a user tray in the position stacker. The person takes - (4) Hao Yu provides - rewards her money transfer method, the department packs the following two steps: to make the packaging of the fresh domain to test the package (9) in the test of the fortune, this series is the tray The position of the test tray when the wafer is packaged in the middle of the second phase; the position of the tray is lowered to the position of the first tray that is lower than the loading position; the test tray is adjusted from the passage position (4) Included in the test tray to the first - temperature 'connected to the first temperature of the packaged wafer to the clamp plate _ test package wafer, and the test package wafer is adjusted to 2 200945482 sizing 'will be tested after the harvest The test tray of the packaged wafer is transferred from the chamber system to the path position, and the test tray in the path position and containing the tested package wafer is transferred from the path position to the first-arrival position below the (four) position, which is Test the position of the test tray when separating the tested package wafer from the measurement and reduction tray; raise the test tray at the first-arrival position to the unloading position 丨 at the unloading position雠程; The test tray that has passed the unloading system © passes the second detachment 2 between the unloading position and the second arriving position and the first-arrival position between the carrying position and the first-disengaged position And from the unloading position to the loading position. Another aspect of the present invention is to provide a package wafer manufacturing method package 2: preparing a package wafer to be used; and recording a single mechanical row to store the prepared package 4 in a test tray located in an aging setting The test tray is used to test the package (9) to be tested. The test tray of the loading process is lowered from the loading position to the lower position than the detachment position: the job tray in the first-disengaged position is transferred to the connection device. The position of the channel of the carrier unit and the chamber system; the test tray located at the path position and having passed the loading process is transferred from the path position to the chamber system, and the chamber is completely housed in the package wafer in the test tray to the first Temperature, the connection is adjusted to the first position of the first job (9) money _ 犹 “ ", and will test: the wafer is adjusted to the second temperature; the test tray containing the test package wafer is transferred to the access position; The test tray of the packaged wafer located in the path position p and containing the 200945482 test is transferred from the path position to the lower position of the unloading position (four) - the offset is the same as the detachment Testing the position of the tray when the wafer is packaged; raising the test tray at the first arrival position to the unloading position; performing the unloading process on the test tray at the unloading position; and passing the test tray that has been undone (four) The second disengagement position between the unloading position and the second arrival position and the first-arrival position between the off-load position and the first disengagement position are transmitted from the unloading position to the loading position. [Embodiment] A preferred embodiment of the pick-up handler of the present invention will be described in detail in conjunction with the drawings.

""1" is a schematic plan view of a test handler of an embodiment of the present invention. "Figure 2" is a three-dimensional diagram of the light load unit and the unloading unit. The "from the map" to the "figure map" are not intended to be an example of one of the loading buffer and the loading picker working position. Fig. 4A to Fig. 3 are side views of another example of the loading buffer and the loading position of the loading picker. "Picture 5" is a demonstration of the route of transporting the pallet between the loading unit, the road position and the unloading %. "6th = J is the front view of the loading unit, the unloading unit and the path position. "Fig. 7" is a plan view of the loading unit and the unloading unit. "8A" to "8D" is a side view of an example of one of the carrier and the unloading pickup. The "first picture" to the "figure 9D picture" are another example of the unloading buffer and the unloading picker operation position. "1G" is a schematic diagram of the path of the transfer tray in the test transfer 12 200945482 embodiment of the present embodiment. "The u___ is a perspective view of the transfer unit in the test handler of the embodiment of the present invention." ^ "5th figure" and "10th figure" represent multiple references in multiple test fields «represented The components of the test handler where these test trays are located. In the "(7) diagram", the number of the dotted line is slightly larger. _ The test tray shows the position of the chamber and the chamber ❹ ❹ == the transmission path' and the plurality of test trays indicated by the solid line are not used. Position and unloading _ test domain transmission path includes a single: Figure 4 ρ " Γ ' 本 本 本 实施 实施 实施 实施 实施 实施 实施 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试 测试"苐11图" and "12th figure"). The package stacker 21 is used to store a plurality of trays to be tested. ° The clipper 22 is used to test the load position 2a when the package of the test tray τ is subjected to the duty reduction T t . This 'Peach T is located in the loading and lowering device 22 and is movable in the X-axis direction and the Y-axis direction and can be raised and lowered. The loading pick 22 includes (4) a plurality of sprays of the (four) fixed package wafers. 200945482 = 2 and 2 the load picker 22 includes a first load picking first load picker 221 from the load placed in the load stacker 21. The picked up seal is housed in the loading buffer 23. The test transport 1 can include a plurality of first-shoulder picker functions. ❹ ❹ First-load pick-up (four) can pick up a plurality of packaged wafers in the matrix unit from the loading stacking disc and the packaged wafers of the packaged form are only in the form of the shackles. The cymbal 22 is used to pick up the package slab to be tested from the loading buffer 23 and to accommodate the picked granules in the recording remaining 2a disk T. The test handler 1 may include a plurality of second loading pickers 222. The second loading picker 222 can place the eight test trays at the loading position, the plurality of receiving areas, and accommodate the packaged wafers to be tested in the receiving areas. The knife receiving area _ is formed by a plurality of miscellaneous The handle such as the load picker 222 can be accommodated in the test tray τ, and the storage area can be sucked and fixed by the second load picker 222 at a time. The 曰曰 曰曰 222 can be housed in the test tray τ from the loading buffer 23; the early work package (9) and can be mounted on the array unit at a time. The day of the film is in the form of a moment 14 200945482, the first picture "and the second picture". The series can also move in the direction. The test handler 1 can include at least one of the buffers 23. Not shown in the middle, the split load buffer 23 can be connected with a plurality of belts I.

(4) movable. When the test handler 1 contains a plurality of load buffers, these load buffers 23 can be moved separately. Please refer to "2nd drawing" and "3rd drawing". The loading buffer 23 can form a loading movement path above the recording 2a^. The loading buffer 23 can be moved along the Wei_moving_a (10) Over the test tray T. ^Along the Lai_ job A, the loader can be recorded in the area between the user tray and the loading position 2a of the loader pair (area b) or: in the test tray at the loading position 2aΤ In the upper area ("3A"), the load buffer H 23 culvert is moved to the detachable domain _23^ loading rail 23a to guide the loading buffer $23 to move along the loading movement path A., load buffer H 23 The clock touches the top of the loading tray 2a, thus shortening the distance of the moving loading picker 222 to the loading process. 200945482 can be moved along the loading movement path A to shorten the second loading picking The moving position of the loading and unloading process of the loading buffer 23 and the picking device 22 will now be combined with the "No. 3" to the "Picture 2". In this embodiment, the buffer 2 is used to transmit the solution to be moved and the second loading/removing area, and the other receiving area is tested by the towel. Load position ❹ that is, the load buffer 23 is loaded by the pickup to perform the loading system. , efficiency. No., when the loading buffer 23 is located in the area (area β) between the user tray loading the stacker 21 and the loading position 2a, the first loading picker 221 can test the The package wafer is housed in the load buffer 23. After the package wafer to be tested is accommodated in the field buffer 23, the load: 23 will move along the loading path. ° As shown in the "3rd drawing", The load buffer 23 is capable of transferring the packaged wafer to be tested into another non-capacitor area, and the receiving area and the second money picker 222 receive the packaged wafer to be tested in the test tray τ at the loading position f 2a The containment area in the middle is adjacent to each other. 16 200945482 中中取_"decoration, 帛: recorded coffee 222彳_buffer 23 = like 4, 叩定之麟 222__ corresponding collection of l, and will be picked up _ package "Received in the position of the cake ^ ❹ Position 23:::== 昼, fine ===, and the physical path. Because the position lUf picker 222 will be the package of the crystal to be tested in the loading stack 働 ^ =_123__ is located in the area between the loaded user tray and the loading position 2a (area B). When the package wafer of the __ machine is housed in the new two test tray τ, Μ step = loading the wafer into the load buffer 23. Therefore, the process is programmed into - s, the process time, and the process is improved. The efficiency of the process. =: package _ in the position of the position - the pick-up ϋ 222 picks up the package Β曰 17 200945482 from the load buffer 23, moves to the corresponding containment area L at a predetermined distance 222a, and The package wafer is then housed in a test tray τ at the loading position 2a.

As described above, the loading buffer 23 can transfer the sealing wafer contained therein to the receiving area L, L, or the receiving area m closest to the receiving areas L, L, or the second loading device 222 can be accommodated. The containment area m of the packaged wafer tested. Q

That is to say, when the second loading picker 222 receives the packaged wafer to be tested and is located in the spare (four) puncture T... coffee L, L, when the package change occurs, the ^ ^ buffer ^ 23 can transmit the county wafer to be processed to the most _ in the corresponding containment area L, L, or the containment area L, L, or M. Therefore, regardless of whether it is located in the accommodating area L, L, 5 iu λ α / (4) (4), where in L&M, it is possible to move the second loading picker 222 to perform the loading process. Now, in conjunction with "4A map" to "筮p - . _ 4th map", the load position buffer 23 for the load buffer 23 and the money pick 922 can be moved along the load shift au initial work A to transfer The packaged wafer to be tested is placed in a containment area. This accommodates the packaged wafer to be tested in place (4) in the carrier-to-receiver 222 area. The load in the test tray T on which 2a is placed is as shown in "Fig. 4A", when loading:: user tray and loading position 2a<_field: loading picker gonger akisaki 18 200945482 packaged wafer to be tested Being contained in Lai _ U _ 23 will follow the Wei _ secret path A machine. The multi-load buffer is shown in the wafer. The loading buffer 23 is capable of transmitting the SM system to be the second loading pick-up TM to be tested, and the positive film is received in the receiving area in the test tray T at the loading position 2a. As shown in Fig. 4C, when the second musk picks up the package wafer to be tested with the crucible 23, the μ-thruster 222 moves from the load buffer stacker 21 W buffer 23 to the load on the loading machine 21 (four). The 峨 position __(_B) moves away from the receiving area M8f, and the second display picker will move to the test tray τ of the seal to be tested. The valley is located at the loading position 2a. Therefore, the area between the buffer 23 position 28 loading position 28 (_B) and the user tray are moved by a distance smaller than the moving distance, and the loading process can be performed. The =^ can shorten the time taken for the loading process. It is enough to pick up (4) Loading and picking 11 221 can accommodate a new waiting device (4) to install the sun piece in the load buffer 23. Therefore, it takes time to seal and further improves the efficiency of the loading process. The loading process is as shown in Fig. 4, and when the finishing process 19 200945482 is located in the corresponding receiving area, the second loading picker 222 is moved to another receiving area adjacent to the receiving area M. L. Thereafter, the loading buffer 23 is capable of transporting the package wafer to be tested to a region above the other receiving area L. The receiving area L is a second loading picker 222 for housing the packaged wafer to be tested in the loading position 2a. Test the containment area in the shot. © When the second loading picker 222 picks up the package wafer to be tested from the loading buffer 23, the 'load buffer n23' will move to the user tray in the loading stacker and the loading position 2 & area (regional loader ^ When leaving the receiving area L, the second carry-on picker 222 will move to the receiving area 1 and house the packaged wafer in the test tray τ at the loading position 2a. - As described above, the loading buffer 23 can transmit the seal to be tested. The I wafer is located in an area above the receiving area M or L, and the receiving area Μ or L is the second loading picker 222 for accommodating the wafer to be placed in the receiving area of the test tray at the carrying position & That is to say, when the second split picker 222 receives the package wafer to the remaining area M or L of the test wipe T in the loading position, the loading buffer 23 can transport the package crystal # to the containment area of the device. Or L. • ★ Therefore, no matter where it is located in the accommodating area L and L, it can shorten the movement. The two loading pickers 222 are used to perform the distance of the rigor. • ^ 5th and 6th 'Loading unit 2 can also contain the first 20 2009 45482 ascending/descending unit 24. The first ascending/descending unit 24 can cause the test to be raised along the first rise/fall = E formed in the loading position 2a, the first-arrival position 2b, and the first-disengagement position The position 2a, the first arrival position 2b, and the first-female system are sequentially arranged in the first-up/down path E from top to bottom (in the direction of the arrow N). ❺ The first arrival position is the slave unloading unit. 3Transfer test tray τ arrives J Γ fresh 70 3 The test tray τ is transmitted after the unloading process has been completed and the test tray _ moves to the position 2 before waiting for the arrival position of the younger one. 2e is the position where the tray τ is detached to go to the position of the passage 4. After passing through the test tray of the gargoyle, it is moved to the position of the passage ❹ and set to wait. This one vine moving single tr unit 24 The first rising/falling element and the first first rising/falling element 241 are included for supporting the test tray τ and can be raised and lowered by the first first rising/falling path. Measuring the bottom of the plate and then touching the test 45482 ... The first ascending/descending member 241 can form an open pattern in the direction from the loading unit 2 to the load unit 3 ♦ (the direction of the arrow P in "Fig. 6"). Therefore, it can be used for the test tray. When τ is transmitted from the first disengagement position 2c to the passage position 4 and the test tray T is transferred from the unloading unit 3 to the first arrival position %, there is no interference with the first ascending/descending element 241. ❹ The first driving unit 242 The first rising/lowering element 241 can be raised and lowered. The first driving unit 242 can move the first rising/lowering element (4) along the first rising (falling path E. The first rising/falling element 241 can be used by The first driving unit 242 rises and falls between the loading position 2a, Μ &, the soil miscellaneous 2a, the first arrival position 2b, and the first-departure position 2c. The first drive unit 242 can include a plurality of cylinders and a rod that is moved by these steam waves. The first ascending dip element 241 is coupled to the rods and is capable of ascending and descending with the members of the rods. The above details can be the secret cylinder pressure steam red. As shown in Fig. 1, the unloading unit 3 is used to execute the unloading process and is set beside the early it 2 . This unloading unit 3 carries the stacker, the unloading picker 32 and the unloading buffer 33. The unloading stacker 31 stores a plurality of users and trays that house the tested packaged wafers. After the job (4), the “Tuanxian _ test wire is classified in the domain stacker 而 and is housed in a different _ household tray located at the unique position. The unloading picker 32 is used to perform the unloading process on the test tray τ. Test 22 200945482 When the tray τ is separated and contained therein, the test tray τ is located at the unloading position 3a. The unloading picker 32 is movable in the y-axis direction and can be raised and lowered in the y-axis direction. The pickup H 32 includes a plurality of fine-grabbing (four) fixed-mouth nozzles. The unloading picker 32 further includes a first unloading picker and a second pick-up picker 322. ❹ ❹ The first unloading picker 321 rides the test from the unloading buffer The rear female wafer and the picked packaged wafer are housed in a user's consumable tray located in the unloading stacker. The test handler 1 may include a plurality of first unloading pickers 321. The first = 32 is picked up from the unloading_33 The _ slice is received in the corresponding user tray according to the test result. The first unloading picker 321 can pick up at least one test package from the unloading buffer %, and the county wafer is picked up at the unloading Stack Μ =: The first unloading picker 321 can take a plurality of tested packaged wafers in the matrix unit from the unloading buffer pair at one time and can accommodate the sizzling matrix unit in the form of the unloading stacker 31 (four) with the second The unloading picker 322 is used to receive the packaged crystal moon from the test tray τ located at the unloading position, for example, and to receive the separated package wafer in the unloading buffer 23 200945482. The second unloading picker 322 can be located at the unloading position. The test tray τ of 3a is divided into a plurality of separation regions and the tested package wafers are accommodated in the separation regions. The separation region is in the form of a matrix unit formed of a plurality of package wafers to enable the second unload pickup 322 to The detachment zone is separated from the test tray at a time. That is, the detachment zone is a matrix unit formed by a plurality of packaged wafers, which are capable of being sucked and fixed by the unloading picker 322. The second unloading picker 322 can be capable of separating a plurality of tested packaged wafers in the matrix unit from the test tray T located at the unloading position 3a. And the second unloading picker 322 can receive the tested package wafer in the form of a matrix unit in the load-suppressing buffer 33 at a time. The second unloading picker 322 can classify the separated packaged wafer according to the test result. The unloading buffer 33 is housed in the unloading buffer 33. As shown in Fig. 1 and Fig. 2, the unloading buffer 33 is movable in the γ-axis direction and can temporarily accommodate the packaged wafer after the test. The test handler i can include at least one unloading buffer 33. Not shown in the drawings, the unloading damper 33 can be coupled to a belt to which a plurality of pulleys are coupled', whereby the unloading damper 33 can be moved as the motor rotates at least one of the pulleys. When the test handler 1 includes a plurality of unloading buffers 33, these unloading buffers 33 can be individually moved. Referring to "Fig. 7" and "Fig. 8A", the unloading damper 33 is movable along the unloading movement path F formed above the unloading position 3a. 24 200945482 The unloading buffer H 33 can be moved along the unloading scale F, and the unloading picker 321 can pick up the position of the tested packaged wafer from the unloading buffer 33. Along the unloading movement path F, the unloading buffer 33 can also be moved to the second unloading picker 322 to receive the tested packaged wafer in the (four) buffer % order position ❹ © the unloading buffer 33 can be movably Connect to the unloading rail says. The unloading guide rail 33a moves along the unloading movement path f by the called unloading buffer %. Test the carrier! Can include multiple copies that can be moved separately. Since the test handler contains more unloading buffers, because of the time used and the progress of the unloading process is increased. By: the first unloading picker 321 and the second unloading on the finder 33 are #, so the _ overlapping __ unloading buffer laps and thus shortens the waiting time. ...however, _戦Transporter 〗 〖More than the width of the domain test transporter 1 1H ("JJ, " therefore larger. When the width of the test transporter m" becomes larger) 321 and the second unloading picker 322 to perform the unloading of the wheel and also to unload the t-puller: the unloading buffer of the shirt is moved by the two-moving path F located at the unloading position, such as the test disc τ, so that even when The test handler 1 contains a large number of unloading buffers. (4) 25 200945482 It can also be configured within the width of the length test carrier 1 with the smallest phase length. Therefore, since it can move the first unloading (four) picker 322 to execute the loader 321 and the first unloading 'this is enough to shorten the waiting time, so it is enough to check the _ _ _ and Cheng's efficiency. No in the figure, multiple unloading buffers %

The buffer 33 is movable so that the unloading of the cymbal is over the test tray T located at the unloading position 3a. As shown in detail _ not shown, but with at least one of the plurality of unloading buffers 33, mb can be moved so that the turnaround can pass over the test tray located at the unloading position . It is difficult to move along the unloading path F along the unloading path F between the loading position 2a and the unloading position, except that the movement is passed through at least the unloading position τ above the unloading position 3_the tray τ. The unloading buffer 33 is capable of accommodating the sealing film through the classification based on the test result. That is to say, the second unloading picker 322 can divide the test trays located in the unloading position, such as the "package test results", into the corresponding unloading buffers 33. In this case, Since the test handler i contains more unloading buffers 33', it is able to further shorten the waiting time for unloading the pickup 32. Therefore, it is capable of verifying the efficiency of the unloading process and riding the ride. 26 200945482 33 The middle of the device is similar, when a plurality of unloading buffers. Above the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Unloading buffers 33 to ο say: load =: '322, ... month 匕 沿 者 者 者 者 者 者 者 者 者 者 unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt unt Now, the "Unloading Buffer 33 can be moved along the unloading path" as shown in "8th 8th "C. One of the operations of the unloading pickup 32" = "Unloading_3" and "Transferring 2" in Figure 8A. -一=:=:: Install one, as shown in Figure 8B, by The packaged wafer after the test is placed in the unloading buffer 33 after being moved by another predetermined distance ===, and can be shortened by moving the second unloading picker η with 27 200945482 : 卩 Execute the unloading distance and shorten the time taken for loading and unloading. As shown in Fig. 8C, the unloading buffer % can be moved up along the unloading moving path to the area (area G) in the stacking machine 31 and the unloading position. And the first unloading picker 321 can pick up the tested packaged wafer from the unloading buffer. ° 第 * "8D", the first unloading picker 321 can accommodate the packaged wafer picked up from the unloader 33 in the user tray located in the unloading stacker. At the same time, the unloading buffer 33 can be moved up to the other separation zone U along the part-loading movement path, and the other separation zone (four) and the second unloading picker milk will be unloaded from the sealed wafer after the test. The separation zone S separated in the test tray τ of position 3a is adjacent. Thereafter, the second unloading picker 322 is moved upward by a predetermined distance 322a to an area above the unloading buffer 33 in the other separating area U, and then the tested packaged wafer is received in the unloading buffer 33. in. As described above, the unloading buffer 33 can be moved to the separation areas S and U which are closest to the separation areas r and $, and at the separation area and s, the second unloading pickup will separate the tested packaged wafer. That is, when the second unloading picker 322 changes the separation regions R and s of the packaged wafer after the test is separated from the test tray T located at the unloading position, the unloading 28 200945482 buffer 33 can be moved to the nearest nearest to the corresponding The separation zone of the separation zone (4). Where the movement is located in the split bottles R, S^ can all shorten the distance by which the first unloading picker 322 is moved to perform the unloading process. (4) See the second unloading picker in the unloading buffer 33 spot unloading picker 32 in conjunction with "9A" to "9D". 322 can be contained in the separation wire. The test package wafer in the test tray is located in the test tray τ at the unloading position 3a as shown in Fig. 9. The unloading buffer can be moved along the unloading movement path to the health domain, which is lower than the second. Unloading the Picker Milk The area of the test piece that has been removed from the unloading position % _ test tray 。. That is, the unloading buffer 33 is located above the separation area R where the first unloading picker 322 can separate the tested packaged wafer from the test tray τ located at the unloading position 3a. = FIG. 9C", when the second unloading picker 322 is to be placed in the packaged load buffer 33 after the test, the unloading buffer 33 can be moved up along the unloading moving path F to the (four) households in the aging 31 The area between the tray and the unloading position 3a (area G). Thereafter, the 'first-unloading picker 321' can pick up the test sealed wafer from the unloading buffer 33. At the same time, the 'second_loader 322' can be moved to another branch 29 200945482, which is separated from the zone s, which is adjacent to the separation zone r. Then, the second unloader 322 can separate the tested package wafers contained in the respective separation regions s + from the test trays τ located at the load position 3a. As shown in Fig. 9D, the first unloading picker 321 can be buffered from the unloading. The wafers taken are contained in a tray of 31 users located in the unloading stack (four) 31. At the same time, the 'unloading buffer % can be moved up to the daily area along the unloading path F, which is lower than the second unloading picker 322 to take the tested cover sheet from the unloading position. Test the area separated in the tray τ. That is, the unloading buffer 33 is located above the separation zone s, and the second unloading picker 322 separates the tested packaged wafer from the test tray τ of the position in the separation zone S'. Set 3a

As described above, when the second unloading picker 322 changes from the separation regions R and S of the wafer after the core of the test disc 77 (10) in the test tray, the unloading buffer 33 can be moved to the corresponding separation region R and The area above S. Therefore, regardless of where the recording separation area W s t is, it is possible to shorten the distance of the mobile-unloading pickup 322 to perform the unloading process. Such as "figure 5" and "figure 6" ascending/descending unit 34. As shown, the unloading unit 3 may further include a second first ascending/descending unit 34 for raising/decreasing the test tray along the & formed in the unloading position a, the second disengaging position 3b, and the second arriving position %. 30 200945482 ^Rise and fall. The unloading position 3a, the second disengaging position 3b, and the second arriving position 3c are sequentially arranged in the second ascending/descending path J from top to bottom (in the direction of the arrow N). ❺ ❹ The second disengagement position 3b is the position where the test is released by the unloading process to go to the position 2b. The test tray τ that has passed through the unloading process will wait at this first: disengagement position % before being transferred to the position 2b. This second disengagement position 3b can be flush with the height of the first arrival position. The second arrival position 3e is a test tray that is transported from the access position 4 and is transported from the access position 4 after arrival. The test tray is loaded with the tested package = test tray Τ, and the pick-up tray τ is transferred to the unloading Miscellaneous month. "Wait at this second arrival position 1. This second arrival position 4 and the first departure position 2. The height is the same. The L path rises second, and the p drop unit M contains the second rise and fall. The driving unit 342., the second rising/falling element is used for the branch test tray and can be raised and lowered along the second rising and falling path j by a driving unit 342. The first falling component can be tested and tested. The bottom of the tray is in contact with each other, and the second rising/lowering member 341 is formed in the direction from the unloading unit 3 to the loading unit 2 (the opposite direction of the arrow Ρ in Fig. 6). Therefore, it is able to = transfer the 31 200945482 test tray Τ from the second disengagement position 3b to the first arrival position and transfer the test deduction from the passage position 4 to the second arrival position %, without the second rise/ The falling element 341 produces interference. The second driving unit 342 can raise and lower the second rising/falling element 341. The second driving unit 342 can cause the second rising and falling element correction to rise and fall along the second rising/falling path j. The second ascending/descending element correction ❹ is raised and lowered by the second driving unit 342 between the unloading position 3a, the second disengaging position 3b, and the second reaching position 3c. A second driving unit 342 can include a plurality of cylinders and the movement of the cylinders by the 341 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ ο As described above, the loading and unloading process S can be performed on the test tray τ because it can perform the loading and unloading processes on the test tray τ. Thus, the rate of error in the on-load process and the unload process can be reduced and = so that when an error occurs in another process, the process in the process and the unload process can be performed normally. Therefore, it is possible to increase the loading process and the unloading system to cause the test tray T to rise and fall in the loading unit 2 and the unloading unit 3, which can be used as a long-term (as shown in the "Figure"). As shown in "1" and "1", the path position 4 is located between the stock list 32 200945482. Element 2 and the unloading unit 3! Connect the loading unit 2 and the unloading unit 3 to the chamber. System 5. Therefore, through the path position 4, the test tray T containing the packaged wafer to be tested can be transferred from the loading unit 2 to the chamber system 5. And through the path position 4, the test tray τ containing the tested packaged wafer can be transferred from the chamber system 5 to the unloading unit 3. 〇 Although not shown in the drawings, the passage position 4 may be provided with a plurality of pulleys, a belt connecting the pulleys, and a conveying tool connected to the belt to convey the test tray by pushing or pulling the test tray. This transfer tool can be placed in the chamber system 5. The passage position 4 can be disposed between the first disengagement position 2c and the second arrival position 3c. This path position 4 can be the same as the height of the first disengagement position 2c and the second arrival position 3c. The path position 4 may further include a rotating unit 41 for rotating the test tray τ. This path position 4 can include a plurality of rotating units 41. The rotating unit 41 is for rotating the test tray τ transmitted from the loading unit 2 from a horizontal state to a vertical state. The test tray tether that is rotated to the vertical state by the rotating unit 41 will be conveyed to the chamber system 5. The rotating unit 41 is also used to rotate the test tray τ transmitted from the chamber system 5 from a vertical state to a horizontal state. Rotation to the horizontal state by the rotation unit 41 33 200945482 • The test tray τ will be conveyed to the unloading unit 3. The test handler 1 can perform a loading process and an unloading process on top of a test head having a horizontal state and can test the process above the test τ having a vertical state. As shown in Figure 1 and Figure 1, the cavity system 5 installed in the test handler includes a first cavity (four), a second difficulty 52, and a third test 53 to cause collapse. Wei Wenwei and Weixia County at room temperature

test. The 1T first chamber 51 is for adjusting the county wafer accommodated in the test tray 传送 conveyed from the path position 4 to the first temperature. This first temperature is within the temperature range of the packaged wafer when the tester measures the packaged wafer. The first chamber 51 is provided with at least one device of the electro-acoustic touch-cup needle to adjust the package wafer to be tested to a first temperature. The first chamber 2 allows the crucible tray T having a vertical state to be moved inside the chamber. When the county to be smashed is adjusted to the first - Wenlin, the test tray τ will be transferred from the chamber 51 to the second chamber. The first cavity to 52 is used to connect the package wafer adjusted to the first temperature and housed in the test tray • to the high precision positioning plate Η. The second chamber 52 is provided with a contact unit for connecting the package wafer adjusted to the first temperature to the high-precision positioning board, wherein some or all of the high-precision positioning board is inserted into the paving unit 521 34 200945482 . The subsequent measurement can be performed on the packaged I wafer to better control the electrical characteristics of the packaged wafer to the high precision positioning board. The second chamber 52 can be configured with at least one of an electric heater and a liquid nitrogen injection device to hold the in-service seal at the first temperature. The test handler 丄 may include a plurality of second chambers 52, and a high-precision positioning core is disposed in each of the second chambers 52. After the package wafer has been completely tested, the test tray τ will be transferred from the second chamber % to the third chamber 53. The third chamber 53 is for adjusting the packaged wafer after being tested in the test tray #τ to the second temperature. This second temperature is in a temperature range including a normal temperature or a temperature close to normal temperature. The third chamber 53 may be configured with at least one of an electric heater and a liquid nitrogen injection device to adjust the packaged wafer after the test to a second temperature. The third chamber 53 can move the test tray τ having a vertical state to the inside of the chamber. When the tested package wafer is adjusted to the second temperature, the test tray τ will be transferred from the third chamber 53 to the via position 4. As shown in Fig. 10, the first chamber 51, the second chamber 52, and the third chamber 53 may be arranged in the vertical direction. A plurality of second chambers 52 can be stacked vertically. Although not shown in the drawings, the first chamber 51, the second chamber 52, and the third chamber 53 may be vertically stacked. In this case, the first chamber 51 can be disposed above the 35 200945482 second chamber 52, and the third chamber 53 can be disposed below the second chamber. 1. The transfer unit 6 is used to transfer the test tray τ from the loading unit 2 to the path position 4' and the read τ is transmitted from the path position 4 to the unloading unit 3, and the test tray τ is to be tested. The loading unit 2 is transferred from the unloading unit 3. The transfer unit 6 may include a first transfer unit 61 and a second transfer unit 62. As shown in FIG. 10 and FIG. 11 , the first transport unit 61 is configured to transport the test tray ❹ located at the first detachment position 2 c to the path position 4 and transmit the test tray τ at the path position to the first position. Second arrived at location 3c. The test tray T transported from the first-disengagement position 2e to the path position 4 _ test-out τ containing the seal to be tested and transferred from the path position 4 to the second arrival position 3c accommodates the packaged wafer after the test. The first transfer unit 61 includes a first transfer element 611, a second transfer element 612, and a moving element 613. The first conveying member 611 is for conveying the test tray τ at the first disengagement position 2c to the passage position 4. This first conveying member 611 is capable of pushing and conveying the test tray T at the first detachment position 2c. The second transport element 612 is used to transport the test tray τ at the path position 4 to the second arrival position 3c. This second transport element 612 is capable of pushing and transporting the test tray T located at the path position 4. The first transfer element 612 can push and transfer the test tray τ. Therefore, even if 36 200945482, when the test tray τ is waiting at the second arrival position 3e, the second transfer tree (10) can be moved to the initial position. Since the second transporting member 612 can be moved to the position for transporting the next test tray T without waiting time, it can shorten the waiting time of the next test tray T in the path position 4. Therefore, it is possible to test the waiting time of the test tray by efficiently transmitting the test tray τ. The first transport element 611 and the second transport element 612 can be coupled to the mobile element 613. Therefore, the moving member 613 can simultaneously transfer the test tray τ located at the first disengagement position & the test tray T located at the passage position 4 by simultaneously moving the first conveying member 6 and the second conveying member 612. , the first transmission U element 611 and the second transmission element 612 are connectable to the moving element 613 = and there is a predetermined interval between the first transmission element 611 and the second transmission element 612

The barrier allows the crucible and the second transfer element to be in contact with the test tray T. Although not shown in the drawings, the moving member 613 can be coupled to a belt to which a plurality of pulleys are coupled and can be rotated with the movement of the belt, wherein a plurality of pulleys can be rotated by the motor. As shown in Fig. 10 and Fig. 12, the second transport unit 62 is configured to transport the test tray τ located north of the second disengagement position to the first arrival position 2b. The test tray τ transferred from the first release position | 3b to the first arrival position 2b is emptied by separating the tested package wafers in the unloading process. 37 200945482, the transfer unit 62 can include the third transfer element 62i rotating and quenching τ. The third conveying element (2) is squashed with a profitable pulley connected to the surface, and the fine (4) is rotated by the motor. ❹ The third transport element 621 can push and transmit the test cartridge. Therefore, even when the test battle is waiting at the first-arrival position 2b, the third transfer element paste can move the fine start position. Since the third transporting member 621 can be moved to the bit_group to be used for transmitting the lower-side trial, the Weiqiu short test test tray T waits for the second disengagement position 3b. Therefore, it is possible to shorten the waiting time of the test tray by efficiently transferring the test tray T and thereby shorten the time taken for the loading process and the unloading process. A detailed description will now be made of the method of the present invention, Wei Weixian County (9) City. As shown in "Fig. 1" to "Fig. 12", the method for unloading a sealing sheet according to an embodiment of the present invention comprises the following steps. First, the second unloading picker 322 separates the tested difficult wafer from the test at the unloading position. The second unloading picker 322 is capable of separating the tested wafers housed in the eight-zone R from the test tray cutter τ located at the unloading position. At least one unloading buffer % 38 200945482 along the unloading plurality of loading buffers 33 is moved up to the area above the test tray D in the unloading position 3a. The unloading damper 33 can be moved along the unloading movement path f to partially or completely pass over the test platter τ located at the unloading position 3a. The second unloading picker 322 houses the packaged wafer after the test in the unloading buffer 33. The second unloading picker 322 can accommodate only the packaged wafers that have been classified according to the test results into the corresponding unloading buffers 33. © The ship's unloaded ship (4) 33 with the tested package moves along the unloading path F to the first-stage picker to pick up the position of the tested package from the unloading buffer (four). The unloading buffer 33 may be located in an area (area (1) between the user tray and the unloading position in the unstacking stacker. The first-unloading pickup 321 picks up the tested packaged wafer from the unloading buffer 33 and picks up the packaged wafer The packaged wafer is housed in a user tray located in the unloading stacker. The first: the unloading picker 321 can classify the tested domain wafer according to the test result and then collect it into the corresponding user tray. For example, "8A" As shown in the "figure map", the step of accommodating the packaged wafer after the test is performed in the unloading buffer 33 may further include the following steps: ^ The position of the square 322 is moved to be above the unloading buffer 33. The knife fox S " another separation zone S system and the second unloading pick (4) will test 39 200945482 after the package crystal # is closest to the separation point located in the unloading button. The unloading picker 322 accommodates the tested packaged wafers in the unloading 33. As described above, the 'second unloading picker 322 can load the tested packaged wafers, and the stack of the load buffers 33 is moved to the nearest Separation The separation zone of R or S ^ or u above 'in the separation zone R or s, the tested package wafer will be separated from the test tray τ located at position 3a. What is the movement theory located in the separation zones R, S and U? At the same time, it is possible to shorten the distance of moving the first unloading picker 322 to perform the unloading process. 33 φ ΐ ΐ to "9D", at least one of the plurality of load buffers The step of moving up the area along the (4) moving path F to the upper portion of the loading position may include the following steps = at least one of the plurality of unloading buffers 33, which is lower than the first position The two knows the wafer from the unloading position: the package after the test:

R means that more than 33 points are added to the top of the _r, and the separation 322 can be separated from the 牦 牦 卸.罝200945482 As described above, when the second unloading picker 322 changes the separation area R or s of the packaged wafer after the test is separated from the test tray τ located at the unloading position 3a, the unloading buffer 33 can be moved to the corresponding separation area. The area above R or S. Thus, where is the separation zone and the s, it is possible to shorten the distance by which the second unloading picker 322 is moved to perform the unloading process. Now, we will combine the method of sending the _-------------------------- As shown in "Fig. 1" to "Fig. 12", the test tray transfer method according to an embodiment of the present invention comprises the following steps. First, the loading unit 2 performs the loading and unloading of the wafer to be tested in the test T of T. As described above, the «pickup=buffer 23 can be carried out according to another example shown in the "Third Diagram 8" to "4D Diagram" shown in "Picture 3" to "Defense Diagram". The job, which constitutes the loading process. ', will have passed the process __ read τ from the position of the first position of the off position & The _ drop unit 24 is lowered. / Down. Transfer the test tray T at the first disengaged position & to the path position 4 of the chamber system 5. The test tray τ can be transmitted through the first load. * 廷早兀61 200945482 A test tray τ located in the path position 4 and having passed the loading process is transferred from the path position 4 to the chamber system 5. The test tray τ can be transferred from the passage position 4 to the first chamber 51 through a transfer tool (not shown) disposed in the passage position 4 or the chamber system 5. When the path position 4 includes the rotating unit 41, the test tray τ can be rotated through the single 〇

Element 41 is rotated from a horizontal state to a vertical state and subsequently transferred from passage position 4 to chamber system 5. In the chamber system 5, the package wafer contained in the test tray is adjusted to a second temperature to connect the package wafer adjusted to the first temperature to the high precision positioning test package wafer, and the package wafer after the test is adjusted to the second temperature. During the process of transferring the measuring disc τ to the first chamber 5, the second chamber S2 and the third chamber 53, the first wafer is adjusted to the first temperature through the first chamber 51, and the second wafer is passed through the second chamber. The chamber 52 connects the sealed wafer adjusted to the first temperature to the high-precision positioning plate and is tested, and the test package wafer is adjusted to the second temperature through the third chamber 53. The test tray containing the tested packaged wafer is transferred from the chamber system $ to the path position 4. The test tray τ can be transferred from the third chamber 53 to the path position 4 through a transfer 1 (not shown) disposed in the path position 4 or the chamber system $. When the path position 4 contains the rotary unit ,, the test field τ can be rotated from the vertical state to the horizontal state by the rotary unit 42 200945482 41 and then transferred from the chamber system 5 to the path position 4. The test tray T of the packaged wafer, which is placed in the path position 4, is transported from the path position 4 to the first-arrival position 2b below the unloading position %. The test tray τ can be transmitted through the first transfer unit & Here, the step of transferring the test sample T located in the path position 4 and containing the tested cover wafer from the path position 4 to the first-arrival position 2b may be located at the first-disengagement position 2e_test τ The step of transmitting to the path position 4 is simultaneously directed. The test tray τ can be transmitted simultaneously through the first transfer unit 61. Let the position at the first-arrival position 2b _ test τ rise to the shout position. The test tray τ can be raised through the second ascending/descending unit 34. The unloading process is performed on the test tray ❹T at the unloading position, for example, by using the package wafer unloading method. As described above, the unloading picker 32 and the unloading buffer can be performed according to an example shown in "Audio 8" to "8D" or another example shown in "9th to 8th". Homework, which constitutes a dismantling process." The test tray τ that has been unloaded is passed through the second disengagement position 3 to reach the position 2b, and the age is set to 3a. The tray can be lowered from the unloading position 3a to the first position through the second ascending/descending unit 34, and can be made to pass from the second disengaged position to the position 2b' and through the first ascending and descending unit through the second transfer unit. From the first-arrival position 43 200945482 2b to the loading position 2a. Sheet Manufacturing Method Conducting A package crystal of an embodiment of the present invention will now be described in detail with reference to the accompanying drawings. This package wafer fabrication method includes steps similar to the test tray transfer method. Therefore, in order to clarify the details of the present invention, a detailed description of the method of manufacturing the packaged wafer will be omitted below, and only the differences will be described.

As shown in the second to the "12th", the difference in the method of transmitting the packaged wafer k square wire of the present invention to the present embodiment lies in the following points. First, a test rider wafer will be prepared. The packaged wafer to be tested can be prepared by storing the user who contains the packaged wafer in the decorative stacker 2i. The packaged wafer can be a memory or non-memory sealed wafer. Then, by repeatedly performing the above steps, the fabrication of the packaged wafer can be completed. The present invention has been described above with reference to the preferred embodiments of the present invention, and it is not intended to limit the invention, and it is intended that the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of patent protection of the invention shall be subject to the definition of the patent, which is attached to this specification. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic plan view of a test handler according to an embodiment of the present invention; FIG. 2 is a perspective view of a loading unit and an unloading unit; 200945482. 帛3A to 3D are load buffers A side view of an example of one of the working positions of the loading picker; FIGS. 4A to 4D are side views of another example of the working position of the load buffer and the loading picker; FIG. 5 is a loading unit, Schematic diagram of the path of the test tray between the scale recording and the unloading red; ❹ Figure 6 is a front view of the loading material, the unloading unit and the passage position; Figure 7 is a plan view of the loading and unloading scales; Figure 8A to The first diagram is a side view of one example of the unloading buffer and the loading position of the pick-up picker; Figure 9A to Figure are side views of another example of the working position of the unloading buffer and the clock-loading picker; A schematic diagram of the path of the test transport transport test tray of the present invention; and FIGS. 11 and 12 are perspective views of the transport unit in the test transporter of the embodiment of the present invention. [Main component symbol description] 1 Test carrier I-load unit 45 200945482

3 Unloading unit 4 Path position 5 Chamber system 6 Transfer unit 2a Loading position 2b First arrival position 2c First disengagement position 3a Unloading position 3b Second disengagement position 3c Second arrival position 21 Loading stacker 22 Loading pickup 23 Loading buffer 24 First rising/lowering unit 31 Unloading stacker 32 Unloading picker 33 Unloading buffer 34 Second ascending/descending unit 41 Rotating unit 51 First chamber 52 Second chamber 46 200945482

53 third chamber 61 first conveying unit 62 second conveying unit 23a loading rail 33a unloading rail 221 first loading picker 222 second loading picker 241 first rising/lowering element 242 first driving unit 321 first unloading picking 322 second unloading picker 341 second ascending/descending element 342 second driving unit 521 contact unit 611 first conveying element 612 second conveying element 613 moving element 621 third conveying element 222a distance 222b moving distance 322a distance 47 200945482 A Loading movement path B area C area E first ascending/descending path F unloading movement path G area H ❹ J high-precision positioning plate second ascending/descending path L housing area V housing area M housing area R separation area S separation area T 〇 u Test tray separation area 1H Width 1L Length 48

Claims (1)

200945482 X. Patent application scope: 1. A test handler, which includes: a chamber system in which the packaged wafers contained in the test enamel are connected to - high precision = and 5 rods | 丨 silk · and tested; an unloading unit, the The unloading unit includes at least one extractor that moves an unloading buffer along an unloading moving path formed above the beak-type tray and at an unloading position In order to unload the picker, the test tray is located at the position where the test tray is located when the gg and L are separated from the H-type tray. The unloading picker_ is in the test tray at the unloading position. The upper unloading process is executed, and the unloading element setting_the side table of the fresh element i is disposed between the loading unit and the unloading unit and connects the j loading unit_dismounting element to The cavity (four) period allows the field containing the wafer to be tested to be transferred to the chamber system and the test of the valley is controlled, and the test can be transferred from the cavity to the unloading unit; , 49 200945482 and will remove the __ (4) unloading interpretation of the station. 2. The test handler of claim 1, wherein the unloading unit comprises a plurality of unloading buffers, the unloading buffers being individually movable, # at least one of the plurality of unloading buffers The unloading movement path can be moved along the test tray located at the (four) position. (4) The picking machine of claim 1, wherein the loading unit comprises at least one loading buffer, the loading buffer being mounted along a load formed above a test tray at the loading position Move the path to move. The test handler of claim 3, wherein the loading buffer is located above the loading tray at the loading position along the loading path. 5. The test handler of claim 1, wherein the loading unit comprises a first upper 下降 下降 / descent unit 'department to enable the test tray to be formed along the financial position, a first-arrival position, and - - a - rise/fall ramp up and down among the disengaged positions, wherein the first arrival position is below the loading position and is the position at which the test tray arrives, the first disengaged position being located Below the first arrival position and in the position where the test tray is detached, the unloading unit includes a second ascending/descending unit for causing the 'tank tray to be formed along the unloading position, the second detachment a second rising/falling path rises and falls between the position and a second offset &quot; position, wherein the second 50 200945482 is out of position and is below the touch and is the position where the drive is disengaged, The second arrival position is below the second disengagement position and is the location at which the test tray arrives. 6. The pick-up machine according to claim 5, wherein the transport unit comprises: a transport sheet 7G, the first transport unit is configured to transfer the test tray in the first disengaged position to the access position and will be located The test tray at the path position is transferred to the second arrival position; and a transport sheet 7L for transporting the test tray at the second disengaged position to the first arrival position. 7. The pick-up machine of claim 6, wherein the first transport unit comprises: a first transport element for transporting the test tray in the first disengaged position to the access position a second transport element for transporting the test tray at the path position to the second arrival position; and - moving the 7G member, the first transport element being coupled to the second transport element Moving to the element, and the moving element moves the first transmitting element and the second transmitting element simultaneously. 8. The test handler of claim 1, wherein the unloading picker comprises: a first-to-unloading take-up n'm. The package wafer is housed in a tray located in the unloading stacker; and 51 200945482 takes n ' _ to separate the (4) wafer from the test tray located at the unloading position and accommodates the separated slab (9) In the unloading buffer, the separation-discharging-unloading picker divides the test tray located at the unloading position into a plurality of sub-categories and passes through the packaged wafer after the test. Lai, (d) __ is moved along the unloading path so that the moving distance of the first unloading pick is shortened when the second unloading picks up the unloading process. The test transporter described in Item 1, Item 1, wherein the load carrying unit comprises a plurality of independent moving unloading buffers, and at least one of the unloading Wei Chong ψ The movement path is moved over the test tray located at the unloading position, and wherein the other retraction system moves between the unloading position and the unloading position.隹χLoading a U. package wafer unloading method, comprising the steps of: placing a second unloading picker from the located-unloading position _ separating the test package, the test tray is in a packaged wafer Positioning: at least one unloading buffer of the plurality of unloading buffers is formed along the forming layer 52 200945482; the unloading moving path above the test tray at the riding position causes the 彳-one unloading buffer (10) to be located Positioning the test tray above the unloading position; causing the second unloader to hold the (4) seal, m is accommodated in the unloading buffer; and the riding buffer containing the tested packaged wafer is placed along the The unloading/moving path is moved to a first-unloading picker capable of picking up the position of the tested packaged wafer from the unloading buffer; and causing the first unloading/removing 11 to pick up the tested sealed piece from the unloading buffer The packaged wafers that are taken out are housed in a user tray located in the unloading stacker. 12. The package wafer unloading method of claim U, wherein the plurality of unloading buffers of the unloading buffers are arranged along the load axis formed above the test disk located at the unloading position. The step of causing at least one unloading buffer to be located above the unloading tray comprises: moving at least one of the plurality of unloading buffers to be lower than the second (10) The step of separating the position of the test tray from the position_mounting position. 13: The method for unloading a packaged wafer according to claim 11, wherein the step of causing the second unloading and picking test package to be contained in the unloader is the following step: 5 53 200945482 Age taking_简Domain_social; and buffer t. (4) The method of accommodating the unloading M.-type test tray transfer method in the phase-like county, including the steps of the town: #位H Π早早&quot;°, the packaged wafer to be smashed is received in a loading tray-loading Process, the loading position is the test support There is a side trial of the position where the crystal material test tray is located; so that the position has been lowered and the position of the Zhao Lai axis is lower than the position (4); the drop is lowered to the position of the first release position. The lining unit and the m, _-view position; the 4-way path position and the over-loaded surface (4) test tray is transferred from the path position to the chamber system; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> After the test, the miscellaneous wafer is adjusted to a second temperature to send the tested packaged wafer to the path position; the test tray is transferred from the chamber system to be located at the IT path and contains the test of the difficult wafer after testing The tray is transported from the δHai path position to the first arrival position 54 ❹ ❹ 200945482 located below the unloading position, which is regarded as the test tray when the packaged wafer is dispensed from the fine test tray. Position of the test; the test shop located at the first-instance is raised to the unloading position; at the unloading (four) test, the execution of the unloading process; and the test of the unloading Transmitting from the unloading position to the loading position by means of the second uncoupling position and the second disengagement position of the second arrival position and the -first arrival position between the loading position and the first disengagement position, wherein Located at The step of performing the unloading process on the fine-tuning disk of the unloading position comprises the steps of: separating the second unloading pick-up from the test disc located at the (four) position; and separating the plurality of unloading ships; At least one unloading sway in the rush n moves along the unloading movement path formed above the test mitigation of the detachment so that at least one unloading rush (10) is located at the unloading Above the test tray; the package W after the second #1 pick-up H test is accommodated in the unloading buffer; and the unloading county "accepting the unloading_n along the unloading moving path to the - a first-unloading pick-up||capable of (iv) unloading the position of the packaged wafer after the test in the unloader; and 55 200945482 causing the first unloading picker to pick up the tested packaged dice from the unloading buffer and picking up the picked The packaged wafer is housed in a user tray located in an unloading stacker. 15. The method according to claim 14, wherein at least one of the plurality of unloading buffers is shaped along the shape The unloading action above the test tray at the unloading position causes at least one of the unloading buffers to be located above the test tray of the domain (10) to include a plurality of unloading At least one of the unloading buffers in the buffer moves to a position lower than a position at which the second unloading picker separates the tested packaged wafer from the test tray located at the unloading position. The test tray transfer method, wherein the step of causing the second unloading picker to receive the tested sealed wafer in the unloading buffer comprises the following steps: © moving the second unloading picker to the unloading buffer Above the device, and the package that has been subjected to the second unloading and being tested, is accommodated in the load buffer. 17. The method of transfer according to claim 4, wherein the step of transporting the first tray disengaged from the stack to the pass-theta of the chamber (four) of the Weixian domain is to be located in the passage The step of transporting the test package containing the tested package from the position of the path to the first position of the 5 mile located below the (4) position is performed simultaneously. 56 200945482 18. A method for manufacturing a packaged wafer, comprising the steps of: preparing a packaged wafer to be tested; and causing the loading unit to perform the loading of the prepared packaged wafer on a split tray (four)-loading process, the remaining The position of the test tray when the packaged wafer to be tested is received in the test tray; Ο ❹ the position that has passed the Wei system (four) is lower than the position of the installation Position; - lion (four) engraving _ transmission connection of the loading 兀 /, a cavity to the system one way position; the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Having the chamber attached to the packaged wafer of the test tape to a temperature, connected to the first temperature package (8) to the high precision positioning plate and testing the packaged wafer, the packaged wafer after the test Adjusting to a second temperature; transferring the test tray of the packaged wafer after the measurement of the valley 4 from the chamber system to the path position; and testing the package (9) after the position of the channel is reserved The disk is transferred from the path position to the -first-arrival position below the location of the domain, the unloading position (four) wrinkles m is placed on the position where the test tray is located after the test is applied; 57 200945482 The test tray of the first arrival position is raised to the unloading position; a load-carrying process is performed on the test tray located at the unloading position; and the test tray that has passed the unloading process is passed between the unloading position and the a second disengagement position between the second arrival position and a -first-arrival position between the loading position and the first-disengagement position from the unloading position to the loading position, wherein at the unloading position The step of performing the unloading process on the test tray comprises the steps of: separating the first unloading picker from the test tray located at the unloading position; and at least one domain buffer of the plurality of unloading buffers ^ moving along the moving path formed above the job located on the unloading so that at least one unloading buffer is located at the unloading position Above the test tray; causing the second unloading pick 11 to receive the tested package crystals &gt; 5 in the unloading buffer; and enclosing the packaged crystal shots along the thief The unloading movement path moves to the position where the unloading picker can pick up the tested package wafer from the unloading buffer; and causes the first unloading picker to pick up the tested packaged wafer from the unloading buffer and The picked-up I-chip is housed in a 58 Ο Ο 200945482 user tray located in the - (4) stacker. 19. The method according to claim 18, wherein the plurality of unloading buffers and at least one of the unloading buffers are moved along a path of the unloading movement formed above the measurement at the unloading position. A ^ ^ system is located in the unloading of the heart, A complex unloading curry [Too 11 training surface contains u ^ 〇, an unloading buffer moved to below the second: take n will The package of the wafer is separated from the disk at the unloading position. The package wafer manufacturing method according to Item 18, wherein the package chip after the second unloading:= is received in the unloading buffer The steps include: moving the second unloading picker to the top of the unloading buffer; and unloading the _ job (four) hidden (10) unloading 59