201133000 六、發明說明： • 【發明所屬之技術領域】 本發明係關於一種裝置分類設備，並且特別地，本發明關於 一種半導體裝置分類設備，其能夠根據一分類標準自動分類例如 半導體晶片之裴置。 【先前技術】 經歷過一封裝製程的半導體裝置（以下，稱作"裝置〃）經歷 多種測試，例如電氣測試、以及抵抗熱或壓力的可靠性測試。 對於裝置的這些測試之燒制試透過絲置插入至一 燒機板中’魏機板容_—賴職設射，並且峨測試時 間向燒機板朗熱或壓力，用⑽彳試這钱 -種用於錢職之分類設縣秘樣-種設備^二 燒機測試之躲置賴（插人）至輯钱置的燒機板中的空位 置C W ’ Μ根縣_裝置之測試結果，根據應_料好及 展產品的每—裝置之分類群，將這鍊置 有 試裝置的燒機板域（分類）至每—域。裝輪燒機測 分類設備之性能根據每小時分類 單元）評估，並且，每小時單元（UPH)=每小時 件之間的裝置及燒機板所花費之時_定。、认備的母-凡 為了提高每小時單元（UPH)， 結構及排列。 而要&分類設備之各元件之 201133000 【發明内容】 裝置Γ二，本發明之目的在於提供―種半導體 裝置刀▲備，其能夠透過減少—面板裝载器與—χ_γ平 的燒機板之交換時間顯著提高處理速度。 ° s 本發明之另—目的在於提供—種半導體裝置分槪備 門^減ί 一面板裝載器與一 Χ_Υ平台之間的燒機板之交換時 :三—過安裝—提升單元於—對格架職單元之間，其中格架裳 早7C之上裝载有具有燒機板的格架，用以自該等格架裝 取回該等格架且與Χ_γ平台交換燒機板，能夠顯著提高處理速产。 本發明之再-目的在於提供一種半導體裝置分類設備，^ 過衫一面板農載器與-X_W台之間的燒機板之交換時間、，透 過女裝-燒機缺顧解元，㈣在χ_γ平台與面板裝载 間，換燒她且在觀底方向以及水平方向上移域機板交換緩 自面板裝載器之中裝載的格架抽回燒機板， 者提尚處理時間。 為了獲得本發明之目的之這些及其他優點，現對本發 體及概括性之贿’本發明之—種半導體裝置分備包含有了 一 Χ-Υ平台’用以袋载_燒機板，此燒機板之中插入有複數個第 H - Χ-Υ平台驅動單元，用以移動χ_γ平台以便透過盘一 苐二傳送卫具交互作業細這些第二裝置，將複數個第一裝置插 入至燒機板之空部份之中，以及當第一裝置與第二裝置在燒機板 之亡完成交換_χ_γ平台移動至一燒機板交換位置；—面板裝 載益’用以順次錢其中播人有複數個第二農置的燒機板、其中 201133000 插=有第—裝置的燒機板，由此將其恤人有第_裝置之燒機板 •傳运至-燒機峨單元；以及-燒機缺換緩鮮元，用以將其 ★入有XYi^台之第一裝置的燒機板與其中插人有面板裝載器 之第二裝置之燒機板相交換。 _八此Χ·Υ平台包含有—對燒機板蚊單元，此對燒機板固定單 讀=在-頂位置及—底位置固定—燒機板丨以及—燒機板上下 飾單元’其在此職機Μ定單元之_頂及底方向上的至少 2方向上’移動此對燒機板固定單元之—個巾固定的燒機板， 二此燒機板乂換緩衝單兀包含有—職機板緩衝單元，此對燒 機板緩解元分顧以在χ_γ平台之燒機板岐單油對應的一 頂位置及—底位置固定-燒機板。 -中〃上具有第—裝置的燒機板自面板裝顧抽回，並且藉 由燒機板緩衝單元之_勒峨敵緩解元，傳送至切 =之-頂侧的燒機板固定單元，以及其上具有第—裝置的燒機 平台之—底侧_定板岐單元細，並且藉由燒機板 父換緩衝單元之-底_燒機板緩衝單_送至面板裝载器。 板 此燒機板透過燒機板交換緩衝單元與面板裝载器之間的一個 2多個副錄件傳送，以錢细触件在燒機板賴緩衝單元 :、面板裝齡之_部份撕應之魏個鶴子部份移動燒機 此對格架裝载 用以在其上裝载複數組格架， 其中面板裝載器可包含有一對格架裝载單元， 早元位於Χ·Υ平台之一 Υ軸方向， 其安裝 、中這些格架之上具有複數個燒機板，·以及—提升單元， 7 S- 201133000 ==2=辭元⑽，肋自縣賴單—格架且在 頂方向及底方向上移動這些格架。 -盘裝载純含有—對格架㈣單元，此雜架抽回單 讀這兩錄钱鱗元相制，肋細 -個上裝_格架。 ⑽早疋之母 一梦=本發月之又—方面…種半導體裝置分類設備包含有： 二Π傳3以裝载7托盤’此托盤之上具有複數個第-裝 〜达工具’肋自—燒機板細複數個第二裝置；一 專送.、肖以將裝載單元之托盤上裝载的這些第一震置 ===:’· 一卸載單71 ’其透過第二傳送工具，透過 、、、；托盤之上卸載自燒機板抽回的第二裝置；一 X-Y平台’制以裝载—燒機板，燒機板之中插人有第二裝置； - X-Y平台驅動單元，其透過與第—傳駐具及第二傳送工具交 互作業在X軸方向及？軸方向上軸χ_γ平台，並且當第一裝置 在，機板之上域交換時，將χ·γΜ移動至—燒機 又、，φ板裝載$ ’其具有複數娜架裝鮮元，用以 裝載其上具錢數倾機板賴數健H及—频板交換緩 衝単兀’其安裝於面錢彻與χ·γ平台之間，以便在面板裝载 讀Χ-Υ平台之間交換複數個燒機板，用以自面板裝載器之上裝 載的格架抽回其中插人有第二裝置之燒機板，以及將其中插入^ 第-裝置之燒機板自χ_Υ平台插入至面板裝載器之上輯的格架 之一空部份。 、 此半導難置分類設備可更包含有—交換緩衝軸單元，用 201133000 讀，單元，直及林飾，贿得燒機板交 •、、 母才。架裝載單凡之上褒载的格架抽回燒機板。 換緩衝鶴單元可包含有—第—轉單元及—第二驅動單 =第-鶴單元根據面诚彻之上賴的辟之頂部份及底 喊機板交換緩衝單元之上Τ移動，第二驅動單元根據 、^之上排列的格架之_水平杨’卿麟板交換 早7G之水平移動。 ㈣2獲縣㈣之目的之這些及其他伽，現對本發明作具 性之描述，提供一種半導體裴置分類設備之面板裝載器 ==裝载器模組包含有作為一個模一 ^ 早兀及父換緩衝驅動單元。 本發明之半導體裳置分類設備可具有以下優點。 杯置分類設備具有燒_交換緩衝單元，燒機 板父換緩衝單元用以當裝置穿 切平台上的频機板之上或自 且在完全將裝置裝載於χ.γ平台二燒機板，並 的燒機板抽回之後，用以六拖^攸機板之上或自Χ·Υ平台上 α 乂換Χ-Υ平台之燒機板。這樣可允哞縮 紐燒機板之交換時間用以提高處理速度。 U允物 第-，半導體裝置分類設備具有提 -對其上輯有格架（ 研早騎裝於 間，用以_格_^=有元之 此縮短燒機板在面域载器與抽回格架由 著提高半瓣置分類設備之處理速度 _，由此顯 201133000 第三，半導難置分類設備具錢機缺換緩衝單元，燒機 板交換緩衝單元用以在Χ_γ平台與面域脑之間交換燒機板， 並且在頂及底方向以及水平方向獅燒機缺換緩解元以便自 面板裝載ϋ之巾裝載的格架細燒機板。這樣可允許縮短 之交換時間以提高一處理速度。 板 本發明之上述及其他目的、特徵、方面及優點將結合圖式部 份並在本發明之以下詳細之描述帽得更加明顯。 【實施方式】 以下將結合圖式部份詳細描述本發明。 為了結合圖式簡單描述，相同或等價之元件使用相同標號表 不，並且將不重複其描述。 下文中，將結合附圖部份，更詳細据述本發明之半導體裳置 分類設備（將稱作〃裝置分類設備，，）。 ▲如帛:圖」及「第2圖」所示，本發明之裝置分類設備保 護有「裝載單元⑽、一卸載單元2〇〇、-分類單元300、以及第 二傳送工具51〇、第四傳送工具52〇、第一傳送工具別、第二傳 送工具54〇、第五傳送工具⑽及分類卫具5⑼姻傳送裝置川。 燒機板2〇表示-其上裝載有複數個裝置⑺的面板，以 便在一燒_試賴（圖絲）執行—燒_試。肚，燒機板 20具有複數個插槽，這些插槽用以將這些裝置1G插入至其中，以 便在-高溫下執行—電特性及—訊雜性測試。 經，燒機測試的第二裝置1G自裝置分類設備的χ·γ平台 之上固疋的燒機板2〇抽取出’並且第一裝置⑺裝載於燒機板 201133000 之中 χ_γ平台用以裝载其中插入有第二㈣㈣燒機板如， 、、且用X卸载插入有第—裝置1〇的燒機板况。如「第1圖」、「第 2圖」以及「第4圖」所示，γ y ^ . χ &^平台41〇包含有一燒機板交換裝 -丁用以接收執行交換裝置1〇的燒機板如，或用以釋 放經歷裝置10之交換的燒機板20。Χ·Υ平台·透過- χ_γ平 台驅齡70 (圖未示）之驅_域機板，贿得透過-務後描 述之第:傳送工具530’第一裝置1〇能夠插入至燒機板2〇之空部 份或第二裝置1〇能夠自燒機板2〇收回。 X-Y平台驅動單对具有不同之結構。舉例而言，“平A 驅動單元可透過與一第二傳送工具_及-第-傳送工且530 ; =作’在X-Y方向或州方向上移動其上裝載有燒機板2〇 的X-Y平台410，以使得第二傳送工具540及第-傳送工且53〇 能夠容易將襄置1〇插入至燒機板或自燒機板20抽取出、。 更具體而5 ’ Χ_Υ平台驅動單^，可移動Χ·Υ平台410，以 便透過與第二傳駐具54G的交互作業自燒機板Μ _第 1〇且將第—裝置1G插人至燒機板2G之空部份之中。—旦第二裝 置10完全插入至燒機板20之中，χ·γ平台驅動單元可mi 台410移動至一燒機板交換位置。 X-Y平台410安裝於本發明之一裝置分類設備之主體。並 且’主體4G可包含有—具有—開口 41的頂面板42，透過第 送工具53〇及第二傳送工具54〇，裝置1〇通過開口 ; 2〇收回或插入至燒機板2〇之中。 域板 11 St* · 201133000 裝載單元100將其上裝載有第 機板20之上（托盤3〇將稱作一，， 之結構。 一裝置10的托盤30裝载於燒 裝載托盤〃），並且可具有不同 …卸載單元透過將第二裝置10之中良好之裝置（以下，將 =乍良好產W )裝载於—托盤3G之上（以下，托盤如將稱作 -卸载托盤ο執行卸载，並且可具有不同之結構。 如「第2圖」所示，裝載單元100及卸載單元2〇〇通常分別 包各有料軌110、210，以及一驅動單元（圖未示），其中導執 110、210用以導向一托盤3〇之移動，並且驅動單元用以移動一托 裝載單元100及卸载單元2⑻可根據設計條件具有不同之排 列。如「第1圖」及「第2圖」所示’裝載單元1〇〇及卸載單元 2〇〇、通常彼此相平行設置，以使得一測試單元⑺、卸载單元·、 :分類單元300、-第-移動緩衝器_、-第二移動緩衝器700 等可安裝於其間然而，本發明並不限制於此。 在第震置自震載單元1〇〇之托盤30抽回之後，空托盤 30可透過-托盤傳送單元（圖未示）傳送至卸載單元㈣，以使 得第二裝置10能夠裝载於其上。 這裡，裝置10可保留於托盤30之中。因此，可更安裝一用 於旋轉托盤3G的托舰轉單元W且因此在托盤％自裝載單元 100傳送至卸载單元2〇〇之前，去除托盤3〇之上保留的裝置1〇。 如「第1圖」及「第2圖」所示，托盤旋轉單元15〇安裝於 裝載單元100與卸載單元2〇〇之間的托盤3〇之一傳送路徑上。並 12 201133000 且，托盤旋轉單元150透過一托盤傳送單元旋轉自裝載單元ι〇〇 接收之托盤30，並且然後將托盤3〇傳送至卸載單元200。 在托盤旋轉單元150之-側，可更安裝有一空托盤單元16〇， 用以將-空托盤3〇供給至分類單元3⑻、卸载單元等，或用 於臨時裝載來自裴載單元100的空托盤30。 此裝置分類設備可更具有一測試單元17〇，用以在將第一裝置 10裝載於燒機板2〇上之前’測試自震載單元100接收之裝置之電 特性，例如直流（DC)特性’以便僅將良好的第一襄置⑴裝載 於燒機板20之上。 透過測試單元170的第一裳置 要解釋的分類單元300的資料。 測試單元no可安裝於裝載單元100肖第一移動緩衝器_ 之間並且包含有與第一裝置10電連接之複數個插槽。較佳地， 與水平方向的鋪30相目之插射絲於—水平方向。 裝置10之測試結果用作透過稍後將 300,分類單元300 W，以及根據透過 本發明之裝置分類設備可包含有分類單元3〇〇 用於其上裝載確定為拒收產品的第-拒收裝置1()， 測試單元170的測试結果待分類的第二拒收裝置I! 類單元遍可根據排列及分類基礎具有不同之結構，並且201133000 VI. Description of the Invention: • Technical Field of the Invention The present invention relates to a device sorting apparatus, and in particular, to a semiconductor device sorting apparatus capable of automatically classifying, for example, a semiconductor wafer according to a classification standard . [Prior Art] A semiconductor device (hereinafter, referred to as "device〃) that has undergone a packaging process undergoes various tests such as electrical testing and reliability testing against heat or pressure. For the test of the device, the firing test is inserted into a burning machine board through the wire. The 'Wei machine board capacity _- Lai's job is set, and the test time is hot or pressure to the burning machine board, and the money is tested with (10) - Kind of use for the classification of the money job to set up the county secret sample - kind of equipment ^ two burning machine test to hide the Lai (insert) to the empty position of the burning machine board CW 'Μ根县_装置 test results According to the classification group of each device of the product and the product, the chain of the burning machine of the test device is classified (classified) to each domain. The performance of the sorting machine is evaluated according to the hourly sorting unit, and the hourly unit (UPH) = the time between the unit and the burning board between the pieces. The mother-of-the-job-in order to improve the hourly unit (UPH), structure and arrangement. And 201133000 of the components of the & classification device. [Invention] The second object of the present invention is to provide a semiconductor device, which is capable of reducing the panel loader and the - χ γ ping machine board. The exchange time significantly increases the processing speed. ° s Another object of the present invention is to provide a semiconductor device for the replacement of a burner panel and a panel loader and a Χ Υ platform for the exchange of the burner board: three - over installation - lifting unit in the - grid Between the units, in which the grid is loaded with a grid with a burning plate, which is used to retrieve the grid from the grid and exchange the burning plate with the Χγ platform. Improve processing and quick production. A further object of the present invention is to provide a semiconductor device sorting device, which can exchange time of a burnt board between a panel of a farmer and a -X_W, and a solution of the burnt-out machine through the women's wear-burning machine, (4) on the χ γ platform Between the panel loading and the panel loading, the grilling machine is replaced by the rack-removing burner plate loaded in the panel loader in the bottom direction and the horizontal direction, and the processing time is raised. In order to obtain these and other advantages of the object of the present invention, the present invention and the generalized bribe 'the semiconductor device of the present invention are separately provided with a Χ-Υ platform' for the bag-burner plate, A plurality of H-Χ-Υ platform driving units are inserted into the burning machine plate for moving the χγ platform to exchange these second devices through the disk-transporting aids, and inserting the plurality of first devices into the burning Among the empty parts of the machine board, and when the first device and the second device are in exchange for the death of the burning plate, the _χ_γ platform is moved to a burning plate exchange position; the panel loading benefit is used to order the money. There are a plurality of burner boards of the second farm, wherein the 201133000 plug = the burner board of the first device, thereby transporting the burner board of the first device to the burner unit; - The burner is replaced with a slow-changing element for exchanging the burner plate of the first device having the XYi table with the burner plate of the second device into which the panel loader is inserted. _ 八Χ Χ Υ Υ 包含 包含 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对 对In the at least 2 directions in the top and bottom directions of the job setting unit, 'moving the fixed plate of the fixed plate of the burning plate, the two plates of the burning plate are included - The machine board buffer unit, the pair of burner board mitigation element is divided into a top position corresponding to the single oil in the χ_γ platform, and a bottom position fixed-burning board. - the burner plate with the first device on the middle plate is withdrawn from the panel, and is transferred to the burning plate fixing unit of the cutting side by the burning plate buffer unit. And the bottom side_station plate unit of the burner platform having the first device is fine, and is sent to the panel loader by the burner plate replacement buffer unit. The burner board is transported through a plurality of sub-recording parts between the burning board exchange buffer unit and the panel loader, and the thin-touch parts are arranged in the burning unit: the panel ageing part The tee crane part of the mobile burning machine is loaded with the grid array to load the multi-array grid, wherein the panel loader can include a pair of grid loading units, which are located on the platform of the Χ·Υ One of the axis directions, the installation, in the middle of these grids have a plurality of burner boards, and - lifting unit, 7 S- 201133000 == 2 = resignation (10), ribs from the county Lai single - grid and Move these grids in the top and bottom directions. - The disk is loaded with purely - on the grid (four) unit, this frame is pulled back to read the two recorded money scales, and the ribs are thin - a top-loaded _ grid. (10) Mother of the early morning dream = this aspect of the month of the month - the semiconductor device classification equipment includes: Two Π 3 to load 7 trays 'There are multiple number one on the tray - the tool ribs - the burner board has a plurality of second devices; a special delivery, and the first shock placed on the pallet of the loading unit ===: '· an unloading slip 71' through the second conveying tool, Through the second device that unloads the self-burning machine board on the tray; an XY platform' is loaded with a burning machine board, and a second device is inserted into the burning machine board; - XY platform driving unit Is it working in the X-axis direction by interacting with the first-passing station and the second transfer tool? The axis χ _ γ platform in the axial direction, and when the first device is in the domain exchange on the upper plate, the χ·γΜ is moved to the burning machine, and the φ plate is loaded with a plurality of Loaded with the money and the number of the board, and the frequency board exchange buffer 単兀' is installed between the platform and the χ·γ platform to exchange the plural between the panel loading and reading platform. a burning machine plate for withdrawing a burning machine board into which a second device is inserted from a grid loaded on the panel loader, and inserting the burning machine board inserted into the first device into the panel loading One of the grids on the top of the grid. The semi-conducting and difficult-to-use classification equipment may further include an exchange buffer shaft unit, which is read by 201133000, unit, direct and forest decoration, bribe to burn the machine board to pay •, and mother. The frame is loaded with a frame that is loaded on the top of the frame. The change buffer unit may include a - first-turn unit and a second drive single = first----the unit is based on the top part of the surface and the top of the bottom plate exchange buffer unit. The driving unit exchanges the horizontal movement of the 7G level according to the grid arranged on the top of the grid. (4) 2 These and other gammas for the purpose of the county (4), which are now described in the present invention, provide a panel loader for a semiconductor device classification device == The loader module contains as a module and a parent Change the buffer drive unit. The semiconductor skirt sorting apparatus of the present invention can have the following advantages. The cup setting sorting device has a burning_exchange buffer unit, and the burning board is replaced by a buffer unit for loading the device on the frequency board on the cutting platform or automatically and completely loading the device on the χ.γ platform second burning board. After the burner board is withdrawn, it can be used on the six-drawing machine board or on the platform of the Χ·Υ platform for the Χ-Υ platform. This allows the exchange time of the shrinking machine board to increase the processing speed. U Yunwu--, the semiconductor device classification equipment has a mention - there is a grid on the upper frame (study early riding in the room, used to _ _ ^ = have the yuan to shorten the burning board in the area carrier and pump The back frame is improved by the processing speed of the half-lobed sorting device _, thereby showing 201133000. The third, semi-conductive hard-to-wear sorting device has a machine missing buffer unit, and the burning board exchange buffer unit is used for the Χ_γ platform and surface. Exchange the burner board between the domain brains, and replace the mitigation elements in the top and bottom directions as well as the horizontal direction lion burning machine to load the grid-burning machine board loaded from the panel. This can shorten the exchange time to improve The above and other objects, features, aspects and advantages of the present invention will become more apparent in conjunction with the appended claims in the <RTIgt The present invention is described with the same reference numerals, and the description thereof will not be repeated, and the description will not be repeated. Minute Class equipment (will be referred to as "〃 device classification device,") ▲ 帛 帛: Figure and "Figure 2", the device classification device of the present invention is protected with "loading unit (10), an unloading unit 2, - The sorting unit 300, and the second transporting tool 51, the fourth transporting tool 52, the first transporting tool, the second transporting tool 54, the fifth transporting tool (10), and the sorting aid 5 (9) 2〇 indicates that the panel on which a plurality of devices (7) are loaded is used to perform a burn-test on a burn-in. The burnt plate 20 has a plurality of slots, and these slots are used to These devices 1G are inserted therein for performing at - high temperature - electrical characteristics and - signal impurity test. The second device 1G of the burn-in test is built on the χ·γ platform of the device sorting device. 2〇 extracted 'and the first device (7) is loaded in the burning machine board 201133000 χ γ platform for loading the second (four) (four) burning machine board inserted therein, and the X-unloading inserted the first device 1 〇 burning Machine condition, such as "1st picture", "2nd picture" and "4th picture" The γ y ^ χ & ^ platform 41 〇 includes a burn-in board exchange package for receiving a burn-in board that performs the switching device 1 , or for releasing the burn-in board 20 that is subjected to the exchange of the device 10 . Χ·Υ platform·through- χ_γ platform drive age 70 (not shown) drive _ domain board, bribe through - after the description of the description: transfer tool 530 'first device 1 〇 can be inserted into the burnt board The 〇 部份 或 第二 第二 XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY XY - the first transfer worker and 530; = 'moving the XY stage 410 on which the burner board 2 is loaded in the XY direction or the state direction, so that the second transfer tool 540 and the first transfer tool can easily Insert the 〇 1〇 into the burner board or the self-burning machine board 20 to extract. More specifically, the 5' Χ _ Υ platform driver unit ^, can move the Χ Υ platform 410, in order to interact with the second stagnation keeper 54G to self-burn the machine Μ _ 1 and insert the first device 1G to burn In the empty part of the 2G board. Once the second device 10 is fully inserted into the burn-in board 20, the χ·γ platform drive unit can be moved to a burn-in board exchange position. The X-Y platform 410 is mounted to the body of a device sorting device of the present invention. And the main body 4G may include a top panel 42 having an opening 41, through the first feeding tool 53 and the second conveying tool 54, the device 1 is passed through the opening; 2 is retracted or inserted into the burning plate 2 . Domain board 11 St* · 201133000 The loading unit 100 is loaded on the upper board 20 (the tray 3 〇 will be referred to as a structure, the tray 30 of a device 10 is loaded on the burning tray 〃), and There may be different...the unloading unit is loaded on the tray 3G by means of a good device (hereinafter, 乍good production W) in the second device 10 (hereinafter, the tray will be referred to as an -unloading tray ο performing unloading, And the structure may be different. As shown in FIG. 2, the loading unit 100 and the unloading unit 2 are generally respectively provided with the respective rails 110, 210, and a driving unit (not shown), wherein the guide 110, 210 is used to guide the movement of a tray 3, and the driving unit for moving the loading unit 100 and the unloading unit 2 (8) can be arranged according to different design conditions, as shown in "1" and "2". The loading unit 1〇〇 and the unloading unit 2〇〇 are generally disposed in parallel with each other such that a test unit (7), an unloading unit·, a classification unit 300, a first-moving buffer_, a second moving buffer 700, and the like Can be installed in between, however, this hair The empty tray 30 can be transported to the unloading unit (4) through the tray transfer unit (not shown) after the pumping of the tray 30 from the seismic loading unit 1 is removed, so that the second device 10 Here, the device 10 can be retained in the tray 30. Therefore, a carrier transfer unit W for rotating the tray 3G can be further mounted and thus transferred from the loading unit 100 to the unloading unit 2 at the tray % Before the crucible, the device 1 remaining above the tray 3 is removed. As shown in "1" and "2", the tray rotating unit 15 is mounted between the loading unit 100 and the unloading unit 2 The tray 3 is transported on one of the paths. And 12 201133000, the tray rotating unit 150 rotates the tray 30 received from the loading unit through a tray transfer unit, and then conveys the tray 3 to the unloading unit 200. On the side of the unit 150, an empty tray unit 16A can be further installed for supplying the empty tray 3〇 to the sorting unit 3 (8), the unloading unit, etc., or for temporarily loading the empty tray 30 from the load carrying unit 100. Device classification There may be further a test unit 17A for 'testing the electrical characteristics of the device received from the seismic loading unit 100, such as direct current (DC) characteristics, before loading the first device 10 on the burner board 2〇 so that only A good first device (1) is mounted on the burner board 20. The first pass through the test unit 170 places the data of the sorting unit 300 to be explained. The test unit no can be mounted on the loading unit 100. Between and including a plurality of slots electrically connected to the first device 10. Preferably, the plugs in the horizontal direction are in a horizontal direction. The test results of the device 10 are used later. 300, the sorting unit 300 W, and the sorting apparatus according to the apparatus according to the present invention may comprise a sorting unit 3 for loading the first-rejecting device 1 () on which the rejected product is determined, the testing of the testing unit 170 Resulting that the second rejecting device I! to be classified has a different structure according to the arrangement and classification basis, and
13 £ 201133000 與「第1圖」及「第2圖」所示的固定安裝之狀態之結構不 相同，分類單幻⑻可具有與裝載單元100及卸載單元200相類 似之結構。也就是說，分類單元3〇〇可包含有一對導向托盤3〇之 移動的導執，以及一移動托盤3〇的驅動單元（圖未示）。 這些傳送工具傳送燒機板2〇、裝載單元1〇〇、測試單元17〇、 卸載單兀200、分類單元3〇〇、第一移動緩衝器_、以及第二移 動緩衝S 7〇0之中或其中兩個之間的裝置1〇，並且可根據各元件 之排列可具有不同之結構。 舉例而言，這些傳送工具可包含有一第三傳送工具51〇、一第 四傳送工具520、-第五傳送工具55〇、以及一分類工具56〇 ,第 三傳送工具510在裝载單元1〇〇與測試單元170之間傳送裝置 10第四傳送工具52〇在測試單元17〇與第一移動緩衝器6⑻之 間傳送I置10 ’第五傳送工具55〇在第二移動緩衝器7⑻與部载 單凡200之間傳送裝置1Q ’以及分類工具迎在第一及第二移動 緩衝器600、700與分類單元3〇〇之間傳送裝置1〇。 傳运工具（第三傳送工具51〇、第四傳送工具52〇、第一傳送 工具530、第一傳送工具54〇、第五傳送工具55〇、以及分類工具 60)可包3有一第一傳送工具、以及一第二傳送工具mo， 第傳送工具530肖以接收裝載單元1〇〇之托盤3〇之上裝载的褒 置10且將接收之裝置1〇插入至第一移動緩衝器_與燒機板如 之間的燒機板2G之空部份，第二傳送工具傳送來自燒機板2〇 與第二移動緩衝器700之間的燒機板2〇之第二裝置1〇。 燒機板20之上裝載的裝置〗〇與裝載單元1〇〇之托盤3〇上裝 201133000 載的裝置10排列不相同，並且燒機板20之上裝載的事置i 目相比較於裝載單元100之托盤30上裝载的裝置1〇之數目更大。 因此’將裝置10傳送至燒機板20或將裝置1〇自燒機板 抽回的第-傳駐具530及第二傳送工具54G較佳傳送的裝置ι〇 之數目相比較於其他傳送工具之數目更多。舉例而言，第二傳送 工具530及第二傳送工| 54〇傳送12x2之裳置，而其他傳送工^ 傳送8x1、8x2等之裝置。 ' a 在這些結叙齡下，⑽傳錄小數目之較ig的傳送工 具能夠使驗除需要較多數目裝置1G的位置之外，需要較小數目 裝置之位置。這樣可減少裝置分類設備之製造成本，並且可提高 裝置分類設備之尺寸及可靠性。 间 考慮職置1G可交錄餅燒機板2()且自_板2q _， 第傳送工具’及第二傳送工具54〇可整體移動。 由於第三傳送工具及第四傳送工具52〇在測試單元17〇 位於其間的狀態下傳送裝置1G，因此第三傳送工具训及第四傳 送工具520也可整體移動。 考敍置H)之效率，第—傳送工具細及第二傳送工具· ^平方向上^取③之數目可與水平方向上裝置容賴（圖未示） 目相同。裝置容納槽用以將第一移動緩衝器_及第 緩衝器700中的裝置10«载於其上。 分類工具56G可具有不同之結構。舉例而言 ，分類工具560 個個或複數個。或者，分類I具可包含有至少一 第四傳送工具汹，用以在苐一移動緩衝器_與分類單元300 15 201133000 =傳适裝置1G ’並且在第二移動緩衝器7触分 間傳送裝置1〇。 一刀頰早几300之 每傳故具可包含有—個或多個拾取器以及— 裝置，拾取器在1一媳罝古。取斋傳迗 穿詈mi 収透過—真空壓力吸取 " 彳。取_送裝置用以在-x_z方向、 方向傳送拾取器。 數行特別地，傳送工具之拾取器可_—行，或例如咖的複 為了快速將複數個第一裝置10自襄載單元 ==卿哪如喻嫩L本發 類設備可包含有一第一移動緩衝器_ =二，第-軸__繼聰元刚與燒機板 時將第—裝置ω裝載於其上且傳送第-裝置10，第 =動緩衝器7GG安裝於燒機板2Q與卸鮮元·之間且將第二 裝置10裝载於其上且傳送第二裝置1〇。 第一移動緩衝H 600及第二移動緩衝器7〇〇可移動地安裝於 主體40 ’並且透過移動—使用燒機板2()交換裝置1㈣裝置交換 上置□使用裝载單W00或卸載單元交換裝置的裝置 、d置□以及使用分類單元300交換裝置的分類位置口 連續且平穩交換裝置10。因此，第一移動緩衝器㈣及第二移動 缓衝器700可顯著提高一分類速度。 …第-移動緩衝器_透過第二傳送工具54〇移動至裝载自測 -式單το 170接收之第一裝置】〇的_裝载位置（裝置交換位置）口、 201133000 貞工具5Γ移動至將拒_置】g傳送至分類單元的 30之痛位置a、以及移動至透過稍後將描述之第三 • 其他的第一裝置裝載於χ-γ平台4ω的燒機板如 之上的一裝載位置（裝置交換位置）Q。 一二「第3圖」所示’第—移動緩衝_包含有一裝置容納 =Ω導向件62G、以及-移動裝置（圖未示），裝置容納 早几610用以將裝置10裳載於其上’導向件_用以在主體40 可移動地支撐裝置容納單元610 置容納單元610。 _裝置透過導向件62〇移動裝 為了將一較大數目之裝置1〇襄載於裝載位置□，較佳地，裝 =納早心10在水付向上的裝置容辅之數目概較於水平 方向上托盤30之裝置容納槽之數目更大。 .裳置置ig職置容納單元剔可直接將 裝其上，並且可根據分類之錢1G之類型具有不同 之尺寸。因此，裝置容納單元610 納槽的額外容納件⑽a。i〇7包含有一具有複數個裝置容 妒成么一第圖」及第2圖」所示’第一移動緩衝器_較佳 ==數目以便同時在每一位置(□、口、口)執行各製程。 。件620配錢當移動時不與另—導向件㈣相衝突。 人^具體而吕’如「第3圖」所示，第一移動緩衝器_可包 ^一二第i置容納單^611、—第二裝置容納單元612、以及-單元Η3,第一裝置容納單元611透過一第一導向件 芽水平移動，第二裝置容納單元612透過一第二導向件 17 201133000 622之支樓水平移動，以及第三裝置容納單元6i3透過一第三導向 件623之支撐水平移動。 —弟一至第三導向件621、622及623導向第一至第三裝置容納 單兀611、612及613之水平移動，並且可具有不同之結構。如「第 4圖」所示’第-導向件621可安裝於主體4()之支樓件_之頂 端，第二導向件622可安裝於支料_之中端，以及第三導向 件62*3可安裝於細牛_之底端或主體4〇之頂面板。這裡，第 -至第三導向件62卜622及623可形成為一對以便穩定支樓裝置 容納單元610。 用於水平移動第-至第三導向件62卜622及623的移動裝置 630可根據-驅動方法具有不同之結構。移動裝置㈣可包 別水平第-至第三導向件621、622及623的第一至第 = 紐、632及633。這裡’第一至第三移動裝置63ι、632及= 透過產生-旋轉力的馬達，以及與第一至第三導向件621、⑵ 623相結合的皮帶實現。特別地，第一至第三移動裝置⑶、碰 及633可透過同步帶及帶輪之結合實現。 以下，將更詳細地介紹第-移動緩衝器_之作業。 一旦第-義_錄裝触置口，崎行_ 程，即，第一裝置1〇自測試單元170裳载至裳置容納單元⑽。 碰，裝載至裝置容納單元⑽的第U 1G可包含有至 透過測試單元m確定為減產品的第—拒收裝㈣ 一裝置ίο之分類。 ^要第 因此，第-移動緩衝器_移動至分類位置口，以便在裝置 18 201133000 10襄載於裝載位置□之後分類第一拒收裝置1〇。 —旦第一移動緩衝器600位於分類位置□，則執行一第一八 類製程，即，第-拒收裝置10透過傳送工具自裝置容:單元二 傳送至分類單元。這裡，每-拒收裝置1〇根據劣質品標準裝 載於分類單元300之托盤30之上。 在分類位置□，裝置容瞬元⑽之已縣除第—拒收褒置 10的位置插人有透過職單元17G的測試結果 =(以下，將稱…繼、)， 已、，坐裝載於第-固定緩衝1341之上（緩衝製程）。 定緩衝請絲於主體W，讀前其上裝載有第一 2農置H)。如果第-固定緩衝器341製造在為起始時間或當作 料為空’卿裝置1G可裝餘分類 衝器_之裝置容納單元610。 U的第移騎 移動成第—分類製程’第—移動緩衝器_自分類位置口 ^好□。然後，賴於第—移動緩衝器_之上的第 良好裝置10透過傳送工具襄載於燒機板2〇之上。 一旦第-移動緩衝器_之数容納單元⑽完全變空 =動緩衝H _自裝餘£α飾至麯 裝置10裝胁其上。因此，私齡輯縣。 構。H動崎器700具有與第一移動緩衝器600相類似之結 動緩衝器·重複移動至-裝載位_ 收之透過第二傳送工具540裝載自燒機板20接 、1〇 ’透過移動至一分類位置□’用以傳送工具將第 19 201133000 二拒收裝置〗G傳送至分鮮元之诚％ (分雜盤），以及 移動至-卸載位置（裝置交換位置）□，用以透過第五傳送工具 550將其他第二裝置1()裝載於托盤3〇 (卸載托盤）之上。 第二移動緩衝H 具有與第—移祕衝器_相類似之結 構更”體而σ，如「第3圖」所示，第二移動緩衝器包含 有-裝置容納單元、一導向件72〇、以及—移動裝置，，裝 置容納單元糊以將裝置1G裝載於其上，導向件,在主體4〇 可移動地支财置容納單元71〇，並且移動裝置73〇透過導向件 720水平移動裝置容納單元710。 六為：將-較大數目之裝置1〇褒載於裝載位置□，較佳地，弟 置谷、、内單疋71G在水平方向上的裝置容納槽之數目相比較於水平 方向上托盤3〇的裝置容納槽之數目更大。 、裡用以在其上裝載裝置1〇的褒置容納單元⑽ 裝置H)裝载於其上，並且可根據待分類之裝置iq之類型具有一 S此’裝置容納單元⑽可包含有"'具有複數個裝 置谷納槽的額外容納件610a。 士第1圖」及「第2圖」所示’第二移動緩衝器700較佳 =為=個數目’以便在每一位置（□、口、口）執行每一製程 ^ 2移動時’導向件720不與另-導向件720相干擾。 體而s ’如「第3圖」所示’第二移動緩衝器可包 笔：拉/置容納單元711、一第二袋置容納單元712、以及一 721 ^去Γ納單元713,第一裝置容納單元711透過一第一導向科 暑良平移動，第二裝置容納單元γΐ2透過一第二導向件 20 201133000 722之支撐水平移動，並且第三裝置容納單元爪透過一第三導向 件723之支撐水平移動。 ，第—至第三導向件72卜722及723導向作為緩衝器的第一、 第二及第三襄置容納單元71卜712及713之水平移動，並且可具 有不同之結構。如「第4圖」所示，第—導向件721可安裝於主 體4〇之支擇件740之頂端，第二導向件從可安裝於支撐件· 之中端，以及第三導向件723可安裝於支撐#74〇之底端或主體 4〇之頂面板42。這裡’第一至第三導向件切、瓜及切可形 成為一對以便穩定支撐裝置容納單元710。 用於水平移動第-至第三導向件？2卜從及？23的移動裝置 730可根據—驅動方法具有不同之結構。移練置730可包含有分 別水平移動第一至第三導向件721、722及723的第一至第三移二 裝置73卜732及733。這裡，第-至第三移動裝置731、乃2及 733可透過產生-旋轉力的馬達，以及與第一至第三導向件切、 722及723相結合的皮帶實現。特別地，第-至第三移動裝置731、 732及733可透過同步帶及帶輪之結合實現。 第二移動緩衝器按照與第—移動緩衝器_相類似之方 式作業。更具體而言’第二移動緩衝器在—裝載位置口，執 行將第二裝置1G自燒機板2〇裝載於裝置容納單元71()之上的裝 載製程，在一分類位置□執行-將第二拒收裝置10傳送至分類單 元300的第二分轉程，以及〆在—域位置〇執行將其他第二 裝置10傳送至卸載單元2〇〇之托盤30的卸載製程。 在裝載製程期間，同時傳送與第一移動緩衝器600之上频 21 S· 201133000 的裝置Η)相同數目之裝置，例如，制為 在第二分類製程期間，第二拒收裝置10透過僂1。 容納單元710傳送至分類單元_。這裡第傳；^具自裝置 根據劣f品。w分料元之滅3Q之―Γ 〇 在刀類位置□’已經麵^減^ 710/位置插入有已'經裝載於第二固定緩衝器3/之上的納第早^ 好裝置10 (緩衝製程）。 的第一良 第二固定緩衝器342安梦 良好裝置K)。如果第其上預絲載有第一 空，則第4城置1GW分齡置□料為 700之裝置容納單元71〇之上。 ㈣後衝态 一旦第一«置10及第二裝置1〇之交換在χ γ平台物 的燒機板20完成，χ_γ平a 之上 11 使用—面板裝載器_交換其上 ,、有第一裝置10的—新燒機板2〇。 =X:平台41〇與面板輯器_之間的燒機板2〇之 日^停止第-妓K)之魏及第二裝置2Q之卸载。這樣可透過 U板的父換時間（持續時⑷產线置1()的裝載及卸載之延遲。 ，果燒機板20岐換時間減少，可提高裝置分類設備所謂的,, UPH之處理速度。為此，本發明之裝置分類設備更包含有一燒 機板交換緩衝單以2〇,燒機板交換緩衝單元4则以按照交替之 方式臨時性_存其上具料U㈣顧板Μ以及其上具 有第二裝置1G的燒機板2G，並且用以將χ γ平台之上插入 有第一裝置1〇的燒機板20與插入有第二裝置1〇且自其上具有複 201133000 數個f板20的面板聚載器_選擇出的燒機板20交換。 平元420透過插入於面板裝載器_與 千口 410之間允許燒機板2()之交換。這裡 … 420可根據設計具有不同之結構。 乂、、’’’早兀 根據裝置分類設備之結構，燒機板交換緩衝單元㈣可安裝 於主體40之移祕域之中的最相之—側，特職，xw 410,或面板裝載器800之一内側面。 σ 為了縮短燒機板20之錢_，健地，χ_γ ρ 妙 啊雜其上錢衫—裝置1二燒機^ 上裝載有第一裝置⑴的燒機板20。13 £ 201133000 Unlike the structure of the fixed installation shown in "1st" and "2nd", the classification phantom (8) can have a structure similar to that of the loading unit 100 and the unloading unit 200. That is, the sorting unit 3A may include a guide for moving the pair of guide trays 3'', and a drive unit (not shown) for moving the trays 3''. These transfer tools transfer the burner board 2〇, the loading unit 1〇〇, the test unit 17〇, the unloading unit 200, the sorting unit 3〇〇, the first moving buffer_, and the second moving buffer S 7〇0 Or a device between two of them, and may have a different structure depending on the arrangement of the elements. For example, the transfer tools may include a third transfer tool 51, a fourth transfer tool 520, a fifth transfer tool 55A, and a sorting tool 56, the third transfer tool 510 being in the loading unit 1 Between the test unit 170 and the test unit 170, the fourth transfer tool 52 transfers between the test unit 17 and the first move buffer 6 (8). The fifth transfer tool 55 is in the second move buffer 7 (8) and the portion. The transfer device 1Q' between the printers 200 and the sorting tool converge the transfer device 1 between the first and second movement buffers 600, 700 and the sorting unit 3A. The transport tool (the third transfer tool 51〇, the fourth transfer tool 52〇, the first transfer tool 530, the first transfer tool 54〇, the fifth transfer tool 55〇, and the sorting tool 60) may have a first transfer a tool, and a second transfer tool 530, the transfer tool 530 receives the device 10 loaded on the tray 3 of the loading unit 1 and inserts the received device 1 into the first movement buffer. The burner board is, for example, an empty portion of the burner board 2G, and the second conveyor conveys the second unit 1 of the burner board 2 between the burner board 2 and the second movement buffer 700. The device loaded on the burner board 20 is different from the arrangement of the device 10 loaded on the tray 3 of the loading unit 1 , and the loading on the burning board 20 is compared with the loading unit. The number of devices 1 loaded on the tray 30 of 100 is larger. Therefore, the number of devices that transmit the device 10 to the burner board 20 or the first carrier 530 and the second conveyor 54G that is used to withdraw the device from the burner board are compared to other transmission tools. The number is more. For example, the second transfer tool 530 and the second transfer machine 54 transmit 12x2, while the other transfer devices transmit 8x1, 8x2, etc. devices. 'a Under these narratives, (10) the transmission of a small number of ig-transfer tools enables a smaller number of devices to be located in addition to the position requiring a larger number of devices 1G. This reduces the manufacturing cost of the device sorting device and increases the size and reliability of the device sorting device. Considering the occupation 1G, the cake burning machine board 2 () can be transferred and the board 2q _, the first conveying tool' and the second conveying tool 54 can be moved as a whole. Since the third transfer tool and the fourth transfer tool 52 are transported in the state in which the test unit 17 is located therebetween, the third transfer tool and the fourth transfer tool 520 can also be moved as a whole. To test the efficiency of H), the number of the first transfer tool and the second transfer tool can be equal to the number of devices in the horizontal direction (not shown). The device receiving slot is for carrying the first moving buffer_and the device 10« in the first buffer 700 thereon. The sorting tool 56G can have a different structure. For example, there are 560 classification tools or multiples. Alternatively, the class I can include at least one fourth transfer tool 用以 for transferring the device 1 between the first mobile buffer _ and the classification unit 300 15 201133000 = the adaptive device 1G ′ and between the second mobile buffer 7 Hey. A knife can be as early as 300. Each transmission can contain one or more pick-ups and devices, and the pickups are at the same time. Take the 迗 迗 詈 wear 詈mi to receive through - vacuum pressure to absorb " 彳. The take-up device is used to transport the pickup in the -x_z direction and direction. In particular, the pick-up of the transport tool can be _-line, or for example, in order to quickly convert the plurality of first devices 10 from the load-carrying unit == Qing, such as the case, the present invention can include a first Moving the buffer _ = two, the first-axis __ is the same as the burning device board, the first device ω is loaded thereon and the first device 10 is transmitted, and the third movable buffer 7GG is mounted on the burning plate 2Q and The second device 10 is loaded between the unloading units and the second device 1 is transferred. The first movement buffer H 600 and the second movement buffer 7 are movably mounted to the main body 40' and are moved through the use of the burner board 2 () switching device 1 (4) device exchange upper set using the loading list W00 or the unloading unit The apparatus of the exchange device, the d-position, and the sorting position of the sorting unit using the sorting unit 300 continuously and smoothly exchange the apparatus 10. Therefore, the first movement buffer (four) and the second movement buffer 700 can significantly increase the classification speed. ...the first-moving buffer _ moves to the first device that is loaded by the second transfer tool 54 装载 装载 式 式 τ ο ο ο ο 170 、 、 装载 装载 装载 装载 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The pain position a of the rejection unit g transmitted to the classification unit 30, and the movement to the third board of the χ-γ platform 4ω by the third device to be described later. Loading position (device exchange position) Q. The 'first-moving buffer _' shown in Fig. 3 includes a device accommodating = Ω guiding member 62G, and a moving device (not shown), and the device accommodating a few 610 for carrying the device 10 thereon. The 'guide member' is for movably supporting the device housing unit 610 to house the unit 610 in the main body 40. The device is moved through the guide 62. In order to load a larger number of devices 1 in the loading position □, preferably, the number of devices in the water-up direction is higher than the level. The number of device receiving slots of the tray 30 in the direction is larger. The hang placement ig can accommodate it directly, and can be sized according to the type of money 1G. Therefore, the device housing unit 610 accommodates the additional housing (10) a of the slot. I〇7 includes a plurality of devices that are capable of being implemented in the first picture and the second picture. The first mobile buffer_better==number is executed at each position (□, mouth, port) at the same time. Each process. . The piece 620 dispenses money and does not conflict with the other-guide (4) when moving. The person ^ concrete and L' as shown in "Fig. 3", the first mobile buffer _ can be provided with a second i accommodated unit 611, the second device accommodating unit 612, and the - unit Η 3, the first device The accommodating unit 611 is horizontally moved by a first guiding member, the second device accommodating unit 612 is horizontally moved through a branch of the second guiding member 17 201133000 622, and the third device accommodating unit 6i3 is supported by a third guiding member 623. Move horizontally. The first to third guide members 621, 622, and 623 guide the horizontal movement of the first to third device housing units 611, 612, and 613, and may have different structures. As shown in FIG. 4, the 'first guide member 621 may be attached to the top of the support member _ of the main body 4 (), the second guide member 622 may be mounted to the intermediate end of the support _, and the third guide member 62 *3 can be installed at the bottom of the fine cow or the top panel of the main body. Here, the first to third guide members 62 and 623 may be formed in a pair to stabilize the branch unit accommodating unit 610. The moving device 630 for horizontally moving the first to third guides 62 and 623 may have a different structure depending on the driving method. The mobile device (4) may include first to fourth, 632, and 633 of the horizontal first to third guides 621, 622, and 623. Here, the first to third moving means 63, 632 and = are realized by a motor which generates a - rotational force, and a belt which is combined with the first to third guides 621, (2) 623. In particular, the first to third mobile devices (3), 633 and 633 can be realized by a combination of a timing belt and a pulley. Hereinafter, the operation of the first-moving buffer_ will be described in more detail. Once the first meaning port is touched, the first device 1 is loaded from the test unit 170 to the skirting unit (10). The U1G loaded to the device accommodating unit (10) may include a classification of the first-rejected device (fourth device) to the product determined by the test unit m. ^ To do so, the first-moving buffer_ moves to the sorting position port to classify the first rejecting device 1 after the device 18 201133000 10襄 is loaded at the loading position □. Once the first mobile buffer 600 is in the sorting position □, a first eight types of processes are executed, i.e., the first-rejecting device 10 is transferred from the device to the sorting unit via the transfer tool. Here, the per-rejection device 1 is loaded on the tray 30 of the sorting unit 300 in accordance with the inferior quality standard. In the sorting position □, the device has the instant (10) of the county except the first-rejected device 10, and the test result is passed through the job unit 17G================================ Above the first fixed buffer 1341 (buffer process). The buffer should be placed on the main body W, and the first 2 farms H) are loaded on the front. If the first-fixed buffer 341 is manufactured at a start time or as a blank, the device accommodating unit 610 can be used. U's first shift ride moves into the first-classification process's first-moving buffer_self-classification position port ^good□. Then, the first good device 10 on the first moving buffer _ is carried on the burner board 2 through the transfer tool. Once the first-moving buffer_number accommodating unit (10) is completely empty = the dynamic buffer H _ self-loading α 饰 is attached to the curved device 10 to lie thereon. Therefore, the private age of the county. Structure. The H-moving device 700 has a knapsack buffer similar to the first movement buffer 600. The repetitive movement to the loading position _ is transmitted through the second transfer tool 540, and the self-burning plate 20 is connected, and the movement is moved to A sorting position □ 'Use the transfer tool to transfer the 19th 201133000 2 reject device G to the Seiko elementary % (shared disc), and move to the unloading position (device exchange position) □ The five transfer tool 550 loads the other second device 1() on the tray 3 (unloading tray). The second movement buffer H has a structure similar to that of the first shifting capsule _, and σ, as shown in FIG. 3, the second movement buffer includes a device housing unit and a guide 72. And a mobile device, the device accommodating unit paste to load the device 1G thereon, the guide member movably supporting the accommodating unit 71 在 in the main body 4 〇, and the mobile device 73 水平 traversing the horizontal moving device through the guide 720 Unit 710. Sixth: a larger number of devices 1 〇褒 are carried in the loading position □, preferably, the number of device accommodating grooves in the horizontal direction of the ridge, and the inner 疋 71G is compared with the tray 3 in the horizontal direction. The number of device receiving slots of the crucible is larger. The device accommodating unit (10) on which the device 1 is loaded is loaded thereon, and may have an S according to the type of device iq to be classified. The device accommodating unit (10) may include " 'Additional housing 610a with a plurality of device valleys. "The second movement buffer 700 is preferably == number" as shown in Figure 1 and Figure 2 to guide each process ^ 2 movement at each position (□, mouth, mouth) The member 720 does not interfere with the other guide member 720. The second movement buffer can be included as shown in the "Fig. 3": the pull/place storage unit 711, a second pocket storage unit 712, and a 721^ go to the unit 713, first The device accommodating unit 711 is moved by a first guiding device, the second device accommodating unit γ ΐ 2 is horizontally moved by the support of a second guiding member 20 201133000 722, and the third device accommodating unit claw is supported by a third guiding member 723. Move horizontally. The first to third guide members 72 and 723 are guided to the horizontal movement of the first, second, and third housing units 71 and 713 as buffers, and may have different structures. As shown in FIG. 4, the first guiding member 721 can be mounted on the top end of the supporting member 740 of the main body 4, the second guiding member can be mounted on the middle end of the supporting member, and the third guiding member 723 can be It is mounted on the bottom panel 42 of the bottom end of the support #74〇 or the main body 4〇. Here, the first to third guide members are cut, melon and cut into a pair to stabilize the support device housing unit 710. Used to move the first to third guides horizontally? 2 Bu and? The mobile device 730 of 23 can have a different structure depending on the driving method. The shifting device 730 may include first to third shifting means 73, 732 and 733 for moving the first to third guiding members 721, 722, and 723, respectively, horizontally. Here, the first to third moving means 731, 2 and 733 can be realized by a motor which generates a - rotational force, and a belt which is combined with the first to third guide cuts, 722 and 723. In particular, the first to third moving devices 731, 732, and 733 can be realized by a combination of a timing belt and a pulley. The second movement buffer operates in a similar manner to the first movement buffer_. More specifically, the 'second moving buffer is at the loading position port, and the loading process for loading the second device 1G from the burner board 2 to the device housing unit 71 () is performed, in a sorting position □ The second rejecting device 10 transmits to the second partial transfer of the sorting unit 300, and performs the unloading process of transferring the other second device 10 to the tray 30 of the unloading unit 2〇〇. During the loading process, the same number of devices as the first mobile buffer 600 over the frequency 21 S·201133000 are transmitted simultaneously, for example, during the second classification process, the second reject device 10 passes through the 偻1 . The housing unit 710 is transferred to the sorting unit_. Here is the first biography; ^ has a self-device according to the inferior product. w 分 分 元 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Buffer process). The first good second fixed buffer 342 An Meng good device K). If the first pre-filament carries the first space, the fourth city is placed above the device accommodating unit 71 of 1 GW. (4) After the first state, the exchange of the first «set 10 and the second device 1〇 is completed on the burner plate 20 of the γ γ platform, and the χ γ γ ping a is used 11 - the panel loader _ is exchanged thereon, with the first The new burner board 2 of the device 10. =X: The burn-in board between the platform 41〇 and the panel editor_〇2^ Stops the unloading of the first-妓K) and the second device 2Q. This can be used to change the loading and unloading delay of the U board's parent time (continuous (4) production line set 1 (). The reduction of the time of the fruit burning machine board 20 can increase the processing speed of the device classification device, UPH To this end, the device sorting device of the present invention further comprises a burn-in board exchange buffer unit of 2 〇, and the burn-in board exchange buffer unit 4 is temporarily arranged in an alternating manner to store the material U (four) Gu board and its The burner plate 2G having the second device 1G is mounted thereon, and the burner plate 20 into which the first device 1 is inserted and the second device 1 is inserted on the γ γ platform and has a plurality of 201133000 The panel stacker of the f board 20 is selected for exchanging the burner board 20. The flat element 420 is inserted between the panel loader _ and the thousand port 410 to allow the exchange of the burner board 2 (). Here... 420 can be designed according to It has different structure. 乂,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, , or the inner side of one of the panel loaders 800. σ In order to shorten the cost of the burner board 20 _, Jiandi, χ _ γ ρ 妙 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 杂 上 上 上 上 上 上 上 上 上 上 上 上
為了同時交換燒機板2G，χ_γ料41G Γ單元⑽—燒她上下義單元，職機姻定單 底位置岐燒機板2G，燒機板上下移動單元在兩個燒機 7固二福頂及底方向的至少—個方向上移_定在一對燒機 板固定單元中的燒機板20。 —錢缺換_單元㈣奸含有_戰機板 :燒機板緩衝單元分別在與χ.γ平台仙之燒機板固定單元相 對應的-頂位置及-底位置燒機板2〇。 W板緩衝單元奶可具有任何其上裝载有燒機板2〇的处 ，。較佳地’燒機板緩衝單元421領猶後將解釋的一第一 早疋44卜一第二指狀單元442等之移動相干涉。 一如第5Α圖」至「第5D圖」所示，燒機板2〇透過第一及 第二指狀單元441及442在χ_γ平台⑽與燒機板交換緩衝單元 23 & 201133000 420之間傳送。這裡，第一及第二指狀單元44i及祕之結構及安 裝位置可根據設計而變化。 丄k機板2〇在X-Y平台41〇與燒機板交換緩衝單元細之間的 交換過程可根據各配置以不同之方魏行。將結合關部份更詳 細解釋該交換過程之一實例。 如「第5A圖」及「第5B圖」所示，χ_γ平台首先自燒 機板交換緩解元㈣概其上具有第二裝置㈣燒機板％。這 裡’在燒機板2G排列於頂位置及底位置之情況下，χ_γ平台· 可在頂側或細自麟板錢緩解元接收錢板Μ。較佳 地，如「第6D圖,及「黛叩闯仏- 第6Ε圖」所不，Χ-Υ平台410在頂側自 k機板交換緩衝單元420接收燒機板2〇。 已左接收其上具有第二裂置1〇的燒機板Μ之Η平台彻 在Χ-Υ方向上驅動，以使得能夠通過開口 41執行第二裝置1〇之 卸載及第一裝置10之裝載。 平台41〇移動用於第二裝置1G之卸載及第—装置1〇 :k機板父換緩衝單疋彻自面板裝載器_供給其上 具有第二裝置10的燒機板2〇。 在兀成第—裝置1G之卸載及第—裝置W之裝載之後，如「第 5C圖」所示，1上且.笛一 換緩衝單元·， β 的燒機板2〇移動至燒機板交 ^ ’以使得能夠供給其上具有第二裝置10的另-燒 錢板20。 如「第5C圖」所示， 單元420移動時，χ_γ平台 當Χ-Υ平台41〇朝向燒機板交換緩衝 410之上的燒機板2〇透過燒機板上下 24 201133000 移動單元向下移動，以便透過燒機板交換緩衝單元420盘燒機板 20交換。 ~ 、/如第圖」所示，移動至燒機板交換緩衝單元42〇的χ-Υ 、’、，供"°有燒機板父換緩衝單元之上的燒機板20。這裡， 平□ 410之下的燒機板2〇移動至燒機板交換緩衝單元"ο之 上的燒機板緩衝單元。 較佳地，X_Y平台410與燒機板交換緩衝單元420之間的燒 機板20之交朗時執行，以便縮短交換時間。 如第1圖」及「第2圖」所示，本發明之 含有一安姆-側的面板裝載議且同時供給有燒機板％。 面板裝载益800按照一堆疊方式裝载其中插入有第二裝置川 =燒機板2G，且隨後额將其幅人有第, 用於將燒機板20傳送至一煻德、、目，丨1 w _ , 咖㈣1 機以早兀。也就是說，面板裝載器 構 Γ物父換具有燒機板20的χ·γ平台·，且可具有不同之結 1上10裝载於一個格架50的所有燒機板20之上， 八上元王裝載有第-裝置i 的燒機板2G之另-格牟5n a# > {姻弟-裝置10 2〇。這可降低裝置分_備之處理速=直至供給有新燒機板 因此，如「第7圖」所示 可包含有-雜練縣元_ 771叙面钱載器_ 元_位於χ·γ平台===—提升單祕格架裝载單 軸方向，用於按照複數組在其上裝 25 S- 201133000 載格架it些格架之上具有複數個燒機板，並且提升單元82〇安 裝於兩個格架裝載單元⑽之間，用於自格架裝載單元請取回 格架50^在觀底方社雜格奸不錢機板之上的裝置之裝 載及卸載相干涉。 格架裝載單元810可具有任何在其上震载格架5〇之結構。 較佳地’格架裝鮮元810職為-對，並且絲於提升單 元820之兩侧。 在提供X-Y平台410及燒機板交換緩衝單元42〇之情況下， 提升單元820透過自格絲鮮元⑽細格㈣且上下移動格 架50，交換具有燒機板2〇的燒機板交換緩衝單元4加。 面板褒載器_包含有-對與兩個格架裝载單元_相對應 之格架抽回單S 830’並且格架抽回單元83〇抽回每一格架裝載單 元810之上襞載的格架5〇。 格架抽回單元83〇將格架5〇自格架裝载單元㈣括回至提升 單元82㈣支撐單元82卜或者將格架5〇自提升單元8 格架裝載單元81〇之上。 來 換過程之一實例 一燒機板2G在燒機板交換緩解元與面域脑_之間 的交換可根據各配置執行不_。町將關部份輯細解釋交 如第6C圖」及「第6D圖」所示，燒機板交換緩衝單元创 百先自面板裝載器_收其上具有第二裝置ω的燒機板如。這 裡，在燒機板2〇排列於頂及底方向之情況下，χ_γ平△ 可在 頂側或底侧自面板裝鋪_接_機板20。她J考慮 26 201133000 機板之又換在χ_γ平台41G與燒機板交換緩衝單元柳之間，对 平台410自頂側接收燒機板20。 也就疋3兒’其上具有第二裝置1〇的燒機板自面板裳載器 _收回，並且藉域敵交換緩衝單元之上的燒機板緩衝單 轉达至Χ·Υ平台410之上的燒機板固^單元。並且，其上具有 第裝置10的燒機板2〇藉由χ_γ平台41〇之下的燒機板固定單 元傳送至面板裝载器800。 在π王交換Χ·Υ平台41〇的燒機板2〇之後，燒機板交換緩衝 單元420通過「第6Α圖」及「第6Β圖」所示之過程交換面板裝 载器800的燒機板2〇。 燒機板交換緩衝單元420將自χ_γ平台·接收的燒機板 特別地ϋ疋於燒機板緩衝單元的底側之燒機板加傳送至面 ，裝，_之格架5〇之空部份。較佳地，複數個格架％透過 提升單7L 82〇上下移動供給有燒機板2〇或將燒機板2〇自其中收 回。為了平穩交換燒機板20，最頂的格架％及最底的格架5〇之 至少一個不具有燒機板20。 燒機板交換緩衝單元420自格架50抽回其上具有第二裳置1〇 的新燒機板2G。這裡’魏機板2Q自格架％收_而固定於燒 機板交換緩衝單元，特別地，固定於一頂侧的燒機板緩衝單元。 如「第6A圖」至「第6D圖」所示，燒機板交換緩衝單元42(> 與面板裝載i _之間的燒機板20之交換透過其間的一個或多個 副指狀件443及444傳送燒機板20執行。 這裡，副指狀件443及444在燒機板交換缓衝單元42〇與面 27 201133000 板裝載器800 板20。 之間的移動部份之間的複數舞動子部份傳送燒機 可僅*「第8B圖」所示，本發明之裝置分類設備 ^上:叙將格架5G㈣於其上的格架裝載單元_，而不包含 ί 3 Γ㈣的提升單元82G。並且’本發明之裝置分類設 r燒機柄μ核左方向上移域機板交換緩解元420，以使 : 能夠自每一格架物元_之上裝载的格架50取 如「第8Β圖」所示，在本發明之較佳 卿可包含有複數個分別裝載格架5〇的格架裝載單元81=: 九個格架裝載單元81〇。 可P Μ圖」及「第8Β圖」所示，本發明之震置分類設僧 2包交猶_解元·，驗斜麵録動燒機柄 父換緩衝單元420。 交換緩衝驅動單it 43G可具有不同之結構，用以在頂、底、 右及左方向’即’水平及垂直^向±魏频板交換緩衝單元 42〇 ’以使得燒機板2〇能夠自每一格架裝载單元⑽之上 格架50取回。 交換緩衝驅動單元43G可包含有—第—驅動單元431及一第 二驅動單元极’第-驅動單元仙根據面板裝載器_之上裝载 的格架5〇之頂及底部轉錢板交換緩解元·之上下移動， 第二驅動單元犯2根據面板魏器細之上排列格架％之水平方 向’驅動燒機板交換緩衝單元420之水平移動。 28 201133000 如「第8A圖」及「第8B圖」所示，第—及第二驅動單元纪卜 432可具有一螺旋起重器、一線性移動設備等，用以透過支撐燒機 板交換緩衝單元420移動燒機板交換緩衝單元42〇。 在本發明之裝置分類設備之中，燒機板2〇在固定格架5〇之 狀態下’透過在頂、底、右及左方向上移動燒機板交換緩衝單元 420取回。這樣可減少燒機板2〇之取出時間，用以極大提高裳置 分類設備之處理速度。 而且’面板裝載益800在燒機板交換緩衝單元42〇在頂、底、 右及左方向上移動的條件下，不需要具有提升單^職可使得 面板裝載ϋ 8GG具有-簡化之結構。而且，面板裝載器_之上 裝载的格架5G之數目增加肋延長格架5()的交換時間，由此提 馬作業效率。 燒機板父換緩衝單元420及交換緩衝驅動單元43〇與面板裝 载器800能夠一起形成為一個面板裝載器模組。 上述之實施例及優點僅為示例性的且並不看作對本發明之限 制。本發明m㈣料顧至其他_之設備。本發明之描 述傾向於示例性描述’並且不對本翻之專利保護朗進行限田 制。本領域之技術人員賴可意朗許㈣雜、變化、以及修 改。在此揭露之示讎實_的這些·、結構、方法、以及盆 他特性以獨之方式相結合以獲得另外與/或魏之實施例/、 雖然本發明在不脫離其特徵的情況下可實現為獨之 I以轉岐，翻，上述實_錢過以描述之任 卽限制’喊該在_之專利保護細定義之顧内作廣泛In order to exchange the burning machine board 2G at the same time, the χ_γ material 41G Γ unit (10) - burns her upper and lower unit, the job machine is stipulated, the single bottom position simmering machine board 2G, the burning machine board lower moving unit is in two burning machines 7 solid two Fuding and The at least one direction of the bottom direction is shifted upwards to the burner board 20 in a pair of firing plate fixing units. - The lack of money _ unit (four) traits contain _ fighter board: Burner board buffer unit in the top position corresponding to the χ. γ platform Sinzhi burning board fixed unit and - bottom position burning board 2 〇. The W plate buffer unit milk may have any place on which the burner plate 2 is loaded. Preferably, the burner plate buffer unit 421 interferes with the movement of a first early finger 44, a second finger unit 442, etc., which will be explained later. As shown in Figures 5 through 5D, the burner plate 2 passes through the first and second finger units 441 and 442 between the χ_γ platform (10) and the burner plate exchange buffer unit 23 & 201133000 420. Transfer. Here, the first and second finger units 44i and the structure and mounting position of the secrets may vary depending on the design. The exchange process between the X-Y platform 41〇 and the burner board exchange buffer unit fine can be performed in different ways according to each configuration. An example of this exchange process will be explained in more detail in the context of the combination. As shown in Figure 5A and Figure 5B, the χγ platform firstly has a second device (four) burner plate % on the machine board exchange mitigation element (4). Here, in the case where the burner board 2G is arranged at the top position and the bottom position, the χ_γ platform can receive the money board on the top side or the fine lining board. Preferably, the "Χ"-" platform" 410 receives the burner board 2 from the k-board exchange buffer unit 420 on the top side as in "Fig. 6D" and "黛叩闯仏-第6Ε图". The platform on which the burner plate having the second split 1〇 has been received left is driven in the Χ-Υ direction to enable the unloading of the second device 1 and the loading of the first device 10 through the opening 41 . The platform 41 is moved for unloading of the second device 1G and the first device 1 is: k-board parent-changing buffer is self-panel loader_supply to the burner plate 2 having the second device 10. After the unloading of the device 1G and the loading of the device W, as shown in the "5C", the fan plate of the 1st and the flute is moved to the burning plate. The intersection is made to enable supply of the other-burning board 20 having the second device 10 thereon. As shown in "5C", when the unit 420 is moved, the χ_γ platform moves downwardly on the burn-in board 2 of the Χ-Υ platform 41〇 toward the burn-in board exchange buffer 410. In order to exchange the burner board 20 through the burner board exchange buffer unit 420. ~, / as shown in the figure, moving to the burn-in board exchange buffer unit 42 〇 Υ - Υ, ', for the "burner board" father on the buffer unit above the burner board 20. Here, the burner board 2 below the level 410 is moved to the burner board buffer unit on the burner board exchange buffer unit ". Preferably, the X_Y platform 410 is executed at the same time as the burner board 20 between the burn-in board exchange buffer units 420 to shorten the switching time. As shown in Fig. 1 and Fig. 2, the panel containing one amp-side of the present invention is loaded with a burner plate %. The panel loading benefit 800 is loaded in a stacking manner in which the second device is inserted into the burning machine plate 2G, and then the amount of the burning machine plate 2G is used to transfer the burning machine plate 20 to a 煻, ,,,丨 1 w _ , coffee (four) 1 machine early. That is to say, the panel loader structure is replaced by the χ·γ platform of the burner board 20, and may have different knots 1 and 10 loaded on all the burner boards 20 of one grid 50, eight Shangyuan Wang is loaded with the burner plate 2G of the first device i. Grid 5n a# > {marriage-device 10 2〇. This can reduce the processing speed of the device _preparation = until the new burning machine board is supplied. Therefore, as shown in "Fig. 7", it can be included in the - _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ γ γ Platform ===—Improve the single-cube rack to load the single-axis direction, which is used to install the 25 S-201133000 carrier on the grid according to the complex array, and has a plurality of burning boards on the grid, and the lifting unit 82〇 It is installed between the two grid loading units (10), and is used to retrieve the grid 50^ from the loading and unloading of the device above the grid. The grid loading unit 810 can have any structure on which the grids 5 are mounted. Preferably, the grid 810 is a pair and is threaded on either side of the lifting unit 820. In the case where the XY stage 410 and the burner board exchange buffer unit 42 are provided, the lifting unit 820 passes through the grid (10) from the grid (10) and moves the grid 50 up and down to exchange the burner board exchange with the burner board 2〇. The buffer unit 4 is added. The panel loader _ includes a pair of grid pullback single S 830' corresponding to the two grid loading units _ and the rack pullback unit 83 〇 is pulled back to each grid loading unit 810 The grid is 5 inches. The rack retracting unit 83 括 retracts the grid 5 from the grid loading unit (4) to the lifting unit 82 (four) supporting unit 82 or the grid 5 from the lifting unit 8 grid loading unit 81. An example of the replacement process. The exchange between the burner board 2G and the area-receiving unit in the burner board 2G can be performed according to each configuration. The section of the town will be explained in detail as shown in Figure 6C and Figure 6D. The burn-in board exchange buffer unit creates a hundred-segment self-panel loader _ the burner board with the second device ω . Here, in the case where the burner board 2 is arranged in the top and bottom directions, the χ_γ flat Δ can be mounted on the top side or the bottom side from the panel. She considers 26 201133000 and then exchanges between the χγ platform 41G and the burner board exchange buffer unit, and receives the burner board 20 from the top side of the platform 410. In other words, the burner board with the second device 1〇 is retracted from the panel loader__, and is transferred to the Χ·Υ platform 410 by the burner board buffer on the domain exchange buffer unit. The burner board is fixed on the unit. Further, the burner board 2 having the first unit 10 thereon is conveyed to the panel loader 800 by the burner board fixing unit below the χ γ platform 41 〇. After the burn-in board of the π-wang exchange Χ·Υ platform 41〇, the burn-in board exchange buffer unit 420 exchanges the burn-in of the panel loader 800 by the processes shown in “Section 6” and “Section 6”. Board 2〇. The burner board exchange buffer unit 420 transfers the burner board received from the χ_γ platform to the burner board of the bottom side of the burner board buffer unit, and transports it to the surface. Share. Preferably, the plurality of grids are supplied with the burner plate 2 through the lifter 7L 82, or the burner plate 2 is retracted therefrom. In order to smoothly exchange the burner board 20, at least one of the topmost grid % and the bottommost grid 5 has no burner board 20. The burner board exchange buffer unit 420 draws back the new burner board 2G having the second skirt 1 from the grid 50. Here, the 'Wei machine board 2Q is fixed from the burner board exchange buffer unit, in particular, to the burner board buffer unit of a top side. As shown in "Fig. 6A" to "6D", the burn-in board exchange buffer unit 42 (> exchanges with the burn-in board 20 between the panel load i_ passes through one or more sub-finger members therebetween) The 443 and 444 transfer burner boards 20 are executed. Here, the sub-fingers 443 and 444 are in the plural between the moving parts of the burner board exchange buffer unit 42 and the surface 27 201133000 board loader 800 board 20. The dancer part transfer burner can be only * "Fig. 8B", the device classification device of the present invention: on the grid loading unit _ on the grid 5G (4), without the lifting of ί 3 四 (4) Unit 82G. And 'the device of the present invention classifies the r-machine handle μ-nuclear left-direction upper-field plate exchange relief element 420 so that: can be taken from the grid 50 loaded on each grid object_ As shown in the "Fig. 8", in the preferred embodiment of the present invention, a plurality of grid loading units 81 of the respective loading grids 5 =: nine grid loading units 81 〇 can be included. As shown in Fig. 8, the vibration classification of the present invention is set to 2, and the buffer is replaced by the buffer unit 420. The buffer drive unit single it 43G can have different structures for the 'top', right and left directions, ie, horizontal and vertical, to the ±wei frequency board exchange buffer unit 42〇' to enable the burner board 2〇 to The grid 50 is retrieved on each of the rack loading units (10). The exchange buffer drive unit 43G may include a first-drive unit 431 and a second drive unit pole'--drive unit according to the panel loader_ Loading the top of the grid and the bottom of the transfer board to ease the movement of the upper and lower movements, the second drive unit commits 2 according to the horizontal direction of the grid on the panel of the fines of the panel - drive the plate exchange buffer unit Horizontal movement of 420. 28 201133000 As shown in Figure 8A and Figure 8B, the first and second drive unit 432 may have a screw jack, a linear mobile device, etc. The burner board exchange buffer unit 420 moves the burner board exchange buffer unit 42. In the apparatus classification apparatus of the present invention, the burner board 2 is slid through the top, bottom, right and in the state of the fixed grid 5 Move the burning board exchange buffer unit in the left direction 420 is retrieved. This can reduce the take-out time of the burner board 2 to greatly improve the processing speed of the hanging classification equipment. Moreover, the panel loading benefit 800 is in the top, bottom and right of the burner board exchange buffer unit 42. In the condition of moving in the left direction, it is not necessary to have a lifting single position to make the panel loading ϋ 8GG have a simplified structure. Moreover, the number of grids 5G loaded on the panel loader _ is increased by the rib extension grid 5 ( The exchange time, thereby lifting the working efficiency. The burner board replacement buffer unit 420 and the exchange buffer drive unit 43 and the panel loader 800 can be formed together as a panel loader module. The above embodiments and advantages are merely exemplary and are not to be considered as limiting. The m (four) of the present invention takes care of other equipment. The description of the present invention is intended to be illustrative and not limiting the scope of the patent. Those skilled in the art will be able to make changes, changes, and modifications. The inventions, structures, methods, and pelvic properties disclosed herein are combined in a unique manner to obtain additional and/or embodiments of the present invention, although the invention may be practiced without departing from the features thereof. Realize as a single I to turn around, turn over, the above-mentioned real _ money to describe the limitations of the task of 'calling the _ patent protection fine definition of the wide-ranging
29 S 201133000 理解，並Μ此屬於專娜魏圍 改由專利保護範圍保護。 〜等彳貝範 【圖式簡單說明】 第1圖係為本發明之一半導體襞置八類μ備之 圍之内的變化及修 園， 實例之概念 =圖係為第1圖之半導體裝置•設備之結構之平面圖· 緩衝器之侧；機裝私_之第-及第二移動 第4圖係為第1圖之半導體震置 板的移動過程之示意圖； 備之χ·υ平台及燒機 =圖係為第丨圖之半導體裝置分類 板父^解元之間的—麵缺換蛛之概念圖，ΓΓ 機板之二==台與燒機板交換緩衝單元之_燒 第5Β圖係為在切平台與繞機缺換緩衝單元之門1緖 機板之後的-祕之示_; _料之間父換燒 單板·衝 圖係為燒機板在燒機板交換緩衝 間交換之_—狀態之移圖； -祕裝載益之 "_為燒機板引入至燒機板交換緩衝單元與面板裝载 201133000 為之間面板I她之格架中的—中間狀態之示意圖； 哭 C圖係為燒機板引入至燒機板交換緩衝單元與面板裝載 盗之^的面板裝载器的格架中之後的—狀態之示意圖； 圖係為燒機板自燒機板父換緩衝單元與面板裝載器之 間的面板袭載器之格架中抽回的一中間狀態之示意圖； 第6E圖係為燒機板自燒機板交換緩衝單元與面板裝載器之 間的面板錢n的格架細之後的_狀態之示意圖； 第7圖係為面板装载器之一結構之側面剖視圖； 少-第8A圖係為第1圖之半導體裝置分類設備之燒機板交換緩 單元及面板震載器之一修改實例之側面剖視圖；以及 第8B圖係為第8A圖之面板裝載器之側面剖視圖。 【主要元件符號說明】 10 裝置 20 燒機板 30 托盤 40 主體 41 開口 42 頂面板 50 格架 100 裝載單元 201133000 150 托盤旋轉單元 160 空托盤單元 170 測試單元 200 卸載單元 210 導執 300 分類單元 341 第一固定緩衝器 342 第二固定緩衝器 410 X-Y平台 420 燒機板交換緩衝單元 421 燒機板緩衝單元 430 交換緩衝驅動單元 431 第一驅動單元 432 第二驅動單元 441 第一指狀單元 442 第二指狀單元 443、444 副指狀件 510 第三傳送工具 520 第四傳送工具 530 第一傳送工具 540 第二傳送工具 32 201133000 550 第五傳送工具 560 分類工具 600 第一移動緩衝器 610 裝置容納單元 610a 額外容納件 611 第一裝置容納單元 612 第二裝置容納單元 613 第三裝置容納單元 620 導向件 621 第一導向件 622 第二導向件 623 第三導向件 630 移動裝置 631 第一移動裝置 632 第二移動裝置 633 第三移動裝置 640 支撐件 700 第二移動缓衝器 710 裝置容納單元 711 第一裝置容納單元 712 第二裝置容納單元 33 201133000 713 第三裝置容納單元 720 導向件 721 第一導向件 722 第二導向件 723 第三導向件 730 移動裝置 731 第一移動裝置 732 第二移動裝置 733 第三移動裝置 740 支撐件 800 面板裝載器 810 格架裝載單元 820 提升單元 830 格架抽回單元 3429 S 201133000 Understand, and this is a special protection of the Wei Wei. ~等彳贝范 [Simple description of the diagram] The first diagram is a variation of the semiconductor device in the eight types of semiconductor devices and repairs, the concept of the example = the system is the semiconductor device of Figure 1 • Plan view of the structure of the device · Side of the buffer; Machine-mounted private _ - and second movement Figure 4 is a schematic diagram of the movement process of the semiconductor oscillating plate of Figure 1; Machine=Graphics is the conceptual diagram of the missing surface of the semiconductor device classification board between the parent and the solution. The second board ======================================================== It is the secret of the door after the cutting platform and the winding machine are missing the buffer unit. The parental burning board and the punching diagram are the burning board in the burning board exchange buffer room. Exchange _-state shift diagram; - secret load benefit " _ for the burner board to be introduced into the burner board exchange buffer unit and panel loading 201133000 for the panel I in the grid - the middle state diagram ; Cry C picture is the grid of the panel loader that is introduced into the burning board and the panel loader of the panel The following is a schematic diagram of the state; the diagram is a schematic diagram of an intermediate state drawn back from the panel of the panel loader between the buffer unit and the panel loader; the 6E is Schematic diagram of the state of the panel after the panel of the burner board exchange buffer unit and the panel loader is thin; Figure 7 is a side cross-sectional view of one of the panel loaders; less - 8A 1 is a side cross-sectional view showing a modified example of a burn-in panel exchange unit and a panel shock absorber of the semiconductor device sorting apparatus of FIG. 1; and FIG. 8B is a side cross-sectional view of the panel loader of FIG. 8A. [Main component symbol description] 10 Device 20 Burner plate 30 Tray 40 Main body 41 Opening 42 Top panel 50 Lattice 100 Loading unit 201133000 150 Tray rotating unit 160 Empty tray unit 170 Test unit 200 Unloading unit 210 Guide 300 Classification unit 341 A fixed buffer 342, a second fixed buffer 410, an XY stage 420, a burn-in board exchange buffer unit 421, a burn-in board buffer unit 430, an exchange buffer drive unit 431, a first drive unit 432, a second drive unit 441, a first finger unit 442, a second Finger unit 443, 444 sub-finger 510 third transfer tool 520 fourth transfer tool 530 first transfer tool 540 second transfer tool 32 201133000 550 fifth transfer tool 560 sorting tool 600 first move buffer 610 device storage unit 610a additional housing 611 first device housing unit 612 second device housing unit 613 third device housing unit 620 guide 621 first guide 622 second guide 623 third guide 630 Second mobile device 633 third Actuator 640 support 700 second movement buffer 710 device accommodation unit 711 first device accommodation unit 712 second device accommodation unit 33 201133000 713 third device accommodation unit 720 guide 721 first guide 722 second guide 723 Third Guide 730 Mobile Device 731 First Mobile Device 732 Second Mobile Device 733 Third Mobile Device 740 Support 800 Panel Loader 810 Grid Loading Unit 820 Lifting Unit 830 Grid Pullback Unit 34