201133688 六、發明說明： 【發明所屬之技術領域】 本發明有關於器件處理器（device handler)，尤其 有關根據檢測結果在晶片狀態的器件中，將合格的器件裝 載於窩伏爾組件的器件處理器。 【先前技術】 态件（半導體晶片）是指：ώ導電率高於非導體、低 於像金屬-樣的導體的半導體構成的積體電路，晶片原來 是指薄片碎片，但是現在用作指代半導體電路的用語。 益件是在寬、高約為lcm左右的薄的石夕片“me⑽ wafer)上集成電晶體電阻電容器等各種器件而成。 器件作為製造現代電腦的基本部件，是執行計算處 理、存儲資料、控制其他晶片等功能的核心，{電；：： 的重要的依託。201133688 VI. Description of the Invention: [Technical Field] The present invention relates to a device handler, and more particularly to a device processing for loading a qualified device into a waffle component in a device in a wafer state according to a detection result. Device. [Prior Art] A state device (semiconductor wafer) refers to an integrated circuit composed of a semiconductor having a higher conductivity than a non-conductor and a metal-like conductor. The wafer originally refers to a thin piece of debris, but is now used as a reference. The terminology of semiconductor circuits. The utility model is formed by integrating various devices such as a transistor resistance capacitor on a thin Shi Xi tablet "me(10) wafer) having a width of about 1 cm. The device is a basic component for manufacturing a modern computer, and performs calculation processing, storing data, Control the core of other functions such as wafers, {electricity::: the important support.
如上所述的器件都有：CPU、SDRAM(記憶體半導體）、 flash RAM等等，最近還有像⑽（CMp 〇n以吻）、咖 (chlp0nFilm) 一樣的 DDI (DispUy ic)等多種。 尤其 檢測工序 予以執行 並且 如上所述的器件在出薇之前，為了提高穩定性， 外觀狀態’並挑出不良器件之後，僅出廠合格的器件。 在器件的製造工序中’可以執行多次對器件的 尤其，在晶片ίί大態下士刀割成各個器件之後可以 根據各個檢測結果可以顯示在器件。 如上所述，完成檢測工序的器件中，為了出廠 201133688 或者後續工序 的分類裝置。 只有合格的器件才可 以裝戴於窩伏 爾組件 造工序中増加檢測 類骏置可以左右器 而且’隨著在如上所述的器件的製 工序和分類工序，根據檢測裝置或者分 件的生產速度。 爾組件的現有的器件處 過程中’如果在寓伏爾 的窩伏爾組件，並載入 但是，用於將器件裝載於窩伏 理器在把晶片裝載於窩伏爾組件的 組件填滿了器件，則需要卸載填滿 空的窩伏爾組件。 琴件… …進行交替的期間無法執行對 ㈣把!因此額外地需要寫伏爾組件的交替時間，從 曰曰片載入窩伏爾組件的時間進行減少時有所受限。 【發明内容】 本發明的目的是為了解決 向寫伏I㈣裝载U件❹ 供了通過心 高伏爾組件的交替時間丄件進行交㈣ 伏爾組件的器件處理器。 曰日片載入窩 為了實現上述目的，本發 可以勹k B I月“開了一種器件處 J以包括：晶圓载入部，进 盗， 私二 ^裁入裝载有器件的晶圓，·曰fg) # 動台，接收從上述曰® # A 圈，日日圓移 右π批 載入部供給的上述晶圓，移動 态牛的上述晶圓；撿起工具 、載 述晶圓尹撿起合袼的 不夕助壹上的上 窩伏爾組件移送部， 匕栝.第 移動第一窩伏爾組件並進行 201133688 八 5^第窩伏爾組件安放有由上述撿走已 件，以及第二窩伏爾組件移送部，與通過上笛、撿起的咨 組件移送部移详的楚 ^ ^ %第—窩伏爾 移廷的第一窩伏爾組件進行聯 伏爾組件並進行釦鄱 ^ , ^ 和動第二窩 進仃卸載，其中上述第二窩伏 上述撿起工具撿起的器件。 ，牛女放有由 上述器件卸载部可以包括：寫伏 有多個窩伏爾组#，*分a 興入部，層疊 供給上述离伏爾組件.以及5 少-個窩伏爾組件移送工 彳，以及至 送上述窩伏_，並傳遞給入部移 或上述第二窩伏爾組件移送部。 高大爾組件移送部 上述窩伏爾組件移送工具可以包括 移送工具，向坌_+丄 第窩伏爾組件 4 、第 移送上述窩伏爾組件；以及第1 伏爾組件移送工具，通過上述及弟-窩 上述窩伏爾組件移送完畢之後第7移送工具將 爾組件，並傳遞給上述第一寓伏爾f一方向私送上述窩伏 窩伏爾組件移送部。 β 且件移送部或上述第二 述第窩伏爾組件移送部 _ 送部，分料過第心# {第-窩伏I組件移 保“钟. ' 導Ρ和第二導向部依次知載上述突 、’且’上述第—窩伏爾組件移。 導向部和第三導向〃通過上述第二 -窝伕^ ^依二人私送上述窩伏爾組件；上述第 -离伏爾組件移送工（第 部，依次移送上述4第二導向部和第四導向 ..<窩伙爾組件；從而傳遞給上述第一寫伏 爾組件移送部或上述、乩弟窩伏 笫一萵伏爾組件移送部。 根據上述窩伏爾組件的尺 寸’以不同寬度和長度的部 201133688 件可以交替上述第二導向部。 上述第一窩伏爾組件 送部可以分別包括··第一窩伏和上述第二窩伏爾組件移 爾組件增屋部件 ^組件增屡部件和第二窩伏 固疋高伙爾組件；移動機體，安 α和後端，以 增壓部件和上述第二高伏爾組件增第—寫伏爾組件 窩伏爾組件的底面，·以及機體驅動别支揮上述 分別移動各個上述移動機體。 。者機體導向部件 上述第-窩伏爾組件增壓部件和上 增塵部件可以設置有滾輪，其與寫伏爾2伏爾組件 接觸的狀態下，能夠旋轉。 的則端和後端 上述第-窩伏爾組件增愿部件和上 增壓部件中的至少—個，可以設置於上述:動一寓二犬爾組件 上述移動機體可以包括：固定機體 向部件能夠移動地設置；支撐機體/迷機體導 能夠上下移動地設置。 边固疋機體一起， 上述器件卸載部還可以設置有圖像 行在器件安放狀態的可視檢測以 /、用於執 中的至少一個，痛^ 盗件上面的可視檢測 獲取女放於寫伏爾組件的器件的圓像。 本發明器件處理且古、gk α 盗具有通過輪換移送窩伏爾組件的 雙:伏爾組件移送部，從而在先行的窩伏爾組件填Li 之後’連續地移送後續的高伏爾組件，從而完成器件Π 後，以空的寓伏爾組件進行交替，從而顯著地減少了高I: 爾組件的父替時間’進而能夠更迅速地執行從晶片到寓伏 201133688 爾組件的載入 【實施方式】 乂下參考附圖，詳細說明本發明的器件處理器。 圖1為本發明器^丰_畑仰 、一 件處理窃的結構示意圖；圖2a及圖 2b為圖不各個晶圓的結構的立體圖和剖面圖丨圖3為用於 圖1的器件處理器的寓伏爾組件立體示意圖；圖4為圖示 在圖1中從晶圓載入部至器件卸載部的器件的移動過程的 概念圖；圖5a至圖5c為晶片載人部的工作過程平面示音 圖；圖6a至圖6d為器件卸載部的工作過程的平面示意亦 圖7a至圖為寫伏爾組件載入部和寓伏爾組件卸載部的 工作&程不思圖’ ® 8為窩伏®組件移送部的結構示意 圖，圖 9 a 至圖 9clA 哭 、 為器件卸載部的窩伏爾組件移送部的工 作過程側面示意圖。 如圖1至圖4所不，本發明的器件處理器包括： 圓載入^ 100，載入晶圓（wafering) 20，上述a 圓20裝載有完成檢測工序的器件；晶圓移動台2。。，接： 從晶圓載入部100供給的晶圓20,以將裝載有器m。的The devices described above are: CPU, SDRAM (memory semiconductor), flash RAM, etc. Recently, there are various DDIs (DispUy ic) such as (10) (CMp 〇n to kiss) and coffee (chlp0nFilm). In particular, the inspection process is carried out and, as described above, in order to improve the stability, the appearance state of the device as described above, and the defective device is picked out, only the qualified device is shipped. In the manufacturing process of the device, it is possible to perform multiple times on the device. In particular, after the wafer is cut into individual devices, the individual detection results can be displayed on the device. As described above, in the device that completes the inspection process, the sorting device for the 201133688 or subsequent process is shipped. Only qualified devices can be installed in the installation process of the waffle assembly. The detection type can be used to control the device and the production process according to the manufacturing process and classification process of the device as described above. . The existing device of the component is in the process of 'if the Volvo's waffle component is loaded and loaded, however, the device used to load the device into the socket is filled with the components that load the wafer into the waffle component. For devices, it is necessary to unload the filled waffle components. The parts of the piano can't be executed during the alternate period (4)! Therefore, the alternate time required to write the Volt component is limited, and the time from the loading of the cymbal to the waffle component is limited. SUMMARY OF THE INVENTION The object of the present invention is to solve the problem of loading a U-shaped device into a write-once I (four) device processor that supplies an alternating (four) volt component through an alternating time component of a heart-high Volt component. In order to achieve the above objectives, this issue can be used to open a device at J BI to include: wafer loading, piracy, and private cutting of wafers loaded with devices.曰fg) #动台, receiving the wafer supplied from the 曰® # A circle, the Japanese yen to the right π batch loading unit, and the wafer of the mobile state cow; picking up the tool and indicating the wafer Yin Yin The upper armor Volt component transfer part of the 不 不 壹 壹 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 The second wavre component transfer portion is connected to the first wavle component of the transfer unit of the transfer unit through the upper flute and the pick-up unit, and is buckled.鄱^, ^ and the second nest are unloaded, wherein the second socket is lifted by the pick-up tool. The unloading portion of the device may include: writing a plurality of wolf groups #,*分分 a, into the department, cascading supply of the above-mentioned Volvo components. And 5 less - a nest Volt component transfer work And to the above-mentioned socket _, and transmitted to the inbound portion or the second wavle assembly transfer portion. The high-alge component transfer portion of the waffle assembly transfer tool may include a transfer tool to the 坌_+丄一窝伏尔The component 4 is transferred to the waffle assembly; and the 1 volt component transfer tool is transferred to the first dwell by the 7th transfer tool after the transfer of the wavf assembly described above. In the direction of f, the above-mentioned waffle-wolf component transfer portion is privately sent. β and the component transfer portion or the second-described second-floating-volume component transfer portion _ delivery portion, which is divided into the first heart #{第一-窝伏I component The transfer "clock." The guide and the second guide are in turn known to carry the above-mentioned protrusion, and the above-mentioned first-well-volume component is moved. The guiding portion and the third guiding raft are privately sent to the waffle pack by the second body, and the first fluctuating component is transferred (the first part, the fourth guiding part and the fourth part are sequentially transferred) Four guides.. <Wool's component; thereby being passed to the first write volt component transfer portion or the above-mentioned 乩 乩 笫 莴 莴 莴 莴 莴 莴 莴 组件 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The width and length of the portion 201133688 may alternate the second guiding portion. The first waffle assembly delivery portion may include a first wrap and a second wavle component moving component increase component a repeating component and a second socket-stirty high-altitude component; a moving body, an alpha and a rear end, with a booster component and a second high-volt component as described above - the bottom surface of the wolf component And the body drive does not separately move the respective moving body. The body guiding member may be provided with a roller, which is in contact with the write Volvo 2 Volt component. State At least one of the above-mentioned first-and-aft-volume component augmenting component and the upper pressurizing component may be disposed on the above-mentioned: the movable one-two-two-dimensional component. The moving body may include: fixing the body direction The component can be movably disposed; the support body/the body guide can be arranged to move up and down. Together with the body, the device unloading portion can also be provided with visual detection of the image line in the device placement state, for use in the execution. At least one, visual inspection on the pirate obtains a circular image of the device placed on the write volt component. The device of the present invention processes and has a dual: Volt component transfer by rotating the waffle component. , in order to continuously transfer the subsequent high-volt components after the pre-fabrication of the waffle pack is filled, thereby completing the device and alternating them with empty dwell components, thereby significantly reducing the high I: component The parent's time" can further perform the loading from the wafer to the 201133688 component more quickly. [Embodiment] Referring now to the drawings, the device processing of the present invention will be described in detail. Figure 1 is a schematic view showing the structure of the device of the present invention; FIG. 2a and FIG. 2b are a perspective view and a cross-sectional view showing the structure of each wafer; FIG. 3 is a device for the device of FIG. FIG. 4 is a conceptual diagram illustrating a movement process of a device from a wafer loading portion to a device unloading portion in FIG. 1; FIGS. 5a to 5c are work of a wafer carrying portion; Process Plane Diagram; Figure 6a to Figure 6d are schematic diagrams of the operation of the device unloading section. Figure 7a to Figure 1 shows the operation of the write Volt component loading section and the Davos component unloading section & ® 8 is a schematic view of the structure of the Woof® component transfer section, and Fig. 9a to Fig. 9clA are the side views of the working process of the waffle assembly transfer section of the device unloading section. As shown in FIGS. 1 to 4, the device processor of the present invention includes: a circular loading device 100, a loading wafer 20, the a circle 20 is loaded with a device for performing a detecting process, and a wafer moving table 2. . Then, the wafer 20 supplied from the wafer loading unit 100 is loaded with the device m. of
各個晶圓2 0移動至| ψ / $ D 至導出位置P0 ;撿起工具（PiCk up t〇〇I ) 300，在晶圓移動& a r*i Λ . 上的日a圓20中撿起合格的5|件ι〇· 以及料卸载部4。。’將由撿起工具_傳送的‘格的器 件ίο女放於窩伏爾組件（waffle pack”。，以卸載器件 10’上述窩伏爾組件30形成有多個用於安放各； 的安放槽31。 " 1* ιυ 201133688 上述器件10是構成像c〇G(Each wafer 20 moves to | ψ / $ D to the derived position P0; the pick-up tool (PiCk up t〇〇I) 300, picks up in the day a circle 20 on the wafer movement & ar*i Λ . Qualified 5|piece ι〇· and material unloading section 4. . 'The device of the 'grid' that is transferred by the pick-up tool_ is placed on the waffle pack. To unload the device 10', the waffle pack 30 described above is formed with a plurality of mounting slots 31 for mounting each; " 1* ιυ 201133688 The above device 10 is composed like c〇G (
LhlP 〇n Glass)^C0F(ChipLhlP 〇n Glass)^C0F(Chip
On Film)—樣的作為顯示器驅 勒日日片的 DDI(Dlspiay Drive 4 1C日日片，LED器件等 器件疋元成所謂的半導體 工序和切割工序（以及檢測工 0 0 斤分類工序）的晶片。並 且’如圖2a和圖2b所示，在士# + + 考# 1 η驻I 70成刀。工序後，以將上述 裔件1〇裝載於晶圓20的狀態，對其進行移送。 20作為用於裝載器件1G並進行移送的結 採用多種結構。如圖2a和圖2b所示，上述曰圓 可以包括：粘接帶21，Α τ估，日々 上过日曰圓 為了使侍各個器件10附著於其 上面：其表面具有枯接性；第一結合環22，結合有 21，U及第二結合環23，針對結合社 4. « οι ^ ^ 、第，，，D 5 壤 22 的粘 外役方向施加張力，使得粘接帶21向外徑方 出現變形，從而細微地隔離各個器件1〇。盆 ^ ° ο π —p , ’、 上述晶圓 …括·'钻接帶，為了使得各個器件ι。附著於 接帶。纟表面-有粘接性’以及-個結合環’結合有粘 上述晶圓20可以為圓形、四邊形等 雔番姓人ISS碰』、 裡仏狀，可以由 又重、·，。5 %構成，還可以由單一結合環構成。 。。如圖3所示，上述寫伏爾組件3〇形成有多個用 态件10的安放槽31，並且可以具有矩形等多種形狀。 、上下層疊寫伏爾組件3。時’為了防止受損，優選地， 上述安放槽31的深度設置成大於器件1〇的高度。 上述晶圓載入部100可以包括：卡盒载入^ HO， 入晶圓卡盒（wafering cassette) U 載 ，、中上述晶圓卡 201133688 座111裝載有多個晶® 20，上述晶® 20裝載有考 晶片移動工具12。’為了相互替換第一個晶圓2" 10; 晶圓20在晶圓卡± ηι和晶圓移動台2。〇 :-個 八 攻第一個晶圓2〇為將要導出器件i 〇 Μ曰 上述第二個晶圓2f)成腺吳# τ Λ9日曰日圓’ _ Ζ (]為將益件1 〇導出完畢的晶圓。 上述晶圓卡各彳11 皿111疋用於層疊多個晶圓20 中上述晶圓20|巷右哭/iLin 、置’八 裝載有益件1 〇，只要是能夠層疊 2 0的結構均可接用., 、載日日圓 。作為一個實施例，其設置成可 動的結構’從而能夠依次導出層疊的晶圓20。 並且’如圖1所示’上述晶圓載人部1GG還可以包括： 晶片緩衝部13 0，用於將筮 a 、將第一個晶圓20傳送至晶圓轉叙二 2 0 〇之前，從晶圓移動Α σ 隻太 動。200接收所傳送的第二個晶圓20, 個晶圓10向晶圓移動台2〇〇傳送完畢之後，臨時保管 第二晶圓20 ,以將第二晶圓2〇傳送至晶圓卡盒⑴的空 立，其中上述第一個為將要導屮哭I ^ 竹罟等出益件10的晶圓，上述第二 個晶圓20為將器件i。導出完畢的晶圓。 一 上述晶片緩衝部13η县田士 用於L時保管晶圓20的裝置， 只要是用於支撐晶圓20的結構均可採用。 上述晶片移動工具19η β + i20疋在晶圓卡盒ill和晶圓移動 D 200之間用於移送晶圓2n m ，2D Μ置’其可以採用多種結 構。如圖5a至圖5c所示，护妯社4丄 x據該 吉構可以實現：從晶圓 卡盒111導出第一個晶圓2〇時， _ 矸將第—個晶圓20移動至 日日圓移動台2 0 0的同時，推翻/ 推動位於晶圓移動台200的第二 個晶圓20，以將第二個晶圓9η你* 曰日圓20移動至晶片緩衝部130,晶 201133688 圓移動台200移動至導出位置 的當-加日m 证於日日片緩衝部1 30 0第一個日日圓20移動至晶圓卡盒u J。 上述晶圓移動台200是將從晶圓卡盒 -移動至導出位置PO的裝置，其令上述導出位置出^曰由圓 ^起工具删可以導出器件1Q的位置，其可以採用多種結 構。如圖1所示，其可以進行 甘士 v 仃入γ移動或者χ-γ-θ移動。 其中’ Χ-Υ代表以晶圓20的水平面盔| .隹Α m，… 尺千面為基準的垂直坐標系的 丄‘軸，Θ代表以z軸中心進行旋轉。 如圖4上述，導出位置p〇的下側還可以設置一 個加壓針腳210,上述b圓梦紅人 有至^一 中命署p吐 过日日圓和動台2〇〇將晶圓20移動至導. 出位置Ρ〇時’為了便於写杜 〜使於盗件10的撿起’對其 的移動，從而對晶圓20的+ Π上側 曰曰圓』的枯接帶21進行加遂。 據器件！〇的尺寸，上述加厂堅針腳210的數量有所不I根 此時’如果上述加塵針腳21〇是根據器们 置P〇移動的結構時，還需I 、導出位 吁還需要增加用於移動的裝置 加了製造成本。因此作為#、g 攸而增 心乍為優選方案’將其進行 優選地將器件10的導出位置p〇進行固定。&進而 並且，上述晶圓移動台2〇。的上側還 於獲取晶圓20的圖像以檢 。置有.用 ^ 件10的安放狀態的第一 n 像獲取部3 3 0，例如相機等 而在本貫施例中，ϋ μ焓 轉晶圓移動台200,以旋轎曰固〇Λ 通過紅 〇π 轉曰日圓20，進而將器件10的日圓 20上的安放狀態調節為 υ的日日圓 槽31的狀態。 了以女放於高伏爾組件的安放 其中’上述第一圖像獲 獲取330可以執行在對器件10 10 201133688 安放狀態的可親給：目,1 ,、，η 至少-個。J以及對器件10上面的可視檢測中的 方面，上述撿起工具300是用於務… 置，苴粝姑认 、移迗态件10的裝 置/、根據撿起方式可以採用多種結構其可以 附頭（未圖示），隨著上下移冑（ ^ 0 真空壓力以吸附51件丨〇 D移動）用於產生 丨竹窃件1 0，從而實現撿起。 至：載=撿起工具300從晶圓移動台200直接移送 .部叫其可以只包括—個撿起工具Μ。。 二 件的移送方式，上述撿起工具3。。可以採用 夕種結構，其還可以执罢士 #— ^ 了^置成能夠錢[ym㈣、 向移動、旋轉移動等多種方式的移動的結構。 尤其，如圖1所示，上述撿起工具3〇〇，對寫伏爾組 件30進行裝載時，需要χ方向 、 移動的結構。 …用可進仃X方向 圖1 ® 6a至圖6d所示’上述器件卸載部_包 > .第一寓伏爾組件移送部50卜移動第_個窩伏爾組件 ’以進行抑載，其中第一個窩伏爾組件3〇安放有被撿起 工具31G撿起的器件1G;以及第二窩伏爾組件移送部502， 與被第—寫伏爾組件移送部501移動的第_寫伏爾組件進 :聯動’移動第二個窩伏爾組件3〇,以進行卸載其中第 -個窩伏爾組件30安放有被撿起工具31〇撿起的器件… ^述第一窩伏爾組件移送部501和上述第二寫伏爾組 件移送部502是具有將被撿起工具3〇〇移送的器件ι〇安放 於窩伏I组件30的安放槽、並且用於移送寫伏爾組件3〇 20Π33688 的裝置’其還可以採用其他多種結構。 並且，上述第—离 ,,^ 罱伏爾組件移送部501 #D±if @电 伏爾組件移送部5〇2除 上述第二窩 】配置以及窩伏爾组杜 所不同之外，其餘結構 I，件30的位置有 貫際上相同。如圖8、 所示’其可以分別包括： ® 9a至圖9d 第二萬伏爾組件增壓部 ° 到增壓部件510和 至。P件520 ’以各個窝佚 送方向為基準，分別支 帛伏爾組件30的移 叉镡窩伏爾組件3〇的前 固定寫伏爾組件30 ;移動機體530,安裝有第—以 件增壓部件51 〇和第_ 、有第—窩伏爾組 弟一窩伙爾組件增壓部 伏爾組件30的底面.； 520,支撐窩 乂及機體驅動部55〇 部540對移動機體53〇進行移動。 &者機體導向 上述第-窩伏爾組件增麼部件5ι〇和 組件增I部件520是可以移送窩伏I组件第^伏爾 窩伏爾組件30的前端 通過支撐 笔^ 固疋窩伏爾組件30的駐 置，其可以採用其他多種結構。的裝 了能夠隨音机罟蛮你a和圖9b所示，為 “匕夠隨思5又置窩伏爾組件3 〇的位 增壓部件510和第二寫伏心曰杜“ 孚第一窩伏爾組件 個，沿著機體導向部54〇 中的至>、- 上-f 動地叹置於移動機體530。 述第-窩伏爾組件增壓部件510 組件增壓部件520中的至少— 31第-寓伏爾 彈菁（咖⑻等多種組合來實施。動可以由氣職以及 ^且，為了能夠隨意設置离伏爾組件3。 第一窩伏爾組件增壓部件51〇和 这 s?n ^ - ^ ^ ^ 乐—高伏爾組件增壓部件 520還5又置有在與窩伏爾組件3〇 刃引糙和後端接觸的狀態 12 201133688 下可^旋轉的滚輪（ro】Ier) 511和滚輪切。 -方面’上述第一窩伏爾組件移送部5〇ι和第 爾組件移送部⑽相互交換第—個窩伏爾組件3q和第^ 窩伏爾組件30並移送的過 —個 ，第二窩伏爾組件增厂件增虔部件 窩伏爾組件…-㈣：： 橫向移動第-個 戈第-個窩伏_牛30。並且上述第 =件增塵部件5〗。和上述第二窩伏爾組件增㈣： ’為了將寫伏爾組件30移送至將要後述的寫伏爾組件 P - 46。之後移送新的窩伏爾組件3〇 ’橫向移動窩伏 組件30至用於接收所傳送的新的寫伏爾組件μ的位置。 進而，在上述第一窩伏爾組件增壓部件51〇和上述 二寫伏爾組件增Μ部件㈣橫向移㈣伏爾組件 了使其移動不受干涉，優選地向下側移動。 ，為 ::第-寓伏爾組件增壓部# 51〇和第二寫伏爾組件 曰“件520向下側移動的機構可以有多種。 戶斤7F ^ 了支撐上述第-窩伏爾組件增壓部件 ^第4伏I组件增壓部件52Q而設置的移動機體训 a m定機體532,沿著機體導向部54()可移動地 支撐機體53卜與固定機體532 —同可上下移㈣ ’以及上下驅動部（未圖示），相對於固定機體532， 下驅動支撐機體53卜因此，第一离伏爾組件增壓部件 和第二寓伏爾組件增壓部件52。可以向下側移動。 上述固定機體532,沿著機體導向部54{)移動地設置， 、’與移動部件560結合而成，其中上述移動部件56〇， 13 201133688 由驅動裝置（未 有至少一個導執 可以採用多種結 沿者傳送帶（be 1 1 ) 5 70可移動地設置 圖示）驅動傳送帶570。 並且上述固定機體532可以設置 532a’用於導向支撐機體531的移動。 上述上下驅動部，根據其驅動方式， 構。即，可以採 高伏爾組件增壓部# 520中的至少一個的驅動方式類似 結構，例如：可以採用由氣壓泵以及彈簧（spring)等 種組合來實施。On Film) - DDI (Dlspiay Drive 4 1C Japanese film, LED device, etc. as a display for the so-called semiconductor process and cutting process (and the inspection process of 0 kg) And, as shown in Fig. 2a and Fig. 2b, in the case of the ## + + test #1 η I 70 knives. After the process, the above-mentioned materials are loaded on the wafer 20 and transferred. 20 is used as a structure for loading the device 1G and transferring. As shown in Fig. 2a and Fig. 2b, the above-mentioned circle may include: an adhesive tape 21, Α τ estimated, the sundial on the sundial in order to make each The device 10 is attached thereto: its surface has a dryness; the first bonding ring 22 is combined with 21, U and a second binding ring 23, for the combination of 4. « οι ^ ^ , , , , , D 5 The tension is applied in the direction of the adhesive outer force, so that the adhesive tape 21 is deformed toward the outer diameter side, thereby finely isolating the respective devices. The basin ^ ° ο π - p , ', the above wafers ... the 'drilled tape, In order to make each device ι. Attached to the tape. 纟 surface - there is adhesion 'and a combination 'Incorporating the above-mentioned wafer 20 can be round, quadrilateral, etc. ISS 人 、 、 、 、 、 、 、 、 、 、 、 、 、 、 , , , , , , , , , , , , , , , , , , , , , , , , , As shown in FIG. 3, the above-described write volt component 3 is formed with a plurality of mounting grooves 31 for the state member 10, and may have various shapes such as a rectangular shape. The upper and lower write volt components 3 are stacked. The depth of the mounting slot 31 is set to be greater than the height of the device 1. The wafer loading unit 100 may include: a cartridge loading device, a wafer loading cassette, and a crystal. The round card 201133688 block 111 is loaded with a plurality of crystals 20, and the above crystals 20 are loaded with the test wafer moving tool 12. 'To replace the first wafer 2"10; wafer 20 on the wafer card ± ηι and wafer Mobile station 2. 〇: - an eight attack on the first wafer 2 将 is to export the device i 〇Μ曰 the second wafer 2f) into the gland wu # τ Λ 9 day 曰 yen ' _ Ζ () for benefit Item 1 〇 Exported wafers. The above wafer cards are each 11 疋 111 疋 for stacking multiple wafers 20 The wafer 20|the right crying/iLin and the 'eight-loading benefit piece 1' can be used as long as the structure can be stacked 20, and the Japanese yen is carried. As an embodiment, it is set as a movable structure. 'The laminated wafer 20 can be sequentially derived. And the above-described wafer carrying portion 1GG can also include: a wafer buffer portion 130 for transferring 筮a to the first wafer 20 to Before the wafer revolving 2,200 ,, moving from the wafer Α σ is only too moving. 200 receives the transferred second wafer 20, and after the wafer 10 is transferred to the wafer mobile station 2, temporarily stores the second wafer 20 to transfer the second wafer 2 to the wafer cassette. (1) The vacancy, wherein the first one is a wafer that will guide the crying I ^ bamboo raft and the like, and the second wafer 20 is the device i. Exported wafers. The above-described wafer buffer portion 13n, the device for storing the wafer 20 in the case of L, can be used as long as it is used to support the wafer 20. The wafer moving tool 19n β + i20 is used to transfer the wafer 2n m between the wafer cassette ill and the wafer movement D 200, which can adopt various structures. As shown in FIG. 5a to FIG. 5c, the 妯 妯 据 据 据 可以 可以 可以 可以 可以 可以 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出 导出At the same time as the Japanese mobile station 200, the second wafer 20 located on the wafer mobile station 200 is pushed/pushed to move the second wafer 9n to the wafer buffer portion 130, and the crystal 201133688 is moved circularly. The day-to-day m of the station 200 moving to the export position is moved to the wafer cassette UJ by the first day circle 20 of the sundial buffer unit 1 30 0. The wafer transfer table 200 is a device for moving the wafer cassette - to the lead-out position PO, and the position of the lead-out device can be derived from the tool to extract the position of the device 1Q, which can adopt various configurations. As shown in Fig. 1, it is possible to perform a gamma movement or a χ-γ-θ movement. Where ’ Υ Υ represents the horizontal axis of the wafer 20 | 隹Α m,... The 丄 ‘axis of the vertical coordinate system based on the tens of thousands of faces, Θ represents the rotation at the center of the z-axis. As shown in FIG. 4, a lowering side of the deriving position p〇 may further be provided with a pressing pin 210, and the b-dreaming red man has a spit to the sun and the moving table 2 to move the wafer 20 When the position is Ρ〇, the squeezing tape 21 of the + Π upper side of the wafer 20 is twisted in order to facilitate the writing of the thief 10 to move it. According to the device! The size of the crucible, the number of the above-mentioned factory-studded pins 210 is not the same. At this time, if the above-mentioned dust-filling pins 21〇 are based on the structure in which the devices are moved by P, the I need to be added, and the export position is required to be increased. The manufacturing cost is added to the mobile device. Therefore, it is preferable to increase the focus as #, g ’', and it is preferable to fix the lead-out position p〇 of the device 10. & Further, the wafer moving table 2 is. The upper side also acquires an image of the wafer 20 for inspection. In the present embodiment, the first n image acquisition unit 303 is placed in the state of the device 10, for example, by a camera or the like. The red 〇 π turns to the Japanese yen 20, and the state of the Japanese yen 20 on the device 10 is adjusted to the state of the Japanese yen groove 31. The placement of the female in the high-volume component wherein the first image acquisition 330 described above can be performed on the affiliation of the device 10 10 201133688: at least one of 1 , , , η. J and the aspect of the visual inspection on the device 10, the above-mentioned pick-up tool 300 is used for the device, and the device for moving the device 10 can be attached to the device 10 according to the pick-up method. The head (not shown) is used to generate the smashing piece 10 as it moves up and down (^ 0 vacuum pressure to move 51 pieces of 丨〇D), thereby achieving pick-up. To: The load=pick up tool 300 is directly transferred from the wafer mobile station 200. The part may include only one pick-up tool. . The transfer method of the two pieces, the above-mentioned pick-up tool 3. . It is possible to adopt the structure of the eve, and it is also possible to implement the structure of the movement of [ym(4), moving, rotating, etc. in various ways. In particular, as shown in Fig. 1, when the pick-up tool 3 is mounted on the write-flux component 30, it is necessary to move in the direction and move. ...the above-mentioned device unloading section_package>the first dvr component transfer section 50 moves the _th worf component to perform the load, as shown in Fig. 1 ® 6a to Fig. 6d, The first waffle pack 3 is placed with the device 1G picked up by the pick-up tool 31G; and the second wavre component transfer portion 502 is moved with the first writ by the first writ-volume transfer unit 501. Volt component advancement: linkage 'moving the second nest Volvo component 3〇 to perform unloading where the first-floating component 30 is placed with the device picked up by the pick-up tool 31... The component transfer portion 501 and the second write volt component transfer portion 502 are provided with a device ι which is to be transferred by the pick-up tool 3 〇 in the mounting groove of the socket I assembly 30, and are used for transferring the write volt component 3 The device of 〇20Π33688' can also adopt a variety of other structures. Further, the above-mentioned first-to-out, ^ 罱 尔 组件 移 移 501 501 501 # 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电 电I, the position of the piece 30 is consistently the same. As shown in Fig. 8, it may include: ® 9a to Fig. 9d 20,000 volt assembly plenum ° to boosting members 510 and . The P piece 520' respectively supports the front fixed write volt component 30 of the shifting armpit volt component 3〇 of the volt component 30, and the moving body 530 is installed with the first component. The pressing member 51 第 and the _, the first-wolf volt group, the bottom surface of the plenum assembly 30 of the plenum assembly; 520, the support socket and the body driving portion 55 540 are opposite to the moving body 53 Move. The body of the body is guided to the above-mentioned first-wolf-volt component, and the component-added component 520 is a front end of the Volt I component that can be transferred to the socket. The standing of the assembly 30 can take on a variety of other configurations. The installation is able to follow the sound of the machine you are a and Figure 9b, as the "sufficient to think about 5 and set the Volvo component 3 〇 position of the booster component 510 and the second write heart 曰 Du Fu" first The waffle packs are slid to the moving body 530 along the up to >, -up-f in the body guide 54. The first-floating-volume component pressurizing member 510 is at least - 31-dwelling arbor (the coffee (8) and the like in the component pressurizing member 520. The movement can be performed by the voluntarily and ^, and in order to be able to set freely The Volt component 3. The first socket Volt component pressurizing component 51〇 and the s?n ^ - ^ ^ ^ Le-Gauvre component pressurizing component 520 are also placed in the housing and the Volvo component 3〇 State of blade roughening and rear end contact 12 201133688 The rotating roller (ro) Ier) 511 and the roller are cut. - Aspect 'The first wavre component transfer part 5〇ι and the dil component transfer part (10) are mutually Exchanging the first whelf component 3q and the dimple Volt component 30 and transferring the over one, the second whelf component is added to the component to increase the component wavre component...-(four):: laterally moving the first戈 _ 窝 窝 _ _ 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 - 46. Afterwards, the new wavre component 3〇's laterally moving the waffle assembly 30 to receive the transmitted new wfr The position of the piece μ. Further, the first wrap-volume component pressurizing member 51〇 and the second waffle assembly augmenting member (4) are laterally displaced (four) volts assembly so as to be moved without interference, preferably to the lower side Move., as:: the first-dwelling volt component plenum #51〇 and the second write volt component 曰 "The mechanism for moving the member 520 to the lower side can be various. The jin 7F ^ supports the above-mentioned first-wolf The moving body body of the component plenum (the 4 volt I component plenum 52Q) is provided with the body 532, and the body 53 is movably supported along the body guiding portion 54 () and the fixed body 532 can be moved up and down. (4) 'and the upper and lower driving portions (not shown), the lower driving support body 53 with respect to the fixed body 532, thus, the first decelerating component pressurizing member and the second dwelling component pressurizing member 52. The fixed body 532 is disposed movably along the body guiding portion 54{), and is combined with the moving member 560, wherein the moving member 56〇, 13 201133688 is driven by the driving device (there is not at least one guide Use a variety of knot conveyor belts (be 1 1 5 70 is movably provided to drive the conveyor belt 570. The fixed body 532 can be provided with 532a' for guiding the movement of the support body 531. The upper and lower drive portions are configured according to the driving manner thereof. At least one of the component plenums #520 is driven in a similar manner, for example, by a combination of a pneumatic pump and a spring.
一方面，上述第一窩伏爾組件移送部501和上述第二 窩伏爾組件移送部502分別通過第一導向部411和第二導 向部412可以依次卸載窩伏爾组件3〇。 上述第一導向部411和第二導向部412是用於導向通 過第一窩伏爾組件移送部501和第二窩伏爾組件移送部 5 〇 2私送的窩伏爾組件3 〇的裝置，其可以採用其他多種結 構其叹置成Y軸方向，Y軸方向垂直於撿起工具3〇〇的 移動方向（X軸）。 並且，上述第一導向部411和上述第二導向部412可 以以寬度和長度不同的其他部件進行交替，從而根據高伏 爾組件30的尺寸可以調節長度和寬度，即與第一導向部 411之間的長度和寬度。 一方面’上述器件卸載部400可以包括：窩伏爾組件 載入部450，層疊有多個窩伏爾組件3〇，並依次供給窩伏 爾組件30 ;以及一個以上的窩伏爾組件移送工具47〇、 14 201133688 480，從窩伏爾組件載入部45〇 , 砂k窩伏爾組件3 0，廿禮 遞給第一窩伏爾組件移送部5〇1 、’傳 5〇2。 次第一窩伏爾組件移送部 只要是層疊有多個窩伏爾組 細杜qn沾紝雄u d0並依次供給窩伏爾 構，上述寓伏爾組件載入部450均可採用。如 圖1、圖6a至圖6d、圖7a至圖7 如，Γ λ ~所不，窩伏爾組件載入 4 450可以包括：—個以上的垂直框架⑸ 組件30的側面以導向上下移動、 芽窩伏爾 门上下寿夕動，上下移動部453，沿著垂 直框架451上下移動窩伏爾組件 。 垂 了讓將要後述的第1伏爾έ 1及限位器452 ’為 卨伏爾組件移送工具470導出窩伏爾 組件30，用於支撐最下端 ° 办 鳊的窩伏爾組件30的底面，使盆 上下移動部453之間維持間隔。 ’、 上述垂直框架451是用於雄：{主哲 能，“” X用於維持窩伏爾組件30的層疊狀 二下移動的裝置，其可以採用多種結構。 产和種尺寸㈣伏I组件3G，其可以採用可調節寬 度和長度的結構。 見 伏爾Γ!7a至圖7d所示，上述上下移動部453是支樓窩 •κ 3〇的底面或側面以向上側 。 時予以切的結構，心採動並且向下側移動 /、j以知用多種其他結構。 撐最==所/，上述限位11 452通過支樓部件452a支 的高伏爾組件30的底面或側面；如圖7b所示， 過線形驅二支撐窩伏爾組件物 其的支擇 線形移動支擇部件452a，從而解除對 15 201133688 並且’如圖7c所示’支撐上述窩伏爾組件如的上 移動部453向下側下降。此時’線形移動支撐部件452a， 以支撐位於上侧的窩伏爾組，牛30。如圖7d所示，上述第 寫伏爾組件移达工具470通過對被上下移動部453支f 的窩伏爾組件3 0進行加壓以將其導出。 件4 2方面，上述器件卸載部4〇°還可以包括：高伏爾組 :卸載部460,設置於移動路徑μ" 一端， 伏爾組件30，i φ ρ、+，& ^ 八中上述窩伏爾組件30裝載有器件丨〇。 上述窩伏爾組件卸載部偏的結構及工作 -件載入…結構及工作類似，因.此省略詳細::爾 八中”窩伏爾組件載入部450的結構相關，以窩伏 _組件移送部500符桂势 办 代替第一窩伏爾組件移送工具470 ;針 對上下移動部453 ，.D構除了還包括用於移動窩伏爾組 夕送部500的結構外，其餘結構幾乎相同。 圖7a至圖7H Φ，και阳 彳圖“記 461、462、462a、462b 以 463刀別為·垂直框架、限位器、支撐部件、線形驅動 #以及上下移動部。 並且，與上述高伏爾組件載入部Μ"目關，窩伏爾組 載入部450和寓伏爾組件卸載部可以相互平行設置。 上述第-窩伏爾組件移送工& 47〇、第二窩伏爾組件 俵：工具48°是將高伏爾組件3。從高伏爾組件載入部450 '帛高伏爾組件移送部5〇1或第二寫伏爾組件移送 5 0 2的結槿，並、署_p、 、可以採用其他多種結構。其可以包括： 弟—窩伏爾組件移送且 具470，以第一方向lpi進行移送； 16 201133688 以及第二窩伏爾組， 移送…。將、二爾:：具48°’通過第一寓伏I組件 m進行編：件3"多送完畢後’以第二方向 送部⑽或第二寫伏…冑遞、'。帛窩伏爾組件移 尚仇爾組件移送部5 〇 2。 述第窩伏爾組件移送工具470和上述第二窝佚 組件移送工具48〇 a田^ —窩伏爾 480疋用於移送高伏爾組件3〇的結 可以採用其他多種結構，其還可以包括：增壓部件4;還 增壓部件481 ’對窩伏爾組件3。的一側增壓；以及 (未圖示），通過增壓部件471、增壓部件4 。 即LP1、m，移送寫伏爾組件3〇β 固方向’ 其中’上述第一窩伏爾組件移送工具47〇和上 寫伏爾組件移送工具權的增星部件471、增壓部1 可以形成為分別用於導向寫伏爾組件3〇的移 的一部分。 吁π # -方面，第-窩伏爾組件移送工卩47〇，通過第 向部仍和第三導向部413,依次移送寫伏爾組件3〇 = =寫㈣組件移送工具，通過第二導向部412和第四 導向#414，依次移送寫伏爾組件3〇，從而將其傳遞 -窩伏爾組件移送部501或第二窩伏爾組件移送部5。2。In one aspect, the first waffle pack transfer portion 501 and the second waffle pack transfer portion 502 can sequentially unload the waffle pack 3 through the first guide portion 411 and the second guide portion 412, respectively. The first guiding portion 411 and the second guiding portion 412 are means for guiding the waffle pack 3 私 which is privately transported through the first waffle pack transfer portion 501 and the second wavre assembly transfer portion 5 ,2, It can adopt other various structures, and its slant is set to the Y-axis direction, and the Y-axis direction is perpendicular to the moving direction (X-axis) of the pick-up tool 3〇〇. Moreover, the first guiding portion 411 and the second guiding portion 412 may be alternated with other members having different widths and lengths, so that the length and the width may be adjusted according to the size of the high-volt component 30, that is, with the first guiding portion 411. Length and width between. In one aspect, the device unloading portion 400 may include: a waffle pack loading portion 450, a plurality of waffle packs 3, and sequentially supply the waffle assembly 30; and more than one waffle component transfer tool 47〇, 14 201133688 480, from the waffle assembly loading unit 45〇, the sand k-wolf assembly 30, the hand to the first wavre component transfer unit 5〇1, 'pass 5〇2. The first doffer component transfer portion 450 can be used as long as a plurality of waffle groups are stacked and sequentially supplied to the wavf structure. As shown in Fig. 1, Fig. 6a to Fig. 6d, Fig. 7a to Fig. 7, for example, 窝λ~, the waffle assembly loading 4450 may include: more than one vertical frame (5) side of the assembly 30 for guiding up and down movement, The Buddhism Volt door moves up and down, moving up and down the moving part 453, moving the wavre assembly up and down along the vertical frame 451. The first Volt 1 and the stopper 452', which will be described later, are led to the waffle assembly transfer tool 470 to derive the waffle assembly 30 for supporting the bottom surface of the wavler assembly 30 at the lowermost end. The interval between the pot up and down moving portions 453 is maintained. The above vertical frame 451 is for a male: {main genius, "" X is used to maintain the stacking motion of the waffle pack 30, and it can adopt various structures. Production and seed size (four) volt I component 3G, which can be constructed with adjustable width and length. See Volt! 7a to 7d, the upper and lower moving portions 453 are the bottom or side faces of the slabs κ 3 以 to the upper side. At the time of cutting the structure, the heart is plucked and moved to the lower side /, j to know a variety of other structures. Supporting the most ==, /, the above-mentioned limit 11 452 passes through the bottom surface or the side surface of the high-volt component 30 supported by the branch member 452a; as shown in Fig. 7b, the linear drive 2 supports the support of the waffle assembly. The adjustment member 452a is moved to release the pair 15 201133688 and the upper moving portion 453 supporting the above-mentioned waffle assembly as shown in Fig. 7c descends downward. At this time, the support member 452a is linearly moved to support the wolverine group on the upper side, the cow 30. As shown in Fig. 7d, the above-described fourth volt component transfer tool 470 is guided by pressurizing the waffle pack 30 which is supported by the upper and lower moving portions 453. In the aspect of the fourth aspect, the device unloading portion 4〇 may further include: a high-volt group: an unloading portion 460, which is disposed at one end of the moving path μ", the Volt component 30, i φ ρ, +, & ^ 八The waffle assembly 30 is loaded with device 丨〇. The structure and work-loading of the above-mentioned waffle assembly unloading portion are similar to the structure and work, because the detailed description is omitted: the structure of the waffle assembly loading portion 450 is related to the frame The transfer unit 500 replaces the first wavre component transfer tool 470; the rest of the structure is almost the same for the upper and lower moving portions 453, .D except for the structure for moving the waffle group evening portion 500. Fig. 7a to Fig. 7H Φ, και Yang 彳 "" 461, 462, 462a, 462b with 463 knives as a vertical frame, a stopper, a support member, a linear drive # and a vertical movement portion. Further, in conjunction with the above-described high-volt component loading unit, the waffle group loading unit 450 and the ordnance component unloading unit may be disposed in parallel with each other. The above-mentioned - volt-volt component transfer device & 47 〇, second worval component 俵: tool 48 ° is the high Volt component 3. From the high-volt component loading unit 450', the high-volt component transfer unit 5〇1 or the second write-volt component is transferred to the knot of 502, and the _p, and other various structures can be used. It may include: a brother-float component transfer and a 470, which is transferred in a first direction lpi; 16 201133688 and a second wolf group, transfer... Will, Er:: 48°' is edited by the first embedding I component m: 3" after the multi-send is completed, the second direction is sent (10) or the second is written... The armpit Volt component is moved to the sinister component transfer unit 5 〇 2. The first socket voltage component transfer tool 470 and the second socket component transfer tool 48 〇 a 窝 — 窝 疋 疋 疋 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移: pressurizing member 4; also pressurizing member 481 'on the waffle assembly 3. One side is pressurized; and (not shown) passes through the pressurizing member 471 and the pressurizing member 4. That is, LP1, m, transfer write volt component 3 〇 β solid direction 'where 'the above-mentioned first wavre component transfer tool 47 〇 and the upper-loading volt component transfer tool right astigmatism part 471, the plenum 1 can be formed Used as part of the shift for guiding the write volt component 3〇, respectively. π π # - aspect, the first-Walvo component transfer process 47〇, through the first portion and the third guiding portion 413, sequentially transfer the write volt component 3 〇 = = write (four) component transfer tool, through the second guide The portion 412 and the fourth guide #414 sequentially transfer the write volt component 3 〇 to transfer it to the waffle pack transfer portion 501 or the second wavle assembly transfer portion 5 .
其中，如上所述，上述第三導向部413通過與第 向部412交替，可以根據窩伏爾組件30的尺寸調節第 入路請的寬度和長度，即與第三導向部4u 度和長度。 I 一方面，上述窩伏爾組件30的移送路徑上設定有裝裁 17 201133688 位置，即與撿起工具300的 秒動方向LL(x軸）相互交叉 的裝載地點中，用於將通過撿叔 揿起工具300移送的器件1〇安 放於寫伏爾組件3〇的安放槽31的位置。其中，為了確認 '件1〇是否穩定地安放於高伏爾組件30的安放槽31内， 上述裝載位置的上部可以設置有 巧弟一圖像獲取部3 5 〇，例 如：相機。 以下 詳細說明 ，對具有上述結構的器件卸載部4〇〇 的工作進行 通過如圖7a至圖7d所示的步嗷丄社 銘h ’步驟，由第-窩伏爾組件 移达工具.470依次從窩伏爾組件載 戰入部450導出將要裝截 器件10的多個窩伏爾組件3〇。 戈装戰 如圖6a所示，由第一窩伏爾 仵移迗工具470沿著第 一方向LP1移送從上述窩伏爾組件 m ,, qn ,, + 戰入。p 450被導出的窩 伏爾.、且件3G。此時，上述第二窩 叫、、且件移运工具4 8 η笙 待導向部的一部分，其用於導向通過第— 、 工具470移送的窩伏ι组件3卜 °組件移送 如圖6b所示’通過上述第1伏爾組件移送工呈㈣ 的窩伏爾組件30的移送完成之後，第— 乐一窩伏爾組件蒋矣 具480 ’沿著第二方向Lp2移送窩伏 ' 遞必預弁笤拣的筮啦 明、、且件30 ’以將其傳 邐、，·α預先#待的第一窩伏爾組件移送 組件移f㈣。此時，第-窩伏爾級件移〜二= 存導向部的一部分，其用於導向通過 ^ 一高伏爾^且拉_劣交；说 工具480移送的窩伏爾組件3〇。 、 运 則如圖6c所示，如果上述窩伏 ，，且仵3 0傳送給第一Here, as described above, the third guide portion 413 is alternated with the first portion 412, and the width and length of the first path, that is, the fourth guide portion and the length can be adjusted in accordance with the size of the waffle pack 30. I On the one hand, the transfer path of the waffle pack 30 described above is set with the position of the 2011 17688688, that is, the loading position that intersects with the second direction LL (x-axis) of the pick-up tool 300, which is used for passing the uncle The device 1 to which the pick-up tool 300 is transferred is placed at the position of the mounting groove 31 of the write volt assembly 3. Here, in order to confirm whether or not the member 1 is stably placed in the seating groove 31 of the high-volume assembly 30, the upper portion of the above-described loading position may be provided with an image acquisition portion 35, for example, a camera. As will be described in detail below, the operation of the device unloading portion 4A having the above-described structure is carried out by the steps of the step-by-five component transfer tool .470 as shown in Figs. 7a to 7d. A plurality of waffle assemblies 3 that are to be loaded with the device 10 are derived from the waffle assembly carrier 450. As shown in Fig. 6a, the first wolf shifting tool 470 is transferred from the above-mentioned waffle assembly m, qn, , + in the first direction LP1. p 450 is derived from the wolf, and the piece is 3G. At this time, the second nest is called, and the part transporting tool 4 8 η is a part of the to-be-guided portion, which is used for guiding the transfer of the unit by the tool 470, and the component is transferred as shown in FIG. 6b. After the transfer of the waffle assembly 30 by the above-mentioned 1st Volt component transfer (4) is completed, the first Le-wolf Volt component JIANG 480 'transfers the wolf along the second direction Lp2'弁笤 筮 、 、 、 、 、 、 、 、 、 、 、 件 件 件 件 件 件 件 件 件 件 件 件 件 件 。 。 。 。 。 。 。 。 。 α α α α At this time, the first-Wavre grade is moved to a part of the second guide, which is used to guide the passage of ^ a high volt and a weak _ inferiority; the tool 480 is transferred to the waffle assembly 3 〇. , as shown in Figure 6c, if the above-mentioned sockets, and 仵3 0 is transmitted to the first
1S 201133688 窩伏爾組件移送部501或第二窩 笛一奋处呵！件移达部502 ,則 第一窩伏爾組件移送部5〇1或第二 欲、ή &瓜 咼伏爾組件移送部502 移达窩伙爾組件30，並且移送至盘 qn , , z、先前被移送的窩伏爾組 件30相鄰的位置後，與先行的 M ^ ^ _，、且件30的移動進行 聯動，從而實現移送。 一方面’先行的窩伏爾組件3〇 ’ #.., εΛ1 逋過第一窩伏爾組件 移达4 501或第二窩伏爾組件移送 心1 M3，經過與撿起工 具300的移送方向LL (又軸）相互 、 人人的裝載地點時，被 填滿器件10，然後向窩伏爾組件卸载部46〇移送。 並且’移送先行的窩伏爾組件3Q的同時，通過另外的 寓伏爾組件移送部’即第二窩伏爾組件移送部5〇2或者第 一寫伏爾組件移送部501 ’緊隨其後的离伏爾組件3。經過 裝載地點。 如上所述，向與撿起工具300的移送方向ll(x抽） 相互交叉的裝載地點，不斷地移送用於裝載器件1〇的窩伏 爾組件30 ’因此器件卸載部4〇〇可以更迅诘 又处逑地執行器件1 〇 的告卩載過程。 -方面，填滿器件10的寓伏爾組件3〇,通過窩伏爾 組件移送部500，移送至窩伏爾組件卸載部46〇之後通 過與如圖7a至圖7d所示的過程相反的過程，層疊於寫伏 爾組件卸載部4 6 0，從而實現裝載。 以上為能夠實現本發明的較佳實施例’因此本發明並 不限於上述的實施例用了在上述實施例中說明的技術 思想的任何改變應均落入本發明的保護範圍之内。 19 201133688 【圖式簡單說明】 圖1為本發明器件處理器的結構米意圖； 圖2a及圖2b為圖示各個晶圓的結構的立體圖和剖面 圖 部至器件卸載部的器 圖4為圖示 在圖1中從晶圓載入 件的移動過程的概念圖； 圖5a至圖A曰t?與 圖6a至圖6d為二:部的工作過程平面示意圖； 圖〜至目7d Μ .部的工作過程的平面示意圖； 部的工作過程示意圖；。伙爾組件載人部和窩伏爾組件卸载 圖8為寫伏爾組件移 …圖…卸戴部:。圖；以及 作過輊側面示意圖。 窩伏爾組件移送部的工 【主要元件符號說明】 10〜器件； 籲 20〜晶圓，· 3 〇〜窩伏爾組件； 31〜安放槽； 1 〇 〇〜晶圓载入部； 2 0 0〜晶圓移動台； 300〜撿起工具； 20 201133688 400〜器件卸載部1S 201133688 The Volvo component transfer unit 501 or the second nest flute! The piece shifting portion 502, the first wavler component transfer portion 5〇1 or the second, ή & 咼 咼 volt component transfer portion 502 is transferred to the Wool assembly 30, and transferred to the disc qn, z After the position of the wrap-around component 30 that was previously transferred is adjacent to the position of the preceding M ^ ^ _, and the movement of the member 30, the transfer is realized. On the one hand, the 'advanced worval component 3〇' #.., εΛ1 passes through the first whelf component and moves to the 4 501 or the second whelf component to transfer the heart 1 M3, through the transfer direction of the pick-up tool 300 When the LL (and the shaft) are at the loading point of each other, the device 10 is filled and then transferred to the waffle assembly unloading portion 46. And 'while transferring the preceding waffle pack 3Q, the second wavre component transfer portion 5〇2 or the first waffle assembly transfer portion 501' is followed by the other dwell device transfer portion Off Volt component 3. After loading location. As described above, the wrap-around assembly 30' for loading the device 1' is continuously transferred to the loading point where the transfer direction ll (x-pull) of the pick-up tool 300 crosses, so that the device unloading portion 4 can be faster.诘 The execution of the device 1 诘 is performed again and again. On the other hand, the accommodation device 10 of the device 10 is filled, passed through the waffle assembly transfer portion 500, and transferred to the waffle assembly unloading portion 46, after passing through a process reverse to that shown in Figs. 7a to 7d. , is stacked on the write volt component unloading unit 460 to achieve loading. The above is a preferred embodiment in which the present invention can be implemented. Therefore, the present invention is not limited to the above-described embodiments, and any changes in the technical idea described in the above embodiments are intended to fall within the scope of the present invention. 19 201133688 [Simplified description of the drawings] Fig. 1 is a schematic view of the structure of the device processor of the present invention; Figs. 2a and 2b are a perspective view showing the structure of each wafer and a cross-sectional view to the device unloading portion. Fig. 1 is a conceptual diagram showing the movement process from the wafer loading member in Fig. 1; Fig. 5a to Fig. A曰t? and Fig. 6a to Fig. 6d are two schematic diagrams of the working process of the portion; Fig. 〜7目 Μ. A schematic diagram of the working process; a schematic diagram of the working process of the department; The gang component and the worf component are unloaded. Figure 8 shows the write volt component shift... Fig.... Unloading:. Figure; and a schematic view of the side. The installation of the Volvo component transfer unit [main component symbol description] 10 ~ device; call 20 ~ wafer, · 3 〇 ~ nest Volt component; 31 ~ placement slot; 1 〇〇 ~ wafer loading section; 2 0 0~ wafer mobile station; 300~ pick up tool; 20 201133688 400~ device unloading department