KR20180083557A - Device handler - Google Patents

Abstract

The present invention relates to a device handler and, more specifically, to a device handler to load a good device among devices of a wafer state on a waffle pack in accordance with an inspection result. According to the present invention, the device handler comprises: a wafer loading unit (100) having a wafer ring (20), on which devices (10) with a length relatively longer than a width are loaded, loaded thereon; a wafer ring moving table (200) receiving the wafer ring (20) from the wafer ring loading unit (100) to move the wafer ring (20) having each device (10) loaded thereon to a device pickup position (P0); a pickup tool (500) to pick up the device (10) from the wafer ring (20) of the wafer ring moving table (200); and a device unloading unit (400) mounting the device (10) transferred by the pickup tool (500) on a waffle pack (30), which includes a plurality of mounting grooves (31) to mount each device (10) thereon, to unload the device (10).

Description

Device handler

The present invention relates to a device handler, and more particularly, to a device handler that loads devices of good ones among devices in a wafer state onto a waffle pack according to a result of an inspection.

An element (semiconductor chip) is an integrated circuit composed of semiconductors whose electrical conductivity is higher than that of an insulator and lower than a conductor such as a metal. The original chip is used as a thin plate piece or as a semiconductor circuit.

The device is made by integrating various elements such as a transistor resistance capacitor on a thin silicon wafer of about 1cm in length and about 1cm in width.

The device is the basic part of modern computer making and it is the key to perform arithmetic operations, information storage, control of other chips and supports the electronics industry.

Such devices include a CPU, an SDRAM (memory semiconductor), and a flash RAM. In recent years, there have been various kinds of display driver ICs such as COD (Chip On Glass) and COF It is becoming diverse.

In order to improve reliability before shipment, the above-described devices are inspected for appearance and the like, and only defective devices are shipped after defective devices are sorted.

In particular, the inspection process for a device can be performed several times during the manufacturing process of the device, and can be performed after cutting into each device in the wafer state, and can be displayed on the device according to each inspection result.

After completion of the inspection process, only the elements of good products are loaded by a sorting device such as a waffle pack for shipment or post-processing.

As the inspection process and the classification process are added in the device manufacturing process as described above, the production speed of the device depends on the processing speed of the inspection device or the sorting device.

An object of the present invention is to improve the processing speed of an apparatus for picking up an element from a loading member such as a wafer or the like loaded with a plurality of elements and loading the same on an unloading member such as a waffle pack, And to provide a device handler capable of eliminating defects that may occur in the device loading process by passing an inspection process relating to the stacking state after the device is loaded on the unloading member.

The present invention has been made in order to achieve the above-mentioned object of the present invention . The present invention provides a wafer ring loading unit (100) in which a wafer ring (20) loaded with elements having a relatively long length is loaded, ; A wafer ring moving table 200 which receives the wafer ring 20 from the wafer ring loading part 100 and moves the wafer ring 20 loaded with each element to the element withdrawing position P0; A pick-up tool 500 for picking up an element from the wafer ring 20 on the wafer ring moving table 200; And an element unloading unit 400 for placing the element transferred by the pick-up tool 500 on the waffle pack 30 formed with the plurality of mounting grooves 31 on which the elements are mounted to unload the element.

Wherein the device handler is configured to obtain an image of the state of one or more elements loaded on the wafer ring so as to be capable of performing at least one of a seating state of the element and a vision check on the upper surface above the element withdrawal position And a first upper image obtaining unit 330.

At this time, the device handler moves the first upper image acquiring unit 330 to an area other than the upper part of the device drawing-out position P0 while picking up the device at the picker pick-up position P0 of the pickup tool 500 And the first upper image acquiring unit 330 moves the first upper image acquiring unit 330 to the element retrieving position P0 when the pick-up tool 500 is moved to the element stacking position of the element unloading unit 400 And a secondary transfer unit.

The pick-up tool 500 includes a rotation driving unit 510 having a horizontal rotation axis; And a plurality of pickers 530 coupled to the rotating shaft and disposed in a circumferential direction of the rotating shaft and rotated around the rotating shaft to pull out the devices at the device drawing-out position P0.

The device handler further includes a first lower image acquiring unit 320 installed in a transfer path of the device by the pick-up tool 500 and acquiring an image of a bottom surface of the device picked up at the device fetch position P0 .

The pick-up tool 500 may be configured such that a device is mounted on the device unloading unit 400 on the basis of an image obtained by one of the first upper image obtaining unit 330 and the first lower image obtaining unit 320. [ The X-axis direction movement, the Z-axis direction movement, and the Z-axis rotation movement so as to be located at the element mounting position.

At this time, in the process of acquiring the image of the bottom surface of the picked-up element, the device handler moves the first lower image obtaining unit 320 moving the first lower image obtaining unit 320 in the longitudinal direction of the picked- And the like.

The device unloading unit 400 includes a plurality of seating units 410 on which waffle packs 30 on which devices picked up by the pick-up tool 500 are classified and seated, A second upper image acquiring unit 340 for acquiring an image of the state of the device mounted on the waffle pack 30 so as to perform at least one of the seating state of the device and the vision inspection of the upper surface .

At this time, the device handler may be configured such that the device picked up by the pick-up tool 500 from the wafer ring 20 is placed on the device mounting position of the mounting part 410, When the pick-up tool 500 is moved to the element drawing-out position P0, the second upper image obtaining part 340 is moved to an area other than the upper part, And a second upper image acquiring unit moving unit for moving the upper image acquiring unit 340.

The device handler may further include a cleaning unit 310 installed on a transfer path of the waffle pack 30 to remove foreign substances from the empty waffle pack 30 to be transferred to the seating unit 410 .

The device unloading unit 400 includes a loading cassette 450 in which empty waffle packs 30 are stacked and stored; A plurality of seating portions 410 on which the elements picked up by the pick-up tool 500 are sorted and loaded; An unloading stacker 460 in which the wafel packs 30 having been loaded with elements are stacked and stored in an upward direction from the bottom; The empty waffle pack 30 loaded from the loading cassette 450 is transferred to the loading unit 410 and the waffle pack 30 having been loaded from the loading unit 410 is received from the loading unit 410, 460. The buffer unit 420 may include a buffer unit 420 for storing the buffer unit 420 and the buffer unit 420. [

The device handler according to the present invention significantly improves the processing speed of an apparatus for picking up an element from a loading member such as a wafer on which a plurality of elements are loaded and loading it on an unloading member such as a waffle pack, There is an advantage in that defects that may occur in the device loading process can be eliminated by passing through the inspection process regarding the post-load condition.

1 is a plan view showing a device handler according to an embodiment of the present invention.
Figure 2 is a perspective view showing the waffle pack of Figure 1;
FIG. 3 is a plan view showing a part of the structure of the element handler of FIG. 1 and showing the movement paths of the pick-up tool, the first upper image acquiring unit, and the second upper image acquiring unit.
FIGS. 4A and 4B are enlarged cross-sectional views of a device handler of FIG. 1, showing an enlarged cross-sectional view of a movement path of a pick-up tool, a first upper image acquiring unit, and a second upper image acquiring unit.
Fig. 5 is an enlarged view showing the movement path of one configuration of the element handler of Fig. 1;
Fig. 6 is an enlarged view showing a movement path of another constitution of the element handler of Fig. 1; Fig.
FIG. 7A is a plan view showing the unloading stacker of the device handler of FIG. 1, and FIG. 7B is a sectional view of the unloading stacker of FIG. 7A.

Hereinafter, a device handler according to the present invention will be described with reference to the accompanying drawings.

1 to 6, a device handler according to the present invention includes a wafer ring loading unit 100 in which a wafer ring 20 loaded with devices 10 having relatively long lengths is loaded, Wow; A wafer ring moving table 200 which receives the wafer ring 20 from the wafer ring loading part 100 and moves the wafer ring 20 loaded with the respective elements 10 to the element withdrawing position P0; A pick-up tool 500 for picking up the element 10 from the wafer ring 20 on the wafer ring moving table 200; The device 10 unloading the device 10 by placing the device 10 transferred by the pick-up tool 500 on the waffle pack 30 formed with the plurality of mounting grooves 31 on which the devices 10 are mounted, (400).

The wafer loading unit 100 may have a variety of configurations including a plurality of wafers 20 to which a plurality of devices 10 are attached.

The device 10 may correspond to the device 10 having a relatively long length compared to the width of the device 10 after the semiconductor process and the sowing process have been completed.

Particularly, the device 10 may be a wafer-level device that has completed a semiconductor process and a packaging process, as well as a semiconductor process and a sowing process.

For example, the device 10 may be an IC chip such as a DDI (Display Display Driver IC) which is a display driving chip such as COG (Chip On Glass) or COF (Chip On Film), an LED device 10, The wafer 10 may correspond to the element 10 after completion of a so-called semiconductor process and a cutting process (also a test process and a classification process).

And the device 10 can be transferred to the wafer ring 20 after being cut.

On the other hand, the wafer ring 20 can have various configurations in which the devices 10 having a relatively long length are loaded.

As one example, the wafer ring 20 may be configured in various ways as a structure for attaching and transferring the elements 10, and an adhesive tape having adhesiveness to the surface so that each element 10 is attached to the upper surface A first coupling ring to which the adhesive tape is coupled, and a second coupling ring for finely separating the elements 10 by deforming the adhesive tape in the outer diameter direction by applying a tensile force in the outer diameter direction to the adhesive tape bonded to the first coupling ring And the like.

It should be noted that the wafer ring 20 may be constituted by one coupling ring to which an adhesive tape and an adhesive tape having adhesive properties are combined so that each element 10 is adhered to the upper surface.

As shown in FIG. 2, the waffle pack 30 has a plurality of seating grooves 31 for receiving the elements 10, and may have various shapes such as a rectangular shape.

It is preferable that the seating groove 31 is formed to be deeper than the height of the element 10 so as not to be damaged when the waffle pack 30 is stacked up and down.

The wafer ring loading part 100 includes a cassette loading part and a wafer ring cassette and a wafer ring moving table 200 on which the wafer ring cassettes loaded with the plurality of wafer rings 20 loaded with the devices 10 to be drawn are loaded, A wafer moving tool for moving the wafer ring 20 to exchange the first wafer ring 20 from which the element 10 is drawn out and the second wafer ring 20 from which the element 10 has been drawn out And the like.

For example, the wafer moving tool may be constituted by a clamping device and a linear driving device, or may be constituted by a linear driving device for linearly moving the pusher and the pusher.

The wafer ring cassette may be configured such that the wafer rings 20 are stacked and loaded in a configuration in which a plurality of wafer rings 20 with attached devices 10 to be loaded are stacked and the stacked wafer rings 20 are sequentially So that it can be moved up and down.

The wafer ring loading section 100 is configured such that the first wafer ring 20 to be drawn out of the element 10 is transferred from the wafer ring moving table 200 to the wafer ring moving table 200 After the second wafer ring 20 is received and the first wafer ring 20 is transferred to the wafer ring moving table 200, the second wafer ring 20 is transferred to the empty space of the wafer ring cassette (Not shown) for temporarily retaining the wafer ring 20 of the wafer ring 2 in the wafer holder.

The wafer buffer unit (not shown) may have any configuration as long as it can support the wafer ring 20 as a configuration for temporarily holding the wafer ring 20. [

The wafer ring moving table 200 has a structure for moving the wafer ring 20 pulled out from the wafer ring cassette 111 to the element withdrawing position P0 at which the pickup tool 500 can pull out the element 10 And can be configured to be capable of XY movement or XY-? Movement, as shown in FIG. Where X-Y denotes an orthogonal coordinate axis with respect to the horizontal plane of the wafer ring 20, and? Denotes rotation around the Z-axis.

The wafer ring moving table 200 may also be moved in the vertical direction, i.e., the Z axis direction.

When the wafer ring moving table 200 moves the wafer ring 20 to the element lead-out position P0, the element 10 is easily picked up below the element lead-out position P0 as shown in Fig. One or more needle pins 210 may be additionally provided to move upward to press the adhesive tape of the wafer ring 20.

Here, the number of the needle pins 210 may vary depending on the size of the element 10.

At this time, when the needle pin 210 is configured to move along the device withdrawing position Po, it is preferable that the apparatus is fixed because an apparatus for movement is added to increase the manufacturing cost of the apparatus, .

The pick-up tool 500 can be variously configured to pick up the element 10 from the wafer ring 20 on the wafer ring moving table 200.

Meanwhile, the pick-up tool 500 may include an adsorption head (not shown) for picking up the element 10 by picking up the element 10 by generating vacuum pressure together with up-and-down movement (movement in the Z direction).

At this time, the pick-up tool 500 may have a variety of structures such as a variable length or a linear movement of the pickup tool 500 as a whole.

In one embodiment, the pick-up tool 500 includes a rotation driving unit 510 having a horizontal rotation axis, as shown in FIGS. 1 to 5; A plurality of rotary arms 520 coupled to the rotary shaft and disposed along the rotational direction of the rotary shaft; And a picker 530 coupled to each of the plurality of rotary arms 520 and picking up the element 10.

The rotation driving unit 510 includes a horizontal rotation axis and rotatably drives the rotary arm 520 coupled to the rotation axis.

For example, the rotation driving unit 510 may be configured as a rotary motor having a horizontal rotation axis to which a plurality of pickers 530 are coupled.

Meanwhile, the rotary drive unit 510 can rotate the picker 530 coupled to the rotary arm 520 with a rotary shaft capable of transmitting vacuum pressure to the bar picker 530 picking up the element 10 by the vacuum pressure, And a pneumatic rotary joint for transmitting the rotary motion.

Here, the rotation axis is preferably arranged so as to be parallel to the upper surface of the wafer ring 20 or the upper surface of the waffle pack 30, that is, perpendicular to the Z axis, by rotating the plurality of pickers 530 by rotation.

Particularly, it is more preferable that the rotation axis is arranged parallel to the X axis or the Y axis and parallel to the X axis.

The rotation axis can be variously rotated according to the control of the rotation direction of the picker 530 such as one direction or both directions.

The rotary arm 520 may have any structure as long as it can support the picker 530 by supporting the picker 530 in combination with rotation of the rotary shaft.

Here, the rotary arm 520 can be selectively adopted, and is not essential.

The picker 530 may have any structure as long as it is coupled with the rotary shaft and is disposed in the circumferential direction of the rotary shaft so as to rotate about the rotary shaft and can pull the element 10 out of the element drawing-out position P0.

For example, the picker 530 may be variously configured as a structure that is coupled with the rotation axis in the radial direction and is disposed in the circumferential direction of the rotation axis and is rotated around the rotation axis.

As another example, the picker 530 may be variously configured as a structure that is coupled in a direction parallel to the rotation axis and is disposed in the circumferential direction of the rotation axis and rotated about the rotation axis.

The picker 530 may be configured to pick up the element 10 from the wafer ring 20 by vacuum pressure.

As an example, the picker 530 includes a pneumatic connection unit that receives air pressure from the outside, and a pick-up head that is installed at an end and picks up the element 10 by a pneumatic pressure transmitted by the pneumatic connection unit .

The plurality of pickers 530 may include a rotation support member (not shown) in connection with the rotation shaft.

The rotation support member (not shown) may have a variety of configurations in which a plurality of pickers 530 are coupled to support a plurality of pickers 530.

The picker 530 may be moved up and down by a vertical drive device provided on the rotary arm 520. [

Further, the picker 530 may be provided in n number, preferably 2n (n is a natural number of 1 or more), so as to have an equilateral angle around the rotation axis in order to carry out element pickup and placement regularly.

The plurality of pickers 530 need to be installed so as to be linearly movable toward the upper surface of the wafer ring 20 or the upper surface of the waffle pack 30 to facilitate the picking up and loading of the elements 10 have.

Accordingly, the plurality of pickers 530 may be linearly movable in the radial direction with respect to the rotation axis, and linearly movable in the radial direction by a radial direction (not shown).

The pick-up tool 500 has a second rotation axis that is perpendicular to the first rotation axis and rotates the rotation driving unit 510 about the second rotation axis when the rotation axis of the picker 530 is a first rotation axis And a second rotation drive unit.

The second rotation drive unit may be configured as a rotation motor having a second rotation axis and rotating the second rotation axis.

The second rotation driving unit may be installed to move at least one of X-axis movement and Y-axis movement by a linear movement unit.

On the other hand, the second rotary shaft is rotated by the rotation of the plurality of pickers 530 so as to smoothly correct an error in the Θ direction of the element 10 picked up by the picker 530, that is, It is preferable to go through the center.

1, the pick-up tool 500 according to the first embodiment having the above-described structure picks up the element 10 at the element drawing-out position P0 on the wafer ring 20, To the waffle pack (30) spaced from the waffle pack (20) to load the element (10) at the loading position.

At this time, on the upper portion of the device drawing-out position P0, as shown in FIGS. 3A to 3, the wafer 10 is placed on the wafer ring 20 so as to perform at least one of the seating state and the vision inspection for the upper surface A first upper image acquiring unit 330 may be installed to acquire an image of the state of the loaded one or more elements 10. [

The first upper image obtaining unit 330 obtains an image of the state of the loaded element 10 of the wafer ring 20 so that at least one of the seating state of the element 10 and the vision inspection of the upper surface can be performed. Various configurations are possible.

The first upper image obtaining unit 330 may be configured to obtain images of the elements 10 loaded on the wafer ring 20, such as a scanner and a camera.

The first upper image obtaining unit 330 may be utilized to locate the element 10 to be picked up by the picker 530 and inspect the upper surface of the element 10.

At this time, the first upper image acquiring unit 330 acquires the element extraction position P0 while the pickup tool 500 picks up the element 10 at the element extraction position P0 by the first upper image acquisition unit. And moved to the element withdrawing position P0 when the pickup tool 500 is moved to the element stacking position of the element unloading portion 400. [

The first upper image obtaining unit moving unit moves the image of the upper surface of the element 10 to be picked up above the element drawing-out position P0 without being disturbed by the pick-up tool 500 The first upper image obtaining unit 330 is moved from the upper portion of the device fetch position P0 to the other region or from the region other than the upper portion of the fetch position P0 to the upper portion of the device fetch position P0 Various configurations are possible.

The first upper image obtaining unit 330 may obtain the upper image of the wafer 10 while the pick-up tool 500 fetches the element 10 from the element fetch position P0 of the wafer ring table 200 The wafer ring 20 is moved to the seating part 410 in order to load the element 10 picked up by the pick-up tool 500 on the waffle pack 30 at one side of the area other than the element withdrawing position P0. The first upper image obtaining unit 330 can be disposed at a position closer to the wafer ring table 200 than the conventional one by moving the wafer W to an upper portion of the wafer withdrawing position P0 of the wafer ring 20, There is an advantage that a higher resolution image can be obtained with respect to the seating state and the upper surface of the mounted device 10.

The first upper image obtaining unit 330 is configured to obtain an image of the upper surface of the element 10 at a position close to the upper portion of the wafer ring table 200. The first upper image obtaining unit 330 further includes a sub- .

The first lower image acquiring unit 320 acquires an image of the bottom surface of the element 10 picked up at the element drawing-out position P0 in the transfer path of the element 10 by the pick-up tool 500 Can be installed.

The first lower image obtaining unit 320 obtains an image of the bottom surface of the element 10 picked up at the element drawing-out position P0 provided in the feeding path of the element 10 by the pickup tool 500 Various configurations are possible.

The first lower image obtaining unit 320 may be configured to acquire an image of the bottom surface of the element 10 picked up at the element drawing-out position P0 by the picker 530, .

The first lower image acquiring unit 320 may be configured to acquire the image of the bottom surface of the picked-up element 10 so that the first lower image acquiring unit 320 is moved in the longitudinal direction of the element 10 picked up by the first picking- Can be installed.

The first lower image acquiring unit moving unit may be configured to move the first lower image acquiring unit 320 in the longitudinal direction of the element 10 to be subjected to bottom image acquisition.

More specifically, the first lower image obtaining unit moving unit moves the first lower image obtaining unit 320 in the longitudinal direction (arrow direction) of the element 10, as shown in FIG. 5, The acquisition unit 320 can sequentially acquire images in the longitudinal direction with respect to the bottom surface of one element 10. [

Since the picked-up element 10 has a relatively long length as compared with the width, the first lower image obtaining unit 320 is moved in the longitudinal direction of the picked-up element 10 to obtain an image, There is an advantage in that a high-resolution image can be obtained with respect to the bottom surface of the element 10 at a distance.

The pick-up tool 500 may be configured such that the element 10 is connected to the element unloading unit 400 (not shown) based on the image obtained by one of the first upper image obtaining unit 330 and the first lower image obtaining unit 320 Axis direction, the Y-axis direction, and the Z-axis direction with reference to the arrangement direction of the device drawing-out position P0 and the loading position so that the device-loading position P0 and the loading position are positioned.

In addition, the pick-up tool 500 may be provided so as to rotate with the second pick-up position P0 and the placement direction of the pick-up position as reference, for example, the Z-axis direction as the second rotation axis.

That is, according to the present invention, the image obtained by the first upper image obtaining unit 330 or the second lower image obtaining unit 320 is analyzed to determine whether the device 10 is mounted on the waffle pack 30 The picked-up element 10 is moved to the seating portion 410 by moving the pick-up tool 500 by moving at least one of the XYZ movement and the horizontal rotation movement so as to be positioned at a predetermined loading position in the waffle pack 30 It can be loaded at the loading position.

1 to 5, the device unloading unit 400 includes a wiping pack 30 having a plurality of seating grooves 31 on which the respective elements 10 are mounted, The device 10 can be unloaded by placing the device 10 to be transferred.

For example, the device unloading portion 400 includes a waffle pack loading portion for loading the empty waffle pack 30 into the plurality of seating portions 410; A plurality of seating portions 410 on which the wafers pack 30, on which the elements 10 picked up by the pick-up tool 500 are sorted and loaded, is seated; A waffle packer loading unit for taking out and unloading the waffle pack 30 having completed the device loading; The waffle pack loading unit transfers the empty waffle pack 30 loaded from the waffle pack loading unit to the seating unit 410 and the waffle pack 30 that has been loaded from the seating unit 410 is transferred to the waffle pack loading unit. (420).

The device unloading unit 400 is provided with a pair of cassettes for loading a waffle pack into a waffle pack loading unit and a waffle pack loading unit, and can supply an empty waffle pack and load a filled waffle pack have.

The waffle pack loading unit may include a loading cassette 450 in which empty waffle packs 30 are stacked and stored.

The waffle pack loading unit is configured to take out the empty waffle pack 30 from the loading cassette 450 and to transfer the empty waffle pack 30 to the plurality of seating units 410, and various configurations are possible.

For example, the waffle pack loading unit may be installed such that the empty tray 30 is conveyed to the plurality of seating units 410 in a rail manner.

The plurality of seating portions 410 may include a first upper image obtaining unit 330 or a first lower image obtaining unit 320. The first and second lower image obtaining units 320 and 320 may include a plurality of mounting portions 410, And a third seating part 410c on which the seating part 410a, the second seating part 410b and the element 10 not classified as good are seated.

The first seating part 410a and the second seating part 410b may be waffle packs 30a and 30b which are stacked when the device 10 which has been drawn out from the pick-up tool 500 and has undergone the inspection process is determined to be good It may correspond to a seated configuration.

The present invention is characterized in that a plurality of first and second seating portions 410a and 410b on which the devices 10 classified as good are mounted are used to form a plurality of welt packs 410a and 410b of the first seating portion 410a, The device mounting process can be performed on the second seating portion 410b while the empty waffle pack 30 is loaded from the waffle pack loading unit after the device loading is completed in the waffle pack loading unit or the waffle pack loading unit. There is an advantage that the process delay due to the exchange of the waffle pack 30 can be prevented.

The upper part of the first seating part 410a and the second seating part 410b are provided on the upper part of the seating part 410 so that at least one of the seating state of the element 10 and the vision inspection of the upper surface can be performed. A second upper image acquiring unit 340 for acquiring an image of the state of the element 10 which is seated on the first upper image acquiring unit 30 may be additionally provided.

The second upper image acquiring unit 340 may include an element mounted on the waffle pack 30 so as to perform at least one of a seating state of the element 10 and a vision inspection of the upper surface of the element 10, 10), and various configurations are possible.

The second upper image obtaining unit 340 may be configured to acquire an image of the state of the device 10 that is seated on the waffle pack 30 at the upper part of the seating unit 410 and corresponds to various configurations such as a scanner and a camera .

The second upper image obtaining unit 340 may detect that the element 10 classified as a good element 10 in the vision inspection through the first upper image obtaining unit 330 and the first lower image obtaining unit 320 It is preferable that the waffle packs 30a and 30b are installed on the seating portions 410a and 410b on which the waffle packs 30a and 30b are seated.

Here, the second upper image obtaining unit 340 may perform at least one of a seating state of the element 10 loaded at the loading position and a vision inspection of the upper surface.

At this time, the second upper image obtaining unit 340 obtains the element 10 picked up by the pick-up tool 500 from the wafer ring 20 by the second upper image obtaining unit, Is moved to an area other than the upper part of the element mounting position of the mounting part 410 and is moved to the element mounting position of the mounting part 410 when the pickup tool 500 is moved to the element drawing out position P0 Can be installed.

The second upper image acquiring unit moving unit may be configured to move the second upper image acquiring unit 340 to acquire an image of the upper surface of the element 10 loaded above the element mounting position without being disturbed by the pick- Various configurations are possible in which the second upper image acquiring unit 340 can be moved from the upper portion of the element mounting position to other regions or from the region other than the upper portion of the element mounting position to the upper portion of the element mounting position.

6, the second upper image acquiring unit moving unit may move the second upper image acquiring unit 340 horizontally from the upper portion of the tray 30 seated on the seating unit 410 And the second upper image obtaining unit 340 sequentially obtains the upper surface image of the plurality of elements 10 loaded on the tray 30. In this case,

The second upper image obtaining unit 340 may obtain the second upper image obtaining unit 340 while the pick-up tool 500 loads the element 10 at the element mounting position of the wafer ring table 200, The pick-up tool 500 is moved to the device pull-out position P0 in order to pull the device 10 out of the wafer ring 20 and then moved to the upper portion of the seating portion 410, The upper image acquiring unit 340 can be disposed at a position closer to the seating unit 410 than in the prior art so that the seating state of the element 10 loaded on the waffle pack 30 of the seating unit 410, Resolution images can be obtained.

The waffle packs 30a and 30b of the seating parts 410a and 410b on which the devices 10 classified as good are loaded can be taken out and stored in the waffle packer loading part when the device loading is completed.

The waffle pack loading unit may be configured to unload the waffle pack 30, which has been loaded with the devices, from the plurality of seating units 410, and various configurations are possible.

For example, the waffle packer loading unit may include an unloading stacker 460 in which the waffle packs 30, which have been loaded with elements, are stacked and stored from the lower side to the upper side.

The unloading stacker 460 may have various constructions in which the waffle packs 30, which have been loaded with elements, are stacked and stored in the upper direction from the lower side.

5A and 5B, the unloading stacker 460 may be configured such that the waffle pack 30 drawn out from the plurality of seating portions 410 is stacked in the upward direction (Z direction) from the bottom A frame 462 with an open bottom for allowing the user to see the image; And a cover portion 464 covering the upper surface of the uppermost waffle pack 30 so as not to be exposed to the outside.

The present invention is characterized in that the waffle pack 30 is stacked in the lower direction to the upper direction and the cover part 464 is provided at the uppermost part to prevent the waffle pack 30 It is possible to prevent contamination of the upper surface.

A buffer unit 420 may be additionally provided to receive the waffle pack 30 from which the devices have been loaded from the seating unit 410 and to transfer the waffle pack 30 to the unloading stacker 460.

The buffer unit 420 receives the empty waffle pack 30 from the loading cassette 450 and exchanges the waffle pack 30 with the plurality of seating units 410. The plurality of seating units 410 The unloading stacker 460 transfers the waffle pack 30, which has been loaded from the unloading stacker 460, to the unloading stacker 460.

At this time, the buffer unit 420 may be installed to be movable up and down for exchanging the waffle pack 30 with the plurality of seating units 410.

The waffle pack 30 is installed on the transfer path of the waffle pack 30 and is disposed between the buffer unit 420 and the plurality of seating units 410. The foreign waffle pack 30, A cleaning unit 310 for removing the cleaning unit 310 may be provided.

The cleaning unit 310 is installed on the conveyance path of the empty waffle pack 30 to be conveyed to the plurality of seating portions 410 and removes foreign matter from the empty waffle pack 30 loaded in the waffle pack loading unit Various configurations are possible.

The cleaning unit 310 is installed on the conveyance path of the empty waffle pack 30 to be conveyed to the first and second seating portions 410a and 410b on which the elements classified as good are seated. desirable.

For example, the cleaning unit 310 may include an air flow path connected to the air supply device so as to spray air to the empty waffle pack 30 that is moved to the seating part 410 while being fixed to the cleaning position, One or more nozzles for receiving air from the flow path and spraying air onto the upper surface of the waffle pack 30 may be installed.

The cleaning unit 310 may include a main body for covering the upper surface of the waffle pack 30 and forming a cleaning space on the waffle pack 30.

The main body is formed so as to maintain a closed state of the cleaning space, and the main body can be connected to the discharge pipe so that the foreign matter together with the air injected through the nozzle is discharged to the outside from the cleaning space.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: Device 100: Wafer ring loading part
200: wafer ring table 400: element unloading portion
500: Pickup tool

Claims (12)

A wafer ring loading part (100) on which a wafer ring (20) loaded with devices (10) having a relatively long length relative to a width is loaded;
A wafer ring moving table 200 which receives the wafer ring 20 from the wafer ring loading part 100 and moves the wafer ring 20 loaded with the respective elements 10 to the element withdrawing position P0;
A pick-up tool (500) picking up the element (10) from the wafer ring (20) on the wafer ring moving table (200);
The element 10 transferred by the pick-up tool 500 is placed on the waffle pack 30 in which the plurality of mounting grooves 31 on which the elements 10 are mounted are loaded, And a loading unit (400). The method according to claim 1,
Obtaining an image of the state of the at least one element (10) loaded on the wafer ring so as to perform at least one of a seating state of the element (10) and a vision check on the upper surface at the element retrieval position (P0) And a first upper image acquiring unit (330) for acquiring the first upper image. The method of claim 2,
The first upper image obtaining unit 330 is moved to a region other than the upper portion of the element drawing-out position P0 while the element 10 is picked up at the picker pick-up position P0 of the pickup tool 500, The first upper image obtaining unit moving unit moving the first upper image obtaining unit 330 to the device fetch position P0 when the first image obtaining unit 500 is moved to the element stacking position of the device unloading unit 400 The device handler comprising: The method of claim 3,
The pick-up tool (500)
A rotation driving unit 510 having a horizontal rotation axis;
And a plurality of pickers (530) coupled to the rotating shaft and arranged in the circumferential direction of the rotating shaft to rotate about the rotating shaft and to pull out the device (10) at the device drawing-out position (P0) . The method of claim 4,
A first lower image acquiring unit 320 installed in a transfer path of the element 10 by the pick-up tool 500 and acquiring an image of the bottom surface of the element 10 picked up at the element drawing-out position P0; The device handler comprising: The method of claim 5,
The pick-up tool (500)
Based on the image obtained by one of the first upper image obtaining unit 330 and the first lower image obtaining unit 320, the device 10 is positioned at the device loading position of the device unloading unit 400 Is moved by at least any one of movement in the X-axis direction, movement in the Y-axis direction, movement in the Z-axis direction, and rotational movement with the Z-axis as the rotation axis. The method of claim 5,
The first lower image obtaining unit moving unit moving the first lower image obtaining unit 320 in the longitudinal direction of the picked up element 10 in the process of obtaining the image of the bottom surface of the picked up element 10 Further comprising: The method according to claim 1,
The device unloading unit (400)
And a plurality of seating portions (410) on which the wafers (30) to which the elements (10) picked up by the pick-up tool (500)
To acquire an image of the state of the element 10 seated in the waffle pack 30 so as to perform at least one of a seating state of the element 10 and a vision check on the upper surface of the seating part 410 And a second upper image obtaining unit (340). The method of claim 8,
While the pick-up tool 500 picks up the element 10 from the wafer ring 20 at the element mounting position of the mounting part 410, To the element stacking position of the seating part (410) when the pick-up tool (500) is moved to the element withdrawing position (P0) by moving the second upper image obtaining part (340) Further comprising: a second upper image acquiring unit moving unit for moving the second image acquiring unit (340). The method according to claim 1,
The device unloading unit (400)
Further comprising a cleaning unit (310) installed on a transfer path of the waffle pack (30) to remove foreign matter from the empty waffle pack (30) to be transferred to the mounting part (410). The method of claim 5,
The device unloading unit (400)
A loading cassette 450 in which empty waffle packs 30 are stacked and stored;
A plurality of seating portions 410 on which the elements 10 picked up by the pick-up tool 500 are sorted and loaded;
An unloading stacker 460 in which the wafel packs 30 having been loaded with elements are stacked and stored in an upward direction from the bottom;
The empty waffle pack 30 loaded from the loading cassette 450 is transferred to the loading unit 410 and the waffle pack 30 loaded with the devices is loaded from the loading unit 410 to the unloading stacker And a buffer unit (420) for transferring the data to the device handler (460). The method of claim 11,
The plurality of seating portions 410,
A first seat portion on which a device 10 determined as a good product based on the image obtained by at least one of the first upper image obtaining portion 330 and the first lower image obtaining portion 320 is loaded, And a seating portion (410a, 410b).

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