KR101291579B1 - Device Inspection Apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting an element and classifying elements in a wafer state according to the inspection result and placing the elements in a tray.
The present invention is a wafer ring loading unit is loaded with a wafer ring attached to the elements; An element inspection unit which receives a wafer ring from the wafer ring loading unit and performs surface inspection on elements attached to the wafer ring; A pick-up tool for picking up and transferring the element from the wafer ring after the surface inspection in the element inspection unit; An unloading unit in which elements inspected by the element inspecting unit among the elements transferred by the pick-up tool are seated on a tray; Disclosed is a device inspection apparatus comprising an empty tray portion in which elements inspected as defective by the device inspection portion are seated on a tray.

Description

Device Inspection Apparatus

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an element inspection apparatus, and more particularly, to an element inspection apparatus for inspecting an element and classifying elements in a wafer state according to the inspection result and placing the elements in a tray.

A device (semiconductor chip) is an integrated circuit composed of a semiconductor whose electrical conductivity is higher than that of a nonconductor and lower than a conductor such as a metal. Originally, a chip refers to a thin plate, but is now used to refer to a semiconductor circuit.

The device is the basic component of modern computers and is the core of arithmetic, information storage, and control of other chips, and supports the electronics industry.

Such devices include a CPU, an SDRAM (memory semiconductor), and a flash RAM. In recent years, such devices as a display drive IC (DDI), which is a display driving chip such as a chip on glass (COG) and a chip on film (COF), are used. It is becoming diverse.

Such devices are inspected for appearance before shipment to increase reliability, and only the good devices are shipped after the defective devices are sorted out.

In particular, the inspection process for the device may be performed several times during the manufacturing process of the device, and in particular, may be performed after cutting into each device in the wafer state and may be displayed on the device according to each inspection result.

On the other hand, the devices that have been inspected in the wafer state are loaded into a dedicated tray such as a waffle pack by a Pick & Place device for shipment or post-processing. The elements loaded on the trays are further loaded by the automatic inspection apparatus or by the naked eye on a subsequent inspection process on the surface thereof.

By the way, the inspection process, pick-and-place process and subsequent inspection process in the wafer state has a problem that must be supplemented again the problems that may occur in each device when performed by a separate device.

That is, the pick and place process is conventionally performed after the inspection process in the wafer state, but it is impossible to inspect the chip and cracks, scratches, and the like during the pick and place process.

As a supplement to this, a subsequent inspection process is performed in the state of being loaded into the tray after pick-and-place, where the vision inspection of the device loaded in the device receiving groove by the state of the tray and the state of the tray (deformation, manufacturing error, etc.) is performed. Inspection could not be performed smoothly).

The present invention is to provide a device inspection apparatus that can perform the inspection process, pick-and-place process and subsequent inspection process in the wafer state by a single device in order to solve the above problems.

The present invention has been made to achieve the object of the present invention as described above, the present invention is a wafer ring loading unit is loaded with a wafer ring attached elements; An element inspection unit which receives a wafer ring from the wafer ring loading unit and performs surface inspection on elements attached to the wafer ring; A pick-up tool for picking up and transferring the element from the wafer ring after the surface inspection in the element inspection unit; An unloading unit in which elements inspected by the element inspecting unit among the elements transferred by the pick-up tool are seated on a tray; Disclosed is a device inspection apparatus comprising an empty tray portion in which elements inspected as defective by the device inspection portion are seated on a tray.

The device inspection apparatus according to the present invention has an advantage of improving reliability of device inspection by inspecting the device in a wafer state, picking up the device, classifying and loading the device into a tray according to the inspection result, and then performing a subsequent inspection process immediately. have.

In particular, since the inspection process, pick-and-place process, and subsequent inspection process in the wafer state are performed by one apparatus, the reliability of the device inspection result can be improved without being affected by the pick-and-place process after the device inspection.

In addition, the device inspection apparatus according to the present invention may be damaged during the pickup and place process of the device, as the follow-up inspection process is performed immediately after the pickup and place of the device to confirm the damage of the device during the pickup and place process of the device There is an easy advantage.

In particular, by inspecting the bottom surface of the device in the state of picking up the device after the device inspection in the wafer state, the device inspection can be performed more efficiently.

In addition, after inspection of the device in the wafer state, the device is picked up, and an image of the bottom surface of the device is acquired and the image is analyzed to align the tray in which the device is seated, thereby preventing damage to the device that may occur during the device mounting process. You can prevent it.

1 is a conceptual diagram showing a device inspection apparatus according to the present invention.
2 is a side view schematically showing the device inspection apparatus of FIG.
3 is a conceptual diagram illustrating a process of loading a tray after device inspection in the device inspection apparatus of FIG. 1.
4A and 4B are cross-sectional views illustrating wafer rings used in the device inspection apparatus of FIG. 1.
5 is a perspective view illustrating a waffle pack used in the device inspection apparatus of FIG. 1.

Hereinafter, a device testing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

Device inspection apparatus according to the present invention, as shown in Figures 1 to 3, the wafer ring loading unit 100 is loaded with a wafer ring 20 to which the elements 10 are attached; An element inspection unit 200 receiving the wafer ring 20 from the wafer ring loading unit 100 and performing surface inspection on the elements 10 attached to the wafer ring 20; A pick-up tool 510 for picking up and transferring the device 10 from the wafer ring 20 whose surface inspection is completed by the device inspection unit 200; An unloading unit 300 in which elements 10 inspected as good by the element inspecting unit 200 of the elements 10 transferred by the pickup tool 510 are seated on the tray 30; The device 10 inspected as a defective product by the device inspection unit 200 includes a bin tray unit 400 seated on the tray 30.

The device 10 is an element forming an IC chip, an LED device, and the like, such as a display drive IC (DDI), which is a display driving chip such as a chip on glass (COG) and a chip on film (COF), and a wafer is a semiconductor process. And a device having completed a cutting process (also a test process and a classification process). 4A and 4B, the device 10 is transferred to the wafer ring 20 after the cutting process.

The wafer ring 20 is a component for loading and transporting the elements 10, and various configurations are possible. As shown in FIGS. 4A and 4B, each wafer 10 is adhered to a surface to be attached to an upper surface thereof. Adhesive tape 21 having sex; The adhesive tape 21 is deformed in the outer diameter direction by applying tension in the outer diameter direction of the first coupling ring 22 to which the adhesive tape 21 is coupled and the adhesive tape 21 bonded to the first coupling ring 22. It may be configured to include a second coupling ring 23 for finely spaced apart each element (10). Here, the wafer ring 20 may be composed of an adhesive tape having an adhesive on the surface and one bonding ring to which the adhesive tape is bonded so that each device is attached to the upper surface.

The wafer ring 20 may have various shapes such as a circle and a rectangle, and of course, the wafer ring 20 may be configured as a single coupling ring in addition to the double coupling ring.

As illustrated in FIG. 5, the tray 30 may have a plurality of mounting grooves 31 formed thereon so that each device 10 may be mounted thereon, and may have various shapes such as a rectangular shape. The seating groove 31 is preferably formed deeper than the height of the element 10 so as not to be damaged when the tray 30 is stacked up and down.

The wafer ring loading unit 100 is configured to load a plurality of wafer rings 20 loaded with the elements 10, and various configurations are possible according to the configuration and arrangement of the device.

As an example, a cassette loading unit in which a wafer ring cassette loaded with a plurality of wafer rings 20 is loaded; It may be configured to include a wafer moving tool for moving the wafer ring 20 for device inspection.

The wafer ring cassette may be configured such that the wafer rings 20 are stacked and stacked in a configuration in which the plurality of wafer rings 20 on which the elements 10 are loaded are stacked, and the stacked wafer rings 20 may be sequentially drawn out. It can be installed so as to be movable up and down.

In addition, the wafer ring loading unit 100 may be inspected and drawn out as shown in FIG. 1 so that the wafer ring having finished device inspection and device withdrawal may be loaded back into the wafer ring cassette according to its configuration. Before the first wafer ring 20 to be transferred to the device inspecting unit 200 is received, the second wafer ring 20 from which the device 10 is drawn out is received from the device inspecting unit 200 and receives the first wafer ring ( 20) after the transfer to the device inspection unit 200 further includes a wafer buffer portion for temporarily storing the second wafer ring 20 to deliver the second wafer ring 20 to the vacancy of the wafer ring cassette. Can be.

Any configuration may be used as long as the wafer buffer portion is configured to temporarily hold the wafer ring 20 and can support the wafer ring 20.

The wafer transfer tool may be configured to transfer the wafer ring 20 between the wafer ring cassette and the device inspection unit 200.

Meanwhile, the wafer loading unit 100 transfers the wafer ring 20 for device inspection and withdrawal to the device inspection unit 200, and has been described as a configuration in which the wafer ring 20 for receiving device inspection and withdrawal is received. Of course, the wafer ring 20 for inspection and withdrawal may be configured to perform only transfer to the device inspection unit 200.

In addition, the wafer loading unit 100 has been described as being configured separately from the device inspection unit 200, but the device inspection unit (such as installing a camera 610 for inspecting the surface of the device on the movement path of the wafer ring 20) ( 200).

The device inspection unit 200 is configured to perform surface inspection of the devices 10 attached to the wafer ring 20, and various configurations are possible.

That is, the device inspecting unit 200 may include a camera 610 installed on the wafer ring 20 to acquire an image of one or more devices 10.

The camera 610 is configured according to the characteristics of the device 10 to be inspected and the contents of the test, and the image obtained by the camera 610 is installed together with the camera 610 or separately or together with a control unit for controlling the device. The surface condition of the device 10 is determined by the inspection module configured and the analysis result is transmitted to the controller.

The control unit controls the pickup tool 510 to be transferred to the unloading unit 300 and the bin tray unit 400 according to the inspection result inspected by the device inspection unit 200.

On the other hand, the device inspection unit 200, the camera 610 and the wafer ring 20 need to move in a relatively horizontal direction for the camera 610 to perform the inspection of the elements 10 on the wafer ring 20, It may include a wafer ring table for moving the wafer ring 20 in the horizontal direction, such as XY direction, XY-θ direction.

The wafer ring table has a variety of configurations that allow replacement of the wafer ring 20 and horizontal movement in the X-Y direction, the X-Y-θ direction, and the like.

Here, the wafer ring table may be used as a configuration for moving the wafer ring 20 to pick up the device 10 by the pickup 510 after the device inspection.

On the other hand, the device inspection unit 200 is a configuration that the camera 610 and the wafer ring 20 can move in a relatively horizontal direction, of course, the camera 610 can be moved.

The surface inspection performed by the device inspection unit 200 may include inspections for bumps, patterns, chipping, cracks, scratches, foreign materials, and the like in the device 10.

The pick-up tool 510 picks up the elements 10 that have been inspected by the element inspector 200 at the element pickup position ① and transfers them to the unloading unit 300 and the bin tray unit 400 according to the inspection result. Various configurations are possible as a structure to make. The device inspection unit 200 may include a separate wafering table for picking up the devices 10 by the pickup tool 510.

The pick-up tool 510 may be composed of one picker or two or more pickers. Here, the picker may be configured to include a suction head (not shown) for picking up and picking up the device 10 by generating a vacuum pressure along with the shanghai (movement in the Z direction).

In addition, the pickup tool 510 may be configured in various ways according to the transfer method of the device, and may be configured to be movable in various forms such as X-Y direction movement, X direction movement, and pivot movement.

In particular, as shown in FIG. 1, the pickup tool 510 may be configured to allow X-direction movement when the X-direction movement is required when loading the tray 30.

The unloading unit 300 has a variety of configurations in which elements 10 inspected as good by the element inspecting unit 200 of the elements 10 transferred by the pickup tool 510 are seated on the tray 30. This is possible.

As an example of the unloading unit 300, and a tray loading portion in which a plurality of trays 30 are stacked; The tray 30 may be configured to include a tray moving unit for receiving the tray 30 from the tray loading unit and moving the tray 30 to the element transfer position ② receiving the elements 10 from the pickup tool 510.

The tray loading part is a configuration in which the tray 30 is stacked, and various configurations are possible.

The tray moving unit is configured to move the tray 30 to the element transfer position ② by drawing the tray 30 from the tray loading unit, and various configurations are possible.

The tray moving part may include a first moving path and a second moving path disposed in parallel with each other, and the first moving path includes a seating groove 31 of the tray 30 for mounting the device 10 at the device delivery position ②. The tray image acquisition unit 630 for inspecting the alignment state of the c) may be installed, and the vision inspection unit 640 may be installed in the second movement path to re-inspect the surfaces of the elements 10 mounted on the tray 30.

The tray image acquisition unit 630 includes a camera for acquiring an image of at least one seating groove 31 formed in the tray 30, and the camera is configured to transfer the acquired image to an inspection module for image analysis. do. The image analysis result is used to align the tray 30 by X-Y direction movement, X direction movement, pivot movement, etc. so that the device 10 can be accurately seated in each seating groove 31. In addition, the tray image acquisition unit 630 may be used to inspect the presence or absence of foreign matter in the mounting groove (31).

The vision inspection unit 640 includes a camera that acquires an image of at least one device 10, and the camera is configured to transfer the acquired image to an inspection module for image analysis. The image analysis result is used to check for damage (chipping, cracks, scratches, presence of foreign matters, etc.) that may occur during the pickup and place process by the pickup tool 510.

Meanwhile, the unloading unit 300 moves the tray 30 in the XY direction, the X direction movement, and pivots so that each device 10 can be accurately seated in the seating groove 31 of the tray 30 at the device transfer position ②. It may include a tray table for moving the tray 30 in the horizontal direction, such as movement.

The bin tray 400 is a configuration in which the devices 10 inspected as defective by the device inspection unit 200 are seated on the tray 30, and various configurations are possible.

As an example, the bin tray 400 may include tray loading parts in which a plurality of trays 30 are stacked; It may include a tray moving unit for receiving the tray 30 from the tray loading portion to move the tray 30 to the element delivery position receiving the elements 10 from the pickup tool 510.

The tray loading part may have a similar configuration to the tray loading part of the unloading part 300 described above or may be used together with the tray loading part of the unloading part 300.

The tray moving unit is configured to move the tray by drawing the boot tray into the tray loading unit, and various configurations are possible.

Meanwhile, the bin tray 400 may have one or a plurality of configurations depending on the type of failure of the device 10.

Meanwhile, the elements 10 inspected as defective in the second movement path of the unloading unit 300 may be transferred by the pickup tool 510 or may move between the unloading unit 300 and the bin tray unit 400. It can be transported by a separate sorting pick-up tool that is additionally installed.

On the other hand, a bottom inspection unit 620 may be additionally installed in the transfer path of the pickup tool 510 to perform a surface inspection on the bottom surface opposite to the pickup surface of the element 10 picked up by the pickup tool 510. .

The bottom inspection unit 620 includes a camera that acquires an image of the device 10 picked up by the pickup tool 510, and the camera is configured to transfer the acquired image to an inspection module for image analysis. The image analysis result is used to check for damage (chipping, cracks, scratches, presence of foreign matters, etc.) that may occur during the pickup and place process by the pickup tool 510.

Meanwhile, the device 10 needs to be more accurately seated in the seating groove 31 of the tray 30 in the unloading part 300 and the bin tray part 400, particularly the unloading part 300. 10) and the alignment of the seating groove 31 of the tray 30 is necessary.

Accordingly, the bottom inspection unit 620 recognizes the bottom projection shape of the element 10 picked up by the pick-up tool 510, and thus the bottom inspection unit 620 in at least one of the unloading unit 300 and the bin tray unit 400. It can be used to align the tray 30 on which the element 10 will be seated based on the projection shape recognized by the.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

100: wafer ring loading unit 200: device inspection unit
300: unloading unit 400: bin tray unit

Claims (10)

A wafer ring loading portion for loading a wafer ring to which elements are attached;
An element inspection unit which receives a wafer ring from the wafer ring loading unit and performs surface inspection on elements attached to the wafer ring;
A pick-up tool for picking up and transferring the element from the wafer ring after the surface inspection in the element inspection unit;
An unloading unit in which elements inspected by the element inspecting unit among the elements transferred by the pick-up tool are seated on a tray;
A bin tray unit in which elements inspected as defective by the element inspecting unit among the elements conveyed by the pickup tool are seated on a tray;
A bottom inspection unit installed on a transfer path of the pickup tool and performing a surface inspection on a bottom surface opposite to a pickup surface in an element picked up by the pickup tool;
The tray is formed with a plurality of mounting grooves for each of the elements to be seated,
The bottom inspection unit recognizes a bottom projection shape of the element picked up by the pickup tool, so that the unloading unit or the bin tray unit aligns a tray on which the element is to be seated based on the projection shape recognized by the bottom inspection unit. Device inspection apparatus. A wafer ring loading portion for loading a wafer ring to which elements are attached;
An element inspection unit which receives a wafer ring from the wafer ring loading unit and performs surface inspection on elements attached to the wafer ring;
A pick-up tool for picking up and transferring the element from the wafer ring after the surface inspection in the element inspection unit;
An unloading unit in which elements inspected by the element inspecting unit among the elements transferred by the pick-up tool are seated on a tray;
Among the elements transported by the pick-up tool includes a bin tray unit that is inspected as defective by the element inspection unit seated on the tray,
The unloading unit may include a tray loading unit in which a plurality of trays are stacked; And a tray moving part receiving the tray from the tray loading part and moving the tray to an element delivery position receiving the elements from the pickup tool. The method according to claim 2,
And a bottom inspection unit installed on a transfer path of the pickup tool to perform a surface inspection on a bottom surface opposite to a pickup surface of the element picked up by the pickup tool. The method according to claim 3,
The tray is formed with a plurality of mounting grooves for each of the elements to be seated,
The bottom inspection unit recognizes a bottom projection shape of the element picked up by the pickup tool, so that the unloading unit or the bin tray unit aligns a tray on which the element is to be seated based on the projection shape recognized by the bottom inspection unit. Device inspection apparatus. The method according to claim 2,
The tray moving part includes a first moving path and a second moving path arranged in parallel with each other.
The first movement path is provided with a tray image acquisition unit for inspecting the alignment of the seating groove of the tray to seat the device in the device transfer position,
And a vision inspection unit for re-inspecting the surfaces of the elements mounted on the tray in the second movement path. The method according to claim 5,
The bin tray unit includes a tray loading unit in which a plurality of trays are stacked;
And a tray moving part receiving the tray from the tray loading part and moving the tray to an element delivery position receiving the elements from the pickup tool. The method of claim 6,
And a sorting pick-up tool for transferring the devices inspected as defective in the second moving path to the bin tray unit. The method of claim 6,
The device inspection device is characterized in that the device inspected as defective in the second moving path is transferred to the bin tray by the pickup tool. A wafer ring loading unit for loading a wafer ring to which elements are attached after a wafer cutting process;
An element inspection unit which receives a wafer ring from the wafer ring loading unit and performs surface inspection on elements attached to the wafer ring;
A pick-up tool for picking up and transferring the element from the wafer ring after the surface inspection in the element inspection unit;
An unloading unit in which elements inspected by the element inspecting unit among the elements transferred by the pick-up tool are seated on a tray;
And a bin tray unit in which elements inspected as defective by the element inspecting unit among the elements conveyed by the pick-up tool are seated on a tray. A wafer ring loading portion for loading a wafer ring to which elements are attached;
An element inspection unit which receives a wafer ring from the wafer ring loading unit and performs surface inspection on elements attached to the wafer ring;
A pick-up tool for picking up and transferring the element from the wafer ring after the surface inspection in the element inspection unit;
An unloading unit in which elements inspected by the element inspecting unit among the elements transferred by the pick-up tool are seated on a tray;
A bin tray unit in which elements inspected as defective by the element inspecting unit among the elements conveyed by the pickup tool are seated on a tray;
And a bottom inspection unit installed on a transport path of the pickup tool and performing a surface inspection on a bottom surface opposite to a pickup surface in the element picked up by the pickup tool.

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