KR20080103353A - System for inspection of semiconductor package - Google Patents

Abstract

A semiconductor package check system is able to perform the division inspect about all domains for one rotation by setting up the plurality of cameras. A semiconductor package check system comprises the main body(1); the loading unit(10) which is equipped in front of the main body in order to supply the tray to the first transfer rail(11); the first vision testing station(12) for performing the vision inspection toward the first side of the semiconductor package; the second transfer rail(13) equipped at the one side of the first transfer rail; the second vision testing station(14) which inspects the second side of the semiconductor package with 2D by using the color camera; the tray transfer unit(16) for moving the tray to the third transfer rail(15); the third vision testing station(17) which inspects the second side of the semiconductor package with 2D by using the line scan camera; the unloader in which the tray in which the good semiconductor device is accepted is loaded; the unloading rail(21) equipped behind the unloader; the buffer rail(31) equipped in the unloading rail; the fourth vision testing station which inspects the first side of the semiconductor package with 2D by using the line scan camera; the plurality of reject parts(40,40a,40b) in which the inferior goods semiconductor device is accepted; the classification machine(60) which classifies the semiconductor package while moving between the reject parts and the unloader.

Description

Semiconductor Package Inspection System {SYSTEM FOR INSPECTION OF SEMICONDUCTOR PACKAGE}

1 is a conceptual diagram of a semiconductor package inspection system according to a first embodiment of the present invention.

2 is a partially omitted perspective view showing an example of FIG.

3 is a plan view of FIG.

4 is a configuration diagram of a semiconductor package inspection system according to a second embodiment of the present invention.

FIG. 5 is a perspective view in which a part of a semiconductor package inspection system according to a second embodiment of the present invention is omitted. FIG.

6 is a plan view of FIG.

Figure 7 is a front perspective view of the cleaning apparatus of the semiconductor package inspection system according to the present invention.

8 is a rear view of FIG. 7;

9 and 10 are views for explaining the operation of the cleaning device of the semiconductor package inspection system of the present invention.

11 is a block diagram showing an embodiment of a conventional semiconductor package appearance inspection apparatus.

<Description of the symbols for the main parts of the drawings>

1: main body

    10: loading part

    11: first transfer rail

    12: first vision inspection unit, 12a: 3D inspection unit, 12b: 2D inspection unit

    13: 2nd transfer rail

    14: second vision inspection unit

    15: 3rd transfer rail

    16 tray feed means

    17: third vision inspection unit

    20: unloading part, 21: unloading rail, 22: fourth vision inspection part

    30: buffer part, 31: buffer rail

    40: reject portion, 41: reject trail

    50: reversal means

    60: classifier

    70: empty tray, 71: empty tray supply rail

    80: cleaning device

         80a: cleaning module body

         80b: guide part

         80c: timing belt

         80d: pulley

     81: brush cleaning module

     82: air cleaning module

     83: Vacuum Suction Pad

     84: lifting device

The present invention relates to a semiconductor package inspection system, and more particularly, a semiconductor package capable of increasing equipment utilization and increasing inspection yield by inspecting different areas of a semiconductor package during one rotation of a single inspection system. Relates to an inspection system.

In general, the development trend of the semiconductor package is moving in the direction of ensuring the reliability of operation while reducing the size of the package as much as possible. Therefore, the development of the most widely used lead frame surface mount from the ultra-small chip scale semiconductor package (chip scale semiconductor package), and ultimately to the flip chip semiconductor package.

The flip chip package is a semiconductor package formed by bumping an electrode of a die, which is a semiconductor chip, and a substrate for a semiconductor package, instead of a wire bonding technique of connecting a semiconductor chip and a lead frame with a gold wire in a conventional semiconductor package.

Solder ball bumps may be used as one of the methods of manufacturing flip chip semiconductor packages. One example of the method of manufacturing such solder ball bumps is that the nozzle is transferred after transferring the flux to a desired portion of the semiconductor wafer. Solder bumps can be manufactured by locating the solder balls and fusion bonding them through reflow.

On the other hand, the external connection of the flip chip package is made by attaching a spherical solder ball for a ball grid array (BGA).

The flip chip-ball grid array (FC-BGA) package has a fatal effect on performance when there is an external defect, so that not only an internal defect inspection but also a CCD camera, etc. Visual inspection by using the test should be performed more precisely.

FIG. 11 is a block diagram illustrating an example of a conventional apparatus for inspecting appearance of a semiconductor package. The apparatus 100 includes a main body 100, a loading unit 210 on which trays containing a semiconductor package for performing inspection are loaded, and a semiconductor package. The inspection unit 300 for inspection, the buffer 220 for temporarily storing the buffer tray containing the completed semiconductor package, and the trays containing the semiconductor packages classified as defective as a result of the inspection are loaded, classified and loaded according to the type of defect. Unloading unit 260 for loading the first reject portion 230, the second reject portion 240, the third reject portion 250, and the tray containing the semiconductor packages classified as a result of the inspection result ) And the loading unit 210, the buffer 220, the first reject unit 230, the second reject unit 240, the third reject unit 250, and the unloading unit 260, respectively. And a plurality of trays for moving the tray in the front-rear direction of the main body 100. The tray conveying unit 460 and the upper side of the main body so as to be reciprocated horizontally, the loading unit 210, the buffer 220, the first reject unit 230, the second reject unit 240, Transfer 500, the buffer 220, the first reject portion 230, the second reject portion 240 for transferring the tray between the tray transfer portion of the third reject portion 250 and the unloading portion 260 ), The third reject unit 250 and the unloading unit 260 is installed so as to reciprocate transfer between the transfer unit, and pick up the defective product from the semiconductor package stored in the tray transferred to the unloading unit 260 According to the defect type, the first and second reject parts 230, 240, and third reject parts 250 are transferred to any one of the semiconductor packages stored in the buffer tray and picked up the above-mentioned products. It comprises a sorting unit 600 for performing a sorting process to fill in the empty spaces out of the defective parts of the unloading unit 260.

Here, the inspection unit 300 is composed of a first and second vision camera for performing a vision inspection, the first vision camera 310 is to inspect one surface of the semiconductor packages accommodated in the tray loaded in the loading unit The second vision camera 320 inspects the other surfaces of the semiconductor packages, and the second vision camera 320 inspects the other surface of the semiconductor package whose one surface is inspected by the first vision camera 310. An inversion unit 700 is further provided between the first vision camera 310 and the second vision camera 320 to invert the tray in which the semiconductor package is accommodated.

Reference numeral 270 denotes an empty tray portion, 410 denotes a loading stacker, 470 denotes a feeder on which the empty tray is placed, and 430, 440, 450, and 460 denote first, second, and third reject portions 230, 240, 250, and A feeder placed in the unloading unit 260 is shown, and 610 represents a classifier for classifying semiconductor packages.

According to the configuration, one surface of the semiconductor package supplied from the loading unit 210 and stored in the tray transferred through the tray transfer unit is inspected through the first vision camera 310, and the semiconductor package whose surface is inspected is inverted ( Inverted at 700).

Here, the inversion unit 700 should be provided with an empty tray so that the semiconductor package can be re-received while showing the other surface when inverting both sides of the semiconductor package accommodated in the tray.

The inverted tray is transferred to the transfer unit of the inspection area of the second vision camera 320 by the transfer 500 which transfers the tray back and forth between the transfer units, and the semiconductor package accommodated in the transferred tray is inverted after the second vision. It is inspected by the camera 320.

However, the conventional semiconductor package appearance inspection apparatus photographs one surface using the first vision camera 310 regardless of the package type, and photographs the other surface through the second vision camera, and determines whether there is a defect through the captured image analysis. do.

Accordingly, there is a problem in that the inspection reliability of the package of the FC-BGA type having different reflectivity for each region is lowered.

In other words, the controlled-collapse chip connection (C4) region in which the semiconductor chip and the substrate are bonded by solder bumps, the substrate region made of a plastic body, and the ball region for external connection, respectively, exhibit a difference in reflectivity. As a result of irradiating the same illumination, there is a problem in that the reliability of an image obtained by deterioration of the reflection or excessive lighting occurs due to excessive illumination.

Therefore, the semiconductor package is divided into a plurality of areas according to the difference in reflectivity and the inspection speed of the semiconductor package is increased by increasing the number of inspection revolutions using a single inspection device in order to acquire images for each region. There was a disadvantage that the test yield is lowered.

SUMMARY OF THE INVENTION An object of the present invention for solving the problems according to the prior art is to install a plurality of different cameras in a single inspection system and inspect each camera for a different area of the semiconductor package during one rotation of the single inspection system. In the present invention, a semiconductor package inspection system can be implemented to improve inspection reliability by enabling divisional inspection of all regions during one rotation.

The semiconductor package inspection apparatus of the present invention for solving the above technical problem, the main body, a loading unit provided in front of the main body to supply a tray containing the semiconductor package for performing the inspection to the first transfer rail, and the first A first vision inspection unit provided at a transfer rail to perform vision inspection on a first surface of the semiconductor package, a second transfer rail provided at one side of the first transfer rail, and a semiconductor package provided on the second transfer rail A second vision inspection unit for 2D inspection using a color camera with respect to a second surface of the tray, tray transfer means for moving the tray vision-inspected by the second vision inspection unit to a third transfer rail on one side of the second transfer rail, A third vision inspection unit provided on the third transfer rail and performing 2D inspection on the second surface of the semiconductor package using a line scan camera; An unloading unit provided at one side of the inspection unit and having a tray containing the good semiconductor device therein, an unloading rail provided at the rear of the unloading unit, a buffer rail provided at one side of the unloading rail, and the unloading rail A fourth vision inspection unit provided in each of the buffer rails and performing a 2D inspection on the first surface of the semiconductor package using a line scan camera, and inverting and transferring the tray on the first conveying rail onto the second conveying rail; 3 reversing means for inverting the tray on the transfer rail to transfer to the unloading rail or the buffer rail, a plurality of reject parts which are provided at one side of the unloading part, in which defective semiconductor devices are classified and stored according to a defect type; The classifier includes a classifier for classifying the semiconductor package having completed the vision inspection while moving between the reject unit and the unloading unit.

The first vision inspection unit may include a 3D vision inspection unit that performs 3D inspection on the first surface of the semiconductor package, and a 2D inspection unit which performs 2D inspection on the first surface of the semiconductor package by using a color camera. Can be.

In addition, between the third transfer rail and the unloading rail is further provided with a ball feed rail provided with a ball tray in front.

In addition, a front end of the first vision inspection unit and the second vision inspection unit is preferably provided with a cleaning device, the cleaning device is provided on both sides of the brush cleaning module and the brush cleaning module for cleaning through close contact with the surface of the semiconductor package. It is preferably configured to include an air cleaning module for performing the air injection and vacuum suction.

In this case, the air cleaning module may further include an ionizer for removing static electricity through ion supply.

The cleaning device includes a cleaning module body on which the brush cleaning module and the air cleaning module are mounted, a guide part for guiding the left and right movement of the cleaning module body, a timing belt on which one side is fixed to the cleaning module body, A pulley fixed to both sides of the guide part to drive the timing belt to move the cleaning module body from side to side, and a semiconductor package provided at a lower portion of the cleaning module body to be accommodated in a tray using a vacuum suction pad; It may further include a lifting device for lifting up and down.

The invention will become more apparent through the preferred embodiments described below with reference to the accompanying drawings. Hereinafter will be described in detail to enable those skilled in the art to easily understand and reproduce through embodiments of the present invention.

1 is a conceptual view of a semiconductor package inspection system according to a first embodiment of the present invention, FIG. 2 is a partially omitted perspective view illustrating an example of FIG. 1, and FIG. 3 is a plan view of FIG. 2, which includes a main body 1 and a loading. Part 10, first vision inspection section 12, second vision inspection section 14, tray transfer means 16, third vision inspection section 17, unloading section 10, re It comprises a projecting section 40, a reversing means 50, a fourth vision inspection section 22, and a classifier 60.

Here, the loading unit 10 is loaded with trays containing the semiconductor package for performing the inspection, and is provided in front of the main body 1 to supply the trays.

The first vision inspection unit 12 is provided on the first transfer rail 11 to perform vision inspection on the first surface of the semiconductor package transferred from the loading unit 10.

In this case, the first vision inspection unit 12 performs a 3D inspection of the first surface of the semiconductor package 12D and a 2D inspection of the first surface of the semiconductor package using a color camera. It consists of the inspection part 12b.

In other words, the controlled-collapse chip connection (C4) region in which the semiconductor chip and the substrate are bonded by solder bumps is inspected by the 3D vision inspection unit 12a, and the inspection items and colors corresponding to the large areas of the plastic body around the C4 are examined. Inspection by the defect is preferably inspected by the 2D inspection unit 12b using a color camera.

In addition, the second vision inspection unit 14 is provided on the second transfer rail 12 to perform 2D inspection on the second surface of the semiconductor package using a color camera.

Here, the second vision inspection unit 14 performs 2D inspection of the second surface of the semiconductor package, that is, the ball land area. In other words, an inspection item corresponding to a large area and a defect inspection by color are performed using a color camera.

The tray transfer means (TRM) is a transfer means for moving the trays vision-inspected by the second vision inspection unit 14 to the third transfer rail 15 and moving the trays between the rails.

Meanwhile, the third vision inspection unit 17 is provided on the third transfer rail 15 and performs 2D inspection on the second surface of the semiconductor package using a line scan camera.

That is, the detailed inspection of the small inspection items in the ball land area is performed by using a line scan camera.

In addition, the front of the main body 1 is provided with an unloading portion 10 for loading a tray for storing good semiconductor elements, and an unloading rail 21 for conveying a good tray is provided at the rear of the unloading portion 10. It is provided, one side of the unloading rail 21 is provided with a buffer rail 31, the buffer tray is transferred.

Here, the unloading rail 21 and the buffer rail 31 are each provided with a fourth vision inspection unit 22 for performing 2D inspection on the first surface of the semiconductor package using a line scan camera.

In this case, the fourth vision inspection unit 22 performs 2D inspection of the plastic body region by using a line scan camera, and performs inspection on inspection items having a small area of the 2D inspection item.

The inverting means 50 inverts and transports the tray on the first transport rail 11 on the second transport rail 12, and inverts the tray on the third transport rail 15 to unload the rail 21. Or it is provided behind the main body 1 to be transferred to the buffer rail (31).

In addition, the reject unit 40 is one in which defective devices are classified and stored according to a defect type among semiconductor devices for which vision inspection is completed. The reject unit 40 includes a plurality of reject units 40a and 40bc, and each reject unit 40a, The reject trail 41 is provided at 40b).

Here, an empty tray supply rail 71 is further provided between the third transfer rail 15 and the unloading rail 21 to provide a ball tray 70 at the front thereof. It is preferable to supply to the reject rail 41 of the.

On the other hand, the classifier 60 classifies the semiconductor package, which has completed the vision inspection, as a tray on the unloading rail 21 while moving between the plurality of reject trails 41 and the unloading rails 21.

4 is a configuration diagram of a semiconductor package inspection system according to a second exemplary embodiment of the present invention, and FIG. 5 is a perspective view in which a part of the semiconductor package inspection system according to the second exemplary embodiment of the present invention is omitted, and FIG. As a plan view, description of the same components as those in the first embodiment of the present invention will be omitted.

The semiconductor package inspection system according to the second embodiment of the present invention includes a cleaning device 80 at the front end of the first vision inspection unit 12 and the second vision inspection unit 14, respectively.

7 is a front perspective view of the cleaning apparatus of the semiconductor package inspection system according to the present invention, FIG. 8 is a rear view of FIG. 7, and the cleaning apparatus 80 according to the second embodiment of the present invention includes a cleaning module body 80a. , Which is provided at the bottom of the cleaning module body 80, is provided on both sides of the brush cleaning module 81 and the brush cleaning module 81 for cleaning while moving in close contact with the surface of the semiconductor package, and performs air injection and vacuum suction. Module 82.

Then, the guide portion 80b for guiding the left and right movement of the cleaning module body 80a, the timing belt 80c fixed to one side of the cleaning module body 80a, and fixed to both sides of the guide portion 80b. And a pulley 80c for driving the timing belt 80c by motor driving to move the cleaning module body 80a from side to side along the guide portion 80b.

In addition, the lifting module 84 provided in the lower portion of the cleaning module body (80a) is accommodated in the tray by using the vacuum adsorption pad (83) is configured to include a lifting device (84).

In addition, although not shown in the drawings, the air cleaning module 82 of the cleaning apparatus according to the second embodiment of the present invention further includes an ionization device (not shown) for removing static electricity through ion supply. It is preferable to prevent the characteristics of the device from deteriorating.

9 and 10 are views for explaining the operation of the cleaning apparatus of the semiconductor package inspection system of the present invention. First, when the tray containing the semiconductor package is transported, the vacuum suction pad 83 provided in the elevating means 84 is removed. The semiconductor package is sucked to fix the semiconductor package on the vacuum suction pad 83.

Then, the lifting means 84 provided with the vacuum suction pad 82 is raised to allow the semiconductor package to be loaded at the cleaning height, and the timing belt connected to the pulley 80d by rotating the pulley 80d through motor driving. Drive 80c).

Accordingly, the cleaning module body 80a moves in the left and right directions along the guide portion 80b, and the brush cleaning module 81 performs cleaning while sliding in close contact with the surface of the semiconductor package.

At this time, air injection and vacuum suction are performed through the air cleaning module 82 to clean the surface of the semiconductor package by air, and at the same time, fine dust or contaminants generated by brush cleaning and air cleaning are sucked and removed by vacuum.

As described above, in the present invention, a plurality of cameras of different types are installed in a single inspection system and each camera is rotated during one rotation of the single inspection system. 3D and 2D inspection of the face allows a single system to be divided into all areas during one revolution, improving inspection reliability, as well as increasing equipment utilization and inspection yield. have.

Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that many different and obvious modifications are possible without departing from the scope of the invention from this description. Therefore, the scope of the invention should be construed by the claims described to include many such variations.

Claims (7)

With the body (1), A loading unit 10 provided in front of the main body 1 to supply a tray containing the semiconductor package for performing the inspection to the first transfer rail 11; A first vision inspection unit 12 provided on the first transfer rail 11 to perform vision inspection on the first surface of the semiconductor package; A second conveying rail 12 provided at one side of the first conveying rail 11; A second vision inspection unit 14 provided on the second transfer rail 12 and performing 2D inspection on the second surface of the semiconductor package using a color camera; A tray transfer means 16 for moving the tray vision-inspected by the second vision inspection unit 14 to a third transfer rail 15 on one side of the second transfer rail 12; A third vision inspection unit 17 provided on the third transfer rail 15 and performing 2D inspection on the second surface of the semiconductor package using a line scan camera; An unloading unit 10 provided at one side of the third vision inspection unit 17 and on which a tray containing good semiconductor devices is loaded; An unloading rail 21 provided behind the unloading part 10, A buffer rail 31 provided at one side of the unloading rail 21; A fourth vision inspection unit 22 provided in the unloading rail 21 and the buffer rail 31 and performing 2D inspection on the first surface of the semiconductor package using a line scan camera; The tray on the first conveyance rail 11 is inverted and conveyed on the second conveyance rail 12, and the tray on the third conveyance rail 15 is inverted to convey the unloading rail 21 or the buffer rail 31. Reversing means (50) for transferring to the; A plurality of reject parts 40 (40a, 40b) provided at one side of the unloading part 10 to receive and classify defective semiconductor devices according to defective types; Inspection of a semiconductor package, characterized in that it comprises a classifier (60) for classifying the semiconductor package has completed the vision inspection while moving between the plurality of reject portion (40; 40a, 40b) and the unloading portion (10) system. The method of claim 1, The first vision inspection unit 12; 3D vision inspection unit 12a for performing a 3D inspection of the first surface of the semiconductor package, And a 2D inspection unit (12b) for performing 2D inspection on the first surface of the semiconductor package by using a color camera. The method of claim 1, An empty tray supply rail (71) is further provided between the third conveying rail (15) and the unloading rail (21) with a empty tray portion (70) in front. The method according to any one of claims 1 to 3, The cleaning system of the semiconductor package, characterized in that the cleaning device (80) is provided at the front end of the first vision inspection unit (12) and the second vision inspection unit (14). The method of claim 4, wherein The cleaning device (80); Brush cleaning module 81 to clean the semiconductor package surface by close contact, Inspection system for a semiconductor package, characterized in that it comprises an air cleaning module (82) which is provided on both sides of the brush cleaning module (81) to perform air injection and vacuum suction. The method of claim 4, wherein The air cleaning module (82) further includes an ionization device for removing static electricity through ion supply. The method of claim 6, The cleaning device (80); A cleaning module body 80a on which the brush cleaning module 81 and the air cleaning module 82 are mounted; A guide part 80b for guiding the left and right movement of the cleaning module body 80a; A timing belt 80c having one side fixed to the cleaning module body 80a; A pulley 80d fixed to both sides of the guide part 80b to drive the timing belt 80c to move the cleaning module body 80a from side to side; Inspection of the semiconductor package, characterized in that further provided with a lifting device 84 which is provided in the lower portion of the cleaning module body (80a) is adsorbed by the vacuum adsorption pad (83) provided in the tray and then lifted up and down. system.

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