KR100873672B1 - System for vision inspection of semiconductor device - Google Patents

Abstract

According to the present invention, the semiconductor device includes a picker module in which the transfer and sorting functions of the semiconductor device are integrated, and the semiconductor device is directly sorted on the tray on the transfer rail without a separate sorting area, thereby simplifying device configuration and reducing equipment size. It relates to a vision inspection system of a semiconductor device.

The semiconductor device vision inspection system of the present invention for this purpose relates to a vision inspection system for taking a semiconductor device surface image and automatically inspects for defects according to the photographing result, and is provided symmetrically on both sides of the main body and the front of the main body. A loading part and an unloading part which are loaded to allow a plurality of trays to be raised or lowered, a loading rail which is provided at the rear of the loading part to transfer the tray in a forward and backward direction, and is provided at the rear of the unloading part to front and back the unloading tray An unloading rail for conveying in a direction, a recycling part provided at the rear of the main body and transferring the empty tray on the loading rail to the unloading rail, and provided between the loading rail and the unloading rail before and after the semiconductor device. Vision inspection device composed of a pair of vision camera to take an image, the unloading rail and vision inspection And pick up semiconductor elements from the tray on the reject rail and the tray on the loading rail and transfer them for vision inspection by a vision inspection device. And a picker module for transporting and sorting to transfer and sort to an unloading tray on a rail or a reject tray on a reject trail.

Semiconductor, Device, Picker Module, Transfer, Pickup

Description

Vision inspection system for semiconductor devices {SYSTEM FOR VISION INSPECTION OF SEMICONDUCTOR DEVICE}

1 is a block diagram of a vision inspection system of a semiconductor device according to the present invention.

2 is a configuration diagram showing an example of an appearance inspection system of such a semiconductor device according to the prior art.

<Description of the symbols for the main parts of the drawings>

1: main body

    11: loading unit

         111: loading rail

    12: unloading unit

         121: Unloading rail

    13: reject trail

    14: recycling unit

    15: vision inspection device

    16: picker module

    17: cleaning means

The present invention relates to a vision inspection system for a semiconductor device, and more particularly, to a semiconductor device including a picker module having integrated transfer and sorting functions of the semiconductor device and directly placing the semiconductor device on a tray on a transfer rail without a separate sorting area. By sorting, the invention relates to a vision inspection system for semiconductor devices that can simplify device configuration and reduce equipment size.

Memory modules, generally semiconductor devices, are manufactured through a series of processes and are then thoroughly inspected prior to shipment. These inspections have a fatal effect on the performance of not only the internal defects of the semiconductor device but also a small defect in its appearance. Because of this, not only the electrical motion inspection but also various inspections such as visual inspection using a vision camera are performed.

In general, external defects of semiconductor devices, in particular, ball grid arrays (BGAs) and defects of leads, may also occur during assembling of semiconductor devices to a printed circuit board (PCB). .

2 is a configuration diagram showing an example of an external appearance inspection system of the semiconductor device according to the prior art.

According to this technology, the vision inspection system of a semiconductor device, the loading unit 100 is loaded in the front of the main body and the tray to be vision-tested, and the loading unit 100 at the front of the main body is disposed on one side of the regular device or defective products The sorting unit 200 in which the devices are classified, the cleaning unit 300 provided on the upper part of the main body, and the vision element for inspecting the front and rear surfaces of the semiconductor device cleaned by the cleaning unit 300. The inspection unit 400, the transfer picker 500 that picks up and transfers the semiconductor element to be vision inspected, the transfer picker mover 600 which guides the horizontal pick-up and movement of the transfer picker 500, and the semiconductor whose vision inspection is completed. The unloading unit 700 in which the buffer tray in which the element is housed and the tray in which the good semiconductor device is stored is loaded, the empty tray unit 800 in which the empty tray is loaded, and the defective element is classified and stored according to the vision inspection result.Consists of the object part 900, the vision inspection results sorting unit 910 and a recycling unit 1000 for transferring the empty tray of the trays supplied through a loading region to an unloading 700 for sorting semiconductor devices according to the.

By such a configuration, the vision inspection system of the semiconductor device transfers a tray containing the semiconductor device to be vision inspected, picks up the semiconductor device using a transport picker, and then performs vision inspection using a vision camera. All of the empty trays picked up are transferred to the buffer unit by using recycling means.

Subsequently, if the inspected semiconductor device is a good product, it is stored in the tray of the unloading unit, and if it is a defective product, the semiconductor device is classified into the reject tray of the reject unit in a slot manner.

And the tray from which the defective element came out is used as a buffer tray.

Here, the reject tray is given a unique identification ID, and is configured to read a unique identification ID of a semiconductor device inserted in a slot manner, and thus, a worker can remove a unique identification ID for a corresponding device having a defect without manually inspecting it. Vision inspection results can be visually inspected through the monitor, so there is an advantage in that the inspection of the defective products and the inspection of subsequent trays can be carried out continuously.

However, according to this technology, a vision picker for transferring a semiconductor device on which the vision inspection is to be performed on the upper part of the main body to the vision inspection unit, and transferring the vision inspected semiconductor element to a tray of the unloading unit, and vision inspection for the transferred semiconductor elements The sorting apparatus which classifies according to a result is provided separately.

Accordingly, the sorting area for classifying defective and good products according to the vision inspection results occupies the front of the main body, and the reject tray is supplied to the sorting area, thus occupying a lot of working space, and thus the installation space cannot be efficiently used. There was a problem.

An object of the present invention for solving the problems according to the prior art is to transport and load the loading tray, the reject tray and the unloading tray on each of the transfer rail provided in the front and rear direction of the main body, Equipped with a picker module with integrated sorting function, the reject and unloading trays are classified into reject trays and unloading trays according to the results of vision inspection, thus eliminating the need for a separate sorting area and providing equipment with integrated sorting and transfer functions. The present invention provides a vision inspection system for semiconductor devices that can simplify the configuration of the device and reduce the work size by reducing the working space.

The present invention for solving the technical problem relates to a vision inspection system for taking a semiconductor device surface image and automatically inspects for defects according to the photographing result, which is provided symmetrically on both sides of the main body and the front of the main body. A loading part and an unloading part which are loaded so that the tray can be raised or lowered, a loading rail which is provided at the rear of the loading part and conveys the tray in the front and rear directions, and is provided at the rear of the unloading part to move the unloading tray in the front and rear directions An unloading rail for transporting, a recycling unit for transporting an empty tray on the loading rail to the unloading rail provided at the rear of the main body, and provided between the loading rail and the unloading rail to display front and rear images of the semiconductor device. A vision inspection device comprising a pair of vision cameras to photograph, and between the unloading rail and the vision inspection device And a semiconductor device from the tray on the reject rail and the loading rail for transporting the reject tray and transported for vision inspection by a vision inspection device. It includes a picker module for the transfer and sorting function to transfer and sort to the reject tray on the loading tray or the reject trail.

Here, the picker module is provided in a pair of front and rear directions to alternately transfer and sort the semiconductor elements.

The invention will become more apparent through the preferred embodiments described below with reference to the accompanying drawings. Hereinafter will be described in detail to enable those skilled in the art to easily understand and reproduce through embodiments of the present invention.

1 is a configuration diagram of a vision inspection system of a semiconductor device according to the present invention, the present invention relates to a vision inspection system for taking a semiconductor device surface image and automatically inspects for defects according to the photographing result.

The semiconductor device vision inspection system of the present invention includes a main body 1, a loading unit 11, an unloading unit 12, a loading rail 111, an unloading rail 121, a reject trail 13, and a recycling unit. 14, the vision inspection apparatus 15, and the picker module 16 are configured.

Here, the loading part (Roading) 11 and the unloading part (Good, 12) is provided in the front of the main body 1 on both sides mutually symmetrical, and is loaded so that a plurality of trays can be raised or lowered, the loading unit At 11, a tray containing a semiconductor element to be subjected to vision inspection is loaded.

In addition, the tray 12 which is supplied onto the reject trail 13 to accommodate the good semiconductor devices is transferred to the unloading part 12 and is loaded.

A loading rail 111 is provided at the rear of the loading unit 11 in the front-rear direction to transport the tray in the front-rear direction, and a rear of the unloading unit 12 is configured to transfer the tray in which the good elements are stored in the front-rear direction. The unloading rail 121 is provided.

In addition, a recycling unit 14 for transferring the empty tray on the loading rail 111 to the unloading rail 121 is provided between the loading rail 111 and the unloading rail 121 behind the main body 11.

In addition, a vision inspection device 15 including a pair of vision cameras 151 and 152 for photographing the front and rear images of the semiconductor device is provided between the loading rail 111 and the unloading rail 121.

In addition, a reject trail 131 is provided between the unloading rail 121 and the vision inspection device 15, and a reject tray for receiving defective products according to a result of vision inspection through the vision inspection device 15 ( Reject) Allows the tray to be loaded and transported.

And, according to a characteristic aspect of the present invention, the picker module 16 is configured to be capable of driving in the left and right and up and down directions of the main body 11, and the transfer and sorting functions are integrated.

In other words, the picker module 16 of the present invention picks up the semiconductor element from the tray on the loading rail 111 and transfers it for vision inspection by the vision inspection apparatus 15, and picks up the vision inspection completed semiconductor element to determine whether it is defective. Accordingly, the transfer is performed by classifying the unloading tray Tray on the unloading rail 121 or the reject tray Reject on the reject trail 13.

At this time, the picker module 16 is provided in a pair in the front-rear direction, while one of the picker modules classifies the semiconductor device according to the vision inspection result, the other from the loading unit 11 onto the loading rail 111. The semiconductor device is picked up from the transferred tray so that vision inspection is performed.

Here, the reject tray is given a unique identification ID and is configured to read a unique identification ID for the semiconductor device inserted in a slot manner.

As a result, the operator can visually inspect the vision inspection result for the device in which the defect occurs without manual inspection and visual inspection by hand, so that the inspection of the defective product and the subsequent trays can be carried out continuously. As such, the detailed description of the reject tray will be described in detail in 10-2006-0043900 filed by the present applicant, so a description of the configuration and operation thereof will be omitted.

On the other hand, between the loading rail 111 and the vision inspection device 15 is preferably provided with a cleaning means 17 for cleaning the surface of the semiconductor device before performing the vision inspection.

In other words, if foreign matters such as fine dust or contaminants are adsorbed on the surface of the semiconductor element, the semiconductor element may be poorly determined by the foreign matter, so that the foreign matter adsorbed on the semiconductor surface is removed by a cleaning means, thereby eliminating the cause of the inspection error. desirable.

As described above, the semiconductor device vision inspection system of the present invention can simplify the configuration of equipment by allowing the picker module to perform a semiconductor device transfer and sorting function.

In addition, since there is no separate sorting equipment, the sorting area is unnecessary, so that the area occupied by the sorting area in the equipment can be reduced, thereby reducing the size of the equipment.

In addition, the picker module has a transporting and sorting function, thereby simplifying the operation of the equipment, compared to the conventional sorting device and the transporting device.

As described above, the present invention provides a loading tray, a reject tray and an unloading tray on each transfer rail provided in the front and rear direction of the main body without a separate sorting area, and the transfer and sorting functions are integrated. The picker module is used to pick up and transfer the semiconductor device from the loading unit for vision inspection, and classify the semiconductor device directly into the reject tray and the unloading tray according to the vision inspection result.

Accordingly, since the defective and good semiconductor devices are classified in the trays on each transfer rail, it is not necessary to secure a separate sorting area, thereby simplifying the configuration of the device and reducing the working space, thereby reducing the size of the equipment. have.

Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that many different and obvious modifications are possible without departing from the scope of the invention from this description. Therefore, the scope of the invention should be construed by the claims described to include many such variations.

Claims (3)

In the vision inspection system that photographs the surface image of the semiconductor device and automatically inspects for defects according to the photographing result, Main body 1; A loading part 11 and an unloading part 12 which are provided symmetrically on both front sides of the main body 1 and are stacked such that a plurality of trays can be raised or lowered; A loading rail 111 provided at the rear of the loading part 11 to transfer the tray in the front-rear direction; An unloading rail 121 provided at the rear of the unloading part 12 to transfer the unloading tray in the front-rear direction; A recycling unit 14 provided at the rear of the main body 1 to transfer the empty tray on the loading rail 111 to the unloading rail 121; A vision inspection device (15) provided between the loading rails (111) and the unloading rails (112) and configured with a pair of vision cameras (151, 152) for photographing the front and rear images of the semiconductor device; A reject trail 13 provided between the unloading rail 121 and the vision inspection device 15 to transfer the reject tray; And The semiconductor device is picked up from the tray on the loading rail 111 and transferred to the vision inspection device 15 for vision inspection, and the semiconductor device is picked up for vision inspection and the unloading tray on the unloading rail 121 according to a defect. A semiconductor device vision inspection system comprising a picker module (16) having a transport and sorting function for transporting and sorting to a reject tray on a reject trail (13). The method of claim 1, The picker module 16; A vision inspection system for a semiconductor device, comprising a pair of front and rear directions to alternately carry out the transfer and sorting operations of the semiconductor device. The method of claim 1, The semiconductor device vision inspection system, characterized in that between the loading rail (111) and the vision inspection device (15) further comprises a cleaning means (17) for cleaning the surface of the semiconductor device before performing the vision inspection.

Images