KR102142687B1 - Apparatus for inspecting exterior of semiconductor device - Google Patents

Abstract

The present invention relates to a semiconductor device appearance inspection device. The first vision inspector inspects a first surface of each semiconductor device stored in a tray transferred from the loading unit. The second vision inspector inspects the second surface of each semiconductor element stored in the tray in an upside-down state via a transfer. The first picker picks up a plurality of semiconductor elements that have passed through the second vision inspector in a row unit from the corresponding tray, transfers them to the first side inspection area along the row direction, and returns to the corresponding tray. The third vision inspector inspects the third and fourth surfaces of each semiconductor device transferred to the first side inspection area. The second picker picks up a plurality of semiconductor elements that have passed through the third vision inspector in a column unit from the corresponding tray, rotates them 90 degrees around the vertical axis, transfers them to the second side inspection area along the row direction, and returns to the corresponding tray. . The fourth vision inspector inspects the fifth and sixth surfaces of each semiconductor device transferred to the second side inspection area.

Description

Apparatus for inspecting exterior of semiconductor device

The present invention relates to a device for inspecting the appearance of semiconductor devices by inspecting and classifying each appearance of semiconductor devices.

The semiconductor device is manufactured through a semiconductor process and then inspected before shipment. That is, the semiconductor device has a fatal effect on performance if there is a defect in the appearance as well as a defect in the packaged interior. Accordingly, various tests including an external appearance test as well as an electrical operation test are performed on the semiconductor device.

On the other hand, as the packaging method of semiconductor devices is advanced, precise inspection technology is required. For example, a BGA (Ball Grid Array) type semiconductor device is packaged in a hexahedron and is formed in a form in which solder balls are arranged on one side. In the related art, dimensional inspection of solder balls is mainly performed. It was common.

However, for a precise visual inspection of the semiconductor device, a surface inspection that checks for cracks, bubbles, metal exposure, scratches, foreign substances, etc. on the remaining surfaces of the semiconductor device, and a marking inspection on an identification mark engraved on the surface of the semiconductor device It is also required to be performed together.

In this case, the semiconductor device appearance inspection device needs to be configured so that it can quickly and efficiently automatically perform a task of classifying good and bad products according to inspection results after visual inspection of all six surfaces of the semiconductor devices.

An object of the present invention is to provide a device for inspecting the appearance of a semiconductor device that can automatically and quickly perform an inspection and classification operation for each of the six surfaces of semiconductor devices.

The semiconductor device appearance inspection apparatus according to the present invention for achieving the above object includes a main body, a tray mounting table, first, second, third, fourth, and fifth tray carrier parts, a first vision inspector, a transfer device, and It includes a second vision inspector, a first picker, a third vision inspector, a second picker, a fourth vision inspector, and a sorting unit. The tray stacking table includes a loading unit for loading a tray containing semiconductor elements to be inspected, an empty tray supply unit for storing empty trays, a defective product storage unit for storing trays containing semiconductor devices classified as defective products, and a sorting process. It is provided in front of the main body, including a tray storage unit for storing a tray in which all semiconductor elements are discharged or only a defective semiconductor element is stored, and an unloading unit for storing a tray containing semiconductor elements classified as good products.

The first, second, third, fourth, and fifth tray carrier parts are respectively connected to the loading part, the empty tray supply part, the defective product storage part, the tray storage part, and the unloading part to transport the corresponding tray. The first vision inspector inspects a first surface of each semiconductor device stored in a tray transferred from the loading unit. The transfer is reciprocally installed between the first and fifth tray carriers at the rear upper side of the main body, and the semiconductor elements that have passed through the first vision checker are inverted upside down and moved to an empty tray. The second vision inspector inspects the second surface of each semiconductor element stored in the tray in an upside-down state via a transfer. The first picker reciprocates in the row direction parallel to the left-right direction from the upper side of the main body, picks up a plurality of semiconductor elements that have passed through the second vision inspector in a row unit from the corresponding tray and transfers them to the first side inspection area along the row direction. Return to the tray. The third vision inspector inspects the third and fourth surfaces of each semiconductor device transferred to the first side inspection area in a state picked up by the first picker. The second picker reciprocates in the row direction parallel to the left and right directions from the upper side of the main body, picks up a plurality of semiconductor elements that have passed through the third vision inspector in columns, and rotates them 90 degrees around the vertical axis along the row direction. After transferring to the second side inspection area, it is returned to the corresponding tray. The fourth vision inspector inspects the fifth and sixth surfaces of each semiconductor device transferred to the second side inspection area in a state picked up by the second picker. The sorting unit, in connection with the second picker, classifies the semiconductor elements that have been inspected into good and bad products and stores them in a corresponding tray.

According to the present invention, inspection and classification of all six surfaces of semiconductor devices can be performed automatically and quickly.

1 is a perspective view of a semiconductor device appearance inspection device according to an embodiment of the present invention.
FIG. 2 is a plan view of FIG. 1.
3 is a schematic configuration diagram of a semiconductor device appearance inspection device illustrated in FIG. 1.
FIG. 4 is an exploded perspective view of FIG. 1 taken from a first picker and a third vision inspector.
5 is an exploded perspective view of the first picker illustrated in FIG. 4.
6A and 6B are conceptual views for explaining an operation example of the first picker and the third vision inspector illustrated in FIG. 4.
FIG. 7 is an exploded perspective view of FIG. 1 taken from a second picker and a fourth vision inspector.
8A to 8C are conceptual views for explaining working examples of the second picker and the fourth vision inspector illustrated in FIG. 7.
9 is a perspective view of FIG. 1 taken from a transfer.
10 is a conceptual diagram illustrating an example of the operation of the transfer shown in FIG. 9.

If described in detail with reference to the accompanying drawings for the present invention. Here, the same reference numerals are used for the same components, and repeated descriptions and detailed descriptions of well-known functions and components that may unnecessarily obscure the subject matter of the present invention are omitted. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Therefore, the shape and size of elements in the drawings may be exaggerated for a clearer explanation.

1 is a perspective view of a semiconductor device appearance inspection device according to an embodiment of the present invention. FIG. 2 is a plan view of FIG. 1. 3 is a schematic configuration diagram of a semiconductor device appearance inspection device illustrated in FIG. 1.

1 to 3, the semiconductor device appearance inspection apparatus includes a main body 100, a tray mounting table 200, and first, second, third, fourth, and fifth tray carrier parts 310, 320, 330, and 340. , 350), the first, second, third, and fourth vision inspectors 410, 420, 430, 440, the transfer 500, the first and second pickers 600, 700, and the sorting unit 800. Includes.

The tray mounting table 200 is disposed in front of the main body 100. The tray mounting table 200 includes a loading unit 210, an empty tray supply unit 220, a defective product storage unit 230, a tray storage unit 240, and an unloading unit 250.

The loading unit 210 places trays in which semiconductor elements to be inspected are stored. Here, when the semiconductor device is a BGA type, it may be packaged in a hexahedron to form solder balls on one side. The semiconductor device may be accommodated in a tray with a surface on which solder balls are formed facing upward.

The empty tray supply unit 220 stores empty trays. The empty tray of the empty tray supply unit 220 may be supplied to the first waiting area 810 of the sorting unit 800 to receive defective semiconductor devices, or supplied to the transfer 500 to be used to invert the semiconductor devices vertically. .

The defective product storage unit 230 stores a tray containing semiconductor elements classified as defective products. The defective product storage unit 230 may receive and place the tray T1 in which semiconductor elements classified as defective products are received from the first waiting area 810. The tray T1 of the first waiting area 810 may be filled with semiconductor devices of a defective product and transferred to the defective product storage unit 230.

In the sorting process, the tray storage unit 240 stores a tray in which all semiconductor devices are discharged or only a defective semiconductor device is left. The tray storage unit 240 may receive and place the tray T3 from the buffer area 830. Here, the tray T3 may be a state in which all semiconductor elements are discharged during the sorting process, or only a defective semiconductor element may remain.

Alternatively, only one type of defective product among semiconductor devices stored in the tray T3 of the buffer area 830 is transferred to the tray T1 of the first standby area 810, and another type of defective product is transferred to the buffer area 830. It may be left in the tray T3 and transferred to the tray storage unit 240 to be stored. In this case, since the semiconductor devices can be classified into two types of defective products, serious defective products having solder ball defects are disposed of, and defective products having defective markings can be reworked through rework.

The unloading unit 250 stores a tray in which semiconductor elements classified as good products are stored. The unloading unit 250 may receive and place the tray T2 in which semiconductor elements classified as good products are received from the second waiting area 820. Semiconductor devices of good quality stored in the tray T2 of the second waiting area 820 may be packaged in a packaging unit (not shown).

The first, second, third, fourth, and fifth tray carrier units 310, 320, 330, 340, and 350 include a loading unit 210, an empty tray supply unit 220, a defective product storage unit 230, and a tray storage unit 240 ), respectively connected to the unloading unit 250 to transfer the tray. The first, second, third, fourth, and fifth tray carrier parts 310, 320, 330, 340, and 350 may be arranged in the left and right directions.

The first tray carrier unit 310 transfers the tray placed in the loading unit 210 to the rear of the main body 100. The second tray carrier unit 320 transfers the tray placed in the empty tray supply unit 220 to the rear of the main body 100. The third tray carrier unit 330 transfers the tray from the rear of the main body 100 to the defective product storage unit 230 through the first waiting area 810. The fourth tray carrier unit 340 transfers the tray from the rear of the main body 100 to the tray storage unit 240 through the buffer area 830. The fifth tray carrier unit 350 transfers the tray from the rear of the main body 100 to the unloading unit 250 through the second waiting area 820.

The first tray carrier part 310 includes a movable block that linearly reciprocates in the front-rear direction of the main body 100 while the tray is seated, rails that guide linear reciprocation of the movable block, and a linear actuator that linearly reciprocates the movable block. It can contain. The linear actuator may include a ball screw screwed to the lower side of the movable block, and a rotating motor that rotates the ball screw.

The second, third, fourth, and fifth tray carrier parts 320, 330, 340, and 350 may be configured in the same manner as the first tray carrier part 310. The first, second, third, fourth, and fifth tray carrier parts 310, 320, 330, 340, and 350 may be controlled by a control unit that controls the overall appearance inspection device of the semiconductor device.

The first vision inspector 410 inspects the first surface of each semiconductor device received in the tray conveyed by the first tray carrier unit 310 from the loading unit 210. The first surface of the semiconductor device corresponds to a surface on which solder balls are formed. The first vision inspector 410 may be configured such that the imaging portion is disposed downward, so that the state of the solder ball on the first surface of the semiconductor element accommodated in the tray can be two-dimensionally inspected.

The first vision inspector 410 may be installed to horizontally reciprocate in the left and right directions on the upper side of the body 100. The first vision inspector 410 is slidably supported in the left and right directions along a column fixed to the upper side of the main body 100, and can be horizontally reciprocated by a linear actuator. The linear actuator can be configured with a conventional linear actuator. The first vision inspector 410 may include a camera and image processing means for processing an image captured from the camera. The image processing means can also be mounted on the control unit. The first vision inspector 410 may include an illuminator, and photograph the first surface of the semiconductor device with the illuminator illuminated.

The transfer 500 is reciprocally installed between the first to fifth tray carrier parts 310, 320, 330, 340 and 350 on the rear upper side of the main body 100. The transfer 500 inverts the semiconductor elements that have passed through the first vision checker 410 upside down and moves them to an empty tray.

That is, the transfer 500 stacks the empty trays upside down on the top of the tray in which the semiconductor devices that have passed through the first vision checker 410 are stacked, and then inverts the stacked up and down semiconductor devices to the stacked state. Moving to the second vision checker 420 may function as a transfer. The transfer 500 is controlled by the control unit. The configuration of the transfer 500 will be described later.

The second vision inspector 420 inspects the second surface of the semiconductor elements stored in the tray in an upside-down state through the transfer 500. The second surface of the semiconductor device corresponds to the surface opposite to the surface on which the solder ball is formed.

The second vision inspector 420 inspects the second surface of each semiconductor device stored in the tray transferred to the sorting unit 800 through the first vision inspector 410. For example, although not shown, when the marking unit is installed between the first vision inspector 410 and the second vision inspector 420 to mark the identification code on the second surface of the semiconductor device, the second vision inspector 420 The marking state of the second surface of the semiconductor device can be two-dimensionally inspected. The image captured from the second vision inspector 420 may be processed by image processing means.

The second vision inspector 420 is installed to horizontally reciprocate in the left and right directions on the upper side of the main body 100, thereby reciprocating between the second tray carrier part 320 and the third tray carrier part 330. The second vision inspector 420 is slidably supported in the left and right directions along a column fixed to the upper side of the main body 100, and can be horizontally reciprocated by a linear actuator. The linear actuator can be configured with a conventional linear actuator. The second vision inspector 420 may be configured in the same way as the first vision inspector 410. The second vision inspector 420 may include an illuminator, and image the second surface of the semiconductor device with the illuminator illuminated.

The first picker 600 reciprocates in the row direction parallel to the left and right directions from the upper side of the main body 100. The first picker 600 picks up a plurality of semiconductor elements that have passed through the second vision checker 420 in units of rows from the corresponding tray, transfers them to the first side inspection area along the row direction, and returns them to the corresponding tray.

When a plurality of semiconductor elements are picked up in units of rows, each of the two side surfaces facing the column direction is exposed together. Semiconductor devices are inspected for the two exposed sides due to the arrangement of the first, second, third, fourth and fifth tray carrier parts 310, 320, 330, 340, 350 and the third vision inspector 430 It is optimal to have a path that is transported in the row direction. Therefore, the first picker 600 is configured to transfer the semiconductor elements along the row direction in a state where the semiconductor elements are picked up in rows.

For example, referring to FIGS. 4 and 5, the first picker 600 may include a nozzle assembly 610, a nozzle assembly lifting mechanism 620, and a picker base 630. The nozzle assembly 610 has a plurality of nozzles 611 arranged in a row along the row direction. Each nozzle 611 may be supplied with a negative pressure by the pneumatic supply means to adsorb the semiconductor element, and may be detached by receiving the positive pressure by the pneumatic supply means. The nozzles 611 may pick up a plurality of semiconductor elements from the tray at once and transfer them to the first side inspection area.

The nozzles 611 may be moved up and down independently of the nozzle bases 612 by nozzle lifting mechanisms. The nozzle lifting mechanism may include a nozzle lifting body 613 and an elastic member (not shown). The nozzle elevating body 613 is supported so as to be able to elevate with respect to the nozzle base 612 in a state where the nozzle 611 is fixed. The nozzle elevating body 613 is descended by receiving air pressure by a pneumatic supply means.

The elastic member exerts an elastic force in the direction of raising the nozzle elevating body 613 relative to the nozzle base 612, and when the air pressure applied to the nozzle elevating body 613 is released, the nozzle elevating body 613 is raised to the original height. . Therefore, the nozzle 611 may move up and down according to the lifting operation of the nozzle lifting body 613.

The nozzle assembly 610 may include a pitch variable mechanism 640 that changes the pitch between the nozzles 611 to match the pitch between semiconductor elements stored in the tray. The pitch variable mechanism 640 includes variable movable bodies 641, a foldable link 642, and a link actuator 643. The variable moving bodies 641 are respectively fixed to the nozzle bases 612 at a distance from each other and are slidably supported in the row direction to the nozzle support 614.

The foldable link 642 is hinged first link members 642a in a zigzag shape, and a second hinge-coupled hinged first link member 642a in a zigzag shape and hinged at a central portion, respectively. Link members 642b may be included. The central hinge coupling portions of the first link members 642a and the second link members 642b may be fixed to the variable moving bodies 641, respectively.

In the folding link 642, the hinge coupling portions of the first link members 642a are folded, and at the same time, the hinge coupling portions of the second link members 642b are folded, so that the first link members 642a and the second link are foldable. The pitch between the nozzles 611 may be reduced or increased as the central hinge coupling portions of the members 642b become closer or farther apart. As a result, the pitch between the nozzles 611 can be varied.

The link actuator 643 folds the folding link 642 by reciprocating the central hinge coupling portions of the first link members 642a and the second link members 642b in the row direction. The link actuator 643 may be formed of an actuator including a screw and a rotating motor, or a conventional linear actuator such as a pneumatic cylinder or a linear motor.

The nozzle assembly lifting mechanism 620 moves the nozzle assembly 610 up and down with respect to the picker base 630, thereby allowing the semiconductor elements to be picked up or picked up at a time as the nozzles 611 are raised and lowered at the same time. The nozzle assembly lifting mechanism 620 may include a lifting block 621 and a lifting actuator 622. The lifting block 621 is supported by the picker base 630 while being fixed to the nozzle support 614 of the nozzle assembly 610. The elevating actuator 622 elevates the elevating block 621 relative to the picker base 630. The lifting actuator 622 may be configured as a conventional actuator.

The picker base 630 is slidably supported in a row direction on a column fixed to the upper side of the main body 100, and allows the nozzle assembly 610 to horizontally reciprocate as it reciprocates horizontally by a linear actuator. The linear actuator can be configured with a conventional linear actuator. The first picker 600 described above is controlled by the control unit.

The third vision inspector 430 inspects the third and fourth surfaces of each semiconductor device transferred to the first side inspection area in a state picked up by the first picker 600. The third surface and the fourth surface of the semiconductor device correspond to two sides facing the column direction among the four sides of the semiconductor device as a reference in which the semiconductor device is accommodated in the tray.

When a plurality of semiconductor elements are picked up by the first picker 600 in a row unit and transferred to the first side inspection area, each of the third and fourth surfaces is exposed. The third vision inspector 430 inspects the third and fourth surfaces of the exposed semiconductor device. The third vision inspector 430 may perform a two-dimensional inspection of cracks, bubbles, metal exposure, scratches, foreign substances, and the like on the third and fourth surfaces of the semiconductor device.

As shown in FIG. 4, the third vision inspector 430 may include a pair of cameras 431 and 432 to inspect the third and fourth surfaces of the semiconductor device, respectively. The cameras 431 and 432 are arranged at intervals in the column direction in the first side inspection area to face the imaging regions. One camera 431 captures the third surface of the semiconductor element with the imaging portion facing forward, and the other camera 432 captures the fourth surface of the semiconductor element with the imaging portion facing backward. Images captured from the cameras 431 and 432 may be processed by image processing means. The third vision inspector 430 may include an illuminator, and may image the third and fourth surfaces of the semiconductor device with the illuminator, respectively.

The cameras 431 and 432 may linearly reciprocate in the column direction, respectively, by the camera movement mechanisms 433. The camera movement mechanism 433 may include a slider fixed to the corresponding cameras 431 and 432, a rail for guiding the slider to move in the column direction, and a linear actuator to linearly reciprocate the slider in the column direction. The linear actuator may be composed of a conventional actuator such as a pneumatic cylinder, a linear motor, or the like. The camera movement mechanisms 433 move the cameras 431 and 432 from a standby position to an imaging position set for each semiconductor device, so that the third and fourth surfaces of the semiconductor device can be captured.

The process of inspecting the third and fourth surfaces of each semiconductor device in connection with the above-described third vision inspector 430 and the first picker 600 will be described with reference to FIGS. 6A and 6B.

The first picker 600 picks up a plurality of semiconductor elements S arranged in the row direction from the corresponding tray T and transfers them between the cameras 431 and 432 along the row direction. Subsequently, the first picker 600 transfers the semiconductor elements S from the cameras 431 and 432 along the row direction to the corresponding tray T in the state in which the semiconductor elements S are picked up, and then picks up the corresponding tray T, The semiconductor elements S can be returned to their original positions on the tray T.

The second picker 700 reciprocates in the row direction parallel to the left and right directions from the upper side of the main body 100. The second picker 700 picks up a plurality of semiconductor elements that have passed through the third vision inspector 430 in units of columns from the corresponding tray and rotates them 90 degrees around the vertical axis to transfer them to the second side inspection area along the row direction. Then return to the tray.

When the semiconductor devices pass through the first, second, and third vision inspectors 410, 420, and 430, only two sides facing the row direction among the six faces of the trays are not inspected. Semiconductor devices need to be picked up in columns so that the two sides facing the row direction are exposed together. The semiconductor devices are exposed due to the arrangement relationship between the first, second, third, fourth, and fourth vision inspectors 440 and the third, second, third, fourth, and third trays 310, 320, 330, 340, and 350. It is optimal to have a path that is rotated 90 degrees around the vertical axis and then traversed in the row direction for inspection of the dog sides. Therefore, the second picker 700 is configured to pick up semiconductor elements in units of columns and rotate them 90 degrees around the vertical axis to transport them along the row direction.

For example, as illustrated in FIG. 7, the second picker 700 includes a nozzle assembly 610 of the first picker 600, a nozzle assembly lifting mechanism 620, a picker base 630, and a pitch variable mechanism ( It may include a nozzle assembly 710 each having the same configuration as 640, a nozzle assembly lifting mechanism 720, a picker base 730, and a variable pitch mechanism 740.

The second picker 700 further includes a rotator 750 for the picker. The picker rotator 750 rotates the nozzle assembly 710 forward and backward in a 90 degree range. The picker rotator 750 may include a movable shaft 751 and a rotator body 752 that rotates the movable shaft 751. The movable shaft 751 is fixed to the nozzle support 714 of the nozzle assembly 710, and the rotator body is fixed to the lifting block 721, so that the nozzle assembly 710 is lifted by rotation of the movable shaft 751 It can rotate about 721. Accordingly, the nozzles 711 may be arranged in the row direction by 90-degree rotation of the movable shaft 751 while being arranged in the column direction. The second picker 700 is controlled by the control unit.

The fourth vision inspector 440 inspects the fifth and sixth surfaces of each semiconductor device transferred to the second side inspection area in a state picked up by the second picker 700. The fifth side and the sixth side of the semiconductor element correspond to the other two side surfaces facing the row direction among the four side surfaces of the semiconductor element as a reference in which the semiconductor element is stored in the tray.

The semiconductor elements are picked up by a plurality of units by the second picker 700 and then transferred to the second side inspection area while being rotated 90 degrees around the vertical axis, each of the fifth and sixth surfaces being exposed. . The fourth vision inspector 440 inspects the fifth and sixth surfaces of the exposed semiconductor device. The fourth vision inspector 440 may perform a two-dimensional inspection of cracks, bubbles, metal exposure, scratches, foreign substances, and the like on the fifth and sixth surfaces of the semiconductor device.

As illustrated in FIG. 7, the fourth vision inspector 440 may include a pair of cameras 441 and 442 to inspect the fifth and sixth surfaces of the semiconductor device, respectively. The cameras 441 and 442 are arranged at intervals in the column direction in the second side inspection area so as to face the imaging parts. One camera 441 captures the fifth surface of the semiconductor element with the imaging portion facing forward, and the other camera 442 captures the sixth surface of the semiconductor element with the imaging portion facing rearward.

Images captured from the cameras 441 and 442 may be processed by image processing means. The fourth vision inspector 440 may include an illuminator, and may image the fifth and sixth surfaces of the semiconductor device with the illuminator, respectively. The cameras 441 and 442 of the fourth vision inspector 440 are in the column direction by the camera movement mechanisms 443 having the same configuration as the camera movement mechanisms 433 of the third vision inspector 430 described above. Each can be reciprocated linearly.

The process of inspecting the third and fourth surfaces of each semiconductor device in connection with the above-described fourth vision inspector 440 and the second picker 700 will be described with reference to FIGS. 7A to 7C.

The second picker 700 rotates the nozzles 711 arranged in the row direction 90 degrees around the vertical axis and arranges them in the column direction. Subsequently, the second picker 700 picks up a plurality of semiconductor elements S arranged in a column direction from the corresponding tray T by nozzles 711 and rotates them 90 degrees in the opposite direction around the vertical axis. It is transferred between the cameras 441 and 442 of the fourth vision inspector 440 along the direction. Subsequently, the second picker 700 transfers the semiconductor elements S from the cameras 441 and 442 to the corresponding tray T in the row direction after picking up the semiconductor elements S, and then rotates them 90 degrees in the opposite direction around the vertical axis. By picking up the corresponding tray T from the nozzles 711, the semiconductor elements S can be returned to the original position on the tray T.

The sorting unit 800, in conjunction with the second picker 700, classifies the semiconductor elements that have been inspected into good and bad products and stores them in a corresponding tray. The sorting unit 800 includes a first waiting area 810 for waiting the empty tray T1 transferred from the empty tray supply unit 220, and a second waiting area for waiting for the tray T2 in which semiconductor devices having been inspected are stored. 820, and a buffer area 830 for temporarily storing another tray T3 in which semiconductor devices having been inspected are stored. The sorting unit 800 may be disposed at the center side of the main body 100. The first and second waiting areas 810 and 820 and the buffer areas 830 may be arranged in left and right directions. The buffer area 830 may be disposed between the first waiting area 810 and the second waiting area 820.

The second picker 700 reciprocates between the first and second waiting areas 810 and 820 and the buffer area 830. The second picker 700 picks up a defective semiconductor device among semiconductor devices stored in the tray T2 of the second standby area 820 and stores it in the empty tray T1 of the first standby area 810, Among the semiconductor elements stored in the tray T3 of the buffer area 830, good-quality semiconductor elements are picked up and stored in the tray T2 of the second waiting area 820.

At this time, in the state where the inspection is completed, the payment information for each position of the semiconductor elements stored in the tray T2 of the second waiting area 820 and the tray T3 of the buffer area 830 is 1, 2, 3, 4, 5 Pre-stored in the control unit through the vision inspectors 410, 420, 430, 440, and 450, the control unit controls the second picker 700 based on the good and bad information for each location of the semiconductor elements to perform the above-described classification operation. It can be done.

In addition, the semiconductor device appearance inspection apparatus includes a fifth vision inspector 450 for three-dimensionally inspecting a first surface of semiconductor devices stored in a tray conveyed by the first tray carrier unit 310 from the loading unit 210. can do. The fifth vision inspector 450 recognizes the three-dimensional shape of the solder ball of the semiconductor device and inspects the height defect. The fifth vision inspector 450 includes a camera, and an image captured from the camera can be processed by image processing means. The fifth vision inspector 450 may include an illuminator, and may image the first surface of the semiconductor device with the illuminator illuminated.

The fifth vision inspector 450 may be installed to horizontally reciprocate in the left and right directions on the upper side of the main body 100. The fifth vision inspector 450 is slidably supported in the left and right directions along a column fixed to the upper side of the main body 100, and can be horizontally reciprocated by a linear actuator. The linear actuator can be configured with a conventional linear actuator.

For example, as illustrated in FIGS. 9 and 10, the transfer 500 is installed such that the transfer body 510 horizontally reciprocates in the left and right directions on the column 520 on the upper side of the body 100. The actuator for horizontally reciprocating and elevating the transfer body 510 may be configured as a conventional actuator.

The transfer 500 may include a gripper 530, upper and lower clamps 540 and 550, and a clamp rotator 560. The gripper 530 is installed to be elevated on the transfer body 510. The gripper 530 is configured to grip or release the tray as the pair of jaws 531 are narrowed or opened.

The upper and lower clamps 540 and 550 fix or release one tray or two stacked trays as they narrow or open each other. The upper clamp 540 may allow the tray to enter and exit as a pair of clamping members 541 are opened or narrowed. The lower clamp 550 may also allow the tray to enter and exit as the clamping members 551 are opened or narrowed. The upper and lower clamps 540 and 550 may be configured identically.

The clamp rotator 560 rotates the upper and lower clamps 540 and 550 together to invert the upper and lower clamps, thereby inverting the tray between the upper and lower clamps 540 and 550. Each actuator of the gripper 530, the upper and lower clamps 540, 550, and the clamp rotator 560 may be configured as a conventional actuator.

The process of inverting the semiconductor devices up and down by the transfer 500 will be described below.

First, the transfer body 510 moves to a position where the empty tray T4 is waiting. Subsequently, when the clamping members 551 of the lower clamp 550 are opened, the gripper 530 descends to hold the empty tray T4, and then ascends and positions it between the lower clamp 550 and the upper clamp 540. .

Subsequently, after the clamping members 551 of the lower clamp 550 are narrowed and the upper and lower clamps 540 and 550 are narrowed to fix the empty tray T4, the upper and lower clamps 540 and 550 are clamp rotators. It rotates 180 degrees by 560. Then, the empty tray T4 is inverted up and down. At the same time, the transfer body 510 moves to the tray T5 where the inspection by the first vision inspector 310 is completed.

Subsequently, after the gripper 530 descends and holds the empty tray T4, the clamping members 541 of the upper clamp 540 moving downward are opened. Subsequently, the gripper 530 stacks the empty trays T4 on top of the inspected trays T5, holds them together, and then rises to place them between the lower clamp 550 and the upper clamp 540.

Subsequently, the clamping members 541 of the upper clamp 540 are narrowed and the upper and lower clamps 540 and 550 are narrowed to fix the stacked trays T4 and T5, and then the upper and lower clamps 540 and 550 ) Is rotated 180 degrees by the clamp rotator 560. Then, the semiconductor elements of the tray T5 that have been inspected are inverted upside down and moved to the empty tray T4. At the same time, the transfer body 510 moves to the fourth tray transfer part 340 or the fifth tray transfer part 350.

Subsequently, the gripper 530 grips the stacked trays T4 and T5, and then the clamping members 551 of the lower clamp 550 are opened. Subsequently, the gripper 530 puts the tray T4 in which the semiconductor elements inverted up and down are stored in the fourth tray transfer part 340 or the fifth tray transfer part 350, and the empty tray T5 located at the upper side. After gripping, it is raised and placed between the lower clamp 550 and the upper clamp 540.

Subsequently, the clamping members 551 of the lower clamp 550 are narrowed and the upper and lower clamps 540 and 550 are narrowed to fix the empty tray T5. The empty tray T5 is used to transfer the semiconductor elements of the new tray, which have been inspected by the first vision inspector 410 and the fifth vision inspector 450, by the above-described processes.

The operation example of the above-described semiconductor device appearance inspection apparatus will be briefly described.

A plurality of trays in which semiconductor elements for carrying out inspection are stored are placed in the loading unit 210. At this time, the semiconductor elements may be accommodated in the tray with solder balls positioned on each first surface facing upward. Then, a plurality of empty trays are stacked on the empty tray supply unit 220, thereby preparing to perform the inspection.

In this state, when the semiconductor device appearance inspection device is operated, the empty tray of the empty tray supply unit 220 is transferred to the rear of the main body 100 by the second tray carrier unit 320. Then, the empty tray is transferred to the third tray carrier part 330 by the transfer 500, and then transferred to the first waiting area 810 of the sorting part 800 by the third tray carrier part 330. Wait. On the other hand, the other empty tray of the empty tray supply unit 220 is transferred to the rear of the main body 100 to wait for the upside down of the semiconductor elements.

The tray placed in the loading unit 210 is transferred to the first vision inspector 410 by the first tray carrier unit 310, and the first vision inspector 410 is the first of each of the semiconductor elements stored in the tray. Two-dimensional inspection of the state of the solder ball located on the surface. The tray, which has been inspected by the first vision inspector 410, is transferred to the fifth vision inspector 450 by the first tray carrier unit 310, and the fifth vision inspector 450 is configured for the semiconductor devices stored in the tray. By detecting the three-dimensional shape of the solder ball, three-dimensional inspection of height defects and the like can be performed.

The semiconductor elements of the tray, which have been inspected by the fifth vision inspector 450, are inverted upside down by the transfer 500 described above and moved to the empty tray. The tray in which the semiconductor elements inverted up and down are accommodated is transferred to the fourth tray carrier portion 340 by the transfer 500, and then transferred to the second vision inspector 420 by the fourth tray carrier portion 340. The second vision inspector 420 may perform a two-dimensional inspection of the marking state of the second surface of the semiconductor device.

The semiconductor elements of the tray that have been inspected by the second vision inspector 420 are transferred to the first picker 600 by the fourth tray carrier part 340. The first picker 600 picks up a plurality of semiconductor elements in a row unit from the tray, transfers them to the third vision inspector 430 along the row direction, and then returns them to the tray from the third vision inspector 430. At this time, the third vision inspector 430 may perform a two-dimensional inspection of cracks, bubbles, metal exposure, scratches, foreign substances, and the like on the third and fourth surfaces of the semiconductor device picked up by the first picker 600. have.

The semiconductor devices that have been inspected by the third vision inspector 430 are transferred to the second picker 700 by the fourth tray carrier 340 while being accommodated in the tray. The second picker 700 picks up a plurality of semiconductor elements from the tray in units of columns, rotates them about a vertical axis, transfers them to the fourth vision inspector 440 along the row direction, and then corresponds to the fourth vision inspector 440. Return to the tray. At this time, the fourth vision inspector 440 may perform a two-dimensional inspection of cracks, bubbles, metal exposure, scratches, foreign substances, and the like on the fifth and sixth surfaces of the semiconductor device picked up by the second picker 700. have. The semiconductor devices, which have been inspected by the fourth vision inspector 440, wait in the second waiting area 820 of the sorting unit 800 while being accommodated in the tray.

Subsequently, the subsequent tray in which the semiconductor elements for performing the inspection are accommodated is inspected through the first vision inspector 410 and the fifth vision inspector 450 in the same manner as the above-described processes, and then moved up and down by the transfer 500. Inverted and transferred to an empty tray. The tray in which the semiconductor elements inverted up and down are accommodated is transferred to the fifth tray carrier part 350 by the transfer 500, and then transferred to the second vision inspector 420 by the fifth tray carrier part 350. The second vision inspector 420 inspects the second surface of the semiconductor device.

After the semiconductor devices that have been inspected by the second vision inspector 420 are transferred to the first picker 600 by the fifth tray carrier unit 350 in a state stored in the tray, the first picker 600 and the first 3 Each third and fourth surfaces are inspected by the vision inspector 430. Subsequently, after the semiconductor devices, which have been inspected by the third vision inspector 430, are transferred to the second picker 700 by the fifth tray carrier unit 350 in a state stored in the tray, the second picker 700 is transferred. And the fifth and sixth surfaces are inspected by the fourth vision inspector 440. The semiconductor devices, which have been inspected by the fourth vision inspector 440, wait in the second waiting area 820 of the sorting unit 800 while being accommodated in the tray.

If there is no defective product among the semiconductor elements accommodated in the tray of the second waiting area 820, the tray T2 of the second waiting area 820 is unloaded by the fifth tray carrier 350. 250) and can be deposited.

Meanwhile, when a defective product is present among the semiconductor elements stored in the tray T2 of the second standby area 820, the second picker 700 is the semiconductor stored in the tray T2 of the second standby area 820. A defective product among elements is picked up and stored in the empty tray T1 of the first waiting area 810, and a good quality of semiconductor devices stored in the tray T3 of the buffer area 830 is picked up and the second waiting area ( The sorting operation to be received in the tray T2 of 820 is performed.

Due to this sorting operation, when the tray T2 of the second waiting area 820 is completely filled with good products, the tray T2 containing the good products is unloaded by the fifth tray carrier 350. ) To be deposited. When the tray T1 of the first waiting area 810 is completely filled with defective products, the tray T1 containing the defective products is transferred to and stored in the defective product storage unit 230 by the third tray carrier unit 330. . When a good product no longer exists in the tray T3 of the buffer area 830 or only a defective product remains, the tray T3 in which the empty or only defective product remains is transferred to the tray storage unit 240 and stored.

The present invention has been described with reference to one embodiment shown in the accompanying drawings, but this is only exemplary, and those skilled in the art can understand that various modifications and other equivalent embodiments are possible therefrom. Will be able to. Therefore, the true protection scope of the present invention should be defined only by the appended claims.

100..Body
200..tray stack
310, 320, 330, 340, 350..1, 2, 3, 4, 5 tray carrier part
410, 420, 430, 440,450..1,2,3,4,5 vision checker
500..Transfer
600..First picker
700..2nd picker
800..Sorting

Claims (4)

main body;
The loading unit for stacking the tray in which the semiconductor elements to be inspected is stored, the empty tray supply unit for storing the empty tray, the defective product storage unit for storing the tray in which the semiconductor elements classified as defective products are stored, and the semiconductor element in the sorting process. A tray storage unit for storing a tray in which all the discharged or defective semiconductor elements remain, and an unloading unit for storing trays in which semiconductor elements classified as good products are stored; a tray mounting table disposed in front of the main body;
A first, second, third, fourth, and fifth tray carrier part connected to the loading part, the empty tray supply part, the defective product storage part, the tray storage part, and the unloading part to transfer the corresponding tray;
A first vision inspector for inspecting a first surface of each semiconductor element accommodated in a tray transferred from the loading unit;
A transfer which is installed reciprocally between the first to fifth tray carriers at the rear upper side of the main body, and moves semiconductor devices that have passed through the first vision checker upside down to move to an empty tray;
A second vision inspector that inspects a second surface of each semiconductor element stored in the tray in an inverted state up and down through the transfer;
It reciprocates in the row direction parallel to the left and right direction from the upper side of the main body, picks up a plurality of semiconductor elements that have passed through the second vision inspector in a row unit from the corresponding tray, transfers them to the first side inspection area along the row direction, and then applies the corresponding tray. A first picker to return to;
A third vision inspector that inspects a third surface and a fourth surface of each semiconductor device transferred to the first side inspection area in a state picked up by the first picker;
It reciprocates in the row direction parallel to the left and right directions from the upper side of the main body, picks up a plurality of semiconductor elements that have passed through the third vision inspector in columns, and rotates them 90 degrees around the vertical axis to rotate along the second direction. A second picker that returns to the corresponding tray after transferring to the side inspection area;
A fourth vision inspector inspecting the fifth and sixth surfaces of each semiconductor device transferred to the second side inspection area in a state picked up by the second picker; And
Includes, in conjunction with the second picker, a sorting unit for classifying the semiconductor elements that have been inspected into good and bad products and storing them in a corresponding tray.
The first picker is arranged in one row along the row direction, a nozzle assembly having a plurality of nozzles for adsorbing and detaching semiconductor elements by pneumatic supply means, and a column fixed to an upper side of the main body can slide in the row direction A picker base for horizontally reciprocating the nozzle assembly as it reciprocates horizontally by a linear actuator in a supported state, and a nozzle assembly elevating mechanism for raising and lowering the nozzle assembly relative to the picker base;
The third vision inspector includes a pair of cameras arranged to be spaced apart in the first side inspection area in the column direction so as to face the imaging parts, and inspects the third and fourth surfaces of the semiconductor device, respectively, and the corresponding camera. Camera moving mechanisms for linearly reciprocating each in the column direction;
The second picker is arranged in one row along the row direction, a nozzle assembly having a plurality of nozzles for adsorbing and detaching semiconductor elements by pneumatic supply means, and a column fixed to an upper side of the main body can slide in the row direction A picker base that horizontally reciprocates the nozzle assembly as it reciprocates horizontally by a linear actuator in a supported state, a nozzle assembly elevating mechanism that raises and lowers the nozzle assembly relative to the picker base, and the nozzle assembly in a range of 90 degrees. And a rotating picker rotator;
The fourth vision inspector is a pair of cameras arranged to be spaced apart in the column direction in the second side inspection area so as to face the imaging parts, and inspects the fifth and sixth surfaces of the semiconductor device, respectively. Camera moving mechanisms for linearly reciprocating each in the column direction;
The transfer,
The transfer body is installed in the column on the upper side of the main body to be horizontally reciprocated in the horizontal direction by an actuator,
A gripper configured to grip or release the tray as the pair of jaws are narrowed or opened, and installed to be elevated on the transfer body,
Upper and lower clamps for fixing or releasing one tray or two stacked trays as they are narrowed or widened apart from each other, but for entering and exiting the tray as a pair of clamping members are widened or narrowed,
Including the rotator for the clamp to rotate the upper and lower clamps together to reverse up and down to invert the tray between the upper and lower clamps up and down,
The semiconductor device appearance characterized by moving the semiconductor devices that have been inverted up and down to an empty tray by stacking the empty trays upside down and stacking them on top of the tray in which the semiconductor devices having undergone the first vision inspector are stacked. Inspection device.
According to claim 1,
The sorting unit,
A first waiting area for waiting for an empty tray to be transferred from the empty tray supply unit, a second waiting area for waiting for a tray in which the inspected semiconductor elements are stored, and a buffer area for temporarily storing another tray in which the inspected semiconductor elements are stored. It includes;
The second picker,
Reciprocating between the first and second waiting areas and the buffer areas, picking up a defective semiconductor device among semiconductor devices stored in the tray of the second waiting area and storing the defective semiconductor devices in an empty tray of the first waiting area, and the buffer area Apparatus for inspecting the appearance of a semiconductor device, characterized in that a semiconductor device of good quality is picked up and stored in a tray in the second waiting area among semiconductor devices stored in the tray of the device.
delete According to claim 1,
The first vision inspector performs two-dimensional inspection of the first surface of each semiconductor device;
And a fifth vision inspector for three-dimensionally inspecting the first surface of each semiconductor element stored in the tray transferred from the loading unit.

Images