TWI388816B - Image detection system for semiconductor components - Google Patents

Image detection system for semiconductor components Download PDF

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TWI388816B
TWI388816B TW97119137A TW97119137A TWI388816B TW I388816 B TWI388816 B TW I388816B TW 97119137 A TW97119137 A TW 97119137A TW 97119137 A TW97119137 A TW 97119137A TW I388816 B TWI388816 B TW I388816B
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rail
tray
unloading
image
loading
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TW97119137A
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TW200848719A (en
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Ssang-Gun Lim
Sang-Yun Lee
Byeong-Gwon Joo
Dong-Kyu Son
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Intekplus Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements

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  • General Physics & Mathematics (AREA)
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Description

半導體元件的影像檢測系統Image detection system for semiconductor components

本發明係有關於一種半導體元件的影像檢測系統,尤指一種半導體元件的影像檢測系統,其具備可將半導體元件之移送及分類功能一體化之拾取器模組,無須其他分類區域即可將半導體元件直接分類至移送軌上之托盤,藉此簡化裝置構成並可縮減裝備尺寸。The present invention relates to an image detecting system for a semiconductor device, and more particularly to an image detecting system for a semiconductor device, which is provided with a pick-up module capable of integrating a semiconductor element transfer and sorting function, and can be used without any other classification region. The components are sorted directly to the pallet on the transfer rail, thereby simplifying the device configuration and reducing the size of the equipment.

記憶體模組、涵蓋半導體元件,係在經過一連串步驟之製造後,當出貨時已經完成精密之檢測。由於影響半導體元件性能的,不僅是半導體元件封裝內部之不良,即使在外觀產生微小缺陷亦會對性能造成致命性之影響,因此該精密檢測中,不僅進行電氣性動作檢測,亦使用影像攝影機進行外觀檢測等各種檢測。The memory module, which covers the semiconductor components, is manufactured after a series of steps and has been accurately tested at the time of shipment. Since the performance of the semiconductor element is affected, not only is the inside of the semiconductor element package defective, but even if a small defect in the appearance has a fatal effect on performance, the precision detection is performed not only by electrical action detection but also by an image camera. Various tests such as appearance inspection.

一般而言,半導體元件之外表缺陷,特別是BGA(Ball Grid Array:球狀矩陣)及引線之缺陷,在將半導體元件組裝於PCB(Printed Circuit Board:印刷電路板)等之過程中亦會產生,因此引線或球之狀態檢測極為重要。In general, defects in semiconductor components, particularly BGA (Ball Grid Array) and lead defects, are also generated in the process of assembling semiconductor components on a PCB (Printed Circuit Board). Therefore, the detection of the state of the lead or ball is extremely important.

第二圖係表示習知技術之半導體元件之外觀檢測系統之一例的構成圖。The second drawing is a configuration diagram showing an example of an appearance detecting system of a semiconductor element of the prior art.

根據該技術,半導體元件之影像檢測系統,係構成由:將欲進行影像檢測之托盤載入並具備於本體前方的裝載部100、在本體之前方部配置於裝載部100之一側並進行正常品元件或不良品元件分類的分類部200、配備於 本體之上部並清潔欲進行影像檢測之半導體元件的清潔部300、檢測在清潔部300清潔後之半導體元件前/背面的影像檢測部400、拾取欲進行影像檢測之半導體元件並進行移送的移送拾取器500、導引移送拾取器500沿左右水平移動的移送拾取器移動部600、積載收納完成影像檢測之半導體元件之緩衝托盤與收納良品半導體元件之托盤的卸載部700、積載空托盤的空托盤部800、依據影像檢測結果分類收納不良品元件的不良品部900、依據影像檢測結果進行半導體元件分類的分類裝置910、以及在經過裝載區域所供給之托盤中將空托盤移送至卸載部700的再循環部1000。According to this technique, the image detecting system of the semiconductor element is configured such that the loading unit 100 that is loaded in the tray to be image-detected and provided in front of the main body is disposed on one side of the mounting unit 100 in front of the main body, and is normally Classification unit 200 for product component or defective component classification The cleaning unit 300 for cleaning the semiconductor element to be image-detected on the upper portion of the main body, the image detecting unit 400 for detecting the front/back surface of the semiconductor element after the cleaning unit 300 is cleaned, and the transfer pickup for picking up the semiconductor element to be image-detected and transferring the same The transfer device 500, the transfer picker moving unit 600 that horizontally moves left and right, the buffer tray for storing the semiconductor element for image detection, the unloading unit 700 for storing the tray of the good semiconductor element, and the empty tray for stacking the empty tray The unit 800 classifies the defective component 900 that stores the defective component based on the image detection result, the sorting device 910 that classifies the semiconductor component based on the image detection result, and the empty tray is transferred to the unloading section 700 in the tray supplied through the loading area. Recycling section 1000.

藉由此種構成,半導體元件之影像檢測系統係移送收納有欲接受影像檢測之半導體元件的托盤,並在使用移送拾取器拾取半導體元件期間,使用影像攝影機進行影像檢測,且使用再循環機構將半導體元件經全部拾取後之空托盤移送至緩衝部。With such a configuration, the image detecting system of the semiconductor element transfers the tray in which the semiconductor element to be image-detected is stored, and performs image detection using the image camera while picking up the semiconductor element using the transfer picker, and uses a recirculation mechanism The semiconductor element is transferred to the buffer portion via the empty tray that has been completely picked up.

接著,若已完成檢測之半導體元件為良品,則收納於卸載部之托盤,若為不良品則以卡槽方式分類收納於不良品部之不良品托盤。Then, when the semiconductor element that has been inspected is a good product, the tray stored in the unloading unit is sorted and stored in the defective product tray in the defective portion by a slot type if it is a defective product.

此外,卸下不良品元件後之空托盤,便使用作為緩衝托盤。In addition, the empty tray after removing the defective component is used as a buffer tray.

此處,不良品托盤係以賦予特有識別ID且可讀取以卡槽方式所插入之半導體元件之特有識別ID的方式所構成,作業者即使不以手動逐一取出以肉眼檢測,亦可透過監視器以肉眼檢測與產生不良之該元件相關的影像檢測結果,具有在監測不良品之同時亦可連續實施後續托盤之檢 測的優點。Here, the defective product tray is configured to provide a unique identification ID and to read the unique identification ID of the semiconductor element inserted by the card slot method, and the operator can monitor through the naked eye without manually taking out one by one. The visual inspection results related to the defective component are visually detected, and the subsequent tray inspection can be continuously performed while monitoring the defective product. The advantages of measurement.

然而,上述技術中,係於本體之上部,分別另外具備有:用以將欲進行影像檢測之半導體元件移送至影像檢測部並將經影像檢測後之半導體元件移送至卸載部之托盤的移送拾取器、與將所移送之半導體元件依據影像檢測結果進行分類的分類裝置這兩者。However, in the above technique, the upper part of the main body is separately provided with a transfer pick-up for transferring the semiconductor element to be image-detected to the image detecting unit and transferring the image-detected semiconductor element to the unloading unit. And a classifying device that classifies the transferred semiconductor elements according to image detection results.

如此,由於根據影像檢測結果進行不良品及良品分類之分類區域會占據本體前方,且不良品托盤係供給至該分類區域,因此會產生占據諸多作業空間而無法有效利用設置空間的問題。As described above, since the classified area in which the defective product and the good product are classified based on the image detection result is occupied in front of the main body, and the defective product tray is supplied to the classified area, there is a problem that a large amount of work space is occupied and the installation space cannot be effectively utilized.

本發明乃有鑒於上述實情而完成者。其目的在於提供一種半導體元件的影像檢測系統,由於該系統具備拾取器模組,其係將裝載托盤、不良品托盤、及卸載托盤分別移送及裝載至配備於本體之前後方向的各移送軌上,且將半導體元件移送及分類功能一體化,並藉由影像檢測結果將不良品或良品之半導體元件分別分類於不良品托盤與卸載托盤,因此無須另外之分類區域並使用將分類及移送功能一體化之裝備,藉此可簡化裝置之構成且能縮減作業空間並減少裝備尺寸。The present invention has been completed in view of the above circumstances. The object of the invention is to provide an image detecting system for a semiconductor component, which is provided with a pick-up module for transferring and loading a loading tray, a defective tray, and an unloading tray to respective transfer rails disposed in a front-rear direction of the body. And the semiconductor component transfer and classification functions are integrated, and the semiconductor components of the defective product or the good product are respectively classified into the defective product tray and the unloading tray by the image detection result, so that the classification and transfer functions are not required to be used separately. The equipment can simplify the structure of the device and reduce the working space and reduce the size of the equipment.

為達成上述目的,本發明係一種拍攝半導體元件表面影像,並根據拍攝結果自動檢測有無不良的影像檢測系統,其構成為具備:本體;裝載部及卸載部,其係以相互對稱配備於該本體之前方兩側,並以能使複數個托盤上升或下降之方式積載;裝載軌,其係配備於該裝載部之後方並可沿前後方向移送托盤;卸載軌,其係配備於該卸載部 之後方並可沿前後方向移送卸載托盤;再循環部,其係配備於該本體之後方並可將裝載軌上之空托盤移送至該卸載軌;影像檢測裝置,其係配備於該裝載軌與卸載軌之間,並由拍攝半導體元件之前/背面影像的一對影像攝影機所構成;不良品軌,其係配備於該卸載軌與該影像檢測裝置之間,並移送不良品托盤;以及拾取器模組,進行移送及分類功能,其係從該裝載軌上之托盤拾取半導體元件並進行移送以使影像檢測裝置進行影像檢測,並拾取業已完成影像檢測之半導體元件,根據有無不良移送分類至卸載軌上之卸載托盤或不良品軌上之不良品托盤。In order to achieve the above object, the present invention is an image detecting system that detects a surface image of a semiconductor element and automatically detects the presence or absence of a defect based on the shooting result, and is configured to include: a body; a loading portion and an unloading portion, which are symmetrically disposed on the body The two sides of the front side are stowed in such a manner that a plurality of trays can be raised or lowered; the loading rail is equipped behind the loading portion and can be transferred in the front-rear direction; the unloading rail is equipped in the unloading portion Thereafter, the unloading tray can be transferred in the front-rear direction; the recirculation portion is disposed behind the body and can transfer the empty tray on the loading rail to the unloading rail; and the image detecting device is equipped with the loading rail and Between the unloading rails, and consisting of a pair of video cameras for capturing the front/back image of the semiconductor component; a defective track, which is disposed between the unloading rail and the image detecting device, and transporting the defective tray; and the pickup The module performs the transfer and sorting function, which picks up and transfers the semiconductor component from the tray on the loading rail to cause the image detecting device to perform image detection, and picks up the semiconductor component that has completed image detection, and sorts to unload according to whether or not the defective transfer is performed. Unloading tray on the rail or defective tray on the defective rail.

此處,該拾取器模組係以一對配備於前後方向,並交互實施半導體元件之移送及分類作業。Here, the pickup module is provided in a pair of front and rear directions, and performs transfer and sorting operations of the semiconductor elements in an interactive manner.

藉由後述最佳之實施例及其圖式,將可更清楚的解釋本發明。以下,使用實施例以業界人士容易理解並可再現之方式詳細說明本發明。The invention will be more clearly explained by the preferred embodiments described hereinafter and the drawings thereof. Hereinafter, the present invention will be described in detail using the embodiments in a manner that is easily understood and reproduced by those skilled in the art.

第一圖係表示本發明之半導體元件影像檢測系統的構成圖。本發明係有關於一種拍攝半導體元件表面影像,並根據拍攝結果自動檢測有無不良的影像檢測系統。The first figure shows the configuration of a semiconductor element image detecting system of the present invention. The present invention relates to an image detecting system that takes a surface image of a semiconductor element and automatically detects the presence or absence of a defect based on the shooting result.

本發明之半導體元件影像檢測系統,係具備本體1、裝載部11、卸載部12、裝載軌111、卸載軌121、不良品軌13、再循環部14、影像檢測裝置15、以及拾取器模組16而構成。The semiconductor element image detecting system of the present invention includes a main body 1, a loading unit 11, an unloading unit 12, a loading rail 111, an unloading rail 121, a defective rail 13, a recirculation portion 14, an image detecting device 15, and a pickup module. 16 constitutes.

此處,裝載部(Loading)11與卸載部(Good)12,由於係以相互對稱備於本體1之前方兩側,並以能使複數個托盤上升或下降之方式積載,因此於裝載 部11係積載業已收納欲進行影像檢測之半導體元件的托盤。Here, the loading portion 11 and the unloading portion 12 are mounted on both sides of the body 1 in a symmetrical manner with each other, and are stowed so that a plurality of trays can be raised or lowered. The part 11 is a tray in which a semiconductor element for image detection is stored.

接著,供給至不良品軌13並已收納有良品半導體元件之托盤(Tray)係被移送並積載於卸載部12。Next, a tray (Tray) that has been supplied to the defective rail 13 and in which the good semiconductor element is housed is transferred and accumulated in the unloading unit 12.

於裝載部11之後方,以能沿前後方向移送托盤之方式,沿前後方向配備裝載軌111。於卸載部12之後方,具備可沿前後方向移送收納良品元件之托盤的卸載軌121。After the loading unit 11, the loading rail 111 is provided in the front-rear direction so that the tray can be transferred in the front-rear direction. After the unloading unit 12, an unloading rail 121 that can transfer the tray in which the good component is stored in the front-rear direction is provided.

又,於本體1後方之裝載軌111與卸載軌121之間,具備將裝載軌111上之空托盤移送至卸載軌121的再循環部14。Further, a recirculation portion 14 for transferring the empty tray on the loading rail 111 to the unloading rail 121 is provided between the loading rail 111 and the unloading rail 121 behind the main body 1.

又,於裝載軌111與卸載軌121之間,配備用以拍攝半導體元件之前/背面影像之一對影像攝影機,構成影像檢測裝置15。Further, between the loading rail 111 and the unloading rail 121, a pair of image cameras for capturing the front/back image of the semiconductor element are provided, and the image detecting device 15 is formed.

又,於卸載軌121與影像檢測裝置15之間,配備不良品軌13,並根據以影像檢測裝置15進行影像檢測之結果,來裝載及移送收納不良品的不良品托盤(Reject)。Further, a defective product rail 13 is provided between the unloading rail 121 and the image detecting device 15, and a defective product tray (Reject) for storing defective products is loaded and transferred based on the result of image detection by the image detecting device 15.

此外,根據本發明之形態特徵,拾取器模組16係構成為可沿本體1之左右及上下方向驅動,且將移送及分類功能一體化。Further, according to the morphological feature of the present invention, the pickup module 16 is configured to be driven along the left and right and up and down directions of the main body 1, and to integrate the transfer and sorting functions.

換言之,本發明之拾取器模組16,係以從裝載軌111上之托盤拾取半導體元件,並以由影像檢測裝置15進行影像檢測的方式來移送,又,拾取完成影像檢測之半導體元件,根據有無不良,進行移送分類至卸載軌121 上之卸載托盤或不良品軌13上之不良品托盤。In other words, the pickup module 16 of the present invention picks up the semiconductor component from the tray on the loading rail 111, and transfers the image by the image detecting device 15, and picks up the semiconductor component for image detection. Whether there is any defect, the transfer classification is performed to the unloading rail 121 The unloading tray on the unloading tray or the defective product rail 13 is attached.

此處,係於前後方向配備一對拾取器模組16,在其中任一側之拾取器模組根據影像檢測結果進行半導體元件分類之期間,其中另一側之拾取器模組即從由裝載部11移送至裝載軌111上之托盤拾取半導體元件,並進行其影像檢測。Here, a pair of pickup modules 16 are disposed in the front-rear direction, and the pick-up module on either side picks up the semiconductor components according to the image detection result, and the pick-up module on the other side is loaded from The portion 11 transfers to the tray on the loading rail 111 to pick up the semiconductor element and perform image detection thereof.

此處,不良品托盤係構成被賦予特有識別ID,且可讀取以卡槽方式插入之半導體元件之特有識別ID。Here, the defective product tray is configured to be given a unique identification ID, and the unique identification ID of the semiconductor element inserted in the card slot can be read.

藉此,作業者不需以手動逐一取出以肉眼檢測,即可透過監視器以肉眼檢測對產生不良之該元件的影像檢測結果,在監測不良品之同時亦可連續實施後續托盤之檢測。針對該不良品托盤,由於在本申請人之韓國專利第10-2006-0043900有詳細記述,因此省略有關其構成及作用之說明。Thereby, the operator does not need to manually take out one by one to detect with the naked eye, and can visually detect the image detection result of the defective component through the monitor, and can continuously perform the detection of the subsequent tray while monitoring the defective product. The defective product tray is described in detail in Korean Patent No. 10-2006-0043900, the entire disclosure of which is hereby incorporated by reference.

另一方面,較佳為在裝載軌111與影像檢測裝置15之間,進一步具備清潔機構17,在進行影像檢測之前用以清潔半導體元件表面。On the other hand, it is preferable to further include a cleaning mechanism 17 between the loading rail 111 and the image detecting device 15 to clean the surface of the semiconductor element before performing image detection.

換言之,於半導體元件表面若吸附微細灰塵或污染物等異物時,由於可將該半導體元件因異物而判別為不良,因此較佳為以清潔機構除去吸附在半導體表面之異物,藉此消除檢測錯誤之原因。In other words, when foreign matter such as fine dust or contaminants is adsorbed on the surface of the semiconductor element, the semiconductor element can be judged to be defective due to foreign matter. Therefore, it is preferable to remove foreign matter adsorbed on the semiconductor surface by a cleaning mechanism, thereby eliminating detection errors. The reason.

如此,本發明之半導體元件影像檢測系統,藉由使拾取器模組兼具半導體元件之移送及分類功能,即可簡化裝備之構成。As described above, the semiconductor element image detecting system of the present invention can simplify the configuration of the equipment by allowing the pickup module to have both the transfer and classification functions of the semiconductor elements.

此外,由於並不另外具備分類裝備,因此不須分類區 域,裝備中分類區域所占據之面積的部分即可減少,而可縮減裝備尺寸。In addition, since there is no separate classification equipment, there is no need for a classification area. The area, the area occupied by the classified area in the equipment can be reduced, and the size of the equipment can be reduced.

又,由於拾取器模組兼具移送及分類之功能,因此相較於既有之分別另外具備分類裝置與移送裝置來運用的方式,便可使裝備運用方式單純化。Moreover, since the pickup module has the functions of transfer and sorting, the equipment operation mode can be simplistic compared to the existing method of separately providing the sorting device and the transfer device.

以上係根據圖式舉出具體實施例來說明本發明,惟本發明並不侷限於此等實施例,業界人士應可了解在不超出本發明之範圍的限度內可進行各種變更。是以,本發明之範圍應以此種包含各種變形例之方式藉由所記述之申請專利範圍來解析。The present invention has been described with reference to the accompanying drawings, and the invention is not limited thereto, and it is understood that various modifications may be made without departing from the scope of the invention. Therefore, the scope of the present invention should be construed by the scope of the appended claims.

本發明並不具備另外之分類區域,而於沿本體之前後方向所具備之各移送軌上,具備裝載托盤、不良品托盤、及卸載托盤,並使用將移送及分類功能一體化之拾取器模組,從裝載部拾取半導體元件後進行移送以供影像檢測,根據影像檢測結果直接將半導體元件分類至不良品托盤及卸載托盤。The present invention does not have another classification area, and has a loading tray, a defective product tray, and an unloading tray on each of the transfer rails provided in the front and rear directions of the main body, and uses a pickup mold that integrates the transfer and classification functions. The group picks up the semiconductor component from the loading section, transfers it for image detection, and directly classifies the semiconductor component into the defective product tray and the unloading tray based on the image detection result.

藉此,由於將不良品及良品之半導體元件分類至各移送軌上之托盤,因此無須另外的分類區域,故可簡化裝置之構成,且可縮減作業空間並減少裝備尺寸。Thereby, since the defective semiconductor product and the good semiconductor component are sorted into the trays on the respective transfer rails, the separate classification area is not required, so that the configuration of the apparatus can be simplified, and the working space can be reduced and the size of the equipment can be reduced.

惟,以上所述,僅為本發明最佳之一的具體實施例之詳細說明與圖式,惟本發明之特徵並不侷限於此,並非用以限制本發明,本發明之所有範圍應以下述之申請專利範圍為準,凡合於本發明申請專利範圍之精神與其類似變化之實施例,皆應包含於本發明之範疇中,任何熟悉該項技藝者在本發明之領域內,可輕易思及之變化或修飾皆可涵蓋在以下本案之專利範圍。However, the above description is only a detailed description of the preferred embodiments of the present invention, and the present invention is not limited thereto, and is not intended to limit the present invention. The scope of the patent application is subject to the scope of the present invention, and any one skilled in the art can easily include it in the field of the present invention. Any changes or modifications considered may be covered by the patents in this case below.

1‧‧‧本體1‧‧‧ Ontology

11‧‧‧裝載部11‧‧‧Loading Department

111‧‧‧裝載軌111‧‧‧ loading rail

12‧‧‧卸載部12‧‧‧Unloading Department

121‧‧‧卸載軌121‧‧‧Unloading rail

13‧‧‧不良品軌13‧‧‧Dangerous product track

14‧‧‧再循環部14‧‧‧Recycling Department

15‧‧‧影像檢測裝置15‧‧‧Image detection device

16‧‧‧拾取器模組16‧‧‧ picker module

17‧‧‧清潔機構17‧‧‧ Cleaning institutions

(習知部分)(previous part)

裝載部‧‧‧100Loading Department ‧‧100

分類部‧‧‧200Classification Department ‧‧200

清潔部‧‧‧300Cleaning Department ‧ ‧ 300

影像檢測部‧‧‧400Image Inspection Department ‧‧400

移送拾取器‧‧‧500Transfer picker ‧‧500

移送拾取器移動部‧‧‧600Transfer Picker Moving Department ‧‧600

卸載部‧‧‧700Unloading Department ‧‧700

空托盤部‧‧‧800Empty tray department ‧‧800

不良品部‧‧‧900Department of Defectives ‧‧900

分類裝置‧‧‧910Sorting device ‧‧‧910

再循環部‧‧‧1000Recycling Department ‧‧‧1000

第一圖係表示本發明之半導體元件影像檢測系統的構成圖。The first figure shows the configuration of a semiconductor element image detecting system of the present invention.

第二圖係表示習知技術之半導體元件之外觀檢測系統之一例的構成圖。The second drawing is a configuration diagram showing an example of an appearance detecting system of a semiconductor element of the prior art.

1‧‧‧本體1‧‧‧ Ontology

11‧‧‧裝載部11‧‧‧Loading Department

111‧‧‧裝載軌111‧‧‧ loading rail

12‧‧‧卸載部12‧‧‧Unloading Department

121‧‧‧卸載軌121‧‧‧Unloading rail

13‧‧‧不良品軌13‧‧‧Dangerous product track

14‧‧‧再循環部14‧‧‧Recycling Department

15‧‧‧影像檢測裝置15‧‧‧Image detection device

16‧‧‧拾取器模組16‧‧‧ picker module

17‧‧‧清潔機構17‧‧‧ Cleaning institutions

Claims (3)

一種半導體元件的影像檢測系統,係拍攝半導體元件表面影像,並根據拍攝結果自動檢測有無不良者,其具有:本體;裝載部及卸載部,係以相互對稱配備於該本體之前方兩側,並以能使複數個托盤上升或下降之方式積載;裝載軌,係配備於該裝載部之後方並可沿前後方向移送托盤;卸載軌,係配備於該卸載部之後方並可沿前後方向移送卸載托盤;再循環部,係配備於該本體之後方並可將裝載軌上之空托盤移送至該卸載軌;影像檢測裝置,係配備於該裝載軌與卸載軌之間,並由拍攝半導體元件之前/背面影像的一對影像攝影機所構成;不良品軌,係配備於該卸載軌與該影像檢測裝置之間,並移送不良品托盤;及拾取器模組,進行移送及分類功能,其係從該裝載軌上之托盤拾取半導體元件並進行移送以使影像檢測裝置進行影像檢測,並拾取業已完成影像檢測之半導體元件,根據有無不良移送分類至卸載軌上之卸載托盤或不良品軌上之不良品托盤。An image detecting system for a semiconductor device is a method for capturing a surface image of a semiconductor element and automatically detecting whether there is a defect according to the shooting result, and has: a body; a loading portion and an unloading portion, which are symmetrically disposed on both sides of the front side of the body, and The load rail is stowed in such a manner that a plurality of trays are raised or lowered; the loading rail is disposed behind the loading portion and can be transported in the front-rear direction; the unloading rail is disposed behind the unloading portion and can be unloaded in the front-rear direction a tray; a recirculation portion disposed behind the body and capable of transferring an empty tray on the loading rail to the unloading rail; and an image detecting device disposed between the loading rail and the unloading rail and before photographing the semiconductor component / a pair of video cameras on the back image; a defective track is provided between the unloading rail and the image detecting device, and transports the defective tray; and the picker module performs the transfer and sorting functions. The tray on the loading rail picks up the semiconductor component and transfers it to enable the image detecting device to perform image detection, and picks up the completed image The semiconductor component like the inspection is sorted to the unloading tray on the unloading rail or the defective product tray on the defective rail according to the presence or absence of defective transfer. 如申請專利範圍第1項所述之半導體元件的影像檢測系統,其中該拾取器模組係以一對配備於前後方向, 並交互實施半導體元件之移送及分類作業。The image detecting system for a semiconductor device according to claim 1, wherein the pick-up module is provided in a pair of front and rear directions. And interactively implement the transfer and classification of semiconductor components. 如申請專利範圍第1項所述之半導體元件的影像檢測系統,其中於該裝載軌與影像檢測裝置之間,進一步配備有清潔機構,用以在影像檢測前清潔半導體元件表面。The image detecting system of the semiconductor device of claim 1, wherein the loading rail and the image detecting device are further provided with a cleaning mechanism for cleaning the surface of the semiconductor component before image detection.
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