WO2008143475A1 - Semiconductor device vision inspecting system - Google Patents
Semiconductor device vision inspecting system Download PDFInfo
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- WO2008143475A1 WO2008143475A1 PCT/KR2008/002873 KR2008002873W WO2008143475A1 WO 2008143475 A1 WO2008143475 A1 WO 2008143475A1 KR 2008002873 W KR2008002873 W KR 2008002873W WO 2008143475 A1 WO2008143475 A1 WO 2008143475A1
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- Prior art keywords
- semiconductor devices
- unit
- unloading
- rail
- tray
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 123
- 238000007689 inspection Methods 0.000 claims abstract description 50
- 238000004064 recycling Methods 0.000 claims abstract description 7
- 230000002950 deficient Effects 0.000 claims description 21
- 238000004140 cleaning Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 230000006870 function Effects 0.000 description 10
- 238000010276 construction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 238000007792 addition Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Definitions
- the present invention relates to a semiconductor device vision inspecting system, and, more particularly, to a semiconductor device vision inspecting system that is capable of directly sorting and transferring semiconductor devices to trays on transfer rails by means of a picker module having both a sorting function and a transferring function without the provision of an additional sorting region, thereby simplifying the structure of equipment and reducing the size of the equipment.
- Background Art
- FIG. 2 is a constructional view illustrating an example of a conventional semiconductor device vision inspecting system.
- the conventional semiconductor device vision inspecting system includes a loading unit 100 mounted at the front of a system body, the loading unit 100 being constructed in a structure in which a tray to be visually inspected is loaded, a sorting unit 200 mounted at the front of the system body at one side of the loading unit 100 for sorting semiconductor devices into good-quality semiconductor devices and defective semiconductor devices, a cleaning unit 300 mounted above the system body for cleaning semiconductor devices to be visually inspected, a vision inspection unit 400 for inspecting the front and rear surfaces of the semiconductor devices cleaned by the cleaning unit 300, a transfer picker 500 for picking up and transferring semiconductor devices to be visually inspected, a picker moving unit 600 for guiding the side-to-side horizontal movement of the transfer picker 500, an unloading unit 700 for allowing a buffer tray having the visually inspected semiconductor devices are received therein and a tray having good-quality semiconductor devices are received to be placed thereon, an empty tray unit 800 for allowing an empty tray to be placed thereon, a reject unit 900 for receiving semiconductor devices sorted as defective products according to the
- a tray in which semiconductor devices to be visually inspected are received, is transferred, the semiconductor devices are picked up by the transfer picker, the picked-up semiconductor devices are visually inspected by vision cameras, and the tray, from which all the semiconductor devices have been picked up and thus which is now empty, is transferred to a buffer unit by means of the recycling unit.
- the good-quality semiconductor devices are received in a tray on the unloading unit.
- the defective semiconductor devices are sorted in a slot-type fashion and are received in a reject tray on the reject unit.
- the tray, from which the defective semiconductor devices are removed, is used as a buffer tray.
- the reject tray is accorded a specific identification (ID) and is configured to read specific identifications (ID) of semiconductor devices inserted in the slot-type fashion. Consequently, it is possible for a worker to visually confirm the vision inspection results of the defective semiconductor device through a monitor without withdrawing the semiconductor devices one by one to inspect the semiconductor devices with the naked eye, and therefore, the monitoring of the defective semiconductor device is possible, and, at the same time, the continuous inspection of following trays is also possible.
- ID specific identification
- ID specific identification
- the transfer picker for transferring semiconductor devices to be visually inspected and transferring the visually inspected semiconductor devices to a tray on the unloading unit
- the sorting device for sorting the transferred semiconductor devices according to the result of the vision inspection
- the present invention has been made in view of the above problems, and it is an object of the present invention to provide a semiconductor device vision inspecting system constructed in a structure in which a loading tray, a reject tray, and an unloading tray are disposed on transfer rails arranged in the frontward- and-backward direction of a system body, semiconductor devices are sorted and transferred, by a picker module having both a sorting function and a transferring function, according to the results of the vision inspection, such that good-quality semiconductor devices and defective semiconductor devices are sorted and transferred to the unloading tray and the reject tray, with the result that it is not necessary to provide an additional sorting region, thereby simplifying the structure of equipment, reducing the size of the work space, and thus achieving the reduction in size of the equipment.
- the above and other objects can be accomplished by the provision of a semiconductor device vision inspecting system that photographs the surfaces of semiconductor devices and automatically determines whether the semiconductor devices are good or defective depending upon the photographed results, the vision inspection system including a system body, a loading unit and an unloading unit disposed at opposite sides of the front part of the system body in a symmetrical fashion, the loading unit and the unloading unit being constructed in a structure in which a plurality of trays are stacked in the loading unit and the unloading unit such that the trays can be moved upward or downward, a loading rail disposed at the rear of the loading unit for allowing a tray to be transferred there along in the frontward-and-backward direction, an unloading rail disposed at the rear of the unloading unit for allowing an unloading tray to be transferred therealong in the frontward-and-backward direction, a recycling unit disposed at the rear part of the system body for transferring an empty tray on the loading rail to the unloading rail, a
- the picker module includes a pair of pickers arranged in the frontward- and-backward direction for alternately performing a transferring process and a sorting process with respect to semiconductor devices.
- FIG. 1 is a constructional view illustrating a semiconductor device vision inspecting system according to the present invention.
- FIG. 2 is a constructional view illustrating an example of a conventional semiconductor device vision inspecting system. Best Mode for Carrying Out the Invention
- FIG. 1 is a constructional view illustrating a semiconductor device vision inspecting system according to the present invention.
- the present invention relates to a semiconductor device vision inspecting system that photographs the surfaces of semiconductor devices and automatically determines whether the semiconductor devices are good or defective depending upon the photographed results.
- the semiconductor device vision inspecting system includes a system body 1, a loading unit 11, an unloading unit 12, a loading rail 111, an unloading rail 121, a reject rail 13, a recycling unit 14, a vision inspection unit 15, and a picker module 16.
- the loading unit 11 and the unloading unit 12 are disposed at opposite sides of the front part of the system body 1 in a symmetrical fashion.
- the loading unit 11 and the unloading unit 12 are stacked a plurality of trays such that the trays can be moved upward or downward. Specifically, trays having semiconductor devices to be visually inspected received therein are stacked in the loading unit 11.
- the loading rail 111 is disposed at the rear of the loading unit 11 in the frontward- and-backward direction for allowing a tray to be transferred there along in the frontward-and-backward direction.
- the unloading rail 121 is disposed at the rear of the unloading unit 12 in the frontward-and-backward direction for allowing a tray in which good-quality semiconductor devices will be received to be transferred there along in the frontward-and-backward direction.
- the recycling unit 14 is disposed at the rear part of the system body 11 between the loading rail 111 and the unloading rail 121 for transferring an empty tray on the loading rail 111 to the unloading rail 121.
- the vision inspection unit 15 is disposed between the loading rail 11 land the unloading rail 121.
- the vision inspection unit 15 includes a pair of vision cameras 151 and 152 for photographing front and rear surfaces of semiconductor devices.
- the reject rail 13 is disposed between the unloading rail 121 and the vision inspection unit 15 for allowing a reject tray in which semiconductor devices sorted as defective products according to the results of the vision inspection by means of the vision inspection unit 15 are received to be loaded thereon and be transferred there along.
- the present invention is characterized in that the picker module 16 is constructed to be driven not only from side to side but also upward and downward, and the picker module 16 has both a transferring function and a sorting function.
- the picker module 16 picks up semiconductor devices from the tray on the loading rail 111 and transfers the picked-up semiconductor devices to the vision inspection unit 15, such that the picked-up semiconductor devices are visually inspected by the vision inspection unit 15.
- the picker module 16 picks up the visually inspected semiconductor devices, and then transfers the visually inspected semiconductor devices to an unloading tray on the unloading rail 121 or a reject tray on the reject rail 13 according to the determination as to whether the visually inspected semiconductor devices are good or defective. As a result, the visually inspected semiconductor devices are sorted into good-quality semiconductor devices and defective semiconductor devices.
- the picker module 16 includes a pair of pickers arranged in the frontward- and-backward direction.
- one of the pickers sorts semiconductor devices according to the results of the vision inspection, and the other picker picks up semiconductor devices from a tray transferred from the loading unit 11 along the loading rail 111 such that the vision inspection can be carried out to the picked-up semiconductor devices.
- the reject tray is accorded a specific identification (ID) and is configured to read specific identifications (ID) of semiconductor devices inserted in a slot-type fashion.
- ID specific identification
- the semiconductor device vision inspecting system preferably further includes a cleaning unit 17 disposed between the loading rail 111 and the vision inspection unit 15 for cleaning the surface of semiconductor devices before the execution of the vision inspection.
- the semiconductor device When foreign matter, such as micro dust or pollutant, is adsorbed on the surface of a semiconductor device, the semiconductor device may be sorted as a defective semiconductor device due to such foreign matter. Consequently, it is preferred to remove the foreign matter adsorbed on the surface of the semiconductor device using the cleaning unit to eliminate a factor which may cause such inspection error.
- the picker module serves to not only transfer semiconductor devices but also sort semiconductor devices, whereby the structure of equipment is simplified.
- the semiconductor device vision inspecting system according to the present invention has no sorting unit. As a result, it is possible to reduce the size of equipment by the area the sorting unit would occupy if the sorting unit is included in the semiconductor device vision inspecting system, and therefore, the reduction in size of the equipment is achieved.
- the semiconductor device vision inspecting system is constructed in a structure in which the loading tray, the reject tray, and the unloading tray are disposed on the respective transfer rails arranged in the frontward-and-backward direction of the system body without the provision of an additional sorting region, semiconductor devices to be visually inspected are picked up and transferred by the picker module having both the transferring function and the sorting function, and the visually inspected semi- conductor devices are sorted according to the results of the vision inspection and transferred to the reject tray and the unloading tray by the picker module.
- the good-quality semiconductor devices and the defective semiconductor devices are sorted and transferred to the corresponding trays on the respective transfer rails, with the result that it is not necessary to provide an additional sorting region. Consequently, the present invention has the effect of simplifying the structure of equipment and reducing the size of the work space, thereby achieving the reduction in size of the equipment.
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- Analytical Chemistry (AREA)
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- General Physics & Mathematics (AREA)
- Immunology (AREA)
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Abstract
A semiconductor device vision inspecting system includes a loading unit and an unloading unit, a loading rail disposed at the rear of the loading unit for allowing a tray to be transferred there along, an unloading rail disposed at the rear of the unloading unit for allowing an unloading tray to be transferred there along, a recycling unit for transferring an empty tray on the loading rail to the unloading rail, a vision inspection unit, a reject rail disposed between the unloading rail and the vision inspection unit for allowing a reject tray to be transferred there along, and a picker module for picking up semiconductor devices from the tray on the loading rail and transferring to the vision inspection unit and for picking up the semiconductor devices and sorting and transferring the semiconductor devices to an unloading tray or a reject tray according to the results of the vision inspection.
Description
Description
SEMICONDUCTOR DEVICE VISION INSPECTING SYSTEM
Technical Field
[1] The present invention relates to a semiconductor device vision inspecting system, and, more particularly, to a semiconductor device vision inspecting system that is capable of directly sorting and transferring semiconductor devices to trays on transfer rails by means of a picker module having both a sorting function and a transferring function without the provision of an additional sorting region, thereby simplifying the structure of equipment and reducing the size of the equipment. Background Art
[2] Semiconductor devices, including memory modules, are manufactured through a series of processes and are subjected to precise inspection before shipping. Not only the internal defectiveness of the semiconductor device packages but also microscopic defects on the external appearances of the semiconductor devices have a fatal influence on the performance of the semiconductor devices. For this reason, the precise inspection includes various kinds of inspection, such as inspection of the external appearances of the semiconductor devices using vision cameras, as well as inspection of electric operations of the semiconductor devices.
[3] Generally, external defects of semiconductor devices, especially defects of ball grid arrays (BGA) and leads, may occur during the assembly of the semiconductor devices to a printed circuit board (PCB). Consequently, the inspection of the leads or the balls is very important.
[4] FIG. 2 is a constructional view illustrating an example of a conventional semiconductor device vision inspecting system.
[5] The conventional semiconductor device vision inspecting system includes a loading unit 100 mounted at the front of a system body, the loading unit 100 being constructed in a structure in which a tray to be visually inspected is loaded, a sorting unit 200 mounted at the front of the system body at one side of the loading unit 100 for sorting semiconductor devices into good-quality semiconductor devices and defective semiconductor devices, a cleaning unit 300 mounted above the system body for cleaning semiconductor devices to be visually inspected, a vision inspection unit 400 for inspecting the front and rear surfaces of the semiconductor devices cleaned by the cleaning unit 300, a transfer picker 500 for picking up and transferring semiconductor devices to be visually inspected, a picker moving unit 600 for guiding the side-to-side horizontal movement of the transfer picker 500, an unloading unit 700 for allowing a buffer tray having the visually inspected semiconductor devices are received therein
and a tray having good-quality semiconductor devices are received to be placed thereon, an empty tray unit 800 for allowing an empty tray to be placed thereon, a reject unit 900 for receiving semiconductor devices sorted as defective products according to the result of the vision inspection, a sorting device 910 for sorting semiconductor devices according to the result of the vision inspection, and a recycling unit 1000 for transferring an empty tray, among trays supplied through a loading region, to the unloading unit 700.
[6] In the conventional semiconductor device vision inspecting system with the above- stated construction, a tray, in which semiconductor devices to be visually inspected are received, is transferred, the semiconductor devices are picked up by the transfer picker, the picked-up semiconductor devices are visually inspected by vision cameras, and the tray, from which all the semiconductor devices have been picked up and thus which is now empty, is transferred to a buffer unit by means of the recycling unit.
[7] Subsequently, when it is determined that the visually inspected semiconductor devices are good, the good-quality semiconductor devices are received in a tray on the unloading unit. On the other hand, when it is determined that the visually inspected semiconductor devices are defective, the defective semiconductor devices are sorted in a slot-type fashion and are received in a reject tray on the reject unit.
[8] The tray, from which the defective semiconductor devices are removed, is used as a buffer tray.
[9] The reject tray is accorded a specific identification (ID) and is configured to read specific identifications (ID) of semiconductor devices inserted in the slot-type fashion. Consequently, it is possible for a worker to visually confirm the vision inspection results of the defective semiconductor device through a monitor without withdrawing the semiconductor devices one by one to inspect the semiconductor devices with the naked eye, and therefore, the monitoring of the defective semiconductor device is possible, and, at the same time, the continuous inspection of following trays is also possible.
[10] In the conventional semiconductor device vision inspecting system, however, the transfer picker, for transferring semiconductor devices to be visually inspected and transferring the visually inspected semiconductor devices to a tray on the unloading unit, and the sorting device, for sorting the transferred semiconductor devices according to the result of the vision inspection, are provided separately above the system body.
[11] Consequently, the sorting region, where semiconductor devices are sorted into good- quality semiconductor devices and defective semiconductor devices according to the results of the vision inspection, occupies the front of the system body, and the reject tray is supplied to the sorting region, with the result that a work space is greatly
reduced, and therefore, the efficient use of the installation space is not expected. Disclosure of Invention
Technical Problem
[12] Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a semiconductor device vision inspecting system constructed in a structure in which a loading tray, a reject tray, and an unloading tray are disposed on transfer rails arranged in the frontward- and-backward direction of a system body, semiconductor devices are sorted and transferred, by a picker module having both a sorting function and a transferring function, according to the results of the vision inspection, such that good-quality semiconductor devices and defective semiconductor devices are sorted and transferred to the unloading tray and the reject tray, with the result that it is not necessary to provide an additional sorting region, thereby simplifying the structure of equipment, reducing the size of the work space, and thus achieving the reduction in size of the equipment. Technical Solution
[13] In accordance with the present invention, the above and other objects can be accomplished by the provision of a semiconductor device vision inspecting system that photographs the surfaces of semiconductor devices and automatically determines whether the semiconductor devices are good or defective depending upon the photographed results, the vision inspection system including a system body, a loading unit and an unloading unit disposed at opposite sides of the front part of the system body in a symmetrical fashion, the loading unit and the unloading unit being constructed in a structure in which a plurality of trays are stacked in the loading unit and the unloading unit such that the trays can be moved upward or downward, a loading rail disposed at the rear of the loading unit for allowing a tray to be transferred there along in the frontward-and-backward direction, an unloading rail disposed at the rear of the unloading unit for allowing an unloading tray to be transferred therealong in the frontward-and-backward direction, a recycling unit disposed at the rear part of the system body for transferring an empty tray on the loading rail to the unloading rail, a vision inspection unit disposed between the loading rail and the unloading rail, the vision inspection unit including a pair of vision cameras for photographing front and rear surfaces of semiconductor devices, a reject rail disposed between the unloading rail and the vision inspection unit for allowing a reject tray to be transferred there along, and a picker module for picking up semiconductor devices from the tray on the loading rail and transferring the picked-up semiconductor devices to the vision inspection unit, such that the picked-up semiconductor devices are visually inspected by the vision inspection unit, and for picking up the visually inspected semiconductor
devices and sorting and transferring the visually inspected semiconductor devices to an unloading tray on the unloading rail or a reject tray on the reject rail according to the determination as to whether the visually inspected semiconductor devices are good or defective.
[14] Preferably, the picker module includes a pair of pickers arranged in the frontward- and-backward direction for alternately performing a transferring process and a sorting process with respect to semiconductor devices. Brief Description of the Drawings
[15] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
[16] FIG. 1 is a constructional view illustrating a semiconductor device vision inspecting system according to the present invention; and
[17] FIG. 2 is a constructional view illustrating an example of a conventional semiconductor device vision inspecting system. Best Mode for Carrying Out the Invention
[18] Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[19] FIG. 1 is a constructional view illustrating a semiconductor device vision inspecting system according to the present invention. The present invention relates to a semiconductor device vision inspecting system that photographs the surfaces of semiconductor devices and automatically determines whether the semiconductor devices are good or defective depending upon the photographed results.
[20] The semiconductor device vision inspecting system according to the present invention includes a system body 1, a loading unit 11, an unloading unit 12, a loading rail 111, an unloading rail 121, a reject rail 13, a recycling unit 14, a vision inspection unit 15, and a picker module 16.
[21] The loading unit 11 and the unloading unit 12 are disposed at opposite sides of the front part of the system body 1 in a symmetrical fashion. In the loading unit 11 and the unloading unit 12 are stacked a plurality of trays such that the trays can be moved upward or downward. Specifically, trays having semiconductor devices to be visually inspected received therein are stacked in the loading unit 11.
[22] Trays supplied to the reject rail 13 and having good-quality semiconductor devices received therein are transferred to the unloading unit 12 such that the trays are placed on the unloading unit 12.
[23] The loading rail 111 is disposed at the rear of the loading unit 11 in the frontward- and-backward direction for allowing a tray to be transferred there along in the
frontward-and-backward direction. The unloading rail 121 is disposed at the rear of the unloading unit 12 in the frontward-and-backward direction for allowing a tray in which good-quality semiconductor devices will be received to be transferred there along in the frontward-and-backward direction.
[24] The recycling unit 14 is disposed at the rear part of the system body 11 between the loading rail 111 and the unloading rail 121 for transferring an empty tray on the loading rail 111 to the unloading rail 121.
[25] The vision inspection unit 15 is disposed between the loading rail 11 land the unloading rail 121. The vision inspection unit 15 includes a pair of vision cameras 151 and 152 for photographing front and rear surfaces of semiconductor devices.
[26] The reject rail 13 is disposed between the unloading rail 121 and the vision inspection unit 15 for allowing a reject tray in which semiconductor devices sorted as defective products according to the results of the vision inspection by means of the vision inspection unit 15 are received to be loaded thereon and be transferred there along.
[27] The present invention is characterized in that the picker module 16 is constructed to be driven not only from side to side but also upward and downward, and the picker module 16 has both a transferring function and a sorting function.
[28] In other words, the picker module 16 picks up semiconductor devices from the tray on the loading rail 111 and transfers the picked-up semiconductor devices to the vision inspection unit 15, such that the picked-up semiconductor devices are visually inspected by the vision inspection unit 15.
[29] Also, the picker module 16 picks up the visually inspected semiconductor devices, and then transfers the visually inspected semiconductor devices to an unloading tray on the unloading rail 121 or a reject tray on the reject rail 13 according to the determination as to whether the visually inspected semiconductor devices are good or defective. As a result, the visually inspected semiconductor devices are sorted into good-quality semiconductor devices and defective semiconductor devices.
[30] Preferably, the picker module 16 includes a pair of pickers arranged in the frontward- and-backward direction. In this case, one of the pickers sorts semiconductor devices according to the results of the vision inspection, and the other picker picks up semiconductor devices from a tray transferred from the loading unit 11 along the loading rail 111 such that the vision inspection can be carried out to the picked-up semiconductor devices.
[31] The reject tray is accorded a specific identification (ID) and is configured to read specific identifications (ID) of semiconductor devices inserted in a slot-type fashion.
[32] Consequently, it is possible for a worker to visually confirm the vision inspection results of the defective semiconductor device through a monitor without withdrawing
the semiconductor devices one by one to inspect the semiconductor devices with the naked eye, and therefore, the monitoring of the defective semiconductor device is possible, and, at the same time, the continuous inspection of following trays is also possible. The details of the reject tray are disclosed in Korean Patent Application No. 10-2006-0043900, which has been filed in the name of the applicant of the present application, and therefore, a detailed description in construction and operation of the reject tray will not be given.
[33] Meanwhile, the semiconductor device vision inspecting system according to the present invention preferably further includes a cleaning unit 17 disposed between the loading rail 111 and the vision inspection unit 15 for cleaning the surface of semiconductor devices before the execution of the vision inspection.
[34] When foreign matter, such as micro dust or pollutant, is adsorbed on the surface of a semiconductor device, the semiconductor device may be sorted as a defective semiconductor device due to such foreign matter. Consequently, it is preferred to remove the foreign matter adsorbed on the surface of the semiconductor device using the cleaning unit to eliminate a factor which may cause such inspection error.
[35] In the semiconductor device vision inspecting system with the above-stated construction according to the present invention, the picker module serves to not only transfer semiconductor devices but also sort semiconductor devices, whereby the structure of equipment is simplified.
[36] Also, the semiconductor device vision inspecting system according to the present invention has no sorting unit. As a result, it is possible to reduce the size of equipment by the area the sorting unit would occupy if the sorting unit is included in the semiconductor device vision inspecting system, and therefore, the reduction in size of the equipment is achieved.
[37] Furthermore, both the transferring function and the sorting function are performed by the picker module. Consequently, the equipment operating system is simplified as compared to the conventional operating system in which the sorting unit and the transfer unit are separately operated. Industrial Applicability
[38] As apparent from the above description, the semiconductor device vision inspecting system according to the present invention is constructed in a structure in which the loading tray, the reject tray, and the unloading tray are disposed on the respective transfer rails arranged in the frontward-and-backward direction of the system body without the provision of an additional sorting region, semiconductor devices to be visually inspected are picked up and transferred by the picker module having both the transferring function and the sorting function, and the visually inspected semi-
conductor devices are sorted according to the results of the vision inspection and transferred to the reject tray and the unloading tray by the picker module.
[39] Therefore, the good-quality semiconductor devices and the defective semiconductor devices are sorted and transferred to the corresponding trays on the respective transfer rails, with the result that it is not necessary to provide an additional sorting region. Consequently, the present invention has the effect of simplifying the structure of equipment and reducing the size of the work space, thereby achieving the reduction in size of the equipment.
[40] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims
[1] A semiconductor device vision inspecting system that photographs the surfaces of semiconductor devices and automatically determineswhether the semiconductor devices are good or defective depending upon the photographed results, the vision inspection system comprising: a system body; a loading unit and an unloading unit disposed at oppositesides of the front part of the system body in a symmetrical fashion, the loading unit and the unloading unit being constructed in a structure in which a plurality of trays are stacked in the loading unit and the unloading unit such that the trays can be moved upward or downward; a loading rail disposed at the rear of the loading unit for allowing a tray to be transferred therealong in the frontward-and-backward direction; an unloading rail disposed at the rear of the unloading unit for allowing an unloading tray to be transferred therealong in the frontward-and-backward direction; a recycling unit disposed at the rear part of the system body for transferring an empty tray on the loading rail to the unloading rail a vision inspection unit disposed between the loading rail and the unloading rail, the vision inspection unit including a pair of vision cameras for photographing front and rear surfaces of semiconductor devices; a reject rail disposed between the unloading rail and the vision inspection unit for allowing a reject tray to be transferred therealong; and a picker module for picking up semiconductor devices from the tray on the loading rail and transferring the picked-up semiconductor devices to the vision inspection unit, such that the picked-up semiconductor devices are visually inspected by the vision inspection unit, and for picking up the visually inspected semiconductor devices and sorting and transferring the visually inspected semiconductor devices to an unloading tray on the unloading rail or a reject tray on the reject rail according to the determination as to whether the visually inspected semiconductor devices are good or defective.
[2] The vision inspection system according to claim 1, wherein the picker module includes a pair of pickers arranged in the frontward-and-backward direction for alternately performing a transferring process and a sorting process with respect to semiconductor devices.
[3] The vision inspection system according to claim 1, further comprising: a cleaning unit disposed betweenthe loading rail and the vision inspection unit
for cleaning the surface of semiconductor devices before the execution of the vision inspection.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2007-0050526 | 2007-05-23 | ||
| KR20070050526A KR100873672B1 (en) | 2007-05-23 | 2007-05-23 | System for vision inspection of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008143475A1 true WO2008143475A1 (en) | 2008-11-27 |
Family
ID=40032112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2008/002873 WO2008143475A1 (en) | 2007-05-23 | 2008-05-22 | Semiconductor device vision inspecting system |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100873672B1 (en) |
| TW (1) | TWI388816B (en) |
| WO (1) | WO2008143475A1 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101315892B1 (en) * | 2010-07-05 | 2013-10-15 | 한미반도체 주식회사 | Method for Vision Inspection of Semiconductor Packages |
| KR101071301B1 (en) | 2011-07-29 | 2011-10-07 | (주)아이솔루션 | Semiconduct package test system having inner vision camera |
| KR102046081B1 (en) * | 2012-04-27 | 2019-12-02 | (주)제이티 | Vision Inspection Module and device inspection apparatus |
| KR101601614B1 (en) * | 2015-11-30 | 2016-03-08 | 최혜정 | Apparatus for External Appearance Inspection of Semiconductor Device |
| CN106044075B (en) * | 2016-08-01 | 2018-02-02 | 安徽鲲鹏装备模具制造有限公司 | The sliding track mechanism that a kind of material frame transition exchanges |
| KR101771905B1 (en) | 2017-07-17 | 2017-09-05 | 조선기 | Alignment system for replacing printed circuit board |
| CN110672600B (en) * | 2018-07-02 | 2022-10-04 | 深圳市奈尔森科技有限公司 | Optical filter online detection device and method |
| KR102433493B1 (en) | 2020-09-03 | 2022-08-19 | 에이티아이 주식회사 | Vision measuring instrument for measuring warpage of a semiconductor package |
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| KR20020066105A (en) * | 2001-02-09 | 2002-08-14 | 성우전자 주식회사 | Lead Frame Inspection Device |
| KR20050101819A (en) * | 2004-04-20 | 2005-10-25 | 미래산업 주식회사 | Handler for compact camera module and method for operating the same |
| KR20070018524A (en) * | 2005-08-10 | 2007-02-14 | 삼성전자주식회사 | Visual inspecting and classifying equipment for wafer level semiconductor element |
-
2007
- 2007-05-23 KR KR20070050526A patent/KR100873672B1/en active IP Right Grant
-
2008
- 2008-05-22 WO PCT/KR2008/002873 patent/WO2008143475A1/en active Application Filing
- 2008-05-23 TW TW97119137A patent/TWI388816B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020066105A (en) * | 2001-02-09 | 2002-08-14 | 성우전자 주식회사 | Lead Frame Inspection Device |
| KR20050101819A (en) * | 2004-04-20 | 2005-10-25 | 미래산업 주식회사 | Handler for compact camera module and method for operating the same |
| KR20070018524A (en) * | 2005-08-10 | 2007-02-14 | 삼성전자주식회사 | Visual inspecting and classifying equipment for wafer level semiconductor element |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080103354A (en) | 2008-11-27 |
| TWI388816B (en) | 2013-03-11 |
| KR100873672B1 (en) | 2008-12-12 |
| TW200848719A (en) | 2008-12-16 |
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