KR100740251B1 - System for vision inspection of semiconductor device - Google Patents

Abstract

A system for a vision test of a semiconductor device is provided to improve work efficiency by automatically displaying the image analysis result of the semiconductor device on a monitor to check the result photographing the corresponding semiconductor device. A system for a vision test of a semiconductor device includes a tester(1), a reject tray(2), a docking station(3), and an auxiliary computer(4). The tester(1) photographs an image of the semiconductor device, analyzes the image, and classifies the normal semiconductor device into an unloading tray, and the defective semiconductor device into the reject tray(2) loaded in a reject stacker(17). The reject tray(2) is detachably installed in the reject stacker(17). The docking station(2) has the detachable reject tray(2) separated from the reject stacker(17). The auxiliary computer(4) communicates with the tester(1), receives the list and image of the inferior semiconductor device from the tester(1), and displays the received image on a monitor(41).

Description

Vision inspection system for semiconductor devices {SYSTEM FOR VISION INSPECTION OF SEMICONDUCTOR DEVICE}

1 is a block diagram of a vision inspection system of a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a block diagram illustrating an example of the inspector of FIG. 1. FIG.

3 is a front perspective view showing a device configuration of the tester of FIG.

4 is an enlarged view of the reject tray of FIG. 1.

5 is an enlarged view of the docking station and reject stacker of FIG.

FIG. 6 is an enlarged view of a portion A of FIG. 5; FIG.

<Description of the symbols for the main parts of the drawings>

1: checker

    11: loading stacker, 12: loading feeder

    13: handler, 14: CCD camera

    15: buffer feeder, 16: unloading stacker

    17: reject stacker, 18: sorting robot

    19: reject means

2: reject tray, 21: groove

3: docking station

    31: tray reading sensor, 32: device reading sensor

4: secondary computer

    41: monitor, 42: keyboard

The present invention relates to a system for inspecting the appearance of a semiconductor device, and more particularly, a semiconductor that can improve inspection efficiency by continuously inspecting a subsequent inspection object without inspection delay due to re-inspection of a defective semiconductor device. A vision inspection system of a device.

After the semiconductor device is manufactured through a series of processes, a precise inspection is completed before shipment. Such a detailed inspection not only causes a defect in the package of the semiconductor device but also a small defect in its appearance, which has a fatal effect on performance. In addition to the normal motion inspection, various inspections such as visual inspection using a vision camera are performed.

In general, external defects of semiconductor devices, in particular, ball grid arrays (BGAs) and defects of leads, may also occur during assembling of semiconductor devices to a printed circuit board (PCB). .

The appearance inspection system of such a semiconductor device has been disclosed in the Korean Patent Application No. 2005-129986 filed by the present applicant under the title "Vision inspection system of semiconductor devices".

The semiconductor vision inspection system of the Republic of Korea Patent Application No. 2005-129986 is a vision inspection system for automatically inspecting a semiconductor device, which is provided in the front portion of the main body so that the loading stacker loaded with a tray containing the semiconductor device to be vision inspection is installed A loading area; A sorting region disposed at one side of the loading region A at the front of the main body to classify the defective or defective components; A cleaning area provided on an upper portion of the main body to clean the semiconductor device to be vision inspected; A vision inspection area for inspecting the front and rear surfaces of the semiconductor device cleaned in the cleaning area; A handling area to which a handler for picking up and transferring the semiconductor device to be vision-tested is moved; A buffer region in which the semiconductor device having completed the vision inspection is re-received; And a recycling area for transferring the empty tray from the tray supplied through the loading area to the buffer area.

With this configuration, the semiconductor vision inspection system transfers a tray containing the semiconductor element to be vision inspected, picks up the semiconductor element using a handler, and then performs vision inspection using a vision camera, and the semiconductor elements are all picked up. The empty tray is transferred to the buffer feeder by using recycling means.

Subsequently, if the inspected semiconductor device is a good product, it is stored in a blank tray seated in a buffer feeder. If it is a defective product, it is inserted into a slot of a reject buffer of the sorting area, and the operator removes the semiconductor device inserted into the slot and performs visual inspection. Do it.

According to such a vision inspection system of a semiconductor device according to the prior art, after classifying a defective semiconductor device as a reject buffer separately, the operator to re-examine whether there is a defect through visual inspection.

However, when the yield of the product is low, the ratio of the defective product is high, so that the worker takes a lot of time to visually inspect the defective product, thereby reducing the productivity of the equipment.

In other words, because the ratio of defective items is high, re-inspection takes a lot of time, so the inspection of subsequent lots cannot be performed continuously and the system is in a standby state. .

The present invention has been improved to solve the problems of the prior art, an object of the present invention is to provide a defect identification semiconductor device in the vision inspection system of the semiconductor device, and is provided detachably to the reject stacker and to provide a unique identification ID A docking station having an assigned reject tray, readout sensors coupled to the reject tray and reading each of the high-rate identification ID of the reject tray and the unique identification ID of the semiconductor element, and each semiconductor element housed in the reject tray. Auxiliary computer for receiving and displaying the result of vision inspection from the inspector.The reject tray is detached from the reject stacker, coupled to the docking station, and visual inspection is performed continuously for subsequent lot inspection. It is to provide a vision inspection system for semiconductor devices.

Vision of a semiconductor device consisting of a tester that takes an image of a semiconductor device and analyzes the photographed image, and classifies the defective semiconductor device into an unloading tray according to the result, and classifies the defective semiconductor device into a reject tray loaded in a reject stacker. In the inspection system, the reject tray is detachably provided in the reject stacker, the reject tray separated from the reject stacker and the docking station and the inspector in communication with the inspector to be detachable from the inspector And a secondary computer configured to receive the semiconductor device list and the captured image of the defective semiconductor device and display the transferred image on a monitor.

In this case, the docking station and the reject stacker may include a tray reading sensor that recognizes the reject tray and an element reading sensor that recognizes a semiconductor element stored in the tray, and the auxiliary computer may read the tray reading sensor and the element reading. It is configured to communicate with the tester according to the signal of the sensor and receive a list of defective semiconductor elements and a photographed image of the defective semiconductor elements from the inspector, and display the transmitted image on the monitor.

The invention will become more apparent through the preferred embodiments described below with reference to the accompanying drawings. Hereinafter will be described in detail to enable those skilled in the art to easily understand and reproduce through embodiments of the present invention.

1 is a block diagram of a vision inspection system of a semiconductor device according to an embodiment of the present invention. The vision inspection system according to an embodiment of the present invention includes an inspector 1, a reject tray 2, a docking station 3, It consists of an auxiliary computer 4.

The inspector 1 is configured to take an image of the semiconductor device, analyze the photographed image, and classify the semiconductor device as a good or defective product according to the result.

FIG. 2 is a block diagram illustrating an example of the inspector of FIG. 1, and FIG. 3 is a front perspective view illustrating a device configuration of the inspector of FIG. 2. The inspector of the vision inspection system of the semiconductor device of the present invention is not limited thereto.

Referring to the drawing, the inspector 1 is divided into a loading region A, a handling region B, a vision inspection region C, a buffer region D, a sorting region E, and a recycling region F.

In the loading area A, a loading stacker 11 is installed on which a tray containing semiconductor elements to be vision-loaded is mounted, and a tray transported from the loading stacker 11 is mounted on the loading area A. The loading feeder 12 is installed to enable horizontal movement before and after.

In the handling area B, left and right horizontal movements are provided, and a handler 13 for picking up and transferring the semiconductor element to be vision inspected from the tray supplied through the loading feeder 12 is installed.

In the vision inspection region C, a CCD camera 14 is installed to inspect the front and rear surfaces of the semiconductor element transferred by the handler 13.

The buffer region D corresponds to a region in which the semiconductor devices in which CCD imaging is completed are re-received in the vision inspection region C, and a buffer feeder 15 is installed in the buffer region D so that an empty tray is supplied. .

The sorting area E is an area in which the good and defective semiconductor devices are separated, and is divided into an unloading part and a reject part, and the sorting robot 18 is mounted in the sorting area E.

The unloading unit Good1 is provided with an unloading stacker 16 on which an unloading tray for accommodating a semiconductor device transferred from the tray seated on the buffer feeder 15 is mounted. Reject1 and Reject2 are provided with a reject stacker 17 on which a defective semiconductor element conveyed from a tray seated on the buffer feeder 15 is seated.

The recycling region F is provided through the loading feeder 12 and includes recycling means 19 for transferring the empty trays from which all semiconductor elements have been removed for vision inspection to the buffer region D.

In addition, when a fine dust or the like is contaminated on the surface of the semiconductor element picked up by the handler 13, an inspection error may occur, so that the inspector 1 cleans the semiconductor element to prevent the inspection error. It may be configured to include more.

In addition, although not shown in the drawing, the inspector 1 controls the driving of each component, and it is obvious that a control computer for analyzing an image photographed by the CCD camera 14 and determining whether there is a defect is built-in. Since this is a conventional technology, detailed description thereof will be omitted.

Meanwhile, as shown in FIG. 4, the reject tray 2 is detachably provided at the reject stacker 17 of the inspector 1, and a semiconductor device is disposed on one side of the reject tray 2. A plurality of grooves 21 are formed to be separately received and the rear of the grooves 21 are opened.

The docking station 3 is provided so that the reject tray 2 separated from the inspector 1 is detachable.

The auxiliary computer 4 communicates with the inspector 1 to receive a list of defective semiconductor elements and a photographed image of the defective semiconductor elements from the inspector, and to display the transmitted images to the operator. It includes a keyboard 42 to be input.

According to this configuration, when the operator takes out the semiconductor element from the reject tray 2 coupled to the docking station 3, the operator inputs the tray and the corresponding semiconductor element unique identification ID through the keyboard 42, the The result of the image analysis transmitted from the inspector 1 is displayed on the monitor 41 of the auxiliary computer 4.

In this way, when the captured image is displayed on the monitor 41, the operator compares the image analysis result with the semiconductor element to make a final determination.

FIG. 5 is an enlarged view of the docking station and the reject tray of FIG. 1, and FIG. 6 is an enlarged view of a portion A of FIG. 5, wherein the docking station 3 and the reject tray 17 are located as shown in FIG. 5. A plurality of element reading sensors 32 corresponding to the grooves 21 of the reject tray 2 and recognizing semiconductor elements may be provided in a slot form. The reject tray 2 may be provided at one side of the docking station 3. The tray reading sensor 31 may further be provided.

According to this configuration, when the reject tray 2 is coupled to the docking station 3, the data sensed through the tray read sensor 31 is input to the auxiliary computer 4.

When the operator selects the semiconductor element and takes it out of the slotted semiconductor element reading sensor 32, the signal sensed by the element reading sensor 32 is inputted to the auxiliary computer 4, and the auxiliary computer according to the input signal. In (4), the image analysis result of the semiconductor element is displayed on the monitor 41.

Then, the operator visually compares the image analysis result displayed on the monitor with the semiconductor element to finally determine whether the semiconductor element is defective.

 Hereinafter, the operation of the vision inspection system of the semiconductor device of the present invention having such a configuration will be described with reference to FIGS. 1 to 5.

First, the tray loaded on the loading stacker 11 is lifted up through an elevator and then transferred to the loading feeder 12.

Then, the loading feeder 12 is moved to the loading position, and then the semiconductor element is picked up using the picker head mounted on the handler 13 and then transferred to the vision inspection position on one side of the CCD camera 14 to perform vision inspection. do.

After performing the vision inspection, the semiconductor device is stored in an empty tray seated in the buffer feeder 15 of the buffer area D, and the semiconductor device determined as defective is a reject stack of the sorting area using the sorting robot 18. The semiconductor elements, which are sandwiched by the grooves 21 of the tray 2 seated on the beaker 17, are determined to be genuine products and are stored in the tray seated on the unloading stacker 16.

On the other hand, when all of the semiconductor elements accommodated in the tray seated on the loading feeder 12 is transferred to the empty tray, the empty tray is transferred to the buffer feeder 15 using the recycling means 19, It is used for storing semiconductor elements in which photographing by a vision camera is completed.

When the reject tray 2 is filled with all the defective semiconductor devices, the operator manually separates the reject tray 2 from the reject stacker 17, couples the docking station 3 to the docking station 3, and removes the empty tray. Mounted on the JACK stacker (17).

At this time, the inspector 1 transmits the image analysis result according to the vision inspection of the semiconductor element accommodated in the reject tray 2 to the auxiliary computer 4, and continues the inspection of the subsequent lot.

Then, the operator removes the semiconductor element from the reject tray 2 coupled to the docking station 3 and visually inspects it.

In other words, the operator takes out the semiconductor element from the reject tray 2 and inputs the tray unique identification ID and the unique identification ID of the semiconductor element through a manual operation device such as the keyboard 42.

Then, the image analysis result received from the inspector 1 is displayed on the monitor 41, and the operator directly checks the image and the semiconductor device with the naked eye.

According to another embodiment of the present invention, since the docking station 3 is provided with a tray reading sensor 31 and a slotted element reading sensor 32, a reject tray in which an operator is coupled to the docking station 3. When the semiconductor element is taken out from (2), the signal sensed by the tray read sensor 31 and the signal sensed by the element read sensor 32 embedded in the slot are input to the auxiliary computer 4, and onto the monitor 41. The image analysis result of the semiconductor device is automatically displayed.

In other words, according to another embodiment of the present invention, even if the operator does not manually input the tray and the device ID, the image analysis result of the semiconductor device is automatically displayed, thereby increasing the inspection speed.

As described above, the vision inspection system of the semiconductor device of the present invention includes a reject tray in which defective semiconductor devices are stored and detachably provided in the reject stacker, and a vision inspection result from a docking station and an inspection machine to which the reject tray is coupled. By providing an auxiliary computer that receives and displays the reject tray, the reject tray is separated from the reject stacker, coupled to the docking station, and then visually inspected so that the vision inspector can be continuously performed without delay of inspection at the inspector. There is an advantage that can be improved.

The present invention also provides reading sensors for assigning a unique identification ID to the reject tray and reading each of the tray unique identification ID and the unique identification ID of the semiconductor device in a docking station to which the reject tray is coupled. The high-rate identification ID of the tray containing the semiconductor element and the unique identification ID of the semiconductor element are transmitted to the auxiliary computer, and according to the result, the image analysis result of the semiconductor element is automatically displayed on the monitor so that the operator can display the semiconductor element. By making it easy to check the photographing result there is an advantage to improve the work efficiency.

Although the present invention has been described with reference to the accompanying drawings, it will be apparent to those skilled in the art that many different and obvious modifications are possible without departing from the scope of the invention from this description. Therefore, the scope of the invention should be construed by the claims described to include many such variations.

Claims (2)

Vision of a semiconductor device consisting of a tester that takes an image of a semiconductor device and analyzes the photographed image, and classifies the defective semiconductor device into an unloading tray according to the result, and classifies the defective semiconductor device into a reject tray loaded in a reject stacker. In the inspection system, The reject tray 2 is provided detachably to the reject stacker 17, Docking station (3) detachably provided a reject tray (2) separated from the reject stacker (17) and And a secondary computer 4 which communicates with the tester 1 to receive a list of defective semiconductor elements and a photographed image of the defective semiconductor element from the inspector, and displays the transmitted image on the monitor 41. Vision inspection system of the device. The method of claim 1, The docking station (3) and the reject stacker (); A tray reading sensor 31 for recognizing the reject tray 2 and an element reading sensor 32 for recognizing semiconductor elements housed in the tray, The auxiliary computer 24 communicates with the inspector 31 according to the signals of the tray reading sensor 31 and the element reading sensor 32 to transmit a list of defective semiconductor elements and a photographed image of the defective semiconductor elements from the inspector. Vision inspection system of a semiconductor device, characterized in that configured to display the received and transmitted image on the monitor (41).

Images