KR102196698B1 - Camera module manufacturing in-line system with improved throughput - Google Patents

Abstract

The present invention relates to a camera module manufacturing in-line system with an improved process rate, including: a plurality of process systems comprising a transfer module which carries a material or a carrier carrying a module in a certain direction in the manufacturing process, and a plurality of process modules which perform a manufacturing process on the material; and a processing unit which interworks with the plurality of process systems, and calculates the sequence of processes in which the camera module is manufactured. The processing unit further includes a position detection unit determining a position at which the plurality of processing systems are disposed, and a process operation unit calculating an order of processes. The position detection unit determines an order in which the plurality of process systems are arranged, and transmits the corresponding information to the process operation unit, and the process operation unit calculates the manufacturing process according to the direction in which the transfer module transfers the carrier.

Description

Camera module manufacturing in-line system with improved throughput}

The present invention relates to an in-line system for manufacturing a camera module, and more particularly, to an in-line system for manufacturing a camera module capable of improving an overall process speed while adjusting the arrangement order of various process modules for manufacturing a camera module. .

A system that manufactures a workpiece within one transfer line is collectively referred to as an in-line system. The in-line system has the advantage of minimizing the management manpower by realizing the fully automated manufacturing process. Therefore, a number of in-line systems are employed when manufacturing various workpieces in organizations that want to realize the minimization of management manpower.

Korean Patent Publication No. 10-2019-0008108 describes an in-line system for manufacturing a semiconductor by processing a wafer. The invention described in the above document comprises a first device for processing a wafer, and a delivery means for transferring the wafer by being disposed between the second device and the plurality of processing devices. A temporary batch cassette is disposed between the plurality of processing devices, and the transfer means transfers the wafer while reciprocating between the plurality of processing devices and the temporary batch cassette. That is, since the transfer means performs the transfer of the wafer as a processed material, it is possible to minimize the manpower to manage the overall process by realizing the automatic transfer of the wafer and the manufacturing process.

However, in the system described in the above document, there is no description of a configuration or structure in which a plurality of processing devices can be modified and arranged, and thus a problem that only a semiconductor having a predetermined shape set in the past can be manufactured may be derived.

In addition, as a difference in each process time, which may occur due to different processes performed by each processing device, may occur, a phenomenon in which the pre-processing device waits may occur due to the processing time of the post-processing device. That is, a delay occurs in the process, which reduces the efficiency of the overall manufacturing process.

Korean Patent Publication No. 10-2019-0008108 "Inline System" (2019. 01. 23.)

The present invention has been conceived to solve the above problems, and an object thereof is to provide an in-line system for manufacturing a camera module in which each process module can be freely arranged according to the shape of a camera module to be manufactured.

In addition, it is an object of the present invention to provide an in-line system for manufacturing a camera module capable of minimizing a process delay phenomenon that may occur due to different times for a plurality of processes.

The present invention is interlocked with a plurality of process systems and the plurality of process systems including a transfer module for carrying a material or a carrier carrying a module in a certain direction in a manufacturing process and a plurality of process modules for performing a manufacturing process on the material. , A processing unit for calculating an order of processes in which the camera module is manufactured, wherein the processing unit further comprises a position sensing unit for determining a position in which the plurality of processing systems are disposed, and a process calculating unit for calculating an order of processes, the The position detection unit is characterized in that it determines the order in which the plurality of process systems are arranged, transfers the information to the process operation unit, and the process operation unit calculates a manufacturing process according to a direction in which the transfer module transfers the carrier. .

In addition, the plurality of process systems include a bonding system that combines a film and a printed circuit board with a material, a stiffener attaching system that combines a reinforcement with a material, a side peeling system that applies an adhesive solution to a gap formed in the material, and a material and printed circuit board. A dispensing system that applies a solution that bonds a connector between them, a laser marking system that writes information to the manufactured module, and a tray that accepts materials and modules and distributes materials between the carriers used inside the plurality of process systems. Or it further includes a loading and unloading system for moving the module.

In addition, the transfer module further includes a first transfer module that transfers the carrier containing the material to the process module, and a second transfer module in which the process is completed by the process module, and the receiving unit transfers an empty carrier, and the transfer module The loading and unloading systems are respectively disposed at both ends of the system along the direction, and the carrier is circulated.

In addition, the final process module of each of the plurality of process systems is characterized in that it consists of an inspection module that inspects the manufactured module and collects defective products generated in the process.

In addition, the inspection module further comprises a camera that acquires a captured image of the module on which the manufacturing process has been performed, and the processing unit analyzes the information received from the camera and selectively transmits a transport signal to the vacuum transport module. To do.

In addition, the inspection module further includes a buffer for loading a plurality of carriers in which the modules of good quality are accommodated, and the processing unit is based on the moving direction of the transfer unit, when the operation of the processing system disposed later is not normally performed, By transmitting a command to the vacuum transport module, it is characterized in that the good-quality module is temporarily stored in the buffer.

In addition, the plurality of process systems further include a carrier replacement system further comprising a vacuum transport module for transporting materials or modules between the plurality of carriers, and the carrier replacement system includes the plurality of carriers having different shapes of carriers transported by the transport module. It is characterized in that it is arranged between the process systems.

In addition, the carrier replacement system further includes a plurality of discharge units disposed between the first transport module and the second transport module to discharge the carrier to the outside of the system, and by a signal transmitted by the processing unit, the plurality of transport units The module is characterized in that the carrier is transferred to the discharge unit.

Due to the present invention, the process manager can freely arrange necessary process modules according to the shape and structure of the ultimately manufactured camera module, so that camera modules of various structures can be produced.

In addition, by preventing a delay that may occur between a plurality of process modules, it is possible to improve the efficiency of the overall manufacturing process.

1 is an exemplary view showing an in-line system for manufacturing a camera module according to an embodiment of the present invention.
2 is an exemplary view showing a bonding system according to the present invention. (Expanded view of a heating module)
3 is an exemplary view showing a dispensing module coupled to a plurality of process systems according to the present invention.
4 is an exemplary view showing an inspection module coupled to a plurality of process systems according to the present invention.
5 is an exemplary view showing a loading and unloading system according to the present invention.
6 is an exemplary view showing a buffer of a plurality of process systems according to the present invention.
7 is an exemplary view showing a tray replacement system according to the present invention.

Terms and words used in this specification and claims should not be construed as being limited to their usual or dictionary meanings, and that the inventor can appropriately define the concept of terms in order to describe his own invention in the best way. Based on the principle, it should be interpreted as a meaning and concept consistent with the technical idea of the present invention.

Therefore, the embodiments described in the present specification and the configurations shown in the drawings are only the most preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, and various equivalents that can replace them at the time of application And it should be understood that there may be variations.

Hereinafter, prior to the description with reference to the drawings, matters that are not necessary to reveal the gist of the present invention, that is, known configurations that can be obviously added by those skilled in the art are not shown or described in detail. Make sure you didn't.

The configuration for accommodating the camera module for which the manufacturing process is completed in the in-line manufacturing system and before input to the in-line manufacturing system according to the present invention is defined as a tray, and the configuration in which the material is received and transported in the in-line manufacturing system is a carrier (Carrier). ).

1 is an exemplary view showing an in-line system for manufacturing a camera module according to an embodiment of the present invention. As shown in FIG. 1, the present invention may be achieved by combining a plurality of process systems 10 for performing a manufacturing process by contacting a material input into the system. The plurality of processing systems 10 are interlocked with the processing unit 20, and the processing unit 20 calculates and controls a camera module manufacturing process performed by the plurality of processing systems 10.

In order to realize the above-described structure, the processing unit 20 uses the second communication unit 21 for transmitting and receiving information with the plurality of process systems 10, and the corresponding process with information transmitted from the second communication unit 21. A location identification unit 22 that determines the location of the system 10, a process calculation unit 23 that receives data primarily calculated by the location identification unit 22 and calculates the order of the overall manufacturing process, and the plurality of The process system 10 may include a database 24 that stores data related to a plurality of embodiments that can be combined with each other.

Each of the process systems 10 interlocked with the processing unit 20 includes a plurality of transfer modules and process modules. That is, the type of the process system 10 is determined by the type of the process module included in the process system 10. An embodiment shown in FIG. 1 is a bonding system 11 for bonding a film and a printed circuit board to a material along a direction in which the plurality of transfer modules transfer materials, a stiffener attaching system for bonding a reinforcing material to the material ( 12), a side peeling system 13 for applying an adhesive solution to a gap formed in the material, a dispensing system 14 for applying a solution for coupling a connector between the material and a printed circuit board, and information to the manufactured module. It includes a loading system that is combined in the order of the laser marking system 15 to write in, and inputs a material to the bonding system 11, and an unloading system that receives a camera module that has completed a manufacturing process from the laser marking system 15. do. In addition to the above system, a separate oven system for curing the applied dispensing solution and other components may be included.

However, the above-described embodiment is one of a plurality of embodiments that can be derived according to the order in which the plurality of process modules 200 are combined, and various embodiments are derived according to the structure and shape of the finally manufactured camera module. Can be. That is, as shown in FIG. 1, the process system 10 can be added, deleted, and changed positions.

2 is an exemplary view showing the bonding system 11 according to the present invention. As shown in FIG. 2, the plurality of process systems 10 including the bonding system 11 transfer materials to the plurality of process modules 200 and the plurality of process modules 200 to perform a manufacturing process by contacting a material. It may consist of a plurality of transfer modules 100 including a first transfer module 110 for transferring and a second transfer module 120 transferring an empty carrier from which materials have been separated.

The bonding system 11 shown in FIG. 2 may further include a separate third transfer module 130 for a printed circuit board that combines with a material, and along the direction in which the first transfer module 110 proceeds, A plurality of attaching modules 210 and heating modules 220 may be included.

The bonding system 11 includes an ACF attaching module 211 for attaching a film to a material and an FPCB attaching module 212 for bonding a printed circuit board to the material. A heating module 220 for curing by applying heat and pressure to a material combined with a film and a printed circuit board is disposed at the rear of the plurality of attaching modules 210 along the traveling direction of the first transfer module 110. I can.

The heating module 220 includes at least one cartridge that descends from the upper side of the material accommodated in the carrier to apply heat. The heating module 220 shown in FIG. 2 is an embodiment in which a total of four cartridges are formed, and may simultaneously perform a curing operation on a plurality of materials. In addition, the cartridge receives heat energy through a pulse heat cable coupled to one side, and the pulse heat cable is selectively operated by a control unit. In this case, the pulse heat cable transfers thermal energy to the cartridge at the moment the material comes into contact with the lower surface of the cartridge, thereby mutually curing the module in which the material, film, and printed circuit board are combined.

3 is an exemplary view showing a dispensing module 230 coupled to a plurality of process systems according to the present invention. As shown in FIG. 3, the dispensing module 230 may have various structures. 3(a) is a first dispensing module 231 included in the stiffener attaching system 12, and may have a structure in which a dispensing solution is sprayed in a direction orthogonal to an upper surface of a material introduced into the system. have.

3(b) is a second dispensing module 232 included in the side filling system 13 and the neck dispensing system 14, and dispensing in a state inclined at a predetermined angle with the upper surface of the material input into the system. It can be made in a structure to spray a solution. That is, by spraying the dispensing solution toward the side of the material, it is possible to increase the bonding force with other components.

The plurality of dispensing modules 230 are combined with a separate moving unit that moves in three axes based on the material input into the system, so that the dispensing solution can be moved to a section in which a dispensing solution is to be applied. That is, in a structure in which only a simple linear motion of the first transfer module 110 into which the material is input is made, the dispensing module 230 may directly move to a position adjacent to the material to perform the corresponding process.

4 is an exemplary diagram showing an inspection module 240 coupled to a plurality of process systems according to the present invention. As shown in FIG. 4, the inspection module 240 may also have various structures. 4A is an inspection module that acquires a captured image of an upper surface of an input material, and may be included in the stiffener attaching system 12 that mainly applies a dispensing solution to the upper surface of the material. In addition, it is included in the laser marking system 15 in a vertically inverted form, so that the manager can check the state of writing information such as barcodes on the lower surface of the material.

4B is an inspection module that acquires a captured image of an upper surface and a side surface of a material, and may be included in the side peeling system 13 and the neck dispensing system 14 that perform a process on the side of the material. . That is, it is a configuration for the manager to check the process performed by the dispensing module as shown in (b) of FIG. 3, and it is possible to obtain a photographed image of the side of the material that is difficult to check with the naked eye by the carrier containing the material. have.

5 is an exemplary view showing the loading system 30 according to the present invention. As shown in FIG. 5, the tray containing the material is put into a plurality of cartridges, and includes a first vacuum adsorption module 31 for transporting the material of the tray from the tray to the carrier by moving three axes. The plurality of cartridges consists of a first cartridge 32 into which a tray in a state in which a material is received and a second cartridge 33 in which a tray in a state in which the material is separated by the first vacuum adsorption module 31 is accommodated. And a tray transport module 34 for transporting a tray from the first cartridge 32 to the second cartridge 33.

In other words, the tray inserted into the first cartridge 32 is accommodated in the second cartridge 33 by the tray transport module 34 after the material is released by the first vacuum adsorption module 31. In this case, the first vacuum adsorption module 31 and the tray transport module 34 may be combined with a separate moving unit that moves on three axes to perform a corresponding process.

The unloading system 40 has a structure that is inverted based on the x-axis direction in which the first transfer module 110 carries the carrier, and can vacuum-adsorb the camera module for which the manufacturing process has been completed to an empty tray. have.

In addition, the loading system 30 and the unloading system 40 are lifting modules 250 for transporting carriers up and down between the plurality of transfer modules 110 and 120 circulating the carriers in the plurality of manufacturing process systems 10. ) To circulate the carrier used in the system. That is, various embodiments may exist depending on the shape and structure of the camera module to be manufactured, but the beginning and end of all the embodiments consist of the loading system 30 and the unloading system 40.

6 is an exemplary view showing a buffer 300 of a plurality of process systems according to the present invention. As shown in FIG. 6, a configuration for minimizing a delay according to a difference in a corresponding process time performed by a plurality of process modules 200 on a material based on the buffer. Although the embodiment of FIG. 6 is disposed behind the inspection module 240, the buffer 300 may be disposed between a plurality of process modules 200 that are different from each other regardless of the type of the plurality of process modules 200. . In addition, a carrier transport module for transporting a carrier to the buffer 300 is formed in a combined structure, so that the material is not transported one by one, but is transported in a carrier state that is introduced into the system.

For example, in the example of FIG. 6, if the process module 200 disposed behind the buffer 300 has not completed the acquisition of the captured image, the first carrier The transport module carries the carrier containing the material to the buffer 300 and waits until the process of the process module 200 at the rear is completed. That is, the inspection module 240 performs a process of obtaining a captured image by receiving another carrier, thereby preventing an overall delay phenomenon that may occur in the manufacturing process.

In addition, the upper surface of the buffer 300 may further include a carrier placing unit 310 capable of placing one carrier, so that the manager may perform a quality check on the material of the carrier placing unit 310.

7 is an exemplary diagram showing a carrier replacement system 50 according to the present invention. As shown in Figure 7, the carrier replacement system 50 is a material from the carrier used in the pre-process system to the carrier used in the post-process system based on the direction in which the first transfer module 110 transports the carrier. It is a system that carries. For example, the stiffener attaching system 12 includes the side peeling system 13 and the neck dispensing system 14 performing a process on the side of the material if the opening of the carrier for receiving the material is formed only on the upper side of the material. The carrier used in) must have an opening formed on the side of the material, and the carrier used in the laser marking system 15 must have an opening formed on the lower surface of the material. That is, as the types of carriers used in the plurality of process systems 10 are different, the carrier replacement system 50 transports materials between the plurality of carriers.

Based on the direction in which the first transport module 110 transports the carrier, the carrier transport module 51 transports the carrier used in the post-processing system to the first transport module 110, and the material is separated. The carrier of the process system is conveyed to the second transfer module 120.

In addition, a cleaning cartridge 53 for stacking a plurality of carriers between the first transfer module 110 and the second transfer module 120 may be further included according to an input signal from the manager. That is, in order to perform the cleaning process of the carrier, the carrier transport module 51 is configured to stack a plurality of carriers by type and discharge them to the manager side, and the carriers that have been cleaned are put back into the cleaning cartridge 53, It is transferred to the first transfer module 110 or the second transfer module 120 to perform a carrier replacement process.

Material movement between a plurality of carriers having different openings may be performed by the second vacuum adsorption module 52.

So far, the present invention has been looked at around the preferred embodiment.

The embodiments described in the present specification and the configurations shown in the drawings are related to one of the most preferred embodiments of the present invention, and do not represent all the technical spirit of the present invention, and thus various equivalents and modified It should be understood that there may be examples.

Therefore, the present invention is not limited to the examples presented, and is within the equivalent scope of the technical idea of the present invention and the technical idea described in the claims to be described below by a person of ordinary skill in the technical field to which the present invention belongs. There may be embodiments in which various modifications and changes are possible.

10: process system
11: bonding system 12: stiffener attaching system
13: side peeling system 14: neck dispensing system
15: laser marking system
20: processing unit
30: loading system
31: first vacuum adsorption module 32: first cartridge
33: second cartridge 34: tray transport module
40: unloading system
50: carrier replacement system
51: carrier transport module 52: second vacuum adsorption module
53: cleaning cartridge
100: transfer module
110: first transfer module 120: second transfer module
200: process module
210: attaching module
211: ACF attaching module 212: FPCB attaching module
220: heating module
230: dispensing module
231: first dispensing module 232: second dispensing module
240: inspection module
241: first inspection module 242: second inspection module
250: carrier lifting module

Claims (8)

A plurality of process systems 100 comprising a transfer module 100 for carrying a material or a carrier carrying a module in a predetermined direction in a manufacturing process and a plurality of process modules 200 for performing a manufacturing process on the material; And
A processing unit 20 interworking with the plurality of process systems 10 to calculate an order of processes in which the camera module is manufactured;
Including,
The plurality of process systems 10
A first communication unit interlocking with the processing unit 20 to transmit and receive signals, an ID storage unit storing an identification signal of a corresponding process system, and a position detection unit detecting a process system coupled to the front and rear sides,
The processing unit 20
The second communication unit 21 interlocking with the first communication unit to transmit and receive signals, the position identification unit 22 determining the position where the plurality of process systems 10 are disposed, and the position identification unit 22 Further comprising a process operation unit 23 for calculating the order of the manufacturing process with the data calculated as, and a database 24 for storing data for a plurality of embodiments in which the plurality of process systems 10 can be combined with each other,
The location identification unit 22
The order in which the plurality of process systems 10 are arranged is determined, and corresponding information is transmitted to the process operation unit 23,
The process operation unit 23
The camera module manufacturing in-line system with improved process rate, characterized in that the transfer module 100 calculates a manufacturing process according to a direction in which the carrier is transferred.
The method of claim 1,
The plurality of process systems 10
Bonding system 11 for bonding the film and the printed circuit board to the material;
A stiffener attaching system 12 for bonding the reinforcement to the material;
A side peeling system 13 for applying an adhesive solution to gaps formed in the material;
A neck dispensing system 14 for applying a solution coupling the connector between the material and the printed circuit board; And
A laser marking system 15 for writing information to the manufactured module;
Camera module manufacturing in-line system with improved process rate further comprising.
The method of claim 2,
A loading system 30 disposed at the starting point of the plurality of process systems 10 along the direction in which the transfer module 100 travels, and
Camera module manufacturing in-line system with improved process rate further comprising an unloading system 40 disposed at a point where all manufacturing processes of the plurality of process systems 10 are completed.
The method of claim 3,
The transfer module 100 is
The first transport module 110 for transporting the carrier containing the material to the process module 200 and
The process is completed by the process module 200, further comprising a second transfer module 120 for carrying an empty carrier,
The loading system 30 and the unloading system 40
A camera module manufacturing in-line system with improved process rate further comprising an elevating module for circulating a carrier between the first transfer module 110 and the second transfer module 120.
The method of claim 1,
The final process module 200 of each of the plurality of process systems 10
Camera module manufacturing in-line system with improved process rate, characterized in that comprising an inspection module 240 that inspects the manufactured module and recovers defective products generated in the process.
The method of claim 5,
The inspection module 240 is
Further comprising a buffer 300 for loading a plurality of carriers in which the modules of the good product are accommodated,
The processing unit 20
Process rate characterized in that, based on the moving direction of the transfer unit 100, when the operation of the process system 10 disposed later is not normally performed, a module of a good product is temporarily stored in the buffer 300 This improved camera module manufacturing inline system.
The method of claim 1,
A carrier replacement system 50 comprising a vacuum transport module for transporting materials between a plurality of carriers and a carrier transport module 51 for transporting the carrier to the first transport module 110 or the second transport module 120. More including,
A camera module manufacturing in-line system with improved process rate, characterized in that a plurality of carriers having different openings are replaced in the system.
The method of claim 7,
The carrier replacement system 50
It is disposed between the first transfer module 110 and the second transfer module 120, further comprises a plurality of cartridges 53 for discharging the carrier to the outside of the system,
In response to a signal transmitted from the processing unit 20, the carrier transport module 51 transports the carrier to the plurality of cartridges 53. The camera module manufacturing in-line system with improved process rate.

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