JP2003204192A - Apparatus and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component in which a conveying order of boards in a production lot can be maintained as a rule of first-in, first-out and a product history can be correctly traced. <P>SOLUTION: The method for mounting the electronic component includes a step of mounting electronic components on the board 3 on mounting conveyors 2c of a plurality of rows of conveying routes 2A, 2B. The method further comprises the steps of alternatively supplying the boards 3 from a conveyor unit C1 to the routes 2A, 2B, and deciding a carrying out order when the boards 3 after mounting is finished are carried out from a conveyor unit C2 to a downstream side according to an order when the boards 3 are carried in the conveyor unit C1 from an upstream side. Thus, the conveying order of the boards in the production lot can be maintained as the rule of first-in, first-out. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a board.

[0002]

2. Description of the Related Art In an electronic component mounting process for manufacturing a mounting substrate on which electronic components are mounted, a substrate transfer means for transferring a substrate from an upstream side to a downstream side to a mounting device forming a mounting line for the purpose of high productivity. Those having a plurality of columns are used. With this configuration, in the mounting apparatus, the board to be mounted next can be always on standby together with the board being mounted. Therefore, when the mounting on one board is completed, the mounting work on the next board can be started immediately, and there is no dead time for the mounting head to wait in the stopped state until the next board is loaded. Instead, there is an advantage that the mounting work can be performed efficiently.

By the way, in the electronic component mounting process, it is necessary to have a means for tracing the product history from the request for quality control. For example, when a defect is found in the subsequent process, it is necessary to trace back to the previous process and specify the defective substrate so that the cause can be investigated. Usually, this product history is traced in many cases based on the transfer order of the board in the mounting line, and the board is specified by the additional number indicating the transfer order of the board in each production lot.

[0004]

However, in the electronic component mounting apparatus provided with the above-mentioned plurality of rows of substrate transfer means,
Since the mounting work can be performed on the mounting stages provided in each of the plurality of rows, if the loading order of the substrates to the mounting stage is not appropriate, the subsequent substrate loaded later will be more likely than the preceding substrate loaded earlier. A situation may occur in which the mounting work is completed first and the product is unloaded first. As a result, the transfer order of the boards in the production lot on the mounting line is
There is a problem in that it is not maintained according to the principle of first-out delivery, which causes inconvenience in tracking the product history.

Therefore, the present invention provides an electronic component mounting apparatus and an electronic component mounting method capable of maintaining the order of carrying substrates in a production lot in accordance with the principle of first-in / first-out and correctly tracking the product history. With the goal.

[0006]

An electronic component mounting apparatus according to claim 1, which is an electronic component mounting apparatus for mounting an electronic component on a substrate, comprises a plurality of rows of substrate conveying means for conveying the substrate, and these. A mounting stage on which a board on which electronic components are mounted and which is set on a transfer path by the board transfer means is placed,
Mounting means for picking up an electronic component from the component supply unit and transferring and mounting it on a substrate placed on the mounting stage, and a substrate arranged on the upstream side of the mounting stage and received from the upstream side to one of the substrate conveying means. A loading side substrate allocating means for selectively delivering, a unloading side substrate allocating means arranged downstream of the mounting stage and selectively receiving a substrate from any of the substrate transporting means to the downstream side, and a substrate after completion of mounting And a carry-in / carry-out control means for determining the carry-out order when carrying out the board to the downstream side by the carry-out side board distributing means according to the carry-in order when the board is carried into the carry-in side board distributing means from the upstream side. .

An electronic component mounting apparatus according to a second aspect is the electronic component mounting apparatus according to the first aspect, wherein the electronic component mounting apparatus is an unmounted device provided on the transfer path between the mounting stage and the loading-side board sorting means. A substrate standby stage, and / or a mounted substrate standby stage provided on the transport path between the mounting stage and the unloading-side substrate sorting means.

According to a third aspect of the present invention, there is provided an electronic component mounting method, wherein a plurality of rows of substrate carrying means for carrying boards and a board on which electronic components are mounted are set on a carrying path by the board carrying means. A stage, a mounting means for picking up an electronic component from a component supply unit and transferring and mounting the electronic component on a substrate mounted on the mounting stage, and a substrate arranged on the upstream side of the mounting stage and received from the upstream side of any one of the substrates. Loading-side board sorting means for selectively passing to the carrying means,
An electronic component that mounts an electronic component on a substrate by an electronic component mounting device that is arranged on the downstream side of the mounting stage and that has a unloading-side substrate allocating device that transfers the substrate selectively received from any of the substrate transporting devices to the downstream side. In the mounting method, the carrying-out order when carrying out the board after mounting is carried out to the downstream side by the carrying-out side board distributing means is according to the carrying-in order when the board is carried in from the upstream side to the carrying-in side board distributing means. decide.

According to the present invention, the unloading sequence for unloading the substrate after the mounting is completed in the mounting stage from the unloading-side substrate allocating means to the unloading-side substrate allocating means from the upstream side is By determining according to the carrying-in order at the time of carrying out, it is possible to maintain the carrying order of the substrates in the production lot according to the principle of first-in / first-out.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2A is a partial plan view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 1 is an arrangement view of a substrate stage of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIGS. 5, 6 and 7 are process explanatory diagrams of the board transporting operation in the electronic component mounting method according to the embodiment of the present invention.

First, the configuration of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a conveyor device C is provided on the upstream side and the downstream side of the base 1 of the electronic component mounting apparatus.
1, C2 are arranged. In the center of the base 1, the board 3
The two conveyor paths 2A and 2B that convey the
1 and C2 are connected and arranged in the X direction. The conveyor devices C1 and C2 are provided with a distribution conveyor 2a, and in the transfer paths 2A and 2B on the base 1, a carry-in conveyor 2b, a mounting conveyor 2c, and a carry-out conveyor 2d, which are board transfer means, are arranged in series. There is.

The sorting conveyors 2a of the conveyor devices C1 and C2 are both Y-movable by a slide mechanism (not shown).
The distribution conveyor 2a of the conveyor device C1 is slid so that the distribution conveyor 2a of the conveyor device C2 is selectively connected to the carry-in conveyor 2b of either of the transport paths 2A and 2B, and the distribution conveyor 2a of the conveyor device C2 slides. As a result, it is selectively connected to the carry-out conveyor 2d of either the transport path 2A or 2B.

The substrate 3 carried into the carry-in conveyor 2b from the upstream side via the conveyor device C1 is mounted on the mounting conveyor 2c.
Passed to. The board 3 is placed at a predetermined position of the mounting conveyor 2c.
There is a positioning part that places and positions
Electronic components are mounted on the substrate 3 positioned here by the mounting means described later. Then, the board 3 on which the mounting is completed is conveyed through the carry-out conveyor 2d to the conveyor device C.
It is carried out to No. 2 and further passed to the downstream side.

Outside each of the transport paths 2A and 2B,
The component supply unit 4 is arranged. A large number of tape feeders 5 are arranged in parallel in each of the component supply units 4. The tape feeder 5 stores the electronic components held on the tape,
Electronic components are supplied by pitch-feeding this tape.

A Y-axis table 6 is provided on both ends of the upper surface of the base 1.
A and 6B are arranged, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B.
By driving the Y-axis table 6A, the X-axis table 7A horizontally moves in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B horizontally moves in the Y direction. A transfer head 8 and a camera 9 that moves integrally with the transfer head 8 are mounted on the X-axis tables 7A and 7B, respectively.

Y-axis table 6A, X-axis table 7A, Y
The transfer head 8 moves horizontally by driving by combining the axis table 6B and the X-axis table 7B, picking up electronic components from the respective component supply units 4 by suction nozzles (not shown), and conveying paths 2A, 2B. It is mounted on the substrate 3 positioned at. Y-axis table 6A,
The X-axis table 7A (or the Y-axis table 6B, the X-axis table 7B) and the transfer head 8 constitute mounting means.

The camera 9 moved on the substrate 3 together with the transfer head 8 picks up and recognizes the substrate 3. A line camera 10 is arranged on the movement path from the component supply unit 4 to the conveyance paths 2A and 2B. The line camera 10 images the electronic components held by the respective transfer heads 8 from below. When the electronic component is mounted on the substrate 3 by the transfer head 8, the mounting position is corrected based on the position recognition result of the substrate 3 by the camera 9 and the position recognition result of the electronic component by the line camera 10.

Next, the substrate stage arrangement of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 2A, the carry-in conveyor 2b, the mounting conveyor 2c, and the carry-out conveyor 2d each constitute a substrate stage on which a substrate is placed. Mounting stages S2A, S for mounting and positioning the substrate 3 on the transport path of the transport conveyors 2c for the transport paths 2A, 2B for mounting by the mounting means described above.
2B is set.

The carry-in conveyor 2 on the transfer paths 2A and 2B
The conveyance path by b is the unmounted substrate standby stages S1A and S1B for waiting the unmounted substrate 3 received from the conveyor device C1 on the upstream side of the mounting stages S2A and S2B. Further, the unloading conveyor 2d on the transport paths 2A and 2B
As for the transportation route, the board 3 after mounting is mounted on the mounting conveyor 2c.
The mounted substrate standby stages S3A and S3B are made to stand by from the time to the transfer to the receiving conveyor device C2.

Here, the unmounted substrate standby stage S1A,
The S1B and mounted substrate standby stages S3A and S3B function as standby stages only when necessary based on the staying state of the substrate 3 on the downstream stage. That is, if the downstream stage is empty, the substrate 3 passes through these standby stages without stopping. On the other hand, when the stage on the downstream side is blocked by the preceding substrate, the substrate 3 passed from the upstream side is stopped and kept in the standby state until the substrate request signal from the downstream side is received.

The movement of the substrate 3 between these substrate stages will be described with reference to FIG. The substrate 3 transferred from the upstream side to the conveyor device C1 goes straight on the sorting conveyor 2a and moves straight to the unmounted substrate standby stage S1A of the transport path 2A, and the sorting conveyor 2b slides to transport the board 3B. The lane change transfer to transfer to the unmounted substrate standby stage S1B is selected.

Then, the unmounted substrate standby stages S1A, S
After that, the substrate 3 moved to 1B goes straight without changing the lane, and the mounting stages S2A, S2A,
S2B, the mounted substrate standby stages S3A and S3B are moved to. By the distribution conveyor 2a of the conveyor device C2 sliding, the mounted substrate standby stage S3A,
The board 3 after mounting from any of S3B is the conveyor device C.
It is handed over to No. 2 and is carried out to the downstream side.

Therefore, the conveyor device C1 is arranged on the upstream side of the mounting stage and receives the substrate 3 received from the upstream side of the mounting stage.
It serves as a loading-side board distribution means for selectively delivering to the (board carrying means), and the conveyor device C2 is arranged on the downstream side of the mounting stage and is an unloading conveyor 2d (board carrying means) on either of the carrying paths 2A and 2B. It serves as an unloading-side substrate allocating means that transfers the substrates 3 selectively received from the downstream side.

Next, the control system of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 3, the arithmetic unit 11 is a CPU, and executes various processing programs stored in the program storage unit 12 using various data stored in the data storage unit 13 to control each unit described below. To do. As a result, various operations and processing such as mounting operation and board transfer operation are executed.

The program storage unit 12 stores a mounting operation program, a transfer operation program, various operation programs such as a carry-in / carry-out control program, and an arithmetic processing program. The mounting operation program takes out the electronic component from the component supply unit 4 by the above-described mounting means in each unit mounting device, and mounts the electronic component on the board 3 on the mounting stage set on the mounting conveyor 2c of the transport path 2A (or 2B). This is an operation program for implementing.

Further, the transfer operation program sends the board 3 carried in from the upstream side to the electronic component mounting apparatus to a predetermined mounting stage where the mounting work is performed on the board 3, and the mounting operation is completed from the mounting stage. 2 is an operation program for sending the substrate 3 of FIG. Carry-in
The carry-out control program determines the carrying-out order when carrying out the board 3 after mounting to the downstream side by the conveyor device C2 according to the carrying-in order when the board 3 is carried in from the upstream side to the conveyor device C1. It is a program to do.

The data storage unit 13 stores data necessary for mounting operation such as component data and mounting coordinate data for each board type. Further, the data storage unit 13 has a storage area for substrate tracking, which is provided for each of the above-mentioned substrate stages and conveyor devices C1,
It is provided corresponding to C2. By writing the serial numbers of the substrates 3 existing on the respective substrate stages and the conveyor devices C1 and C2 when the electronic component mounting apparatus is in the operating state in these storage areas and updating the writing each time the substrate is moved, The arrangement state of the board 3 in the electronic component mounting apparatus can be monitored in real time.

The transport mechanism driving section 14 is a conveyor device C.
1, C2 sorting conveyor 2a, carry-in conveyor 2b,
The mounting conveyor 2c and the unloading conveyor 2d are driven. The mounting mechanism drive unit 15 drives the X-axis tables 7A and 7B, the Y-axis tables 6A and 6B, and the transfer head 8. That is, the calculation unit 11 is a mounting operation control unit that controls the mounting unit based on the mounting operation program, and also a transfer operation control unit that controls the substrate transfer unit and the substrate distribution unit based on the transfer operation program. . Further, the function realized by the arithmetic unit 11 executing the carry-in / carry-out control program constitutes a carry-in / carry-out control means.

The recognizing unit 16 recognizes the position of the substrate 3 by recognizing the imaged data by the camera 9, and recognizes the imaged data by the line camera 10, and is held by the transfer head 8. Recognize the position of electronic components. The operation / input unit 17 is an input means such as a keyboard and a mouse, and inputs various data and operations.

Next, the loading / unloading control of the substrate 3 will be described with reference to FIG. FIG. 4A shows a process of sorting the substrates 3 delivered from the upstream transporting means 20 by the conveyor device C1. A serial number N indicating the transport order in the production lot is given to the board 3 to be mounted, and the serial number N of the board 3 is supplied to the data storage unit each time a new board 3 is supplied from the transport means 20. Thirteen
Written in. Then, the moving destination of the substrate 3 is determined according to the additional number N. Here, it is determined to which of the unmounted substrate standby stages S1A and S1B the substrate is carried in depending on whether the additional number N of the new substrate 3 is an even number or an odd number.

For example, if the first substrate (serial number 1) is carried into the unmounted substrate standby stage S1B, FIG.
As shown in (a), all the odd numbered substrates 3 (N) among the subsequent substrates 3 are unmounted substrate standby stages S1B.
In addition, all the substrates 3 (N) with even additional numbers are carried into the unmounted substrate standby stage S1A. That is, the newly supplied substrate 3 is alternately supplied to the two transport paths 2A and 2B.

FIG. 4B shows an unmounted board standby stage S.
1A, S1B to mounting stages S2A, S2B Substrate 3
7A and 7B show a method of determining the order before and after when moving the substrate 3 and when moving the substrate 3 from the mounting stages S2A, S2B to the mounted substrate waiting stages S3A, S3B. That is, when the substrates 3 are present at the same timing on the two substrate stages located in parallel on the transport paths 2A and 2B, the substrate to be moved in advance is determined according to the following criteria.

Here, a comparison is made between the serial number NA of the substrate 3 on the transport path 2A side and the serial number NB of the substrate 3 on the transport path 2B side. If NA is smaller than NB, the substrate 3 (N
Move A) first. If NA is larger than NB, the substrate 3 (NB) is moved in advance.

FIG. 4C shows the mounted substrate waiting stage S.
It shows the movement of the substrate 3 from 3A, S3B to the conveyor device C2. Even in this case, when the substrates 3 are present on the mounted substrate standby stages S3A and S3B at the same timing, the substrate to be moved in advance is determined by the same method as the example shown in FIG. 4B. . Then, the mounted substrate 3 delivered to the conveyor device C2 is used as the downstream conveying means 2
It is carried out to 1.

That is, in the loading / unloading control of the substrate 3 in the present embodiment, when the substrate 3 is present at the same timing on the two substrate stages in the parallel positions of the two transport paths 2A and 2B, the upstream side is used. According to the order of loading from the side, the order of moving the substrates 3 is determined so that the principle of first-in / first-out is maintained.

Next, with reference to FIG. 5, FIG. 6 and FIG. 7, a board transfer operation in mounting electronic components will be described. In addition, in the following description, a serial number N assigned to the substrate 3 in the order of supply is added to each production lot (example: 3 (1), 3
(2), 3 (3) ...), and individual boards are distinguished. The transport paths 2A and 2B are simply referred to as 2A and 2B, and the reference numerals of the carry-in conveyor 2b, the mounting conveyor 2c, and the carry-out conveyor 2d in the electronic component mounting apparatus are omitted, and only the reference numerals of the substrate stage are shown. ing. further,
Substrate stages (unmounted substrate standby stage, mounted stage, mounted substrate standby stage) are simply abbreviated as “stages” and are distinguished only by reference numerals.

FIG. 5A shows a state in which the sorting conveyor 2a (see FIG. 1) of the conveyor device C1 which receives the first substrate 3 (1) from the upstream side is located on the 2B side. Then, here, the serial number N of the substrate 3 is determined,
As shown in FIG. 5B, the odd-numbered board 3 (1) passes through the stage S1B on the 2B side and moves to the stage SB2, where the mounting work for the board 3 (1) is performed. Be seen. In the subsequent substrate loading operation, all the odd numbered substrates 3 are loaded into the transport path 2B. In the conveyor device C1, the distribution conveyor 2a that receives the substrate 3 (2) from the upstream side is located on the 2A side.

Then, as shown in FIG. 5C, the even-numbered substrate 3 (2) passes through the stage S1A on the 2A side and moves to the stage S2A, where the substrate 3 (2) is targeted. The mounting work is performed. In the subsequent substrate loading operation, all the even-numbered substrates 3 are loaded to the transport path 2A side. In the conveyor device C1, the substrate 3
The sorting conveyor 2a that has received (3) moves to the 2B side. The substrates 3 (1) and 3 (2) are the stage S2.
When moving to B and S2A, since there is no preceding substrate, the standby in stages S1B and S1A is not performed.

After this, as shown in FIG. 6A, the substrate 3
(3) moves to the stage S1B and waits there. In addition, in the conveyor device C1, a new substrate 3 is added from the upstream side.
The sorting conveyor 2a that has received (4) is located on the 2A side. Then, as shown in FIG. 6B, the substrate 3
Similarly, (4) moves to the stage S1A and waits there. In the conveyor device C1, a new substrate 3 is added from the upstream side.
The sorting conveyor 2a that has received (5) moves to the 2B side.

After this, the board 3 after mounting is carried out. As shown in FIG. 6C, of the two substrates 3 on the two stages S2A and S2B in the parallel position, the substrate 3 (1) that has been carried in first and completed the mounting work first is the substrate 3
Prior to (2), it is unloaded from the stage S2B, passes through the empty stage S3B, and transfers to the sorting conveyor 2a of the conveyor device C2. At this time, it is confirmed that the serial number of the substrate 3 (1) is smaller than the serial number of the substrate 3 (2), and then the substrate 3 (1) is moved.

Next, as shown in FIG. 7A, the substrate 3 (2) for which the mounting work has been completed is carried out from the stage S2A, passes through the empty stage S3A, and is transferred to the distribution conveyor 2a of the conveyor device C2. Also, the substrate 3 (3)
Moves to the stage S2B, where the mounting work for the substrate 3 (3) is performed. At this time, it is confirmed that the serial number of the substrate 3 (3) is smaller than the serial number of the substrate 3 (4), and then the substrate 3 (3) is moved. Then, the substrate 3 (5) moves to the stage S1B and stands by there. In the conveyor device C1, the distribution conveyor 2a that receives the substrate 3 (6) from the upstream side is located on the 2A side.

Thereafter, as shown in FIG. 7B, the substrate 3
(4) moves to the stage S2A, where the substrate 3 (4)
The mounting work targeting is started. Also substrate 3 (6)
Moves to stage S1A and waits there. In the conveyor device C1, the distribution conveyor 2a that has received the substrate 3 (7) moves to the 2B side. After that, the same mounting operation and board transfer operation are repeated and continued.

As described above, in the electronic component mounting shown in the present embodiment, the unloading sequence for unloading the board 3 after the mounting is completed to the downstream side by the conveyor device C2 is as follows.
The board is determined according to the carrying-in order when the board is carried into the conveyor device C1 from the upstream side. Therefore, the board production order in each production lot is not confused by the complexity of board transportation in the electronic component mounting apparatus, and the principle of first-in / first-out is always maintained. As a result, when a product defect is found in the subsequent process, it is possible to trace back to the previous process and identify the defective substrate based on the transfer order of the substrates, and reliably trace the product history when the defect occurs. be able to.

[0044]

According to the present invention, the unloading sequence when unloading a substrate after mounting is completed at the mounting stage from the unloading side substrate allocating means to the unloading side substrate allocating means By deciding according to the delivery order when delivered to, the order of boards in individual production lots can be maintained according to the principle of first-in / first-out,
It is possible to reliably trace the product history when a defect occurs.

[Brief description of drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2A is a partial plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2B is a layout diagram of a substrate stage of the electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 4 is an explanatory diagram of loading / unloading control in the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 5 is a process explanatory diagram of a board conveying operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 6 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 7 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

[Explanation of symbols]

2A, 2B transport path 2a Sorting conveyor 2b Carry-in conveyor 2c mounting conveyor 2d carry-out conveyor 3 substrates 4 Parts supply department 6A, 6B Y-axis table 7A, 7B X-axis table 8 Transfer head 11 Operation part 12 Program storage

Claims (3)

[Claims] 1. An electronic component mounting apparatus for mounting an electronic component on a board, comprising a plurality of rows of board carrying means for carrying the board and electronic parts mounted on a carrying path by the board carrying means. A mounting stage for mounting a substrate
Mounting means for picking up an electronic component from the component supply unit and transferring and mounting it on a substrate placed on the mounting stage, and a substrate arranged on the upstream side of the mounting stage and received from the upstream side to one of the substrate conveying means. A loading side substrate allocating means for selectively delivering, a unloading side substrate allocating means arranged downstream of the mounting stage and selectively receiving a substrate from any of the substrate transporting means to the downstream side, and a substrate after completion of mounting And a carry-in / carry-out control means for determining the carry-out order when carrying out the board to the downstream side by the carry-out side board distributing means according to the carry-in order when the board is carried into the carry-in side board distributing means from the upstream side. An electronic component mounting device characterized by the above. 2. An unmounted substrate standby stage provided on the transfer path between the mounting stage and the loading-side substrate distribution means, and / or the transfer path between the mounting stage and the unload-side substrate distribution means. 2. A mounted substrate stand-by stage provided on the upper side.
Electronic component mounting apparatus described. 3. A plurality of rows of substrate transfer means for transferring substrates,
A mounting stage for mounting a substrate on which electronic components are mounted, which is set on the transport path by the substrate transport means, and an electronic component is picked up from a component supply unit and transferred and mounted on the substrate mounted on the mounting stage. Mounting means, a loading-side substrate allocating means which is arranged upstream of the mounting stage and selectively delivers a substrate received from the upstream side to one of the substrate conveying means, and one of which is arranged downstream of the mounting stage. An electronic component mounting method for mounting an electronic component on a substrate by an electronic component mounting device comprising: a delivery-side substrate distribution unit that delivers a substrate selectively received from a substrate transfer unit to a downstream side; The carrying-out order when carrying out the substrate to the downstream side by the carrying-out side substrate distributing means is such that the substrate is carried in from the upstream side to the carrying-in side substrate distributing means. Electronic component mounting method characterized by determining the order.