JP2010050398A - Surface mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mounting device without being interrupted in component mounting work because of substrate conveyance. <P>SOLUTION: Mounting stations 14A, 14B for moving the substrates and fixing the same at predetermined positions to mount a component thereon are provided with a plurality of conveyance lanes 14A1, 14A2, 14B1, 14B2 for moving the substrate 1 while carry-in units 16A, 16B for carrying the substrate into the mounting stations 14A, 14B and carry-out units 16B, 16C for receiving the substrate carried out of the mounting stations 14A, 14B are provided with one conveyance lane for moving the substrate, respectively, and are capable of moving into horizontal direction orthogonal to the moving direction of the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a surface mounting apparatus for mounting a component on a substrate, and more particularly to a surface mounting apparatus in which production of the substrate is improved and production efficiency is improved.

  FIG. 5 is a plan view schematically showing a surface mounting apparatus 100 which is an example of a conventional surface mounting apparatus. The conventional surface mounting apparatus 100 is assembled to the substrate transport unit 102, the X axis moving mechanisms 108A, 108B, 108C, and 108D, and the X axis moving mechanisms 108A, 108B, 108C, and 108D so as to be movable in the X direction. It includes mounting heads 110A, 110B, 110C, and 110D, and a Y-axis moving mechanism 112 that mounts the X-axis moving mechanisms 108A, 108B, 108C, and 108D so as to be movable in the Y direction.

  The substrate transfer unit 102 includes two loading stations 104A and 104B arranged in the substrate transfer direction, a loading unit 106A that receives the substrate 1 from the outside and loads the substrate 1 into the loading station 104A, and the loading station 104A. The loading / unloading unit 106B receives the coming substrate 1 and loads the substrate into the mounting station 104B, and the unloading unit 106C receives the substrate 1 unloaded from the loading station 104B and unloads the substrate 1 to the outside.

  The mounting stations 104A and 104B have a role of fixing the substrate 1 at the component mounting position by moving the fixed substrate 1 to a predetermined position and fixing it. In each of the mounting stations 104A and 104B, a substrate arrival detection sensor 130 is disposed on the substrate carry-in side, and a substrate passage detection sensor 132 is disposed on the substrate carry-out side, and the substrate 1 into the mounting stations 104A and 104B. The loading and unloading of the substrate 1 from the loading and loading stations 104A and 104B can be detected.

  The X-axis 108A, 108B, 108C, 108D is driven by the Y-axis moving mechanism 112 and can move in the Y direction. Therefore, the X-axis 108A, 108B, 108C, 108D is mounted so as to be movable in the X direction. The heads 110A, 110B, 110C, and 110D are movable in the horizontal direction (XY direction).

  The mounting heads 110A and 110B for mounting components mount components on the substrate 1 fixed to the mounting station 104A, and the mounting heads for mounting components on the substrate 1 fixed to the mounting station 104B. 110C and 110D mount components. Thus, the surface mounting apparatus 100 has a dual gantry configuration in which two mounting heads are arranged for one mounting station. A surface mount apparatus having a dual gantry configuration is also described in FIG.

JP 2002-208797 A (FIG. 7)

  However, in the conventional surface mounting apparatus 100 configured as shown in FIG. 5, after the board 1 that has finished mounting components at the mounting station 104A is carried out to the carry-in / out section 106B, a new board 1 is transferred from the carry-in section 106A to the mounting station 104A. It is carried in. For this reason, after the mounting of the substrate 1 at the mounting station 104A, the mounting of the component at the mounting station 104A cannot be performed until the new substrate 1 is carried into the mounting station 104A. Work was interrupted. Similarly, after the mounting of the substrate 1 at the mounting station 104B, the component mounting operation at the mounting station 104B can be performed until the new substrate 1 is transferred from the loading / unloading unit 106B to the mounting station 104B. The parts mounting work was interrupted.

  For this reason, in the conventional surface mounting apparatus 100 of the structure of FIG. 5, the efficiency of component mounting work has fallen.

  The present invention has been made in view of such problems, and an object of the present invention is to provide a surface mounting apparatus in which a component mounting operation is not interrupted for transporting a substrate.

  A surface mounting apparatus according to the present invention includes a mounting station that moves and fixes a substrate to a predetermined position for mounting components, a loading unit that loads the substrate into the mounting station, and a substrate that is unloaded from the mounting station. In the surface mounting apparatus, the mounting station has a plurality of transport lanes for moving the substrate, and the carry-in unit and the carry-out unit each have a transport lane for moving the substrate. It is characterized by having one each and moving in the horizontal direction perpendicular to the moving direction of the substrate.

  According to the present invention, the mounting station has a plurality of transfer lanes for moving the substrate, and the carry-in unit and the carry-out unit have one transfer lane for moving the substrate, respectively, and the moving direction of the substrate In the mounting station, the substrate can be carried into and out of the other lanes while the components are being mounted in one of the plurality of transfer lanes. For this reason, except for the time of loading the first board and the time of unloading the last board, in principle, it is no longer necessary to spend time only on board transportation. The component mounting operation can be performed, and the component mounting operation is not interrupted for the conveyance of the substrate, so that the efficiency of the component mounting operation is improved as compared with the prior art.

  In addition, since the carry-in part and the carry-out part have only one transport lane (single lane), it is possible to cope with the single-lane of the pre-process and post-process apparatuses, and the surface mounting apparatus according to the present invention Capital investment at the time of introduction can be suppressed.

  Hereinafter, a surface mounting apparatus 10 according to an embodiment of the present invention will be described in detail with reference to the drawings. In principle, parts having the same configuration and function as parts of a conventional surface mounting apparatus 100 are denoted by the same reference numerals. The description is omitted.

  FIG. 1 is a plan view schematically showing a surface mounting apparatus 10 according to an embodiment of the present invention. In the surface mounting apparatus 10, the parts having different configurations and functions from the parts of the conventional surface mounting apparatus 100 are the substrate transfer part 12, the carry-in part moving mechanism 18A, the carry-in / out part moving mechanism 18B, and the carry-out part moving mechanism 18C. Other parts (X-axis moving mechanisms 108A, 108B, 108C, 108D, mounting heads 110A, 110B, 110C, 110D, and Y-axis moving mechanism 112) are the same as the corresponding parts of the conventional surface mounting apparatus 100. Similar to the conventional surface mounting apparatus 100, the surface mounting apparatus 10 has a dual gantry configuration.

  The substrate transport unit 12 is unloaded from the two mounting stations 14A and 14B arranged in the transport direction of the substrate 1, a loading unit 16A that receives a substrate from outside and loads the substrate into the mounting station 14A, and the mounting station 14A. The loading / unloading unit 16B receives the substrate and loads the substrate into the mounting station 14B, and the unloading unit 16C receives the substrate unloaded from the loading station 14B and unloads the substrate to the outside. The carry-in / out unit 16B has a role as a carry-out unit that receives a substrate carried out from the mounting station 14A and a role as a carry-in unit that carries a substrate into the mounting station 14B.

  Although the basic roles of the mounting stations 14A and 14B, the loading section 16A, the loading / unloading section 16B, and the unloading section 16C of the surface mounting apparatus 10 according to this embodiment are the same as the corresponding portions of the conventional surface mounting apparatus 100. The corresponding parts of the conventional surface mounting apparatus 100 have the following different configurations and functions.

  That is, the loading station 14A has transfer lanes 14A1 and 14A2, the loading station 14B has transfer lanes 14B1 and 14B2, and the loading stations 14A and 14B each have two transfer lanes. In each of the transport lanes 14A1 and 14A2 and the transport lanes 14B1 and 14B2, the substrate arrival detection sensor 30 is disposed on the substrate carry-in side, and the substrate passage detection sensor 32 is disposed on the substrate carry-out side. , 14A2 and the transfer lanes 14B1 and 14B2, and the transfer of the substrate 1 from the transfer lanes 14A1 and 14A2 and the transfer lanes 14B1 and 14B2 can be detected.

  Further, the carry-in part 16A, the carry-in / out part 16B, and the carry-out part 16C can be moved in the Y direction by the carry-in part moving mechanism 18A, the carry-in / out part moving mechanism 18B, and the carry-out part moving mechanism 18C, respectively. For this reason, the carry-in unit 16A, the carry-in / out unit 16B, and the carry-out unit 16C have only one transfer lane, but the substrate 1 can be transferred between the loading stations 14A and 14B having two transfer lanes. ing. In addition, since the carry-in unit 16A and the carry-out unit 16C have only one transport lane (single lane), it is possible to cope with the single-lane apparatus in the previous process and the subsequent process, and the surface according to the present embodiment The capital investment when introducing the mounting apparatus 10 can be suppressed.

  The carry-in unit moving mechanism 18A, the carry-in / out unit moving mechanism 18B, and the carry-out unit moving mechanism 18C have a role of moving and positioning the carry-in unit 16A, the carry-in / out unit 16B, and the carry-out unit 16C in the Y direction. 16A, the carry-in / out part 16B, and the carry-out part 16C are supported from below so as to be movable in the Y direction.

  As described above, the surface mounting apparatus 10 according to the present embodiment has two transfer lanes (the transfer lanes 14A1 and 14A2 and the transfer lanes 14B1 and 14B2) in each of the mounting stations 14A and 14B, and the carry-in portion 16A. Since the loading / unloading unit 16B and the unloading unit 16C can move in the Y direction, the mounting station 14A can place the board on the other lane while mounting the components on one of the transfer lanes 14A1 and 14A2. In addition, in the mounting station 14B, the substrate can be transferred into and out of the other lane while the components are mounted in one of the transfer lanes 14B1 and 14B2. For this reason, in principle, it is not necessary to spend time only on transporting the board except when the first board is loaded and when the last board is unloaded. The component mounting operation can be performed, and the component mounting operation is not interrupted for the conveyance of the substrate, so that the efficiency of the component mounting operation is improved as compared with the prior art.

  FIG. 2 is a block diagram showing a control system of the surface mounting apparatus 10. The control device 40 grasps the movement of the substrate based on the sensor signals from the substrate arrival detection sensor 30 and the substrate passage detection sensor 32, and conveys the belts (not shown) of the transfer lanes 14A1 and 14A2 of the mounting station 14A and the mounting station 14B. The belts (not shown) of the transport lanes 14B1 and 14B2 and the belts (not shown) of the transport lanes 16A1, 16B1 and 16C1 of the carry-in unit 16A, the carry-in / out unit 16B, and the carry-out unit 16C are respectively connected to the belt drive motors 15A1 and 15A2. , 15B1, 15B2, 17A, 17B, and 17C to appropriately move the substrate. Further, the drive motors 19A, 19B, and 19C of the carry-in part moving mechanism 18A, the carry-in / out part moving mechanism 18B, and the carry-out part moving mechanism 18C are appropriately driven to move the carry-in part 16A, the carry-in / out part 16B, and the carry-out part 16C in the Y direction. The substrate 1 is appropriately moved so that the substrate 1 is appropriately transferred between the loading stations 14A and 14B and the carry-in unit 16A, the carry-in / out unit 16B, and the carry-out unit 16C.

  Next, an example of the operation of the surface mounting apparatus 10 according to the present embodiment (the process of mounting electronic components on the substrate 1) will be described with reference to FIG. 3 (plan view).

  First, as shown in FIG. 3A, the substrate 1 is carried from the carry-in section 16A to the carrying lane 14A1 of the mounting station 14A.

  Next, as shown in FIG. 3B, the substrate 1 is carried from the carry-in portion 16A to the conveyance lane 14A2 while the parts are being mounted on the conveyance lane 14A1.

  When the component mounting is completed in the transfer lane 14A1, as shown in FIG. 3C, the component is switched to the component loading in the transfer lane 14A2, and the substrate 1 in the transfer lane 14A1 is mounted during the component mounting in the transfer lane 14A2. It is carried out to the transfer lane 14B1 via the carry-in / out unit 16B, and the substrate 1 is newly carried into the transfer lane 14A1 from the carry-in unit 16A.

  When the component mounting is completed in the transfer lane 14A2, as shown in FIG. 3D, the component mounting is switched to the transfer lane 14A1, and the substrate 1 in the transfer lane 14A2 is loaded and unloaded while the components are mounted in the transfer lane 14A1. The substrate 1 is carried out to the transport lane 14B2 via the part 16B, and the substrate 1 is newly carried into the transport lane 14A2 from the carry-in part 16A. At this time, components are being mounted on the transfer lane 14B1 in the mounting station 14B.

  As shown in FIG. 3D, in the state where the board exists in the two lanes (transport lanes 14B1 and 14B2) of the mounting station 14B, when the component mounting is completed in the transport lane 14A1, as shown in FIG. In addition, the board 1 that has finished mounting components in the transport lane 14A1 is carried out to the carry-in / out unit 16B and waits in the carry-in / out unit 16B.

  Then, as shown in FIG. 3 (f), after component mounting in the transport lane 14B1 is completed and the substrate 1 is unloaded to the unloading unit 16C, the substrate 1 is transferred from the unloading / unloading unit 16B to the transfer lane 14B1. It is brought in.

  The operation of the surface mounting apparatus 10 according to the present embodiment will be described in more detail using the flowchart shown in FIG.

  First, the substrate 1 is carried into the loading station 14A from the carry-in portion 16A. At this time, it is determined whether or not there is a substrate in the transport lane 14A1 of the mounting station 14A (step S1-1), and if there is no substrate in the transport lane 14A1. The substrate is transferred to the transfer lane 14A1 (step S2-1). If there is a substrate in the transfer lane 14A1, it is determined whether there is a substrate in the transfer lane 14A2 of the mounting station 14A (step S1-2). If there is no substrate in the transfer lane 14A2, the substrate is transferred to the transfer lane 14A2 (step S1-2). S2-2). If there is a substrate in the transfer lane 14A2, the process returns to step S1-1. Hereinafter, the subsequent operation will be described separately for the case where the substrate is transferred to the transfer lane 14A1 (step S2-1) and the case where the substrate is transferred to the transfer lane 14A2 (step S2-2).

(1) Subsequent operations when the board is transported to the transport lane 14A1 (Step S2-1) It is determined whether or not components are being mounted in the transport lane 14A2 (Step S3-1), and components must be mounted in the transport lane 14A2. For example, component mounting is started in the transport lane 14A1 (step S4-1).

  While the parts are being mounted on the transfer lane 14A1, it is determined whether or not there is a board on the transfer lane 14A2 (step S5-1). If there is no board on the transfer lane 14A2, the board is transferred to the transfer lane 14A2 (step S5-1-1). 1). If there is a substrate in the transport lane 14A2, it is determined whether or not the component mounting in the transport lane 14A1 is completed (step S6-1). If the component mounting in the transport lane 14A1 is completed, there is a substrate in the loading / unloading unit 16B. If there is no board in the loading / unloading section 16B, the board on which component mounting is completed in the transfer lane 14A1 is transferred to the loading / unloading section 16B (step S8-1).

  If the component mounting of the transport lane 14A1 is not completed in step S6-1, it is determined again whether the component mounting of the transport lane 14A1 is completed (step S6-1). In step S7-1, if there is a substrate in the loading / unloading unit 16B, it is determined again whether there is a substrate in the loading / unloading unit 16B (step S7-1).

  When the substrate is transported to the transport lane 14A2 in step S5-1-1, it is determined whether or not the component mounting in the transport lane 14A1 is completed (step S5-1-2), and the component mounting in the transport lane 14A1 is completed. Then, the component mounting of the transport lane 14A2 is started (step S5-1-3), and thereafter, the same operation as the operation after step 4-2 is performed. If the component mounting of the transport lane 14A1 is not completed, it is determined again whether the component mounting of the transport lane 14A1 is completed (step S5-1-2).

(2) Subsequent operations when the board is transported to the transport lane 14A2 (step S2-2) It is determined whether or not components are being mounted in the transport lane 14A1 (step S3-2), and components must be mounted in the transport lane 14A1. For example, component mounting is started in the transport lane 14A2 (step S4-2).

  While the parts are being mounted on the transfer lane 14A2, it is determined whether or not there is a board on the transfer lane 14A1 (step S5-2). If there is no board on the transfer lane 14A1, the board is transferred to the transfer lane 14A1 (step S5-2). 1). If there is a substrate in the transport lane 14A1, it is determined whether or not the component mounting in the transport lane 14A2 is completed (step S6-2). If the component mounting in the transport lane 14A2 is completed, there is a substrate in the loading / unloading unit 16B. (Step S7-2), and if there is no board in the loading / unloading section 16B, the board 1 on which component mounting is completed in the transfer lane 14A2 is transferred to the loading / unloading section 16B (step S8-2).

  If it is determined in step S6-2 that component mounting in the transport lane 14A2 has not been completed, it is determined again whether component mounting in the transport lane 14A2 has been completed (step S6-2). If there is a substrate in the loading / unloading unit 16B in step S7-2, it is determined again whether there is a substrate in the loading / unloading unit 16B (step S7-2).

  When the substrate is transported to the transport lane 14A1 in step S5-2-1, it is determined whether or not the component mounting in the transport lane 14A2 is completed (step S5-2-2), and the component mounting in the transport lane 14A2 is completed. Then, the component mounting of the transport lane 14A1 is started (step S5-2-3), and thereafter the same operation as the operation after step 4-1 is performed. If the component mounting of the transport lane 14A2 is not completed, it is determined again whether the component mounting of the transport lane 14A2 is completed (step S5-2-2).

  In the flowchart of FIG. 4, the process is completed by transferring the substrate to the carry-in / out unit 16B. However, since the surface mounting apparatus 10 of the present embodiment includes the two mounting stations 14A and 14B, the substrate is transferred to the carry-in / out unit 16B. In the process up to the transfer, only the component mounting work at the mounting station 14A is completed. The component mounting operation at the mounting station 14B is carried in the loading / unloading section 16B by replacing the transfer lanes 14A1 and 14A2 with the transfer lanes 14B1 and 14B2 and the loading / unloading section 16B with the unloading section 16C in the flowchart of FIG. The substrate 1 may be transferred again from the beginning of the flowchart of FIG.

  The surface mounting device 10 of the present embodiment described above has a dual gantry configuration having two mounting heads for one mounting station. However, the present invention is not limited to a surface mounting device having a dual gantry configuration, The present invention can also be applied to a surface mounting apparatus having one mounting head for a mounting station, or a surface mounting apparatus having three or more mounting heads for one mounting station.

  The number of mounting stations of the surface mounting apparatus 10 of this embodiment is two. However, the present invention is a surface mounting apparatus having one mounting station or a surface mounting apparatus having three or more mounting stations. It can also be applied to.

  Further, in the mounting stations 14A and 14B of the surface mounting apparatus 10 of the present embodiment, the number of transport lanes is two, but the number of transport lanes may be three or more.

The top view which shows roughly the surface mounting apparatus which concerns on embodiment of this invention Block diagram showing a control system of the surface mounting apparatus The top view which shows typically an example of operation | movement (mounting process of the electronic component to a board | substrate) of the said surface mounting apparatus Flowchart showing the operation of the surface mounting apparatus The top view which shows roughly the surface mounting apparatus which is an example of the conventional surface mounting apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 10,100 ... Surface mounting apparatus 12, 102 ... Board | substrate conveyance part 14A, 14B, 104A, 104B ... Mounting station 14A1, 14A2, 14B1, 14B2 ... Conveyance lane 15A1, 15A2, 15B1, 15B2 ... Belt drive motor 16A, 106A ... Carry-in part 16B, 106B ... Carry-in / out part 16C, 106C ... Carry-out part 16A1, 16B1, 16C1 ... Transport lanes 17A, 17B, 17C ... Belt drive motor 18A ... Carry-in part moving mechanism 18B ... Carry-in / out part moving mechanism 18C ... Carry-out Part moving mechanism 19A ... carry-in part drive motor 19B ... carry-in / out part drive motor 19C ... carry-out part drive motor 30 ... board arrival detection sensor 32 ... board passage detection sensor 108A, 108B, 108C, 108D ... X-axis movement mechanism 110A, 110B, 110C, 110D ... Placing head 112 ... Y axis moving mechanism

Claims (1)

A surface having a mounting station that moves and fixes a substrate to a predetermined position for mounting components, a loading unit that loads the substrate into the loading station, and a carry-out unit that receives the substrate unloaded from the loading station In mounting equipment,
The mounting station has a plurality of transfer lanes for moving the substrate,
The carry-in unit and the carry-out unit each have one transfer lane for moving a substrate and can move in a horizontal direction perpendicular to the moving direction of the substrate.

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