JP2003204191A - Apparatus and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component which can deal with various mounting states without providing a special board conveying mechanism for a bypass. <P>SOLUTION: The method for mounting an electronic component comprises a step of switching a mounting operation program and a conveying operation program in an electronic component mounting line having conveyer devices C1, C2, C3 and C4, mounting units M1, M2 and M3 having two rows of conveying passages 2A, 2B having conveyors each for conveying a board and a sorting conveyor 2b, and switching a plurality-of-rows mounting state in which the passages 2A, 2B are used as mounting stage, and a bypass mounting state in which any of the passages 2A, 2B is used as a bypass conveying route for allowing a following board to pass through the preceding board to be conveyed. Thus, the various mounting state can be dealt with without providing the special purpose bypass board conveying mechanism. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting electronic components on a board.

[0002]

2. Description of the Related Art In an electronic component mounting process for manufacturing a mounting board on which electronic components are mounted, a plurality of unit mounting devices are connected to form a mounting line for electronic components for the purpose of high productivity. Be seen. In recent years, as a unit mounting device used in this mounting line, a unit mounting device which has a plurality of rows of substrate transfer means for transferring a substrate from upstream to downstream has been used.

With this configuration, in each unit mounting apparatus, the board to be mounted next can be always on standby together with the board being mounted. Therefore, when the mounting on one board is completed, the mounting work on the next board can be started immediately, and there is no dead time for the mounting head to wait in the stopped state until the next board is loaded. Instead, there is an advantage that the mounting work can be performed efficiently.

[0004]

By the way, the mounting boards targeted for the same mounting line have been diversified, and the mounting line is required to have an ability to cope with more and more diverse production forms. In the above-described mounting line configured by connecting a large number of unit mounting devices in series, it is important to carry in / out the substrate at appropriate timing so that no dead time is generated in each unit mounting device.

Therefore, regardless of the mounting state of each unit mounting device, a bypass transfer mechanism for transferring the substrate by bypassing each unit mounting device is provided for the purpose of transferring the substrate from upstream to downstream. . By providing this bypass transport mechanism, it becomes possible to carry in and carry out a substrate to and from an arbitrary unit mounting apparatus at an arbitrary timing.

However, this bypass transport mechanism is
Since it is necessary to additionally provide a mechanism such as a conveyor on the side or above each unit mounting device, this leads to an increase in device cost and an increase in occupied space. For this reason,
There has been a demand for a mounting line configuration capable of coping with various mounting forms without providing a substrate transfer mechanism dedicated to bypass.

Therefore, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of coping with various mounting modes without providing a substrate transfer mechanism dedicated to bypass.

[0008]

An electronic component mounting apparatus according to claim 1 is an electronic component mounting apparatus configured by connecting a plurality of unit mounting apparatuses for mounting electronic components on a substrate,
A plurality of rows of board transfer means provided in the unit mounting apparatus for transferring the board, a mounting stage for mounting a board on which electronic components are mounted and set on a transfer path by the board transfer means, and the unit mounting Mounting means provided in the device for picking up electronic components from a component supply unit and transferring and mounting them on a substrate mounted on the mounting stage; and any one of the upstream unit mounting devices arranged between the unit mounting devices. A board distribution means for selectively delivering the board received from the carrying means to one of the board carrying means of the downstream unit mounting device, a mounting operation control section for controlling the mounting means based on a mounting operation program, and a carrying operation A transfer operation control unit that controls the board transfer unit and the board distribution unit based on a program, and the mounting operation program and transfer operation program By switching, a multi-row mounting mode in which each of the plurality of rows of board carrying means is used as a mounting stage, and a plurality of rows of board carrying means as a bypass carrying path that allows the succeeding board to overtake the preceding board And a mounting mode switching unit for switching between a bypass mounting mode using one of them.

According to a second aspect of the present invention, there is provided an electronic component mounting method in which a plurality of rows of board carrying means for carrying boards and a board on which electronic parts are mounted are set on a carrying path by these board carrying means. A plurality of unit mounting devices having a stage and a mounting means for picking up an electronic component from a component supply unit and transferring and mounting the electronic component on a substrate mounted on the mounting stage are connected and arranged between the unit mounting devices. Board distribution means for selectively delivering the board received from any one of the board transfer means of the upstream unit mounting apparatus to any board transfer means of the downstream unit mounting apparatus, and the mounting based on the mounting operation program. An electronic section including a mounting operation control section for controlling the means, and a transfer operation control section for controlling the board transfer means and the board allocating means based on a transfer operation program. A method of mounting an electronic component by a mounting apparatus, wherein a plurality of columns mounting mode in which each of the plurality of columns of substrate conveying means is used as a mounting stage by switching between the mounting operation program and the transfer operation program and a succeeding substrate is a preceding substrate. The bypass mounting mode, in which one of the plurality of rows of the transport paths is used as the bypass transport path for allowing the transport to pass over.

According to the present invention, in a mounting line in which unit mounting devices having a plurality of rows of substrate transfer means are connected, a plurality of rows mounting mode in which each of the plurality of rows of board transfer means is used as a mounting stage and a subsequent substrate To provide a board transfer mechanism dedicated to bypass by switching between a bypass mounting mode in which one of a plurality of rows of board transfer means is used as a bypass transfer path for allowing the transfer of the board passing the preceding board. It is possible to cope with various mounting forms.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention, FIG. 2 is a plan view of a unit mounting device according to an embodiment of the present invention, and FIG. 3 is an electronic component according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of the board distribution operation in the mounting line, FIG. 4 is a block diagram showing the configuration of the control system of the electronic component mounting line of one embodiment of the present invention, FIG. 5, FIG. 6, FIG.
8, FIG. 9 and FIG. 10 are process explanatory diagrams of the board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

First, the configuration of an electronic component mounting line (electronic component mounting apparatus) will be described with reference to FIG. In FIG. 1, the electronic component mounting line is configured by serially connecting unit mounting devices M1, M2, and M3 for mounting electronic components, and a substrate carried in from the upstream side is mounted by any unit mounting device. By being sent to the stage, a predetermined mounting operation on the substrate is completed at the mounting stage. These unit mounting devices M1,
Before and after M2, M3, conveyor devices C1, C2, C
3, C4 are arranged, and the conveyor devices C1, C2
Each of C3 and C4 includes a distribution conveyor 2b that receives the board to be mounted from the upstream side and transfers it to the downstream side.

Next, the structure of the unit mounting device 2 will be described with reference to FIG. In FIG. 2, two transfer paths 2A and 2B are provided in the center of a base 1 in the X direction, and the transfer paths 2A and 2B are transfer conveyors 2a as a transfer means for transferring a substrate 3, respectively. I have it. A positioning unit for mounting and positioning the substrate 3 is provided at a predetermined position of the transport conveyor 2a, and electronic components are mounted on the positioned substrate 3 by the mounting means described later. Therefore, a mounting stage on which the substrate 3 is placed is set on the transfer path of the transfer conveyors 2a on the transfer paths 2A and 2B.

Outside each of the transport paths 2A and 2B,
The component supply unit 4 is arranged. A large number of tape feeders 5 are arranged in parallel in each of the component supply units 4. The tape feeder 5 stores the electronic components held on the tape,
Electronic components are supplied by pitch-feeding this tape.

A Y-axis table 6 is provided on both ends of the upper surface of the base 1.
A and 6B are arranged, and two X-axis tables 7A and 7B are installed on the Y-axis tables 6A and 6B.
By driving the Y-axis table 6A, the X-axis table 7A horizontally moves in the Y direction, and by driving the Y-axis table 6B, the X-axis table 7B horizontally moves in the Y direction. A transfer head 8 and a camera 9 that moves integrally with the transfer head 8 are mounted on the X-axis tables 7A and 7B, respectively.

Y-axis table 6A, X-axis table 7A, Y
The transfer head 8 moves horizontally by driving by combining the axis table 6B and the X-axis table 7B, picking up electronic components from the respective component supply units 4 by suction nozzles (not shown), and conveying paths 2A, 2B. It is mounted on the substrate 3 positioned at. Y-axis table 6A,
The X-axis table 7A (or the Y-axis table 6B, the X-axis table 7B) and the transfer head 8 constitute mounting means.

The camera 9 moved on the substrate 3 together with the transfer head 8 picks up and recognizes the substrate 3. A line camera 10 is arranged on the movement path from the component supply unit 4 to the conveyance paths 2A and 2B. The line camera 10 images the electronic components held by the respective transfer heads 8 from below. When the electronic component is mounted on the substrate 3 by the transfer head 8, the mounting position is corrected based on the position recognition result of the substrate 3 by the camera 9 and the position recognition result of the electronic component by the line camera 10.

Next, with reference to FIG. 3, the function of distributing the substrates by the conveyor device will be described. Conveyor device C
1, C2, C3, C4 sorting conveyor 2b is slidable in the Y direction by a slide mechanism (not shown), and this sorting mechanism selects sorting conveyor 2b from upstream and downstream transport paths 2A, 2B. Are linked together.

That is, as shown in FIG. 3 (a), when the substrate transferred on the upstream transfer path 2A and transferred to the conveyor device C2 (C3) is transferred to the downstream side, the distribution conveyor 2b is directly operated. The straight-ahead transport that transfers to the downstream-side transport path 2A and the lane-change transport that transfers to the downstream-side transport path 2B due to the distribution conveyor 2b sliding are selected. Further, as shown in FIG. 3B, the conveyor device C2 (C3) is conveyed along the upstream conveying path 2B.
Similarly, when the board delivered to the downstream side is delivered to the downstream side, the straight-line transportation that transfers to the downstream transportation path 2A and the lane change transportation that transfers to the transportation path 2B are similarly selected. Therefore, the conveyor devices C2 and C3 are arranged between the unit mounting devices, and selectively receive the substrate received from any one of the substrate carrying units of the upstream unit mounting devices to any substrate carrying unit of the downstream unit mounting devices. It is a means to distribute the board to

The conveyor device C1 has a function of selectively distributing the substrates 3 received from the distribution conveyor 2b from the upstream side to one of the transport paths 2A and 2B of the unit mounting device M1, and also the conveyor device C4. Is the conveyance path 2 of the unit mounting apparatus M3 by the distribution conveyor 2b.
It has a function of passing the substrate selectively received from either A or 2B to the downstream side.

Next, the control system of the electronic component mounting line will be described with reference to FIG. In FIG. 4, the calculation unit 11
Is a CPU, which controls each unit described below by executing various processing programs stored in the program storage unit 12 using various data stored in the data storage unit 13. As a result, various operations and processes such as a mounting operation in each unit mounting apparatus, a board transfer operation, and a board transfer operation between each unit mounting apparatus are executed.

The program storage unit 12 stores a mounting operation program, various operation programs such as a transfer operation program, and an arithmetic processing program. The mounting operation program takes out the electronic component from the component supply unit 4 by the mounting means in each unit mounting device,
It is an operation program for mounting an electronic component on the substrate 3 on the mounting stage set on the A (or 2B) transport conveyor 2a. In addition, the transfer operation program uses the board 3 loaded from the upstream side of the electronic component mounting line,
It is an operation program for sending the mounted board 3 to the downstream side from the predetermined mounting stage while sending it to the mounting stage of the predetermined unit mounting apparatus where the mounting work is performed on the board.

Here, as the mounting operation program and the transfer operation program, a plurality of types of programs are stored according to the mounting form adopted in the electronic component mounting line, and as described later, each time the mounting form is switched. The mounting operation program and the transfer operation program corresponding to the mounting form are read from the program storage unit 12. The data storage unit 13 stores data necessary for mounting operation such as component data and mounting coordinate data for each board type.

The transport mechanism drive unit 14 drives the transport conveyor 2a of each unit mounting device and the distribution conveyor 2b of each conveyor device. The mounting mechanism drive unit 15 drives the X-axis tables 7A and 7B, the Y-axis tables 6A and 6B, and the transfer head 8. That is, the calculation unit 11 is a mounting operation control unit that controls the mounting unit based on the mounting operation program, and also a transfer operation control unit that controls the substrate transfer unit and the substrate distribution unit based on the transfer operation program. .

The recognizing unit 16 recognizes the position of the substrate 3 by recognizing the imaged data by the camera 9, and recognizes the imaged data by the line camera 10 and is held by the transfer head 8. Recognize the position of electronic components. The operation / input unit 17 is an input means such as a keyboard and a mouse, and inputs various data and operation inputs such as a mounting mode switching instruction command described later. Then, according to this instruction, the calculation unit 11 reads the mounting operation program and the transfer operation program corresponding to the mounting form from the program storage unit 12 according to the operation input instruction. That is, the operation / input unit 17 and the arithmetic unit 11
Is a mounting mode switching unit that switches between the multi-column mounting mode and the bypass mounting mode by switching between the mounting operation program and the transfer operation program.

Next, an electronic component mounting method executed using this electronic component mounting line will be described. First, with reference to FIG. 5, FIG. 6, and FIG. 7, a substrate transfer operation in a multi-row mounting mode in which each of a plurality of rows (two rows) of substrate transfer means is used as a mounting stage will be described. In the following description, the individual substrates are distinguished by adding subscripts a, b, c ... In addition, the transport paths 2A, 2
B is simply described as 2A and 2B, and the reference numerals of the transport conveyor 2a in the unit mounting devices M1, M2, M3 and the distribution conveyor 2b in the conveyor devices C1, C2, C3, C4 are omitted.

FIG. 5A is a distribution conveyor 2b (FIG. 3) of the conveyor device C1 which receives the substrate 3a from the upstream side.
(See) is located on the 2B side. After that, the board 3a is transferred to the transport conveyor 2a (see FIG. 2) of the unit mounting apparatus M1 as shown in FIG. 5B.

In parallel with this operation, in the conveyor device C1, the sorting conveyor 2b which receives the substrate 3b from the upstream side moves to the 2A side. Then, as shown in FIG. 5C, the board 3b is transferred to the transport conveyor 2a on the 2A side of the unit mounting apparatus M1, and in the conveyor apparatus C1, the sorting conveyor 2b that receives the board 3c from the upstream side is 2
Move to B side.

Thereafter, as shown in FIG. 6A, the substrate 3a
Transfers to the conveyor device C2, and then transfers to the transfer conveyor 2a of the unit mounting device M2 as shown in FIG. 6 (b). After this, the sorting conveyor 2b of the conveyor device C2
Moves to the 2A side and receives the board 3b from the unit mounting apparatus M1. In parallel with this operation, the board 3c moves from the conveyor apparatus C1 to the transfer conveyor 2a on the 2B side of the unit mounting apparatus M1, and the sorting conveyor 2b that receives the board 3d from the upstream side moves to the 2A side.

Next, as shown in FIG. 6 (c), the board 3b is transferred to the 2A side transfer conveyor 2a of the unit mounting apparatus M2, and the board 3d is transferred to the 2A side transfer conveyor 2a of the unit mounting apparatus M1. Then, the distribution conveyor 2b of the conveyor device C2 moves to the 2B side, and the conveyor device C1 receives the substrate 3e from the upstream side thereof.
Moves to the 2B side.

Thereafter, as shown in FIG. 7A, the substrate 3a
Transferred from the unit mounting device M2 to the conveyor device C3,
The board 3c is transferred from the unit mounting device M1 to the conveyor device C2. The board 3e is transferred from the conveyor device C1 to the transfer conveyor 2a on the 2B side of the unit mounting device M1. Further, in the conveyor device C1, the distribution conveyor 2b that receives the substrate 3f from the upstream side is located on the 2A side.

Next, as shown in FIG. 7B, the substrate 3a
Is transferred from the conveyor device C3 to the transfer conveyor 2a on the 2B side of the unit mounting device M3, and the substrate 3c is transferred from the conveyor device C2 to the transfer conveyor 2a on the 2B side of the unit mounting device M2. Then, the substrate 3a is placed and positioned on the mounting stage set on the transport conveyor 2a on the 2B side of the unit mounting device M3, and the mounting work for the substrate 3a is performed here. Similarly, on the 2B side of the unit mounting devices M1 and M2, the mounting work for the substrates 3c and 3e is sequentially started.

Thereafter, as shown in FIG. 7C, the substrate 3
b moves from the unit mounting apparatus M2 to the unit mounting apparatus M3 through the conveyor apparatus C3, and the mounting work for the board 3b is set on the transfer conveyor 2a on the 2A side of the unit mounting apparatus M3. Performed on stage.
The board 3d is moved from the unit mounting device M1 to the conveyor device C.
2 to the unit mounting device M2, and the board 3f moves from the conveyor device C1 to the unit mounting device M1.
Substrates 3d and 3 in the unit mounting devices M2 and M1, respectively.
The mounting work for f is executed.

After this, the substrate 3a, which has been mounted by the unit mounting device M3, is transferred to the conveyor device C4. Similarly, the boards 3c and 3e whose mounting work has been completed at each mounting stage are also sequentially transported to the conveyor device c4. Further, in the conveyor device C1, the distribution conveyor 2b that receives the substrate 3g from the upstream side is located on the 2B side. After that, the same substrate transfer operation is repeated and continued.

In this multi-row mounting mode, the two-row transport paths 2A and 2B of each unit mounting apparatus are set as the mounting stages, respectively, and the substrates on which the mounting work has been completed are sequentially transferred to the downstream side via the same transport path. Be shipped. When the electronic component mounting line is exclusively used in the multi-column mounting mode, the conveyor devices C2 and C3 are omitted and the unit mounting device M is omitted.
1, M2 and M3 may be directly connected.

Next, with reference to FIGS. 8, 9 and 10, in the substrate transfer operation for transferring the substrates sequentially supplied from the upstream side to the downstream side in the electronic component mounting line, two rows of transfer paths 2A are provided. , 2B, one of the transport paths 2B is used as a bypass transport path for allowing the subsequent substrate to overtake and transport the preceding substrate.

In FIG. 8A, the sorting conveyor 2b of the conveyor device C1 which receives the substrate 3a from the upstream side is 2A.
It shows the state of being located on the side. After that, the board 3a is transferred to the transport conveyor 2a of the unit mounting apparatus M1 as shown in FIG. 8B. Then, the board 3a is mounted on the mounting stage set on the transport conveyor 2a on the 2A side of the unit mounting apparatus M1.
Are placed and positioned, and the mounting work for the substrate 3a is performed here.

In parallel with this operation, in the conveyor device C1, the sorting conveyor 2b which receives the substrate 3b from the upstream side moves to the 2B side. Then, as shown in FIG. 8C, the board 3b is transferred to the distribution conveyor 2b of the conveyor device C2 via the transfer conveyor 2a on the 2B side of the unit mounting device M1. In the conveyor device C1, the sorting conveyor 2b that receives the substrate 3c from the upstream side is 2B.
Located on the side.

After this, as shown in FIG. 9A, in the conveyor device C2, the distribution conveyor 2b moves to the 2A side together with the substrate 3b. Next, as shown in FIG. 9B, the board 3b is transferred to the transport conveyor 2a of the unit mounting apparatus M2. Then, the substrate 3b is placed on the mounting stage set on the conveyor 2a on the 2A side of the unit mounting apparatus M2.
The positioning is performed, and the mounting work for the substrate 3b is performed here.

Then, as shown in FIG. 9C, in the conveyor device C3, the distribution conveyor 2b moves to the 2A side together with the substrate 3c, and in the conveyor device C1,
Sorting conveyor 2b that receives the substrate 3d from the upstream side
Moves to the 2A side. Next, as shown in FIG. 10A, the board 3c is transferred to the transport conveyor 2a of the unit mounting apparatus M3. Then, the substrate 3c is placed on the mounting stage set on the conveyor 2a on the 2A side of the unit mounting apparatus M3.
The positioning is performed, and the mounting work for the substrate 3c is performed here.

Thereafter, as shown in FIG. 10 (b), the board 3a on which the mounting work has been completed in the unit mounting apparatus M1 is carried out to the conveyor device C2, and then, as shown in FIG. 10 (c), the board 3a is 2B. Move to the side, and the unit mounting devices M2, M
After passing through the transport conveyor 2a of No. 3, transfer to the conveyor device C4, it is carried out to the downstream side. In the conveyor device C1, the distribution conveyor 2b that has received the substrate 3e from the upstream side moves to the 2B side. Further, the board 3d is transferred to the transport conveyor 2a on the 2A side of the unit mounting apparatus M1, and the mounting work for the board 3d is performed here. Then, after that, the substrates 3b, 3c, 3d are carried out to the downstream side via the 2A side transfer conveyor 2a in the order in which the mounting work is completed.

As described above, in the electronic component mounting line according to the present embodiment, various mounting forms can be achieved without increasing the device cost and occupying space by providing the substrate transfer mechanism dedicated to the bypass. Can respond.

[0043]

According to the present invention, in a mounting line in which unit mounting devices having a plurality of rows of substrate transfer means are connected,
A multi-row mounting mode in which each of a plurality of rows of substrate transfer means is used as a mounting stage, and a bypass using one of the plurality of rows of transfer paths as a bypass transfer path for passing a succeeding substrate over a preceding substrate By switching the mounting mode, it is possible to cope with various mounting modes without providing a substrate transfer mechanism dedicated to bypass.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an electronic component mounting line according to an embodiment of the present invention.

FIG. 2 is a plan view of a unit mounting device according to an embodiment of the present invention.

FIG. 3 is an explanatory diagram of a board distribution operation in the electronic component mounting line according to the embodiment of the present invention.

FIG. 4 is a block diagram showing a configuration of a control system of an electronic component mounting line according to an embodiment of the present invention.

FIG. 5 is a process explanatory diagram of a board conveying operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 6 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 7 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 8 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 9 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

FIG. 10 is a process explanatory diagram of a board transfer operation in the electronic component mounting method according to the embodiment of the present invention.

[Explanation of symbols]

2A, 2B transport path 2a Transport conveyor 2b Sorting conveyor 3 substrates 4 Parts supply department 6A, 6B Y-axis table 7A, 7B X-axis table 8 Transfer head 11 Operation part 12 Program storage M1, M2, M3 unit mounting device C1, C2, C3, C4 conveyor device

Claims (2)

[Claims] 1. An electronic component mounting apparatus configured by connecting a plurality of unit mounting apparatuses for mounting electronic components on a board,
A plurality of rows of board transfer means provided in the unit mounting apparatus for transferring the board, a mounting stage for mounting a board on which electronic components are mounted and set on a transfer path by the board transfer means, and the unit mounting Mounting means provided in the device for picking up electronic components from a component supply unit and transferring and mounting them on a substrate mounted on the mounting stage; and any one of the upstream unit mounting devices arranged between the unit mounting devices. A board distribution means for selectively delivering the board received from the carrying means to one of the board carrying means of the downstream unit mounting device, a mounting operation control section for controlling the mounting means based on a mounting operation program, and a carrying operation A transfer operation control unit that controls the board transfer unit and the board distribution unit based on a program, and the mounting operation program and transfer operation program By switching, a multi-row mounting mode in which each of the plurality of rows of board carrying means is used as a mounting stage, and a plurality of rows of board carrying means as a bypass carrying path that allows the succeeding board to overtake the preceding board An electronic component mounting apparatus comprising: a mounting mode switching unit that switches between a bypass mounting mode using one of them. 2. A plurality of rows of substrate transfer means for transferring substrates,
A mounting stage for mounting a substrate on which electronic components are mounted, which is set on the transport path by the substrate transport means, and an electronic component is picked up from a component supply unit and transferred and mounted on the substrate mounted on the mounting stage. A plurality of unit mounting devices each having a mounting unit are connected to each other, and the substrate received from any one of the substrate transport units of the upstream unit mounting devices arranged between the unit mounting devices is connected to the downstream unit mounting device. A board allocating means for selectively delivering to any of the board carrying means, a mounting operation control unit for controlling the mounting means based on a mounting operation program, and a board transferring means and a board allocating means for controlling the mounting operation program An electronic component mounting method using an electronic component mounting apparatus, comprising: By switching the frame, a multi-row mounting mode in which each of the plurality of rows of board transfer means is used as a mounting stage, and a plurality of rows of bypass transfer paths for allowing a succeeding board to overtake a preceding board An electronic component mounting method characterized by switching between a bypass mounting mode using one of the transfer paths.