JP2002026577A - Method and apparatus for mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently mount components using a plurality of positioning sections by shortening the time required for replacement of objects to be mounted with components at those positioning sections before and after mounting. SOLUTION: While self-advancing and going around on a closed loop track between a component supplying section 2 and the positioning sections 5 for positioning the objects 3 to be mounted with components, mounting heads 6 repeatedly pick up components 1 at the component supplying section 2 and then carry and mount them onto the objects 3 to be mounted with components. The objects 3 to be mounted with components are carried into and out of the respective positioning sections 5 disposed at two or more places on the closed loop track 7 through separate carry-in and carry-out paths 8. The objects 3 to be mounted with components are carried into the respective positioning sections 5, positioned, and then carried out of the positioning sections 5 independently without synchronizing with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component for manufacturing an electronic circuit board by holding various components such as an electronic component by a mounting head and carrying the component at a predetermined position on a mounting target such as a circuit board. It relates to a mounting device.

[0002]

2. Description of the Related Art There are so-called mounting states in which electronic components are mounted in a fixed state, and so-called mounting states in which electronic parts are mounted in a temporary mounting state. The temporary attachment state is set to a mounted state by reflow processing after the mounting.

In order to mount such components, conventionally,
A component mounting apparatus as shown in FIGS. 6A and 6B is generally used. This apparatus includes a component supply unit b for supplying a component a, a positioning unit d for positioning a circuit board c on which the component a is mounted at a mounting work position, and suction nozzles intermittently rotating and arranged on a circumference. e is sequentially moved by a predetermined pitch while the component a is supplied by the component supply unit b.
Is held and picked up by the suction nozzle e stopped there, and thereafter carried to the positioning portion d side, and whenever the suction nozzle e carrying the component a stops at the positioning portion d, the circuit board c positioned there is stopped. A mounting head g for repeating mounting at a predetermined position. The positioning part d is combined with the carry-in / out path f, the circuit board c is carried in by the carry-in part f1 of the carry-in / out path f, and holds the circuit board c to be carried in, and moves in the XY2 directions orthogonal to each other each time a component is mounted, Parts a at predetermined positions on the circuit board c
Is mounted, and the electronic circuit board on which the mounting of the component a has been completed is carried out at the unloading section f2 of the loading / unloading path f, and the loading of the next circuit board c and the mounting of the component a are repeated. .

[0004]

However, in the above-described conventional apparatus, the suction nozzle e is used to pick up the component a supplied by each of the component supply mechanisms b1 arranged in a large number in the component supply section b. There is a relationship in which it cannot move to the position of each component supply mechanism b1. Therefore, the side of the component supply unit b is
As shown in (b), it is necessary to move in the X direction in which the component supply mechanisms b1 are arranged.

The component supply section b is large and has a width of about 1.5
m, weighs 100 kg. Such a component supply part b
If the robot is moved at a high speed under recent high-speed operation, vibration and noise are remarkably environmental problems and may affect the mounting accuracy of the component a. These problems hinder further speedups. In addition, the movement stroke required for the component supply unit b is twice as large as the width thereof, and the size of the entire apparatus is also a problem in terms of space saving.

The present inventors have previously proposed a component mounting apparatus that solves such a problem. As shown in FIG. 4, the component mounting apparatus includes a component supply unit b for supplying a component a to be mounted, a positioning unit d for positioning a circuit board c on which the component a is mounted at a mounting work position, and a positioning unit d. A loading / unloading path f for loading and unloading the circuit board c and a component a supplied by the component supply unit b are picked up and carried to a predetermined position on the circuit board c positioned at the positioning unit d. And the mounting head g self-runs along a circular orbit h passing sequentially through the component supply section b and the positioning section d, and repeats the pickup and mounting of the component a. Here, the component supply section b has a large number of component supply mechanisms b1 arranged along the circular orbit h. Due to such an arrangement of the component supply mechanism b1, the mounting head g and the suction nozzle e mounted on the mounting head g are all arranged in the component supply section b when moving along the circular orbit h. Through
The component a supplied by any component supply mechanism b1 can be picked up and carried, and the component supply unit b can be kept at a fixed position.

On the other hand, in order to increase the efficiency of picking up and carrying the component a in this manner and mounting it on the circuit board c, a plurality of the mounting heads g are provided, one by one.
One mounting head g can take a sufficient time to pick up a necessary type and number of parts a. In addition, in response to the provision of a plurality of mounting heads g,
Attempts are made to provide positioning portions d at two locations on a circular orbit h on which the mounting head g moves, and to be able to simultaneously mount the component a with the two mounting heads g at the two positioning portions d.

In order to achieve this, the circuit board c is carried into and out of the two positioning portions d using one carrying-in / out path f. But in this,
The operation procedure is as shown in FIG. To explain this, when the mounting of the component a is completed at the two positioning portions d at the same time, the positioning portions d on the downstream side as in step 1 shown in FIG.
After carrying out the electronic circuit board c1 manufactured by mounting the components through the unloading section f2, the electronic circuit board c1 manufactured on the upstream side as in step 2 shown in FIG.
3. Discharge through the positioning unit d and the unloading unit f2.

Next, as shown in step 3 in FIG.
After the circuit board c being carried into the position No. 1 is carried into the positioning part d on the downstream side through the positioning part d on the upstream side and the bridging part f3, it is carried into the carrying part f1 as shown in step 4 in FIG. The next circuit board c is carried into the positioning part d on the upstream side. At this point, the circuit board c is positioned at both the upstream and downstream positioning portions d, and the mounting work of the component a is performed in parallel by the two mounting heads g.

Therefore, the electronic circuit board c1 already mounted on the two positioning portions d is not mounted on the circuit board while the component a is mounted simultaneously by the two mounting heads g on the two positioning portions d. The above-described four steps are required to exchange the electronic circuit board c and the transfer distance of the electronic circuit board c1 and the circuit board c required for the above-described steps. Is twice or more as compared with the case where the number is one, the productivity is reduced.

Specifically, when the positioning portion d is located at one position, 2
It was about 4 seconds or more. At present, the mounting time per part is less than 0.1 second,
This is the time when 0 components a can be mounted. Considering the case where 40 components a are mounted on one circuit board c, the work stoppage time can be 4 seconds each time the mounting of 4 seconds is completed. The operation rate becomes 50%.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a component mounting method and apparatus capable of shortening a time for exchanging objects to be mounted before and after mounting at a plurality of positioning portions, and enabling efficient mounting of components using the plurality of positioning portions. Is to provide.

[0013]

In order to achieve the above object, a component mounting method according to the present invention includes a component supply unit for supplying a component to be mounted, and a loading object on which the component is mounted. The positioning head repeats the positioning and holding at the mounting work position, and then carries out the loading after the component is mounted.The mounting head travels around the closed loop orbit and picks up the components supplied by the component supply unit. In order to repeat carrying and mounting at a predetermined position on the mounting object positioned on the positioning section by means of the positioning section, the mounting target is set to each of the positioning sections arranged at two or more positions on the closed loop track by different loading / unloading paths. The main feature is that the loading / unloading of the object and the loading / unloading of the object to be mounted at each positioning section are performed independently of each other without synchronization.

Further, the component mounting apparatus of the present invention includes a component supply unit for supplying a component to be mounted, a positioning unit for positioning a mounting object on which the component is mounted at a mounting work position, and a mounting object on the positioning unit. A loading / unloading path for loading and unloading, and a mounting head for picking up a component supplied by the component supply unit and carrying it to a predetermined position on a mounting target positioned at the positioning unit and mounting the same. In this component mounting apparatus, the mounting head self-runs and circulates in a closed loop orbit that sequentially passes through the component supply unit and the positioning unit, and repeats the pick-up and mounting of the component. The main feature is that these positioning units are arranged side by side such that the positioning parts are located on a closed loop trajectory on which the mounting head runs. It is.

[0015] In the configuration of the method and the apparatus, the mounting head repeats successively positioning on the component supply section and the plurality of positioning sections without restraining each other by self-propelling and circulating in a closed loop orbit. Therefore, the parts supply section picks up the supplied parts and carries them,
In the plurality of positioning portions, it is possible to repeatedly perform mounting of the carried component at a predetermined position on a corresponding one of the mounting objects positioned thereon, and in the plurality of positioning portions, Independently carrying in, positioning, and unloading the mounting object using a dedicated transport path without constraining each other without constraining each other, coupled with the mounting of components by the mounting head at each of the plurality of positioning units Therefore, in the conventional case where there is only one positioning part, there is no need to extend the waiting time or the transport distance due to the influence of the replacement of the mounting object before and after mounting in each positioning part. It can be achieved in a similar short time, and the productivity can be improved up to a multiple of the number of positioning parts, compared to the conventional case where there is only one positioning part. Kill.

In these cases, if the component mounting heads are used in a number equal to or greater than the number of the positioning portions, and the components are mounted in parallel on the mounting target positioned without being synchronized with the positioning portions, the components are not synchronized with each other. In addition, parts that are not synchronized but can be mounted in parallel at a plurality of positioning units that carry in, position, and carry out the mounting object can be mounted in parallel, thereby improving productivity. Also, if the number of mounting heads is larger than the number of positioning parts, the empty mounting heads use the time while other mounting heads mount components to prepare for component picking, component picking up In addition, it is possible to carry out preparations such as carrying and inspection for mounting the picked-up component, and correction of the orientation and the position, so that no play occurs in mounting the component. As a device, the loading, positioning, and unloading of the mounting target object are performed independently of each other without synchronization with each other, and the components are mounted at predetermined positions on the mounting target positioned at the respective positioning portions by the mounting heads. It is only necessary to include a control unit for controlling the positioning unit, the loading / unloading path, and the mounting head, and to perform control in accordance with a predetermined program by the control unit.
It can be achieved automatically, reliably and stably at high speed.

Further, in the above-described method and apparatus, the object to be mounted, which is transported and supplied by one supply transport path, is distributed and supplied to each loading section of the loading / unloading path associated with each positioning section. When the objects to be mounted after the components are unloaded at each unloading section of the loading and unloading path are merged into one outgoing transport path, transported and sent to the next, they are loaded in one supply transport path and one outgoing transport path, respectively. Efficient mounting of components using a plurality of positioning portions can be performed while supplying the preceding and following mounting objects and sending them to the next. As the apparatus, one supply conveyance path that conveys the mounting object and supplies it to the positioning unit, one sending conveyance path that conveys the mounting object unloaded from the positioning unit first, and the one supply conveyance path A loading section that distributes and sends the loading objects to the loading sections of each loading / unloading path, a merging section where the loading objects from the loading / unloading sections of each loading / unloading path are sent to the one delivery transport path and merged, and each positioning section includes: Control means for controlling the supply transport path, the sorting section, the merging section, and the output transport path in accordance with the loading and unloading of the load target object, and the control section automatically controls the control section according to a predetermined program. It can be achieved reliably and stably at high speed.

Further features and operations of the present invention will become apparent from the following detailed description and drawings. Each feature of the present invention is solely as much as possible,
Alternatively, various combinations can be used in combination.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a method and an apparatus for mounting components according to an embodiment of the present invention will be described in detail with reference to FIGS. The present embodiment described below is an example of manufacturing an electronic circuit board by mounting or temporarily mounting electronic components such as electronic components and connectors on a circuit board having a wiring pattern. It is a specific example of the present invention and does not limit the technical scope of the present invention. In general, the present invention is applied when various components other than electronic components are mounted on various mounting objects other than a circuit board. Are also effective, and both belong to the category of the present invention.

One example of the component mounting method shown in FIGS. 1 and 2 is a component supply unit 2 for supplying an electronic component 1 as an example of a component to be mounted, and a mounting target on which the electronic component 1 is mounted. The mounting head 6 moves the closed loop track 7 to the positioning section 5 which repeatedly carries in the circuit board 3 as an example of an object, positions and holds the circuit board 3 at the mounting work position 4, and carries out the mounting after mounting the electronic component 1. In order to repeat running and circulating, picking up the electronic component 1 supplied by the component supply unit 2 and carrying the electronic component 1 at a predetermined position on the circuit board 3 positioned on the positioning unit 5, the closed loop track Loading and unloading the circuit board 3 to and from each of the positioning sections 5 disposed at two or more locations on the loading and unloading path 8, and loading, positioning, and unloading the circuit board 3 at each of the positioning sections 5. Each other It carried out independently without synchronization.

As a device for performing this, electronic components 1
Component supply unit 2 for supplying the circuit board 3, a positioning unit 5 for positioning the circuit board 3 at the mounting work position, a loading / unloading path 8 for loading and unloading the circuit board 3 into and from the positioning unit 5, A mounting head 6 that picks up the electronic component 1 supplied by the electronic component 1 and carries the electronic component 1 to a predetermined position on the circuit board 3 positioned at the positioning unit 5 and mounts the electronic component 1 on the circuit board 3. Self-propelled and circulates on a closed loop orbit 7 sequentially passing through 2 and the positioning unit 5,
In the one in which the pick-up and mounting of the electronic component 1 are repeated, two or more combinations of the positioning unit 5 and the loading / unloading path 8 are further provided, and each of the positioning units 5 is provided on the closed loop orbit 7 of the mounting head 6. Are arranged side by side.

As in these methods and devices, the mounting head 6 self-runs and circulates along the closed-loop orbit 7 so that the mounting head 6 can be sequentially connected to the component supply unit 2 and the plurality of positioning units 5 without restraining each other. Is repeatedly picked up by the component supply unit 2, the electronic component 1 supplied is picked up and carried, and the plurality of positioning units 5 determine the corresponding one of the circuit boards 3 positioned on them. The electronic component 1 brought to the predetermined position
Can be repeatedly performed. Each of the plurality of positioning sections 5 uses a dedicated loading / unloading path 8 to independently carry out the loading, positioning, and unloading of the circuit board 3 without restraining each other. In conjunction with the mounting of the electronic component 1 by the mounting head 6, the mounting of the component in each positioning unit 5 does not increase the waiting time or the transport distance due to the influence of the replacement of the circuit board 3 before and after mounting in the other positioning unit 5. That is, it can be achieved in the same short time as in the conventional case where there is only one positioning portion 5, and the number of the positioning portions 5 to be provided is at most as compared with the conventional case where there is only one positioning portion 5. The productivity can be improved by a multiple of.

In this embodiment, the component mounting heads 6 are used more than the number of the positioning portions 5, and the electronic components 1 are mounted in parallel on the circuit board 3 positioned without synchronizing with the positioning portions 5. . Thus, the plurality of positioning units 5 that independently carry in, position, and carry out the circuit board 3 without synchronization can mount the electronic components 1 in a non-synchronous but parallel manner, thereby improving productivity. When the number of the mounting heads 6 is larger than the number of the positioning parts 5, the vacant mounting heads 6 use the time while the other mounting heads 6 mount the electronic components 1 to mount the electronic components 1. Preparing for pickup, picking up the electronic component 1, carrying, inspecting, and correcting for mounting the picked up electronic component 1 can be performed, and it is possible to prevent play in component mounting by these operations. Work efficiency is improved. For this purpose, the apparatus is designed to allow the loading, positioning, and unloading of the circuit board 3 at each positioning section 5 to be performed independently without synchronization with each other, and at a predetermined position on the circuit board 3 positioned at each positioning section 5. In order to mount the electronic component 1 by the mounting heads 6, a positioning unit 5, a loading / unloading path 8, and a control unit 12 for controlling the mounting head 6 are provided. Thus, the above-described method can be automatically, reliably, and stably achieved at a high speed under the control of the control means 12 according to a predetermined program.

As shown in FIG. 1 and FIG.
The component supply unit 2 is arranged along the closed loop track 7 and the component supply mechanism 2a provided on the closed loop
Are arranged along. With such an arrangement of the component supply mechanism 2a, the mounting head 6 and the suction nozzle 13 as an example of a component handling tool equipped for picking up, carrying, and mounting the electronic component 1 thereof are provided on the closed loop track 7. When moving along, it passes through all the component supply mechanisms 2a arranged in the component supply section 2 under the same conditions, so that any electronic component 1 supplied by each component supply mechanism 2a can be picked up and carried. Thus, the component supply unit 2 can be kept at the fixed position. Therefore, the problem of vibration and noise caused by the movement of the component supply unit 2 is eliminated, and a plane space for the movement of the component supply unit 2 is not required.

Each of the positioning sections 5 is provided with a positioning table 30 for holding the circuit board 3 to be carried in.
1 and the Y motor 32 are moved in orthogonal XY2 directions. Thereby, the positioning table 3
Numeral 0 indicates that the circuit board 3 can be positioned at any position in the XY2 direction, and that various electronic components 1 can be sequentially mounted at a plurality of predetermined positions. The closed loop track 7 is formed by a guide rail A, which is a circular track in the illustrated case.
It is necessary that the mounting head 6 can revolve repeatedly at a minimum, and it is necessary to form a closed loop trajectory. However, the loop shape of the closed loop trajectory can be variously set in accordance with the arrangement of various work stations. Each mounting head 6 has a driving unit for self-propelling, and can easily self-propell by a relative action with the guide rail A.
Any self-propelled system may be adopted. In short, it is only necessary that the control means 12 can control the operation. The operation control performs necessary operation control according to an input command from the operation panel 14 or a preset program.

In the example shown in FIG. 3, the circuit board 3 conveyed and supplied by one supply conveyance path 21 is particularly
The circuit board 3 after the components are mounted, which is distributed and supplied to each loading section 8a of the loading / unloading path 8 according to the above, and is carried out at each loading section 8b of the loading / unloading path 8 according to each positioning section 5, that is, the electronic circuit board 3
a is merged into one sending-out conveyance path 22, conveyed, and sent to the next. Thereby, one supply conveyance path 2
1 supplies the circuit board 3 before mounting, and sends the mounted electronic circuit board 3a to the next by one sending-out conveyance path 22 while efficiently providing the electronic component 1 using the plurality of positioning portions 5. Can be mounted.

For this purpose, the apparatus includes one supply transport path 21 for transporting the circuit board 3 and supplying it to the positioning unit 5.
And one delivery transport path 22 for transporting the electronic circuit board 3a carried out from the positioning section 5 first, and the circuit board 3 from the one supply transport path 21 to the loading section 8a of each loading / unloading path 8. A sorting section 23 for sending in, and a joining section 24 for sending and joining the electronic circuit boards 3a from the unloading section 8b of each of the loading and unloading paths 8 to the one sending out and transporting path 22.
In accordance with the loading and unloading of the circuit board 3 in each positioning section 5, the supply transport path 21, the sorting section 23, the merging section 24,
And a control means 12 for controlling the delivery conveyance path 22. Thus, the distribution and the mounting of the electronic component 1 at the plurality of positioning sections 5 with the merging can be automatically, reliably, and stably achieved under the control of the control means 12 according to the predetermined program. . The distributing unit 23 constitutes a transfer unit that can transfer the circuit board 3 between the supply transfer path 21 and each positioning unit 5, and transfers the circuit board 3 received from the supply transfer path 21 at a predetermined position in a direction orthogonal to the transfer direction. When each of the positioning portions 5 is positioned so as to oppose the necessary one at a time by the movement, the positioning portion 5 is fed to the opposing positioning portion 5. The merging section 24 connects the electronic circuit board 3 a to each of the positioning sections 5 and the delivery conveyance path 2.
And a transfer means which can be exchanged with the electronic circuit board 3 at a position facing the positioning part required at each time.
a, and sends it out to the delivery path 22 at a predetermined position.

Other configurations and operational effects are not particularly different from those shown in FIGS. 1 and 2, and the same members are denoted by the same reference numerals and overlapping illustration and description are omitted.

[0029]

According to the component mounting method and apparatus of the present invention, the mounting head is free-running and circulating along a closed-loop trajectory, so that the component supply unit and the plurality of positioning units can be connected without restraining each other. The parts supply section picks up and carries the parts to be supplied, and the plurality of positioning sections perform the predetermined positioning for the corresponding one of the mounting objects positioned at them. It is possible to repeatedly carry out loading of the carried parts at the position, and in the plurality of positioning sections, independently carrying out the loading object independently without synchronizing without restraining each other using a dedicated transport path, By performing positioning and unloading, the mounting of components at each of the positioning units can be performed at other positions in conjunction with the mounting of components by the mounting head at each of the plurality of positioning units. Without the extension of the waiting time and the conveying distance by the influence of the replacement of the mounting object before and after mounting in the fit portion,
In other words, it can be achieved in the same short time as in the conventional case having only one positioning portion, and the productivity is at most a multiple of the number of the positioning portions, as compared with the conventional case having only one positioning portion. Can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of a component mounting method and device according to an embodiment of the present invention.

FIG. 2 is a plan view of the component mounting apparatus of FIG.

FIG. 3 is a plan view showing another example of the component mounting method and device according to the embodiment of the present invention.

FIG. 4 is a plan view showing a component mounting apparatus improved by the present inventors.

FIG. 5 is a plan view showing a replacement state of circuit boards before and after component mounting in a positioning unit in the apparatus of FIG. 4;

6A and 6B show a conventional component mounting apparatus, in which FIG. 6A is a perspective view and FIG. 6B is a plan view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Component supply part 2a Component supply mechanism 3 Circuit board 4 Mounting work position 5 Positioning part 6 Mounting head 7 Closed loop track 8 Carry-in / out path 8a Carry-in part 8b Carry-out part 12 Control means 13 Suction nozzle 21 Supply conveyance path 22 Send-out conveyance path 23 Distributing unit 24 Merging unit

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Kunio Sakurai 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. F term (reference) 5E313 AA01 AA11 DD12 EE02 EE25 EE33 FF24 FF29 FG01

Claims (6)

[Claims] A component supply unit for supplying a component to be mounted;
The positioning head repeats the loading and unloading of the mounting target, which is the component mounting target, at the mounting work position, and repeats the loading and unloading after the component is mounted. In a component mounting method in which a component supplied by a component supply unit is repeatedly picked up and carried to a predetermined position on a mounting target positioned at a positioning unit and mounted, two or more locations on the closed loop track Independent loading and unloading of loading objects into and out of each positioning section, and loading and unloading, positioning, and unloading of loading objects at each positioning section are independent of each other. A component mounting method characterized in that the component mounting is performed. 2. The mounting head according to claim 1, wherein the component mounting heads are used in a number equal to or greater than the number of the positioning portions, and the components picked up by the respective mounting portions are mounted in parallel on the mounting targets positioned in synchronization with the respective positioning portions. Component mounting method described in. 3. A loading object transported and supplied by one supply transport path is distributed and supplied to each loading section of a loading / unloading path related to each positioning section, and is unloaded at each loading section of a loading / unloading path related to each positioning section. The component mounting method according to any one of claims 1 and 2, wherein the mounted object after component mounting is merged into one sending-out transport path, transported, and sent to the next. 4. A component supply unit for supplying a component to be mounted, a positioning unit for positioning a mounting target on which the component is mounted at a mounting work position, and a loading / unloading path for loading and unloading the mounting target onto the positioning unit. And a mounting head that picks up a component supplied by the component supply unit, carries the component to a predetermined position on a mounting target positioned by the positioning unit, and mounts the component. In a component mounting apparatus that travels along a closed loop trajectory sequentially passing through a supply unit and a positioning unit and repeats pickup and mounting of the component, the component mounting apparatus includes two or more combinations of the positioning unit and the loading / unloading path. The component mounting apparatus is characterized in that each combination is arranged side by side so that each positioning part is positioned on a closed loop orbit on which the mounting head runs by itself. 5. The mounting head is provided with a number equal to or greater than the number of each positioning portion, and the loading, positioning and unloading of the mounting object at each positioning portion are performed independently without synchronization with each other, and the mounting target positioned at each positioning portion is provided. 5. The component mounting apparatus according to claim 4, further comprising: a positioning unit, a loading / unloading path, and control means for controlling the mounting head so that the component is mounted at a predetermined position on an object by the mounting heads. 6. A supply transport path for transporting an object to be mounted and supplying the same to a positioning unit, a sending transport path for transporting an object to be mounted unloaded from the positioning unit first,
A distributing unit for distributing the loading objects from the two supply transport paths to the loading sections of the respective loading / unloading paths, The controller according to any one of claims 4 and 5, further comprising control means for controlling a supply transport path, a distribution section, a merging section, and an output transport path in accordance with loading and unloading of the mounting target object in the positioning section. Component mounting equipment.