JP3341764B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for transferring and mounting electronic components on a substrate.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, an electronic component mounting apparatus which picks up an electronic component provided in an electronic component supply unit by a transfer head and transfers the electronic component to a predetermined coordinate position of a substrate positioned at a positioning unit is widely used. (Eg, JP-A-63-178596, JP-A-3-203295)
issue).

In this type of electronic component mounting apparatus, when the mounting of the electronic component on the board positioned at the positioning section is completed, the board is carried out downstream and a new board is carried into the positioning section. Has become. In the following, a description will be given of how to change a board in a conventional electronic component mounting apparatus.

FIG. 8 is an explanatory view of a conventional changeover of a substrate, and is a plan view of a substrate transfer system. FIG.
1A, reference numeral 1 denotes a substrate positioning portion, 2 denotes a substrate loading portion connected to an upstream side thereof, and 3 denotes a substrate unloading portion connected to a downstream side thereof. Although not shown, the positioning unit 1, the loading unit 2, and the unloading unit 3 are provided with a belt conveyor for transporting the substrates.

FIG. 8A shows an initial state. The first substrate 4A is positioned in the positioning section 1, and
The second substrate 4 </ b> B is waiting in the loading unit 2. In this state, electronic components are successively mounted on the board 4A positioned by the positioning section 1.

When the mounting of the electronic components on the board 4A is completed, the board 4A is unloaded to the unloading section 3 (FIG. 8).
(B) arrow a), then the substrate 4 waiting at the loading unit 2
B is carried into the positioning section 1 (arrow b in FIG. 8C), and mounting of electronic components on the board 4B is started. Thereafter, the substrate 4A is unloaded from the unloading unit 3, and the third substrate is sent to the unloading unit 2 (see arrow c in FIG. 8C).

[0007]

However, in the above-mentioned conventional method, as shown in FIG. 8B, the board 4A on which the electronic components have been mounted is sent out from the positioning section 1 to the carry-out section 3, and then as shown in FIG. As shown in (1), the mounting of electronic components on the board 4B must be interrupted during the setup change of the board until the new board 4B is sent from the loading section 2 to the positioning section 1 and positioned. As a result, there is a problem that the mounting efficiency is not improved.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting method capable of efficiently performing a changeover of a board and increasing the mounting efficiency of electronic components.

[0009]

An electronic component mounting method according to the present invention includes an electronic component supply unit and an electronic component supply unit.
Picks up electronic components and transfers them to the board 2
Transfer heads and these two transfer heads
A moving table for moving in the X direction or the Y direction, a board loading section, a board unloading section, and a direction interposed between the loading section and the unloading section and orthogonal to the board transfer direction by the loading section and the unloading section. An electronic component mounting method using an electronic component mounting apparatus having a plurality of substrate positioning portions provided in the electronic component mounting device, wherein the electronic components are mounted on a plurality of substrates positioned on the plurality of positioning portions in parallel. When the mounting of the electronic component on any one of the plurality of substrates is completed, the carry-in portion and the carry-out portion are moved by the moving means to the positioning portion that positions the substrate, and connected to each other, While sending out the board from this positioning section and sending the board into this positioning section, mounting of the electronic component on the board positioned in the other positioning section is performed. It was to perform in connection with.

[0010]

According to the present invention, a plurality of substrate positioning portions are provided, and a carry-in portion and a carry-out portion are selectively connected to any one of the positioning portions to carry in and carry out the substrate. Therefore, even during the changeover of the board, the electronic component can be mounted by positioning the board on any one of the positioning portions, and therefore, the reduction in the mounting efficiency due to the changeover of the board is eliminated. Can be.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of a substrate transport system of the electronic component mounting apparatus according to the embodiment of the present invention. FIGS. 5, 6, and 7 are explanatory views of the change of the board setup in the electronic component mounting method according to one embodiment of the present invention.

In FIG. 1, a plurality of (two in the present embodiment) positioning portions 11A and 11B of the substrate are provided at the center of the upper surface of the base 10. Positioning parts 11A, 11B
A carry-in section 12 is provided on the upstream side of the apparatus, and a carry-out section 13 is provided on the downstream side. The carry-in unit 14 is connected to the carry-in unit 12, and the carry-out unit 15 is connected to the carry-out unit 13. Although not shown, a conveyor for transporting the substrate 4 is attached to each of the positioning units 11A and 11B, the carry-in unit 12, the carry-out unit 13, the carry-in unit 14, and the carry-out unit 15.

On both sides of the upper surface of the base 10, a large number of parts feeders 16 as electronic parts supply units are arranged side by side. The parts feeder 16 is provided with various types of electronic components. Y tables 17A and 17B are provided on both sides of the upper surface of the base 10, and the Y tables 17A and 17B are provided.
X tables 18A and 18B are installed on A and 17B. The transfer head 19 is provided on the X tables 18A and 18B.
A, 19B are mounted. Y tables 17A, 17
When the B and X tables 18A and 18B are driven, the two transfer heads 19A and 19B move horizontally in the X and Y directions, pick up the electronic components of the parts feeder 16 and mount them on the substrate 4 at predetermined coordinate positions. I do.

Next, the substrate transfer system will be described in detail with reference to FIG. The positioning units 11A and 11B are the loading unit 1
2, two of which are provided in the direction orthogonal to the direction in which the substrate is transported. Positioning parts 11A, 11
B, the carry-in unit 12, the carry-out unit 13, and the carry-in unit 14,
A substrate detection sensor 21 and a substrate stopper 22
Is provided. The sensor 21 is an optical element, and the substrate stopper 22 is a cylinder. The sensor 21 is mounted on the substrate 4
Is detected to have been carried into a predetermined position or the substrate 4 has been carried out. In addition, the substrate stopper 22 protrudes the rod on the transfer surface of the substrate 4 according to the detection result of the sensor 21 to forcibly stop the transfer of the substrate 4 or cancel the stopped state of the substrate. A detailed description of the operation of the sensor 21 and the substrate stopper 22 will be omitted.

Reference numeral 23 denotes a cylinder as a first moving means, which moves the carry-in section 12 in the longitudinal direction (a direction orthogonal to the substrate carrying direction) to move the carry-in section 12 to the two positioning sections 11A and 11B. Is selectively located at a position connected to any one of. Numeral 24 denotes a cylinder as a second moving means, which moves the unloading section 13 in the longitudinal direction thereof so that the unloading section 13 is connected to one of the two positioning sections 11A and 11B. Selectively position. 25, 26, 27 are feed screws, 2
Reference numerals 8, 29 and 30 denote motors for rotating the feed screws 25, 26 and 27, and reference numerals 31, 32 and 33 denote guides. These components correspond to the positioning portions 11A and 11B, the loading portion 12, and the unloading portion according to the width of the substrate. 13 constitutes a width shifting means for adjusting the substrate transfer width.

This electronic component mounting apparatus mounts the electronic components of the parts feeder 16 in parallel on the board 4 positioned at the two positioning portions 11A and 11B, respectively. Next, FIGS. The setup change of the substrate 4 will be described with reference to FIG. In FIGS. 3 to 7, the substrates 4A, 4B, 4C, and 4D are shown in FIGS.
Are given.

FIG. 3 shows that the mounting of the electronic components on the first substrate 4A positioned on one positioning portion 4A is completed, and that the second substrate 4B positioned on the other positioning portion 11B has 40% This shows the mounted state.
The substrate 4A after completion of the mounting is hatched. In this case, the cylinders 23 and 24 are driven to move the carry-in section 12 and the carry-out section 13 to a position where they are connected to the positioning section 11A (see arrows A and B in FIG. 4). During this time, the mounting of the electronic components on the second board 4B is continued, and the mounting rate of the electronic components on the second board 4B is 4
Increase from 0% to 50%.

Next, the first substrate 4A is carried out to the carry-out portion 13 (see arrow C in FIG. 5), and the third substrate 4C is sent from the carry-in portion 12 to the positioning portion 11A (see arrow D). FIG. 6 shows a state in which the loading / unloading is completed. During this time, the mounting of the electronic components on the second substrate 4B is continued, and the mounting rate increases from 50% to 60%, and further from 60% to 70%. Next, the carry-in part 12 and the carry-out part 13 are moved to a position connected to the positioning part 11B (see arrows E and F in FIG. 7), and the fourth substrate 4D is sent from the carry-in unit 14 to the carry-in part 12 (arrow G). ), The substrate 4A of the unloading section 13 is unloaded to the unloading unit 15 (arrow H). During this time, the mounting rate of the second board 4B increases from 70% to 80%, and mounting of the electronic component on the board 4C newly positioned at the positioning section 11A is started, and the mounting rate becomes 0% → Increase to 10%.

Thereafter, the substrate 4 of the other positioning portion 11B
The mounting of the electronic component on B is completed. In this case, the setup change of the board is also performed in the same manner as in the case of the board 4A described above. That is, in this case, the loading section 12 and the unloading section 13 are connected to the positioning section 11B,
The board 4B is sent to the unloading section 13 and a new board is sent to the positioning section 11B. Meanwhile, the mounting of the electronic components on the board positioned at the other positioning section 11A is continued.

As described above, in this method, the electronic components are mounted on the two substrates 4 positioned in the two positioning portions 11A and 11B in parallel, and one of the substrates 4
When the mounting of the electronic components on the board is completed, the board is replaced.However, during this setup, the mounting of the electronic components on one of the boards can be continued without interruption. A reduction in mounting efficiency can be eliminated.

[0021]

According to the present invention, it is possible to mount the electronic component by positioning the substrate at one of the positioning portions even during the change of the board, and thus to carry out the change of the board. A reduction in mounting efficiency can be eliminated.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a board transfer system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is an explanatory diagram of a changeover of a board in an electronic component mounting method according to an embodiment of the present invention;

FIG. 4 is an explanatory diagram of a changeover of a board in the electronic component mounting method according to one embodiment of the present invention;

FIG. 5 is an explanatory diagram of a changeover of a board in an electronic component mounting method according to an embodiment of the present invention;

FIG. 6 is an explanatory diagram of a changeover of a board in the electronic component mounting method according to one embodiment of the present invention;

FIG. 7 is an explanatory diagram of a changeover of a board in an electronic component mounting method according to an embodiment of the present invention;

FIG. 8 is an explanatory view of a conventional board changeover.

[Explanation of symbols]

 4 Substrate 11A, 11B Positioning part 12 Loading part 13 Unloading part 16 Parts feeder 17A, 17B Y table 18A, 18B X table 19A, 19B Transfer head 23, 24 Cylinder

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-129630 (JP, A) JP-A-2-207595 (JP, A) JP-A-5-267896 (JP, A) JP-A-63- 178595 (JP, A) JP-A-64-89500 (JP, A) JP-A-7-136878 (JP, A) JP-A-4-261722 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/02 H05K 13/00

Claims (1)

(57) [Claims] An electronic component supply unit and an electronic component supply unit
Pick up the provided electronic components and transfer them to the board for mounting
Two transfer heads, and these two transfer heads
A moving table for moving in the X and Y directions, respectively;
A substrate loading portion, a substrate unloading portion, and a plurality of substrate positioning portions provided between the loading portion and the unloading portion and provided in a direction orthogonal to the substrate transport direction by the loading portion and the unloading portion. An electronic component mounting method using an electronic component mounting apparatus, comprising: performing electronic component mounting on a plurality of substrates positioned by the plurality of positioning portions in parallel; and selecting one of the plurality of substrates. When the mounting of the electronic components on the board is completed, the carrying-in section and the carrying-out section are moved by the moving means to be connected to the positioning section for positioning the board, and the board is sent out from the positioning section and to the positioning section. Electronic component mounting method, wherein the electronic component is continuously mounted on the substrate positioned at the other positioning portion while the substrate is being fed.