JP3652243B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method for transferring and mounting an electronic component on a substrate.
[0002]
[Prior art]
As an electronic component mounting apparatus, an apparatus that picks up an electronic component provided in an electronic component supply unit with a transfer head, and transfers and mounts the electronic component on a predetermined coordinate position of a substrate positioned in the positioning unit is widely implemented (for example, in particular (Kaisho 63-178596, JP-A-3-203295).
[0003]
In this type of electronic component mounting apparatus, when the mounting of the electronic component on the board positioned in the positioning unit is completed, the board is unloaded and a new board is loaded into the positioning unit. . Hereinafter, the changeover of the substrate in the conventional electronic component mounting apparatus will be described.
[0004]
FIG. 8 is an explanatory view of the conventional substrate setup change-over, and is a plan view of the substrate transport system. In FIG. 8A, reference numeral 1 denotes a substrate positioning portion, 2 denotes a substrate carry-in portion arranged in connection with the upstream side, and 3 denotes a substrate carry-out portion arranged in connection with the downstream side. is there. Although not shown, the positioning unit 1, the carry-in unit 2, and the carry-out unit 3 are provided with a belt conveyor for conveying the substrate.
[0005]
FIG. 8A shows the initial state. The first substrate 4A is positioned in the positioning unit 1, and the second substrate 4B is waiting in the carry-in unit 2. In this state, electronic components are successively mounted on the board 4A positioned by the positioning unit 1.
[0006]
When the mounting of the electronic component on the board 4A is completed, the board 4A is carried out to the carry-out section 3 (arrow a in FIG. 8B), and then the board 4B waiting in the carry-in section 2 is placed in the positioning section 1. (Arrow b in FIG. 8C), and mounting of electronic components on the substrate 4B is started. Thereafter, the substrate 4A is carried out from the carry-out unit 3, and the third substrate is sent to the carry-in unit 2 (see arrow c in FIG. 8C).
[0007]
[Problems to be solved by the invention]
However, in the above conventional method, as shown in FIG. 8 (b), the substrate 4A on which the electronic component has been mounted is sent from the positioning unit 1 to the carry-out unit 3, and then a new substrate 4B is mounted as shown in FIG. 8 (c). The mounting of the electronic component on the board 4B must be interrupted during the board changeover from the carry-in part 2 to the positioning part 1 until the positioning is performed, and during this period, the dead time is not achieved and the mounting efficiency is not improved. There was a point.
[0008]
Therefore, an object of the present invention is to provide an electronic component mounting method capable of efficiently changing the substrate setup and increasing the mounting efficiency of the electronic component.
[0009]
[Means for Solving the Problems]
An electronic component mounting method of the present invention includes an electronic component supply unit, two transfer heads that pick up an electronic component provided in the electronic component supply unit, and transfer-mount the substrate onto a substrate, and these two transfer heads A moving table for moving the head in the X direction and the Y direction, a substrate carry-in portion, a substrate carry-out portion, and a position between the carry-in portion and the carry-out portion and orthogonal to the carrying direction of the substrate by the carry-in portion and the carry-out portion. A plurality of substrate positioning portions provided in a direction to be mounted, the carry-in portion, the carry-out portion, and the positioning portion provided on an upper surface of a base, and the electronic component supply portion provided with a parts feeder in parallel. An electronic component mounting method using an electronic component mounting apparatus provided on both sides of the upper surface of a base, wherein electronic component mounting on a plurality of substrates positioned in the plurality of positioning portions is performed in parallel, substrate When the mounting of the electronic component on one of the boards is completed, the carry-in part and the carry-out part are moved and connected to the positioning part for positioning the board, and the board is sent out from the positioning part. While the substrate is being fed into the positioning portion, the electronic component is mounted on the substrate positioned at the other positioning portion.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
According to the present invention, a plurality of substrate positioning portions are provided, and the carry-in portion and the carry-out portion are selectively connected to any one of the positioning portions to carry in and carry out the substrate. In the meantime, it is possible to mount the electronic component by positioning the substrate at any one positioning portion, and therefore, it is possible to eliminate the decrease in mounting efficiency due to the changeover of the substrate.
[0011]
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of a substrate transport system of the electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 5, FIG. 6, and FIG. 7 are explanatory diagrams of substrate replacement in the electronic component mounting method according to the embodiment of the present invention.
[0012]
In FIG. 1, a plurality of substrate positioning portions 11 </ b> A and 11 </ b> B (two in this embodiment) are provided at the center of the upper surface of the base 10. A carry-in part 12 is provided on the upstream side of the positioning parts 11A and 11B, and a carry-out part 13 is provided on the downstream side. A carry-in unit 14 is connected to the carry-in unit 12, and a carry-out unit 15 is connected to the carry-out unit 13. Although not shown, the positioning units 11A and 11B, the carry-in unit 12, the carry-out unit 13, the carry-in unit 14 and the carry-out unit 15 are provided with a conveyor for carrying the substrate 4.
[0013]
A large number of parts feeders 16 as electronic component supply units are arranged in parallel on both sides of the upper surface of the base 10. The parts feeder 16 is provided with various types of electronic components. Y tables 17A and 17B are provided on both sides of the upper surface of the base 10, and X tables 18A and 18B are installed on the Y tables 17A and 17B. Transfer tables 19A and 19B are mounted on the X tables 18A and 18B. When the Y tables 17A and 17B and the X tables 18A and 18B are driven, the two transfer heads 19A and 19B move horizontally in the X direction and the Y direction, pick up the electronic components of the parts feeder 16, and perform predetermined processing on the substrate 4. Mounted at the coordinate position.
[0014]
Next, the substrate transport system will be described in detail with reference to FIG. Two positioning parts 11A and 11B are provided between the carry-in part 12 and the carry-out part 13 and are provided in a direction perpendicular to the substrate transport direction. The positioning units 11A and 11B, the carry-in unit 12, the carry-out unit 13, and the carry-in unit 14 are provided with a substrate detection sensor 21 and a substrate stopper 22, respectively. The sensor 21 is an optical element, and the substrate stopper 22 is a cylinder. The sensor 21 detects that the substrate 4 has been carried into a predetermined position or that the substrate 4 has been carried out. Further, the substrate stopper 22 projects its rod on the transfer surface of the substrate 4 according to the detection result of the sensor 21, forcibly stops the transfer of the substrate 4, or releases the stopped state of the substrate. Detailed operation explanations of the sensor 21 and the substrate stopper 22 are omitted.
[0015]
Reference numeral 23 denotes a cylinder as a first moving means. By moving the carry-in unit 12 in the longitudinal direction (direction orthogonal to the substrate transport direction), the carry-in unit 12 is moved out of the two positioning units 11A and 11B. It is selectively placed at a position connected to any one of them. Reference numeral 24 denotes a cylinder as a second moving means. By moving the carry-out portion 13 in the longitudinal direction, the carry-out portion 13 is moved to a position where it is connected to one of the two positioning portions 11A and 11B. Selective positioning. Reference numerals 25, 26, and 27 denote feed screws, 28, 29, and 30 denote motors that rotate the feed screws 25, 26, and 27, and 31, 32, and 33 denote guides. These components are positioned in the positioning portion 11A according to the width of the board. 11B, a carry-in unit 12 and a carry-out unit 13 for adjusting the substrate conveyance width.
[0016]
This electronic component mounting apparatus mounts the electronic components of the parts feeder 16 in parallel on the substrate 4 positioned in the two positioning portions 11A and 11B. Next, referring to FIGS. Next, the setup change of the substrate 4 will be described. In order to distinguish a large number of substrates 4, the reference numerals 4A, 4B, 4C, and 4D are attached to the substrates in FIGS.
[0017]
In FIG. 3, the mounting of the electronic components on the first board 4A positioned on one positioning part 4A is finished, and 40% is mounted on the second board 4B positioned on the other positioning part 11B. Indicates the state. The substrate 4A that has been mounted is hatched. In this case, the cylinders 23 and 24 are driven to move the carry-in part 12 and the carry-out part 13 to positions where they are connected to the positioning part 11A (see arrows A and B in FIG. 4). During this time, mounting of electronic components on the second substrate 4B is continued, and the mounting ratio of electronic components on the second substrate 4B increases from 40% to 50%.
[0018]
Next, the first substrate 4A is carried out to the carry-out unit 13 (see arrow C in FIG. 5), and the third substrate 4C is fed from the carry-in unit 12 to the positioning unit 11A (see arrow D). FIG. 6 shows a state where the carry-in / carry-out is completed. In the meantime, the mounting of the electronic components on the second substrate 4B is continued, and the mounting rate increases from 50% to 60% and further from 60% to 70%. Next, the carry-in unit 12 and the carry-out unit 13 are moved to positions where they are connected to the positioning unit 11B (see arrows E and F in FIG. 7), and the fourth substrate 4D is sent from the carry-in unit 14 to the carry-in unit 12 (arrow G). ), The substrate 4A of the carry-out unit 13 is carried out to the carry-out unit 15 (arrow H). During this time, the mounting rate of the second board 4B increases from 70% to 80%, and mounting of electronic components on the board 4C newly positioned by the positioning portion 11A is started, and the mounting rate is 0% → Increase to 10%.
[0019]
Thereafter, the mounting of the electronic component on the board 4B of the other positioning portion 11B is completed. In this case, the board is replaced by the same method as that of the board 4A described above. That is, in this case, the carry-in part 12 and the carry-out part 13 are connected to the positioning part 11B, the substrate 4B of the positioning part 11B is sent to the carry-out part 13, and a new board is sent to the positioning part 11B. Continue to mount the electronic component on the substrate positioned in (1).
[0020]
As described above, this method performs mounting of electronic components on the two substrates 4 positioned by the two positioning portions 11A and 11B in parallel, and mounting of the electronic components on one of the substrates 4 is completed. If this is the case, the board is replaced, and the mounting of the electronic component on one board can be continued without interruption during the change of the board, so that it is possible to eliminate a reduction in mounting efficiency due to the board change.
[0021]
【The invention's effect】
According to the present invention, it is possible to mount the electronic component by positioning the board on any one of the positioning portions even during the board changeover, and therefore, the mounting efficiency is reduced due to the board changeover. Can be resolved.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of a substrate transport system of the electronic component mounting apparatus according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of substrate setup change in the electronic component mounting method of the embodiment. FIG. 4 is an explanatory diagram of substrate setup change in the electronic component mounting method of the embodiment of the invention. FIG. 6 is an explanatory view of board changeover in the electronic component mounting method according to the embodiment. FIG. 6 is an explanatory view of board changeover in the electronic component mounting method according to the embodiment of the invention. FIG. 8 is an explanatory diagram of board setup change in the electronic component mounting method of FIG. 8. FIG. 8 is an illustration of conventional board setup change.
4 Substrate 11A, 11B Positioning part 12 Carry-in part 13 Carry-out part 16 Parts feeder 17A, 17B Y table 18A, 18B X table 19A, 19B Transfer head 23, 24 Cylinder

Claims (1)

An electronic component supply unit, two transfer heads for picking up an electronic component provided in the electronic component supply unit and transferring and mounting them on a substrate, and these two transfer heads in the X direction and the Y direction, respectively. A plurality of movable tables, a substrate carry-in portion, a substrate carry-out portion, and a plurality of portions provided between the carry-in portion and the carry-out portion and in a direction perpendicular to the carrying direction of the substrate by the carry-in portion and the carry-out portion. A board positioning portion, the carry-in portion, the carry-out portion, and the positioning portion are provided on the upper surface of the base, and the electronic component supply portions provided with the parts feeders are provided on both sides of the upper surface of the base. and an electronic component mounting method according to the electronic component mounting apparatus performs in parallel electronic component mounting for a plurality of substrates positioned in the plurality of positioning portions, for any substrate out of the plurality of substrates When the mounting of the child parts is completed, the carry-in part and the carry-out part are moved and connected to the positioning part positioning the board by the moving means, and the board is sent out from the positioning part and the positioning part is connected to the positioning part. An electronic component mounting method comprising mounting an electronic component on a substrate positioned at the other positioning portion while the substrate is being fed.

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