JP2002271091A - Mounting machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity in a mounting machine. SOLUTION: The mounting machine comprises a board transfer passage 8 including a board carry-in section 3 for carrying in a board 2 and a board carry-out section 4 for carrying out the board 2, first and second board holding sections 5 and 7 which are movable with the board 2 held, first and second feeding sections 9 and 12 which are provided according to the respective sections 5 and 7, and first and second mounting sections 10 and 13 which are provided according to the sections 5 and 7 and pick up components fed by the sections 9 and 12 to mount them on the board 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to a circuit board (hereinafter, referred to as a circuit board).
The present invention relates to a mounting machine for mounting electronic components (hereinafter, referred to as components) on a substrate.

[0002]

2. Description of the Related Art In a conventional mounting machine, components are mounted on a board held by one board holding section by a mounting section.

[0003]

In the conventional mounting machine, since the mounting operation is performed on one substrate, the productivity is low.

[0004] Therefore, an object of the present invention is to improve the productivity of equipment.

[0005]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a substrate transfer path including a substrate carry-in section for carrying a substrate and a substrate carry-out section for carrying out the substrate. A plurality of substrate holding units provided and capable of holding and moving the substrate, a plurality of supply units provided corresponding to the respective substrate holding units and supplying components mounted on the substrate, and the respective substrate holding units This is a mounting machine composed of a plurality of mounting parts that are provided corresponding to the parts and take out the parts supplied by the supply part and mount them on the board, and can perform mounting work at multiple places in the board transfer path at the same time. Thus, the productivity as equipment can be improved.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, there is provided a substrate transfer path including a substrate carry-in section for carrying in a substrate and a substrate carry-out section for carrying out the substrate, and provided in the substrate transfer path. A plurality of substrate holders that are movable while holding the substrate, a plurality of supply units that are provided corresponding to the respective substrate holders, and that supply components to be mounted on the substrate, It is a mounting machine composed of a plurality of mounting parts that take out the parts supplied by the supply part and are mounted on the board, which can be mounted at a plurality of places in the board transfer path at the same time, The productivity as equipment can be improved.

According to a second aspect of the present invention, there is provided the mounting device according to the first aspect, further comprising a standby portion for temporarily waiting the substrate between the uppermost stream substrate holding section and the lowermost stream substrate holding section. Even when the mounting operation on the substrate held by the downstream substrate holding unit is temporarily interrupted by a component supply operation to the corresponding supply unit, the substrate holding unit upstream of the substrate holding unit Since the mounting operation on the board and the carry-out and carry-in of the board with respect to the board holding section can be continued in the section, it is possible to suppress a decrease in the operation rate as equipment.

According to a third aspect of the present invention, there is provided a substrate transfer section for transferring a substrate held by a substrate holding section upstream of a most downstream substrate holding section to one of the downstream substrate holding sections. 3. The mounting machine according to claim 1 or 2, wherein a new substrate can be carried into the substrate holding unit immediately after the substrate held by the substrate holding unit is taken out by the substrate transfer unit.
The substrate transfer time can be reduced.

According to a fourth aspect of the present invention, the substrate carrying-in portion and the substrate carrying-out portion are linearly arranged in one direction, and the first substrate holding portion and the first substrate carrying portion are arranged on one side of the straight line. The mounting machine according to any one of claims 1 to 3, wherein the mounting unit is provided, and the second board holding unit and the second mounting unit are provided on the other side, By providing a place for performing each mounting operation, it is possible to reduce the size of the entire equipment as compared with a case where two places for performing the mounting operation are provided on one side.

[0010] The invention according to claim 5 of the present invention provides the following:
The second substrate holding portion is arranged on a straight line orthogonal to one direction of the substrate loading portion and the substrate unloading portion, and the first and second substrate holding portions independently move in the orthogonal direction. Item 4. The mounting machine according to Item 4, wherein a portion serving as a movement guide among the moving mechanisms of the first substrate holding portion and the second substrate holding portion can be shared, so that the equipment can be made compact. Can be done.

According to a sixth aspect of the present invention, there is provided a substrate transfer unit for transferring a substrate held by the first substrate holding unit or the second substrate holding unit to the other substrate holding unit. Item 6. The mounting machine according to Item 5, wherein immediately after the substrate held by the first substrate holding unit or the second substrate holding unit is taken out by the substrate transfer unit, a new substrate is loaded into the substrate holding unit. And the substrate transfer time can be shortened.

[0012] The invention according to claim 7 of the present invention is arranged adjacent to the first substrate holding portion and the second substrate holding portion on the upstream side or the downstream side of the first substrate holding portion and the second substrate holding portion. 7. The mounting machine according to claim 6, further comprising a board transfer unit movable in the same direction as the board holding unit, wherein the board transfer unit is disposed adjacent to the first board holding unit and the second board holding unit. Since the substrate can be unloaded from the substrate holding unit to the substrate transfer unit in a short time, the substrate transfer time can be further reduced.

[0013] The invention according to claim 8 of the present invention is arranged adjacent to the first and second substrate holding portions on the upstream and downstream sides of the first and second substrate holding portions, and further includes the first and second substrate holding portions. 7. The mounting apparatus according to claim 6, further comprising a board transfer unit movable in the same direction as the board holding unit, wherein the board holding unit moves for carrying in and out of the board. Can be shortened, so that the equipment can be made more compact.

According to a ninth aspect of the present invention, there is provided:
6. The mounting machine according to claim 5, wherein the second substrate holding unit is configured to be rotatable at least up to a direction orthogonal to one direction of the substrate loading unit and the substrate unloading unit. Can be arranged adjacent to each other in series in the same transfer direction, and the substrate can be directly transferred between the two substrate holding units, so that the substrate transfer time can be reduced.

According to a tenth aspect of the present invention, there is provided the mounting machine according to the ninth aspect, wherein at least one of the substrate holding units is provided with a substrate sending means for sending a substrate to the other substrate holding unit. Further, since the substrate can be transferred between the two substrate holding units without providing a separate mechanism, the equipment can be made compact.

According to an eleventh aspect of the present invention, there is provided the mounting machine according to the ninth aspect, wherein at least one of the substrate holding units is provided with a substrate extracting means for extracting a substrate from the other substrate holding unit. Since the substrate can be transported between the two substrate holding units without providing a separate mechanism, the equipment can be made compact.

Embodiment 1 Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view showing a mounting machine according to the present embodiment, and FIG. 2 is a front view thereof.

As shown in FIGS. 1 and 2, a substrate carrying-in portion 3 for carrying in the substrate 2 is provided on the right side of the base 1 in the same figure, and a substrate carrying-out portion 4 for carrying out the substrate 2 is provided on the opposite left side. Are linearly arranged in the X direction.

The substrate 2 carried in from the substrate carrying-in section 3 is carried into the first substrate holding section 5, and thereafter, the central standby section 6
It is carried out to. Hereinafter, similarly, the substrate 2 is transported from the standby unit 6 to the second substrate holding unit 7 and further to the substrate unloading unit 4. As described above, the substrate loading unit 3, the first substrate holding unit 5, the standby unit 6, the second substrate holding unit 7, the substrate unloading unit 4
Thus, the substrate transport path 8 is configured.

Although not shown in detail, each of these parts has a pair of rails for guiding the end of the substrate 2 and a transport belt for transporting the substrate 2.

The first substrate holder 5 reciprocates from the position shown in FIG. 1 to the lower side in the figure, that is, in the Y direction shown in the figure. As shown in the figure, two first supply units 9 are linearly arranged in the X direction with the first substrate holding unit 5 interposed therebetween.

As shown in FIG. 1, two first mounting portions 10 as shown in FIG. 2 are arranged between the first supply portions 9 and the first substrate holding portions 5, respectively. Have been.

Each of the first mounting portions 10 has a nozzle 11 attached thereto as shown in FIG. 2, and reciprocates in the X direction shown in FIGS.

The two first mounting sections 10 take out the components supplied by the first supply section 9 with the nozzles 11 and mount the components on the board 2 held by the first board holding section 5. Has become.

The second substrate holding portion 7 is opposite to the first substrate holding portion 5 from the position shown in FIG. 1 on the upper side of the figure, that is, a straight line connecting the substrate carrying-in portion 3 and the substrate carrying-out portion 4. It moves to the side in the Y direction.

As shown in FIG. 2, two second supply units 12 are linearly arranged in the X direction with the second substrate holding unit 7 interposed therebetween.

As shown in FIG. 1, two second mounting portions 13 are arranged between the respective second supply portions 12 and the second substrate holding portions 7.

As shown in FIG. 1, a first inspection section 14 is arranged between the first supply section 9 and the first substrate holding section 5. After taking out the component from the first supply unit 9, the first mounting unit 10 moves over the first inspection unit 14 to the first substrate holding unit 5, and places the component on the substrate 2. Implement

The first inspection unit 14 inspects the holding posture of the component sucked and held at the lower end of the nozzle 11 when the first mounting unit 10 passes above the first inspection unit 14.

Similarly to the first inspection section 14, a second inspection section 15 is disposed between the second supply section 12 and the second substrate holding section 7.

As described above, the first substrate holding portion 5 is disposed on one side of the straight line connecting the substrate carrying-in portion 3 and the substrate carrying-out portion 4 shown in FIG. 1, and the second substrate holding portion is provided on the other side. The first and second supply units 9 and 12 and the first and second mounting units 10 and 13 are arranged corresponding to the first and second substrate holding units 5 and 7, respectively. That is, the configuration is as follows.

In this way, components are mounted simultaneously at two places in the board transfer path 8, that is, in the first and second board holding parts 5, 7, so that productivity as equipment is improved. Can be improved.

The first substrate holding portion 5 and the first mounting portion 10 are arranged on one side of the substrate carrying-in portion 3 and the substrate carrying-out portion 4 which are linearly arranged, and the second side is arranged on the other side. Since the board holding part 7 and the second mounting part 13 are arranged, compared with a case where two mounting operations are provided only on one side,
It is said that the entire facility can be made more compact.

As shown in FIGS. 1 and 2, after a predetermined amount of components are mounted on the board 2 in the first board holding portion 5 which is on the upstream side, that is, the most upstream, the board 2 is placed on the downstream side, that is, the most downstream. When the remaining predetermined amount of components are mounted on the second substrate holding unit 7 to complete the entire component mounting operation on the substrate 2, a high productivity can be achieved when mounting various types of components. Therefore, this is preferable as a mounting operation.

At this time, in the mounting operation in the second substrate holding portion 7 on the downstream side, the components to be supplied become insufficient, and in order to carry out the component replenishing operation, the mounting operation in the second substrate holding portion 7 must be performed. You will be temporarily suspended.

At this time, as shown in FIG. 1, the first substrate is placed in the standby portion 6 disposed between the first substrate holding portion 5 which is the most upstream and the second substrate holding portion 7 which is the most downstream. The board 2 that has completed the component mounting work in the holding unit 5 is temporarily put on standby, a new board 2 is loaded into the first board holding unit 5 from the board loading unit 3, and the component mounting work can be continued. ing.

As described above, even if the mounting operation in the second substrate holding unit 7 on the downstream side is temporarily interrupted, the mounting operation in the first substrate holding unit 5 on the upstream side is continued, so that the equipment can be installed. As a result, it is possible to suppress a decrease in the operation rate.

As shown in FIG. 2, the standby section 6 has a plurality of stages of standby spaces so that a plurality of substrates 2 can be made to wait by moving up and down.

(Embodiment 2) Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

FIG. 3 is a plan view showing the mounting machine of the present embodiment, and FIG. 4 is a front view thereof.

This embodiment is different from the above-described first embodiment in that the first and second substrate holders are arranged and the substrate is transported between the two base holders. The difference is that only the point where the substrate transfer section is provided and the point where the standby section is not provided is the same, and the other points have the same configuration. Detailed description is omitted.

As shown in FIG. 3, the first substrate holder 25
And the second substrate holding portion 27 are linearly arranged at the center of the base 1 in the Y direction shown in the figure, that is, in the direction orthogonal to the X direction straight line connecting the substrate carrying-in portion 3 and the substrate carrying-out portion 4. Are located in Then, they move independently on the one moving guide 21 shown in FIG. 4 in the Y direction.

As shown in FIGS. 3 and 4, a substrate transfer section 22 is disposed above the first and second substrate holding sections 25 and 27.

The substrate 2 is first conveyed from the substrate loading section 3 to the first substrate holding section 25. Then, a predetermined amount of components supplied by the first supply unit 9 is mounted on the substrate 2 by the first mounting unit 10.

Thereafter, the first substrate holder 25 moves below the substrate transfer unit 22 shown in FIGS. 3 and 4, and the substrate transfer unit 22 descends to move the substrate from the first substrate holder 25. 2
And then rise.

Next, the first substrate holding unit 25 moves to a position in series with the substrate loading unit 3 shown in FIG. 3, and a new substrate 2 is loaded into the first substrate holding unit 25. A component mounting operation is performed on the simple substrate 2.

Next, the second substrate holding unit 27 moves below the substrate transfer unit 22, and the substrate transfer unit 22 descends to transfer the previous substrate 2 to the second substrate holding unit 27. And then rise.

The component mounting operation is subsequently performed on the substrate 2 in the second substrate holding section 27.

As described above, the first and second substrate holders 2
Since the moving guide 21 is shared by the members 5, 27, the equipment can be made compact.

The first substrate holding portion 25 on the upstream side
Immediately after taking out the substrate 2 held by the substrate transfer unit 22, the new substrate 2 can be carried into the substrate holding unit 25, so that the substrate transfer time can be shortened.

(Embodiment 3) Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

FIG. 5 is a plan view showing the mounting machine of the present embodiment.

This embodiment is different from the above-described first embodiment in that the first and second substrate holders are arranged and the substrate for carrying the substrate between the two substrate holders is provided. The only difference is that a transfer unit is provided and a standby unit is not provided. Other configurations are the same, and the same components are denoted by the same reference numerals. Detailed description is omitted.

As shown in FIG. 5, the first substrate holder 35
And the second substrate holding portion 37 are linearly arranged in the center portion of the base 1 in the Y direction shown in the figure, that is, in the direction orthogonal to the X direction straight line connecting the substrate carrying-in portion 3 and the substrate carrying-out portion 4. Are located in

The substrate 2 is first conveyed from the substrate loading section 3 to the first substrate holding section 35. Then, a predetermined amount of components supplied by the first supply unit 9 is mounted on the substrate 2 by the first mounting unit 10.

Thereafter, the first substrate holder 35 moves in series with and is adjacent to the substrate unloading unit 4 shown in FIG. That is, the substrate unloading unit 4 is the substrate transfer unit 31.

Next, a new board 2 is loaded into the first board holding section 35 from the board loading section 3 which is arranged in series and adjacent to the first board holding section 35. Subsequently, a component mounting operation on the new board 2 is performed. Will be

Next, the second substrate holding unit 37 is moved to a position in series with the substrate transferring unit 31, and the substrate 2 is transferred from the substrate transferring unit 31 to the substrate holding unit 37. Become.

The component mounting operation is subsequently performed on the substrate 2 in the second substrate holding section 37.

As described above, immediately after the substrate 2 held by the first substrate holding unit 35 on the upstream side is taken out by the substrate transfer unit 31, a new substrate 2 is loaded into the first substrate holding unit 35. Therefore, the substrate transfer time can be shortened.

(Embodiment 4) Hereinafter, a fourth embodiment of the present invention will be described with reference to the drawings.

FIG. 6 is a plan view showing the mounting machine of the present embodiment.

This embodiment is different from the above-described third embodiment in that a substrate transfer section is provided between the substrate loading / unloading section and the first and second substrate holding sections. Only the points are different, and the other points have the same configuration. Therefore, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 6, the substrate loading section 3 and the first,
A first substrate transfer unit 41 is provided between the second substrate holding units 45 and 47, and a second substrate transfer unit is provided between the first and second substrate holding units 45 and 47 and the substrate unloading unit 4. Part 42 is arranged,
It can move in the Y direction shown in FIG.

The substrate 2 is transported from the substrate loading unit 3 to the first substrate transfer unit 41 first, and then to the first substrate holding unit 45. Then, a predetermined amount of components supplied by the first supply unit 9 is mounted on the substrate 2 by the first mounting unit 10.

In the meantime, the second substrate transfer unit 42 has moved to a position adjacent to the substrate unloading unit 4 in series.

After that, the first substrate holding unit 45 moves to a position adjacent to the substrate transfer unit 42 in series and transfers the substrate 2 to the second substrate transfer unit 42.

Next, a new board 2 is carried into the first board holding section 45 from the board transfer section 41 which is waiting at a position adjacent in series, and the components for the new board 2 are successively loaded. Implementation work is performed.

Next, the second substrate transfer section 42 and the second substrate holding section 47 are moved to respective positions in series, and the second substrate transfer section 42 and the second substrate holding section 47 The substrate 2 is transferred.

The component mounting operation is subsequently performed on the substrate 2 in the second substrate holding section 47.

Further, the first substrate transfer section 41 can supply the substrate 2 to the first and second substrate holding sections 45 and 47 alternately.

In this case, the first substrate transfer unit 41 which has received the substrate 2 from the substrate carry-in unit 3 moves to the position where the first and second substrate holding units 45 and 47 are in series with the non-working ones. Then, the substrate 2 is transferred.

Similarly, the second substrate transfer unit 42 moves to a position in series with the end of the operation of the first and second substrate holding units 45 and 47 to receive the substrate 2, and then unloads the substrate. The substrate 2 is unloaded by moving to a position in series with the unit 4.

As described above, the first and second substrate transfer units 4
The first and second substrate holders 45 and 47 and the first and second substrate holders 45 and 47 move to an intermediate position to be in series and can be transported, so that the transport time can be reduced and the equipment can be made more compact. I have.

(Fifth Embodiment) Hereinafter, a fifth embodiment of the present invention will be described with reference to the drawings.

FIG. 7 is a plan view showing a mounting machine according to the present embodiment.

This embodiment is different from the third embodiment in that the first and second substrate holders are rotatable in a direction perpendicular to one direction of the substrate carry-in unit and the substrate carry-out unit. Are different from each other, and the other points have the same configuration. Therefore, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 7, the first substrate holder 55
And the second substrate holding portion 57 are arranged at the center of the base 1 in a straight line in the Y direction shown in the figure, and are orthogonal to a straight line in one direction connecting the substrate loading portion 3 and the substrate discharging portion 4. It can rotate up to.

The substrate 2 is transported from the substrate loading section 3 to the first substrate holding section 55 first. And the first supply unit 9
Is mounted on the board 2 by the first mounting unit 10.

Thereafter, the first and second substrate holders 55, 5
Numeral 7 rotates until it is orthogonal to the substrate transport path, moves to a position adjacent to each other, and transfers the substrate 2 by using a substrate sending means or a substrate extracting means (not shown).

Further, as described in the first embodiment, a transport belt may be provided in each of the first and second substrate holders 55 and 57.

After the transfer of the substrate 2 in this manner, the first and second substrate holders 55 and 57 rotate in the opposite directions to the previous state and return to the original state.

Next, a new board 2 is loaded into the first board holding section 55 from the board loading section 3, and a component mounting operation on the new board 2 is performed.

During this time, the component mounting operation is being performed in the second substrate holding unit 57, and after the operation, the subsequent substrate 2 is discharged to the substrate unloading unit 4.

As described above, the first and second substrate holders 5
Since the substrates 5, 57 can be arranged adjacent to each other in series in the same transport direction, the substrate transport time can be shortened.

[0087]

As described above, the present invention provides a substrate transport path including a substrate loading section for loading a substrate and a substrate unloading section for transporting the substrate, and a board provided in the substrate transport path to hold the substrate. And a plurality of supply units provided corresponding to the respective substrate holders and configured to supply components to be mounted on the substrate, and a plurality of supply units provided corresponding to the respective substrate holders. This is a mounting machine composed of a plurality of mounting parts that take out the parts supplied by the parts and mount them on the board.The mounting work can be performed simultaneously at multiple places in the board transfer path, and the productivity as equipment is improved. Can be improved.

[Brief description of the drawings]

FIG. 1 is a plan view showing a mounting machine according to a first embodiment of the present invention.

FIG. 2 is a front view of the same.

FIG. 3 is a plan view showing a mounting machine according to a second embodiment of the present invention.

FIG. 4 is a front view of the same.

FIG. 5 is a plan view showing a mounting machine according to a third embodiment of the present invention.

FIG. 6 is a plan view showing a mounting machine according to a fourth embodiment of the present invention.

FIG. 7 is a plan view showing a mounting machine according to a fifth embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 1 base 2 substrate 3 substrate carry-in part 4 substrate carry-out part 5 first substrate holding part 6 standby part 7 second substrate holding part 8 substrate transport path 9 first supply part 10 first mounting part 11 nozzle 12th Second supply unit 13 Second mounting unit 14 First inspection unit 15 Second inspection unit 21 Moving guide 22 Substrate transfer unit 25 First substrate holding unit 27 Second substrate holding unit 31 Substrate transfer unit 35 First substrate holding unit 37 Second substrate holding unit 41 First substrate transfer unit 42 Second substrate transfer unit 45 First substrate holding unit 47 Second substrate holding unit 55 First substrate holding unit 57 Second substrate holder

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Shigeki Nakatsuka 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E313 AA01 AA11 DD07 DD12 DD13 DD14 EE03 EE24

Claims (11)

[Claims] 1. A substrate transfer path including a substrate carry-in portion for carrying in a substrate and a substrate carry-out portion for carrying out the substrate, and a plurality of substrates provided in the substrate transfer passage and capable of holding and moving the substrate. Holder, a plurality of supply units provided corresponding to each of the board holding units and supplying components to be mounted on the board, and the components supplied corresponding to the board holding units and supplied by the supply unit are taken out. A mounting machine composed of multiple mounting units mounted on a board. 2. The mounting machine according to claim 1, further comprising a standby unit for temporarily waiting the substrate between the uppermost substrate holding unit and the lowermost substrate holding unit. 3. The substrate transfer section according to claim 1, further comprising a substrate transfer section for transferring a substrate held by the substrate holding section upstream of the most downstream substrate holding section to one of the downstream substrate holding sections. Mounting machine. 4. A substrate carrying-in part and a substrate carrying-out part are linearly arranged in one direction, a first substrate holding part and a first mounting part are provided on one side of the straight line, and on the other side. The mounting machine according to claim 1, further comprising a second substrate holding unit and a second mounting unit. 5. The first and second substrate holders are arranged on a straight line orthogonal to one direction of the substrate loading unit and the substrate unloading unit, and the first and second substrate holders are independent of each other in the orthogonal direction. 5. The mounting machine according to claim 4, wherein the mounting machine moves. 6. The mounting machine according to claim 5, further comprising a substrate transfer unit for transferring the substrate held by the first substrate holding unit or the second substrate holding unit to the other substrate holding unit. 7. A first substrate holding portion and a second substrate holding portion which are arranged adjacent to an upstream side or a downstream side of the first and second substrate holding portions and are movable in the same direction as the first and second substrate holding portions. The mounting machine according to claim 6, further comprising a substrate transfer unit. 8. A first substrate holding unit and a second substrate holding unit which are arranged adjacent to the upstream and downstream sides of the first and second substrate holding units and are movable in the same direction as the first and second substrate holding units. The mounting machine according to claim 6, further comprising a substrate transfer unit. 9. The mounting machine according to claim 5, wherein the first and second substrate holding portions are configured to be rotatable at least in a direction orthogonal to one direction of the substrate carrying-in portion and the substrate carrying-out portion. 10. The mounting machine according to claim 9, wherein at least one of the substrate holding units is provided with substrate sending means for sending a substrate to the other substrate holding unit. 11. The mounting machine according to claim 9, wherein at least one of the substrate holding units is provided with a substrate extracting means for extracting a substrate from the other substrate holding unit.