JPH04261734A - Mounting device for tip - Google Patents

Abstract

PURPOSE:To reduce to the utmost the dead time when a transfer head stops its operation, in the case of a substrate being carried in and out of a stage, by including a common mounting stage with the moving areas of each transfer head being superposed each other. CONSTITUTION:Mounting stages a, b, c mounting tips on a substrate S are provided at least 3 places. Also transfer heads A, B are provided in plural pieces, the respective moving area of the transfer heads A, B are made to include the mounting stages at two places, and yet by superposing the moving areas mutually, a common mounting stage is provided on plural transfer heads. Consequently the tip is mounted on the substrate, while covering the substrate of the common mounting stage by the plural transfer heads.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus, and more particularly to a means for transferring and mounting a chip onto a substrate while fully operating a plurality of transfer heads.

0002

[Prior Art] As a device for mounting chips such as QFP and SOP on a board, the board is positioned on a mounting stage,
A device has been implemented in which a transfer head is moved in the XY directions by an XY table, and the chips on the tray are transferred and mounted on the substrate while reciprocating between the tray and the substrate.

[0003] Also, as a mounting device for such a chip,
A system has been implemented in which two transfer heads and two mounting stages are provided, and chips are mounted on two substrates using the two transfer heads to increase work efficiency.

0004

[Problem to be Solved by the Invention] However, in the case of a chip mounting apparatus equipped with two transfer heads and a mounting stage,
When transferring substrates to and from two mounting stages, the transfer head must stop operating for a considerable period of time, and this operation stoppage time becomes dead time, which reduces work efficiency. there were.

SUMMARY OF THE INVENTION An object of the present invention is to provide a means for efficiently mounting chips on a substrate using a plurality of transfer heads while minimizing the dead time as described above.

[0006]

[Means for Solving the Problems] The present invention has at least three mounting stages provided on a substrate transport path, and is driven by an XY table to move in the XY direction, thereby positioning the mounting stage. The device is equipped with a plurality of transfer heads for transferring and mounting chips on a substrate, and the movement areas of the respective transfer heads overlap each other to include a common mounting stage.

[0007]

[Operation] In the above configuration, the transfer head mounts the chip on the substrate of the mounting stage while moving in the X and Y directions. In this case, each transfer head has a common mounting stage in its movement area. Therefore, the chips are mounted while covering each other on the board of this mounting stage.

[0008]

Embodiments Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a chip mounting apparatus. This mounting device has two transfer devices 1 and 2. Each of the transfer devices 1 and 2 is the same, and each
It consists of Y tables 3 and 4 and transfer heads A and B held on the XY tables 3 and 4. Trays 5 and 6 serve as chip supply units, and are equipped with chips such as QFP and SOP.

Reference numeral 7 denotes a conveyor for conveying substrates, and along the conveyance path of this conveyor 7, there are three loading stages a,
b and c are provided. The above transfer heads A and B are
Driven by Y tables 3 and 4, trays 5 and 6 and substrate S
It moves back and forth between the trays, picks up chips P on trays 5 and 6, and transfers and mounts them onto substrates S positioned on mounting stages a, b, and c.

In FIG. 2, Q1 is the movement area of the transfer head A, and Q2 is the movement area of the transfer head B. One moving area Q1 includes two loading stages a and b. The other moving area Q2 includes two mounting stages b and c. Therefore, the movement areas Q1 and Q2 of the respective transfer heads A and B overlap and include the intermediate mounting stage b as a common mounting stage.

Next, the operating method will be explained with reference to FIG. As shown in FIG. 3(a), the first substrate S1 is carried onto the stage a, and a chip is mounted by one transfer head A. As shown in FIG. In this case, the board S1 is divided into three areas E1, E
It is divided into 2 and E3, and the chip is mounted in area E1 on the left side.

Next, this substrate S1 is moved to the intermediate stage b (FIG. 2(b)), and on this stage b, the chip is mounted on the area E2 of the substrate S1 by the transfer head B, while being transferred to the other stage a. The second substrate S2 is carried in (FIG. 3(c)). In the figure, area E marked with symbols A and B represents the area where chips are being mounted by transfer heads A and B. Furthermore, area E with symbols A and B marked on the shaded line represents an area where loading by transfer heads A and B has been completed.

Next, on stage a, the substrate S1 is moved to stage c while a chip is mounted on area E1 of substrate S2 (FIG. 2(d)). Next, at stage c, while mounting the chip on area E3 of substrate S1,
The substrate S2 is moved to stage b ((e) in the figure). Next, the substrate S1 with chips mounted on all areas E1, E2, and E3 is carried out from the stage c, and while mounting the chips on the area E2 of the substrate S2 on the stage b,
Transfer the third substrate S3 to stage a ((f) in the same figure)
. Next, the substrate S2 is moved from the stage b to the stage c while mounting the chip on the area E1 of the substrate S3. (Figure (g)).

The state shown in FIG. 3(g) is the same as the state shown in FIG. will be installed sequentially.

In the state shown in FIG. 2(c), the substrate S2
While the substrate S2 is being transferred to the stage a, a chip is mounted on the substrate S2 by the transfer head B. Further, in the state shown in FIG. 2D, a chip is mounted on the substrate S2 by the transfer head A while the substrate S1 is being moved from the stage b to the stage c. Also in the same figure (e), (f), (g)
Also in the state shown in , a chip is mounted on the other substrate S while one substrate S is being transported.

[0017] In this way, the present means has the mounting stages a and b.
. However, since we are making it possible to mount a chip,
When carrying the substrate S to and from the stage, both heads A,
B does not completely stop operation, and both heads A
, B to reduce the dead time when the operation is stopped, both heads A and B can cover the substrate S of the common stage b, and both heads A and B can be operated at full capacity to perform the mounting work efficiently. be able to.

[0018] The above embodiment has been explained by taking as an example the case where there are two transfer heads and three loading stages, but the same method can be used when there are three or more transfer heads and four or more loading stages. Able to drive. Furthermore, the above embodiment is explained by taking as an example a case where the substrate S is divided into a plurality of areas E1, E2, and E3, and chips are mounted in each area E1, E2, and E3 using two transfer heads A and B. However, the chips are divided into multiple groups (for example, the first group and the second group) by type, and the chips of the first group are mounted on the substrate S by one transfer head A, and the chips of the second group are The other transfer head may be used to load the substrate S, and various operating modes are possible.

[0019]

[Effects of the Invention] As explained above, the present invention provides at least three mounting stages provided on the substrate transport path;
It is equipped with a plurality of transfer heads that transfer and mount chips on the substrate positioned on the mounting stage by being driven by an XY table and moved in the XY directions, and the moving areas of each transfer head overlap each other Since the transfer head covers a common mounting stage, it minimizes the dead time when the transfer head stops operating when loading and unloading substrates to and from the stage, and covers the substrates on the common stage with the transfer head. While working together, each transfer head can be operated at full capacity to perform mounting work with high work efficiency.

[Brief explanation of the drawing]

[Fig. 1] A perspective view of a chip mounting apparatus of the present invention.

[Figure 2] Plan view of the mounted stage

[Figure 3] Explanatory diagram of the same operation process

[Explanation of symbols]

A, B Transfer head S board Q1, Q2　Movement area a, b, c Loading stage 3,4 XY table 7 Conveyor

Claims (1)

[Claims] [Claim 1] At least three substrates provided on the substrate conveyance path.
Driven by the loading stage and the XY table,
It is equipped with a plurality of transfer heads that transfer and mount chips on the substrate positioned on the mounting stage by moving in the direction, and the movement area of each transfer head overlaps with the common mounting stage. What is claimed is: 1. A chip mounting device characterized in that: