JP2001150255A - Parts feeder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To optimize the layout of parts feeding units. SOLUTION: The plurality of parts feeding units are provided each comprising a placement table 10 capable of movement in X direction and Y direction and θrotation while having placed thereon a plurality of wafers 11 each containing a number of bare chips, a takeout mechanism 15 for taking out the desired bare chips from within the wafers 11 on the placement table 10 and transferring the bare chips onto a corresponding inspection table 16, an inspection mechanism 20 for inspecting the bare chips on the inspection stand 16 for their states, and a mounting mechanism 21 for taking out and mounting the bare chips on mounting substrates 2 after an inspection carried out with the inspection mechanism 20. The parts feeding units are arranged so that the interval between the parts taking positions of adjacent takeout mechanisms 15 is smaller than the interval between the centers of θ rotation of adjacent placement stands 10, so that the interval between adjacent mounting stations and therefore the distance over which the mounting substrate 2 is conveyed are reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply device, and more particularly, to a technique for improving the arrangement efficiency of a component supply device for supplying various components mounted on a mounting board.

[0002]

2. Description of the Related Art A conventional component supply apparatus will be described below. For convenience of explanation, the following description will be given by taking a board supply device mounted on a component mounting apparatus for mounting various components on a mounting board as an example.

[0003] As a conventional component supply device, for example, FIG.
A plurality of (four in this embodiment) parts groups (for example, semiconductor wafers) 31 accommodating a large number of parts are placed as shown in FIG. A take-out mechanism 34 for taking out a desired component from the plurality of component groups 31 on the mounting table 32 and transferring it to the test table 33; an inspection mechanism 35 for inspecting the component state on the test table 33; The component mounting efficiency is enhanced by providing a plurality of component supply units each including a component after completion of inspection by the inspection mechanism 35 and a mounting mechanism 37 mounted on the mounting board 36.

[0004]

However, in the component supply device having the above-described configuration, the mounting table 32 moves in the X and Y directions and rotates by θ in accordance with the position where the component is taken out by the take-out mechanism 34. It is necessary to arrange the moving range based on the center T (the range indicated by a two-dot chain line so as to surround the outer peripheral portion of the mounting table 32 in FIG. 3) and the mounting tables 32 adjacent to each other at a predetermined interval. Component supply units occupy a relatively large area of equipment space.

[0005] In particular, in recent years, the required specifications of various types of component mounting apparatuses have become more sophisticated, and the apparatuses have become larger. Therefore, there has been a demand to improve the arrangement efficiency by improving the component supply unit arrangement method.

Furthermore, if the transport distance of the mounting board can be shortened by the improvement of the component supply unit arrangement method, it will be advantageous to shorten the transport time.

[0007]

SUMMARY OF THE INVENTION In view of the above-mentioned problems, a component supply apparatus according to the present invention mounts a plurality of wafers 11 containing a large number of bare chips as shown in FIG. A mounting table 10 capable of moving and moving in the Y direction and rotating by θ, a take-out mechanism 15 for taking out a desired bare chip from within the wafer 11 on the mounting table 10 and transferring each bare chip onto a corresponding inspection table 16, A plurality of component supply units including an inspection mechanism 20 for inspecting a bare chip state on the inspection table 16 and a mounting mechanism 21 for taking out the bare chip after the inspection by the inspection mechanism 20 and mounting it on the mounting board 2 are provided. By disposing the component take-out positions between the corresponding take-out mechanisms 15 so as to be narrower than the space between the θ rotation centers of the adjacent mounting tables 10, the adjacent mounting stations are arranged. Since the distance between the components is shortened, the transport distance of the mounting board 2 can be reduced.

Further, the mounting table 10, the take-out mechanism 15, and the mounting board 2 are arranged on a straight line so as to have a front-rear relationship, the θ rotation center of the mounting table 10 is shifted by a predetermined amount, and the adjacent mounting tables are shifted. 3, the mounting table 32, the takeout mechanism, and the mounting board are arranged on a straight line in a front-rear relationship, as shown in FIG. 3, and the θ rotation center of the mounting table is on the straight line. Since the interval between the mounting stations is shorter than that of a certain configuration, the transport distance of the mounting board 2 can be reduced.

Further, the mounting table 10, the take-out mechanism 15, and the mounting board 2 are arranged on a straight line so as to have a front-rear relationship with each other. The mounting tables 10 are shifted by a predetermined amount in the direction in which the mounting tables 10 are separated from each other, and the distance between the adjacent mounting tables 10, the take-out mechanism 15, and the mounting substrate 2 that are linearly arranged is shifted in the direction of narrowing by the predetermined amount. Since the interval between the adjacent work stations is reduced, the transport distance of the mounting board 2 can be reduced.

Further, as shown in FIG. 1, four (or six) wafers 11 are mounted on the mounting table 10, and, for example, the θ rotation center of the mounting table 10 is When the mounting substrate 2 is shifted from the straight line by 45 ° (or 60 °) in a form having a front-rear relationship, the mounting substrate 2
By rotating the bare chip taken out during the mounting operation onto the mounting table 10 by 90 ° (or 120 °), the orientation of the bare chip in the wafer 11 when the bare chip is mounted on the mounting table 10 and the bare chip are mounted on the mounting board 2. In this case, the moving direction of the mounting mechanism 21 can be matched.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a component supply apparatus according to an embodiment of the present invention.

FIGS. 1 and 2 are a plan view and a side view of a component supply apparatus to which the present invention is applied.

In FIG. 1, reference numeral 1 denotes a component supply device main body, which is supplied from a supply stocker (not shown) to the main body 1 and transports a work pallet 3 on which a mounting board 2 on which various components are mounted is mounted to a mounting station. Further, a transport mechanism 4 for transporting the mounting board 2 on which the mounting operation has been completed to the downstream is configured. The mounting board 2 mounted on the work pallet 3
May be one sheet or a plurality of sheets.

Although various configurations are conceivable as the configuration of the transport mechanism 4, in the present embodiment, a slide that can be moved horizontally while being guided by the transport guide 5 with the work pallet 3 mounted thereon. Although a configuration having the mechanism 6 is adopted, for example, a transport system using a conveyor or a rod feed system may be used.

Further, in this embodiment, in order to improve the component mounting efficiency, a plurality of (for example, two) component supply units described later are prepared, and the corresponding work pallet 3 is provided.
The (mounting board 2) is transported to the mounting station by a plurality (two) at a time.

Reference numeral 10 denotes a component group containing a large number of components (in this embodiment, a diced semiconductor wafer, hereinafter referred to as a wafer, and a component taken out of the wafer 11 is referred to as a bare chip). , 4)
The mounting table is capable of moving in the X direction, the Y direction, and rotating by θ, and is arranged in two adjacent shapes. The range indicated by the two-dot chain line so as to surround the outer peripheral portion of the mounting table 10 in FIG. 1 is the moving range of the mounting table 10 with respect to the center T.

A pick-up mechanism 15 picks up a desired bare chip from within the wafer 11 on the mounting table 10 and transfers it to the inspection table 16. The pick-up mechanism 15 has a pickup arm 17 that can be rotated 90 ° horizontally and moved up and down. Pickup arm 1
After the bare chips on the wafer 11 are sucked out at 7, the pickup arm 17 is rotated by 90 ° via the fulcrum to transfer the bare chips onto the inspection table 16.

Reference numeral 20 denotes an inspection mechanism for inspecting the state (posture, chipping, etc.) of the bare chip transferred on the inspection table 16, and the posture of the bare chip by a recognition camera (not shown) positioned above the inspection table 16. And recognizes a chipped state or the like.

21 is to take out the bare chip after the inspection is completed,
A mounting mechanism for mounting on the mounting board 2;
Has a bonding head 22 that can move horizontally and vertically and can rotate θ from the inspection station to the mounting station, and picks up the bare chip on the inspection table 16 by the bonding head 22 and then mounts the mounting point on the mounting board 2. And then move down at that point to bond the bare chip.

A component supply unit is constituted by the mounting table 10, the take-out mechanism 15, the inspection mechanism 20, and the mounting mechanism 21, and the component supply units are arranged adjacent to each other.
The transfer mechanism 4 is provided side by side.

The component take-out points on the mounting table 10, the inspection points by the inspection mechanism 20, and the mounting points on the mounting board 2 are arranged on a straight line in a back-and-forth relationship. The center T is shifted by a predetermined amount (for example, 45 ° from the straight line) in a direction in which the mounting tables 10 adjacent to each other are separated from the straight line. (It becomes narrower than the interval between the θ rotation centers T between the mounting tables 10)
Set to position.

By adopting such an arrangement, in the present invention, the parts take-out point on the mounting table 31, the inspection point by the inspection mechanism 35, and the mounting point on the mounting board 36 as in the prior art (arrangement shown in FIG. 3). Are arranged on a straight line in a manner having a front-rear relationship, and the interval between the mounting tables 10 (adjacent to each other) is smaller than that in the configuration in which the θ rotation center T of the mounting table 31 is on the straight line. The distance A <A ′) between the mounting points on the mounting board 2 and the moving range (B <B ′) of the mounting table 10 can be reduced. Therefore, the transport distance of the mounting board 2 can be reduced.

Further, as described above, four wafers 11 are placed on the mounting table 10, and, for example, the θ rotation center of the mounting table 10 is set to the unloading point by the unloading mechanism 15 on the mounting table 10, the inspection mechanism 16 In a case where the bare chip is taken out by the pickup arm 17 of the take-out mechanism 15 when it is arranged at a position shifted by 45 ° from a straight line connecting the inspection point by the mounting mechanism 21 and the mounting point by the mounting mechanism 21 on the mounting board 2, 90
In order to rotate the bare chip 90 ° and mount it on the mounting substrate 2 by rotating the wafer
Can be matched with the direction of the bare chips in the wafer 11 when the wafer is placed and the moving direction (mounting direction) of the mounting mechanism 21 when the bare chips are mounted on the mounting substrate 2. Of the wafer 11 can be suppressed.

In this embodiment, four wafers 11 are placed on the mounting table 10, and the θ rotation center of the mounting table 10 is determined by the unloading point of the unloading mechanism 15 on the mounting table 10 and the inspection by the inspection mechanism 20. Although the configuration in which the points and the mounting point of the mounting mechanism 21 on the mounting substrate 2 are arranged at a position shifted by 45 ° from the straight line connecting the mounting points has been described, the present invention is not limited to this, and the illustrated description is omitted. However, for example, six wafers 11 are placed on the mounting table 10, and the θ rotation center of the mounting table 10 is determined by the unloading point of the unloading mechanism 15 on the mounting table 10, the inspection point by the inspection mechanism 20, and the mounting substrate 2. By arranging the components at a position shifted by 60 ° from a straight line connecting the mounting points by the mounting mechanism 21 above, the component supply unit arrangement efficiency which is a feature of the present invention is provided. Together to enable the top, after the removal of the bare chip by the pickup arm 17 of the take-out mechanism 15, the pick-up arm 17 120
If the bare chip is rotated by 120 ° to be mounted on the mounting substrate 2 by rotating the mounting table 2
Since the direction of the bare chips in the wafer 11 when placing the wafer 11 thereon and the moving direction (mounting direction) of the mounting mechanism 21 when mounting the bare chips on the mounting board 2 can be matched, An error in mounting the wafer 11 on the mounting table 10 can be suppressed.

Hereinafter, the component supply operation will be described with reference to the drawings.

First, the worker places the wafer 11 on the mounting table 10.
Is placed on four sheets. At this time, as described above, the wafer 11
The mounting direction of the bare chip inside the mounting board 21 may be adjusted in accordance with the moving direction of the mounting mechanism 21 when mounting the bare chip on the mounting board 2, so that mounting errors are less likely to occur (in FIG. Shown).

After mounting four wafers 11 on the mounting table 10 as described above, the operator starts the component mounting operation.

When the component mounting operation is started, the mounting table 10
Move in the X and Y directions and rotate θ (
A range indicated by a two-dot chain line so as to surround the outer peripheral portion is a moving range of the mounting table 10 with respect to the center T. Then, the pickup arm 17 of the take-out mechanism 15 is positioned above the desired bare chip (see FIGS. 1 and 2).

Next, the pick-up arm 17 moves down by a predetermined amount to suck and take out a desired bare chip. At the time of suction and removal, a push-up mechanism (not shown) is provided to push up the bare chip from the back surface of the wafer to facilitate suction and removal.

Subsequently, after picking up the bare chip on the wafer 11 by the pick-up arm 17, the pick-up arm 17 is rotated 90 ° through a fulcrum,
A bare chip is transferred onto the inspection table 16. At this time,
The direction of the bare chip on the wafer 11 and the direction of the bare chip on the inspection table 16 are the same. Here, the inspection table 16
The bare chip state (posture, chipping, etc.) transferred above is
It is recognized by the inspection mechanism 20.

Finally, the bare chip after the inspection is taken out by the bonding head 22 of the mounting mechanism 21, and the bare chip is bonded to the mounting point on the mounting board 2 via the bonding head 22. At this time, as a result of recognition by the inspection mechanism 20, for a bare chip having a posture (position) deviation, the head 22 is rotated by a desired angle θ after being sucked by the bonding head 22, and the posture (position) deviation is thereby obtained. Is corrected and mounted on the mounting board 2.
In addition, for a defective product such as a chipped product, the mounting operation is temporarily interrupted, an abnormality is notified, and the worker is notified.

Hereinafter, the same operation is repeated. At this time, a desired bare chip is sequentially selected and mounted. In the present invention, a component take-out point on the mounting table 10, an inspection point by the inspection mechanism 20, and a mounting point on the mounting board 2 are respectively set before and after. Are arranged on a straight line in a relational manner, and the θ rotation center T of the mounting table 10 is shifted by a predetermined amount (for example, 45 ° from the straight line) in a direction in which the mounting tables 10 adjacent to each other are separated from the straight line. Conventionally (arrangement configuration shown in FIG. 3) by arranging the component take-out position intervals between adjacent take-out mechanisms 15 smaller than the interval between θ rotation centers T between adjacent mounting tables 10.
The component take-out points on the mounting table 31, the inspection points by the inspection mechanism 35, and the mounting points on the mounting board 36 are arranged on a straight line in a back-and-forth relationship, and the rotation center θ of the mounting table 31 Compared to the configuration in which T is on the straight line, the interval between the mounting tables 10 (the interval A <A ′ between the mounting points on the adjacent mounting substrates 2).
Further, the moving range (B <B ′) of the mounting table 10 can be narrowed. Therefore, the transfer distance of the mounting board 2 can be shortened, the time required for transferring the mounting board 2 can be shortened, and workability is improved.

[0033]

According to the present invention, the mounting table, the take-out mechanism, and the mounting board are arranged on a straight line in a front-rear relationship, and the θ rotation center of the mounting table is adjacent to the mounting table. By displacing the mounting tables by a predetermined amount in a direction in which the mounting tables are separated from each other, the mounting table, the takeout mechanism, and the mounting board as in the related art are arranged on a straight line in a front-rear relationship,
Compared to the configuration in which the θ rotation center of the mounting table is on the straight line, the space between the mounting tables (the space between the mounting points on adjacent mounting boards) and the moving range when the mounting table moves. Can be narrow. Therefore, by employing the above arrangement, the transfer distance of the mounting board can be reduced, and the transfer efficiency can be improved by shortening the time required for transferring the board.

A plurality of component groups are placed on the mounting table, and the θ rotation center of the mounting table is arranged at a position shifted by a predetermined angle from a straight line connecting the mounting table, the take-out mechanism, and the mounting board. In this case, after the parts are taken out by the take-out mechanism, the bare chips are mounted on a mounting board by rotating the bare chips by a predetermined angle, so that the orientation of the bare chips when the wafer is mounted on the mounting table and the mounting board. Since the direction of movement (mounting direction) of the mounting mechanism for mounting the components can be matched, it is possible to prevent a worker from mounting the wafer on the mounting table.

[Brief description of the drawings]

FIG. 1 is a plan view showing a component supply device according to an embodiment of the present invention.

FIG. 2 is a side view showing a component supply device according to an embodiment of the present invention.

FIG. 3 is a plan view showing a conventional component supply device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component supply apparatus main body 2 Mounting board 4 Transfer mechanism 10 Mounting table 11 Semiconductor wafer 15 Take-out mechanism 16 Inspection table 20 Inspection mechanism 21 Mounting mechanism

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F065 AA37 CC19 FF04 JJ03 PP12 QQ31 3C030 BC16 DA01 DA11 DA15 4M106 AA02 CA38 DB01 DG08 DG10 DG20 DG26 5F047 FA02 FA03 FA05 FA08 FA72 FA74 FA83

Claims (7)

[Claims] 1. A component supply device for supplying various components mounted on a mounting board, wherein a plurality of component groups accommodating a large number of components are placed, and the component group is capable of moving in an X direction, a Y direction, and rotating θ. A plurality of component supply units each including a mounting table and a mounting mechanism for picking up desired components from the plurality of component groups on the mounting table and mounting the components on a mounting board, and a component pick-up position interval between adjacent picking-up mechanisms. Are arranged so as to be narrower than the interval between the θ rotation centers of the adjacent mounting tables. 2. A component supply apparatus for supplying various components mounted on a mounting board, wherein a plurality of component groups containing a large number of components are placed, and a component group capable of moving in the X and Y directions and rotating θ. A mounting table, a take-out mechanism for taking out a desired part from a plurality of component groups on the mounting table, and transferring the component to an inspection table; an inspection mechanism for inspecting a component state on the inspection table; Equipped with a plurality of component supply units consisting of a mounting mechanism that picks up components after inspection and mounts them on the mounting board, and the interval between component pick-up positions between adjacent pick-up mechanisms is the interval between the θ rotation centers of adjacent mounting tables. A component supply device, wherein the component supply device is arranged to be narrower than the component supply device. 3. A component supply device for supplying various components mounted on a mounting board, wherein a plurality of component groups accommodating a large number of components are placed, and the component group can be moved in X and Y directions and rotated by θ. A plurality of component supply units each including a mounting table and a mounting mechanism for extracting a desired component from the plurality of component groups on the mounting table and mounting the mounting component on the mounting board are provided. A component supply device, which is arranged on a straight line in a front-rear relationship, and the center of rotation of the mounting table is not on the straight line. 4. A component supply device for supplying various components mounted on a mounting board, wherein a plurality of component groups accommodating a large number of components are placed, and a component group capable of moving in the X and Y directions and rotating θ. A mounting table, a take-out mechanism for taking out a desired part from a plurality of component groups on the mounting table, and transferring the component to an inspection table; an inspection mechanism for inspecting a component state on the inspection table; A plurality of component supply units including a mounting mechanism for taking out the component after the inspection and mounting the component on the mounting board are provided. The mounting table, the removing mechanism, and the mounting board are linearly arranged in a front-rear relationship. A component supply device, wherein the center of rotation of the mounting table is not on the straight line. 5. The apparatus according to claim 3, wherein the θ rotation center of the mounting table is shifted by a predetermined angle from a straight line on which the mounting table, the take-out mechanism, and the mounting board are arranged. Parts supply equipment. 6. The method according to claim 3, wherein the θ rotation center of the mounting table is offset by 45 ° and 60 ° from a straight line on which the mounting table, the take-out mechanism, and the mounting board are respectively arranged. The component supply device according to claim 4 or 5. 7. The device according to claim 2, wherein the take-out mechanism is configured to be horizontally rotatable from a component take-out position on the mounting table to a component transfer position on the inspection table. Parts supply equipment.