JP2011176078A - Electronic component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method that improves substrate productivity without making an electronic component mounting system large in size. <P>SOLUTION: In the electronic component mounting system, two electronic component mounting machines 2 equipped with two substrate transfer conveyors 13 arranged parallel are coupled to each other in a transfer direction in which substrates 3 are transferred by the substrate transfer conveyors 13, and the substrate transfer conveyors 13 that the electronic component mounting machines 2 have are connected in the transfer direction of the substrates 3 to form two transfer lanes 20, wherein a substrate 3 is positioned by one transfer lane 20 (substrate transfer lane 20a), and a component placing tray 21 on which an electronic component 5 is mounted is positioned by the other transfer lane 20 (component transfer land 20b), and the electronic component 5 mounted on the component placing tray 21 is picked up by a mounting head 16 that the electronic component mounting machine 2 has, and mounted on the substrate 3 positioned by the substrate transfer lane 20a. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting method by an electronic component mounting system in which a plurality of electronic component mounting machines including a plurality of substrate transfer conveyors arranged in parallel are connected in the substrate transfer direction by the substrate transfer conveyor. is there.

  The electronic component mounting system includes a plurality of electronic component mounting machines equipped with a substrate transport conveyor for carrying in, positioning and unloading a substrate, and a mounting head as a work device for mounting the electronic component on the substrate positioned by the substrate transport conveyor. It becomes the structure connected in the conveyance direction of the board | substrate by a board | substrate conveyance conveyor. In such an electronic component mounting system, the board transfer conveyors provided in each electronic component mounting machine are connected in the board transfer direction to form a transfer lane, while the board flows from the upstream side to the downstream side. Electronic components are sequentially mounted by the mounting head of each electronic component mounting machine.

  In some electronic component mounting systems, each electronic component mounting machine has two transport lanes by having two substrate transport conveyors. In such an electronic component mounting system provided with two transport lanes, electronic component mounting can be performed on two types of substrates simultaneously (for example, Patent Document 1).

JP 2003-204192 A

  However, in the above-described conventional electronic component mounting system, when the electronic component to be mounted on the board is relatively large or the electronic component to be mounted on the board requires prior assembly. These electronic components cannot be supplied from the component supply device provided in the electronic component mounting machine, and a dedicated supply device that can supply large-sized electronic components can be externally attached or electronic components can be assembled. A separate mounting system had to be prepared. For this reason, there has been a problem that the electronic component mounting system is enlarged and the substrate productivity is lowered.

  Therefore, an object of the present invention is to provide an electronic component mounting method capable of improving the board productivity without increasing the size of the electronic component mounting system.

  The electronic component mounting method according to claim 1, wherein a plurality of electronic component mountings including a plurality of substrate transfer conveyors arranged in parallel for carrying in, positioning and carrying out a substrate, and a work device for performing a required operation. Electronic component mounting in which a plurality of substrate transfer conveyors provided in each electronic component mounting machine are connected to the substrate transfer direction to form a plurality of transfer lanes. An electronic component mounting method according to a system, the step of positioning a substrate by a substrate transport lane composed of at least one of the plurality of transport lanes, and a component transport lane composed of at least one of the plurality of transport lanes The positioning of the component mounting member on which the electronic component is mounted and the work device provided in the electronic component mounting machine can The decided the component mount the electronic component mounted on the mounting member to pick up and a step of mounting a substrate which is positioned by the substrate transport lane.

  The electronic component mounting method according to claim 2 is the electronic component mounting method according to claim 1, wherein the electronic component mounting method is performed on the component mounting member positioned by the component transport lane by the work device provided in the electronic component mounting machine. A step of joining the second electronic component to the one electronic component to manufacture the electronic component.

  The electronic component mounting method according to claim 3 is the electronic component mounting method according to claim 2, wherein the electronic component manufactured on the component mounting member is configured by a working device provided in the electronic component mounting machine. A step of thermocompression bonding the first electronic component and the second electronic component on the component placing member.

  The electronic component mounting method according to claim 4 is the electronic component mounting method according to claim 1, wherein the electronic component mounted on the component mounting member is moved by the work device provided in the electronic component mounting machine. A step of inspecting on the component placement member.

  In the present invention, the substrate is positioned by the substrate conveyance lane composed of at least one of the plurality of conveyance lanes formed in the electronic component mounting system, while the component conveyance lane composed of at least one of the plurality of conveyance lanes. The component mounting member on which the electronic component is mounted is positioned by the work device, and the work device picks up the electronic component mounted on the component mounting member positioned by the component transport lane and mounts it on the substrate positioned by the substrate transport lane. It is supposed to be. For this reason, even when the electronic component to be mounted on the board is relatively large and cannot be supplied from the component supply device provided in the electronic component mounting machine, the electronic component is placed on the component placing member and the components are conveyed. By carrying it by the lane, the electronic component can be supplied without the need for a separate dedicated supply device. In addition, if the electronic device is manufactured by joining the second electronic component to the first electronic component on the component placement member positioned by the component conveyance lane by the working device, the electronic component to be mounted on the board However, even if prior assembly is required, it is not necessary to separately prepare an electronic component system for the prior assembly. Therefore, according to the present invention, substrate productivity can be improved without increasing the size of the electronic component mounting system.

The perspective view of the electronic component mounting system in one embodiment of this invention The perspective view of the electronic component mounting machine which comprises the electronic component mounting system in one embodiment of this invention The side view of the electronic component mounting machine which comprises the electronic component mounting system in one embodiment of this invention The top view of the electronic component mounting system in one embodiment of this invention The block diagram which shows the control system of the electronic component mounting machine which comprises the electronic component mounting system in one embodiment of this invention The figure explaining the process in which the upstream mounting machine which comprises the electronic component mounting system in one embodiment of this invention mounts a unit type electronic component on a board | substrate. (A) (b) A process in which an upstream mounting machine constituting the electronic component mounting system according to the embodiment of the present invention joins the second electronic component to the first electronic component to manufacture a bonded electronic component. Illustration to explain (A) (b) The figure explaining the process in which the downstream mounting machine which comprises the electronic component mounting system in one embodiment of this invention mounts a junction type electronic component on a board | substrate.

  Embodiments of the present invention will be described below with reference to the drawings. An electronic component mounting system 1 shown in FIG. 1 is formed by connecting a plurality of electronic component mounting machines 2 in the conveyance direction of the substrate 3 (the direction of arrow A shown in FIG. 1). In the present embodiment, the electronic component mounting system 1 is composed of two electronic component mounting machines 2, an upstream mounting machine 2 a and a downstream mounting machine 2 b, although not shown, on the upstream side of the upstream mounting machine 2 a Other electronic component mounting devices such as a screen printing machine that screen-prints paste such as solder on the substrate 3 are connected, and other electronic devices such as an appearance inspection machine and a reflow furnace are connected to the downstream side of the downstream mounting machine 2b. Assume that an electronic component mounting line including the electronic component mounting system 1 is configured by connecting component mounting apparatuses. Hereinafter, for convenience of explanation, the conveyance direction (direction of arrow A) of the substrate 3 in this electronic component mounting system 1 is the X axis direction, the horizontal plane direction orthogonal to the X axis direction is the Y axis direction, and the vertical direction is the Z axis direction. The Y-axis direction is the front-rear direction of the electronic component mounting machine 2, and the X-axis direction is the lateral direction of the electronic component mounting machine 2.

  1 and 2, each electronic component mounting machine 2 transports a substrate 3 carried in from the upstream side in the horizontal direction and applies an electronic component 5 (see FIGS. 2 and 2) to an electrode 4 provided on the surface of the substrate 3. 3).

  2 and 3, each electronic component mounting machine 2 (upstream mounting machine 2 a and downstream mounting machine 2 b) is parallel to the base 12 covered by the body cover 11 that forms the outer shell and the base 12. Are provided with two substrate transfer conveyors 13 as substrate positioning portions, a plurality of parts feeders (for example, tape feeders) 14 as component supply devices, and two mounting heads 16 as work devices for performing required work. ing. The two mounting heads 16 are moved relative to the substrate 3 positioned by the substrate transfer conveyor 13 by a head moving mechanism 17 including an XY robot attached to the base 12.

  The substrate transfer conveyor 13 extends in the X-axis direction so as to pass through the substrate carry-in port 11a (FIG. 1) and the substrate carry-out port (not shown) provided at positions facing the X-axis direction of the main body cover 11. The board 12 received from the other upstream electronic component mounting apparatus (screen printing machine or the like for the upstream mounting machine 2a, or upstream mounting machine 2a for the downstream mounting machine 2b) is carried into the base 12 Is positioned at the central work position (position shown in FIGS. 2 and 3), and then the substrate 3 is mounted on another electronic component mounting device on the downstream side (downstream mounting device 2b on the upstream mounting device 2a, downstream side). If it is the mounting machine 2b, it is carried out to an appearance inspection machine or the like.

  In FIG. 4, two board transfer conveyors 13 provided in each electronic component mounting machine 2 (upstream side mounting machine 2 a and downstream side mounting machine 2 b) are connected to the transfer direction (X-axis direction) of the board 3, and two transfer lanes are provided. 20 is formed (FIG. 4), one of these two transport lanes 20 is a substrate transport lane 20a that only transports the substrate 3, and the other is a component placement space 21a on the upper surface (see FIGS. 1 and 4). It is a component transport lane 20b that only transports the component placing tray 21 as a component placing member having a.

  2 and 3, the plurality of parts feeders 14 are mounted side by side in the X-axis direction on both end regions of the base 12 that face each other in the front-rear direction (Y-axis direction) with the two substrate conveyors 13 interposed therebetween. The single-type electronic component 5 (hereinafter referred to as single-type electronic component 5A) that is directly attached to the substrate 3 in the component supply port 14a provided at the end portion of the base 12 on the center side (board conveyor conveyer 13 side). Continuously). The plurality of parts feeders 14 are held by a carriage Cg that can be moved on the floor surface by an operator OP (FIG. 4) operating a pair of handle portions H. The operator OP uses the carriage Cg as a base 12. By coupling to the plurality of parts feeders 14, a plurality of parts feeders 14 can be collectively mounted on the base 12. In the present embodiment, the upstream side mounting machine 2a and the downstream side mounting machine 2b are only from the part feeders 14 on the side close to the substrate transport lane 20a among the plurality of parts feeders 14 provided on both the front and rear sides of the base 12. It is assumed that the single electronic component 5A is supplied, and the single electronic component 5A is not supplied from the parts feeder 14 on the side close to the component conveyance lane 20b.

  1 and 4, a plurality of first electronic components 5s and a plurality of second electronic components 5t are mounted on the component mounting space 21a of the component mounting tray 21. The first electronic component The second electronic component 5t is bonded to the upper surface of 5s to manufacture a bonded electronic component 5 (hereinafter referred to as a bonded electronic component 5B). It is assumed that the joining type electronic component 5B is relatively large and cannot be supplied by the parts feeder 14.

  2 and 3, the head moving mechanism 17 is movable in the Y-axis direction on a beam-like Y-axis table 17a and Y-axis table 17a provided extending in the Y-axis direction so as to straddle the substrate transport conveyor 13. A beam-shaped X-axis table 17b provided in the X-axis direction and a plate-shaped moving stage 17c provided on the X-axis table 17b so as to be movable in the X-axis direction. The mounting head 16 is attached to each moving stage 17c, and includes a plurality of suction nozzles 16a extending downward and rotatable up and down and up and down (Z axis).

  2 and 3, each of the two moving stages 17 c included in the head moving mechanism 17 is provided with a substrate camera 18 whose imaging field of view is directed downward, and two substrate transfer conveyors 13 on the base 12. A component camera 19 with the imaging field of view facing upward is provided in both regions sandwiching the.

  The substrate conveyance conveyor 13 conveys and positions the substrate 3 by a substrate conveyance conveyer drive unit 31 (see FIG. 5), in which the work execution control unit 30a (FIG. 5) of the control device 30 provided in the electronic component mounting machine 2 includes an actuator (not shown). The operation of supplying the electronic component 5 (single electronic component 5A) to the component supply port 14a by each of the parts feeders 14 is performed by performing the operation control of 5), and the work execution control unit 30a of the control device 30 is an actuator (not shown). This is done by controlling the operation of the parts feeder drive unit 32 (FIG. 5). Each parts feeder 14 is electrically connected to the control device 30 in a state where the carriage Cg is coupled to the base 12, and the operation control of each parts feeder 14 by the control device 30 is possible.

  The movement operation of each mounting head 16 in the horizontal plane by the head movement mechanism 17 is performed by the operation control (Y axis) of the head movement mechanism drive unit 33 (FIG. 5) including an actuator (not shown) by the work execution control unit 30a of the control device 30. The movement control of the X-axis table 17b with respect to the table 17a in the Y-axis direction and the movement control of the movement stage 17c with respect to the X-axis table 17b in the X-axis direction) are performed. The vertical movement and the rotation around the vertical axis are performed by the work execution control unit 30a of the control device 30 controlling the operation of the nozzle drive unit 34 (FIG. 5) including an actuator (not shown). Further, the suction and detachment operations of the electronic components 5 (single electronic components 5A and bonded electronic components 5B) by the respective suction nozzles 16a are performed by a vacuum pressure supply unit in which the work execution control unit 30a of the control device 30 includes an actuator (not shown). 35 (FIG. 5) is controlled to supply the vacuum pressure into the suction nozzle 16a and release the supply of the vacuum pressure.

  The imaging operation by the substrate camera 18 and the component camera 19 is performed by the work execution control unit 30a of the control device 30 performing operation control of the substrate camera 18 and the component camera 19 (FIG. 5). Image data obtained by the imaging operations of the board camera 18 and the component camera 19 is captured and stored in the storage unit 36 (FIG. 5), and the image is recognized by the image recognition unit 30 b (FIG. 5) provided in the control device 30.

  Each control device 30 of the upstream side mounting machine 2a and the downstream side mounting machine 2b is a device for mounting other electronic components on the upstream side (upstream mounting machine 2a is a screen printing machine, and downstream side mounting machine 2b is upstream. After the substrate 3 carried out from the side mounting machine 2a) is received and positioned by the substrate transport conveyor 13 in the substrate transport lane 20a, the operation of the head moving mechanism drive unit 33 is controlled to position the substrate camera 18 above the substrate 3 ( The mounting head 16 is moved to image a misregistration detection mark (not shown) provided on the substrate 3. Then, by causing the image recognition unit 30b to recognize the obtained image, a displacement of the substrate 3 from the normal work position is obtained (substrate positioning step).

  1, 2, and 4, the control device 30 starts from the upstream side (operator OP for the upstream mounting machine 2 a and upstream mounting for the downstream mounting machine 2 b. After receiving and positioning the loaded component mounting tray 21 by the substrate transport conveyor 13 in the component transport lane 20b (from the machine 2a), the operation of the head moving mechanism driving unit 33 is controlled to perform the component control. The substrate camera 18 (the mounting head 16) is moved above the mounting tray 21 to image a misregistration detection mark (not shown) provided on the component mounting tray 21. Then, by causing the image recognition unit 30b to recognize the obtained image, the positional deviation of the component placing tray 21 from the normal work position is obtained.

  The control device 30 of the upstream mounting machine 2a operates the mounting head 16 on the board transfer lane 20a side after positioning the board 3 on the board transfer lane 20a and positioning the component placing tray 21 on the component transfer lane 20b. Thus, the single electronic component mounting process for mounting the electronic component 5 (single electronic component 5A) supplied from the parts feeder 14 on the substrate transport lane 20a side to the substrate 3 is repeatedly executed, and the electronic component 5 on the component transport lane 20b side is also executed. The mounting head 16 is operated to repeatedly perform a bonded electronic component manufacturing process for manufacturing the bonded electronic component 5B by bonding the second electronic component 5t to the first electronic component 5s on the component mounting tray 21. To do.

  Here, in the above-described single electronic component mounting step, the control device 30 of the upstream mounting machine 2a controls the operation of the head moving mechanism driving unit 33, moves the mounting head 16 above the parts feeder 14, and sucks it. The nozzle 16a is moved up and down with respect to the mounting head 16, and a vacuum pressure is supplied into the suction nozzle 16a to cause the suction nozzle 16a to suck the single electronic component 5A supplied to the component supply port 14a of the parts feeder 14. After picking up the single electronic component 5A, the single electronic component 5A passes above the component camera 19 while moving the mounting head 16 to the substrate 3 side. The electronic component 5A is imaged, and the obtained image is recognized by the image recognition unit 30b, whereby the single-type electronic component 5A is captured. After performing the image recognition process for inspecting the presence or absence of abnormality of the component 5A and obtaining the positional deviation (suction deviation) of the single-type electronic component 5A with respect to the suction nozzle 16a and the image recognition of the single-type electronic component 5A, This includes a joining step in which the mounting head 16 is moved to bring the single electronic component 5A into contact with the electrode 4 of the substrate 3 and join them (see arrow C shown in FIG. 6). In the joining step in the single electronic component mounting step, the adsorption to the substrate 3 is corrected so that the positional deviation of the substrate 3 obtained in the substrate positioning step and the adsorption deviation of the single electronic component 5A obtained in the image recognition step are corrected. The position of the nozzle 16a is corrected (including rotation correction).

  In addition, in the above-described bonded electronic component manufacturing process, the control device 30 of the upstream mounting machine 2a controls the operation of the head moving mechanism driving unit 33 and is positioned by the substrate transfer conveyor 13 in the component transfer lane 20b. The mounting head 16 is moved above the mounting plate 21, the suction nozzle 16a is moved up and down relative to the mounting head 16, and a vacuum pressure is supplied into the suction nozzle 16a, whereby the second electronic component 5t is supplied to the suction nozzle 16a. And picking up and picking up the second electronic component 5t, and then picking up the second electronic component 5t so that the second electronic component 5t passes above the component camera 19 while moving the mounting head 16 to the substrate 3 side. By imaging the second electronic component 5t with the component camera 19, and causing the image recognition unit 30b to recognize the obtained image. After performing an image recognition process for inspecting whether there is an abnormality in the second electronic component 5t and obtaining a positional shift (suction shift) of the second electronic component 5t with respect to the suction nozzle 16a, and performing image recognition of the second electronic component 5t. The joining head 16 is moved above the first electronic component 5s, and the second electronic component 5t is brought into contact with the first electronic component 5s to join them (arrows shown in FIG. 7A). D). In the joining step in this joining type electronic component manufacturing process, the positional deviation of the component placing plate 21 obtained in the component placing plate positioning step and the suction displacement of the second electronic component 5t obtained in the image recognition step are corrected. As described above, the position correction (including rotation correction) of the suction nozzle 16a with respect to the component placing tray 21 (that is, with respect to the first electronic component 5s) is performed.

  The upstream side mounting machine 2a repeatedly mounts the single electronic component 5A to be mounted on the substrate 3 by repeatedly executing the single electronic component mounting step, and repeatedly executes the bonding electronic component manufacturing process. When all the junction type electronic components 5B to be manufactured are manufactured by (FIG. 7B), the substrate 3 is transported by the substrate transport conveyor 13 in the substrate transport lane 20a, and the component placing tray 21 is transported by the substrate in the component transport lane 20b. Each of the conveyors 13 carries out to the downstream mounting machine 2b, and the next substrate 3 and the component mounting tray 21 are carried in so as to newly mount the unit-type electronic component 5A on the substrate 3 and manufacture the joining-side electronic component 5B. I do.

  On the other hand, the control device 30 of the downstream mounting machine 2b is carried out of the board positioning step of positioning the board 3 carried out from the upstream mounting machine 2a by the board carrying conveyor 13 in the board carrying lane 20a and carried out from the upstream mounting machine 2a. When the component placing tray positioning step for positioning the component placing tray 21 on the component transport lane 20b by the substrate transport conveyor 13 is performed, the mounting head 16 on the substrate transport lane 20a side is operated, and the parts on the substrate transport lane 20a side are operated. A single electronic component mounting process similar to the single electronic component mounting process described above for mounting the electronic component 5 (single electronic component 5A) supplied from the feeder 14 on the substrate 3 is repeatedly executed, and the component transport lane 20b side The mounting head 16 is actuated to assemble the upstream mounting machine 2a and place it on the component placing tray 21. Type electronic component 5B, repeat the junction type electronic component mounting step of mounting a substrate 3 which is positioned by the substrate conveyor 13 of the substrate transport lane 20a side.

  Here, in the bonding type electronic component mounting step described above, the control device 30 of the downstream mounting machine 2b controls the operation of the head moving mechanism driving unit 33, and is positioned by the substrate transfer conveyor 13 in the component transfer lane 20b. The mounting head 16 is moved above the mounting tray 21, the suction nozzle 16a is moved up and down relative to the mounting head 16, and a vacuum pressure is supplied into the suction nozzle 16a. A pick-up process for picking up and picking up the bonding type electronic component 5B, and then picking up the bonding type electronic component 5B, and then moving the mounting head 16 to the substrate 3 side so that the bonding type electronic component 5B passes over the component camera 19 19, the bonded electronic component 5B is imaged, and the obtained image is recognized by the image recognition unit 30b. After performing the inspection for the presence or absence of abnormality of the junction type electronic component 5B and the image recognition step for obtaining the positional deviation (suction deviation) of the junction type electronic component 5B with respect to the suction nozzle 16a, the image recognition of the junction type electronic component 5B is performed. 3 includes a joining step of moving the mounting head 16 above 3 to bring the joining-type electronic component 5B into contact with the electrode 4 of the substrate 3 and joining them (see arrow E shown in FIG. 8A). In the bonding step in the bonding type electronic component mounting step, the position difference of the substrate 3 obtained in the substrate positioning step and the adsorption difference of the bonding type electronic component 5B obtained in the image recognition step are corrected. The position of the nozzle 16a is corrected (including rotation correction).

  The downstream mounting machine 2b repeatedly mounts the single electronic component 5A to be mounted on the substrate 3 by repeatedly executing the single electronic component mounting step, and repeatedly executes the bonding electronic component mounting step. When all the junction type electronic components 5B to be mounted on the substrate 3 are mounted on the substrate 3 (FIG. 8B), the substrate 3 is mounted on the substrate transfer conveyor 13 in the substrate transfer lane 20a, and the component placing tray 21 is mounted on the component. It is carried out to the other electronic component mounting apparatuses (for example, appearance inspection machines) on the downstream side by the substrate transfer conveyor 13 in the transfer lane 20b, and the single-type electronic component 5A and the junction type electronic component 5B are newly mounted on the substrate 3. In order to carry out, the next board | substrate 3 and the component mounting tray 21 are carried in.

  As described above, in the electronic component mounting method according to the electronic component mounting system 1 in the present embodiment, the step of positioning the substrate 3 by the substrate transfer lane 20a including one of the two transfer lanes 20 (substrate positioning step). And a step of positioning the component mounting tray 21 on which the electronic component 5 (bonded electronic component 5B) is mounted by the component transport lane 20b formed of the other of the two transport lanes 20 (component mounting tray positioning step). Then, by using the mounting head 16 provided in the downstream mounting machine 2b, which is one of the two electronic component mounting machines 2, the joining type electronic component 5B mounted on the component mounting tray 21 positioned by the component transport lane 20b is picked up. Electronic component mounting system including a step (bonding type electronic component mounting step) for mounting on the substrate 3 positioned by the substrate transfer lane 20a The substrate 3 is positioned by a substrate transport lane 20a composed of at least one of the plurality of transport lanes 20 formed on the electronic component, and an electronic component is constructed by a component transport lane 20b composed of at least one of the plurality of transport lanes 20. The component mounting tray 21 as the component mounting member 5 is positioned, and the mounting head 16 as the working device picks up the electronic component 5 mounted on the component mounting tray 21 and mounts it on the substrate 3. It is supposed to be.

  For this reason, even when the electronic component 5 to be mounted on the substrate 3 (joint type electronic component 5B) is relatively large and cannot be supplied from the parts feeder 14 included in the electronic component mounting machine 2, the electronic component 5 is By mounting on the component mounting tray 21 and transporting it by the component transport lane 20b, the electronic component 5 (joint type electronic component 5B) can be supplied without requiring a separate dedicated supply device.

  Further, as shown in the present embodiment, the second electronic component 5s is placed on the first electronic component 5s on the component placing tray 21 positioned by the component transport lane 20b by the mounting head 16 provided in the upstream mounting machine 2a. The electronic component 5 (bonded electronic component 5B) to be mounted on the substrate 3 is included by including a step (bonded electronic component manufacturing step) for manufacturing the electronic component 5 (bonded electronic component 5B) by bonding the component 5t. ) Requires prior assembly, it is not necessary to prepare a separate electronic component system for the previous assembly. Therefore, according to the electronic component mounting method in the embodiment of the present invention, the substrate productivity can be improved without increasing the size of the electronic component mounting system 1.

  In addition, in the electronic component mounting method by the electronic component mounting system 1 in the present embodiment, the electronic component 5 (joint type electron) on the component mounting tray 21 is utilized using the component mounting tray 21 transported by the component transport lane 20b. Various operations can be performed on the component 5B). For example, after installing the intermediate electronic component mounting machine 2 between the upstream mounting machine 2a and the downstream mounting machine 2b, the component mounting is performed by a crimping tool (not shown) provided in the intermediate electronic component mounting machine 2. A step (thermocompression step) of thermocompression bonding the first electronic component 5s and the second electronic component 5t constituting the joining type electronic component 5B manufactured by the mounting plate 21 on the component mounting plate 21; The electronic component 5 (junction type electronic component 5B or the like) placed on the component placing plate 21 is placed on the component placing plate 21 by an inspection camera (not shown) provided in the intermediate electronic component mounting machine 2. A process to be inspected (appearance inspection process) can be executed.

  Further, in the above-described embodiment, the two electronic component mounting machines 2 having the two substrate transport conveyors 13 arranged in parallel for carrying in, positioning and unloading the substrate 3 are mounted on the substrate 3 by the substrate transport conveyor 13. The electronic component mounting system 1 is configured by being connected in the transport direction, and the two substrate transport conveyors 13 included in each electronic component mounter 2 are connected in the transport direction of the substrate 3 to form two transport lanes 20. However, the number of substrate transport conveyors 13 provided in each electronic component mounting machine 2 is not limited to two, and may be three or more. In this case, three or more transfer lanes 20 are formed, but the substrate transfer lane 20a may be composed of at least one of the plurality of transfer lanes 20, and the component transfer lane 20b is also the plurality of transfer lanes. It should just consist of at least one of 20. The number of electronic component mounting machines 2 is not limited to two, and may be three or more.

  Provided is an electronic component mounting method capable of improving substrate productivity without increasing the size of an electronic component mounting system.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting system 2 Electronic component mounting machine 3 Substrate 5 Electronic component 13 Substrate conveyance conveyor 16 Mounting head (working device)
20 Transport lane 20a Substrate transport lane 20b Component transport lane 21 Component mounting tray (component mounting member)

Claims (4)

A plurality of electronic component mounting machines having a plurality of substrate conveyors arranged in parallel for carrying in, positioning and carrying out the substrate and a work device for performing a required operation are arranged in the substrate conveyance direction by the substrate conveyor. An electronic component mounting method by an electronic component mounting system, in which a plurality of substrate transfer conveyors included in each electronic component mounting machine are connected in the substrate transfer direction to form a plurality of transfer lanes,
Positioning the substrate by a substrate transport lane comprising at least one of the plurality of transport lanes;
Positioning a component placing member on which an electronic component is placed by a component carrying lane comprising at least one of the plurality of carrying lanes;
And a step of picking up the electronic component placed on the component placement member positioned by the component transport lane and mounting it on the substrate positioned by the substrate transport lane by a working device provided in the electronic component mounter. Electronic component mounting method.   And a step of manufacturing the electronic component by joining the second electronic component to the first electronic component on the component mounting member positioned by the component transport lane by the working device provided in the electronic component mounting machine. The electronic component mounting method according to claim 1.   Including a step of thermocompression-bonding the first electronic component and the second electronic component constituting the electronic component manufactured on the component mounting member on the component mounting member by a working device provided in the electronic component mounting machine. The electronic component mounting method according to claim 2.   The electronic component mounting method according to claim 1, further comprising a step of inspecting the electronic component placed on the component placing member on the component placing member by a working device provided in the electronic component mounting machine. .

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