CN103379819A - Component installation method and component installation device - Google Patents
Component installation method and component installation device Download PDFInfo
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- CN103379819A CN103379819A CN 201310149277 CN201310149277A CN103379819A CN 103379819 A CN103379819 A CN 103379819A CN 201310149277 CN201310149277 CN 201310149277 CN 201310149277 A CN201310149277 A CN 201310149277A CN 103379819 A CN103379819 A CN 103379819A
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- adsorption mouth
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Abstract
The object of the invention is to provide a component installation method and a component installation device, capable of preventing increasing the size of an installation head with a nozzle and pressing components requiring higher pressure into a substrate. After a component (3) is attached to one of absorption nozzles (17), namely a first absorption nozzle (17a), of an installation head (15), and a plurality of insertion pins (3a) of the component (3) are situated above a plurality of insertion holes (2a) of a substrate (2), the component (3) is pressed into the substrate (2) in such a manner that the first absorption nozzle (17a) cooperates with a second absorption nozzle (17b) different from the first absorption nozzle (17a) among the absorption nozzles (17) to lower the first absorption nozzle (17a) and the second absorption nozzle (17b) and to press the insertion pins (3a) of the component (3) into the insertion holes (2a) of the substrate (2).
Description
Technical field
The present invention relates to make the part that possesses a plurality of insertion pins that extend downwards to be pressed into a plurality of pin insertion holes that are arranged at substrate and to carry out part to part mounting method and the apparatus for mounting part of the installation of substrate.
Background technology
At present, as making the part that possesses a plurality of insertion pins that extend downwards be pressed into a plurality of pin insertion holes that are arranged at substrate and carry out part to the apparatus for mounting part of the installation of substrate, known have by chuck clamping part, carry out after the contraposition inserting pin and pin insertion hole, the device (for example, patent documentation 1) of the type that part is pressed to substrate-side.In such apparatus for mounting part, under the state that part is fixedly secured by the chuck clamping, can insert substrate, therefore, only press a part to substrate-side and just part can be fixedly mounted on the substrate.
On the other hand, in recent years, from generalization of apparatus for mounting part etc., using according to by the adsorption mouth adsorbent parts that possesses on the mounting head and apparatus for mounting part (apparatus for mounting part of so-called surface installing type) that the mode that this absorption has the portion of terminal of part to be stated to be arranged on the electrode on the substrate is carried out the installation of part, the part of above-mentioned pin insert type is being installed on substrate.
Patent documentation 1: Japanese kokai publication hei 4-354198 communique
But, the part that the apparatus for mounting part of stating in the use existing surface installing type will be sold insert type is pressed in the situation of (being installed on) substrate, need to make and adsorb the pin insertion hole that the adsorption mouth that part is arranged descends and the insertion pin of part side is pressed into substrate-side, therefore, need required pressing force (part being pressed on the power of substrate) in adsorption mouth.Particularly, the in recent years maximization of part is progressively accelerated, and at present, will not be that the situation that the part that is pressed into the high pressing force of the needs of object is pressed into substrate increases.Therefore, adsorption mouth need to be higher than present pressing force, if merely want to increase the pressing force of adsorption mouth, then has the problem points of the mounting head maximization that possesses adsorption mouth.
Summary of the invention
So the object of the invention is to provide a kind of and can make the mounting head maximization that possesses adsorption mouth and can make the part that needs high pressing force be pressed into part mounting method and the apparatus for mounting part of substrate.
First aspect provides a kind of part mounting method, make the part that possesses a plurality of insertion pins that extend downwards be pressed into a plurality of pin insertion holes that are arranged at substrate, thereby carry out described part to the installation of described substrate, wherein, comprise: the contraposition operation, make described part be adsorbed in a plurality of adsorption mouth that mounting head possesses one i.e. the first adsorption mouth, and make described a plurality of insertion pins of this part be positioned at the top of a plurality of pin insertion holes that are arranged at described substrate; Be pressed into operation, described part is pressed on the mode of described substrate with the second adsorption mouth cooperations different from described the first adsorption mouth in described the first adsorption mouth and the described a plurality of adsorption mouth, these first adsorption mouth and the second adsorption mouth are descended, and a plurality of insertion pins that described part possesses are pressed into a plurality of pin insertion holes that are arranged at described substrate.
The part mounting method of second aspect is on the basis of first aspect, and wherein, described the second adsorption mouth is in the adsorption mouth across the position of described the first adsorption mouth adjacency.
The part mounting method of the third aspect first or the basis of second aspect on, wherein, be pressed in the operation described, make described the first adsorption mouth from the state that makes described a plurality of insertion pin be positioned at the top of described a plurality of pin insertion holes descend until described each lower end of inserting pin with after corresponding described pin insertion hole contacts, described the second adsorption mouth is descended until the lower end of described the second adsorption mouth contacts with described part, then, described the first adsorption mouth and described the second adsorption mouth are descended simultaneously, described part is pressed into described substrate.
Fourth aspect provides a kind of apparatus for mounting part, possesses: substrate orientation section, and it carries out the location of substrate; Mounting head, it moves freely with respect to the substrate by described substrate orientation section location and arranges; Control device, it is by carrying out the action control of described mounting head, make the part that possesses a plurality of insertion pins that extend downwards be pressed into a plurality of pin insertion holes that are arranged at described substrate, thereby carry out described part to the installation of described substrate, wherein, described control device makes described part be adsorbed in a plurality of adsorption mouth that described mounting head possesses one i.e. the first adsorption mouth, and described a plurality of insertion pins of this part are positioned at after the top of a plurality of pin insertion holes that are arranged at described substrate, described part is pressed on the mode of described substrate with the second adsorption mouth cooperations different from described the first adsorption mouth in described the first adsorption mouth and the described a plurality of adsorption mouth, these first adsorption mouth and the second adsorption mouth are descended, and a plurality of insertion pins that described part possesses are pressed into a plurality of pin insertion holes that are arranged at described substrate.
The apparatus for mounting part of the 5th aspect is on the basis of fourth aspect, and wherein, described the second adsorption mouth is in the adsorption mouth across the position of described the first adsorption mouth adjacency.
The apparatus for mounting part of the 6th aspect is on the basis aspect the 4th or the 5th, wherein, described control device make described the first adsorption mouth from the state that makes described a plurality of insertion pin be positioned at the top of described a plurality of pin insertion holes descend until described each lower end of inserting pin with after corresponding described pin insertion hole contacts, described the second adsorption mouth is descended until the lower end of described the second adsorption mouth contacts with described part, then, described the first adsorption mouth and described the second adsorption mouth are descended simultaneously, described part is pressed into described substrate.
The apparatus for mounting part of the 7th aspect wherein, is provided with in the lower end of described the second adsorption mouth along the pad parts that extend with the direction of the lifting direction quadrature of described the second adsorption mouth on the basis aspect the 4th～the 6th.
In the present invention, after making the insertion pin of part side be positioned at the top of pin insertion hole of substrate-side, absorption has the first adsorption mouth of part and the second adsorption mouth cooperation different from the first adsorption mouth that part is pressed on substrate, thus, because the pressing by the second adsorption mouth of part based on the first adsorption mouth assisted, therefore, even be inserted into fully in the situation of pin insertion hole as only insertion not being sold by the first adsorption mouth, also can be inserted into fully pin insertion hole with inserting pin, the mounting head that possesses adsorption mouth is maximized (can not increase the pressing force of adsorption mouth), and the part of pressing force that can needs are high is pressed into (installation) in substrate.
Description of drawings
Fig. 1 is the major part stereogram of the apparatus for mounting part of an embodiment of the present invention;
Fig. 2 is the front elevation of the mounting head that possesses of the apparatus for mounting part of an embodiment of the present invention;
Fig. 3 is the substrate of an embodiment of the present invention and the stereogram of part;
Fig. 4 is the piece figure of control system of the apparatus for mounting part of expression an embodiment of the present invention;
Fig. 5 is the flow chart of the part installation exercise carried out of the apparatus for mounting part of an embodiment of the present invention;
Fig. 6 (a)～(d) is the figure that the apparatus for mounting part of an embodiment of the present invention is installed erection sequence from part to substrate is described;
Fig. 7 (a) and (b) are the figure that apparatus for mounting part is installed on part the state of substrate that pass through of expression an embodiment of the present invention.
Symbol description
1 apparatus for mounting part
2 substrates
The 2a pin insertion hole
3 parts
3a inserts pin
12 substrate conveyer belts (substrate orientation section)
15 mounting heads
17 adsorption mouth
17a the first adsorption mouth
17b the second adsorption mouth
30 control device (control unit)
Pd pad parts
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described.Apparatus for mounting part shown in Figure 11 is carried moving into and location action of the substrate 2 of coming for repeatedly carrying out by the device of illustrated upstream process side (for example solder printing machine or other apparatus for mounting part) never, part (electronic component) 3 is to the installation action of the substrate 2 of location and to the device of the lower procedure side of the substrate 2 that part 3 is installed (for example other apparatus for mounting part or inspection machine, the apparatus for mounting part of the surface installing type of a series of part installation procedures of taking out of action composition reflow ovens etc.).Below, for convenience of explanation, the throughput direction of substrate 2 is made as X-direction (left and right directions of seeing from operating personnel OP), will be made as Y direction (fore-and-aft direction of seeing from operating personnel OP) with direction in the horizontal plane of X-direction quadrature.In addition, above-below direction is made as Z-direction.
Among Fig. 1, apparatus for mounting part 1 has the substrate conveyer belt 12 that extends setting along X-direction at the central portion of base station 11.This substrate conveyer belt 12 receives the substrate 2 that transports from the device of upstream process side and carries (arrow A shown in Fig. 1) to X-direction, becomes the substrate orientation section of the job position that substrate 2 is positioned to stipulate.
End in the Y direction of base station 11 is provided with the component delivery pallet 13 of taking in a plurality of parts 3.This component delivery pallet 13 becomes the component delivery section of the supply of carrying out part 3.
Be provided with head moving mechanism 14 at base station 11.Head moving mechanism 14 by the Y-axis workbench 14a that extends to Y direction, under the state that extends to X-direction along Y-axis workbench 14a(namely to Y direction) mobile freely X-axis workbench 14b and consist of along the mobile moving stage 14c freely of X-axis workbench 14b upper (namely to X-direction).At moving stage 14c mounting head 15 is installed, head moving mechanism 14 carries out X-axis workbench 14b with respect to Y-axis workbench 14a to the shift action of Y direction and moving stage 14c with respect to the action of X-axis workbench 14b to the shift action combination of X-direction, thus, make mounting head 15 mobile in horizontal plane.That is, mounting head 15 becomes with respect to the substrate 2 by substrate conveyer belt 12 location and moves consisting of of arranging freely.
And for example shown in Figure 2, be provided with a plurality of (being 3 herein) spindle unit 16 downwards with on mounting head 15, extending, in the dismounting of the lower end of each spindle unit 16 adsorption mouth 17 for adsorbent parts 3 is installed freely.Each spindle unit 16 is arranged at axle driving mechanism 18 drivings of mounting head 15 and carries out with respect to the knee-action of mounting head 15 with around the up and down spinning movement of central shaft (Z axis).
Among Fig. 1, mounting head 15 be equipped with the shooting visual field towards below substrate video camera 20(again with reference to Fig. 2), the substrate conveyer belt 12 on the base station 11 and the region division between the component delivery pallet 13 have with the shooting visual field towards above part video camera 21.
Among Fig. 3, part 3 is made of the pin insert type part that has from the following a plurality of insertion pin 3a that extend downwards, on substrate 2, is provided with accordingly a plurality of pin insertion hole 2a that insertion pin 3a that this part 3 possesses inserts with each part 3.If part 3 from make each insert pin 3a be positioned at corresponding substrate 2 pin insertion hole 2a the top state, be pressed with respect to substrate 2, then each inserts pin 3a and is pressed into corresponding pin insertion hole 2a, and becomes the state that is installed on substrate 2.
Among Fig. 4, the knee-action of the shift action of the mounting head 15 of the conveying of the substrate 2 of substrate conveyer belt 12 and location action, head moving mechanism 14, each spindle unit 16 of axle driving mechanism 18 reaches around control of up and down each action of the spinning movement of central shaft (Z axis) and is undertaken by the control device 30 that apparatus for mounting part 1 possesses.In addition, undertaken by the action control that is arranged on the adsorbing mechanism 31 that not shown actuator in the mounting head 15 etc. consists of by 30 pairs of control device via the absorption action of the adsorption mouth 17 of each spindle unit 16.
In addition, in Fig. 4, control device 30 controls that the shooting action control of substrate video camera 20 and the shooting action control of part video camera 21 are possessed by apparatus for mounting part 1, the view data that the view data that the shooting action by substrate video camera 20 obtains and the shooting action by part video camera 21 obtain be sent to control device 30 and in the 30a of image recognition section of control device 30 by image recognition.
Then, the flow chart of use Fig. 5 describes the execution sequence of the part installation exercise (part mounting method) of control device 30 execution.
After control device 30 makes part 3 be adsorbed in the first adsorption mouth 17a, mounting head 15 is moved and make a video recording from the below to part 3 by part video camera 21 in the part 3 of this absorption mode by the top of part video camera 21, each inserts the position (step ST4) of pin 3a based on the image detection part 3 that obtains possesses.
After control device 30 detects the position of each pin insertion hole 2a of substrate 2, position based on detected pin insertion hole 2a among the position of detected insertion pin 3a among the step ST4 and the step ST5, the mode that is positioned at the top of corresponding pin insertion hole 2a according to each insertion pin 3a moves mounting head 15, carries out contraposition (step ST6 with respect to 2 pairs of parts of substrate 3.Fig. 2).
As described above, in the apparatus for mounting part 1 of present embodiment, by mounting head 15 is carried out action control, as the part 3 that will possess downwards a plurality of insertion pin 3a that extend be pressed into a plurality of pin insertion hole 2a that are arranged at substrate 2 and part 3 is installed on substrate 2 control unit control device 30 make part 3 be adsorbed in a plurality of adsorption mouth 17 that mounting head 15 possesses one namely the first adsorption mouth 17a and a plurality of pin insertion hole 2a of a plurality of insertion pin 3a of this part 3 being positioned at be arranged at substrate 2 above after, cooperate part 3 by the mode that is pressed on the substrate 2 with the second different from the first adsorption mouth 17a in the first adsorption mouth 17a and a plurality of adsorption mouth 17 adsorption mouth 17b, these the first adsorption mouth 17a and the second adsorption mouth 17b are descended, be pressed into a plurality of pin insertion hole 2a that are arranged at substrate 2 with a plurality of insertion pin 3a that part 3 is possessed.
In addition, the part mounting method of this apparatus for mounting part 1 is following method, the part 3 that will possess downwards a plurality of insertion pin 3a that extend is pressed into a plurality of pin insertion hole 2a of being arranged at substrate 2 and part 3 is installed on substrate 2, comprise: the contraposition operation makes part 3 be adsorbed in a plurality of adsorption mouth 17 that mounting head 15 possesses one i.e. the first adsorption mouth 17a and make a plurality of insertion pin 3a of this part 3 be positioned at the top (step ST6) of a plurality of pin insertion hole 2a that are arranged at substrate 2; Be pressed into operation, part 3 is pressed on the mode of substrate 2 with the second adsorption mouth 17b cooperations different from the first adsorption mouth 17a in the first adsorption mouth 17a and a plurality of adsorption mouth 17, these the first adsorption mouth 17a and the second adsorption mouth 17b are descended, and a plurality of insertion pin 3a that part 3 is possessed are pressed into a plurality of pin insertion hole 2a(step ST7 of being arranged at substrate 2～step ST9).
Then, above-mentionedly be pressed into operation specifically, make the first adsorption mouth 17a from the state that makes a plurality of insertion pin 3a be positioned at the top of a plurality of pin insertion hole 2a descend until each lower end of inserting pin 3a with after corresponding pin insertion hole 2a contacts, the second adsorption mouth 17b is descended until the lower end of the second adsorption mouth 17b contacts with part 3, then, make the first adsorption mouth 17a and the second adsorption mouth 17b descend simultaneously part 3 to be pressed on substrate 2(step ST9).
Like this, at the apparatus for mounting part 1(of present embodiment part mounting method) in, because pressing by the second adsorption mouth 17b of the part 3 that the first adsorption mouth 17a carries out is auxiliary, therefore, even fully be inserted in the situation of pin insertion hole 2a as only not making insertion sell 3a by the first adsorption mouth 17a, also can make insertion pin 3a insert fully pin insertion hole 2a, the mounting head 15 that possesses adsorption mouth 17 is maximized (pressing force of adsorption mouth 17 is increased), and can make needs the part 3 of high pressing force to be pressed into (installation) substrate 2.
In addition, variation as above-mentioned execution mode, shown in Fig. 7 (a) and (b), also can arrange in the lower end of the second adsorption mouth 17b along with the pad parts Pd of direction (the being direction horizontal plane in) extension of lifting direction (above-below direction) quadrature of the second adsorption mouth 17b.Thus, except part 3 stably can being pressed downwards (Fig. 7 (a)), the dimension in cross-direction (size of the orientation of adsorption mouth 17) of part 3 with respect to the relatively little situation in the interval between the adsorption mouth 17 under, also can press part 3 by the second adsorption mouth 17b.
In addition, in the above-described embodiment, the adsorption mouth 17 that mounting head 15 possesses is three, but adsorption mouth 17 possesses first an adsorption mouth 17a of adsorbent parts 3 and assists the first adsorption mouth 17a that at least one second adsorption mouth 17b that presses of part 3 is got final product.If adsorption mouth 17 is more than three, then shown in above-mentioned execution mode, become in the adsorption mouth 17 across the position adjacency of the first adsorption mouth 17a by making the second adsorption mouth 17b, can balancedly part 3 be pressed on substrate 2, therefore particularly preferably.In addition, the second adsorption mouth 17b also can be more than three, thus, the part 3 of large molded dimension stably can be installed on substrate 2.
Utilizability on the industry
Providing a kind of can not make the mounting head maximization that possesses adsorption mouth and can make the part that needs high pressing force be pressed into part mounting method and the apparatus for mounting part of substrate.
Claims (7)
1. a part mounting method makes the part that possesses a plurality of insertion pins that extend downwards be pressed into a plurality of pin insertion holes that are arranged at substrate, thereby carries out described part to the installation of described substrate, it is characterized in that, comprising:
The contraposition operation makes described part be adsorbed in a plurality of adsorption mouth that mounting head possesses one i.e. the first adsorption mouth, and makes described a plurality of insertion pins of this part be positioned at the top of a plurality of pin insertion holes that are arranged at described substrate;
Be pressed into operation, described part is pressed on the mode of described substrate with the second adsorption mouth cooperations different from described the first adsorption mouth in described the first adsorption mouth and the described a plurality of adsorption mouth, these first adsorption mouth and the second adsorption mouth are descended, and a plurality of insertion pins that described part possesses are pressed into a plurality of pin insertion holes that are arranged at described substrate.
2. part mounting method as claimed in claim 1 is characterized in that,
Described the second adsorption mouth is in the adsorption mouth across the position of described the first adsorption mouth adjacency.
3. part mounting method as claimed in claim 1 or 2 is characterized in that,
Be pressed in the operation described, make described the first adsorption mouth from the state that makes described a plurality of insertion pin be positioned at the top of described a plurality of pin insertion holes descend until described each lower end of inserting pin with after corresponding described pin insertion hole contacts, described the second adsorption mouth is descended until the lower end of described the second adsorption mouth contacts with described part, then, described the first adsorption mouth and described the second adsorption mouth are descended simultaneously, described part is pressed into described substrate.
4. apparatus for mounting part possesses: substrate orientation section, and it carries out the location of substrate; Mounting head, it moves freely with respect to the substrate by described substrate orientation section location and arranges; Control device, it is pressed into a plurality of pin insertion holes that are arranged at described substrate by the part that carries out the action control of described mounting head, make possessing a plurality of insertion pins that extend downwards, thereby carries out described part to the installation of described substrate, it is characterized in that,
Described control device makes described part be adsorbed in a plurality of adsorption mouth that described mounting head possesses one i.e. the first adsorption mouth, and described a plurality of insertion pins of this part are positioned at after the top of a plurality of pin insertion holes that are arranged at described substrate, described part is pressed on the mode of described substrate with the second adsorption mouth cooperations different from described the first adsorption mouth in described the first adsorption mouth and the described a plurality of adsorption mouth, these first adsorption mouth and the second adsorption mouth are descended, and a plurality of insertion pins that described part possesses are pressed into a plurality of pin insertion holes that are arranged at described substrate.
5. apparatus for mounting part as claimed in claim 4 is characterized in that,
Described the second adsorption mouth is in the adsorption mouth across the position of described the first adsorption mouth adjacency.
6. such as claim 4 or 5 described apparatus for mounting part, it is characterized in that,
Described control device make described the first adsorption mouth from the state that makes described a plurality of insertion pin be positioned at the top of described a plurality of pin insertion holes descend until described each lower end of inserting pin with after corresponding described pin insertion hole contacts, described the second adsorption mouth is descended until the lower end of described the second adsorption mouth contacts with described part, then, described the first adsorption mouth and described the second adsorption mouth are descended simultaneously, described part is pressed into described substrate.
7. such as the apparatus for mounting part described in the claim 4～6 each, it is characterized in that,
Be provided with in the lower end of described the second adsorption mouth along the pad parts that extend with the direction of the lifting direction quadrature of described the second adsorption mouth.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012101105A JP2013229477A (en) | 2012-04-26 | 2012-04-26 | Component mounting method and component mounting apparatus |
| JP2012-101105 | 2012-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103379819A true CN103379819A (en) | 2013-10-30 |
Family
ID=49464187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201310149277 Pending CN103379819A (en) | 2012-04-26 | 2013-04-26 | Component installation method and component installation device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2013229477A (en) |
| CN (1) | CN103379819A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598839A (en) * | 2018-03-07 | 2018-09-28 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
| CN110024509A (en) * | 2016-11-30 | 2019-07-16 | 川崎重工业株式会社 | Apparatus for mounting component and its control method |
-
2012
- 2012-04-26 JP JP2012101105A patent/JP2013229477A/en active Pending
-
2013
- 2013-04-26 CN CN 201310149277 patent/CN103379819A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110024509A (en) * | 2016-11-30 | 2019-07-16 | 川崎重工业株式会社 | Apparatus for mounting component and its control method |
| CN110024509B (en) * | 2016-11-30 | 2021-09-28 | 川崎重工业株式会社 | Component mounting apparatus and control method thereof |
| CN108598839A (en) * | 2018-03-07 | 2018-09-28 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
| CN108598839B (en) * | 2018-03-07 | 2019-09-24 | 华域汽车系统股份有限公司 | A kind of board to board connector mounting tool and method |
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| Publication number | Publication date |
|---|---|
| JP2013229477A (en) | 2013-11-07 |
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Application publication date: 20131030 |