CN104604358B - Mounting apparatus, method for mounting electronic component, program, and method for manufacturing substrate - Google Patents
Mounting apparatus, method for mounting electronic component, program, and method for manufacturing substrate Download PDFInfo
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- CN104604358B CN104604358B CN201380035165.6A CN201380035165A CN104604358B CN 104604358 B CN104604358 B CN 104604358B CN 201380035165 A CN201380035165 A CN 201380035165A CN 104604358 B CN104604358 B CN 104604358B
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- electronic unit
- mounting head
- height
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- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0853—Determination of transport trajectories inside mounting machines
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
[Problem] To provide a technology of a mounting apparatus or the like that is capable of improving production efficiency of substrates. [Solution] This mounting apparatus is provided with a mounting head, a transfer mechanism, and a control unit. The mounting head is capable of holding at least one electronic component, and mounts the holding electronic component on a substrate. The transfer mechanism transfers the mounting head in the height direction. On the basis of a classification table in which a plurality of electronic components having different sizes are classified into a plurality of groups corresponding to the sizes, the control unit determines to which group the electronic component to be mounted on the substrate belongs, adjusts, by means of the transfer mechanism, the height of the mounting head to the height corresponding to the group to which the electronic component belongs, and mounts the electronic component on the substrate by means of the mounting head having the height thereof adjusted.
Description
Technical field
This technology is related to install erecting devices of various electronic units such as resistor, capacitor, inductor etc. on substrate
Technology.
Background technology
In the past, the erecting device widely people for installing resistor, capacitor, the various electronic units such as inductor on substrate
Know (for example, referring to patent document 1).In this erecting device, first, the mounting head of the adsorption mouth with absorption electronic unit
The top of supply unit is moved to, the electronic unit supplied by supply unit is adsorbed by adsorption mouth.Then, electricity has been adsorbed in adsorption mouth
In the state of subassembly, mounting head is moved on substrate from supply unit.Then, by the adsorption mouth of reduction mounting head, in base
Electronic unit is installed on plate.
Further, as the technology related to the application, disclosing the technology enumerated in following patent documents 2.
Prior art literature
Patent document 1：Japanese Laid-Open 2011-165946 publication
Patent document 2：Japanese Laid-Open 2011-100955 publication
The content of the invention
In the erecting device for expecting electronic unit is arranged on substrate to produce substrate, imitate can the production of substrate
The technology that rate is improved.
In view of the above circumstances, the purpose of this technology is to provide the installation dress that a kind of production efficiency that can make substrate is improved
The technology put etc..
The erecting device that this technology is related to includes：Mounting head, travel mechanism, control unit.
The mounting head can keep at least one electronic unit, and the electronic unit for keeping is arranged on substrate
On.
The travel mechanism makes the mounting head move in the height direction.
The control unit presses the classification chart that the size classes are into multiple groups according to by size different multiple electronic units,
Judge which group the electronic unit installed on the substrate belongs to, by the travel mechanism, by the mounting head
The Height Adjustment extremely height corresponding with the group belonging to the electronic unit, by the mounting head of adjustment height in the substrate
It is upper that the electronic unit is installed.
In this technique, multiple electronic units can be pressed the size classes of electronic unit into multiple groups, and by mounting head
Height Adjustment into the appropriate height corresponding with the group.Thereby, it is possible to shorten time when being installed electronic unit by mounting head,
As a result, improve can the production efficiency of substrate.
In the erecting device, the travel mechanism can make the mounting head in the supply for supplying the electronic unit
Move between the installation region of region and the installation electronic unit.
In this case, the control unit can be performed and keep the electricity by the mounting head in the supply area
The holding operation of subassembly and the electronic unit is installed on the substrate by the mounting head in the installation region
Installation procedure.
In the erecting device, the mounting head can keep multiple electronic units.
In this case, the control unit judge in the holding operation once by the mounting head keep it is many
Whether individual electronic unit is to all belong to identical group of electronic unit, is not all of belonging to identical group in the plurality of electronic unit
Electronic unit in the case of, the height of the mounting head can be adjusted to the electricity maximum with size in the plurality of electronic unit
The corresponding height of group belonging to subassembly, and by adjusting to the corresponding height of the group belonging to the electronic unit that size is maximum
The mounting head the plurality of electronic unit is installed on the substrate.
Thereby, it is possible to avoid the electronic unit kept by mounting head from (such as being installed on substrate with other parts
Into electronic unit) collide such interference.
In the erecting device, can be that the control unit is not all of belonging to identical group in the plurality of electronic unit
Electronic unit in the case of, in the supply area, from belonging to electronic unit minimum in the plurality of electronic unit
The height of the corresponding mounting head of group start to adjust the height of the mounting head successively by stages and protected by the mounting head
Hold the plurality of electronic unit.
Each electronics is kept with the height of the appropriate mounting head corresponding with the group of electronic unit thereby, it is possible to make mounting head
Part.
In the erecting device, can keep institute by the Height Adjustment stage by stage for the control unit
The Height Adjustment of mounting head is stated to the height corresponding with the group belonging to the electronic unit that size is maximum, the peace is made
Dress head is moved to the installation region, and the group phase by belonging to adjusting to the electronic unit maximum with size from the supply area
The mounting head of corresponding height installs the plurality of electronic unit on the substrate.
In the erecting device, can keep electronic unit when operation under by adjusted to appropriate height installation
Head installs each electronic unit on substrate.
In the erecting device, in the case where the mounting head can keep multiple electronic units, the control unit
Can preferentially keep belonging to identical group of multiple electronic units by the mounting head in the holding operation once.
Thus, the multiple electronic units for being kept by mounting head in holding operation once are with the height of identical mounting head
The multiple electronic units that belong to identical group of the degree on substrate.
In the erecting device, the control unit can also be from belonging to the electronic unit being relatively small in size
The corresponding height of group start to be sequentially adjusted in the height of the mounting head, once the height of the mounting head is changed to and size
In the case of the corresponding height of group belonging to the relatively large electronic unit, the height for limiting the mounting head is changed to
The height corresponding with the group belonging to the electronic unit being relatively small in size.
Thereby, it is possible to avoid the electronic unit kept by mounting head from colliding with the electronic unit of the installation on substrate
Such interference.
The installation method of the electronic unit that this technology is related to includes：Press described according to by size different multiple electronic units
Into multiple groups of classification chart, size classes judge which group the electronic unit on substrate belongs to.
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit.
The electronic unit is installed on the substrate by the mounting head of adjustment height.
The program that this technology is related to performs following steps in erecting device：
The size classes are pressed into multiple groups of classification chart according to by size different multiple electronic units, judges to be arranged on
Electronic unit on substrate belong to which group the step of；
By the Height Adjustment of mounting head to the elevation procedure corresponding with the group belonging to the electronic unit；
The electronic unit step is installed on the substrate by the mounting head of adjustment height.
The manufacture method of the substrate that this technology is related to includes：The size is pressed according to by size different multiple electronic units
Multiple groups of classification chart is categorized into, judges which group the electronic unit on substrate belongs to.
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit.
The electronic unit is installed on the substrate by the mounting head of adjustment height.
As described above, using this technology, using the teaching of the invention it is possible to provide erecting device that a kind of production efficiency for making substrate is improved etc.
Technology.
Description of the drawings
Fig. 1 is the front view of the erecting device of an embodiment for representing this technology；
Fig. 2 is the side view for representing erecting device；
Fig. 3 is the top view for representing erecting device；
Fig. 4 is the block diagram for representing erecting device composition；
Fig. 5 is represented size different multiple electronic units by the size classes of electronic unit into multiple groups of classification chart
An example figure；
Fig. 6 is the figure for representing from the upper surface of substrate the height started to the leading section of adsorption mouth；
Fig. 7 is the flow chart of the process for representing erecting device；
Fig. 8 is the adsorption mouth row in the vertical direction of (comparative example) in the case that mounting head is not moved in the height direction
Journey and mounting head move in the height direction in the case of (present embodiment) adsorption mouth stroke in the vertical direction ratio
Relatively scheme；
Fig. 9 is that the length of the adsorption mouth of (comparative example) in the case that mounting head is not moved in the height direction is existed with mounting head
The comparison diagram of the length of (present embodiment) in the case of moving in short transverse.
Symbol description
1... substrate
2... electronic unit
3... control unit
25... supply unit
30... mounting head
31... rotating turret
32... adsorption mouth
40... head moving mechanism
100... erecting device
Specific embodiment
Hereinafter, referring to the drawings the embodiment that this technology is related to is illustrated.
The overall structure and Each part of erecting device
Fig. 1 is the front view of the erecting device 100 of the first embodiment for representing that this technology is related to.Fig. 2 is erecting device
100 side view, Fig. 3 are the top views of erecting device 100.Fig. 4 is the block diagram of the structure for representing erecting device 100.
As shown in these figures, erecting device 100 includes frame structure body 10 and trucking department 15, and the trucking department 15 is installing dress
Put 100 inside to arrange along X-direction, to X-direction carrying substrate 1.Additionally, erecting device 100 includes supporting part 20 and supplies
To portion 25, the supporting part 20 supports the substrate 1 for being carried to assigned position by trucking department 15 from below, and the supply unit 25 is removed with clipping
The mode in fortune portion 15 is arranged on the fore-and-aft direction both sides of erecting device 100, supplies electronic unit 2.
Additionally, erecting device 100 includes mounting head 30 and head moving mechanism 40, the mounting head 30 keeps being supplied by supply unit 25
The electronic unit 2 given, and the electronic unit 2 of holding is installed on substrate 1, the head moving mechanism 40 makes mounting head 30 in XYZ
Side moves up.
With reference to Fig. 4, erecting device 100 also includes：It is control unit 3, storage part 4, display part 5, input unit 6, shoot part 7, logical
Letter portion 8, air compressor 33, rotating turret drive division 34, mouth drive division 35 etc..
Frame structure body 10 has：The horizontal frame 13 of vertical framework 12, two of base 11, four, the base 11 are arranged on bottom,
Above-mentioned four vertical frameworks 12 are fixed on the pedestal 11, and above-mentioned two horizontal frames 13 are erected at the top of vertical framework 12 along X-direction.
Trucking department 15 (with reference to Fig. 2, Fig. 3) includes guiding piece 16 and conveyer belt 17, and above-mentioned guiding piece 16 is matched somebody with somebody along X-direction
If above-mentioned conveyer belt 17 is arranged on the inner face side of guiding piece 16.Trucking department 15 is moved into substrate 1 and is positioned at by driving conveyer belt 17
Assigned position, or discharge the substrate 1 of the installation for completing electronic unit 2.Guiding piece 16 is formed as upper end 16a to inner side bending,
The upper end 16a of guiding piece, can be from upside supporting substrate 1 when substrate 1 is moved to top by supporting part 20.
Supporting part 20 (with reference to Fig. 2) includes：Gripper shoe 21, multiple supporting pins 22, plate elevating mechanism 23, above-mentioned multiple supports
Pin 22 is vertically situated in the gripper shoe 21, and above-mentioned plate elevating mechanism 23 lifts gripper shoe 21.
When the predetermined substrate 1 for installing electronic unit 2 is carried to the position of regulation by trucking department 15, by plate elevating mechanism
23 are moved upward gripper shoe 21.If being moved upward gripper shoe 21, by supporting substrate 1 from below of multiple supporting pins 22, to
Top boosts substrate 1.If boosting substrate 1 upward, substrate 1 is separated with conveyer belt 17, by the upper end 16a of guiding piece from upper
The both ends of square supporting substrate 1.
Thus, substrate 1 is clipped between supporting part 20 and the upper end 16a of guiding piece, and substrate 1 is fixed on assigned position,
Under the state, electronic unit 2 is installed on substrate 1.The region on substrate 1 now becomes the installing zone for installing electronic unit 2
Domain M.
Supply unit 25 is made up of the multiple tape drums 26 arranged along X-direction.The tape drum 26 can be filled relative to erecting device 100
Unload, internally accommodate carrier band (not shown).Tape drum 26 each includes the spool and delivering mechanism for being wound with carrier band, above-mentioned to send machine
Structure sends carrier band in the way of step feed.
There are such as resistor, capacitor, inductor, IC chip (IC in the inner containment of carrier band：Integrated
Circuit：Integrated circuit) etc. same type electronic unit 2.In the end (center side of erecting device 100) of tape drum 26
Upper surface be formed with supply window 27, via the supply window 27 to mounting head 30 supply electronic unit 2.By arranging multiple loads
Band, the region for being arranged with multiple supply windows 27 become the supply area S of electronic unit 2.
Head moving mechanism 40 (with reference to Fig. 1 and Fig. 2) have for make mounting head 30 respectively Y direction, X-direction and
Y-axis moving mechanism 41, X-axis travel mechanism 44 and the Z axis travel mechanism 51 moved in Z-direction.
Y-axis moving mechanism 41 includes Y-axis framework 42 and Y-axis moving body 43, and above-mentioned Y-axis framework 42 is relative to frame structure body
10 two horizontal frames 13 are set up along Y direction, and above-mentioned Y-axis moving body 43 is may move in the Y-axis direction relative to Y-axis framework 42
Be assemblied in the lower position of Y-axis framework 42.Additionally, Y-axis moving mechanism 41 has Y-axis drive division, above-mentioned Y-axis drive division is used for
Y-axis moving body 43 is driven along Y direction.
X-axis travel mechanism 44 has X-axis framework 45 and X-axis moving body 46, and above-mentioned X-axis framework 45 has in the X-axis direction
Longer shape, is assemblied in the side of Y-axis moving body 43, above-mentioned X-axis moving body 46 relative to X-axis framework 45 in the X-axis direction
It is movably mounted in the lateral location of the X-axis framework 45.Additionally, X-axis travel mechanism 44 has X-axis drive division, above-mentioned X-axis
Drive division is for along X-direction driving X-axis moving body 46.Two are provided with the side of X-axis framework 45 abreast along X-direction
Guide rail 47, is provided with the slide unit 48 slided on guide rail 47 on the guide rail 47.X-axis moving body 46 is via guide rail 47
And slide unit 48 is assemblied in the lateral location of X-axis framework 45.
Z axis travel mechanism 51 has supporter 52 and Z axis drive division, and above-mentioned supporter 52 is relative to X-axis moving body 46 in Z
The lateral location of X-axis moving body 46 is movably mounted on direction of principal axis, and above-mentioned Z axis drive division should for driving along Z-direction
Supporter 52.Supporter 52 is supported in the way of it can rotate installs mounting head 30 on substrate 1 by electronic unit 2.In X-axis
The side of moving body 46 is abreast provided with two guide rails 53 along Z-direction, is provided with guide rail 53 on the guide rail 53
The slide unit 54 of upper slip.Supporter 52 is assemblied in the side position of X-axis moving body 46 via guide rail 53 and slide unit 54
Put.
As X-axis drive division, Y-axis drive division and Z axis drive division, for example, can enumerate ball screw drive mechanism, band
Drive mechanism, linear electric motor mechanism etc..Head moving mechanism 40 makes peace by driving X-axis drive division and Y-axis drive division
Dress 30 is moved between supply area S and installation region M.Additionally, head moving mechanism 40 makes installation by driving Z axis drive division
30 move in Z-direction (short transverse).
Mounting head 30 has rotating turret 31 and multiple adsorption mouths 32, and above-mentioned rotating turret 31 is assembled into can be relative to being arranged on
Standard shaft 55 on supporter 52 rotates, and adsorption mouth 32 is assemblied in rotating turret 31 in the circumference along rotating turret 31 in equally spaced mode
On.
Although the quantity of mounting head 30 is set to one in the present embodiment, the quantity of mounting head 30 can also be two
More than.Additionally, for the quantity of adsorption mouth 32 is not limited, for example, the quantity of adsorption mouth 32 can also be one.
Rotating turret 31 is set to standard shaft 55 that can be in an inclined direction obliquely to configure and rotates as Pivot axle.Rotate
The axle rotation centered on above-mentioned standard shaft 55 by driving rotating turret drive division 34 (with reference to Fig. 4) of frame 31.
Pivot axle of the adsorption mouth 32 with the axis of adsorption mouth 32 relative to rotating turret 31 is distinguished inclined mode and is assembled
On rotating turret 31.
To support adsorption mouth 32 relative to rotating turret 31 along the moveable mode of above-mentioned axis direction, additionally, with being capable of phase
For the mode of the rotation of rotating turret 31 supports adsorption mouth 32.Driving of the adsorption mouth 32 by mouth drive division 35 (with reference to Fig. 4), to advise
(above-below direction) is mobile in the axial direction for fixed sequential, or is rotated about the axis with the sequential for specifying.
In multiple adsorption mouths 32, positioned at extreme lower position adsorption mouth 32 (in FIG, positioned at the rightmost side adsorption mouth 32)
Axis towards vertical direction.Hereinafter, this axis is referred to as into operative position towards the position of the adsorption mouth 32 of vertical direction
Put.By the rotation of rotating turret 31 successively adsorption mouth 32 of the switching positioned at operating position.
Adsorption mouth 32 is connected with air compressor 33 (with reference to Fig. 4).Adsorption mouth 32 can be according to the air compressor 33
The switching of negative pressure and malleation is adsorbing or depart from electronic unit 2.
Mounting head 30 is repeated holding operation and installation procedure by the control of control unit 3, and above-mentioned holding operation is to supply
Electronic unit 2 is adsorbed (keep) by adsorption mouth 32 in the S of region, above-mentioned installation procedure is by adsorption mouth 32 in the M of installation region
Electronic unit 2 is installed.Additionally, mounting head 30 presses control adjustment height (Z-direction) of control unit 3.
Control unit 3 is for example by CPU (Central processing Unit：Central processing unit) constitute.3 basis of control unit
The various calculating of various program performings being stored in storage part 4, so that uniformly control each several part of erecting device 100.With regard to
The process of the control unit 3, is described in detail below.
Storage part 4 has nonvolatile memory and a volatile memory, and above-mentioned nonvolatile memory is stored with control
Various programs necessary to the control in portion 3, above-mentioned volatile storage are used as the operating area of control unit 3.Can also from tabula rasa,
The removable recording medium such as semiconductor memory reads above-mentioned various programs.
Display part 5 is by liquid crystal display, EL (Electro-Luminescence：Electroluminescent) display etc. constitutes,
Various data are shown on picture.Input unit 6 is for example made up of keypad, touch panel etc., the various instructions of input operation personnel.
Shoot part 7 includes arranging the shoot part 7 of shooting alignment mark on substrate 1 and shoots absorption in adsorption mouth 32
The various shoot parts such as the shoot part 7 of electronic unit 2 of leading section 7.These shoot parts 7 are for example arranged on and support propping up for mounting head 30
On support body 52, move together with mounting head 30 with the movement of mounting head 30.Shoot part 7 is for example by CCD (Charge
Coupled Device：Charge coupled device) sensor, CMOS (Complementary Metal Oxide
Semiconductor：Complementary metal oxide semiconductors (CMOS)) sensor etc. capturing element and on capturing element be imaged image
Imaging len etc. constitute.
Position of the control unit 3 based on the image recognition substrate 1 of the alignment mark shot by shoot part 7.Additionally, control unit 3
Based on the image of the electronic unit 2 adsorbed by adsorption mouth 32 shot by shoot part 7, the absorption posture of electronic unit 2 is recognized.
Communication unit 8 sends information to other devices in hookup wire, and receives information from other devices.As in hookup wire
Other devices, can for example enumerate solder(ing) paste printing equipment, printing inspection apparatus, other erecting devices, inspecting substrate dress
Put.
Classification chart
Used in the present embodiment by size different multiple electronic units 2 by electronic unit 2 size classes into
Multiple groups of classification chart.Hereinafter, the classification chart is illustrated.
Fig. 5 is represented size different multiple electronic units 2 by the size classes of electronic unit 2 into multiple groups of classification
The figure of one example of table.The classification chart is stored in advance in storage part 4.In classification chart as shown in Figure 5, transverse axis represents electronics
The width of part 2 and in depth direction a longer side size, the longitudinal axis represents the thickness of electronic unit 2.
As shown in figure 5, by width and in depth direction, a longer side is below 1.0mm, also, thickness is 0.5mm
Following electronic unit 2 is classified in group A.As the electronic unit 2 for being classified to group A, can for example enumerate 0402 (0.4mm ×
0.2mm × 0.2mm), 0603 (0.6mm × 0.3mm × 0.3mm), the electronics of the type of 1005 (1.0mm × 0.5mm × 0.5mm)
Part 2 etc..Further, the size that here is represented is width × depth × thickness.In the electronic unit 2 included by group A, maximum chi
Very little electronic unit 2 be width × depth × thickness be 1.0mm × 1.0mm × 0.5mm electronic unit 2.
Additionally, as shown in figure 5, it is 1.0mm～2.0mm and thickness that will meet a longer side in width and depth direction
For below 2.0mm, or, it is 2.0mm to meet thickness for a longer side in 0.5mm～2.0mm and width and depth direction
The electronic unit 2 of following condition is classified to a group B.As the electronic unit 2 for being classified to group B, for example, 1608 can be enumerated
(1.6mm × 0.8mm × 0.8mm), electronic unit 2 of type of 2012 (2.0mm × 1.2mm × 1.2mm) etc..In group B bags
In the electronic unit 2 for containing, it is 2.0mm × 2.0mm × 2.0mm that maximum sized electronic unit 2 is width × depth × thickness
Electronic unit 2.
Additionally, as shown in figure 5, meeting in width and depth direction that a longer side is 2.0mm～7.5mm and thickness is
The condition of below 3.0mm, or, meeting thickness for a longer side in 2.0mm～3.0mm and width and depth direction is
The electronic unit 2 of the condition of below 7.5mm is classified to a group C.As the electronic unit 2 for being classified to group C, for example, can enumerate
3216(3.2mm×1.6mm×1.6mm)、3225(3.2mm×2.5mm×2.5mm)、5025(5.0mm×2.5mm×2.5mm)
Electronic unit 2 of type etc..Further, in the electronic unit 2 included by group C, maximum sized electronic unit 2 is width × vertical
Electronic unit 2 of the depth × thickness for 7.5mm × 7.5mm × 3.0mm.
Electronic unit 2 is not only a group A～group C, by the size of electronic unit 2, is also further classified to a group D, group E......
Deng other groups.Classification chart as shown in Figure 5 is only an example, suitably can be changed.
" starting the height to the leading section of adsorption mouth 32 from the upper surface of substrate 1 "
Next, to starting the height (height of mounting head 30 to the leading section of adsorption mouth 32 from the upper surface of substrate 1
Degree) illustrate.Fig. 6 is to represent the figure to starting the height to the leading section of adsorption mouth 32 from the upper surface of substrate 1.Figure
6 left hand view, central figure, right part of flg are illustrated respectively in the height of the adsorption mouth 32 in a group A, group B, group C.It will be appreciated from fig. 6 that each
In group, differ to starting the height (height of mounting head 30) to the leading section of adsorption mouth 32 from the upper surface of substrate 1.
As depicted on the left hand side of fig. 6, in group A, to starting to the leading section of adsorption mouth 32 from the upper surface of substrate 1
Highly it is 2mm+2mm, i.e. 4mm.Additionally, as shown in the central authorities of Fig. 6, in group B, to starting to absorption from the upper surface of substrate 1
Height till the leading section of mouth 32 is 2mm+4mm, i.e. 6mm.Similarly, as illustrated by the right side of figure 6, in group C, to from substrate
The height that 1 upper surface starts to the leading section of adsorption mouth 32 is 2mm+6mm, i.e. 8mm.By each group and the height of adsorption mouth 32
The relation table of degree (height of mounting head 30) is formatted and is stored in storage part 4.
Height setting method to starting to the leading section of adsorption mouth 32 from the upper surface of substrate 1 is illustrated.It is logical
Cross, the electronic unit 2 adsorbed by adsorption mouth 32 is installed on substrate 1.
Therefore, the upper surface of substrate 1 is improved with side's installation rate closer to the distance of the leading section of adsorption mouth 32.The opposing party
Face, if the hypotelorism of the leading section of the upper surface of substrate 1 and adsorption mouth 32, mounting head 30 by compared with substrate 1 more
When going to be installed above the upper end 16a for guiding piece prominent upward, the electronic unit 2 kept by adsorption mouth 32
Contact with the upper end 16a of guiding piece.If additionally, the upper surface of substrate 1 and the hypotelorism of the leading section of adsorption mouth 32, also deposit
The situation that electronic unit 2 on already installed on substrate 1 is contacted with the electronic unit 2 adsorbed by adsorption mouth 32.
Accordingly, it would be desirable to the upper surface for considering these situations to set from substrate 1 starts to the leading section of adsorption mouth 32
Height.In this example, because the height started to the upper end 16a of guiding piece from the upper surface of substrate 1 is set to
2mm, so start from the upper surface of substrate 1 highly desirable bigger than 2mm to the leading section of adsorption mouth 32.The condition is each
It is common in group.
Further, the maximum of the thickness of electronic unit 2 is 0.5mm in group A, is 2.0mm, in group C is in group B
3.0mm.Therefore, the height for starting to the leading section of adsorption mouth 32 from the upper end 16a of guiding piece needs ratio in group A
0.5mm is big, needs bigger than 2.0mm in group B, needs bigger than 3.0mm in group C.
Additionally, when keeping electronic unit 2 by adsorption mouth 32 in the S of supply area, there is adsorption mouth 32 and inhaled with incorrect posture
The situation of attached electronic unit 2.Therefore, start distance to the bottom of electronic unit 2 simultaneously from the leading section of adsorption mouth 32
It is not limited to equal with the thickness of electronic unit 2, also has above-mentioned distance to become bigger feelings compared with the thickness of electronic unit 2
Condition.
For example, it is envisioned that in the electronic unit 2 included by group A, causing to adsorb most under raised state by absorption mistake
The situation of large-sized electronic unit 2 (1.0mm × 1.0mm × 0.5mm).Because the solid of the maximum sized electronic unit 2
Cornerwise length is 1.5mm, so starting distance to the bottom of electronic unit 2 most from the leading section of adsorption mouth 32
Greatly 1.5mm.For this viewpoint, in group A, start to the leading section of adsorption mouth 32 from the upper end 16a of guiding piece
Highly it is set to the value of more than 1.5mm, i.e. 2.0mm.
Similarly, it is contemplated that in the electronic unit 2 included by group B, cause to adsorb under raised state by absorption mistake
The situation of maximum sized electronic unit 2 (2.0mm × 2.0mm × 2.0mm).Because the maximum sized electronic unit 2 is vertical
The length of body diagonal is about 2.8mm, thus from the leading section of adsorption mouth 32 start to the bottom of electronic unit 2 away from
From being 2.8mm to the maximum.For this viewpoint, in group B, start to the leading section of adsorption mouth 32 from the upper end 16a of guiding piece be
Height only is set to the value of more than 2.8mm, i.e. 4.0mm.
Further, being set to from the beginning of substrate 1 with the height of the leading section of adsorption mouth 32 in the electronic unit 2 for including group A
In the case that the mode of 4mm is installed on substrate 1, can be with 75000 [CPH：Chip per hour：Chip/per hour] effect
Rate installs electronic unit 2.In the electronic unit 2 for including group B in the way of the height of the leading section of adsorption mouth 32 is set to 6mm
The installation effectiveness for installing situation on substrate 1 is 73500 [CPH].Additionally, the electronic unit 2 included by group C is with adsorption mouth 32
The height of leading section be set to the mode of 6mm to install the installation effectiveness of situation on substrate 1 be 72000 [CPH].
Operating instruction
Next, the operation to erecting device 100 is illustrated.Fig. 7 is the flow process of the process for representing erecting device 100
Figure.
First, the control of control unit 3 trucking department 15, carrying substrate 1 is to assigned position.Then, 3 control panel lift of control unit
Structure 23, is moved upward gripper shoe 21 and supporting pin 22, substrate 1 is positioned at assigned position.
Next, the control head moving mechanism 40 of control unit 3, makes mounting head 30 move up in XY side, so that mounting head
(step 101) is moved on 30 to supply area S.
Next, control unit 3 is obtained by mounting head 30 from storage part 4 in this holding operation (and installation procedure)
In should keep (and install) multiple electronic units 2 kind of information (step 102).Here, being set in advance in a chip base
The multiple electronic units 2 for making a reservation for install on plate 1 are kept on simultaneously installation base plate 1 by mounting head 30 in what order.
Typically, in order to avoid already installed on the electronic unit 2 on substrate 1 and the electronic unit kept by mounting head 30
2 interference, electronic unit 2 start to be sequentially arranged on substrate 1 from the electronic unit 2 being relatively small in size.Therefore, will keep with
And the order of installation electronic unit 2 is set to the electronic unit 2 for belonging to group A, the electronic unit 2 for belonging to group B, the electronics for belonging to group C
Part 2, the order for belonging to group D.......
In order to keep keeping (and installation) to belong to by mounting head 30 is preferential in operation (and installation procedure) in identical
Identical group of multiple electronic units 2, control unit 3 preset the order of holding (and installation) electronic unit 2.
Further, in identical keeps operation, there is also and keep belonging to multiple electronic units 2 of different groups by mounting head 30
Situation.For example, there is also in identical keeps operation by the electronic unit 2 of 30 holding group A of mounting head, the ministry of electronics industry of group B
The situation of part 2.
If the information of multiple electronic units 2 that acquirement should be kept in this holding operation, control unit 3 is based on upper
State classification chart (with reference to Fig. 5) and judge that those electronic units 2 are belonging to the electronic unit 2 (step 103) of which group.Next, control
Whether multiple electronic units that portion processed 3 judges should to keep in this holding operation 2 are to all belong to identical group of electronics
Part 2 (step 104).
The multiple electronic units 2 that should be kept in this holding operation are to all belong to identical group of electronic unit 2
Situation ("Yes" of step 104 ") under, adjust the height of mounting head 30 to corresponding with the group belonging to those electronic units 2
Highly (step 105).With reference to Fig. 5, such as in the case of in those electronic units 2 being the electronic unit 2 for all belonging to group A, control
Portion processed 3 controls head moving mechanism 40 to adjust the height of mounting head 30, so that the leading section of adsorption mouth 32 is relative to the upper of substrate 1
The height on surface is changed into 4mm.
Further, can also obtain in mounting head 3 is performed from step 102 in a period of movement towards on the S of supply area
The information of multiple electronic units 2 starts into step 105 process adjusting the height of mounting head 30.Or, it is also possible to
The process is performed when mounting head 30 is on the S of supply area.
If the height of adjustment mounting head 30, next control unit 3 adsorbs many by multiple adsorption mouths 32 of mounting head 30
Individual electronic unit 2 (step 106).Now, control unit 3 by the adsorption mouth 32 positioned at operating position and is fed through the absorption first
The position of the supply window 27 of the electronic unit 2 of the absorption of mouth 32 is aligned.Then, the control mouth of control unit 3 drive division 35, makes to be located at
The adsorption mouth 32 of operating position is moved downwards, then, is controlled air compressor 33, the pressure of adsorption mouth 32 is switched to negative
Pressure.Thus, adsorbed by the leading section of adsorption mouth 32 and keep electronic unit 2.Control unit 3 makes the absorption electronic unit of adsorption mouth 32
After 2, it is moved upward the adsorption mouth 32.
Next, the control rotating turret of control unit 3 drive division 34, rotates rotating turret 31, so as to switch positioned at operating position
Adsorption mouth 32.Then, control unit 3 makes the newest adsorption mouth 32 positioned at operating position move downwards, is inhaled by the adsorption mouth 32
Attached electronic unit 2, then, is moved upward adsorption mouth 32.
The species of the electronic unit 2 adsorbed by adsorption mouth 32 in holding operation once be not limited to it is all identical,
There is also different situation (in step 106, organize for identical).In this case, because the supply window of supply electronic unit 2
27 position is different, and control unit 3 makes mounting head 30 move up in XY side, again to maintain the state of the height of mounting head 30
Carry out positioned at the adsorption mouth 32 of operating position and being aligned for supply window 27.
So, control unit 3 is by rotating rotating turret 31, adsorption mouth 32 is moved in the vertical direction, make mounting head 30
Move up in XY side, adsorbed the multiple electronic units 2 that should be kept in this holding operation by multiple adsorption mouths 32.
In the present embodiment, because the height of mounting head 30 is set as the appropriate height corresponding with the group of electronic unit 2
Degree, it is possible to shorten the time spent when adsorption mouth 32 is moved in the vertical direction and adsorbs electronic unit 2.
If being adsorbed the whole electronic units 2 that should be kept in this holding operation by multiple adsorption mouths 32, connect down
Come, control unit 3 makes mounting head 30 move (step 108) on the M of installation region with the state for maintaining the height of mounting head 30.This
When, although become mounting head 30 by the top of the upper end 16a of the prominent guiding piece in side more up compared with substrate 1, but
In present embodiment, the appropriate height of the height of the Height Adjustment to the upper end 16a for having contemplated that guiding piece of mounting head 30.Cause
This, is prevented from the interference that electronic unit 2 is contacted with the upper end 16a of guiding piece.
Next, the multiple electronic units 2 kept by mounting head 30 are installed (step 109) on substrate 1 by control unit 3.
Now, first, control unit 3 is by the position of the electronic unit 2 kept by the adsorption mouth 32 positioned at operating position and is installing the electricity
Installation site on the substrate 1 of subassembly 2 is aligned.Then, control unit 3 make positioned at operating position adsorption mouth 32 downwards
It is mobile, the pressure of adsorption mouth 32 is switched to into malleation from negative pressure.Thus, electronic unit 2 departs from from the leading section of adsorption mouth 32, from
And electronic unit 2 is installed on substrate 1.
Next, the control rotating turret of control unit 3 drive division 34 switches the electronic unit 2 positioned at operating position.Then, control
Portion 3 makes the position of the electronic unit 2 kept by the newest adsorption mouth 32 positioned at operating position and the electronic unit 2 be arranged on substrate
Installation site on 1 is aligned.Then, control unit 3 makes adsorption mouth 32 move downwards, and electronic unit 2 is arranged on substrate 1
On.If the electronic unit 2 of the whole kept by mounting head 30 is installed on substrate 1, this installation procedure is completed.
In the present embodiment, because the height of mounting head 30 sets the appropriate height corresponding with the group of electronic unit 2,
It is possible to the time spent in shortening when adsorption mouth 32 is moved in the vertical direction and installs electronic unit 2.
At step 104, the multiple electronic units 2 that should be kept in this holding operation are not all of belonging to identical
In the situation ("No" of step 104) of the electronic unit 2 of group, control unit 3 enters next step 107.In step 107, control
The height of the corresponding mounting head 30 of group belonging to portion processed 3 from the electronic unit 2 minimum with multiple electronic units 2 start according to
Multiple electronic units 2 are kept by mounting head 30 while the height of the secondary mounting head 30 of adjustment by stages.
In step 107, control unit 3 adjust first the height of mounting head 30 to this holding operation in should keep
Multiple electronic units 2 in the corresponding mounting head 30 of group belonging to minimum electronic unit 2 height.For example, it is envisioned that at this
Feelings comprising the electronic unit 2 for belonging to a group A, group B and group C in the multiple electronic units 2 that should be kept in secondary holding operation
Condition.In this case, the height of the adjustment of control unit 3 mounting head 30 to the group belonging to minimum electronic unit 2, that is, organize A phases
Corresponding height (with reference to the left side of Fig. 6).
Further, can also obtain many in mounting head 30 is performed from step 102 in a period of movement on the S of supply area
The information of individual electronic unit 2 start into step 107 by the Height Adjustment of mounting head 30 to belonging to minimum electronic unit 2
Process till the corresponding height of group.Or, it is also possible to the process is performed when mounting head 30 is on the S of supply area.
Control unit 3 adjustment mounting head 30 height to the multiple electronic units that should keep in this holding operation
During the corresponding height of group in 2 belonging to minimum electronic unit 2, adsorb adsorption mouth 32 with the height of the mounting head 30 and belong to
The electronic unit 2 of the group.In this case, such as control unit 3 with the height of the mounting head 30 corresponding with group A by adsorption mouth
32 absorption belong to the electronic unit 2 of group A.
In the multiple electronic units 2 that should be kept in the holding operation for completing this belonging to minimum electronic unit 2
In the case of the absorption of the electronic unit 2 of group, the height of the adjustment mounting head 30 of control unit 3 is to electronic unit 2 institute little with second
The height of the corresponding mounting head 30 of the group of category.Then, control unit 3 is made adsorption mouth 32 and is belonged to the absorption of the height of the mounting head 30
The electronic unit 2 of the group.For example, control unit 3 with the height (central with reference to Fig. 6) of the mounting head 30 corresponding with group B by adsorbing
The absorption of mouth 32 belongs to the electronic unit 2 of group B.
Be repeated such process, the height of 3 final adjustment mounting head 30 of control unit to this holding operation in
The corresponding height of group in the multiple electronic units 2 that should be kept belonging to maximum electronic unit 2.Then, control unit 3 is with this
The height of mounting head 30 makes the absorption of adsorption mouth 32 belong to the electronic unit 2 of the group.For example, with the mounting head 30 corresponding with group C
Height (with reference on the right side of Fig. 6), the electronic unit 2 of group C is belonged to by the absorption of adsorption mouth 32.
By such process, the whole electronic units 2 that should be kept in the holding operation for being kept this by mounting head 30.
In the present embodiment, because the group that can correspond to electronic unit 2 adjusts the height of mounting head 30 by stages and by adsorption mouth
32 absorption electronic units 2, it is possible to shorten the time for keeping operation to be spent.
In the explanation of step 107, as an example, to keeping belonging to the multiple of three different groups by mounting head 30
The situation of electronic unit 2 is illustrated.On the other hand, the multiple ministrys of electronics industry that should be kept in there is also holding operation once
Part 2 belongs to the situation of two groups, there is also the situation of the group for belonging to more than four.
Next, installation of the control unit 3 to maintain to adjust to the height corresponding with the group belonging to maximum electronic unit 2
The state of 30 height, makes mounting head 30 move (step 108) on the M of installation region.Next, control unit 3 is by having adjusted
The mounting head 30 of the corresponding height of group belonging to the whole electronic unit 2 maximum to size installs multiple ministrys of electronics industry on substrate 1
Part 2 (step 109).
That is, control unit 3 is with corresponding with the group (such as organizing C) belonging to the electronic unit 2 of the electronic unit 2 for belonging to maximum
The multiple electronic units 2 for belonging to different groups (for example organizing A～C) are installed on substrate 1 by the height of mounting head 30.So, pass through
The electronic unit 2 for belonging to each group, energy are installed with the height of the mounting head corresponding with the group belonging to maximum sized electronic unit 2
Enough avoid doing as electronic unit 2 and other parts (such as the electronic unit 2 on guiding piece 16, substrate 1) collide
Disturb.
If completing this installation procedure, next, control unit 3 is judged for the 1 predetermined whole installed of a plate base
Whether electronic unit 2 has installed (step 110) on substrate 1.Situation (the step 110 of the electronic unit 2 that should be installed in residual
"No") under, control unit 3 control head moving mechanism 40, mounting head 30 is moved on the S of supply area (step 101).Then,
The later process of execution step 102 in the same manner as before.
For by a plate base 1 predetermined whole electronic units 2 in the case of of installing on substrate 1 installed (step 110
"Yes"), control unit 3 completes to process.
Effect etc.
It is as described above, in the present embodiment, multiple electronic units 2 are categorized into into the size with electronic unit 2
Corresponding multiple groups, can adjust the height of mounting head 30 to the appropriate height corresponding with group.Thereby, it is possible to shorten by
Time during the absorption electronic unit 2 of adsorption mouth 32 of mounting head 30, and electronic unit 2 is pacified by the adsorption mouth 32 of mounting head 30
Time when filling on substrate 1.Therefore, in the erecting device 100 that this technology is related to, carry can the production efficiency of substrate 1
It is high.
Further, in the present embodiment, because mounting head 30 may move in the height direction, mounting head 30 can be reduced
Size.The reasons why to reducing the size of mounting head 30, illustrates.
Fig. 8 be adsorption mouth 32 in the situation (comparative example) that mounting head 30 is not moved in the height direction in the vertical direction
Stroke and mounting head 30 situation (present embodiment) that moves in the height direction under adsorption mouth 32 in the vertical direction
The comparison diagram of stroke.Fig. 9 is the length of the adsorption mouth 32 in the situation (comparative example) that mounting head 30 is not moved in the height direction
The comparison diagram of the length in the situation (present embodiment) for being moved with mounting head 30 in the height direction.
First, with reference to Fig. 8 and Fig. 9 left side, to not moving in the height direction in mounting head 30 in the case of absorption
The stroke of mouth 32 is illustrated.In the explanation, it is contemplated that by the ministry of electronics industry that electronic unit 2 and thickness that thickness is 1mm are 25mm
Part 2 installs situation on substrate 1.
In this case, the adsorption mouth 32 of the electronic unit 2 of the thickness of 25mm is kept to exist by already installed on base
The situation of the top of the electronic unit 2 of the thickness of the 25mm on plate 1.Therefore, for making the electronic unit 2 kept by adsorption mouth 32 not
Contact already installed on the electronic unit 2 on substrate 1, to starting to the leading section of adsorption mouth 32 from the upper surface of substrate 1
Highly desirable be set to more than 50mm (25mm+25mm).In this example embodiment, to starting to adsorption mouth 32 from the upper surface of substrate 1
Leading section till height be set to 52mm.
On the other hand, it is contemplated that when the height in the leading section of adsorption mouth 32 is set as from substrate starting the height of 52mm, will
Thickness installs situation on substrate 1 for the electronic unit 2 of 1mm.In this case it is necessary in the vertical direction with 51mm with
On stroke movement adsorption mouth 32, in this example embodiment, the stroke of adsorption mouth 32 is set to 52mm.In this case, such as a left side of Fig. 9
Shown in side, the length of adsorption mouth 32 needs to be set to more than 52mm.
Next, with reference to the right side of Fig. 8 and Fig. 9, the adsorption mouth in the case of being moved to mounting head 30 in the height direction
32 stroke is illustrated.In the explanation, it is contemplated that electronic unit 2 of the thickness for 1mm is installed on substrate 1, thickness is 13mm
Electronic unit 2, thickness for 25mm electronic unit 2 situation.
In this case, there is the adsorption mouth 32 of electronic unit 2 of the thickness for keeping 25mm by being arranged on substrate 1
On 25mm thickness electronic unit 2 top situation.Therefore, in order to not contact with these electronic units 2, in adsorption mouth
32 by the time point of the top of electronic unit 2, to starting the height to the leading section of adsorption mouth 32 from the upper surface of substrate 1
Degree needs to be set to more than 50mm (25mm+25mm).In this example embodiment, to starting to adsorption mouth 32 from the upper surface of substrate 1
Height till end is set to 52mm.Further, the height of 30 entirety of mounting head now is set to the highest point of arrival.
In the present embodiment, different from comparative example, moved as mounting head 30 is overall in the vertical direction, adsorption mouth 32
Leading section relative to substrate 1 height need not be fixed as from substrate 1 start 52mm.By thickness for 1mm electronic unit 2
In the case of installing on substrate 1, the state that can be integrally located at lower position with mounting head 30 installs electronic unit 2.
For example, the height of the leading section of adsorption mouth 32 is set as from substrate 1 starting the height positioned at 15mm, in the shape
Under state, electronic unit 2 that can be by thickness for 1mm is installed on substrate 1.In this case, the above-below direction of adsorption mouth 32
Stroke need to be set to more than 14mm, in this example, the trip is set to 15mm.Further, by mounting head 30 now
Whole height is set to the minimum point of arrival.
Here, mounting head 30 generally can be in the highest point of arrival (height of 52mm) and the minimum point of arrival (height of 15mm
Degree) between move in the vertical direction.Therefore, the stroke of the above-below direction of 30 entirety of mounting head is set to 37mm.
For example, state of the lower end part of electronic unit 2 in the position for starting 15mm from substrate 1 starts to move downwards suction
Attached mouth 32, so that install the electronic unit 2 that the electronic unit 2 and thickness that thickness is 13mm is 25mm on substrate 1.Even if at this
In the case of kind, if the stroke of the above-below direction of adsorption mouth 32 is set to 15mm, it is also possible to install electronic unit 2 on substrate 1.
Therefore, in the case where 30 entirety of mounting head can be moved in the vertical direction as in the present embodiment, such as Fig. 9
Right side shown in, if to be set at least 15mm just enough for the length of adsorption mouth 32.
Can be clear and definite from the comparison of described above, in the case where 30 entirety of mounting head can be moved in the vertical direction,
The size of mounting head 30 can be reduced.
In the explanation, in order to beneficial to the effect illustrated in present embodiment is understood, enumerate 32 entire length of adsorption mouth
Example be illustrated.However, in practice, adsorption mouth 32 is the structure being assemblied on mouth axle.Therefore, mouth described herein
32 entire length is really the length that adsorption mouth 32 is amounted to mouth axle.
Various modifications example
In explanation above, in the case of being not all of belonging in multiple electronic units 2 identical group of electronic unit 2,
The situation of the holding operation to adjusting the height of mounting head 30 by stages and performing electronic unit 2 is illustrated.The opposing party
Face, in the case of being not all of belonging in multiple electronic units 2 identical group of electronic unit 2, it is also possible to with maximum electronics
The height of the corresponding mounting head 30 of group belonging to part 2, performs the operation of the electronic unit 2 for keeping belonging to each group.This
In the case of, control unit 3 makes installation with the state for maintaining the height of mounting head 30 after the holding operation for completing electronic unit 2
30 are moved to installation region M from supply area S.Then, control unit 3 is with corresponding with the group belonging to maximum electronic unit 2
Mounting head 30 height, the multiple electronic units 2 for belonging to each group are installed on substrate 1.
30 height of mounting head is once changed to relative with the group belonging to relatively large sized electronic unit 2 by control unit 3
In the case of the height answered, then the height for limiting mounting head 30 changes to the group phase belonging to the electronic unit 2 being relatively small in size
Corresponding height.For example, control unit 3 once adjusts the height of mounting head 30 to the height corresponding with group B and with the mounting head
In the case that the electronic unit 2 for belonging to group B is installed on substrate 1 by 30 height, then the height for limiting mounting head 30 is changed to
The height corresponding with group A.Thereby, it is possible to the electronic unit 2 that avoids being kept by mounting head 30 and installation on substrate 1
Electronic unit 2 collide such interference.
Additionally, there is the common situation for installing other erecting devices 100 of electronic unit 2 on substrate 1 in hookup wire
Under, control unit 3 can obtain the letter of the electronic unit 2 of installation via communication unit 8 from other erecting devices 100
Breath.Then, control unit 3 can also limit the height of mounting head 30 and change to compared with the electronic unit 2 of installation
The corresponding height of group belonging to little electronic unit 2.
For example, it is also possible to replace above-mentioned adsorption mouth using such as clamping from both sides and keeping the holding member of electronic unit 2
32。
This technology can also adopt following structure.
(1) a kind of, erecting device, including：
Mounting head, can keep at least one electronic unit, and the electronic unit for keeping is arranged on substrate；
Travel mechanism, makes the mounting head move in the height direction；
Control unit, presses the size classes into multiple groups of classification chart according to by size different multiple electronic units, sentences
It is disconnected to install which group the electronic unit on the substrate belongs to, by the travel mechanism by the height of the mounting head
Adjust to the height corresponding with the group belonging to the electronic unit, pacified by the mounting head of adjustment height on the substrate
Fill the electronic unit.
(2) erecting device described in (1), as described above, wherein,
The travel mechanism makes the mounting head supply the supply area of the electronic unit and install the ministry of electronics industry
Move between the installation region of part,
The control unit performs the holding operation for being kept the electronic unit in the supply area by the mounting head
With the installation procedure for being installed the electronic unit in the installation region by the mounting head on the substrate.
(3) erecting device described in (2), as described above, wherein,
The mounting head can keep multiple electronic units,
The control unit judges that the multiple electronic units kept by the mounting head in the holding operation once are
No is to all belong to identical group of electronic unit, is not all of belonging in the plurality of electronic unit identical group of electronic unit
In the case of, by the group belonging to the Height Adjustment of the mounting head to the electronic unit maximum with size in the plurality of electronic unit
Corresponding height, and the mounting head of the corresponding height of the group by belonging to adjusting to the electronic unit maximum with size exists
The plurality of electronic unit is installed on the substrate.
(4) erecting device described in (3), as described above, wherein,
In the case that the control unit is not all of belonging in the plurality of electronic unit identical group of electronic unit, in institute
State in supply area, from the height of the mounting head corresponding with the group belonging to electronic unit minimum in the plurality of electronic unit
Beginning adjusts the height of the mounting head successively by stages, and keeps the plurality of electronic unit by the mounting head.
(5) erecting device described in (4), as described above, wherein,
The control unit keep by the Height Adjustment stage by stage by the Height Adjustment of the mounting head to
In the state of the corresponding height of group belonging to the maximum electronic unit of size, the mounting head is made to move from the supply area
To the installation region, and by adjusting the mounting head to the corresponding height of the group belonging to the electronic unit that size is maximum
The plurality of electronic unit is installed on the substrate.
(6) erecting device any one of (2) to (5), as described above, wherein,
The mounting head can keep multiple electronic units,
The control unit is preferential in the holding operation once to keep belonging to identical group multiple by the mounting head
Electronic unit.
(7) erecting device any one of (1) to (6), as described above, wherein,
The control unit starts successively from the height corresponding with the group belonging to the electronic unit being relatively small in size
The height of the mounting head is adjusted, once the height of the mounting head is changed to and the relatively large sized electronic unit institute
In the case of the corresponding height of the group of category, then the electricity that the height of the mounting head is changed to and is relatively small in size is limited
The corresponding height of group belonging to subassembly.
(8) a kind of, installation method of electronic unit,
The size classes are pressed into multiple groups of classification chart according to by size different multiple electronic units, judges to be arranged on
Which group electronic unit on substrate belongs to,
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit,
The electronic unit is installed on the substrate by the mounting head of adjustment height.
(9) a kind of, program for performing following steps in erecting device,
The size classes are pressed into multiple groups of classification chart according to by size different multiple electronic units, judges to be arranged on
Electronic unit on substrate belong to which group the step of；
The step of by the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit；
The step of electronic unit is installed on the substrate by the mounting head of adjustment height.
(10) a kind of, manufacture method of substrate, it is characterised in that
The size classes are pressed into multiple groups of classification chart according to by size different multiple electronic units, judges to be arranged on
Which group electronic unit on substrate belongs to,
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit,
The electronic unit is installed on the substrate by the mounting head of adjustment height.
Claims (9)
1. a kind of erecting device, it is characterised in that include:
Mounting head, can keep multiple electronic units, and the electronic unit for keeping is arranged on substrate；
Travel mechanism, makes the mounting head move in the height direction；
Control unit, presses the classification chart that the size classes are into multiple groups according to by size different multiple electronic units, judges peace
Which group the dress electronic unit on the substrate belongs to, by the travel mechanism by the Height Adjustment of the mounting head
To the height corresponding with the group belonging to the electronic unit, institute is installed on the substrate by the mounting head of adjustment height
State electronic unit,
The travel mechanism makes the mounting head supply the supply area of the electronic unit and install the electronic unit
Move between installation region,
The control unit perform in the supply area by the mounting head keep the electronic unit holding operation and
The installation procedure of the electronic unit is installed on the substrate by the mounting head in the installation region,
Judge whether the multiple electronic units kept by the mounting head in the holding operation once are to all belong to phase
With the electronic unit of group, in the case of being not all of belonging in the plurality of electronic unit identical group of electronic unit, will be described
Extremely corresponding with the group belonging to the electronic unit that size in the plurality of electronic unit the is maximum height of the Height Adjustment of mounting head,
And the mounting head of the corresponding height of the group by belonging to adjusting to the electronic unit maximum with size is pacified on the substrate
Fill the plurality of electronic unit.
2. erecting device as claimed in claim 1, wherein,
In the case that the control unit is not all of belonging in the plurality of electronic unit identical group of electronic unit, in the confession
In to region, from the beginning of the height of the mounting head corresponding with the group belonging to electronic unit minimum in the plurality of electronic unit
Adjust the height of the mounting head successively by stages, and the plurality of electronic unit is kept by the mounting head.
3. erecting device as claimed in claim 2, wherein,
The control unit keep by the Height Adjustment stage by stage by the Height Adjustment of the mounting head to and size
In the state of the corresponding height of group belonging to maximum electronic unit, the mounting head is made to be moved to institute from the supply area
State installation region, and by adjusting the mounting head to the corresponding height of the group belonging to the electronic unit that size is maximum in institute
State.
4. erecting device as claimed in claim 1, wherein,
The control unit in the holding operation once is preferentially kept belonging to identical group of multiple electronics by the mounting head
Part.
5. a kind of erecting device, it is characterised in that include:
Mounting head, can keep at least one electronic unit, and the electronic unit for keeping is arranged on substrate；
Travel mechanism, makes the mounting head move in the height direction；
Control unit, presses the classification chart that the size classes are into multiple groups according to by size different multiple electronic units, judges peace
Which group the dress electronic unit on the substrate belongs to, by the travel mechanism by the Height Adjustment of the mounting head
To the height corresponding with the group belonging to the electronic unit, institute is installed on the substrate by the mounting head of adjustment height
State electronic unit,
The control unit starts to be sequentially adjusted in from the height corresponding with the group belonging to the electronic unit being relatively small in size
The height of the mounting head, once the height of the mounting head change to belonging to the relatively large sized electronic unit
In the case of the corresponding height of group, then the ministry of electronics industry that the height of the mounting head is changed to and is relatively small in size is limited
The corresponding height of group belonging to part.
6. a kind of installation method of electronic unit, it is characterised in that
The classification chart that the size classes are into multiple groups is pressed according to by size different multiple electronic units, is judged installed in substrate
On electronic unit which group belonged to,
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit,
The electronic unit is installed on the substrate by the mounting head of adjustment height,
Make the mounting head in the supply area for supplying the electronic unit and install between the installation region of the electronic unit
It is mobile,
Perform and the holding operation of the electronic unit is kept and in the installing zone by the mounting head in the supply area
The installation procedure of the electronic unit is installed on the substrate by the mounting head in domain,
Judge whether the multiple electronic units kept by the mounting head in the holding operation once are to all belong to phase
With the electronic unit of group,
In the case of being not all of belonging in the plurality of electronic unit identical group of electronic unit, by the height of the mounting head
Adjust to the height corresponding with the group belonging to the electronic unit that size in the plurality of electronic unit is maximum,
The mounting head of the corresponding height of group by belonging to adjusting to the electronic unit maximum with size is on the substrate
The plurality of electronic unit is installed.
7. a kind of installation method of electronic unit, it is characterised in that
The classification chart that the size classes are into multiple groups is pressed according to by size different multiple electronic units, is judged installed in substrate
On electronic unit which group belonged to,
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit,
The electronic unit is installed on the substrate by the mounting head of adjustment height,
Start to be sequentially adjusted in the mounting head from the height corresponding with the group belonging to the electronic unit being relatively small in size
Height,
Once the height of the mounting head changes to the height corresponding with the group belonging to the relatively large sized electronic unit
In the case of degree, then the height for limiting the mounting head is changed to and the group phase belonging to the electronic unit being relatively small in size
Corresponding height.
8. a kind of manufacture method of substrate, it is characterised in that
The classification chart that the size classes are into multiple groups is pressed according to by size different multiple electronic units, is judged installed in substrate
On electronic unit which group belonged to,
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit,
The electronic unit is installed on the substrate by the mounting head of adjustment height,
Make the mounting head in the supply area for supplying the electronic unit and install between the installation region of the electronic unit
It is mobile,
Perform and the holding operation of the electronic unit is kept and in the installing zone by the mounting head in the supply area
The installation procedure of the electronic unit is installed on the substrate by the mounting head in domain,
Judge whether the multiple electronic units kept by the mounting head in the holding operation once are to all belong to phase
With the electronic unit of group,
In the case of being not all of belonging in the plurality of electronic unit identical group of electronic unit, by the height of the mounting head
Adjust to the height corresponding with the group belonging to the electronic unit that size in the plurality of electronic unit is maximum,
The mounting head of the corresponding height of group by belonging to adjusting to the electronic unit maximum with size is on the substrate
The plurality of electronic unit is installed.
9. a kind of manufacture method of substrate, it is characterised in that
The classification chart that the size classes are into multiple groups is pressed according to by size different multiple electronic units, is judged installed in substrate
On electronic unit which group belonged to,
By the Height Adjustment of mounting head to the height corresponding with the group belonging to the electronic unit,
The electronic unit is installed on the substrate by the mounting head of adjustment height,
Start to be sequentially adjusted in the mounting head from the height corresponding with the group belonging to the electronic unit being relatively small in size
Height,
Once the height of the mounting head changes to the height corresponding with the group belonging to the relatively large sized electronic unit
In the case of degree, then the height for limiting the mounting head is changed to and the group phase belonging to the electronic unit being relatively small in size
Corresponding height.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012-151149 | 2012-07-05 | ||
| JP2012151149 | 2012-07-05 | ||
| PCT/JP2013/003164 WO2014006809A1 (en) | 2012-07-05 | 2013-05-17 | Mounting apparatus, method for mounting electronic component, program, and method for manufacturing substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104604358A CN104604358A (en) | 2015-05-06 |
| CN104604358B true CN104604358B (en) | 2017-03-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380035165.6A Active CN104604358B (en) | 2012-07-05 | 2013-05-17 | Mounting apparatus, method for mounting electronic component, program, and method for manufacturing substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6171158B2 (en) |
| CN (1) | CN104604358B (en) |
| WO (1) | WO2014006809A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6409059B2 (en) * | 2014-05-16 | 2018-10-17 | 株式会社Ｆｕｊｉ | Optimization device and electronic component mounting machine |
| WO2017013696A1 (en) * | 2015-07-17 | 2017-01-26 | 富士機械製造株式会社 | Component mounting machine |
| DE102016222590B4 (en) | 2016-11-16 | 2021-04-15 | Asm Assembly Systems Gmbh & Co. Kg | Method for equipping a substrate with components, control device, computer program product and automatic equipping machine |
| JP2019027923A (en) * | 2017-07-31 | 2019-02-21 | セイコーエプソン株式会社 | Pressure device, electronic component conveyance device, and electronic component inspection device |
| JP6670410B2 (en) * | 2019-03-13 | 2020-03-18 | 株式会社Ｆｕｊｉ | Inspection support device and inspection support method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5402564A (en) * | 1991-07-12 | 1995-04-04 | Canon Kabushiki Kaisha | Parts mounting sequence determination method and apparatus |
| CN1466864A (en) * | 2000-08-04 | 2004-01-07 | 松下电器产业株式会社 | Method for optimization of an order of component mounting, apparatus using the same and mounter |
| CN1668178A (en) * | 2004-02-13 | 2005-09-14 | 株式会社日立高新技术仪器 | Electronic component mounting apparatus |
| JP2011100955A (en) * | 2009-11-09 | 2011-05-19 | Fuji Mach Mfg Co Ltd | Component mounting apparatus and mounting head device of the same |
| JP2011165946A (en) * | 2010-02-10 | 2011-08-25 | Sony Corp | Parts management system, part management method, and program |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3582653B2 (en) * | 2001-05-17 | 2004-10-27 | 松下電器産業株式会社 | Component mounting sequence optimizing method, device and component mounting machine |
| JP4044017B2 (en) * | 2003-04-22 | 2008-02-06 | 松下電器産業株式会社 | Component mounting apparatus and method |
-
2013
- 2013-05-17 WO PCT/JP2013/003164 patent/WO2014006809A1/en active Application Filing
- 2013-05-17 JP JP2014523562A patent/JP6171158B2/en active Active
- 2013-05-17 CN CN201380035165.6A patent/CN104604358B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5402564A (en) * | 1991-07-12 | 1995-04-04 | Canon Kabushiki Kaisha | Parts mounting sequence determination method and apparatus |
| CN1466864A (en) * | 2000-08-04 | 2004-01-07 | 松下电器产业株式会社 | Method for optimization of an order of component mounting, apparatus using the same and mounter |
| CN1668178A (en) * | 2004-02-13 | 2005-09-14 | 株式会社日立高新技术仪器 | Electronic component mounting apparatus |
| JP2011100955A (en) * | 2009-11-09 | 2011-05-19 | Fuji Mach Mfg Co Ltd | Component mounting apparatus and mounting head device of the same |
| JP2011165946A (en) * | 2010-02-10 | 2011-08-25 | Sony Corp | Parts management system, part management method, and program |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6171158B2 (en) | 2017-08-02 |
| WO2014006809A1 (en) | 2014-01-09 |
| JPWO2014006809A1 (en) | 2016-06-02 |
| CN104604358A (en) | 2015-05-06 |
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