KR101842002B1 - Solder preform cutting apparatus - Google Patents

Abstract

The present invention relates to a solder cutting apparatus, and more specifically, to a solder cutting apparatus, wherein a process of cutting a solder pre-form in a form of a strip into solder having predetermined length and then introducing the cut solder into a tray is completely automated, thereby enhancing productivity and saving labor costs, and preventing production of a defective product such as deformation of solder occurring in a cutting process. The apparatus of the present invention comprises: a solder supply unit composed of a mounting portion where a solder reel is mounted, a transfer portion which unwinds the solder pre-from wound on the solder reel to predetermined length and then transfers the same, and a cutting portion which cuts an end portion of the transferred solder pre-form; a tray transfer unit having a gripper on which a tray is seated and a transferring means horizontally moving the gripper to the left and the right; a solder transfer unit having a pickup head installed on the upper part of the tray transfer unit to be able to horizontally move back and forth or the left and the right, and suck the solder cut by the cutting portion to introduce the same into the tray of the gripper; and a tray loading unit having a plurality of loading portions where the trays are loaded and an elevator vertically moving each loading portion to the height of the gripper, wherein each tray before and after introduction of solder is stored therein.

Description

[0001] SOLDER PREFORM CUTTING APPARATUS [0002]

The present invention relates to a solder cutting apparatus, and more particularly, to a method and apparatus for cutting a solder preform in a strip state with a predetermined length of solder, A transfer part for transferring and transferring the solder preform wound on the solder reel by a predetermined length so as to prevent defective products such as deformation of the solder generated during the operation from occurring; A solder supply unit comprising a cutting portion for cutting an end portion; A tray transfer unit including a gripper on which the tray is seated and conveying means for horizontally moving the gripper; A solder transfer unit having a pickup head installed horizontally in the front, rear, left, and right sides of the tray transfer unit, for picking up solder cut at the cutting portion and inputting the solder into the tray of the gripper; And a tray stacking unit including a plurality of stacking units for stacking trays, and an elevator for raising and lowering each stacking unit up to the height of the gripper, wherein each tray before and after the insertion of the solder is stored; To a solder cutting apparatus.

DCB (Direct Copper Bonding) is one of the methods used to bond and bond chips to substrates in power semiconductor modules.

As can be seen in Japanese Patent Application Laid-Open No. 10-2009-0005464, the DCB process uses a thin metal thin-film solder to form a DCB substrate.

At this time, the solder used is produced as a thin strip (solder preform), and then the solder preform is wound on a reel to be shipped.

Therefore, in order to use solder in the DCB process, it is essential to cut a strip-shaped solder preform into a certain length and to individually store the solder in the tray.

Conventionally, after the solder cutting operation, the worker manually proceeds the work of storing the solder, so that not only the productivity is lowered but also the labor cost burden is large.

That is, as shown in FIG. 1, conventionally, a solder preform is cut into a predetermined length of solders by a reel-cutting machine, the operator collects the cut solder, separates the solder into individual pieces of the tray, There is a problem that not only the solder cutting operation takes much time but also the labor cost is increased due to the use of the worker.

Particularly, in the conventional reel-cutting machine, when the solder preform is cut using the cutting blade, the end portion of the cut surface is bent frequently, and the solder is damaged during the solder collecting and storing operations due to insufficient worker And the like.

There is a need for a technology that can automate all processes related to solder cutting and tray storage.

Accordingly, the present invention has been made to solve the above-mentioned problems,

It is possible to improve productivity and reduce labor costs by completely automating the whole process of cutting solder preform in strip state with solder of a certain length and storing it in a tray. It is also possible to prevent defects such as deformation of solder And to provide a solder cutting apparatus capable of preventing the solder from being broken.

In order to achieve the above object, a solder cutting apparatus according to the present invention comprises:

The present invention relates to a solder cutting apparatus for cutting a solder preform in a strip state with a solder having a predetermined length,

A solder supply unit including a mounting portion for mounting a solder reel, a transfer portion for transferring the solder preform wound around the solder reel by a predetermined length, and a cutting portion for cutting an end portion of the solder preform transferred;

A tray transfer unit having a gripper for fixing the tray and a conveying means for horizontally moving the tray;

A solder transfer unit having a pickup head installed horizontally in the front, rear, left, and right sides of the tray transfer unit, for picking up solder cut at the cutting portion and inputting the solder into the tray of the gripper; And

A tray stacking unit having a plurality of stacking units for stacking trays and an elevator for raising and lowering each stacking unit up to the height of the gripper,

And a control unit.

In the solder cutting apparatus according to the present invention,

Wherein the conveying portion comprises a conveying path provided horizontally in the left and right direction below the mounting portion and a conveying roller provided on the conveying path,

And the solder supply unit includes a guide portion provided between the mounting portion and the transfer path in an arc shape to guide the end portion of the solder preform to the entrance of the transfer path.

Furthermore, in the solder cutting apparatus according to the present invention,

Wherein the cutting portion is composed of an upper blade fixed to the upper portion of the conveyance path to form an outlet of the conveyance path and a lower blade installed to move up and down at the exit side of the conveyance path, And the lower blade is raised in a state that the lower blade is supported on the upper surface of the lowered lower blade, so that the solder is cut.

In the solder cutting apparatus according to the present invention,

The solder transfer unit is provided with two or more pick-up heads installed so as to move up and down, respectively, so that two or more solders are simultaneously transferred to the tray.

The solder cutting apparatus according to the present invention can prepare solder used for manufacturing a power semiconductor module or the like by cutting and individually classifying the solder according to the semiconductor design structure. Accordingly, the solder preform can be cut and soldered to the solder pre- Total) process can be fully automated to improve productivity and reduce labor costs.

In addition, the solder cutting apparatus according to the present invention prevents the solder preforms wound on the solder reel from being bent when the solder preform is untwisted and transported, and also prevents the solder deformation such as bending of the cut surface during the cutting operation , It is possible to prevent the occurrence of defective products which are likely to occur at the time of solder cutting.

Further, the solder cutting apparatus according to the present invention can simultaneously deliver two or more solders through two or more pick-up heads to separate and store the solder in a tray, thereby securing the same productivity as two or more facilities available with one facility, And the productivity can be further increased.

1 is a front view schematically illustrating a solder cutting apparatus according to the present invention;
2 is a schematic perspective view of a solder cutting apparatus according to the present invention;
3 is a perspective view of a solder supply unit according to the present invention;
4 is a perspective view of a tray transfer unit and a solder transfer unit according to the present invention;
5 is a side view of a pickup head according to the present invention;
6 is a perspective view of a tray loading unit according to the present invention;
Figures 7 and 8 are partial photographs of a prototype product according to the present invention.
9 is a cross-sectional view schematically showing a modified pickup head of the present invention.

While the present invention has been described in connection with certain embodiments, it is obvious that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

In the drawings, the same reference numerals are used for the same reference numerals, and in particular, the numerals of the tens and the digits of the digits, the digits of the tens, the digits of the digits and the alphabets are the same, Members referred to by reference numerals can be identified as members corresponding to these standards.

In the drawings, the components are expressed by exaggeratingly larger (or thicker) or smaller (or thinner) in size or thickness in consideration of the convenience of understanding, etc. However, It should not be.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise.

 In the present application, the term " comprising " or " consisting of ", or the like, refers to the presence of a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

It is to be understood that the first to second aspects described in the present specification are merely referred to in order to distinguish between different components and are not limited to the order in which they are manufactured, It may not match.

In describing the solder cutting apparatus according to the present invention, when an unambiguous approximate direction reference is specified for convenience, referring to FIG. 1, the direction in which the gravitational force acts is referred to as a downward direction The directions are specified in accordance with these standards unless otherwise specified in the detailed description of the invention and the scope of claims relating to other drawings.

Hereinafter, a solder cutting apparatus according to the present invention will be described with reference to the accompanying drawings.

The present invention relates to a solder cutting apparatus for cutting a solder preform SF in a strip state into a predetermined length of solder S and then cutting the solder S into a tray T, A feed unit 10, a tray transfer unit 20, a solder transfer unit 30, and a tray loading unit 40.

Specifically, a tray transfer unit 20 is provided at the center of a bed (not shown) of the main body, a solder supply unit 10 is installed at one side (right side in the figure) of the tray transfer unit 20, And a solder transfer unit 30 is installed in an upper space between the solder supply unit 10 and the solder supply unit 10. The tray loading unit 40 is installed on the other side of the tray transfer unit 20 (left side in the drawing).

The solder supply unit 10 includes a mounting portion 11 on which a solder reel SR is mounted, a transfer portion 12 for transferring the solder preform SF wound on the solder reel SR by a predetermined length, And a cutting portion 13 for cutting the end portion of the transferred solder preform SF.

The mounting portion 11 has a rotary shaft 11a that is extended in the front and rear directions in a frame provided on the upper portion of the main body of the main body so that the solder reel SR is fitted to the rotary shaft 11a, One of the side plates is separated from the rotary shaft 11a to sandwich the solder reel SR on the rotary shaft 11a and then the separated side plate is inserted into the rotary shaft 11a to be connected to the solder reel (not shown) SR) to the left or right.

The transfer unit 12 is provided on a bed of the main body and guides the solder preform SF to the cutting unit 13. The transfer unit 12 has a feed path 12a provided horizontally in the horizontal direction below the mounting unit 11, And a conveying roller 12b provided on the upper portion of the conveying path 12a.

The conveying path 12a is formed on the upper surface of the support block 10a by a pair of guide blocks 12c which are coupled to the upper surface of the support block 10a with a predetermined distance therebetween, And the transfer roller 12b is rotated by the motor so that the end of the solder preform SF is transferred to the cutting portion 13. [

One of the two guide blocks 12c forming the transfer path 12a is coupled to be adjustable in the longitudinal direction so that the width of the transfer path 12a can be adjusted in accordance with the width of the solder preform SF .

At this time, the solder supply unit 10 is installed in a circular arc shape between the mounting portion 11 and the conveying path 12a and guides the end portion of the solder preform SF to the entrance of the conveying path 12a 14).

The guide part 14 may be formed of a roller so that the direction in which the solder preform SF is unwound toward the entrance of the conveying path 12a can be guided. However, when the solder preform SF is released, Shaped member bent in a semicircle in order to prevent damage such as bending.

In addition, a sensor 12d for detecting whether or not the solder preform SF is drawn is provided at one side of the transfer path 12a.

The cutting unit 13 may be configured such that a blade capable of cutting a solder preform SF of a thin metal is vertically moved up and down,

In order to prevent deformation such as damage or bending of a cut surface when cutting a solder preform (SF)

 The cutting unit 13 includes an upper blade 13a fixed to the upper portion of the feed path 12a to form an outlet of the feed path 12a and a lower blade 13b fixed to the lower end of the feed path 12a, The lower blade 13b is elevated in the state that the end of the solder preform SF drawn to the lower portion of the upper blade 13a is supported on the upper surface of the lowered blade 13b, S is cut.

Specifically, the upper blade 13a is installed at a predetermined distance above the support block 10a to form an outlet of the feed path 12a, and the lower blade 13b is disposed on the other side of the upper blade 13a The upper left and the lower right) of the vehicle.

The tray transfer unit 20 includes a gripper 21 for fixing the tray T and a transfer means (not shown) for horizontally moving the tray T.

The gripper 21 is provided on the inner surface of each first horizontal frame 22 provided at left and right spaced apart from the front and back of the main body by a predetermined distance so that both left and right sides of the tray T supported by a stopper So that the tray T is fixed.

The gripper 21 is provided so as to be pivotally opened and closed by a cylinder so that when the gripper 21 is opened, the tray T is transported to the left and right, and when the gripper 21 is closed, The tray T is fixed.

The conveying means moves the tray T in the longitudinal direction of the first horizontal frame 22 in a state in which the gripper 21 is opened. The moving block is operated by a motor, or alternatively, And a belt which rotates left and right in the longitudinal direction at the inner surface of one horizontal frame 22 can be considered.

The solder transfer unit 30 is horizontally movable in the front, rear, left, and right directions on the upper side of the tray transfer unit 20. The solder transfer unit 30 sucks the solder S cut by the cutting unit 13, (31) for inputting the picked up image (T).

Specifically, the solder transfer unit 30 is provided with a second horizontal frame 32 in a front-back horizontal direction orthogonal to the first horizontal frame 22 so that the second horizontal frame 32 is connected to the first horizontal frame 22, And the pickup head 31 is coupled to move horizontally in the longitudinal direction of the second horizontal frame 32,

The pickup head 31 is moved in the front, rear, left, and right directions by the lateral movement of the second horizontal frame 32 and the forward and backward movement of the pickup head 31.

The pick-up head 31 is provided on the second horizontal frame 32 to vertically move up and down through a cylinder. The pick-up head 31 is connected to a vacuum suction means (not shown) such as a compressor to perform vacuum suction.

Particularly, the solder transfer unit 30 of the present invention is provided with at least two pick-up heads 31 installed up and down by cylinders so that two or more solders S can be simultaneously transferred to the tray T Thus, productivity of two or more units is ensured by one facility, and two pick-up heads 31 can be confirmed in the drawings of the present specification.

The tray stacking unit 40 includes a plurality of stacking units 41 on which the tray T is stacked and an elevator 42 for moving the stacking units 41 up and down to the height of the gripper 21.

The loading unit 41 is formed on the inner side of the front and rear sides of the loading unit so as to be vertically and vertically spaced apart from the loading unit 41 so that the trays T are individually stored in the loading unit 41.

The elevator 42 is vertically installed at the lower portion of the loading box to vertically move the supporting member 41a on which the loading box is mounted. Various known techniques can be applied to the elevating and lowering method.

In addition, the supporting member 41a is provided with a sensor (not shown) for detecting whether or not the loading box is loaded.

Hereinafter, a specific operation of the solder cutting apparatus having the above-described structure will be described.

The solder preform SF is unfastened from the solder reel SR and the guide unit 14a is mounted on the mounting unit 11 and the support member 41a, And the end of the solder preform SF is inserted into the inlet of the transfer path 12a under the transfer roller 12b.

When the solder cutting device is operated after the cutting length of the solder S is set, the elevator 42 is operated to move the empty tray T upward and downward to the same height as the gripper 21, The tray T is pulled out from the loading section 41 to transfer the tray T to the waiting position between the first horizontal frames 22.

At the same time, the solder supply unit 10 transfers the solder preform SF while the transporting roller 12b rotates, so that the end portion of the solder preform SF passes through the upper blade 13a and is drawn out to the upper surface of the lower blade 13b Thus, the solder preform (SF) to be drawn out at this time is always controlled in the same manner by the rotation of the feed roller 12b.

In this state, one of the pick-up heads 31 moved to the cutting standby position of the solder (that is, the upper portion of the lower blade 13b) is lowered to attract the lower end of the solder preform SF, The solder preform SF in the form of a metal thin film is broken by the stagger operation of the upper and lower blades 13a and 13b to cut the solder S. [

When the cutting of the solder S is completed, the pickup head 31 rises to return to the original state, and at the same time, the solder supply unit 10 operates to restart the drawing of the solder preform SF, 31 are moved to the upper portion of the lower blade 13b, and the cutting operation after the suction of the solder S is repeated.

When the suction of the cut solder S to both of the two or more pick-up heads 31 is completed, the second horizontal frame 32 and the pick-up heads 31 are separated from the empty seating groove Ta of the tray T The pickup head 31 is lowered and desorbed so that the respective solders S are simultaneously introduced into the seating grooves Ta of the tray T. [

When the insertion of the solder S is repeated and the insertion of the solder S cut into all of the seating grooves Ta of the tray T is completed, After the tray T is opened, the tray T is transported to and stored in the bin loading unit 41.

When the elevator 42 and the tray transfer unit 20 are operated again after storing the tray T and the vacant tray T is transferred to the job waiting position, the above operation is repeatedly resumed.

Therefore, the present invention can completely automate all the processes required for the cutting operation of the solder S, thereby accurately and precisely cutting and sorting and storing the solder S of an accurate specification, Production and solder non-classification, and the like, thereby improving productivity and reducing labor costs.

As described above, in the present invention, the solder S is conveyed through the suction of the pick-up head 31, and the pick-up head 31 used at this time is inevitably required to use a soft material such as rubber due to its vacuum adsorption structure .

If the suction of the solder S is repeated for a long time, the pick-up head 31 may be worn or damaged. This may prevent the accurate pickup of the solder S, The position of the solder S may be changed, which may result in failure in feeding or feeding of the solder S.

In order to prevent this, the pick-up head 31 must be made of a hard material such as a metal having high durability. However, as described above, it is essential that the pick-up head 31 is completely adhered to the solder S , Hard materials can not be used.

9, the outer body 31A of the hard material and the outer body 31A of the hard material are bonded to each other so that the suction of the solder S can always be guaranteed at the correct position irrespective of the durability deterioration of the pickup head 31. [ And a head portion 31B of a deformed pick-up head 31 'having a double adsorption structure.

The deformed pick-up head 31 'is composed of an outer body 31A made of a hard material such as metal and having an upper and lower hollow portion 31S and a flexible material such as rubber, And a head portion 31B coupled to be descendable.

Specifically, the outer body 31A has an elevating groove 31a formed in the vertical direction on the inner circumferential surface.

The outer end is hinged to the inner surface of the lifting groove 31a while being slidably coupled between the lifting groove 31a and the outer peripheral surface of the head 31B such that the outer end thereof is lifted up and down in the longitudinal direction of the lifting groove 31a And a lifting bar 31C hinged to the head 31B at an inner end thereof and formed to be telescopic and length-adjustable.

A lock switch 31b for unlocking the elevating bar 31C is provided on the lower stepped portion of the elevating groove 31a in a one-touch type so that one end of the elevating bar 31C is locked and locked at the next pressing, .

Although not shown in the figure, a spring for resiliently supporting the inner end of the lifting bar 31C is interposed in the lifting groove 31a, and the lock switch 31b is inserted into the spring.

When the head portion 31B is raised in the hollow portion 31S, the outer end of the lifting bar 31C is raised and pressed by the spring, The length of the bar 31C is shortened.

When the deformed pickup head 31 'is lowered for the suction of the solder S, the outer body 31A comes into contact with the upper surface of the solder S first.

In this state, when the deformed pickup head 31 'continues to be lowered, only the head portion 31B is lowered in a state where the lowering of the outer body 31A is stopped. At this time, the elevating bar 31C is moved along the elevating groove 31a As the spring is lowered together, the elastic force acts on the spring, and the solder S is pressed downward by the outer body 31A and fixed.

When the head portion 31B is completely lowered and the head portion 31B is in close contact with the upper surface of the solder S, both ends of the lifting bar 31C are rotated in a hinge structure to be long.

At this time, the outer end of the lifting bar 31C presses the lock switch 31b while the hinge structure is locked while being locked so that the head 31B is prevented from being lifted up. Due to the head portion 31B of the soft material, The solder S is sucked and fixed while the length of the solder S is finely shortened.

In this state, when the deformed pick-up head 31 'rises and moves down to the tray standby position and then drops again, the head portion 31B is finely lowered while the solder S is in contact with the seating groove Ta, The outer end of the lifting bar 31C is pressed downward and the lockup of the lifting bar 31C is released as the lock switch 31b is pressed again,

At this time, when the deformed pick-up head 31 'is lifted after the vacuum suction of the head part 31B is released, only the head part 31B is raised in the state where the outer body 31A is pressed downward by the elastic force of the spring And then the outer body 31A is lifted together with the head portion 31B.

Therefore, the deformed pick-up head 31 'constantly presses the solder S on the outer body 31A of the hard material during the attraction and release of the head portion 31B, Even if the durability of the solder S is lowered, the position of the solder S to be adsorbed is always made at the same position at all times to prevent the position of the solder S from being shifted, .

While the present invention has been particularly shown and described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, Should be interpreted as belonging to.

S: Solder SF: Solder preform
SR: Solder reel T: Tray
Ta: Seated groove
10: Solder supply unit 10a: Support block
11: mounting part 12:
12a: Feed path 12b: Feed roller
13: cutting portion 13a: upper blade
13b: lower blade 14: guide portion
20: Tray transfer unit 21: Gripper
22: first horizontal frame
30: Solder transfer unit 31: Pickup head
31 ': Variation pickup head 32: Second horizontal frame
40: tray loading unit 41:
42: elevator

Claims (4)

The present invention relates to a solder cutting apparatus for cutting a solder preform SF in a strip state by a predetermined length of solder S and then feeding the cut solder S into a tray T,
A transfer unit 12 for transferring the solder preform SF wound on the solder reel SR by a predetermined length and transferring the solder preform SF to the solder reed SR, A solder supply unit (10) comprising a cutting portion (13) for cutting a part;
A gripper (21) for fixing the tray (T); a tray transfer unit (20) having a transfer means for horizontally moving the tray (T);
A pick-up head which is horizontally movable forward, backward and leftward from the upper side of the tray transfer unit 20 and which sucks the solder S cut at the cutting portion 13 and inserts the solder S into the tray T of the gripper 21; A solder transfer unit (30) having a solder ball (31); And
A plurality of stacking portions 41 on which the tray T is stacked and an elevator 42 for raising and lowering each stacking portion 41 to the height of the gripper 21, A tray loading unit (40) in which a tray (T) is stored;
, ≪ / RTI >

The conveying unit 12 includes a conveying path 12a provided horizontally in the horizontal direction below the mounting unit 11 and a conveying roller 12b provided on the conveying path 12a,

The cutting unit 13 includes an upper blade 13a fixed to the upper portion of the feed path 12a to form an outlet of the feed path 12a and a lower blade 13b fixed to the lower end of the feed path 12a, And a blade 13b,

The pickup head 31 is lowered in a state in which the end of the solder preform SF drawn to the lower portion of the upper blade 13a is drawn out to the upper surface of the lower blade 13b lowered through the upper blade 13a, The lower blade 13b rises and the solder S is cut by the shifting operation of the upper and lower blades 13a and 13b after the end portion of the solder preform SF is suctioned and fixed. (31) moves and the solder (S) adsorbed is put into the tray (T).
The method according to claim 1,
The solder supply unit 10 includes a guide portion 14 disposed between the mounting portion 11 and the transfer path 12a in an arcuate shape and guiding an end portion of the solder preform SF to the entrance of the transfer path 12a And a solder bump formed on the substrate.
The method according to claim 1,
The pick-up head 31 includes an outer body 31A made of a hard material and having an upper and lower hollow portion 31S, a head portion 31b made of a soft material and displaceable in shape and coupled to move up and down by the hollow portion 31S 31B having a double adsorption structure, wherein the deformation pickup head 31 '

The outer body 31A has an elevation groove 31a formed in the vertical direction on the inner peripheral surface thereof,
The outer end is hinged to the inner surface of the elevating groove 31a while being slidingly coupled with the elevating groove 31a so as to move up and down in the longitudinal direction of the elevating groove 31a, A lift bar 31C hinged to the head portion 31B at an inner end thereof and formed in a telescopic type so as to be adjustable in length,
A lock switch 31b is provided on the lower stepped portion of the elevating groove 31a to lock the one end of the elevating bar 31C by one push and to release the fixing of the elevating bar 31C when the next pushing is performed, Respectively,
A spring for resiliently supporting the inner end of the lifting bar 31C upward is interposed in the lifting groove 31a, and the lock switch 31b is inserted into the spring to be coupled therewith,

The outer end of the lifting bar 31C is pressed upward by the spring to shorten the length of the lifting bar 31C when the head portion 31B is lifted by the hollow portion 31S,
When the deformed pick-up head 31 'is lowered for the suction of the solder S, after the outer body 31A contacts the upper surface of the solder S, the fall of the deformed pick-up head 31' As the elevating bar 31C descends along the elevating groove 31a while the head 31B is lowered while the lowering of the outer body 31A is stopped, the spring is compressed and the resilient force acts on the outer body 31A, The solder S is fixed while being pressed downward by the solder 31A,
Both ends of the lifting bar 31C are rotated in a hinge structure and the length thereof becomes long in a state in which the head portion 31B is in close contact with the upper surface of the solder S after the lowering of the head portion 31B is completed,
At this time, the outer end of the lifting bar 31C presses the lock switch 31b while the hinge structure is locked and locked so that the lifting of the head 31B is suppressed. As a result of the head portion 31B of the soft material, The solder S is sucked and fixed while the length of the solder 31C is finely shortened,
When the deformed pick-up head 31 'moves up to the waiting position of the tray T and then descends again, the head portion 31B is pressed down while the solder S is in contact with the seating groove Ta, The lower end of the lifting bar 31C is unlocked as the lock switch 31b is pressed again,
At this time, when the deformed pick-up head 31 'is lifted after the vacuum suction of the head part 31B is released, only the head part 31B is raised in the state where the outer body 31A is pressed downward by the elastic force of the spring And then the outer body (31A) rises together with the head part (31B).
4. The method according to any one of claims 1 to 3,
The solder transfer unit 30 includes two or more pickup heads 31 installed to move up and down so that two or more solders S are simultaneously transferred to the tray T, .

Images