JPH0555427A - Discharging device for ic product - Google Patents

Abstract

PURPOSE:To effectively discharge a product without deformation, etc., of a lead when products of pieces are discharged from a lead frame. CONSTITUTION:In a discharging device for an IC product to be used for a processing machine for processing a lead frame 20 as prescribed while feeding it by sizing and individually separating products into pieces from the product from the frame in a final step, sucking and supporting mechanisms 28, 30 for sucking and supporting the product 26 separated from the frame 20 into pieces, are provided at an upper mold side of a processing mold in the final step. A conveying mechanism having a conveying arm 36 for sucking the lower surface of the product 20 supported by the mechanism to receive the product and conveying the product to a position out of the mold from a receiving position of the upper mold, is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC product discharging device used in a lead frame processing machine.

[0002]

2. Description of the Related Art IC products are separated into individual products through processing steps such as resin molding of a lead frame, removal of resin burrs, and bending of outer leads into a predetermined shape. Here, when the outer lead is bent and formed, the processing is performed after the product is separated from the lead frame into individual pieces, and the case where the strip-shaped lead frame is processed and the individual pieces are separated from the lead frame in the final step. There is a method to separate products. The present invention relates to a device for discharging a product when a strip-shaped lead frame is fed at a constant size for processing.

FIG. 8 shows an apparatus for feeding and processing a strip-shaped lead frame at a constant size, and shows a portion for discharging a product in the final step. In the figure, arrow A indicates the feed direction of the lead frame,
B shows the arrangement position of the processing die. Numerals 5a and 5b are feed arms for feeding the lead frame at a fixed size, and a feed rod 6 reciprocating at a predetermined feed pitch in the feed direction of the lead frame.
It is locked by and reciprocates. Feed pins are provided upright on the lower surfaces of the feed arms 5a and 5b, and they slide into the guide holes of the lead frame to position and transport the lead frame at the time of constant size feeding. Reference numeral 7 denotes a discharge arm that reciprocates in a direction orthogonal to the feed direction of the lead frame. The discharge arm 7 is for transferring the product separated from the lead frame into individual pieces to the discharge line C. At the tip of the discharge arm 7, the product separated into individual pieces from the lead frame is located at a lower position. A receiving pocket 7a is provided, and a suction portion is provided in the pocket 7a so as to suck the product with air at the time of discharging.

[0004]

The above-mentioned discharging device receives the individualized product in the pocket 7a, advances the discharging arm 7 from the mold to the discharging line and transfers it to the discharging line, and the discharging arm 7 is transferred to the metallic mold. The next processing is performed by retracting to the mold position. The lead frame is fed at a constant size by the feed arms 5a and 5b while the ejection arm 7 reciprocates. As described above, in the conventional discharging device, since the discharging arm 7 is moved below the processing mold, burrs and the like generated during processing are likely to accumulate in the discharging arm 7, which may stain the product. , When the product passes through the mold at the time of discharging, the lead may hit foreign matter and the lead may be deformed or the product may be rubbed to leave marks, and the discharging arm 7 has a large stroke so that the discharging speed of the product does not increase. There was a problem such as. Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to provide an IC product discharging device capable of efficiently discharging products without causing deformation of the leads. It is the one we are trying to provide.

[0005]

The present invention has the following constitution in order to achieve the above object. In other words, an IC used in a processing machine that performs the required processing while feeding the lead frame at a constant size, and separates the product from the lead frame into individual pieces in the final step.
In the product discharging device, a suction support mechanism for sucking and supporting the product separated from the lead frame into individual pieces is provided on the upper die side of the processing die in the final step, and the product supported by the suction support mechanism is provided. The present invention is characterized by providing a carry-out mechanism having a carry-out arm for sucking the lower surface to receive the product and carrying out the product from the receiving position in the upper mold to the position outside the mold.

[0006]

Function When the lead frame is processed while being fed at a constant size and the product is separated from the lead frame into individual pieces in the final step, the product is sucked and picked up by the upper die side by the suction support mechanism. When the upper mold is lifted and the product is lifted, the carry-out mechanism is operated to receive the product by the carry-out arm, and the product is carried out of the mold and discharged.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is an explanatory view of an embodiment of an IC product discharging device as seen from the lead frame feed direction side, and FIG. 2 is an illustration as seen from the side orthogonal to the lead frame feed direction. The discharge device of the present embodiment is characterized in that when the product is finally separated from the lead frame into individual pieces, the product is adsorbed and supported by the upper mold, and the product is received from the upper mold and delivered to the discharge line. And

In FIG. 1, 10 is a lower die, 12 is a die bed, and 14 is a feed plate. The feed plate 14 is supported so that it can move up and down, and when the lead frame 20 is fed at a fixed size, the lead frame is lifted from the die surface of the lower die to support the lead frame at a fixed size.
On the upper die side, 22 is a stripper plate, and 24 is an upper die set. The upper die is provided with a knockout and a punch for sandwiching and supporting the product with the lower die 10. The lead frame is sandwiched as a suction mechanism for sucking and supporting the product when the product 26 is separated into individual pieces. A pressing rod 30 that comes into contact with the resin mold portion and adsorbs the product when pressed is slidably provided in the upper mold. An air flow path communicating with the suction pad 28 is provided in the pressing rod 30 to communicate with an external air suction mechanism. A spring 32 that elastically biases the pressing rod 30 downward is provided at the base end of the pressing rod 30.

Next, the product unloading mechanism in this embodiment will be described. Reference numeral 34 denotes a rotary actuator that is installed at a side position of the lower die 10 with its drive shaft facing upward. The drive shaft is rotatably movably mounted on the drive shaft in a horizontal plane at an intermediate height position between the upper die and the lower die. The base end of is fixed. A suction pad 38 for adsorbing the product 26 is provided on the upper surface of the tip of the carry-out arm 36, and when the tip of the carry-out arm 36 is swung into the middle of the upper mold and the lower mold, the suction pad 38 is directly below the product 26. The disposition of the carry-out arm 36 is set so that 38 is positioned. As shown in FIG. 2, the entire rotary actuator 34 is fixed to one end side of the support plate 40, and the base end portion of the support plate 40 is connected to a vertical movement cylinder 42 for moving the support plate 40 up and down. The support plate 40 is provided on the lower surface of the support plate 40.
An LM guide 44 for guiding the vertical movement of the LM is provided.

Next, the operation of the IC product discharging apparatus of the above embodiment will be described. First, the lead frame 20 is supported by the feed plate 14, is fed by a fixed size, and is conveyed to a predetermined lower die 10 position, and the upper die is lowered to clamp and support the lead frame 20 with the lower die. ,
The product is subjected to predetermined processing to separate the product into individual pieces. As the upper die descends, the pressing rod 30 also descends, and the suction pad 28
Comes into contact with the resin mold portion of the product and sucks the product by the air suction mechanism. When processing is completed and the upper mold rises,
The product 26 is lifted together with the upper mold while being sucked by the suction pad 28.

The carrying-out arm 36 is swung in from the outer position to the inner side at the same timing as the rising of the upper mold, and stops at the position below the product 26. Along with that, the vertical movement cylinder 4
2 is driven, and the support plate 40 is pushed up to the upper position where the suction pad 38 of the carry-out arm 36 contacts the lower surface of the product 26. Switching the air adsorption to remove the upper arm 36
The product 26 is delivered to and the unloading arm 36 is rotated to the outside to carry the product out of the mold. At the position where the product is carried out by the carry-out arm 36, the product is discharged from the carry-out arm 36 to the discharge line. Carrying out arm 3
When 6 is rotated to the outer position, the unloading arm 36 is lowered from the upper position to the lower position to prepare for the next product unloading operation.
The lead frame is fed at a fixed size when the carry-out arm 36 is rotated outward, and is prepared for the next processing. FIG. 3 shows how the carry-out arm 36 rotates between a position for receiving a product below the mold and a position for discharging the product outside the mold. As shown in the figure, the unloading arm 36 reciprocally rotates in a range of approximately 90 ° so that products can be unloaded sequentially in accordance with the processing operation by the mold.

4 and 5 show another embodiment of the IC product discharging device. In the apparatus of this embodiment, the carrying-out operation is performed by linearly reciprocating the carrying-out arm 36 in the same direction as the direction in which the lead frame is fed at a constant size. FIG. 4 shows a plane arrangement attached to the die bed 12, and FIG. 5 shows a side arrangement. The carry-out arm 36 is supported on the side surface of the moving plate 54 which is guided in the constant-size feed direction of the lead frame by the LM guide 52 provided on the vertically moving plate 50 mounted so as to be vertically movable between the posts 60a and 60b. 1
The tip extends to the processing position of the lead frame in 2.
56 is a moving plate 54 guided by the LM guide 52
It is a rodless cylinder that reciprocates. The rodless cylinder 56 is fixed to the vertical movement plate 50,
The drive shaft end is connected to the moving plate 54 via an L-shaped member 58. The vertical movement plate 50 is vertically movable by providing the LM guides 62 on each of the posts 60a and 60b as described above, and the vertical movement cylinder 64 is provided on the lower surface of the vertical movement plate 50 as shown in FIG. Driven to.

The IC product discharging device of this embodiment discharges the product by moving the carry-out arm 36 in the constant-size feed direction of the lead frame. Although the structure is different from that of the above embodiment, the discharging function is It is almost the same. That is, the lead frame is processed while the carry-out arm 36 is outside the mold, and the lead frame is separated into individual pieces and sucked by the upper mold suction pad 28, and the product is lifted together with the upper mold. Enters the lower part of the product, the vertical movement plate 50 rises, the product is adsorbed by the adsorption pad 38 of the unloading arm 36, and the product is delivered out of the mold. Carrying out arm 3
The linear movement of 6 is made by the operation of the rodless cylinder 56, and the vertical movement is made by the driving of the vertical movement cylinder 64. In this way, the products can be sequentially discharged by linearly driving the carry-out arm 36 and delivering the product in synchronization with the processing operation of the lead frame.

FIG. 6 is an explanatory view showing still another embodiment of the IC product discharging device. This embodiment is characterized in that the feed arm for feeding the lead frame at a constant size is also used as the carry-out arm for carrying out the product. FIG. 6 shows a feed arm 70 for feeding the lead frame at a fixed size when the lead frame is viewed from the feed direction. The feed arm 70 extends horizontally from the side of the mold to a position above the feed plate 14, and the feed pin 7 is provided on the lower surface on the extension end side.
2 are erected. FIG. 7 shows a plan view of the feed arm 70. As shown in the figure, the suction portion 74 is projected from the side surface of the feed arm 70, and the suction pad 38 is provided on the upper surface of the suction portion 74. A flow path 76 for sucking air is provided inside the suction section 74 and the feed arm 70 to communicate with the air suction mechanism. Figure 6
Reference numeral 78 is a linear guide for guiding the vertical movement of the feed arm 70, 80 is a spring for urging the feed arm 70 downward, and 82 is a drive cylinder for pushing the feed arm 70. Reference numeral 84 is an LM guide which guides the feed arm 70 in the feed direction when the feed arm 70 is fed at a constant size.

Explaining the discharge operation of the product in this embodiment, when the feed arm 70 feeds the lead frame 20 at a fixed size, it temporarily stops at that position, and the lead frame that has been fed at a fixed size is processed in that state. Is given. The product separated into individual pieces by processing is lifted together with the upper mold as in the above-described embodiment. The feed arm 70 that has moved to the previous position after the fixed-size feed returns to the original position for the next fixed-size feed. When the feed arm 70 returns to the original position, the drive cylinder 82 is operated to raise the feed arm 70, bring the suction pad 38 into contact with the lower surface of the product 26, and deliver the product 26 to the feed arm 70 side. Drive cylinder 8
By removing the air of 2, the feed arm 70 descends, the feed pin 72 engages with the lead frame, and the lead frame is fed in the constant size. In this state, the lead frame is fed at a fixed size by operating the fixed feed mechanism. The feed arm 70 feeds the lead frame 20 at a fixed size, so that the product 26 sucked and supported by the feed arm 70 is simultaneously carried forward by the feed pitch. That is, since the product 26 is unloaded laterally by the movement of the feed arm 34, when the product 26 is moved to the lateral position, it is discharged by, for example, receiving the product 26 by a suction arm for discharging and moving it to the discharge line. Thus
Each time the feed arm 70 feeds the lead frame by a fixed size, the feed arm 70 can receive the product 26 and can discharge the product 26 at the same time as the fixed size feed.

In each of the IC product discharging devices described in the above embodiments, the product separated from the lead frame is suction-supported by the upper mold side, and the product is transferred from the upper mold to the carry-out arm to reach the discharging position. Since the processing scraps when the lead frame is processed do not adhere to the product and the processed product is lifted and discharged, the product does not come into contact with foreign matter when discharging the product. It is possible to eliminate the problem that the lead is deformed. In addition, since the product is carried out using the carry-out arm, a pusher for discharging is not required, and the discharging speed of the product can be increased and the processing capacity can be improved.
Since the movement position accuracy of the carry-out arm is high, it is possible to deliver the product accurately, and it is possible to prevent occurrence of abnormalities when the product is discharged.

[0017]

As described above, according to the IC product discharging apparatus of the present invention, since the product is picked up and carried out by the upper mold side, the product does not hit a foreign substance during discharging, and the lead is removed. It can be reliably discharged without causing deformation or the like. In addition, the product can be efficiently discharged by discharging the product using the carry-out arm.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of an IC product discharging device as seen from the front direction.

FIG. 2 is an explanatory view showing an embodiment of an IC product discharging device as seen from a side direction.

FIG. 3 is an explanatory diagram showing a state in which a carry-out arm rotates.

FIG. 4 is an explanatory view of another embodiment of the IC product discharging device as seen from the plane direction.

FIG. 5 is an explanatory view of another embodiment of the IC product discharging device as seen from the front direction.

FIG. 6 is an explanatory view of still another embodiment of the IC product discharging device as seen from the front direction.

FIG. 7 is an explanatory diagram showing the structure of a feed arm.

FIG. 8 is an explanatory diagram showing a conventional example of an IC product discharging device.

[Explanation of symbols]

 10 Lower Die 20 Lead Frame 22 Stripper Plate 26 Product 28, 38 Adsorption Pad 30 Push Rod 34 Rotary Actuator 36 Carrying Out Arm 40 Support Plate 42 Vertical Cylinder 44, 52, 62, 78 LM Guide 50 Vertical Motion Plate 56 Rodless Cylinder 60a, 60b Post 64 Vertical movement cylinder 70 Feed arm 74 Adsorption part 82 Drive cylinder

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location H01L 21/68 A 8418-4M

Claims (1)

[Claims] 1. A discharge device for an IC product used in a processing machine, wherein a lead frame is subjected to a predetermined size while being subjected to a required processing, and a product is separated from the lead frame into individual pieces in a final step. The upper die side is provided with an adsorption support mechanism for adsorbing and supporting the product separated from the lead frame into individual pieces, and the lower surface of the product supported by the adsorption support mechanism is adsorbed to receive the product, and the upper die side An IC product discharging device comprising a carry-out mechanism having a carry-out arm for carrying out a product from a receiving position of the product to a position outside the mold.