JP2006319345A - Part mounting apparatus and part mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a part mounting apparatus and a part mounting method capable of accurately and efficiently mounting parts such as film electronic parts on a substrate such as a glass substrate. <P>SOLUTION: A measuring device 21 moves along the edge part of a glass substrate 31 and measures the distance between the measuring device 21 and the glass substrate 31 at a predetermined position on the way during movement. Here, the measurement result by the measuring device 21 is sent to a controller 22 and in the controller 22, the state of deformation of the glass substrate 31 is acquired based on the measurement result, and the suction force of a suction pad 12 of a substrate conveying unit 10 is controlled. By causing the suction force to act on the suction pad 12, the glass substrate 31 to be conveyed by the substrate conveying unit 10 receives, as a result, the downward suction force by the suction pad 12 and the upward reaction force of a prop 13, and the local warp of the glass substrate 31 is corrected and at the same time, the height of the glass substrate 31, the height of the upper end of the prop 13 being a standard of reference, is held evenly. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate.

  2. Description of the Related Art Conventionally, as a component mounting apparatus for manufacturing a flat panel display such as a liquid crystal panel, a component mounting apparatus for mounting a film-shaped electronic component (hereinafter referred to as “film electronic component”) on a glass substrate is known.

  In such a component mounting apparatus, the relative positional relationship between the glass substrate transported by the substrate transport unit and the film electronic component transported by the component transport unit is recognized using an imaging device and an image processing device, Based on the recognized position data, the film electronic component is positioned at a predetermined position on the edge of the glass substrate. Thereafter, in a state where the edge of the glass substrate is supported from the lower surface side by the backup tool, the film electronic component is mounted on the edge of the glass substrate by a crimping tool via a connecting member such as an anisotropic conductive film.

  By the way, the glass substrate on which the film electronic component is mounted in this manner tends to increase in size, and as a result, deformation such as warpage is likely to occur. When the edge of the glass substrate is supported by the backup tool in a state where such deformation occurs, when the film electronic component is mounted on the edge of the glass substrate by the crimping tool, The sliding of components occurs, and the mounting accuracy of the film electronic component on the glass substrate is remarkably lowered.

  For this reason, conventionally, prior to mounting the film electronic component on the edge of the glass substrate, a method of correcting the warp of the glass substrate by a correction unit has been proposed.

  FIG. 7 is a diagram showing a component mounting apparatus for realizing such a method. As shown in FIG. 7, the glass substrate 31 is transported to the mounting position by the substrate transport unit 60. When the glass substrate 31 is conveyed to the mounting position, the backup tool 63 rises and supports the edge of the glass substrate 31 from the lower surface side. Thereafter, the correction unit 65 is lowered, and the glass substrate 31 supported by the backup tool 63 is pressed downward to correct the curvature of the edge of the glass substrate 31. Finally, the crimping tool 64 descends, and the film electronic component 32 is mounted on the edge of the glass substrate 31 corrected by the correction unit 65 via the connection member 33 such as an anisotropic conductive film. Note that a plurality of suction pads 62 that can be vertically expanded and contracted to suck and hold the lower surface of the glass substrate 31 are provided on the transport stage 61 of the substrate transport unit 60.

  However, the above-described conventional method has a problem that a large warp or a local warp generated in the glass substrate 31 cannot be sufficiently corrected due to restrictions on the pressing position and pressing force of the correction unit 65 (FIG. 8). reference).

  Further, in the conventional method described above, the glass substrate 31 is held by the plurality of suction pads 62 of the substrate transport unit 60, so that when the glass substrate 31 is pressed by the correction unit 65, the relative relationship between the glass substrate 31 and the transport stage 61. There is a problem that the general positional relationship is likely to change, and the mounting accuracy of the film electronic component 32 on the glass substrate 31 is likely to be lowered.

  Furthermore, in the conventional method described above, since the correction unit 65 must be driven every time the film electronic component 32 is mounted on the edge of the glass substrate 31, there is a problem that the throughput of the final product is lowered.

  The present invention has been made in consideration of such points, and a component mounting apparatus and a component mounting method capable of accurately and efficiently mounting a component such as a film electronic component on a substrate such as a glass substrate. The purpose is to provide.

  The present invention provides a component mounting apparatus for mounting an electronic component on a substrate, a substrate transport unit that transports the substrate, a backup tool that supports an edge of the substrate transported by the substrate transport unit, and the substrate A crimping tool that is provided opposite to the backup tool and crimps an electronic component to the edge of the substrate, and the substrate transport unit includes a transport stage and a lower surface of the substrate provided on the edge of the transport stage. Provided is a component mounting apparatus comprising: a plurality of suction pads to be sucked; and a plurality of support portions that are provided at an edge of the transfer stage and support the lower surface of the substrate in cooperation with the suction pads. .

  In the present invention, it is preferable that the suction pads and the support portions are alternately arranged. The plurality of suction pads are provided along an edge portion of the transfer stage, and the support portion is adjacent to the suction pad on the edge side or on the side opposite to the edge portion. You may arrange | position in the adjacent position. Moreover, it is preferable to further include a suction force adjusting mechanism that adjusts the suction force of the suction pad according to the deformation state of the substrate. Furthermore, it is preferable to further include a measuring device that measures the deformation state of the substrate, and a control device that controls the suction force of the suction pad of the substrate transport unit based on the measurement result by the measuring device. Furthermore, it is preferable that the substrate transport unit has a mechanism for adjusting an attachment position of the suction pad or the support portion according to a deformation state of the substrate. Moreover, it is preferable that the said board | substrate conveyance unit has a mechanism for adjusting the height of the said support part with respect to the said conveyance stage.

  According to another aspect of the present invention, there is provided a component mounting method for mounting an electronic component on a substrate, a step of supporting the substrate on the transfer stage by a plurality of suction pads and a plurality of support portions provided on the transfer stage, and the transfer Measuring the deformation state of the substrate supported on the stage, and depending on the measured deformation state of the substrate, the suction force of the suction pad, the attachment position of the suction pad on the transfer stage, The step of adjusting at least one of the mounting position of the support part on the transfer stage and the height of the support part, and the support stage being supported on the transfer stage by moving the transfer stage There is provided a component mounting method comprising a step of transporting a substrate to a mounting position and a step of mounting a component on the substrate transported to the mounting position.

  According to the present invention, a plurality of suction pads and support portions are provided at the edge of the transfer stage, and a warp generated on the substrate due to a downward suction force by the suction pads and an upward reaction force by the support portions. Since the deformation is corrected, it is possible to effectively correct a large warp or a local warp generated on the substrate, and to keep the substrate height uniform with respect to the height of the upper end of the support portion. Therefore, it is possible to mount components on the board with high accuracy and efficiency.

  Embodiments of the present invention will be described below with reference to the drawings.

  First, the overall configuration of the component mounting apparatus according to the present invention will be described with reference to FIGS. 4A and 4B.

  4A and 4B, the component mounting apparatus 1 is for mounting a film electronic component 32 on a glass substrate 31, and includes a crimping tool 24 and a transfer mechanism 41 that transports the crimping tool 24. In addition, the film electronic component 32 adsorbed by the crimping tool 24 can be mounted on the glass substrate 31. The transfer mechanism 41 includes a Z-direction moving device 42 that moves the crimping tool 24 in the vertical direction (Z direction), and a Y-direction moving device that moves the crimping tool 24 in the horizontal direction (Y direction) together with the Z-direction moving device 42. 43, and the film electronic component 32 sucked by the crimping tool 24 can be transferred from the component delivery position T to the component mounting position B (the edge of the glass substrate 31).

  Here, the film electronic component 32 is supplied from a component supply device 44 including a tray, a punching mechanism, and the like, and is transferred to the intermediate stage 49 by the component extraction mechanism 45. Further, the component take-out mechanism 45 moves the suction nozzle 46 in the Y direction together with the suction nozzle 46 that sucks the film electronic component 32, the Z-direction moving device 47 that moves the suction nozzle 46 in the Z direction, and the Z-direction transfer device 47. And a Y-direction moving device 48 to be moved. The intermediate stage 49 includes a mounting table 50 on which the film electronic component 32 is mounted and an X-direction moving device 51 that moves the mounting table 50 in the horizontal direction (X direction).

  The above-described component supply mechanism 44, component extraction mechanism 45, intermediate stage 49, transfer mechanism 41, component crimping tool 24, and the like constitute a component transport unit.

  On the other hand, the glass substrate 31 on which the film electronic component 32 is mounted is transported by the substrate transport unit 10. The substrate transport unit 10 includes a transport stage 11 and an X table 54, a Y table 55, and a θ table 56 that move the transport stage 11 in the X direction, the Y direction, and the θ direction. A backup tool 23 is provided at the component mounting position B so as to face the crimping tool 24 positioned at the component mounting position B, and the film electronic component 32 is mounted on the glass substrate 31 by the crimping tool 24. In this case, the edge of the glass substrate 31 conveyed to the component mounting position B by the substrate conveying unit 10 is supported from the lower surface side. Further, at the component mounting position B, an imaging device 35 that images the glass substrate 31 and the film electronic component 32 is provided. The backup tool 23 is retracted from the visual field when the glass substrate 31 and the film electronic component 32 are imaged by the imaging device 35. Here, positioning marks are respectively provided on the glass substrate 31 and the film electronic component 32, and an imaging region including these positioning marks is imaged by the imaging device 35. The imaging result captured by the imaging device 35 is processed by an image processing device (not shown), and the positions of the glass substrate 31 and the film electronic component 32 are recognized.

  Next, details of the substrate transfer unit 10 shown in FIG. 1 will be described with reference to FIGS. 1, 2A and 2B.

  As shown in FIG. 1, FIG. 2A and FIG. 2B, the substrate transport unit 10 includes a transport stage 11, a plurality of suction pads 12 that are provided along the edge of the transport stage 11 and suck the lower surface of the glass substrate 31, A plurality of columns (supports) 13 are provided along the edge of the transfer stage 11 to support the lower surface of the glass substrate 31 in cooperation with the suction pad 12.

  Here, the transfer stage 11 is formed in substantially the same shape as the glass substrate 31 and slightly smaller than the glass substrate 31. The size of the transport stage 11 is such that the transport stage 11 interferes with the backup tool 23 and the crimping tool 24 when the edge of the glass substrate 31 is inserted between the backup tool 23 and the crimping tool 24. It is preferable that it is not so much. Moreover, it is preferable that the conveyance stage 11 is formed from materials, such as a metal and resin.

  Further, the suction pads 12 and the support pillars 13 are alternately arranged along the edge of the transfer stage 11. In addition, the support | pillar 13 can take various shapes, such as a prism shape and a hemisphere other than the column shape as shown in FIG.1, FIG.2A and FIG.2B. Moreover, it is preferable that the support | pillar 13 is formed with the material (for example, metal etc.) which does not change easily.

  The transfer stage 11 is provided with a slide groove 11a along the edge thereof, and the suction pad 12 and the support column 13 are moved along the slide groove 11a, so that the glass substrate 31 is deformed. The attachment positions of the suction pad 12 and the column 13 can be adjusted.

  Further, in relation to the substrate transport unit 10, a measuring device 21 that measures a deformation state of the glass substrate 31 transported by the substrate transport unit 10, and a suction pad 12 of the substrate transport unit 10 based on a measurement result by the measuring device 21. And a control device 22 for controlling the attraction force. The measuring instrument 21 is movably supported along the edge of the glass substrate 31, and the distance between the measuring instrument 21 and the glass substrate 31 is measured at a predetermined position during the movement. As the measuring device 21, a laser displacement meter or the like that measures the distance using reflection of laser light or the like can be used.

  The suction pads 12 of the substrate transport unit 10 are connected to the vacuum source 38 via the pressure regulator 39 and the electromagnetic switching valve 40, respectively, and are controlled according to the measurement result by the measuring instrument 21 (the deformation state of the glass substrate 31). By controlling the pressure regulator 39 and the electromagnetic switching valve 40 by the device 22, the suction force of the suction pad 12 can be individually adjusted. The vacuum source 38, the pressure regulator 39, and the electromagnetic switching valve 40 constitute an adsorption force adjustment mechanism.

  Next, the operation of the present embodiment having such a configuration will be described.

  4A and 4B, the film electronic component 32 is supplied from the component supply device 44 and transferred to the intermediate stage 49 by the component take-out mechanism 45. Here, after the film electronic component 32 is sucked by the suction nozzle 46, the component take-out mechanism 45 moves the suction nozzle 46 in the Z direction and the Y direction by the Z direction transfer device 47 and the Y direction movement device 48. The film electronic component 32 adsorbed on is transferred to the mounting stage 50 of the intermediate stage 49.

  Thereafter, the intermediate stage 49 moves the mounting table 50 in the X direction by the X-direction moving device 51, and transports the film electronic component 32 mounted on the mounting table 50 to the component delivery position T.

  In this state, the transfer mechanism 41 moves the crimping tool 24 in the Z direction and the Y direction by the Z direction moving device 42 and the Y direction moving device 43, and the intermediate stage 49 is moved by the crimping tool 24 at the component delivery position T. After the film electronic component 32 placed on the mounting table 50 is sucked, the film electronic component 32 sucked by the crimping tool 24 is transferred from the component delivery position T to the component mounting position B (the edge of the glass substrate 31). .

  On the other hand, in the substrate transport unit 10, as shown in FIG. 1, the measuring instrument 21 is moved along the edge of the glass substrate 31 while the glass substrate 31 is supported by the suction pad 12 and the support column 13 of the transport stage 11. Then, the distance between the measuring instrument 21 and the glass substrate 31 is measured at a predetermined position during the movement (for example, a position corresponding to the attachment position of the suction pad 12 and the column 13). Here, the measurement result by the measuring device 21 is sent to the control device 22, and the control device 22 obtains the deformation state of the glass substrate 31 based on the measurement result. Based on this, the pressure regulator 39 and the electromagnetic switching valve are obtained. By controlling 40, the suction force of the suction pad 12 of the substrate transport unit 10 is adjusted. For example, the control device 22 uses the largest measured value among the measured values measured for each measurement position as a reference, and compares the measured value at the measurement position with the measured value based on the reference for each measurement position. The difference is obtained, and the pressure regulator 39 is controlled so that the suction force of the suction pad 12 increases as the difference increases. Here, the magnitude of the adsorption force (control amount of the pressure regulator 39) according to the difference from the reference measurement value may be measured in advance by experiments or the like and set in the control device 22.

  Specifically, for example, when local warpage occurs at equal intervals over the entire glass substrate 31 (see the phantom line in FIG. 3A), the same suction force (with respect to all suction pads 12) ( (See the arrow in FIG. 3A). As a result, the glass substrate 31 transported by the substrate transport unit 10 receives the downward suction force by the suction pad 12 and the upward reaction force by the support column 13, and the local warpage of the glass substrate 31. Is corrected, and the height of the glass substrate 31 is kept uniform with reference to the height of the upper end of the column 13 (see the solid line in FIG. 3A).

  In addition, when the big curvature has arisen over the whole edge part of the glass substrate 31 (refer the virtual line of FIG. 3B), it seems to increase as it goes to the center part from the edge part of the glass substrate 31 with respect to the suction pad 12. FIG. Adsorption force (see arrow in FIG. 3B) is applied. As a result, the glass substrate 31 transported by the substrate transport unit 10 receives a larger adsorbing force at the center portion where warpage is larger than the end portion where warpage is small, and the large warpage of the glass substrate 31 is effectively corrected. (See the solid line in FIG. 3B).

  Moreover, when the local curvature which is not equal intervals has arisen over the whole glass substrate 31 (refer the virtual line of FIG. 3C), the attachment position of the suction pad 12 and the support | pillar 13 is made into the magnitude | size and position of curvature. After changing accordingly (see FIG. 3C), the suction force (see the arrow in FIG. 3C) is applied to the suction pad 12. Thereby, the glass substrate 31 conveyed by the substrate conveyance unit 10 receives the downward adsorption force at the warped portion, and the local warpage of the glass substrate 31 is effectively corrected ( (See solid line in FIG. 3C).

  The glass substrate 31 whose warpage has been corrected in this way is transported to the component mounting position B by the substrate transport unit 10. In order to align the glass substrate 31 thus transported by the substrate transport unit 10 and the film electronic component 32 transported while being attracted by the crimping tool 24 by the transport mechanism 41, the imaging device and the image The processing apparatus is used to recognize the relative positional relationship, and the film electronic component 32 is positioned at a predetermined position on the edge of the glass substrate 31 based on the recognized position data.

  Thereafter, based on the position data recognized in this way, the crimping tool 24 is moved by the Z-direction moving device 42 and the Y-direction moving device 43 of the transfer mechanism 41, or the X table 54 and Y table of the substrate transport unit 10. By moving the transport stage 11 by the 55 and the θ table 56, the film electronic component 32 adsorbed by the crimping tool 24 is aligned with the glass substrate 31.

  Finally, the film electronic component 32 adsorbed by the crimping tool 24 is pressed against the glass substrate 31 with the backup tool 23 supporting the edge of the glass substrate 31 from the lower surface side, and the anisotropic conductive film. A film electronic component 32 is temporarily attached on the glass substrate 31 via a connecting member (not shown) such as the above. In addition, the film electronic component 32 temporarily attached on the glass substrate 31 in this way is finally pressure-bonded by a heating / pressurizing unit (not shown).

  As described above, according to the present embodiment, a plurality of suction pads 12 and support pillars 13 are provided at the edge of the transport stage 11, and the downward suction force by the suction pads 12 and the upward reaction force by the support pillars 13 are Accordingly, deformation such as warpage generated in the glass substrate 31 is corrected, so that large warpage or local warpage generated in the glass substrate 31 can be effectively corrected and the height of the upper end of the column 13 can be increased. The height of the glass substrate 31 can be kept uniform with reference to the thickness. For this reason, the film electronic component 32 can be accurately mounted on the glass substrate 31. Further, since the correction operation by the correction unit that has been conventionally required is not required, the throughput of the final product is improved, and the film electronic component 32 can be efficiently mounted on the glass substrate 31.

  Further, according to the present embodiment, the suction force of the suction pad 12 and the attachment positions of the suction pad 12 and the support column 13 can be adjusted, so that deformation such as warping is appropriately performed according to the deformation state of the glass substrate 31. Can be corrected. Moreover, since the deformation state of the glass substrate 31 is measured by the measuring instrument 21 and the suction force of the suction pad 12 is controlled based on the measurement result, the warp of the glass substrate 31 can be automatically corrected.

  Furthermore, according to the present embodiment, the transfer stage 11 is formed in a flat plate shape slightly smaller than the glass substrate 31 and the suction pads 12 and the support pillars 13 are arranged along the edges thereof. The position in the vicinity of the edge is supported by the column 13. As a result, it is possible to prevent the length of the portion of the glass substrate 31 that protrudes outward from the arrangement position of the support columns 13 from being unnecessarily large, and the edge of the glass substrate 31 is bent (hangs down) by its own weight. This can be effectively prevented.

  In the above-described embodiment, the suction force of the suction pad 12 is adjusted by adjusting the suction force at the vacuum source 38 by the pressure regulator 39 and the electromagnetic switching valve 40. However, the present invention is not limited to this. Instead, the suction force of the suction pad may be adjusted by changing suction pads having different diameters.

  In the above-described embodiment, the attachment positions of the suction pad 12 and the column 13 are adjusted using the slide groove 11a provided at the edge of the transport stage 11, but the present invention is not limited to this. A plurality of holes for attaching the suction pad 12 or the support column 13 are provided on the stage 11, and the attachment position of the suction pad 12 and the support column 13 is adjusted by embedding the suction pad 12 or the support column 13 in an arbitrary hole. It may be. In addition, if a drive mechanism for moving the suction pad 12 and the column 13 along the slide groove 11a is provided, the attachment position of the suction pad 12 and the column 13 by the control device 22 based on the measurement result by the measuring instrument 21. Can be automatically adjusted.

  Further, in the above-described embodiment, the suction pad 12 and the support column 13 are fixedly attached to the transfer stage 11. However, the present invention is not limited thereto, and the suction pad 12 and the support column 13 are attached to the transfer stage 11. You may make it possible to adjust the height of the up-down direction according to rotation of the suction pad 12 and the support | pillar 13 by cutting a screw (refer the code | symbol 14 of FIG. 2B). In this manner, the height of the suction pad 12 and the support column 13 can be adjusted with respect to the transfer stage 11, so that the glass substrate 31 can be adjusted without being affected by processing accuracy or thermal deformation of the transfer stage 11. It becomes possible to correct the warp well. That is, the transfer stage 11 is made of a metal or resin and is formed in a flat plate shape that is slightly smaller than the glass substrate 31. Therefore, when the glass substrate 31 is enlarged, the transfer stage 11 is also enlarged accordingly. However, it is difficult to process such a large metal plate or resin plate flatly and accurately, and the transfer stage 11 may be distorted. Even if the transfer stage 11 is fixed to another member such as an XY table, even if it can be processed flat, distortion may occur due to the influence of the assembly accuracy of the other member. Even in such a case, if the height of the suction pad 12 and the support column 13 can be adjusted with respect to the transfer stage 11, the suction pad 12 and the support column 13 can be used regardless of the distortion of the transfer stage 11 as described above. The upper end height of the glass substrate 31 can be set uniformly, and as a result, the warp of the glass substrate 31 can be corrected satisfactorily. Moreover, you may make it adjust the height of the up-down direction by providing the slide mechanism and fixing mechanism for moving the suction pad 12 and the support | pillar 13 in the up-down direction. If a drive mechanism for moving the suction pad 12 and the support column 13 in the vertical direction is provided, the height of the suction pad 12 and the support column 13 in the vertical direction by the control device 22 based on the measurement result by the measuring instrument 21. Can be automatically adjusted.

  Furthermore, in the above-described embodiment, the suction pad 12 and the support column 13 can be moved along the edge of the transfer stage 11, but in addition to the direction along the edge, the direction orthogonal to the direction along the edge. It may be configured to be slidable. By doing in this way, the arrangement position of the suction pad 12 and the support | pillar 13 with respect to the edge part of the conveyance stage 11 can be adjusted according to the magnitude | size of the intensity | strength of the bending direction resulting from the difference in the thickness of the glass substrate 31, etc. It becomes possible, and the plurality of glass substrates 31 having different bending strengths can be adsorbed and supported at an optimal position where the drooping of the edge can be effectively removed while the warp is corrected well.

  Further, in the above-described embodiment, the suction pads 12 and the support columns 13 are alternately arranged on the conveyance stage 11, but not limited to this, the adsorption pads 12 and the columns 13 are arranged at predetermined intervals on the conveyance stage 11. You may make it arrange | position the support | pillar 13 with respect to each of the suction pad 12 by the predetermined | prescribed relationship (for example, one-to-one relationship). Specifically, for example, as shown in FIG. 5, a plurality of suction pads 12 are provided along the edge of the transfer stage 11 of the substrate transfer unit 10, and positions adjacent to the respective suction pads 12 on the edge side. The column 13 is provided at a position (position shown by a broken line in FIG. 5) or a position adjacent to the edge on the opposite side (position shown by a solid line in FIG. 5), or as shown in FIG. A plurality of cylindrical struts 13 can be arranged along the edge, and the suction pad 12 can be provided in the struts 13. Also in such a case, according to the deformation state of the glass substrate 31, the suction force of the suction pad 12, the attachment position of the suction pad 12 and the support | pillar 13, etc. are adjusted, or according to the magnitude | size of the curvature of the glass substrate 31. Thus, the warp of the glass substrate 31 can be corrected by adjusting the height of the support column 13.

  Furthermore, in the above-described embodiment, a non-contact type sensor such as a laser displacement meter is used as the measuring device 21, but the present invention is not limited to this, and a contact type displacement measuring device can also be used.

  Furthermore, in the embodiment described above, the measuring instrument 21 is moved along the edge of the glass substrate 31, but the glass substrate 31 may be moved with respect to the measuring instrument 21. In this case, since the X table 54 and the Y table 55 of the substrate transport unit 10 can be used as means for moving the glass substrate 31 relative to the measuring instrument 21, the measuring instrument 21 and the glass substrate 31 are relatively relative to each other. It is not necessary to provide a special moving device as means for moving the device to the device, and the device configuration can be simplified. In this case, the measuring instrument 21 can be integrally or detachably attached to the crimping tool 24 in addition to being fixedly disposed near the component mounting position B via a support or the like.

  In the above-described embodiment, when the deformation state of the glass substrate 31 is measured by the measuring instrument 21, the glass substrate 31 is supported by the suction pad 12 and the column 13 in a state where no suction force is applied to the suction pad 12. Alternatively, the glass substrate 31 may be supported by the suction pad 12 and the support column 13 in a state where the suction force is applied to the suction pad 12.

The figure which shows the principal part of one Embodiment of the component mounting apparatus by this invention. The top view and side view which show the detail of the board | substrate conveyance unit shown in FIG. 1, respectively. The top view and side view which show the detail of the board | substrate conveyance unit shown in FIG. 1, respectively. The figure for demonstrating the effect | action of the board | substrate conveyance unit shown to FIG. 2A and FIG. 2B. The figure for demonstrating the effect | action of the board | substrate conveyance unit shown to FIG. 2A and FIG. 2B. The figure for demonstrating the effect | action of the board | substrate conveyance unit shown to FIG. 2A and FIG. 2B. The side view and top view which respectively show the whole structure of the component mounting apparatus by this invention. The side view and top view which respectively show the whole structure of the component mounting apparatus by this invention. The figure which shows the modification of the board | substrate conveyance unit shown in FIG. The figure which shows the other modification of the board | substrate conveyance unit shown in FIG. The figure which shows the conventional component mounting apparatus. The figure for demonstrating the problem of the component mounting apparatus shown in FIG.

Claims (9)

In a component mounting apparatus that mounts electronic components on a board,
A substrate transfer unit for transferring a substrate;
A backup tool for supporting the edge of the substrate transported by the substrate transport unit;
A crimping tool that is provided opposite to the backup tool across the substrate and crimps an electronic component to an edge of the substrate;
The substrate transport unit includes a transport stage, a plurality of suction pads that are provided at an edge of the transport stage and sucks a lower surface of the substrate, and the suction pad that is provided at an edge of the transport stage and cooperates with the suction pad. A component mounting apparatus comprising: a plurality of support portions that support the lower surface of the substrate.   The component mounting apparatus according to claim 1, wherein the suction pads and the support portions are alternately arranged.   The plurality of suction pads are provided along an edge portion of the transfer stage, and the support portion is adjacent to the suction pad at a position adjacent to the edge portion or opposite to the edge portion. The component mounting apparatus according to claim 1, wherein the component mounting apparatus is disposed at a position.   The component mounting apparatus according to claim 1, further comprising a suction force adjusting mechanism that adjusts a suction force of the suction pad according to a deformation state of the substrate. A measuring instrument for measuring the deformation state of the substrate;
The component mounting apparatus according to claim 4, further comprising a control device that controls the suction force of the suction pad of the substrate transport unit based on a measurement result by the measuring instrument.   The component mounting apparatus according to claim 1, wherein the board transport unit includes a mechanism for adjusting an attachment position of the suction pad according to a deformation state of the board.   The component mounting apparatus according to claim 1, wherein the board transport unit includes a mechanism for adjusting an attachment position of the support portion according to a deformed state of the board.   The component mounting apparatus according to claim 1, wherein the substrate transfer unit includes a mechanism for adjusting a height of the support portion with respect to the transfer stage. In a component mounting method for mounting electronic components on a substrate,
A step of supporting a substrate on the transfer stage by a plurality of suction pads and a plurality of support portions provided on the transfer stage;
Measuring the deformation state of the substrate supported on the transfer stage;
According to the measured deformation state of the substrate, the suction force of the suction pad, the attachment position of the suction pad on the transfer stage, the attachment position of the support part on the transfer stage, and the support part Adjusting at least one of the heights;
A step of transferring the substrate supported on the transfer stage to a mounting position by moving the transfer stage;
Mounting the component on the substrate transported to the mounting position.

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