JP2011204908A - Substrate clamping device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an error in clamping a substrate by adequately changing setting of a clamping pressure in switching a model of the substrate.SOLUTION: As a printed board P received from an upstream side is conveyed by a substrate carrying conveyer, the printed board abuts on a descending stopper, is locked, and is positioned to stop the conveyance. Then, a backup table 1 is lifted, and an air cylinder 3 is operated. A clamping member 5 presses the printed board P on a fixing chute 2A and sandwiches a side surface to clamp and support the printed board P by both of them. In this case, a CPU 10 instructs an electropneumatic regulator 8 to clamp at a clamping pressure "1.4 Mpa" corresponding to the printed board P, and a pressure of air supplied to the air cylinder 3 is regulated by the electropneumatic regulator 8. Therefore, the clamping pressure becomes the appropriate one corresponding to the selected printed board P.

Description

  The present invention relates to a substrate clamping device that clamps a substrate by pressing the substrate against the other conveyance chute with a clamp member provided on one of the conveyance chutes. More specifically, the present invention relates to a substrate clamping device applied to a mounting work apparatus that constitutes a component mounting line for mounting electronic components. For example, a screen printing device that applies a solder paste on a printed board, and an adhesive that is applied to the printed board. The present invention relates to a substrate clamping device applied to a mounting work device such as an adhesive application device and an electronic component mounting device for mounting an electronic component on a printed circuit board.

  A screen printing machine as this type of mounting work apparatus is disclosed in, for example, Patent Document 1 and the like. The printed circuit board is transported by a transport device, the printed circuit board and the screen are aligned, and the coating agent is printed on the printed circuit board. It is applied on top. Here, the substrate is pressed and supported by the clamp member provided on the other conveyance chute on one conveyance chute, but the pressure for clamping the substrate at this time is adjusted by manually operating an analog regulator. In general, the adjustment is performed according to the thickness of the substrate.

  Thereby, when the thickness of the substrate is thin or the rigidity of the split substrate is small, the clamp pressure is reduced to prevent the substrate from warping. Also, if it is a printing machine, in order to increase the clamping pressure as much as possible within the range where the substrate does not warp so that the substrate does not shift during printing or substrate recognition, if it is a thick and rigid substrate, The clamp pressure is adjusted high.

JP 2000-211108 A

  However, since the operator manually adjusts the clamping pressure, even if the type of board is changed, if the clamping pressure is not changed, the pressure will be too high and the board will warp, or conversely, the clamping will be too low. However, there has been a problem that a printing misalignment, a clamp disengagement, etc. may occur in a printing press.

  Accordingly, an object of the present invention is to prevent a mistake in board clamping by appropriately changing the setting of the clamping pressure when changing the board model.

  Therefore, according to a first aspect of the present invention, in the substrate clamping device that clamps and supports the substrate by pressing the substrate against the other conveyance chute with a clamp member provided on one of the conveyance chutes, the clamp member is moved so as to press the substrate. An air cylinder, an electropneumatic regulator for adjusting the pressure of air supplied to the air cylinder, a storage device for storing pressure data of air supplied to the electropneumatic regulator for each type of board, And a control device for controlling the electropneumatic regulator based on air pressure data stored in the storage device corresponding to the substrate to be produced.

  According to a second aspect of the present invention, there is provided a substrate clamping device that clamps and supports a substrate by pressing the substrate against the other conveyance chute with a clamp member provided on one of the conveyance chutes, for moving the clamp member so as to press the substrate. Air cylinder, an electropneumatic regulator for adjusting the pressure of air supplied to the air cylinder, and a memory for storing pressure data of air supplied to the electropneumatic regulator according to at least the material and thickness of the substrate An apparatus and a control device for controlling the electropneumatic regulator based on air pressure data stored in the storage device corresponding to the substrate to be produced are provided.

  Further, a third invention is characterized in that, in the first or second invention, the storage device stores pressure data in accordance with a material, a thickness and a dimension in a pressing direction of the substrate.

  According to the present invention, the clamp pressure is appropriately changed when changing the substrate type, and mistakes in the substrate clamp can be prevented.

It is a top view of a board | substrate clamp apparatus. It is a right view of a board | substrate clamp apparatus. It is a figure which shows board | substrate information. It is a figure which shows the relationship data table in which the clamp pressure value was defined by the relationship between the material of a board | substrate, thickness, and the size of a Y direction. It is a figure which shows the flowchart concerning the change of the board clamp pressure accompanying the model switching of a printed circuit board.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. As a mounting work apparatus constituting a component mounting line for mounting electronic components on a printed circuit board, a solder paste is applied on the printed circuit board. There are screen printing apparatuses, adhesive application apparatuses that apply an adhesive on a printed circuit board, electronic component mounting apparatuses that mount electronic parts on a printed circuit board, etc. To do.

  This screen printing machine is for printing cream solder as a coating agent on a printed circuit board P, and includes a substrate support unit installed on the apparatus main body, and a Y extending above the substrate support unit and extending in the horizontal direction. A screen supported by a screen support unit having a moving mechanism for moving in the axial direction (front-rear direction of the screen printing machine), and a movement provided between the substrate support unit and the screen and provided with a substrate recognition camera, etc. A body, a screen recognition camera for imaging a screen recognition mark attached to the screen, and a printing mechanism provided above the screen with a squeegee.

  The substrate support unit is composed of a pair of substrate transfer conveyors configured to transfer a printed circuit board P in the X-axis direction and a moving mechanism (not shown) that can move in the X-axis direction, the angle direction in the horizontal plane, and the vertical direction. A plurality of suction holes (not shown) communicating with a vacuum suction source are formed, and can be moved in the Z direction (vertical direction) to suck the printed circuit board P from below and support it horizontally. A backup table 1 and a pair of conveyance chutes 2 arranged in the front and rear directions for guiding the conveyance of the printed circuit board are provided (see FIG. 2).

  The pair of conveyance chutes 2 includes a fixed chute 2A that guides conveyance of the printed circuit board P and supports the printed circuit board P from the side and a movable chute 2B. And according to the width size orthogonal to the conveyance direction of the printed circuit board P, the movable chute 2B is moved to and away from the fixed stationary chute 2A that does not move, and corresponds to the width size of the printed circuit board P to be handled. is there.

  Further, a clamp device is provided on the front surface (outside) of the movable chute 2B located outside the screen printing machine. In this clamping device, two cylinder mounting bodies 4 each having an air cylinder 3 as a drive source are fixed to the front surface of the movable chute 2B, and when both air cylinders 3 are operated, an L-shaped rod 3A extends. The clamp member 5 fixed to the upper part of the rod 3A is moved in the direction in which the printed board P is pressed.

  8 is an electropneumatic regulator (servo valve) that can adjust the pressure of air supplied from a compressed air supply source (not shown) to the air cylinder 3 steplessly. It is connected to a CPU 10 (Central Processing Unit) as a control device for controlling the system. The CPU 10 is connected to a RAM (Random Access Memory) 11 and a ROM (Read Only Memory) 12 as storage devices via a bus line. Then, the CPU 10 controls the operation related to the printing operation of the screen printer in accordance with the program stored in the ROM 12 based on the data stored in the RAM 11.

  The RAM 11 stores pattern program data, which is various information for each type of printed circuit board P, such as circuit board information as shown in FIG. That is, in the RAM 11, as shown in FIG. 3, the X direction (indicated by “X”) and the Y direction (direction in which the substrate is pressed, indicated by “Y”) for each type of printed circuit board P. The board information of the pattern program data such as the size of the thickness (indicated by “T”) and the material of the printed board P is stored. The substrate ID “PB001” means that the X direction is 200 mm, the Y direction is 200 mm, the thickness is 1.6 mm, and the material is a glass epoxy substrate made of glass epoxy resin.

  Further, the air supplied to the air cylinder 3 when the clamp member 5 presses and holds the printed circuit board P on the fixed chute 2A is adjusted by the electropneumatic regulator 8, but the clamp pressure value is printed as shown in FIG. The RAM 11 stores a relational data table determined by the relation among the material of the board P, the thickness of the printed board P, and the size in the Y direction (direction perpendicular to the transport direction of the printed board P).

  That is, for example, when the thickness is less than 0.5 mm and the size in the Y direction is less than 50 mm with a glass epoxy substrate, the clamping pressure is 1.6 Mpa (megapascal), and the thickness is 0.5 mm or more with a ceramic substrate. When the size is less than 0.8 mm and the size in the Y direction is not less than 75 mm and less than 100 mm, the clamping pressure is 1.4 Mpa.

  The clamping pressure may be determined according to the material and thickness of the substrate, and the size of the substrate in the Y direction is not necessarily considered.

  A monitor 13 as a display device and a touch panel switch 14 provided on the monitor 13 are connected to the CPU 10 via the interface 9, and the operator operates the touch panel switch 14, so that various types of screen printing are performed. Settings can be made.

  Next, based on the flowchart shown in FIG. 5, the change of the substrate clamp pressure in accordance with the model change of the printed circuit board P will be described. First, in the model switching, when the printed board P to be produced is selected based on the pressing operation of the touch panel switch 14 displayed on the monitor 13 (step S01), the CPU 10 is stored in the RAM 11 of the selected printed board P. The board information of the obtained pattern program data is acquired (step S02).

  Based on the acquired substrate information (see FIG. 3), the CPU 10 refers to the relational data table shown in FIG. 4 to determine the clamp pressure (step S03). That is, if the selected substrate type is a ceramic substrate, the thickness is 0.7 mm (0.5 mm or more and less than 0.8 mm), and the size in the Y direction is 85 mm (75 mm or more and less than 100 mm), the clamp The pressure is 1.4 Mpa.

  Then, the CPU 10 transmits the data of the determined clamp pressure “1.4 Mpa” to the electropneumatic regulator 8 (step S04), changes the data to the determined clamp pressure “1.4 Mpa”, and stores it in the RAM 11. (Step S05). Therefore, when the printed circuit board P is produced, the clamp member 5 controls the printed circuit board P to be clamped and supported by the clamp member 5 by pressing the printed circuit board P against the fixed chute 2A with the clamping pressure. To do. That is, the CPU 10 reads out the clamping pressure “1.4 Mpa” stored in the RAM 11 and issues a command to the electropneumatic regulator 8 to clamp at the clamping pressure “1.4 Mpa”. The pressure of the air supplied to 3 is adjusted to be an appropriate clamping pressure corresponding to the selected printed circuit board P, and it is possible to prevent printing misalignment, clamping detachment, and the like.

  Note that when the clamp pressure is held in a register provided in the electropneumatic regulator 8 and the substrate is clamped, the pressure may be adjusted so as to be the held clamp pressure.

  Further, when a printed circuit board P to be produced is selected, various types of, for example, change of the substrate conveying conveyor and conveying chute 2 according to the size of the printed circuit board P, and a screen according to the selected printed circuit board P are selected. The CPU 10 automatically performs the setup change such as the above, or the operator manually performs the setup change.

  Next, a simple printing operation of the screen printer will be described below. First, since the printed circuit board P inherited from the upstream side flows from the left to the right in FIG. 1 by the circuit board conveyer, the printed circuit board P that has been transported and moved by the descending stopper comes into contact and is locked. Then, the positioning is stopped and the conveyance is stopped.

  Then, the backup table 1 is raised to raise the printed circuit board P indicated by the solid line in FIG. 2 to the position indicated by the dotted line. Thereafter, the air cylinder 3 is operated, and the clamp member 5 moves the printed board P to the fixed chute 2A. The printed circuit board P is clamp-supported by pressing and clamping the side surface. In this case, as described above, the CPU 10 issues a command to the electropneumatic regulator 8 to clamp at the clamping pressure “1.4 Mpa”, and the pressure of the air supplied to the air cylinder 3 is adjusted by the electropneumatic regulator 8. Therefore, an appropriate clamping pressure corresponding to the selected printed circuit board P is obtained, and it is possible to prevent the occurrence of printing misalignment, clamping detachment, and the like.

  The printed circuit board P is sucked and held on the backup table 1 while being clamped and supported horizontally. Note that support pins may be implanted on the backup table to support the printed circuit board P horizontally.

  Then, the screen recognition mark attached to the screen is imaged by the screen recognition camera, and the board recognition mark attached to the printed board P is imaged by the substrate recognition camera, and the recognition processing device (not shown) performs these operations. The image is recognized and both recognition results are sent to the CPU 10. Then, in the control unit, based on the recognition processing result, a position shift amount that should position the position of each substrate recognition mark and the position of each screen recognition mark relatively is calculated, and the calculation result is stored in the built-in storage unit. At the same time, based on the amount of positional deviation, the CPU 10 corrects the relative positional deviation between the printed circuit board P and the screen for positioning.

  Then, the substrate support unit is further lifted, the horizontally supported printed circuit board P is brought into close contact with the lower surface of the screen, the printing mechanism is operated, and the squeegee (not shown) applies the cream solder to the screen printing pattern. Printing is performed by applying onto the printed board P through the holes, and the board support unit is lowered after the printing is finished. The printed printed board P is placed on the board conveyor from the backup table 1 and is downstream. Be transported.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Backup table 2 Conveying chute 2A Fixed chute 2B Movable chute 3 Air cylinder 5 Clamp member 8 Electropneumatic regulator 10 CPU10
11 RAM

Claims (3)

  In a substrate clamping device that clamps and supports a substrate by pressing the substrate against the other conveyance chute with a clamp member provided on one of the conveyance chutes, an air cylinder for moving the clamp member to press the substrate, and the air An electropneumatic regulator for adjusting the pressure of air supplied to the cylinder, a storage device for storing pressure data of air supplied to the electropneumatic regulator for each type of board, and the memory corresponding to the board to be produced A substrate clamping device, comprising: a control device that controls the electropneumatic regulator based on air pressure data stored in the device.   In a substrate clamping device that clamps and supports a substrate by pressing the substrate against the other conveyance chute with a clamp member provided on one of the conveyance chutes, an air cylinder for moving the clamp member to press the substrate, and the air An electro-pneumatic regulator for adjusting the pressure of air supplied to the cylinder, a storage device for storing pressure data of air supplied to the electro-pneumatic regulator according to at least the material and thickness of the board, and the board to be produced And a control device for controlling the electropneumatic regulator based on air pressure data stored in the corresponding storage device.   3. The substrate clamping device according to claim 1, wherein pressure data is stored in the storage device in accordance with a substrate material, a thickness, and a dimension in a pressing direction.

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