KR102241187B1 - Substrate supporting apparatus, substrate mounting apparatus, film formation apparatus, substrate supporting method, film formation method, and manufacturing method of electronic device - Google Patents

Abstract

[Problem] The variation of each substrate is suppressed when the substrate is placed on the placement body.
[Solving means] The substrate placing device includes a support means including a plurality of support tools for supporting a periphery of the substrate, and a placing means for placing the substrate on the placing body, wherein the plurality of support tools are provided with a distance between some support tools. It is characterized in that the distance between the different supports is different. Alternatively, the substrate mounting apparatus includes a support means including a plurality of support tools for supporting a periphery of the substrate, a support tool moving means for moving at least a part of the plurality of support tools independently of other support tools, and a substrate. It includes a placing means for placing on the placing body.

Description

Substrate support apparatus, substrate placing apparatus, film forming apparatus, substrate support method, film forming method, and manufacturing method of an electronic device {SUBSTRATE SUPPORTING APPARATUS, SUBSTRATE MOUNTING APPARATUS, FILM FORMATION APPARATUS; }

The present invention relates to a substrate supporting apparatus, a substrate placing apparatus, a film forming apparatus, a substrate supporting method, a film forming method, and a manufacturing method of an electronic device.

In recent years, the increase in size and thickness of the substrate is in progress, and the influence of sagging due to the self-weight of the substrate is increasing. In addition, in terms of providing the film-forming region in the center of the substrate, it is limited to the outer peripheral portion (periphery) of the substrate that can support and pinch the substrate.

In the prior art, a substrate mounting mechanism has been used that has a substrate support that supports the outer circumferential portion (4 sides) of the substrate, and mounts the substrate on the mounting body (for example, a mask). Here, the substrate is pinched at one of the outer circumferences of the substrate (eg, the long side portion), and the substrate is held without pinching at the opposite side portion (eg, the short side portion) of the substrate.

Japanese Patent Laid-Open Publication No. 2009-277655

As described above, when the periphery of the substrate is supported, the substrate is drooped by its own weight and the center of the substrate is concave. In addition, sagging occurs in the substrate even around the supported periphery. At this time, the shape of the sag of the substrate (the sag method) differs for each substrate. Accordingly, when the outer periphery of the substrate is supported by a plurality of support tools, the contact state between the substrate and the plurality of support tools also differs for each substrate. Further, when the substrate is placed on a mounting body (for example, a mask), a shift occurs, but the shift method is also different for each substrate.

That is, when placing the substrate on the placement body, there arises a problem that the position of the substrate on the placement body changes for each substrate. This leads to an increase in the time required for alignment, leading to an increase in manufacturing time (tact time).

In view of the above-described problem, the present invention aims to suppress variations for each substrate when the substrate is mounted on the mounting body.

A substrate supporting device according to the first aspect of the present invention,

Support means including a plurality of support tools for supporting the periphery of the substrate,

A support tool moving means for moving at least a part of the plurality of support tools supporting the first side of the substrate independently from other support tools supporting the first side so that the position in the gravitational direction is changed. do.

A substrate placing device according to the second aspect of the present invention,

A substrate support device according to the first aspect,

And a mounting means for mounting the substrate on the mounting body.

The film forming apparatus according to the third aspect of the present invention,

A substrate placing device according to the second aspect,

And a film forming means for forming a film on the substrate.

The substrate supporting method according to the fourth aspect of the present invention,

A support step of supporting the periphery of the substrate by a plurality of support tools,

Having a support tool moving step of moving at least a part of the plurality of support tools independently of other support tools,

In the support tool moving step, at least a part of the plurality of support tools is moved independently of other support tools so that the height in the direction of gravity changes.

The substrate supporting method according to the fifth aspect of the present invention,

A support step of supporting the periphery of the substrate with a plurality of support tools,

Having a support tool moving step of moving at least a part of the plurality of support tools independently of other support tools,

In the support tool moving step, after the plurality of support tools receive the substrate from the conveying means, among a plurality of support tools that support the first side of the substrate, a support tool that is not in contact with the substrate is transferred to the substrate. It is characterized in that the at least part of the support is moved so as to be in contact.

The substrate supporting method according to the sixth aspect of the present invention,

A support step of supporting the periphery of the substrate with a plurality of support tools,

Having a support tool moving step of moving at least a part of the plurality of support tools independently of other support tools,

In the support tool moving step, after the plurality of support tools receive the substrate from the conveying means, between the plurality of support tools supporting the first side of the substrate, the distance between the support tools adjacent to each other becomes the same, It is characterized in that the at least part of the support is moved.

The film forming method according to the seventh aspect of the present invention,

As a film forming method for forming a film of a predetermined pattern on a substrate,

A step of supporting the substrate by the substrate supporting method according to any one of the fourth to sixth aspects, and

And a film forming step of forming a film on the substrate.

An electronic device manufacturing method according to the eighth aspect of the present invention,

A method of manufacturing an electronic device having an organic film or a metal film formed on a substrate, the method comprising:

It is characterized in that the organic film or the metal film is formed by the film forming method according to the seventh aspect.

Advantageous Effects of Invention According to the present invention, variation for each substrate can be suppressed when the substrate is placed on the placement body. Thereby, the time required for alignment and the entire manufacturing time can be shortened.

[Fig. 1] A plan view schematically showing a part of a configuration of an electronic device manufacturing apparatus.
[Fig. 2] A cross-sectional view schematically showing a configuration of a film forming apparatus.
[Fig. 3] A diagram showing the configuration of a substrate holding unit.
[Fig. 4] A diagram for explaining a method of supporting a substrate in Example 1. [Fig.
[Fig. 5] A diagram for explaining a method of placing a substrate (receiving a substrate to supporting a substrate).
Fig. 6 is a diagram explaining a method for placing a substrate (first alignment).
[Fig. 7] A diagram for explaining a method for placing a substrate (second alignment).
[Fig. 8] A diagram for explaining a method for placing a substrate (second alignment).
[Fig. 9] A diagram for explaining a method for placing a substrate (lower cooling plate to release a pinch).
[Fig. 10] A diagram for explaining a method of supporting a substrate in Example 2. [Fig.
[Fig. 11] A diagram for explaining a method of supporting a substrate in Example 3. [Fig.
[Fig. 12] A diagram for explaining a method of supporting a substrate in Example 4. [Fig.
[Fig. 13] A diagram for explaining a method of supporting a substrate in a modified example.
[Fig. 14] A diagram showing an overall view of an organic EL display device and a cross-sectional structure of one pixel of an organic EL electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of the preferred configuration of the present invention, and the scope of the present invention is not limited to such a configuration. In addition, in the following description, the hardware configuration and software configuration of the device, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. are intended to limit the scope of the present invention to only these, unless otherwise specified. It is not.

TECHNICAL FIELD [0001] The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and in particular, to a technique for high-precision conveyance and position adjustment of a substrate. The present invention can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation on the surface of a parallel plate substrate. As the material of the substrate, an arbitrary material such as glass, resin, and metal can be selected, and as a vapor deposition material, an arbitrary material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected.

Specifically, the technology of the present invention is applicable to manufacturing apparatuses such as organic electronic devices (eg, organic EL display devices, thin-film solar cells) and optical members. Among them, the manufacturing apparatus of the organic EL display device is further required to improve the transfer accuracy of the substrate and the alignment accuracy between the substrate and the mask in accordance with the increase in the size of the substrate or the high precision of the display panel. Is one.

<Manufacturing device and manufacturing process>

1 is a plan view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus of Fig. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to The panel is fabricated.

An electronic device manufacturing apparatus generally includes a plurality of film forming chambers 111 and 112 and a transfer chamber 110 as shown in FIG. 1. In the transfer chamber 110, a transfer robot 119 that holds and transfers the substrate 10 is provided. The transfer robot 119 is, for example, a robot having a structure in which a robot hand for holding a substrate is mounted on an articulated arm, and carries in/out the substrate 10 into each film forming chamber.

Each of the film forming chambers 111 and 112 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus), respectively. A series of film formation processes such as transfer of the substrate 10 to the transfer robot 119, adjustment (alignment) of the relative position of the substrate 10 and the mask, fixing of the substrate 10 onto the mask, and film formation (deposition). Is performed automatically by the film forming apparatus. The film-forming apparatus in each film-forming chamber has different parts in detail, such as differences in whether the film-forming target is an organic film or a metal film, a difference in a vapor deposition source, or a difference in a mask, but the basic configuration (especially, substrate transfer and alignment). The configuration related to) is almost common. Hereinafter, the common configuration of the film formation apparatus in each film formation chamber will be described.

<Film forming apparatus>

2 is a cross-sectional view schematically showing a configuration of a film forming apparatus. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction is used. At the time of film formation, the substrate is fixed so as to be parallel to the horizontal plane (XY plane), and at this time, the short length direction (parallel to the short side) is the X direction, and the long length direction (the direction parallel to the long side) is Y. In the direction. In addition, the rotation angle around the Z axis is represented by θ.

The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. A substrate holding unit 210, a mask 220, a mask stand 221, a cooling plate 230, and an evaporation source 240 are substantially installed inside the vacuum chamber 200. The substrate holding unit 210 is a means for holding and transporting the substrate 10 received from the transfer robot 119, and is also referred to as a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to a thin film pattern formed on the substrate 10 and is fixed on a frame-shaped mask stand 221. During film formation, the substrate 10 is placed on the mask 220. Accordingly, the mask 220 also serves as a mounting body on which the substrate 10 is placed. The cooling plate 230 is a member that is in close contact with the substrate 10 (the surface opposite to the mask 220 of) at the time of film formation and suppresses an increase in temperature of the substrate 10, thereby suppressing deterioration or deterioration of the organic material. to be. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member that increases the adhesion between the substrate 10 and the mask 220 at the time of film formation by attracting the mask 220 by magnetic force. The evaporation source 240 is composed of an evaporation material, a heater, a shutter, a driving mechanism for an evaporation source, an evaporation rate monitor, and the like (all not shown).

Above (outside) the vacuum chamber 200, a substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), A theta actuator (not shown) is provided. These actuators are composed of, for example, a motor and a ball screw, a motor and a linear guide. The substrate Z actuator 250 is a driving means (substrate lifting means) for lifting (moving in the Z direction) the entire substrate holding unit 210. The clamp Z actuator 251 is a driving means for opening and closing the holding mechanism (to be described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is a driving means for raising and lowering the cooling plate 230. The X actuator, the Y actuator, and the θ actuator (hereinafter, collectively referred to as “XY θ actuator”) are driving means for alignment of the substrate 10. The XYθ actuator moves the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and the θ rotation. Further, in the present embodiment, the X, Y, and θ of the substrate 10 are adjusted while the mask 220 is fixed, but the position of the mask 220 is adjusted or the substrate 10 and the mask 220 are adjusted. By adjusting the positions of both ), the substrate 10 and the mask 220 may be aligned.

Above (outside) of the vacuum chamber 200, cameras 260 and 261 that measure the positions of the substrate 10 and the mask 220 are installed for alignment of the substrate 10 and the mask 220 have. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through a window installed in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, it is possible to measure the respective XY positions and relative deviations in the XY plane. In order to realize high-precision alignment in a short time, the first alignment (also referred to as “rough alignment”) roughly performing alignment and the second alignment (“fine alignment”) performing alignment with high accuracy. It is preferable to perform alignment in two stages of (also referred to as). In that case, two types of cameras may be used: a camera 260 for first alignment with a low-resolution but wide-field and a camera 261 for second alignment with a narrow-field but high-resolution. In this embodiment, with respect to each of the substrate 10 and the mask 220, the alignment marks attached to two positions of a pair of opposite sides are measured with two cameras 260 for first alignment, and the substrate 10 ) And the alignment marks attached to the four corners of the mask 220 are measured with four cameras 261 for second alignment.

The film forming apparatus has a control unit 270. The control unit 270 includes control of the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XYθ actuator, and the cameras 260, 261, as well as the transport and alignment of the substrate 10, It has functions such as controlling the evaporation source and controlling the film formation. The control unit 270 can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or a built-in computer or a programmable controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured with a circuit such as an ASIC or an FPGA. Further, a control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatuses.

In addition, constituent parts related to holding/transporting and alignment of the substrate 10 (substrate holding unit 210, substrate Z actuator 250, clamp Z actuator 251, XYθ actuator, cameras 260, 261) , Control unit 270, etc.} are also referred to as “substrate placing device”, “substrate holding device”, “substrate conveying device”, and the like.

<Substrate holding unit>

The configuration of the substrate holding unit 210 will be described with reference to FIG. 3. 3 is a perspective view of the substrate holding unit 210.

The substrate holding unit 210 is a means for holding and transporting the substrate 10 by holding the peripheral portion of the substrate 10 by a holding mechanism. Specifically, the substrate holding unit 210 includes a support frame 301 provided with a plurality of support tools 300 supporting each of the four sides of the substrate 10 from below, and the support tool 300 at the long side. It has a clamp member 303 provided with a plurality of pressing tools 302 that sandwich the substrate 10 therebetween, and a support tool moving mechanism 304 for moving the support tool 300 at the short side. One clamping mechanism is configured with a pair of supporters 300 and a pressurization tool 302. In the example of FIG. 3, three support tools 300 are disposed along the short side of the substrate 10, and six gripping mechanisms (a pair of support tools 300 and pressurization ports 302) are disposed along the long side. , It is composed of two long sides. However, the configuration of the holding mechanism is not limited to the example of Fig. 3, and the number and arrangement of the holding mechanism may be appropriately changed according to the size or shape of the substrate to be processed, or film formation conditions, and the like. In addition, the support tool 300 is also referred to as a “rest hook” or a “finger”, and the pressurization tool 302 is also called a “clamp”.

The support tool moving mechanism 304 is a mechanism for moving the support tool 300 of the short side in the vertical direction (Z direction) and the direction along the short side (X direction). With the support tool moving mechanism 304, a part of the support tool can be moved independently of the other support tool. Further, the support tool moving mechanism 304 is also provided for the support tool on the short side of the front side of the drawing, but the illustration is omitted in order to make the drawing easier to understand. In addition, in FIG. 3, although the support tool moving mechanism 304 is provided only to the support tool 300 in the center of the short side part, even if the support tool moving mechanism 304 is provided with respect to the support tool 300 other than the center, Does not matter.

The transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed, for example, as follows. First, the clamping member 303 is lifted by the clamp Z actuator 251 to separate the pressurizing port 302 from the support tool 300 to release the clamping mechanism. After the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119, the substrate 10 is supported by the support tool 300. In this state, by driving the substrate holding unit 210 by the substrate Z actuator 250, the substrate 10 can be lifted (moved in the Z direction). Further, since the clamp Z actuator 251 rises/falls together with the substrate holding unit 210, the state of the holding mechanism does not change even when the substrate holding unit 210 is raised or lowered.

In addition, reference numeral 101 in FIG. 3 denotes an alignment mark for the second alignment attached to the four corners of the substrate 10, and the reference numeral 102 denotes an alignment mark for the first alignment attached to the center of the short side of the substrate 10. The alignment mark is shown.

<Example 1>

4(a) to 4(d) show the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220 It is a figure explaining the supporting method of the board|substrate 10 by using.

Fig. 4A is a view of the substrate holding unit 210 and the substrate 10 viewed from below. As shown, the support tool of the substrate holding unit 210 supports the peripheral portion 103 (supportable region) of the substrate 10. As described above, the long side of the substrate 10 is held by the support tool 300 and the pressing tool 302, while the short side of the substrate 10 is only supported by the support tool 300. Here, the support tools other than some of the support tools on the short side side (the support tools 403 in the drawing) are located at the same height. This height is simply referred to as a reference height below.

4(b) to 4(d) are cross-sectional views of the substrate 10 in a central portion (FIG. 4(c)) and a short side portion (FIG. 4(b)(d)). In the central portion of the substrate 10, as shown in Fig. 4(c), the center sags downward by its own weight. On the other hand, in the short side portion of the substrate 10, as shown in Fig. 4(b)(d), the central support tool 403 is evacuated in a direction below the reference height. Therefore, between the support tool 402 and the support tool 404, the substrate 10 sags downward by its own weight. The sag of the substrate 10 between the other support tools in the short side portion is smaller than the sag between the support tool 402 and the support tool 404.

As described above, in the present embodiment, the substrate 10 is actively sagging by using the self-weight of the substrate 10 in the short side portion. Accordingly, even if there is a difference in characteristics for each substrate 10, the shape of the sag of the substrate 10 when the substrate holding unit 210 holds the substrate 10 (sagging method) can be made constant. There can be.

In addition, in the drawing, the central support tool 403 does not support the substrate 10, but the support tool 403 may support the substrate 10.

Hereinafter, a series of processing until the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220 will be described with reference to FIGS. 5 to 9. do.

5A shows a state when the substrate 10 held by the robot hand 501 of the transfer robot 119 is transferred to the substrate holding unit 210. Further, the substrate 10 held by the robot hand 501 has its center drooped down by its own weight. Here, so that the substrate holding unit 210 can receive the substrate 10 while maintaining this shape of the substrate 10, the support tool 403 at the center of the short side is not in contact with the substrate 10. Evacuate downwards to the location. In this way, by performing the transfer of the substrate 10 between the robot hand 501 and the substrate holding unit 210 while maintaining the sag, displacement of the substrate during transfer (at the time of receiving) can be alleviated.

5B shows a state in which the transfer of the substrate 10 is completed and the robot hand 501 is removed.

After completion of the transfer, the support tool 403 at the center of the short side is moved by the support tool moving mechanism 304 until it comes into contact with the substrate 10. Fig. 5(c) is a diagram showing a state after movement. The height of the support tool 403 after movement may be determined in advance, or may be measured and determined by a sensor. By lifting the central portion of the substrate 10 by the support tool 403, the sag in the downward direction is alleviated, and is supported by all of the support tools 401-405.

Next, as shown in FIG. 6A, after the long side of the substrate 10 is pinched, the substrate 10 is lowered to a position where it does not contact the mask 220. The holding of the long side of the substrate 10 is performed by lowering the clamp member 303 and pressing the pressing tool 302 against the support tool 300 with a predetermined pressing force. The lowering of the substrate 10 is performed by driving the substrate holding unit 210 by the substrate Z actuator 250. Further, while the height of the substrate holding unit 210 is fixed, the substrate 10 may be mounted on the mask 220 by raising and lowering the mask stand 221 by a mounting body lifting means.

Here, although the substrate 10 is lowered while holding the long side portion of the substrate 10, it may be lowered without pinching the substrate 10.

6(b) is a diagram showing a first alignment. The first alignment is an alignment process that performs rough alignment, and is also referred to as "rough alignment". In the first alignment, the substrate alignment mark 102 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 are recognized by the camera 260, and each XY position or within the XY plane. The relative deviation from is measured and alignment is performed. The camera 260 used for the first alignment is a low-resolution but wide-field camera to enable approximate alignment. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, and both the substrate 10 and the mask 220 may be You may adjust the position.

When the first alignment process is completed, the substrate 10 is further lowered and the substrate 10 is placed on the mask 220 as shown in FIG. 6C. Here, the state in which the substrate 10 is placed on the mask 220 means a state in which the substrate 10 and the mask 220 are in contact. That is, the state in which the substrate 10 is placed on the mask 220 means that the time when the substrate 10 starts to contact the mask 220, and the contact area between the substrate 10 and the mask 220 is greater than the time when the contact starts. It includes a state of an increased point of time and a point of time when the substrate 10 is completely placed on the mask 220.

The support tool 403 in the center of the short side is located at a lower height (lower than the reference height) than other support tools, but when placing the substrate 10 on the mask 220, as shown in FIG. 7(a) As described above, it is moved to the same height (reference height) as other support tools by the support tool moving mechanism 304. Accordingly, deformation when the substrate 10 is mounted on the mask 220 can be reduced. The movement of the support tool 403 may be performed before the substrate 10 and the mask 220 come into contact, or may be performed after the substrate 10 and the mask 220 come into contact.

7(b) to 8(c) are diagrams for explaining the second alignment. The second alignment is an alignment process that performs high-precision alignment, and is also referred to as "fine alignment". First, as shown in Fig. 7(b), the substrate alignment mark 101 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 are recognized by the camera 261, Measure each XY position or relative deviation within the XY plane. The camera 261 is a camera with a narrow field of view but high resolution so that high-precision positioning is possible. When the measured deviation exceeds the threshold value, alignment processing is performed. Hereinafter, a case where the measured deviation exceeds the threshold will be described.

When the measured deviation exceeds the threshold value, the substrate Z actuator 250 is driven, the substrate 10 is lifted and separated from the mask 220 as shown in FIG. 7(c). At this time, the height of the support tool 403 may be maintained, that is, the same height as other support tools, or the height of the support tool moving mechanism 304 may be adjusted by the support tool moving mechanism 304.

In FIG. 8A, the XY? actuator is driven based on the deviation measured by the camera 261 to perform positioning. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, and both the substrate 10 and the mask 220 may be You may adjust the position.

After that, as shown in FIG. 8B, the substrate 10 is lowered again, and the substrate 10 is placed on the mask 220. Then, as shown in Fig. 8(c), the camera 261 is used to photograph the alignment marks of the substrate 10 and the mask 220, and the shift is measured. When the measured deviation exceeds the threshold value, the above-described positioning process is repeated.

When the deviation falls within the threshold value, as shown in Fig. 9A, the cooling plate Z actuator is driven to lower the cooling plate 230 so as to come into close contact with the substrate 10. In this embodiment, the cooling plate 230 also functions as a magnet plate, and by attracting the mask 220 by magnetic force, the adhesion between the substrate 10 and the mask 220 is improved.

When the lowering of the cooling plate (magnet plate) is completed, the clamp member 303 is raised, as shown in Fig. 9(b), to release (unclamp) the pinching of the long side of the substrate 10. After that, as shown in Fig. 9(c), the substrate holding unit 210 is lowered.

By the above process, the mounting process of the substrate 10 on the mask 220 is completed, and a film forming process (deposition process) by a film forming apparatus is performed.

According to this embodiment, when holding the substrate 10 by the substrate holding unit 210, by placing a part of the support tool on the short side lower than the other support tools, the substrate 10 is moved downward by its own weight. To sag. Accordingly, regardless of the difference in the characteristics of the substrate 10, the sagging method of the substrate 10 can be made the same. Accordingly, when the substrate 10 is mounted on the mask 220, it is possible to suppress variations in the mounting position for each substrate. Thereby, alignment can be completed in a short time with high precision. Further, the film forming process on the substrate can be completed in a short time with high precision.

In the present embodiment, it has been described that the height is adjusted only for one support tool 403 at the center of the short side portion, but the height of a plurality of support tools at the center of the short side portion may be adjusted. At this time, the heights of the plurality of support tools need not be the same, and may be different.

<Example 2>

In this embodiment, a sagging method different from that in the first embodiment is applied to the substrate 10. 10(a) to 10(d) show the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220 It is a figure explaining the supporting method of the board|substrate 10 by using.

As shown in Fig. 10(b)(d), in the present embodiment, in the short side of the substrate 10, the end supports 401 and 405 are evacuated in a direction below the reference height. Accordingly, the substrate 10 is not supported on the end side, and is drooped larger than the support tools 402 and 404 at the end portions than at other locations. In addition, the end of the substrate 10 is drooped downward due to its own weight, and the substrate 10 becomes a convex upward sag system as a whole.

The sag method of the substrate 10 is different from that of the first embodiment, but also in this embodiment, a uniform sag is applied to the substrate 10, so that the difference in sag method for each substrate can be eliminated. That is, the same effect as in Example 1 can be obtained.

In addition, in FIG. 10, although the support tools 401, 405 are not in contact with the substrate 10, for example, after receiving the substrate 10, the support tools 401, 405 are raised to prevent the substrate 10 and You may make it contact.

<Example 3>

In this embodiment, the substrate 10 is given the same deflection method as in the second embodiment, but the method is different. 11(a) to 11(d) show the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220 It is a figure explaining the supporting method of the board|substrate 10 by using.

As shown in Fig. 11(b)(d), in this embodiment, in the short side of the substrate 10, the central support tool 403 is higher than the height (reference height) of the other support tools. Has been moved to. Accordingly, the center of the end portion of the substrate 10 is mechanically lifted to form an upwardly convex sag system.

Also in this embodiment, a uniform sag is given to the substrate 10, so that a difference in sag method for each substrate can be eliminated. That is, the same effect as in Example 1 can be obtained.

<Example 4>

In this embodiment, the substrate 10 is given a different sag method similar to that of the second and third embodiments, but the method is different. 12(a) to 12(d) show the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220 It is a figure explaining the supporting method of the board|substrate 10 by using.

As shown in Fig. 12(b)(d), in this embodiment, in the short side of the substrate 10, the support tool is moved in the transverse direction (X direction), and the support tool is moved near the center of the short side. Focus. Accordingly, the support of the substrate 10 at the end side is weakened, and the end of the substrate 10 is drooped downward by its own weight, so that the substrate 10 becomes a convex upward sag system as a whole.

In this embodiment, the support tool moving mechanism 304 needs to be configured to be able to move the support tool in the transverse direction (X direction). The support tool moving mechanism 304 in this embodiment may be able to move the support tool only in the transverse direction, or may move the support tool in both the transverse direction and the vertical direction (Z direction).

Also in this embodiment, a uniform sag is given to the substrate 10, so that a difference in sag method for each substrate can be eliminated. That is, the same effect as in Example 1 can be obtained.

<Other Examples>

The arrangement of the support tool is not particularly limited as long as it is an arrangement capable of providing a uniform sagging method to the substrate 10. For example, a uniform sag method may be provided to the substrate 10 by making the distance (three-dimensional distance) between some of the support tools different from the distance between other support tools. The arrangement of the support tools that can be adopted may be specified as an arrangement such that the sag of the substrate 10 between some of the support tools is larger than that of the other support tools. Alternatively, the arrangement of the support tools that can be adopted may be specified as an arrangement in which the space between the support tools is non-equal. In addition, the arrangement of the support tools that can be adopted may be specified as an arrangement in which at least one support tool is located at a position different from the reference position when the virtual position in the case where a plurality of support tools are evenly arranged is used as the reference position. .

As such an arrangement of the support tool, in addition to the example described above, an arrangement as shown in Figs. 13(a) and (b) can also be employed. In both Figs. 13A and 13B, a plurality of support tools are at the same height, but the distance between the support tools at the center is greater than the distance between the support tools at the ends. The difference between Figs. 13(a) and 13(b) is that the distance between the support tools at the center is different, and the sagging method of the substrate 10 can be changed according to this distance.

<modification example>

In the description of the above embodiment, the movement of the support may be omitted. Therefore, the substrate holding unit 210 does not need to be provided with the support tool moving mechanism 304. For example, as a modification of the first embodiment, the central support tool 403 may be fixed at a lower position than other support tools. If the spacing between the support tools is different, the sag method when the substrate 10 is held can be made the same, and it is possible to suppress variations in the placement position when the substrate 10 is placed on the mask 220.

In the description of the above embodiment, the spacing of the support tools is adjusted on both sides of the opposite short sides, but the spacing of the support tools may be adjusted only on one side. Further, in the above embodiment, an example in which the long side is pinched and the short side is provided is described, but conversely, the short side is pinched and the long side may be provided. In this case, it is sufficient to adjust the spacing of the support tools on at least one side to be supported. In addition, it is also possible to adjust the spacing of the support tool on the side to be pinched.

In the description of the above embodiment, the timing of holding the long sides of the substrate 10 may be appropriately changed. For example, the mounting of the substrate 10 on the mask may be performed in a state in which the holding of the substrate 10 is released. Alternatively, while the substrate 10 is placed on the mask, it is okay to hold the substrate 10 again (release and renegotiate).

In addition, although alignment in two stages of the first alignment (rough alignment) and the second alignment (fine alignment) is performed, the first alignment may be omitted and only the second alignment may be performed. In addition, alignment treatment may be performed again after adhesion with the cooling plate (for example, Fig. 9(c)).

<Example of an electronic device manufacturing method>

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, a configuration and a manufacturing method of an organic EL display device will be exemplified as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 14A is an overall view of the organic EL display device 60, and Fig. 14B shows a cross-sectional structure of one pixel.

As shown in Fig. 14A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to herein refers to a minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that exhibit different light emission. Has been. The pixel 62 is often composed of a combination of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, but may be a combination of a yellow light-emitting device, a cyan light-emitting device, and a white light-emitting device. no.

Fig. 14(b) is a schematic partial cross-sectional view taken along line A-B in Fig. 14(a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, a light emitting layer 66R, 66G, 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 63. ). Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In addition, in this embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light-emitting layers 66R, 66G, and 66B are formed in predetermined patterns corresponding to light-emitting elements emitting red, green, and blue colors (sometimes referred to as organic EL elements), respectively. In addition, the first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. In addition, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign substances, an insulating layer 69 is provided between the first electrode 64. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In order to form the organic EL layer in units of light emitting devices, a method of forming a film through a mask is used. BACKGROUND ART In recent years, high precision of display devices is in progress, and a mask having an opening width of several tens of μm is used to form an organic EL layer. In the case of film formation using such a mask, if the mask is thermally deformed by receiving heat from an evaporation source during film formation, the position between the mask and the substrate is shifted, and the pattern of the thin film formed on the substrate is shifted from the desired position. Accordingly, the film forming apparatus (vacuum vapor deposition apparatus) according to the present invention is suitably used for forming these organic EL layers.

Next, an example of a method of manufacturing an organic EL display device will be described in detail.

First, a circuit for driving an organic EL display device (not shown) and a substrate 63 on which the first electrode 64 is formed are prepared.

On the substrate 63 on which the first electrode 64 is formed, an acrylic resin is formed by spin coating, and the acrylic resin is patterned to form an opening in the portion where the first electrode 64 is formed by a lithography method, and the insulating layer 69 To form. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first film forming apparatus, and the substrate is held by the substrate holding unit, and the hole transport layer 65 is placed on the first electrode 64 in the display area as a common layer. The tabernacle is made. The hole transport layer 65 is formed by vacuum evaporation. Actually, since the hole transport layer 65 is formed to have a size larger than that of the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second film forming apparatus, and is held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a light emitting layer 66R emitting red is formed on a portion of the substrate 63 in which an element emitting red is disposed. According to this example, the mask and the substrate can be well overlapped and matched, and film formation can be performed with high precision.

Similar to the film formation of the light-emitting layer 66R, the light-emitting layer 66G emitting green is formed by the third film forming device, and further, the light-emitting layer 66B emitting blue color is formed by the fourth film-forming device. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is transferred to a sputtering device to form a second electrode 68, and then transferred to a plasma CVD device to form a protective layer 70 to complete the organic EL display device 60. do.

From the time when the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when exposed to an atmosphere containing moisture or oxygen, the light-emitting layer made of an organic EL material is formed. There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the carrying in and carrying out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device thus obtained, a light emitting layer is formed with high precision for each light emitting element. Therefore, by using the above manufacturing method, it is possible to suppress the occurrence of defects in the organic EL display device due to a positional shift of the light emitting layer.

In addition, the above-described support tool spacing control and gripping force control can be applied to any scene before the first alignment, between the first alignment and the second alignment, and after the second alignment.

210: substrate holding unit
250: board Z actuator
300, 401~405: support ball
304: support movement mechanism

Claims (25)

Support means including a plurality of support tools for supporting the vicinity of the first side of the substrate,
A support tool moving means for moving at least a portion of the plurality of support tools independently of the other support tools among the plurality of support tools,
The support tool moving means, when the support means receives the substrate from the transfer means, the at least one part of the support tool so that at least one spacing is different from other spacings in a plurality of support tools that come into contact with the substrate. A substrate support device, characterized in that to move. The method of claim 1,
The at least one interval is longer than the other intervals,
When the support means receives the substrate from the transport means, the at least part of the support is spaced apart from the substrate,
The support tool moving means includes the at least a portion between the two adjacent support tools so that the two support tools and the at least some support tools that are adjacent at the at least one interval are arranged at the same height after receiving the substrate. A substrate support device, characterized in that moving the support tool of the. The method of claim 1,
Wherein the support tool moving means moves the at least part of the support tool so that the at least part of the support tool does not contact the substrate when the support means receives the substrate from the transfer means. Support device. The method of claim 1,
The support tool moving means, after the support means has received the substrate from the transfer means, moves the at least part of the support tool to contact the substrate. The method of claim 1,
Said support tool moving means, after said support means has received said substrate from a conveying means, said at least part of said support tool moves so that the position in the gravitational direction with other support tools is the same. . The method of claim 5,
Characterized in that the at least part of the support unit moved by the support unit moving unit after the support unit has received the substrate from the transport unit does not come into contact with the substrate when receiving the substrate from the transport unit Substrate support device. The method of claim 1,
Said support tool moving means, after said support means has received said substrate from said conveying means, said at least part of said support tool is moved so that said plurality of support tools are arranged in a straight line. . Support means including a plurality of support tools for supporting the vicinity of the first side of the substrate,
A support tool moving means for moving at least a portion of the plurality of support tools independently of other support tools among the plurality of support tools,
The support tool moving means, when the support means receives the substrate from the transfer means, the at least one part of the support tool so that at least one spacing is different from other spacings in a plurality of support tools that come into contact with the substrate. Move it,
The support tool moving means, after the support means receives the substrate from the conveying means, the at least part of the support tool so that a support tool not in contact with the substrate among the plurality of support tools comes into contact with the substrate. A substrate support device, characterized in that to move. The method of claim 8,
The support tool moving means moves the at least part of the support tool so that its position in the direction of gravity changes. Support means including a plurality of support tools for supporting the vicinity of the first side of the substrate,
A support tool moving means for moving at least a portion of the plurality of support tools independently of the other support tools among the plurality of support tools,
The support tool moving means, when the support means receives the substrate from the transfer means, the at least one part of the support tool so that at least one spacing is different from other spacings in a plurality of support tools that come into contact with the substrate. Move it,
The support tool moving means, after the support means receives the substrate from the transfer means, the at least a part of the plurality of support tools that are in contact with the vicinity of the first side of the substrate are arranged at equal intervals. A substrate support device, characterized in that the support tool is moved. The method of claim 10,
The support tool moving means moves the at least part of the support tool so that its position in the direction of gravity changes. The substrate support device according to any one of claims 1 to 11, and
A substrate placing apparatus comprising a placing means for placing the substrate on a placing body. The method of claim 12,
The substrate placing device, wherein the placing means includes a substrate lifting means for raising and lowering the substrate. The method of claim 12,
The mounting means includes a mounting body lifting means for lifting the mounting body. The method of claim 12,
And a position adjusting means for adjusting a relative position between the substrate and the mounting body. The method of claim 12,
The substrate placing apparatus, wherein the placing body is a mask used for forming a film of a predetermined pattern on the substrate. The substrate placing device according to claim 12,
A film forming apparatus comprising a film forming means for forming a film on the substrate. A support step of supporting the vicinity of the first side of the substrate by a plurality of support tools,
It has a support tool moving step of moving at least a part of the support tool among the plurality of support tools independently from the other support tool among the plurality of support tools,
In the support tool moving step, when receiving the substrate from the conveying means, moving the at least part of the support tool so that at least one gap in the plurality of support tools in contact with the substrate is different from other gaps, Substrate support method. A support step of supporting the vicinity of the first side of the substrate with a plurality of support tools,
It has a support tool moving step of moving at least a part of the support tool among the plurality of support tools independently from the other support tool among the plurality of support tools,
In the support tool moving step, when receiving the substrate from the conveying means, the at least part of the support tool is moved so that at least one gap in the plurality of support tools in contact with the substrate is different from other gaps, After receiving the substrate from the conveying means, the at least part of the support tool is moved so that a support tool not in contact with the substrate among the plurality of support tools comes into contact with the substrate. A support step of supporting the vicinity of the first side of the substrate with a plurality of support tools,
It has a support tool moving step of moving at least a part of the support tool among the plurality of support tools independently from the other support tool among the plurality of support tools,
In the support tool moving step, when receiving the substrate from the conveying means, the at least part of the support tool is moved so that at least one gap in the plurality of support tools contacting the substrate is different from other gaps, After receiving the substrate from the conveying means, the at least part of the support is moved so that all of the plurality of support tools in contact with the vicinity of the first side of the substrate are arranged at equal intervals. Way. As a film forming method for forming a film of a predetermined pattern on a substrate,
A step of supporting the substrate by the substrate supporting method according to any one of claims 18 to 20, and
Film forming process of forming a film on the substrate
Including a film formation method. A method for manufacturing an electronic device having an organic film formed on a substrate, comprising:
22. A method of manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 21. A method for manufacturing an electronic device having a metal film formed on a substrate, comprising:
22. A method of manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 21. The method of claim 22,
The electronic device manufacturing method, wherein the electronic device is a display panel of an organic EL display device. The method of claim 23,
The electronic device manufacturing method, wherein the electronic device is a display panel of an organic EL display device.

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