KR101975123B1 - Substrate mounting apparatus, film formation apparatus, substrate mounting method, film formation method, and manufacturing method of electronic device - Google Patents

Abstract

[PROBLEMS] To suppress deviation in each substrate when a substrate is placed on a substrate.
[MEANS FOR SOLVING PROBLEMS] A substrate mounting apparatus includes a support means including a plurality of support members for supporting a periphery of a substrate, and a placement means for mounting the substrate on the mount, wherein the plurality of support members have a distance Is different from the distance between the other supporting regions. Alternatively, the substrate-placing apparatus may comprise support means including a plurality of support members for supporting the periphery of the substrate, support moving means for moving at least a part of the plurality of support members independently of the other support members, And means for placing on the body.

Description

TECHNICAL FIELD [0001] The present invention relates to a substrate mounting apparatus, a substrate depositing apparatus, a substrate mounting method, a deposition method, and a manufacturing method of an electronic device. BACKGROUND OF THE INVENTION 1. Field of the Invention [0002]

The present invention relates to a substrate placing apparatus, a film forming apparatus, a substrate placing method, a film forming method, and a manufacturing method of an electronic device.

BACKGROUND ART [0002] In recent years, enlargement and thinning of substrates have been progressing, and the influence of deflection due to the weight of the substrate has increased. In addition, since the film forming region is provided at the central portion of the substrate, it is limited to the outer peripheral portion (peripheral portion) of the substrate that can support and hold the substrate.

BACKGROUND ART In the prior art, a substrate mounting mechanism for mounting a substrate on a mount (e.g., a mask) having a substrate support for supporting the outer peripheral portion (four sides) of the substrate is used. Here, the substrate may be sandwiched between opposing sides (for example, a long side) of one of the outer peripheries of the substrate and not sandwiched between the opposite sides (for example, a short side).

Japanese Patent Application Laid-Open No. 2009-277655

As described above, when the periphery of the substrate is supported, the substrate is squeezed by its own weight, so that the center of the substrate is concave. In addition, the peripheral portion of the substrate may be sagged. At this time, the shape (sagging manner) of deflection of the substrate differs from substrate to substrate. Therefore, when the outer periphery of the substrate is supported by a plurality of support members, the contact state between the substrate and the plurality of support members also becomes different from substrate to substrate. Furthermore, when the substrate is placed on a substrate (for example, a mask), deviation occurs, but the manner of deviating the substrate also varies from substrate to substrate.

That is, when the substrate is placed on the substrate, the position of the substrate on the substrate changes depending on the substrate. This leads to an increase in the time required for alignment, leading to an increase in manufacturing time (tact time).

DISCLOSURE OF THE INVENTION In view of the above problems, it is an object of the present invention to suppress a deviation in each substrate when a substrate is placed on a substrate.

A substrate mounting apparatus according to an aspect of the present invention includes:

A supporting means including a plurality of supports for supporting a periphery of the substrate;

A mounting means for mounting the substrate on the mounting body

And,

And the distance between the partial supporting portions of the plurality of supporting portions is different from the distance between the other supporting portions.

A substrate mounting apparatus according to an aspect of the present invention includes:

A supporting means including a plurality of supports for supporting the periphery of the substrate;

An earth moving means for moving at least a part of the plurality of the support members independently of the other support members;

A mounting means for mounting the substrate on the mounting body

Respectively.

A substrate mounting method according to an aspect of the present invention includes:

A supporting step of supporting the periphery of the substrate by a plurality of supporting members,

A mounting step of mounting the substrate on a mounting body

/ RTI >

And the distance between the partial supporting portions of the plurality of supporting portions is different from the distance between the other supporting portions.

A substrate mounting method according to an aspect of the present invention includes:

A supporting step of supporting the periphery of the substrate with a plurality of supporting members,

A support moving step of moving at least a part of the plurality of support members independently of the other support members;

Witch process for placing a substrate on a substrate

.

According to the present invention, it is possible to suppress deviation in each substrate when the substrate is placed on the substrate. As a result, it is possible to shorten the time required for alignment and the entire manufacturing time.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view schematically showing a part of a configuration of an electronic device manufacturing apparatus. FIG.
FIG. 2 is a cross-sectional view schematically showing a configuration of a film forming apparatus. FIG.
3 is a view showing a configuration of a substrate holding unit;
4 is a view for explaining a substrate supporting method in Embodiment 1. Fig.
5 is a view for explaining a method of mounting a substrate (receiving a substrate to supporting a substrate);
6 is a view for explaining a method of placing a substrate (first alignment);
7 is a view for explaining a placement method (second alignment) of a substrate.
8 is a view for explaining a placement method (second alignment) of a substrate.
9 is a view for explaining a method of mounting a substrate (cooling plate lowering to sandwiching and releasing);
10 is a view for explaining a substrate holding method in Embodiment 2. Fig.
11 is a view for explaining a substrate supporting method in Embodiment 3. Fig.
12 is a view for explaining a substrate holding method in the fourth embodiment;
13 is a view for explaining a substrate holding method in a modified example;
14 is an overall view of an organic EL display device and a sectional structure of one pixel of an organic EL electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to such configurations. The hardware configuration, software configuration, processing flow, manufacturing conditions, dimensions, material, shape, and the like of the apparatus in the following description are not intended to limit the scope of the present invention It is not.

The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and more particularly to a technique for precisely transporting a substrate and adjusting its position. The present invention can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation on the surface of a substrate of a parallel plate. As the material of the substrate, any material such as glass, resin, and metal can be selected, and as the evaporation material, any material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected.

Specifically, the technique of the present invention is applicable to an organic electronic device (for example, an organic EL display, a thin film solar cell), an optical member, and the like. In particular, since the apparatus for manufacturing an organic EL display device is required to further increase the substrate conveyance accuracy and the alignment accuracy of the substrate and the mask in accordance with the enlargement of the substrate or the high definition of the display panel, It is one.

<Manufacturing Apparatus and Manufacturing Process>

1 is a plan view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus shown in Fig. 1 is used, for example, in manufacturing a display panel of an organic EL display device for a smart phone. In the case of a display panel for a smart phone, for example, organic EL is formed on a substrate having a size of about 1800 mm x about 1500 mm and a thickness of about 0.5 mm, and then the substrate is diced into a plurality of small- A panel is made.

As shown in Fig. 1, an apparatus for manufacturing an electronic device generally has a plurality of film formation chambers 111, 112 and a transport chamber 110. In the transfer chamber 110, a transfer robot 119 for holding and transferring the substrate 10 is provided. The carrying robot 119 is, for example, a robot having a structure in which a robot hand for holding a substrate on a multi-joint arm is mounted, and carries the substrate 10 into / out of each film forming chamber.

Each of the deposition chambers 111 and 112 is provided with a deposition apparatus (also referred to as a deposition apparatus). A series of film formation processes such as the transfer of the substrate 10 to the transfer robot 119, the alignment of the relative positions of the substrate 10 and the mask, the fixing of the substrate 10 onto the mask, Is automatically performed by the film forming apparatus. The film forming apparatus of each film forming chamber is different from the film forming apparatus in details such as an organic film, a metal film, a vapor source, or a mask. However, ) Are almost common. Hereinafter, the common constitution of the film forming apparatus for each film forming chamber will be described.

&Lt;

2 is a cross-sectional view schematically showing the structure of a film forming apparatus. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. The substrate is fixed so as to be parallel to the horizontal plane (XY plane) at the time of film formation, and the X-direction in the short-length direction (parallel to the short side) Direction. Further, the rotation angle around the Z axis is represented by?.

The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in an inert gas atmosphere such as a vacuum atmosphere or a nitrogen gas. A substrate holding unit 210, a mask 220, a mask table 221, a cooling plate 230 and an evaporation source 240 are provided in the vacuum chamber 200. The substrate holding unit 210 is also referred to as a substrate holder as means for holding and conveying the substrate 10 received from the transfer robot 119. The mask 220 is a metal mask having an opening pattern corresponding to a thin film pattern to be formed on the substrate 10, and is fixed on a frame-shaped mask base 221. At the time of film formation, the substrate 10 is placed on the mask 220. Therefore, the mask 220 also serves as a mounting body for mounting the substrate 10. The cooling plate 230 is in close contact with the substrate 10 (the surface opposite to the mask 220) at the time of film formation to suppress the temperature rise of the substrate 10, to be. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member for enhancing the adhesion between the substrate 10 and the mask 220 at the time of film formation by attracting the mask 220 by magnetic force. The evaporation source 240 is composed of an evaporation material, a heater, a shutter, a drive mechanism of the evaporation source, an evaporation rate monitor, and the like (all not shown).

A substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a Y actuator a &amp;thetas; actuator (not shown). These actuators include, for example, a motor, a ball screw, a motor, and a linear guide. The substrate Z actuator 250 is a driving means (substrate elevating means) for elevating (moving in the Z direction) the entire substrate holding unit 210. The clamp Z actuator 251 is a driving means for opening and closing a holding mechanism (to be described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is a driving means for moving the cooling plate 230 up and down. The X actuator, the Y actuator, and the? Actuator (collectively referred to as "XY? Actuator" hereinafter) are driving means for alignment of the substrate 10. The XY theta actuator moves the entire substrate holding unit 210 and the cooling plate 230 in X direction, Y direction, and? In this embodiment, X, Y, and θ of the substrate 10 are adjusted while the mask 220 is fixed. However, it is also possible to adjust the position of the mask 220 or adjust the positions of the substrate 10 and the mask 220 The alignment of the substrate 10 and the mask 220 may be performed.

Cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220 are provided on the outside of the vacuum chamber 200 for alignment of the substrate 10 and the mask 220 have. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through windows provided in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, the relative displacement in each XY position and XY plane can be measured. In order to realize high-precision alignment in a short time, a first alignment (also referred to as &quot; rough alignment &quot;) and a second alignment (&quot; fine alignment & ) Is preferably performed in two steps. In this case, it is sufficient to use two types of cameras, that is, the camera 260 for the first alignment and the camera 261 for the second alignment, which are in close agreement with the first alignment but are in the low resolution. In this embodiment, two alignment marks attached to two opposing sides of the substrate 10 and the mask 220 are measured by the two first alignment cameras 260 and the substrate 10 And the alignment marks attached to the four corners of the mask 220 are measured by the four cameras 261 for alignment.

The film forming apparatus has a control section 270. The control unit 270 controls the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XY theta actuator and the cameras 260 and 261 as well as the conveyance and alignment of the substrate 10, Control of the evaporation source, control of film formation, and the like. The control unit 270 can be configured by a computer having a processor, memory, storage, I / O, and the like, for example. In this case, the function of the control unit 270 is realized by the processor executing the program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an adjustable computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or an FPGA. Further, the control unit 270 may be provided for each deposition apparatus, or one control unit 270 may control a plurality of deposition apparatuses.

The substrate holding unit 210, the substrate Z actuator 250, the clamp Z actuator 251, the XY theta actuator, the cameras 260 and 261, and the like, which are related to holding, transportation, and alignment of the substrate 10 , The control unit 270, etc.) are also referred to as &quot; substrate mounting apparatus &quot;, &quot; substrate holding apparatus &quot;, &quot;

<Substrate Holding Unit>

The configuration of the substrate holding unit 210 will be described with reference to Fig. 3 is a perspective view of the substrate holding unit 210. Fig.

The substrate holding unit 210 is a means for holding and conveying the substrate 10 by holding the peripheral edge of the substrate 10 by a holding mechanism. More specifically, the substrate holding unit 210 includes a supporting frame 301 provided with a plurality of supporting members 300 for supporting the four sides of the substrate 10 from below, A clamping member 303 provided with a plurality of pressing ports 302 sandwiching the substrate 10 therebetween and a guide movement mechanism 304 for moving the support 300 of the short side. One holding mechanism 300 and one pressing mechanism 302 constitute one holding mechanism. 3, three support members 300 are disposed along the short side of the substrate 10 and six support mechanisms (a pair of support 300 and presser 302) are arranged along the long side , And two sides of the long side are sandwiched. However, the configuration of the nipping mechanism is not limited to the example of Fig. 3, and the number and arrangement of the nipping mechanisms may be changed as appropriate in accordance with the size, shape, or film forming conditions of the substrate to be processed. The retainer 300 is also referred to as a &quot; support hook &quot; or &quot; finger &quot;, and the pusher 302 is also referred to as a &quot; clamp &quot;.

The guide moving mechanism 304 is a mechanism for moving the support 300 of the short side in the vertical direction (Z direction) and in the direction along the short side (X direction). The support mechanism can move some of the support members independently of the other support mechanisms. Further, although the support mechanism 304 is provided for the short-side support on the front side of the drawing, the illustration is omitted for easy understanding. In Fig. 3, the support mechanism 304 is provided only for the support 300 at the center of the short side, but even if the support mechanism 304 is provided for the support 300 other than the center Does not matter.

The transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed, for example, as follows. First, the clamping member 303 is lifted by the clamp Z actuator 251 to move the pressing member 302 away from the support 300, thereby releasing the clamping mechanism. The transfer robot 119 introduces the substrate 10 between the support 300 and the presser 302 and then the substrate 10 is supported by the support 300. [ By driving the substrate holding unit 210 by the substrate Z actuator 250 in this state, the substrate 10 can be raised and lowered (moved in the Z direction). Since the clamp Z actuator 251 is moved up and down together with the substrate holding unit 210, the state of the nipping mechanism does not change even when the substrate holding unit 210 is moved up and down.

Reference numeral 101 in Fig. 3 denotes a second alignment alignment mark attached to the four corners of the substrate 10, reference numeral 102 denotes a first alignment alignment mark attached to the center of the short side of the substrate 10 And an alignment mark is shown.

&Lt; Example 1 &gt;

4 (a) to 4 (d) are diagrams showing a state in which the substrate holding unit 210 receives the substrate 10 from the carrying robot and places the substrate 10 on the mask (substrate) Fig. 2 is a view for explaining a method of supporting the substrate 10 by the method of Fig.

4 (a) is a view of the substrate holding unit 210 and the substrate 10 as viewed from below. As shown, the support of the substrate holding unit 210 supports the peripheral portion 103 (sustainable region) of the substrate 10. The short side of the substrate 10 is only supported by the support 300 while the long side of the substrate 10 is sandwiched by the support 300 and the presser 302 as described above. Here, the supporting posts other than the partial supporting portions (the supporting portions 403 in the drawing) on the short side are located at the same height. This height is hereinafter simply referred to as a reference height.

4 (b) to 4 (d) are cross-sectional views at a central portion (Fig. 4 (c)) and a short side portion (Fig. 4 (b) (d)) of the substrate 10. In the central portion of the substrate 10, as shown in Fig. 4 (c), the center is sagged downward by its own weight. On the other hand, at the short side of the substrate 10, as shown in Figs. 4 (b) and 4 (d), the central support 403 is retracted in a direction lower than the reference height. Thus, between the support 402 and the support 404, the substrate 10 is sagged downward by its own weight. The deflection of the substrate 10 between the other supports in the short sides becomes smaller than the deflection between the support 402 and the support 404.

As described above, in the present embodiment, the substrate 10 is positively sagged using the weight of the substrate 10 at the short sides. Thereby, even if the characteristics of the substrates 10 are different, the shape (sagging manner) of the substrate 10 when the substrate holding unit 210 holds the substrate 10 is made constant There is a number.

Although the center support member 403 does not support the substrate 10 in the figure, the support member 403 may support the substrate 10.

5 to 9, a series of processes from the substrate holding unit 210 until the substrate 10 is received from the carrying robot and placed on the mask (mount body) 220 will be described with reference to Figs. do.

5A shows a state when the substrate 10 held by the robot hand 501 of the transfer robot 119 is transferred to the substrate holding unit 210. Fig. Further, the substrate 10 held by the robot hand 501 is centered down by its own weight. Here, the support 403 at the center of the short side of the substrate 10 is not in contact with the substrate 10 so that the substrate holding unit 210 can receive the substrate 10 while maintaining this shape of the substrate 10 Evacuate downward to the position. As described above, by transferring the substrate 10 between the robot hand 501 and the substrate holding unit 210 while maintaining deflection, it is possible to alleviate the deviation of the substrate at the time of transfer (at the time of transfer).

5 (b) shows a state in which transfer of the substrate 10 is completed and the robot hand 501 is pulled out.

After the completion of the transfer, the support 403 at the center of the shorter side is moved by the guide moving mechanism 304 until it contacts the substrate 10. [ 5 (c) is a diagram showing the state after the movement. The height of the support 403 after the movement may be determined in advance or may be determined by measurement by a sensor. The central portion of the substrate 10 is lifted by the support member 403 so that deflection in the downward direction is relaxed and supported by all the support members 401 to 405. [

Next, as shown in Fig. 6 (a), after the long side portion of the substrate 10 is sandwiched, the substrate 10 is lowered to a position where it does not contact the mask 220. [ The clamping of the long side portion of the substrate 10 is carried out by lowering the clamp member 303 and pressing the pressing member 302 against the support 300 with a predetermined pressing force. The lowering of the substrate 10 is performed by driving the substrate holding unit 210 by the substrate Z actuator 250. The substrate 10 may be placed on the mask 220 by moving the mask stand 221 up and down by the substrate lifting means while the height of the substrate holding unit 210 is fixed.

Although the substrate 10 is lowered in a state where the long side portion of the substrate 10 is sandwiched here, the substrate 10 may be lowered without sandwiching it.

6 (b) is a view showing the first alignment. The first alignment is referred to as &quot; rough alignment &quot; as an alignment process for performing rough alignment. In the first alignment, the camera alignment marks 102 provided on the substrate 10 and the mask alignment marks (not shown) provided on the mask 220 are recognized by the camera 260 and the XY position and the XY plane So as to perform alignment. The camera 260 used for the first alignment is a low-resolution, but light-vision camera so as to allow approximate alignment. The position of the substrate 10 (the substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, and the position of both the substrate 10 and the mask 220 may be adjusted The position may be adjusted.

When the first alignment process is completed, the substrate 10 is further lowered to place the substrate 10 on the mask 220, as shown in Fig. 6 (c). Here, the state in which the substrate 10 is placed on the mask 220 means a state in which the substrate 10 and the mask 220 are in contact with each other. That is, the state in which the substrate 10 is placed on the mask 220 means that the contact area between the substrate 10 and the mask 220 is smaller than the contact start time when the substrate 10 starts to contact the mask 220 And the state at any point in time when the substrate 10 is completely placed on the mask 220. [

The support 403 at the center of the short side portion is located at a lower height than the other support portion (height lower than the reference height). However, when the substrate 10 is placed on the mask 220, (Reference height) by the support mechanism 304, as shown in Fig. Thus, deformation when the substrate 10 is placed on the mask 220 can be reduced. The movement of the support 403 may be performed before the substrate 10 and the mask 220 are in contact with each other or after the substrate 10 and the mask 220 are in contact with each other.

7 (b) to 8 (c) are views for explaining the second alignment. The second alignment is also referred to as &quot; fine alignment &quot; as alignment processing for performing highly accurate alignment. First, as shown in Fig. 7 (b), a camera alignment mark 101 provided on the substrate 10 and a mask alignment mark (not shown) provided on the mask 220 are recognized by the camera 261, The relative displacement in each XY position or XY plane is measured. The camera 261 is a camera having a narrow view but high resolution so as to enable highly precise alignment. When the measured deviation exceeds the threshold value, alignment processing is performed. Hereinafter, the case where the measured deviation exceeds the threshold value will be described.

When the measured deviation exceeds the threshold value, the substrate Z actuator 250 is driven to lift the substrate 10 and separate it from the mask 220, as shown in Fig. 7 (c). At this time, the height of the support frame 403 may be maintained, that is, the same height as another support frame, or the height of the support frame moving mechanism 304 may be adjusted by the support frame moving mechanism 304.

8A, the XY &amp;thetas; actuator is driven based on the displacement measured by the camera 261 to perform alignment. The position of the substrate 10 (the substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, and the position of both the substrate 10 and the mask 220 may be adjusted The position may be adjusted.

8 (b), the substrate 10 is lowered again, and the substrate 10 is placed on the mask 220. Then, as shown in Fig. Then, as shown in Fig. 8 (c), the photographing of the alignment marks of the substrate 10 and the mask 220 is performed by the camera 261, and deviation is measured. When the measured stagger exceeds the threshold value, the above-described alignment processing is repeated.

9 (a), the cooling plate Z actuator is driven so that the cooling plate 230 is lowered to be brought into close contact with the substrate 10, as shown in Fig. 9 (a). In the present embodiment, the cooling plate 230 serves also as a magnet plate, attracting the mask 220 by magnetic force, thereby enhancing the adhesion between the substrate 10 and the mask 220.

When the lowering of the cooling plate (magnet plate) is completed, as shown in Fig. 9 (b), the clamp member 303 is lifted to release (unclamp) the long side portion of the substrate 10. Thereafter, as shown in Fig. 9 (c), the substrate holding unit 210 is lowered.

Through the above steps, the placement processing of the substrate 10 onto the mask 220 is completed, and the film formation process (deposition process) by the film formation apparatus is performed.

According to the present embodiment, when the substrate 10 is held by the substrate holding unit 210, a part of the support on the side of the short side is positioned lower than the support on the other side, . Thereby, the sagging manner of the substrate 10 can be made the same regardless of the difference in characteristics of the substrate 10. Accordingly, when the substrate 10 is mounted on the mask 220, it is possible to suppress deviation of the placement position from substrate to substrate. Thereby, the alignment can be completed in a short time with high accuracy. Further, the film forming process on the substrate can be completed in a short time with high accuracy.

In the present embodiment, the height is adjusted only for one support 403 at the center of the short side. However, the height of a plurality of supports at the center of the short side may be adjusted. At this time, the heights of the plurality of support members do not have to be the same and may be different.

&Lt; Example 2 &gt;

In this embodiment, a deflection method different from that of the first embodiment is applied to the substrate 10. 10 (a) to 10 (d) are diagrams showing a state in which the substrate holding unit 210 receives the substrate 10 from the carrying robot and places the substrate 10 on the mask (mount) 220, Fig. 2 is a view for explaining a method of supporting the substrate 10 by the method of Fig.

10 (b) and (d), in the present embodiment, the support portions 401 and 405 at the ends of the short side portion of the substrate 10 escape in a direction lower than the reference height. Therefore, the substrate 10 is not supported on the end side, but stays at a position larger than other portions at the ends than the support portions 402 and 404. In addition, the end portion of the substrate 10 is sagged downward by its own weight, and the substrate 10 is deflected upward as a whole.

Although the method of deflecting the substrate 10 is different from that of the first embodiment, a uniform deflection is given to the substrate 10 also in the present embodiment, thereby eliminating the difference in deflection method for each substrate. That is, the same effect as that of the first embodiment can be obtained.

10, the support portions 401 and 405 are not in contact with the substrate 10, but the support portions 401 and 405 are raised after the substrate 10 is received, for example, Or may be brought into contact with each other.

&Lt; Example 3 &gt;

In the present embodiment, the same deflection method as that of Embodiment 2 is given to the substrate 10, but the method is different. 11 (a) to 11 (d) are diagrams showing a state in which the substrate holding unit 210 receives the substrate 10 from the carrying robot and places the substrate 10 on the mask (mount body) Fig. 2 is a view for explaining a method of supporting the substrate 10 by the method of Fig.

11 (b) and (d), in the present embodiment, the center support 403 at the short side of the substrate 10 is positioned above the height (reference height) of the other support . Therefore, the center of the end portion of the substrate 10 is mechanically lifted and becomes convexly deflected.

Also in this embodiment, uniform deflection is imparted to the substrate 10, and the difference in the deflection manner for each substrate can be eliminated. That is, the same effect as that of the first embodiment can be obtained.

<Example 4>

In the present embodiment, the same deflection method as that in the second and third embodiments is given to the substrate 10, but the method is different. 12 (a) to 12 (d) are diagrams showing a state in which the substrate holding unit 210 receives the substrate 10 from the transfer robot and places the substrate 10 on the mask (substrate) 220, Fig. 2 is a view for explaining a method of supporting the substrate 10 by the method of Fig.

12 (b) and 12 (d), in this embodiment, in the short side of the substrate 10, the substrate 10 is moved in the lateral direction (X direction) Concentrate. Therefore, the support on the end side of the substrate 10 becomes weak, and the end of the substrate 10 sags downward due to its own weight, so that the substrate 10 is deflected upward as a whole.

In this embodiment, the reticle movement mechanism 304 needs to be configured to be movable in the lateral direction (X direction). The retainer moving mechanism 304 in this embodiment may be movable only in the lateral direction or may be movable in both the lateral direction and the up and down direction (Z direction).

Also in this embodiment, uniform deflection is imparted to the substrate 10, and the difference in the deflection manner for each substrate can be eliminated. That is, the same effect as that of the first embodiment can be obtained.

<Other Embodiments>

The arrangement of the support members is not particularly limited as long as it is an arrangement capable of imparting a uniform deflection manner to the substrate 10. For example, a uniform deflection manner may be given to the substrate 10 by making the distances (three-dimensional distances) between some of the supporting members different from the distances between the other supporting members. The arrangement of the adoptable support can be specified by an arrangement in which the deflection of the substrate 10 between some of the support members is larger than the deflection between the other support members. Alternatively, the placement of the adoptable retention zones may be specified as a spacing that is equal to the spacing between the retention zones. Further, it is also possible to specify the arrangement of the adoptable support by a layout in which at least one support is located at a position different from the reference position when a virtual position of the plurality of support units is uniformly set as a reference position .

13 (a) and 13 (b) can be employed in addition to the above-described examples of the arrangement of the support. 13 (a) and 13 (b) are arrangements in which a plurality of supports is at the same height, but the distance between the supports at the center is larger than the distance between the supports at the ends. The difference between Figs. 13A and 13B is that the distances between the support portions at the center are different, and the deflection manner of the substrate 10 can be changed according to the distance.

<Modifications>

In the description of the embodiment, the movement of the support may be omitted. Therefore, the substrate holding unit 210 does not need to have the support moving mechanism 304. [ For example, as a modification of the first embodiment, the center support 403 may be fixed at a lower position than the other support. The deflection of the substrate 10 when holding the substrate 10 can be made the same and the deviation of the placement position when the substrate 10 is placed on the mask 220 can be suppressed.

In the above description of the embodiment, the distance between the support portions is adjusted on both sides of the opposing short sides, but the distance between the support portions may be adjusted on one side. In the above embodiment, the example is described in which the long side is sandwiched and the short side is provided. Alternatively, the short side may be sandwiched and the long side may be provided. In this case, it is only necessary to adjust the gap of the support at least on one side. In addition, the gap between the retainers may be adjusted on the side where the nipping is performed.

In the above description of the embodiment, the timing of holding the long side of the substrate 10 may be appropriately changed. For example, the substrate 10 may be mounted on the mask in a state in which the holding of the substrate 10 is released. Alternatively, even if the substrate 10 is held again (release of the sandwiching and re-sandwiching) in a state where the substrate 10 is placed on the mask.

Further, although the two-stage alignment of the first alignment (rough alignment) and the second alignment (fine alignment) is performed, only the second alignment may be performed without omitting the first alignment. 9 (c)), it is also possible to carry out the alignment process again after adhesion by the cooling plate (for example, Fig. 9 (c)).

&Lt; Embodiment of Manufacturing Method of Electronic Device >

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of the electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 14 (a) is an overall view of the organic EL display device 60, and Fig. 14 (b) shows a cross-sectional structure of one pixel.

As shown in Fig. 14 (a), a plurality of pixels 62 each having a plurality of light emitting elements are arranged in a matrix form in a display region 61 of the organic EL display device 60. Fig. Each of the light emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. The term &quot; pixel &quot; as used herein refers to a minimum unit capable of displaying a desired color in the display region 61. [ In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B, . The pixel 62 is often formed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. no.

Fig. 14 (b) is a partial sectional schematic view taken along line A-B in Fig. 14 (a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, light emitting layers 66R, 66G and 66B, an electron transport layer 67, a second electrode (cathode) 68 The organic EL device according to claim 1, Of these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in predetermined patterns corresponding to light emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. The first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67 and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed separately for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In order to form the organic EL layer by a light emitting element unit, a method of forming a film through a mask is used. 2. Description of the Related Art In recent years, a high-definition display device has been developed, and a mask having a width of several tens of micrometers is used for forming an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the mask and the substrate are displaced from each other and the thin film pattern formed on the substrate is displaced from a desired position. Therefore, the film forming apparatus (vacuum vapor deposition apparatus) of the present invention is suitably used for film formation of these organic EL layers.

Next, an example of a manufacturing method of the organic EL display device will be described in detail.

First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

An acrylic resin is formed on the substrate 63 on which the first electrode 64 is formed by spin coating and the acrylic resin is patterned by lithography so as to form an opening in a portion where the first electrode 64 is formed, . This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is brought into the first film forming apparatus to hold the substrate by the substrate holding unit and the hole transporting layer 65 is formed as a common layer on the first electrode 64 in the display region To the tabernacle. The hole transport layer 65 is formed by vacuum evaporation. In practice, since the hole transport layer 65 is formed in a size larger than the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transporting layer 65 is carried into the second film forming apparatus and held by the substrate holding unit. Alignment of the substrate and the mask is performed and the substrate is placed on the mask to form a light emitting layer 66R that emits red light on the portion where the red emitting element of the substrate 63 is disposed. According to this example, the mask and the substrate can be superimposed on each other and aligned, and film formation can be performed with high accuracy.

Similar to the formation of the light emitting layer 66R, the light emitting layer 66G that emits green light is formed by the third film forming apparatus, and further the light emitting layer 66B that emits blue light by the fourth film forming apparatus is formed. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth film forming apparatus. The electron transporting layer 67 is formed as a common layer to the three color light emitting layers 66R, 66G, and 66B.

The organic EL display device 60 is completed by forming the second electrode 68 by moving the substrate formed up to the electron transporting layer 67 by the sputtering device and then moving to the plasma CVD device to form the protective layer 70 do.

When the substrate 63 having the insulating layer 69 is exposed to an atmosphere containing moisture or oxygen from the time when the substrate 63 having been patterned is transferred to the film forming apparatus to the completion of film formation of the protective layer 70, There is a possibility of deterioration due to moisture or oxygen. Therefore, in this example, the carrying-in and carrying-out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device thus obtained, the light emitting layer is formed precisely for each light emitting element. Therefore, when the above manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the positional deviation of the light emitting layer.

In addition, the above-described support distance control and the grip force control can be applied before the first alignment, between the first alignment and the second alignment, and after the second alignment.

210: substrate holding unit
250: substrate Z actuator
300, 401 ~ 405: District
304: Earth moving equipment

Claims (41)

delete delete delete delete A supporting means including a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of a plurality of support members supporting the first side of the substrate independently from other support members supporting the first side,
And a mounting means for mounting the substrate on the mounting body,
Wherein the guide moving means moves the at least a portion of the support in the direction of gravity to a height in the direction of gravity of the other support when the substrate is transferred from the transfer robot, Wherein the at least one supporting member moves the at least part of the supporting member. 6. The method of claim 5,
Wherein the locating means moves at least a part of the support so that the distance between the support portions is different from the distance between the support portions. The method according to claim 5 or 6,
Wherein the support means is configured such that when the support of the substrate is supported by the support, the deflection of the substrate between the support portions is greater than the deflection of the substrate between the other support portions, And the substrate is moved. The method according to claim 5 or 6,
Characterized in that the locating means moves at least a part of the support so that the distance between the support portions supporting the same side of the substrate is different from the distance between the other support portions Substrate mounting device. The method according to claim 5 or 6,
Wherein the support means moves at least a part of the support to the substrate after receiving the substrate from the conveying robot. The method according to claim 5 or 6,
Wherein the support means is provided with at least one support at the center so that at least one support in the center of at least one side of the substrate is not in contact with the substrate when the substrate is transferred from the carrier robot And the substrate is moved. 11. The method of claim 10,
Wherein the support means moves the at least one support in the center to be brought into contact with the substrate after the substrate is transferred from the transfer robot. 12. The method of claim 11,
Wherein the support means moves the at least one support in the center at a height equal to that of the other support in a state in which the substrate is placed on the support. The method according to claim 5 or 6,
Wherein the placing means includes a substrate elevating means for elevating the substrate. The method according to claim 5 or 6,
Wherein said mounting means includes a mounting means for mounting and lowering said mounting means. The method according to claim 5 or 6,
Further comprising position adjusting means for adjusting a relative position between the substrate and the mounting body. The method according to claim 5 or 6,
Wherein the substrate is a mask used for forming a film of a predetermined pattern on the substrate. A substrate mounting apparatus according to claim 5 or 6,
A film forming means for forming a film on the substrate
. delete delete delete A supporting step of supporting the periphery of the substrate with a plurality of supporting members,
A substrate moving step of moving at least a part of a plurality of support members supporting the first side of the substrate independently from other support members supporting the first side,
And a mounting step of mounting the substrate on the mounting body,
Wherein the substrate transferring step is performed such that when the substrate is transferred from the transfer robot, the height of the at least part of the support in the gravity direction is different from the height of the other support in the gravity direction, And moving the substrate to a position where it does not move. 22. The method of claim 21,
Wherein the at least partial support is moved so that the distance between some of the support members is different from the distance between the other support members. 23. The method of claim 21 or 22,
In the above-described step of moving the substrate, when the substrate is supported by the support, the deflection of the substrate between the partial supports is greater than the deflection of the substrate between the other supports, And the substrate is moved. 23. The method of claim 21 or 22,
Wherein the at least partial support is moved in such a manner that the distance between the partial supports differs from the distances between the other supports between the supports supporting the same side of the substrate A method of mounting a substrate. 23. The method of claim 21 or 22,
Wherein the substrate transferring step is performed before the placing step, after the placing step, or before and after the placing step. 23. The method of claim 21 or 22,
The above-
Further comprising the step of moving the at least partial support to a position in contact with the substrate after the substrate is transferred from the transfer robot. 23. The method of claim 21 or 22,
Wherein the at least one support at the center of at least one side of the substrate is not in contact with the substrate when the substrate is transferred from the transfer robot, And moving the substrate. 28. The method of claim 27,
Wherein the substrate transporting step includes a step of transporting the substrate from the transport robot and then moving at least one of the centers of the substrate to contact the substrate. 29. The method of claim 28,
Wherein the step of moving the substrate includes a step of moving at least one of the centers of the center at the same height as the other supports in a state where the substrate is placed on the substrate. 23. The method of claim 21 or 22,
Wherein the substrate is raised and lowered in the placing step. 23. The method of claim 21 or 22,
Wherein the substrate is raised or lowered in the placing step. 23. The method of claim 21 or 22,
Further comprising a first position adjusting step of adjusting a relative position of the substrate and the body in a direction parallel to the surface of the body prior to the placing step. 23. The method of claim 21 or 22,
Further comprising a second position adjusting step of adjusting a relative position between the substrate and the body in a direction parallel to the surface of the body after the placing step. 34. The method of claim 33,
The second position adjustment step may include:
Measuring a relative displacement between the substrate and the substrate in a state in which the substrate is mounted on the substrate;
Separating the substrate from the body,
A step of adjusting a relative position of the substrate and the body in a direction parallel to the surface of the body based on the measured relative displacement
Wherein the substrate is a substrate. 23. The method of claim 21 or 22,
Wherein the substrate is a mask used for forming a film of a predetermined pattern on the substrate. A film forming method for forming a film of a predetermined pattern on a substrate,
A step of placing the substrate on the mounting body by the method of mounting a substrate according to claim 21 or 22,
A film forming step of forming a film on the substrate
&Lt; / RTI &gt; A method of manufacturing an electronic device having an organic film formed on a substrate,
A method for manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 36. A method of manufacturing an electronic device having a metal film formed on a substrate,
A method for manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 36. 39. The method of claim 37,
Wherein the electronic device is a display panel of an organic EL display device. 39. The method of claim 38,
Wherein the electronic device is a display panel of an organic EL display device. A supporting means including a plurality of supports for supporting the periphery of the substrate;
And support moving means for moving at least part of the plurality of support members supporting the first side of the substrate independently from other support members supporting the first side,
Wherein the guide moving means moves the at least a portion of the support in the direction of gravity to a height in the direction of gravity of the other support when the substrate is transferred from the transfer robot, So as to move the at least partially supported region.

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