KR102219478B1 - Substrate mounting method, film forming method, electronic device manufacturing method - Google Patents

Abstract

A substrate mounting method for placing a substrate on a mounting body, comprising: a first clamping step of clamping a peripheral edge of the substrate by a clamping mechanism; a release step of releasing the clamping of the substrate by the clamping mechanism; and after the release step, In a state in which the substrate is placed on the placing body, a second clamping step is provided in which the peripheral portion of the substrate is clamped by a clamping mechanism. This improves the adhesion between the large and thin substrate and the mask by a simple and easy method.

Description

Substrate mounting method, film forming method, electronic device manufacturing method

The present invention relates to a substrate placing method, a film forming method, an electronic device manufacturing method, a substrate placing apparatus, and a film forming apparatus.

In recent years, the increase in size and thickness of the substrate are in progress, and the influence of sagging due to the self weight of the substrate is increasing. In addition, due to the relationship of providing the film-forming region in the central portion of the substrate, it is limited to the peripheral portion of the substrate that the substrate can be held.

For this reason, if the substrate is placed on the mask (raised) with the peripheral portion of the substrate (e.g., a pair of opposite edges) pinched by the substrate support, the substrate pinched by the peripheral portion becomes the substrate's own weight. When the sagging center part and the mask come into contact, free movement is prevented, and distortion occurs in the substrate.

Due to this distortion, a gap is created between the mask and the substrate, and the adhesion between the mask and the substrate decreases, resulting in poor film formation and the like.

Thus, for example, even if a substrate or the like is enlarged, a technique as disclosed in Patent Document 1 has been proposed in order to ensure good adhesion between the substrate and the mask, but further improvement is required.

In addition, when film formation is performed without holding the substrate placed on the mask, the substrate is vibrated by vibrations caused by the movement of the evaporation source or the transport mechanism driven in the film forming apparatus, and the substrate and the mask rub against this vibration to process the substrate. There is a case of damaging the cotton.

[Prior technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2009-277655

The present invention has been made in view of the above-described phenomena, and provides a technique capable of improving the adhesion between a large and thin substrate and a mask by a simple method.

A first aspect of the present invention is a substrate mounting method in which a substrate is placed on a mounting body, wherein the substrate is placed on the mounting body, and a peripheral portion of the substrate is removed. It is a method of placing a substrate, characterized in that it is held by a holding mechanism.

A second aspect of the present invention is a film forming method for forming a film of a predetermined pattern on a substrate, the step of placing the substrate on the mounting body by the substrate mounting method according to the first aspect, and forming a film on the substrate. It is a film formation method characterized by including a step to perform.

A third aspect of the present invention is a method of manufacturing an electronic device having an organic film formed on a substrate, wherein the organic film is formed by the film forming method according to the third aspect.

A fourth aspect of the present invention is a substrate placing device for placing a substrate on a mounting body, comprising: a substrate holding means having a holding mechanism for holding a peripheral portion of the substrate, and a control means for controlling the substrate holding means. And, the control means, in a state in which the substrate is placed on the mounting body, the holding mechanism shifts from a released state in which the holding mechanism does not hold the substrate to a holding state in which the holding mechanism holds the substrate, It is a substrate placing apparatus characterized by controlling the holding means.

A fifth aspect of the present invention is a film forming apparatus for forming a film of a predetermined pattern on a substrate, comprising: a substrate placing apparatus according to the fourth aspect, for placing the substrate on a placing body, and a means for forming a film on the substrate. It is a film forming apparatus characterized by the above-mentioned.

According to the present invention, as described above, it is possible to increase the adhesion between a large and thin substrate and a mask by a simple and easy method.

1 is a cross-sectional view schematically showing a substrate mounting apparatus of Example 1. FIG.
Fig. 2 is a cross-sectional view schematically showing a holding mechanism of Example 1. [Fig.
3 is an explanatory diagram of a method for placing a substrate in Example 1. FIG.
Fig. 4 is an explanatory diagram of a method for placing a substrate in Example 1. [Fig.
Fig. 5 is an explanatory diagram of a method for placing a substrate in Example 1. [Fig.
Fig. 6 is an explanatory diagram of a method for placing a substrate in Example 1. [Fig.
Fig. 7 is an explanatory diagram of a method for placing a substrate in Example 1. [Fig.
Fig. 8 is an explanatory diagram of a method for placing a substrate in Example 1. [Fig.
Fig. 9 is a cross-sectional view schematically showing a substrate mounting apparatus of Example 2. [Fig.
Fig. 10 is an explanatory diagram of a method for placing a substrate in Example 2. [Fig.
Fig. 11 is an explanatory diagram of a method for placing a substrate in Example 2. [Fig.
Fig. 12 is an explanatory diagram of a method for placing a substrate in Example 2. [Fig.
Fig. 13 is an explanatory diagram of a method for placing a substrate in Example 2. [Fig.
Fig. 14 is an explanatory diagram of a method for placing a substrate in Example 2. [Fig.
Fig. 15 is an explanatory diagram of a method for placing a substrate in Example 2. [Fig.
Fig. 16 is an explanatory diagram of a method for placing a substrate in Example 3. [Fig.
Fig. 17 is an explanatory diagram of a method for placing a substrate in Example 3. [Fig.
Fig. 18 is an explanatory diagram of a method for placing a substrate in Example 3. [Fig.
Fig. 19 is an explanatory diagram of a method for placing a substrate in Example 3. [Fig.
Fig. 20 is an explanatory diagram of a method for placing a substrate in Example 4;
Fig. 21 is an explanatory diagram of a method for placing a substrate in Example 5. [Fig.
Fig. 22 is an explanatory diagram of a method for placing a substrate in Example 6. [Fig.
23 is a plan view schematically showing a part of an electronic device manufacturing apparatus.
24 is a cross-sectional view schematically showing a configuration of a film forming apparatus.
Fig. 25 is a perspective view of a substrate holding unit.
[Fig. 26] (a) is a perspective view of an organic EL display device, and (b) is a cross-sectional structure diagram of one pixel.
Fig. 27 is a modification example of the second alignment process of the third embodiment.
[Fig. 28] This is a modified example of the second alignment process of the third embodiment.
[Fig. 29] This is a modification of the second alignment process of the third embodiment.
[Fig. 30] It is a modification example of the 2nd alignment process of Example 3. [FIG.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware and software configurations, processing flows, manufacturing conditions, dimensions, materials, shapes, and the like of the apparatus in the following description are not intended to limit the scope of the present invention unless otherwise specified.

TECHNICAL FIELD [0001] The present invention relates to a film forming apparatus for forming a thin film on a substrate, and a control method thereof, and in particular, to a technique for conveying and positioning a substrate with high precision. The present invention can be suitably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum evaporation on the surface of a parallel plate substrate. As the material of the substrate, an arbitrary material such as glass, resin, and metal can be selected, and as a vapor deposition material, an arbitrary material such as an organic material and an inorganic material (metal, metal oxide, etc.) can be selected. Specifically, the technology of the present invention is applicable to manufacturing apparatuses such as organic electronic devices (eg, organic EL display devices, thin-film solar cells) and optical members. Among them, the manufacturing apparatus of an organic EL display device is one of the preferred application examples of the present invention, since it is further required to improve the transfer accuracy of the substrate and the alignment accuracy between the substrate and the mask due to the increase in the size of the substrate or the high precision of the display panel. .

<Manufacturing device and manufacturing process>

23 is a plan view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus in Fig. 23 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of approximately 1800 mm × approximately 1500 mm and a thickness of approximately 0.5 mm, the substrate is diced to form a plurality of small-sized panels. Is produced.

An electronic device manufacturing apparatus generally includes a plurality of film formation chambers 111 and 112 and a transfer chamber 110 as shown in FIG. 23. A transfer robot 119 that holds and transfers the substrate 10 is installed in the transfer chamber 110. The transfer robot 119 is, for example, a robot having a structure in which a robot hand that holds a substrate on an articulated arm is mounted, and performs carrying in/out of the substrate 10 into each film formation chamber.

Each of the film forming chambers 111 and 112 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus), respectively. A series of film formation processes such as transfer of the substrate 10 to the transfer robot 119, adjustment (alignment) of the relative position between the substrate 10 and the mask, fixing the substrate 10 onto the mask, and film formation (deposition). Is performed automatically by the film forming apparatus. The film-forming apparatuses in each film-forming chamber have differences in details such as differences in evaporation sources and differences in masks, but their basic configurations (especially configurations related to transport and alignment of substrates) are almost common. Hereinafter, the common configuration of the film forming apparatus in each film forming chamber will be described.

<Film forming apparatus>

24 is a cross-sectional view schematically showing a configuration of a film forming apparatus. In the following description, an XYZ rectangular coordinate system in which the vertical direction is the Z direction is used. At the time of film formation, the substrate is said to be fixed so as to be parallel to the horizontal plane (XY plane).At this time, the short length direction (parallel to the short side) is the X direction and the long length direction (the direction parallel to the long side) is the Y direction. To do. Also, the rotation angle around the Z axis is expressed as θ.

The film forming apparatus includes a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. A substrate holding unit 210, a mask 220, a mask stand 221, a cooling plate 230, and an evaporation source 240 are approximately installed inside the vacuum chamber 200. The substrate holding unit 210 is a means for holding and transferring the substrate 10 received from the transfer robot 119, and is also referred to as a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate 10 and is fixed on the frame-shaped mask stand 221. During film formation, the substrate 10 is placed on the mask 220. Accordingly, the mask 220 also plays a role as a mounting body on which the substrate 10 is placed. The cooling plate 230 is pushed onto the substrate 10 (the surface opposite to the mask 220 of), thereby bringing the substrate 10 into close contact with the mask 220 and the role of the substrate 10 during film formation. It is a plate member having a role of suppressing deterioration or deterioration of an organic material by suppressing an increase in temperature. The cooling plate 230 may also serve as a magnetic plate. The magnet plate is a member that increases the adhesion between the substrate 10 and the mask 220 during film formation by attracting the mask 220 by magnetic force. The evaporation source 240 is composed of a evaporation material, a heater, a shutter, a driving mechanism for the evaporation source, an evaporation rate monitor, and the like (all not shown).

In the upper (outer side) of the vacuum chamber 200, a substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), θ actuator (Not shown) is installed. These actuators are composed of, for example, a motor and a ball screw, a motor and a linear guide. The substrate Z actuator 250 is a driving means for lifting the entire substrate holding unit 210 (moving in the Z direction). The clamp Z actuator 251 is a driving means for opening and closing the holding mechanism (to be described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is a driving means for raising and lowering the cooling plate 230. The X actuator, the Y actuator, and the θ actuator (hereinafter, collectively referred to as “XYθ actuator”) are driving means for alignment of the substrate 10. The XYθ actuator moves the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and the θ rotation. In addition, in the present embodiment, the X, Y, θ of the substrate 10 is adjusted while the mask 220 is fixed, but the position of the mask 220 is adjusted or the substrate 10 and the mask 220 are adjusted. By adjusting the positions of both ), the substrate 10 and the mask 220 may be aligned.

Cameras 260 and 261 are installed in the upper (outer side) of the vacuum chamber 200 to measure positions of the substrate 10 and the mask 220 for alignment of the substrate 10 and the mask 220 . The cameras 260 and 261 photograph the substrate 10 and the mask 220 through a window installed in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, it is possible to measure the respective XY positions and relative deviations in the XY plane. In order to realize high-precision alignment in a short time, the first alignment (also referred to as “rough alignment”) roughly aligned and the second alignment (“fine alignment”) aligned with high precision. It is preferable to perform alignment in two stages of (also referred to as). In that case, two types of cameras may be used: the camera 260 for first alignment having a low-resolution but wide viewing angle, and the camera 261 for second alignment having a narrow viewing angle but having a high resolution. In this embodiment, for each of the substrate 10 and the mask 220, alignment marks provided at two locations of a pair of opposite sides are measured with two first alignment cameras 260, and the substrate 10 And alignment marks installed at the four corners of the mask 220 are measured with four second alignment cameras 261.

The film forming apparatus includes a control unit 270. In addition to the control of the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XYθ actuator and the cameras 260, 261, the substrate 10 is transported, aligned, and deposited. It has functions such as circle control and film formation control. The control unit 270 can be configured by, for example, a computer having a processor, memory, storage, I/O, and the like. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a programmable controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured with a circuit such as an ASIC or an FPGA. Further, the control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatuses.

Here, constituent parts related to holding, conveying, and aligning the substrate 10 (substrate holding unit 210, substrate Z actuator 250, clamp Z actuator 251, XYθ actuator, camera 260, 261, The control unit 270 and the like} are also referred to as "substrate placing device", "substrate holding device", "substrate conveying device", and the like.

<Substrate holding unit>

The configuration of the substrate holding unit 210 will be described with reference to FIG. 25. 25 is a perspective view of the substrate holding unit 210.

The substrate holding unit 210 is a means for holding and conveying the substrate 10 by holding the periphery of the substrate 10 by a holding mechanism. Specifically, the substrate holding unit 210 includes a support frame body 301 provided with a plurality of support tools 300 supporting each of the four sides of the substrate 10 from below, and each support tool 300. It includes a clamp member 303 provided with a plurality of pressing tools 302 for sandwiching the substrate 10 therebetween. One clamping mechanism is configured with a pair of support tools 300 and pressure tools 302. In the example of FIG. 25, three support tools 300 are disposed along the short side of the substrate 10, and six gripping mechanisms (a pair of support tools 300 and pressure tools 302) are disposed along the long side. , It is composed of two sides of the long side. However, the configuration of the holding mechanism is not limited to the example of Fig. 25, and the number and arrangement of the holding mechanism may be appropriately changed in accordance with the size and shape of the substrate to be processed, or film formation conditions. In addition, the support tool 300 is also referred to as a “rest hook” or a “finger”, and the pressure port 302 is also referred to as a “clamp”.

The transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed, for example, as follows. First, the clamping member 303 is lifted by the clamp Z actuator 251 and the pressing tool 302 is separated from the support tool 300 to release the clamping mechanism. After the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119, the clamp member 303 is lowered by the clamp Z actuator 251, and the pressing tool ( 302 is pressed against the support tool 300 with a predetermined pressure. Thereby, the substrate 10 is pinched between the pressing tool 302 and the support tool 300. In this state, by driving the substrate holding unit 210 by the substrate Z actuator 250, the substrate 10 can be lifted (moved in the Z direction). Further, since the clamp Z actuator 251 rises/falls together with the substrate holding unit 210, the state of the clamping mechanism does not change even when the substrate holding unit 210 is raised or lowered.

In addition, reference numeral 101 in FIG. 25 denotes an alignment mark for a second alignment provided at the four corners of the substrate 10, and 102 is an alignment mark for a first alignment provided at the center of the short side of the substrate 1 Is shown.

<Example 1>

The substrate mounting method according to the first embodiment of the present invention will be briefly described based on FIGS. 1 to 8. 1 to 8 schematically show portions of a substrate holding unit 6 of a film forming apparatus and a mask 1 that is a placement of the substrate 2 for convenience of explanation.

Example 1 is a method of placing the substrate 2 on the mask 1, which is a mounting body, and the periphery of the substrate 2 is the substrate holding unit 6 in a state where the substrate 2 is placed on the mask 1. It is a method of placing a substrate, characterized in that it is held by a holding mechanism. In other words, in the first embodiment, after placing at least a part of the substrate 2 on the mask 1, the substrate holding unit 6 is carried out by the control unit so that the clamping mechanism transitions from the released state (non-clamped state) to the clamped state. ) Is how to control. By holding the periphery of the substrate 2 while the substrate 2 is placed on the mask 1, sagging (distortion) of the substrate 2 can be corrected.

That is, since the substrate 2 is sagging by its own weight, when the substrate 2 and the mask 1 are relatively close together, the central portion of the substrate comes into contact with the mask 1 first. At this time, since the periphery of the substrate 2 is not pinched, the deformation of the substrate 2 caused by contact with the mask 1 is not inhibited by the holding mechanism, and the substrate 2 extends outward. . Thereby, the substrate 2 can be made to conform to the mask 1 well, and the substrate 2 can be held in close contact with the mask 1 without distortion.

Therefore, it becomes possible to perform film formation in a state in which the substrate 2 is in good contact with the mask 1 without gaps, and it becomes possible to eliminate film formation defects caused by a decrease in adhesion between the mask 1 and the substrate 2 . In addition, since the periphery of the substrate 2 is clamped by the clamping mechanism while the mask 1 is placed on the substrate 2, the mask 1 and the substrate ( The friction of 2) is prevented, and it is possible to prevent the occurrence of scratches on the treated surface of the substrate 2.

Here, "the state in which the substrate 2 is placed on the mask (placement) 1" means a state in which at least a part of the substrate 2 is in contact with the mask 1. In other words, “the state in which the substrate 2 is placed on the mask 1” means that when the substrate 2 and the mask 1 are relatively close, “the substrate 2 starts contacting the mask 1 View point (Fig. 6)”, closer to “the point in time when the contact area between the substrate 2 and the mask 1 increases from the point at which the contact is initiated (Fig. 7)”, closer to “the entire substrate 2 becomes the mask 1 ) It includes the state of any point of view of the point of view placed on top of it (Fig. 8). From the viewpoint of adhesion between the substrate 2 and the mask 1 after mounting the substrate, the timing of holding the periphery of the substrate 2 is preferably the state of FIG. 7 rather than the state of FIG. 6, and more preferably the state of FIG. Do.

In this embodiment, the present invention is applied to a film-forming apparatus in which a film-forming mask 1 is disposed in a vacuum chamber 5 and has an opening for defining a film-forming pattern and a film-forming mechanism is used. Yes.

Specifically, in the vacuum chamber 5, a mask 1 as a mounting body is disposed in a state supported by the mask stand 4, and a movement mechanism for changing the relative distance between the mask 1 and the substrate 2 (3) is installed.

Further, the mounting body may be other than the mask 1 such as a mounting table on which the substrate 2 is temporarily placed in order to eliminate sagging (distortion) of the substrate 2. In this case, it is possible to place the substrate 2 pinched on the mask 1 in a state in which sagging or the like has already been corrected before mounting on the mask 1, so that the substrate 2 and the mask 1 are satisfactory. It becomes possible to make it close.

In the moving mechanism 3, a substrate holding unit 6 is provided at a distal end portion of a moving portion provided in which the fixed portion is mounted on the wall surface of the vacuum chamber 5 and provided in the fixed portion so as to move forward and backward. Accordingly, the substrate 2 supported by the substrate holding unit 6 moves in a fold with respect to the mask 1 by moving the moving part forward and backward.

As shown in Fig. 2, in the substrate holding unit 6, a support tool 7 and the support tool 7 and the substrate 2 are provided in contact with the lower surface of the periphery of the substrate 2 A pressure port 8 is provided that is provided on the upper surface side of the substrate 2 so as to be sandwiched therebetween.

Specifically, the substrate holding unit 6 has a shape in which sleeves hang down on the left and right sides of the body portion, and a support tool 7 is provided so as to protrude inward from the tip end of the sleeve portion. Further, a base 9 is provided in which the pressing tools 8 are movably installed so as to face each of the support tools 7.

The pressing tool 8 is configured to protrude from the base 9 and hold the substrate 2 by pressing the substrate 2 against the support tool 7. The pressing tool 8 is pressed against the substrate 2 by the support tool 7 and the pressing tool 8 (a pinching mechanism), and the pressing tool 8 is retracted from the substrate 2 so that the substrate ( It becomes possible to appropriately switch the state of liberation that does not hold 2). In addition, the released state in this embodiment refers to a state in which the substrate 2 is not clamped by any clamping mechanism.

A plurality of support tools 7 and pressure tools 8 (a pinching mechanism) are provided so as to pinch a plurality of sides of the substrate 2. In this embodiment, the support tool 7 and the pressing tool 8 are provided so as to hold a pair of opposite sides of the substrate 2, respectively.

Further, in the present embodiment, the pair of support tools 7 and pressure tools 8 are configured so as to contact substantially the entire length of the long longitudinal direction of the one side. In addition, a plurality of support tools 7 and pressure tools 8 may be provided for one side to support and pinch one side at multiple points. Further, the corner portion of the substrate 2 may be held in a plurality of places.

Using the moving mechanism 3 and the holding mechanism of the above configuration, the substrate 2 is brought into contact with the mask 1, and the peripheral edge of the substrate 2 is held in contact with the mask 1 by the holding mechanism. do. That is, in this embodiment, after the substrate 2 is brought into contact with the mask 1 in an open state, it is pinched.

Specifically, the holding of the substrate 2 makes the relative distance between the substrate 2 and the mask 1 close by a moving mechanism 3 that changes the relative distance between the substrate 2 and the mask 1, After the contact between the substrate 2 and the mask 1, the contact area between the substrate 2 and the mask 1 is increased from when the contact is started.

In this embodiment, as shown in Figs. 3 to 8, for example, the substrate 2 transferred from the substrate transfer robot outside the vacuum chamber 5 is carried into the vacuum chamber 5, and the substrate holding unit ( 6) at the time of reception (Fig. 3), the start time of lowering for placing the substrate 2 on the mask 1 (Fig. 4), the time during the lowering (Fig. 5), and the substrate 2 is the mask 2 6) and the time when the substrate 2 contacts the mask 1 and then descends further while increasing the contact area (Fig. 7), the holding mechanism is released, and the substrate 2 is It is pinched at the end of the placement overlaid on the mask 1 (Fig. 8).

Accordingly, when the substrate 2 descends while increasing the contact area with the mask 1, the substrate 2 comes into contact with the mask 1 in a released state (non-interrupted state). The deformation is not inhibited by the holding mechanism, and the substrate 2 extends outward. Thereby, the substrate 2 can be made to conform to the mask 1 satisfactorily, and the substrate 2 can be held in close contact with the mask 2 without distortion.

In addition, if it is in the released state at the time point of FIG. 6 and the step of holding it at the time point of FIG. 8 is included, the anti-friction effect of the substrate is exhibited in any state of being pinched or released at the time points of FIGS. 3 to 5 and 7. Confirmed.

<Example 2>

The substrate mounting method according to the second embodiment of the present invention will be briefly described based on FIGS. 9 to 15. 9 to 15 schematically show portions of the substrate holding unit 6 of the film forming apparatus and the mask 1 as a place for the substrate 2 for convenience of explanation.

Example 2 is a method of placing the substrate 2 on the mask 1 as a placement body, wherein the peripheral portion of the substrate 2 is held by a holding mechanism in a state in which the substrate 2 is placed on the mask 1, It is a substrate placing method characterized in that the clamping is performed again after the clamping of the substrate 2 by the clamping mechanism is released once. In other words, in the second embodiment, a first clamping step in which the peripheral edge of the substrate 2 is clamped by a clamping mechanism, a release step of releasing the clamping of the substrate 2 in the first clamping step, and the release step This is a substrate placing method including a second clamping step of clamping the periphery of the substrate 2 by a clamping mechanism in a state in which the substrate 2 is placed on the mask 1 as a mounting body after the step.

For example, the substrate 2 is conveyed to the vicinity of the mask 1 while the peripheral edge of the substrate 2 is held by the holding mechanism of the substrate holding unit 6, and at least a part of the substrate 2 is At the point of contact with 1), the clamping mechanism is once released, and after that, the peripheral edge of the substrate 2 is renegotiated by the clamping mechanism.

Since the holding mechanism is once released, the deformation of the substrate 2 caused by contact with the mask 1 is not inhibited by the holding mechanism, and the substrate 2 extends outward. Thereby, the substrate 2 can be made to conform to the mask 1 satisfactorily, and the substrate 2 can be held in close contact with the mask 1 without distortion.

Therefore, it becomes possible to perform film formation in a state in which the substrate 2 is in good contact with the mask 1 without any gaps, and it becomes possible to eliminate film formation defects caused by a decrease in the adhesion between the mask 1 and the substrate 2. . In addition, since the periphery of the substrate 2 is reciprocated by the clamping mechanism while the substrate 2 is placed on the mask 1, vibration generated inside the film forming apparatus causes the mask 1 Friction of the substrate 2 is prevented, and scratches on the treated surface of the substrate 2 can be prevented.

Here, "the state in which the substrate 2 is placed on the mask (placement) 1" means a state in which at least a part of the substrate 2 is in contact with the mask 1. In other words, “the state in which the substrate 2 is placed on the mask 1” means that when the substrate 2 and the mask 1 are relatively close, the “substrate 2 starts to contact the mask 1 View (Fig. 13)”, closer to “the point in time when the contact area between the substrate 2 and the mask 1 increases from the point at which the contact is initiated (Fig. 14)”, closer to “the whole of the substrate 2 becomes the mask 1 ) Includes the state of any point in time “at the point of time placed above (Fig. 15). From the viewpoint of adhesion between the substrate 2 and the mask 1 after mounting the substrate, the timing of re-pinching the periphery of the substrate 2 is preferably the state of FIG. 14 than the state of FIG. 13, and the state of FIG. 15 is more desirable.

In this embodiment, the present invention is applied to a film-forming apparatus in which a film-forming mask 1 is disposed in a vacuum chamber 5 and has an opening for defining a film-forming pattern and a film-forming mechanism is used. Yes.

Specifically, in the vacuum chamber 5, a mask 1 as a mounting body is disposed in a state supported by the mask stand 4, and a movement mechanism for changing the relative distance between the mask 1 and the substrate 2 (3) is installed.

Further, the mounting body may be other than the mask 1 such as a mounting table on which the substrate 2 is temporarily placed in order to eliminate sagging (distortion) of the substrate 2. In this case, it is possible to place the substrate 2 pinched on the mask 1 in a state in which sagging or the like has already been corrected before mounting on the mask 1, so that the substrate 2 and the mask 1 are satisfactory. It becomes possible to make it close.

In the moving mechanism 3, a substrate holding unit 6 is provided at a distal end portion of a moving portion provided in which the fixed portion is mounted on the wall surface of the vacuum chamber 5 and provided in the fixed portion so as to move forward and backward. Accordingly, the substrate 2 supported by the substrate holding unit 6 moves in a fold with respect to the mask 1 by moving the moving part forward and backward.

In the substrate holding unit 6, a support 7 in contact with the lower surface of the periphery of the substrate 2 and the upper surface side of the substrate 2 so that the support 7 and the substrate 2 are sandwiched therebetween. A pressure port 8 installed in the is installed.

Specifically, the substrate holding unit 6 has a shape in which sleeves hang down on the left and right sides of the body portion, and a support tool 7 is provided so as to protrude inward from the tip end of the sleeve portion. Further, a base 9 is provided in which the pressing tools 8 are movably installed so as to face each of the support tools 7.

The pressing tool 8 is configured to protrude from the base 9 and hold the substrate 2 by pressing the substrate 2 against the support tool 7. The pressing tool 8 is pressed against the substrate 2 by the support tool 7 and the pressing tool 8 (a pinching mechanism), and the pressing tool 8 is retracted from the substrate 2 so that the substrate ( It becomes possible to appropriately switch the state of liberation that does not hold 2). In addition, the released state in this embodiment refers to a state in which the substrate 2 is not clamped by any clamping mechanism.

A plurality of support tools 7 and pressure tools 8 (a pinching mechanism) are provided so as to pinch a plurality of sides of the substrate 2. In this embodiment, the support tool 7 and the pressing tool 8 are provided so as to hold a pair of opposite sides of the substrate 2, respectively.

Further, in the present embodiment, the pair of support tools 7 and pressure tools 8 are configured so as to contact substantially the entire length of the long longitudinal direction of the one side. In addition, a plurality of support tools 7 and pressure tools 8 may be provided for one side to support and pinch one side at multiple points. Further, the corner portion of the substrate 2 may be held in a plurality of places.

Through the above configuration, the relative distance between the substrate 2 and the mask 1 is brought close while the peripheral edge of the substrate 2 is held by the clamping mechanism, so that at least a portion of the substrate 2 contacts the mask 1 At one point, the holding mechanism is released. Then, the relative distance between the substrate 2 and the mask 1 is further brought closer to each other, and the entire surface of the substrate 2 is placed on the mask 1, and then the peripheral portion of the substrate 2 is reciprocated with a holding mechanism.

Specifically, as shown in Figs. 10 to 15, for example, the substrate 2 transferred from the substrate transfer robot outside the vacuum chamber 5 is carried into the vacuum chamber 5, and the substrate holding unit 6 ) At the time of receipt (Fig. 10), the start time of lowering for placing the substrate 2 on the mask 1 (Fig. 11), the time during the lowering (Fig. 12), and the substrate 2 on the mask 2 It is held between the contact points (Fig. 13), and when the substrate 2 comes into contact with the mask 1 and is further lowered, it is set to a released state (Fig. 14), and the substrate 2 is overlaid on the mask 1 Re-negotiate at the matched point (FIG. 15).

As a result, when the substrate 2 descends while increasing the contact area with the mask 1, the substrate 2 is in contact with the mask 1 in a released state (non-interrupted state), so that the substrate 2 is deformed. The substrate 2 extends outward without being disturbed by this holding mechanism. Thereby, the substrate 2 can be made to conform to the mask 1 satisfactorily, and the substrate 2 can be held in close contact with the mask 2 without distortion. Accordingly, while stably transporting the substrate 2, deformation during contact with the mask 1 is prevented, and film formation defects can be satisfactorily prevented.

In addition, if the step of being released at the time point of FIG. 14 and renegotiating at the time point of FIG. 15 is included, even if it is not held at all time points of FIGS. 10 to 13, if it is held at least one time point, film formation failure is prevented. It was confirmed that the effect was exerted.

In addition, at the time point of Figs. 10 to 13, since the substrate 2 descends in a pinched state, the substrate 2 does not shift due to an inertial force acting on the substrate 2 during descending.

<Example 3>

The substrate mounting method according to the third embodiment of the present invention will be described based on FIGS. 16 to 19. 16 to 19 show a series of processes until the substrate holding unit 210 receives the substrate 10 from the transfer robot 119 and places it on the mask (placement body) 220.

16(a) shows a state immediately after the substrate 10 is transferred from the transfer robot 119 to the substrate holding unit 210. The center of the substrate 10 is drooped downward by its own weight. Subsequently, as shown in Fig. 16(b), the clamp member 303 is lowered and the pressing tool 302 is pressed against the support tool 300 with a predetermined pressing force. Thereby, the left and right sides of the substrate 10 are pinched by a holding mechanism composed of the pressing tool 302 and the support tool 300.

Fig. 16(c) is a diagram showing a first alignment. The first alignment is a first position adjustment process that roughly adjusts the relative position of the substrate 10 and the mask 220 in the XY plane (a direction parallel to the surface of the mask 220). ) It is also called “alignment”. In the first alignment, the substrate alignment mark 102 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 are recognized by the camera 260, and within each XY position or XY plane. The relative deviation of is measured and alignment is performed. The camera 260 used for the first alignment is a camera having a low resolution but wide viewing angle to enable approximate alignment. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, and both the substrate 10 and the mask 220 may be You may adjust the position.

When the first alignment process is completed, the substrate 10 is lowered as shown in Fig. 17A. Then, as shown in Fig. 17(b), before the substrate 10 comes into contact with the mask 220, the pressing port 302 is raised to release the holding mechanism. Subsequently, as shown in Fig. 17(c), after lowering the substrate holding unit 210 to the position where the second alignment is performed while in the released state (non-interrupted state), as shown in Fig. 17(d) Similarly, the periphery of the substrate 10 is reciprocated by the clamping mechanism. In addition, the position where the second alignment is performed is a position where the substrate 10 is temporarily placed on the mask 220 in order to measure the relative deviation between the substrate 10 and the mask 220, for example , The support surface (upper surface) of the support tool 300 is a position slightly higher than the mounting surface of the mask 220. At this time, the central portion of the substrate 10 is in contact with the mask 220, and the left and right sides of the peripheral portion of the substrate 10 held by the clamping mechanism are slightly separated (floating) from the mounting surface of the mask 220. Becomes.

In this embodiment, the substrate 10 is brought close to the mask 220 with the substrate holding unit 210 in the released state as shown in Figs. 17B to 17D. Then, when the substrate 10 comes into contact with the mask 220 and the contact area between the substrate 2 and the mask 1 is further increased than the contact start point, the periphery of the substrate 10 is pinched. Therefore, when the substrate 10, which has been sagging by its own weight, returns to a flat surface after the mask 220, the peripheral edge of the substrate 10 is pushed outward, so that unnecessary stress is not applied to the substrate 10. Accordingly, the adhesion between the substrate 10 and the mask 220 increases, and when the substrate 10 is placed on the mask 220, the position of the substrate 10 is shifted or the surface of the substrate 10 ) And friction can be suppressed.

18(a) to 18(d) are diagrams for explaining the second alignment. The second alignment is an alignment process that performs high-precision alignment, and is also referred to as "fine alignment". First, as shown in Fig. 18(a), the substrate alignment mark 101 installed on the substrate 10 and the mask alignment mark (not shown) installed on the mask 220 are recognized by the camera 261, respectively, Measure the XY position and relative deviation within the XY plane. The camera 261 is a camera with a narrow viewing angle but high resolution to enable high-precision positioning. When the measured deviation deviates from the threshold value, alignment processing is performed. Hereinafter, a case where the measured deviation deviates from the threshold will be described.

When the measured deviation deviates from the threshold value, the substrate Z actuator 250 is driven to lift the substrate 10 and away from the mask 220 as shown in FIG. 18B. In Fig. 18(c), based on the deviation measured by the camera 261, the XY? actuator is driven to perform positioning. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, and both the substrate 10 and the mask 220 may be You may adjust the position.

After that, as shown in Fig. 18(d), the substrate 10 is again lowered to a position where the second alignment is performed, and the substrate 10 is placed on the mask 220 again. Then, the alignment marks of the substrate 10 and the mask 220 are photographed by the camera 261, and the shift is measured. When the measured deviation deviates from the threshold value, the above-described alignment processing is repeated.

When the deviation falls within the threshold, the substrate holding unit 210 is lowered while holding the substrate 10, as shown in Figs. 19(a) to 19(b), and the substrate holding unit 210 ) And the height of the mask 220 are matched. As a result, the entire substrate 10 is placed on the mask 220. After that, the cooling plate Z actuator 252 is driven to lower the cooling plate 230 to make it in close contact with the substrate 10. By the above process, the mounting process of the substrate 10 on the mask 220 is completed, and a film forming process (deposition process) by a film forming apparatus is performed.

(Variation example of 2nd alignment process)

In this embodiment, as shown in Figs. 18 (a) to 18 (d), an example in which the second alignment is repeated while holding the substrate 10 by the holding mechanism has been described, but as another example, the substrate When (10) is mounted on the mask 220, the clamping mechanism may be released, or the clamping force of the clamping mechanism may be weakened (the clamping force may be loosened). A specific example of operation is shown in Figs. 27 to 30. In the following description, in the drawings, the clamping mechanism for supporting the right edge is referred to as a right clamping mechanism, and the clamping mechanism for supporting the left edge is referred to as a left clamping mechanism.

27 shows an operation example of placing the substrate 10 on the mask 220 in a state in which the clamping mechanisms on both the left and right sides are released. The operations of FIGS. 27(a) to 27(c) are the same as those of FIGS. 18(a) to 18(c). When the position adjustment of the substrate 10 in Fig. 27(c) is finished, as shown in Fig. 27(d), the presser 302 is raised to release the clamping mechanisms on both the left and right sides (the clamping force = 0). State). Thereafter, as shown in Fig. 27(e), the substrate 10 is lowered to the position where the second alignment is performed while in the released state, and the substrate 10 is placed on the mask 220 again. Then, the alignment mark of the substrate 10 and the mask 220 is photographed by the camera 261, and the shift is measured. When the measured deviation exceeds the threshold value, after the clamping mechanisms on both the left and right sides are held in a clamping state, the processes of Figs. 27(b) to 27(e) are repeated. On the other hand, when the deviation falls within the threshold value, the second alignment is ended, and the next operation (Fig. 19 or Fig. 21 or Fig. 22) is shifted.

28 shows an example of an operation of placing the substrate 10 on the mask 220 in a state in which only one of the holding mechanisms is released. Operations from Figs. 28(a) to 28(c) are the same as those of Figs. 18(a) to 18(c). When the position adjustment of the substrate 10 in Fig. 28(c) is finished, as shown in Fig. 28(d), only the presser 302 on one side (in the illustrated example, the right side) is raised, and the right side is clamped. Only the instrument is set to the liberated state (interacting force = 0). The left holding mechanism remains in the state of holding the left side of the substrate 10. Thereafter, as shown in Fig. 28(e), the substrate 10 is lowered to the position where the second alignment is performed while only one of the substrates 10 is held, and the substrate 10 is moved to the mask 220. Relocate the prize. Subsequent processing is the same as the operation example in FIG. 27.

FIG. 29 shows an operation example of placing the substrate 10 on the mask 220 in a state in which the clamping force of one clamping mechanism is weaker than the clamping force of the other clamping mechanism. Operations from Figs. 29(a) to 29(c) are the same as those of Figs. 18(a) to 18(c). When the position adjustment of the substrate 10 in Fig. 29(c) is finished, as shown in Fig. 29(d), the pressurization pressure of the pressurization port 302 on one side (the right side in the illustrated example) is weakened, and the right side The clamping force of the clamping mechanism is weaker than that of the normal city (for example, at 17(d)). The clamping force of the clamping mechanism on the left is the same as usual. The white arrows in the drawing schematically indicate the strength of the gripping force. For example, the clamping force in normal time is preferably such that even when a horizontal force acts on the substrate 10, the clamping position of the substrate 10 by the clamping mechanism is not easily shifted. On the other hand, the clamping force of the right clamping mechanism in the case of FIG. 29(d) is preferably such that the clamping position of the substrate 10 is relatively easily shifted when a horizontal force acts on the substrate 10. . Thereafter, as shown in Fig. 29(e), the substrate 10 is lowered to the position where the second alignment is performed while the holding force on one side is weakened, and the substrate 10 is placed on the mask 220. Be wit again. Subsequent processing is the same as the operation example in FIG. 27.

30 shows an operation example of placing the substrate 10 on the mask 220 in a state in which the clamping force of the clamping mechanisms on both the left and right sides is weaker than usual. Operations from Figs. 30(a) to 30(c) are the same as those of Figs. 18(a) to 18(c). When the position adjustment of the substrate 10 in FIG. 30(c) is finished, as shown in FIG. 30(d), the pressing force of the pressing tool 302 is weakened, so that the clamping force of the clamping mechanisms on the left and right sides is normally reduced. It is weaker than the gripping force of poetry (for example, when it is 17(d)). The clamping force in the case of Fig. 30(d) is preferably such that the clamping position of the substrate 10 by the clamping mechanism is relatively easily shifted when a horizontal force acts on the substrate 10. Thereafter, as shown in Fig. 30(e), the substrate 10 is lowered to the position where the second alignment is performed while the holding force is weakened, and the substrate 10 is placed on the mask 220 again. do. Subsequent processing is the same as the operation example in FIG. 27.

As illustrated in Figs. 27 to 30, by placing the substrate 10 on the mask 220 again with the holding mechanism in the released state or with the holding force weaker than usual, the substrate 10 When the deflection of the mask 220 is spread along the mounting surface of the mask 220, the peripheral portion of the substrate 10 is pushed outward, so that unnecessary stress is not applied to the substrate 10. Therefore, while the adhesion between the substrate 10 and the mask 220 increases, the position of the substrate 10 is shifted or the surface of the substrate 10 is shifted when the substrate 10 is placed on the mask 220. Rubbing with this mask 220 can be suppressed. As a result, it is possible to improve the positioning accuracy of the second alignment.

In Figs. 27 to 30, after adjusting the position of the substrate 10, before starting the lowering of the substrate 10, control is performed to release or weaken the grip. However, before the substrate 10 comes into contact with the mask 220 and the sagging of the substrate 10 starts to unfold, the above-described effect can be obtained by performing the control to release or weaken the pinch. For example, the substrate ( Before performing the position adjustment of 10), or after starting the lowering of the substrate 10 (however, before the substrate 10 comes into contact with the mask 220), the grip may be released or weakened.

<Example 4>

A method of placing a substrate according to the fourth embodiment of the present invention will be described based on FIG. 20. 20 shows a process of transferring the substrate 10 to the position of the second alignment after the first alignment described in the third embodiment.

When the first alignment process is completed in FIGS. 16A to 16C, the substrate 10 is lowered as shown in FIG. 20A. And, as shown in Fig. 20 (b), after a part of the substrate 10 (for example, the central portion of the substrate 10 sagging by its own weight) contacts the mask 220, the pressure port 302 is raised. And the holding mechanism is released. Subsequently, as shown in Fig. 20(c), after lowering the substrate holding unit 210 to the position where the second alignment is performed while in the released state (non-interrupted state), as shown in Fig. 20(d) Similarly, the periphery of the substrate 10 is reciprocated by the clamping mechanism. The processing after that is the same as in Example 3.

In this embodiment, as shown in Fig. 20(a), the substrate 10 is lowered while holding the substrate 10 by a holding mechanism until the substrate 10 comes into contact with the mask 220. . Accordingly, there is an advantage in that the position of the substrate 10 can be prevented from being shifted in the process of bringing the substrate 10 close to the mask 20. In addition, in this embodiment, as shown in Figs. 20(b) to 20(d), when the substrate 10 comes into contact with the mask 220, the holding mechanism is released, and the holding mechanism is kept in the released state. The substrate 10 is placed on the mask 220. Therefore, when the substrate 10, which has been sagging by its own weight, returns to the mask 220 to be flat, since the peripheral edge of the substrate 10 is pushed outward, unnecessary stress is not applied to the substrate 10. Accordingly, the adhesion between the substrate 10 and the mask 220 increases, and at the same time, when the substrate 10 is placed on the mask 220, the position of the substrate 10 is shifted or the surface of the substrate 10 220) and rubbing can be suppressed.

<Example 5>

A method for placing a substrate according to the fifth embodiment of the present invention will be described based on FIG. 21. FIG. 21 illustrates a process of bringing the entire surface of the substrate 10 into close contact with the mask 220 after the second alignment described in the third embodiment.

When the 2nd alignment process is completed in FIGS. 18(a) to 18(d), as shown in FIG. 21(a), the holding mechanism is again brought into the released state. Then, as shown in Fig. 21(b), the substrate holding unit 210 is lowered, so that the support surface of the substrate holding unit 210 and the height of the mask 220 are equal to each other, and the holding state is again held. . The processing after that is the same as in other examples. According to the method of this embodiment, it is possible to suppress the positional shift of the substrate 10 that occurs after the second alignment. In addition, as shown in Fig. 27(e), when the holding mechanism is in the released state at the time of completion of the second alignment process, the operation of Fig. 21(a) can be omitted.

<Example 6>

A method for placing a substrate according to the sixth embodiment of the present invention will be described based on FIG. 22. 22 illustrates a process of bringing the entire surface of the substrate 10 into close contact with the mask 220 after the second alignment described in the third embodiment.

When the 2nd alignment process in FIGS. 18(a) to 18(d) is completed, as shown in FIG. 22(a), the holding mechanism is again brought into the released state. Then, the substrate holding unit 210 is lowered as shown in FIG. 22(b), so that the support surface of the substrate holding unit 210 and the height of the mask 220 are matched. As a result, the entire substrate 10 is placed on the mask 220. After that, the cooling plate Z actuator 252 is driven to lower the cooling plate 230 to make it in close contact with the substrate 10. The subsequent processing is the same as in other examples. In addition, as shown in Fig. 27(e), when the holding mechanism is in the released state at the time of completion of the second alignment process, the operation of Fig. 22(a) can be omitted.

In the method of this embodiment, after the second alignment treatment, with the holding mechanism in the released state, the substrate 10 is lowered (placed), the cooling plate 230 is lowered, and the cooling plate 230 is applied to the substrate 10 It differs from Example 5 in that it performs a series of processing of fixing of. Also in the method of this embodiment, as in the fifth embodiment, it is possible to suppress the displacement of the substrate 10 that occurs after the second alignment.

<Example of an electronic device manufacturing method>

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of an organic EL display device are illustrated as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 26(a) is an overall view of the organic EL display device 60, and Fig. 26(b) shows a cross-sectional structure of one pixel.

As shown in Fig. 26(a), in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Details will be described later, but each of the light-emitting devices has a structure including an organic layer sandwiched between a pair of electrodes. Incidentally, the pixel referred to herein refers to a minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that exhibit different light emission. Has been. The pixel 62 is mostly composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and it is particularly limited if it is at least one color no.

Fig. 26(b) is a schematic partial cross-sectional view taken along line A-B in Fig. 26(a). The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, an emission layer 66R, 66G, 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 63. ) Has an organic EL device. Among these, the hole transport layer 65, the emission layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In this embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light-emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light-emitting elements emitting red, green, and blue colors (also referred to as organic EL elements), respectively. In addition, the first electrode 64 is formed separately for each light emitting device. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. In addition, in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign objects, an insulating layer 69 is provided between the first electrode 64. Further, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture or oxygen is provided.

In order to form the organic EL layer in units of light emitting devices, a method of forming a film through a mask is used. BACKGROUND ART In recent years, high precision of display devices is in progress, and a mask having an opening width of several tens of μm is used to form an organic EL layer. In the case of film formation using such a mask, if the mask is thermally deformed by receiving heat from an evaporation source during film formation, the position between the mask and the substrate is shifted, and the pattern of the thin film formed on the substrate is shifted from the desired position and formed. Accordingly, the film forming apparatus (vacuum vapor deposition apparatus) according to the present invention is suitably used for forming these organic EL layers.

Next, an example of a method of manufacturing an organic EL display device will be described in detail.

First, a circuit (not shown) for driving an organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

On the substrate 63 on which the first electrode 64 is formed, an acrylic resin is formed by spin coating, and the acrylic resin is patterned to form an opening in the portion where the first electrode 64 is formed by a lithography method, and the insulating layer 69 To form. This opening corresponds to a light-emitting region in which the light-emitting element actually emits light.

The substrate 63 with the insulating layer 69 patterned thereon is carried into the first film forming apparatus to hold the substrate with the substrate holding unit, and the hole transport layer 65 is a common layer on the first electrode 64 in the display area. It is formed as The hole transport layer 65 is formed by vacuum evaporation. Actually, since the hole transport layer 65 is formed to have a size larger than that of the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second film forming apparatus, and is held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a light-emitting layer 66R emitting red is formed on a portion of the substrate 63 in which an element emitting red is disposed. According to this example, since the mask and the substrate can be satisfactorily overlapped and matched, high-precision film formation can be performed.

Similar to the film formation of the light-emitting layer 66R, the light-emitting layer 66G emitting green is formed by the third film forming device, and further, the light-emitting layer 66B emitting blue color is formed by the fourth film-forming device. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is moved to a sputtering device to form the second electrode 68, and then transferred to a plasma CVD device to form a protective layer 70 to complete the organic EL display device 60. do.

From the time the substrate 63 on which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when exposed to an atmosphere containing moisture or oxygen, the light emitting layer made of an organic EL material is There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the carrying in and carrying out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device obtained as described above, a light emitting layer is formed for each light emitting element with high precision. Therefore, by using the above manufacturing method, it is possible to suppress the occurrence of defects in the organic EL display device due to a positional shift of the light emitting layer.

In addition, the above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and appropriate modifications are possible within the scope of the technical idea. For example, in the above embodiment, the substrate is moved by the substrate holding unit, but the mask as a placeholder or both the substrate and the mask may be moved. In that case, in addition to the moving means for the substrate, a moving means for the mounting body may be provided. In addition, in the above embodiment, the camera used for measurement was divided into the first alignment and the second alignment, but the same camera may be used for the first alignment and the second alignment, and both the first alignment and the second alignment It is okay to use cameras 260 and 261.

1, 20: Mask
2, 10: substrate
6, 210: Substrate holding unit
7, 300: Earth
8, 302: pressure port
60: Organic EL display device

Claims (35)

As a substrate placing method of placing a substrate on a mask,
A first clamping step of setting a first clamping state for clamping the peripheral edge of the substrate by a clamping mechanism;
A releasing step in which the peripheral portion of the substrate is not pinched by the holding mechanism from the first holding state;
A placing process of placing the substrate on the mask in the released state,
And a second clamping step of setting the substrate to a second clamping state in which the peripheral portion of the substrate is clamped by the clamping mechanism while the substrate is placed on the mask. The method of claim 1,
And a first position adjustment step of adjusting a relative position of the substrate and the mask in a direction parallel to the surface of the mask between the first clamping step and the releasing step. Way. As a substrate placing method of placing a substrate on a mask,
A first clamping step of setting a first clamping state for clamping the peripheral edge of the substrate by a clamping mechanism;
A placing process of placing the substrate on the mask in the first holding state,
In a state in which the substrate is placed on the mask, a second clamping step of setting the peripheral edge of the substrate to a second clamping state in which the peripheral edge of the substrate is clamped again after the clamping mechanism does not clamp the peripheral edge of the substrate. A method for placing a substrate, characterized in that. The method of claim 3,
And a first positioning step of adjusting a relative position between the substrate and the mask in a direction parallel to the surface of the mask between the first holding step and the mounting step. Way. The method of claim 1 or 3,
The state in which the substrate is placed on the mask,
A substrate placing method, wherein at least a portion of the substrate is in contact with the mask. The method of claim 1 or 3,
The substrate mounting method, wherein the mask has a predetermined opening pattern. delete delete delete The method of claim 1 or 3,
And a second position adjusting step of adjusting a relative position between the substrate and the mask in a direction parallel to the surface of the mask after the second clamping step. The method of claim 10,
The second position adjustment process,
A step of separating the substrate from the mask,
And a step of aligning the substrate and the mask in a direction parallel to the surface of the mask. The method of claim 10,
The second position adjustment process,
A step of measuring a relative displacement amount between the substrate and the mask while the substrate is placed on the mask,
A step of separating the substrate from the mask,
A step of aligning the substrate and the mask in a direction parallel to the surface of the mask based on the measured relative displacement amount;
Step of placing the substrate on the mask again after performing the alignment
Substrate mounting method comprising a. The method of claim 12,
The step of placing the substrate on the mask again is in a state in which the clamping of the substrate by the clamping mechanism is released, or in a state in which the clamping force of the clamping mechanism is weaker than the clamping force in the second clamping step. A method for placing a substrate, characterized in that it is performed. The method of claim 12,
The holding mechanism has two holding mechanisms for holding two opposite edges of the peripheral edge of the substrate, respectively,
In the step of placing the substrate on the mask again, the holding of the substrate by one of the two holding mechanisms is released, or the holding force of one of the two holding mechanisms is different. A method for placing a substrate, characterized in that it is performed in a state that is weaker than the clamping force of the clamping mechanism on the side. The method of claim 10,
After the second positioning process, a process of placing the entire substrate on the mask,
And an adhesion step of intimately bringing the substrate into contact with the mask by pressing the plate member against the substrate. The method of claim 15,
The substrate placing method, wherein the step of placing the entire substrate on the mask is performed in a state in which the holding of the substrate by the holding mechanism is released. The method of claim 16,
After the step of placing the entire substrate on the mask, a step of holding the peripheral portion of the substrate by the holding mechanism,
In the adhesion step, the plate member is pressed against the substrate while the peripheral portion of the substrate is held by the holding mechanism. The method of claim 16,
The substrate mounting method, wherein in the adhesion step, the plate member is pressed against the substrate while the holding of the substrate by the holding mechanism is released. delete delete delete delete delete As a film forming method for forming a film of a predetermined pattern on a substrate,
A step of placing the substrate on the mask by the substrate placing method of claim 1 or 3, and
A film formation method comprising a step of forming a film on the substrate. A method of manufacturing an electronic device having a metal film formed on a substrate, comprising:
An electronic device manufacturing method, wherein the metal film is formed by the film forming method according to claim 24. A method for manufacturing an electronic device having an organic film formed on a substrate, comprising:
An electronic device manufacturing method, wherein the organic film is formed by the film forming method according to claim 24. The method of claim 26,
The electronic device manufacturing method, wherein the electronic device is a display panel of an organic EL display device. A substrate placing device for placing a substrate on a mask,
A holding mechanism for holding the periphery of the substrate,
A height adjustment means for adjusting a relative position between the substrate and the mask in the thickness direction of the substrate,
And a control means for controlling the holding mechanism and the height adjustment means,
The control means mounts the substrate on the mask after the first clamping state in which the peripheral edge of the substrate is clamped by the clamping mechanism is brought to a release state in which the peripheral edge of the substrate is not clamped by the clamping mechanism. And, in a state in which the substrate is placed on the mask, the clamping mechanism and the height adjusting means are controlled so that the clamping mechanism enters a second clamping state for clamping the substrate from the release state. . A substrate placing device for placing a substrate on a mask,
A holding mechanism for holding the periphery of the substrate,
A height adjustment means for adjusting a relative position between the substrate and the mask in the thickness direction of the substrate,
And a control means for controlling the holding mechanism and the height adjustment means,
The control means includes the substrate being placed on the mask in a first holding state in which the peripheral portion of the substrate is held by the holding mechanism, and then the substrate is placed on the mask by the holding mechanism. And the holding mechanism and the height adjusting means are controlled so that the peripheral edge of the substrate is not pinched, and then the second pinching state is again pinched to the peripheral edge of the substrate. The method of claim 28 or 29,
The state in which the substrate is placed on the mask,
A substrate placing apparatus, wherein at least a part of the substrate is in contact with the mask. The method of claim 28 or 29,
The holding mechanism includes a support tool for supporting the substrate and a pressing tool for pressing the substrate against the support tool. delete The method of claim 28 or 29,
And a position adjusting means for adjusting a relative position between the substrate and the mask in a direction parallel to the surface of the mask. The method of claim 28 or 29,
The substrate mounting apparatus, wherein the mask has a predetermined opening pattern. A film forming apparatus for forming a film of a predetermined pattern on a substrate,
The substrate placing device of claim 28 or 29, wherein the substrate is placed on the mask,
And means for forming a film on the substrate.

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