JP6448067B2 - Substrate mounting method, substrate mounting mechanism, film forming method, film forming apparatus, and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a substrate mounting method, a mounting mechanism, a film forming method, a film forming apparatus, and an electronic device manufacturing method when forming a film on a substrate.

Conventionally, in manufacturing an electronic device, a peripheral portion of a substrate transported into a vacuum chamber is sandwiched by a plurality of sandwiching tools, and the sandwiched substrate is lowered and placed on a mask (mounting body). Then, a predetermined pattern formed on the mask is formed on the substrate by vapor deposition.
Since the substrate has a film formation region in the central part of the substrate, the peripheral part of the substrate (for example, a pair of opposing side parts) is clamped by the clamping tool, so that the central part of the substrate is bent downward by its own weight. Then, when the substrate is lowered, first, the bent central portion comes into contact with the mask, and then the contact area expands toward the periphery of the central portion and comes into full contact.
However, when the central portion of the substrate bent by its own weight comes into contact with the mask, free movement is hindered by the contact frictional force between the substrate and the mask, and the substrate is distorted. Due to this distortion, a gap is generated between the mask and the substrate, and the adhesion between the mask and the substrate is lowered, which causes film blurring and the like.
In particular, in recent years, the substrate has become larger and thinner, and the influence of bending due to the weight of the substrate has increased.

As a technique for improving the adhesion between the substrate and the mask, for example, a technique disclosed in Patent Document 1 has been proposed.
In this Patent Document 1, the upper surface of the substrate is pressed toward the mask side so that the substrate and the mask are in close contact, and a substrate-mask contact unit that can be deformed along the bent shape of the substrate is provided. It is configured to apply pressure to adhere to the mask.

JP 2009-277655 A

However, in Patent Document 1, since the substrate is only pressurized by the substrate-mask contact unit, the distortion of the substrate itself cannot be removed.
An object of the present invention is to remove the distortion of a substrate that occurs when a substrate bent by its own weight is mounted on a mounting body.

In order to achieve the above object, the substrate mounting method of the present invention comprises:
A supporting step for supporting the periphery of the substrate;
A substrate placement method comprising placing a supported substrate on a placement body,
The previous placement process is
One end side of the supported substrate is brought into contact with the mounting body, and then the other end side of the substrate is brought into contact with the mounting body to place the substrate on the mounting body .
In the supporting step, among a plurality of supporting means for supporting the peripheral edge of the substrate, one end of the substrate is supported by some supporting means, and the other end of the substrate is supported by other supporting means,
In the placing step, the part of the supporting means is lowered before the other supporting means,
The other supporting means is lowered later, and the other supporting means is configured to support the substrate so that the supporting position of the supporting substrate is movable.
The supporting means is a holding tool for holding the periphery of the substrate, and the holding tools constituting the other supporting means hold the substrate with a holding force that can move the holding position of the holding substrate. And

The substrate mounting mechanism of the present invention is
A substrate mounting mechanism for mounting a substrate on a mounting body,
A plurality of support means for supporting the periphery of the substrate;
Elevating means for elevating and lowering the plurality of support means;
Furthermore, have a, and a control means for said plurality of supporting means controls said elevating means for movement independently,
In the configuration in which one end of the substrate is supported by a part of the plurality of support units and the other end of the substrate is supported by the other support unit.
The part of the support means and the other support means are each a holding tool for holding the substrate,
It is characterized by having a clamping force variable means for independently varying the clamping force of the clamping tool of the part of the supporting means and the clamping force of the clamping tool of the other supporting means .

The film forming method of the present invention is a film forming method for forming a predetermined pattern on a substrate,
After the substrate is placed on the placement body by the substrate placement method, the substrate placement method further includes a second position adjustment step of adjusting a relative position between the substrate and the placement body,
The mounting body is a mask having a predetermined pattern, which is used to form a predetermined pattern on the substrate, and the relative position between the substrate and the mask in the second position adjustment step. A film having a predetermined pattern is formed on the substrate after the adjustment.
The film forming apparatus of the present invention is a film forming apparatus for forming a predetermined pattern on a substrate,
The substrate mounting mechanism is provided, and the mounting body includes a mask having the predetermined pattern.
The electronic device manufacturing method of the present invention is an electronic device manufacturing method having an organic film formed on a substrate, and an organic film or a metal film is formed on the substrate by the film forming method described above. It is characterized by that.

  According to the present invention, when the substrate is placed on the mounting body, the substrate sequentially contacts the other end side from the one end side with respect to the mounting body. The distortion can be removed on the other end side. Therefore, the displacement due to the distortion of the substrate with respect to the mounting body becomes a displacement in a certain direction, and the amount of displacement (amount, direction) becomes reproducible, so the number of alignment operations can be reduced and the time required for alignment is also shortened. can do.

FIG. 1 is a top view schematically showing a part of a configuration of an electronic device manufacturing apparatus. FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. FIG. 3 is a perspective view of a substrate holding unit including a substrate holding mechanism. 4A is an overall view of the organic EL display device 60, and FIG. 4B is a diagram showing a cross-sectional structure of one pixel. FIG. 5 is a diagram showing Embodiment 1 of the substrate mounting method of the present invention. FIG. 6 is a view showing Embodiment 2 of the substrate mounting method of the present invention. FIG. 7 is an explanatory diagram of alignment adjustment.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, dimensions, materials, shapes, and the like limit the scope of the present invention only to those unless otherwise specified. It is not intended.
The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and more particularly, to a technique for highly accurate conveyance and position adjustment of a substrate. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition on the surface of a parallel plate substrate. Arbitrary materials such as glass, resin, and metal can be selected as the material of the substrate, and any material such as organic material and inorganic material (metal, metal oxide, etc.) can be selected as the vapor deposition material. Specifically, the technology of the present invention can be applied to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members, and the like. In particular, the organic EL display device manufacturing apparatus is required to further improve the substrate transport accuracy and the substrate / mask alignment accuracy by increasing the size of the substrate or increasing the definition of the display panel. This is one example.

<Manufacturing equipment and manufacturing process>
FIG. 1 is a top view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to produce a plurality of small size panels. The
An electronic device manufacturing apparatus generally has a plurality of film forming chambers 111 and 112 and a transfer chamber 110 as shown in FIG. In the transfer chamber 110, a transfer robot 119 for holding and transferring the substrate 10 is provided. The transfer robot 119 is, for example, a robot having a structure in which a robot hand that holds a substrate is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.
Each of the film formation chambers 111 and 112 is provided with a film formation apparatus (also referred to as a vapor deposition apparatus). A series of film formation processes such as delivery of the substrate 10 to the transfer robot 119, adjustment of the relative position between the substrate 10 and the mask (alignment), fixation of the substrate 10 on the mask, film formation (evaporation) are performed by the film formation apparatus. It is done automatically. The film forming apparatus in each film forming chamber has almost the same basic structure (particularly, the structure related to substrate transport and alignment), although there are differences in details such as the difference in vapor deposition source and mask. . Hereinafter, a common configuration of the film forming apparatuses in the respective film forming chambers will be described.

<Deposition system>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. At the time of film formation, the substrate is fixed so as to be parallel to the horizontal plane (XY plane), and the short direction (direction parallel to the short side) of the substrate at this time is the X direction, and the long direction (direction parallel to the long side). ) In the Y direction. The rotation angle around the Z axis is represented by θ.
The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In general, a substrate holding unit 210, a mask 220, a mask base 21, a cooling plate 230, and a vapor deposition source 240 are provided inside the vacuum chamber 200. The substrate holding unit 210 is means for holding and transporting the substrate 10 received from the transport robot 119, and is also called a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate 10, and is fixed on the frame-shaped mask base 21. The substrate 10 is placed on the mask 220 during film formation. Therefore, the mask 220 also serves as a mounting body on which the substrate 10 is mounted. The cooling plate 230 is a member that is in close contact with the substrate 10 (the surface opposite to the mask 220) during film formation and suppresses an increase in temperature of the substrate 10, thereby suppressing deterioration and deterioration of the organic material. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member that enhances the adhesion between the substrate 10 and the mask 220 during film formation by attracting the mask 220 with a magnetic force. The evaporation source 240 includes an evaporation material, a heater, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, and the like (all not shown).

A substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a θ actuator (not shown) are provided above (outside) the vacuum chamber 200. ing. These actuators include, for example, a motor and a ball screw, a motor and a linear guide, and the like. The substrate Z actuator 250 is a driving means for moving the entire substrate holding unit 210 up and down (moving in the Z direction). The clamp Z actuator 251 is a driving unit for opening and closing a clamping mechanism (described later) of the substrate holding unit 210. Cooling plate Z actuator 25
Reference numeral 2 denotes driving means for moving the cooling plate 230 up and down. The X actuator, Y actuator, and θ actuator (hereinafter collectively referred to as “XYθ actuator”) are drive means for alignment of the substrate 10. The XYθ actuator rotates the entire substrate holding unit 210 and the cooling plate 230 in the X direction, the Y direction, and θ rotation. In this embodiment, the X, Y, and θ of the substrate 10 are adjusted with the mask 220 fixed. However, the position of the mask 220 is adjusted, or the positions of both the substrate 10 and the mask 220 are adjusted. By adjusting, the substrate 10 and the mask 220 may be aligned.

  Cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220 are provided above (outside) the vacuum chamber 200 in order to align the substrate 10 and the mask 220. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through a window provided in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, each XY position and relative displacement in the XY plane can be measured. In order to achieve high-precision alignment in a short time, a first alignment that roughly aligns (also referred to as “rough alignment”) and a second alignment that aligns with high accuracy (also referred to as “fine alignment”). It is preferable to perform the two-stage alignment. In that case, it is preferable to use two types of cameras, a low-resolution but wide-field first alignment camera 260 and a narrow-field but high-resolution second alignment camera 261. In the present embodiment, for each of the substrate 10 and the mask 220, alignment marks attached to two locations on a pair of opposing sides are measured by two first alignment cameras 260, and the four corners of the substrate 10 and the mask 220 are measured. The alignment marks attached to are measured with four second alignment cameras 261.

The film forming apparatus includes a control unit 270. The control unit 270 controls the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XYθ actuator, and the cameras 260 and 261, as well as transport and alignment of the substrate 10, control of the evaporation source, film formation, etc. It has a function. The control unit 270 can be configured by a computer having a processor, memory, storage, I / O, and the like, for example. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. Note that a control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatuses.
Note that the components related to holding, transporting, and alignment of the substrate 10 (substrate holding unit 210, substrate Z actuator 250, clamp Z actuator 251, XYθ actuator, cameras 260, 261, control unit 270, etc.) "," Substrate transfer device "and the like.

<Board holding unit>
The configuration of the substrate holding unit 210 will be described with reference to FIG. FIG. 3 is a perspective view of the substrate holding unit 210.
The substrate holding unit 210 is means for holding and transporting the substrate 10 by holding the peripheral edge of the substrate 10 by the holding mechanism 310. Specifically, the substrate holding unit 210 includes a plurality of support frames 301 provided with a plurality of support tools 300 that support each of the four sides of the substrate 10 from below, and a plurality of the substrate 10 sandwiched between the support tools 300. And a clamp member 303 provided with the pressing tool 302. The pair of support tools 300 and the pressing tool 302 constitute one clamping mechanism. In the example of FIG. 3, three support tools 300 are arranged along the short side of the substrate 10, and six clamping mechanisms 310 (a pair of the support tool 300 and the pressing tool 302) are arranged along the long side, The long side is sandwiched between two sides. However, the configuration of the clamping mechanism is not limited to the example of FIG. 3, and the number and arrangement of the clamping mechanisms 310 may be changed as appropriate in accordance with the size and shape of the substrate to be processed or the film formation conditions. The support tool 300 is also called a “receiving claw” or “finger”, and the pressing tool 302 is also called a “clamp”.
For example, the transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed as follows. First, the clamp member 303 is raised by the clamp Z actuator 251, and the pressing tool 302 is separated from the support tool 300, so that the clamping mechanism is opened. After the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transport robot 119, the clamp member 303 is lowered by the clamp Z actuator 251, and the pressing tool 302 is pressed against the support tool 300 with a predetermined pressing force. As a result, the substrate 10 is sandwiched between the pressing tool 302 and the support tool 300. In this state, by driving the substrate holding unit 210 by the substrate Z actuator 250, the substrate 10 can be moved up and down (moved in the Z direction). Since the clamp Z actuator 251 is raised / lowered together with the substrate holding unit 210, the state of the clamping mechanism does not change even when the substrate holding unit 210 is raised / lowered.
3 indicates a second alignment alignment mark attached to the four corners of the substrate 10, and reference numeral 102 indicates a first alignment alignment mark attached to the center of the short side of the substrate 10. Show.

<Example of Manufacturing Method of Electronic Device>
Next, an example of an electronic device manufacturing method using the film forming apparatus of the present embodiment will be described. Hereinafter, as an example of an electronic device, a configuration and a manufacturing method of an organic EL display device will be exemplified.
First, an organic EL display device to be manufactured will be described. 4A shows an overall view of the organic EL display device 60, and FIG. 4B shows a cross-sectional structure of one pixel.
As shown in FIG. 4A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 each including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. Here, the pixel refers to a minimum unit that enables display of a desired color in the display area 61. In the case of the organic EL display device according to this example, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit different light. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element. It is not limited.

FIG. 4B is a schematic partial cross-sectional view taken along the line AB of FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66 </ b> R, 66 </ b> G, and 66 </ b> B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. And an organic EL element. Among these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting elements that emit red, green, and blue (sometimes referred to as organic EL elements). The first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62, or may be formed for each light emitting element. Note that an insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.
In order to form the organic EL layer in units of light emitting elements, a method of forming a film through a mask is used. In recent years, display devices have been improved in definition, and a mask having an opening width of several tens of μm is used for forming an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the position of the mask and the substrate is shifted, and the pattern of the thin film formed on the substrate is desired. It will be formed out of position. Therefore, a film forming apparatus (vacuum evaporation apparatus) according to the present invention is suitably used for forming these organic EL layers.
Next, an example of a method for manufacturing an organic EL display device will be specifically described.
First, a circuit (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.
An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in a portion where the first electrode 64 is formed. 69 is formed. This opening corresponds to a light emitting region where the light emitting element actually emits light.
The substrate 63 patterned with the insulating layer 69 is carried into the first film formation apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is a common layer on the first electrode 64 in the display region. As a film formation. The hole transport layer 65 is formed by vacuum deposition. Actually, since the hole transport layer 65 is formed in a size larger than the display region 61, a high-definition mask is not necessary.
Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 where the element that emits red is disposed. According to this example, the mask and the substrate can be satisfactorily overlapped, and highly accurate film formation can be performed.
Similarly to the formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third film forming apparatus, and the light emitting layer 66B that emits blue is formed by the fourth film forming apparatus. After the formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film formation apparatus. The electron transport layer 67 is formed as a layer common to the three-color light emitting layers 66R, 66G, and 66B.
The substrate on which the electron transport layer 67 has been formed is moved to the sputtering apparatus, the second electrode 68 is formed, and then the protective layer 70 is formed by moving to the plasma CVD apparatus, whereby the organic EL display device 60 is completed. To do.
From when the substrate 63 with the insulating layer 69 patterned is carried into the film formation apparatus until the film formation of the protective layer 70 is completed, if the light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen, There is a risk of deterioration due to moisture and oxygen. Therefore, in this example, the carrying-in / out of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.
In the organic EL display device thus obtained, a light emitting layer is accurately formed for each light emitting element. Therefore, if the manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer.

[Substrate mounting mechanism]
Next, the configuration of the substrate mounting mechanism of the present invention will be described in correspondence with the apparatus configuration of FIGS.
In the following description, a clamping mechanism 310 that clamps one long side is identified as a first clamping mechanism 310L, and a clamping mechanism 310 that clamps the other long side is identified as a second clamping mechanism 310R. And
That is, according to the present invention, the first clamping mechanism 310L and the second clamping mechanism 310R, which are a plurality of support means, and the substrate Z actuator 250 and the substrate Z auxiliary actuator 253 that move up and down the first clamping mechanism 310L and the second clamping mechanism 310R. (Lifting / lowering means), a clamp Z actuator 251 (clamping force variable means) for changing the clamping force of the first clamping mechanism 310L and the second clamping mechanism 310R independently, and the substrate Z actuator 250 and the substrate Z auxiliary actuator. 253 and a control unit 270 (control means) that controls the clamp Z actuator 251 at a predetermined timing.
The controller 270 controls the substrate Z actuator 250 and the substrate Z auxiliary actuator 253 so that the first clamping mechanisms 310L and 310R are independently movable. That is, the first clamping mechanism 310L is driven by the substrate Z actuator 250, and the second clamping mechanism 3
10R is configured to be driven by overlapping the movement amounts of the substrate Z auxiliary actuator 253 and the substrate Z actuator 250. However, the drive mechanism is not limited to such a configuration, and may be an actuator configuration that raises and lowers the first clamping mechanism 310L and the second clamping mechanism 310R independently.
Further, the control unit 270 controls the clamp Z actuator 251 so that the clamping force of the first clamping mechanism 310L and the clamping force of the second clamping mechanism 310R can be varied independently.
Further, when placing the substrate 10 on the mask 220, the controller 270 lowers the first clamping mechanism 310L before the other second clamping mechanism 310R, so that the second clamping mechanism 310R It controls so that it may descend | fall from after the 1st clamping mechanism 310L.

[Substrate mounting method]
[Embodiment 1]
Next, with reference to FIG. 5, Embodiment 1 of the substrate mounting method of the present invention will be described.
The substrate placing method of the present invention is a sandwiching method between sandwiching the transported substrate 10 and placing it on the mask 220, and sandwiching the substrate 10 (FIGS. 5A and 5B). And a placing step (FIGS. 5C and 5D) for placing the sandwiched substrate 10 on the mask 220.
In the placement step, one end of the supported substrate 10 is brought into contact with the mask 220, and then the other end of the substrate 10 is brought into contact with the mask 220 to place the substrate 10 on the mask 220.
<Clamping process>
FIG. 5A shows a state where the substrate 10 that has been transported is received.
That is, the substrate 10 is delivered from a transfer robot (not shown) with the first clamping mechanism 310L and the second clamping mechanism 310R opened.
At this time, one long side that is one end of the substrate 10 is supported on the support 300 of the first clamping mechanism 310L, and the other long side that is the other end of the substrate 10 is supported by the second clamping mechanism 310R. Supported on the tool 300. A plurality of first clamping mechanisms 310 </ b> L and second clamping mechanisms 310 </ b> R are arranged along each long side of the substrate 10, and each long side of the substrate 10 is supported by a plurality of supports 300.
In addition, although the short side is also supported by the plurality of support devices 300, in the following description, only the long side will be described, not the sandwiched portion.
FIG. 5B shows a state where the long sides on both sides of the substrate 10 are clamped by the first clamping mechanism 310L and the second clamping mechanism 310R. This clamping operation is performed by driving the clamp Z actuators 251 of the first clamping mechanism 310L and the second clamping mechanism 310R and moving the plurality of pressing tools 302 toward the support tool 300 via the clamp member 303. Hold with the pinch force. This clamping force is set to a size that does not cause the substrate 10 to deviate from the clamping position.
The substrate 10 sandwiched between the long sides on both sides by the first clamping mechanism 310L and the second clamping mechanism 310R is bent by its own weight, and is bent in a form in which the center of the substrate 10 is recessed.

<Installation process>
FIG. 5C shows a state in which the first clamping mechanism 310L provided on one long side is first lowered. The other second clamping mechanism 310R also descends with a delay.
The control unit 270 controls the timing at which the first clamping mechanism 310L and the second clamping mechanism are lowered, the time required for the lowering, the lowering speed, and the like.
Thus, the substrate 10 is not located at the center position, but one end side of the substrate 10, that is, a portion near the first clamping mechanism 310 </ b> L that has been lowered first comes into contact with the mask 220 first, and the second clamping mechanism 310 </ b> R The contact is made sequentially toward the other long side (the other end) that is sandwiched. For this reason, the distortion of the substrate 10 can be brought closer to the side that comes into contact with the mask 220 later, that is, the second clamping mechanism 310R side.
Then, after the substrate 10 contacts the mask 220, the second clamping mechanism 310R weakens the clamping force and then returns to the original clamping force. The pinching force to be weakened is set to such a magnitude that the holding position of the holding substrate 10 can be moved. More specifically, the clamping force that can move the clamping position is a clamping force that can move the clamping position by the force that acts on the substrate 10 from the mask 220.
As a result, the substrate is displaced between the support tool 300 and the pressing tool 302 of the second clamping mechanism 310R, and the distortion is eliminated.
FIG. 5D shows a state in which the substrate 10 is completely in close contact with the mask 220. In this state, similarly to the first clamping mechanism 310L, the clamping force of the second clamping mechanism 310R is set to a magnitude that does not allow the clamping position to be displaced. Then, the alignment mark between the substrate and the mask 220 is photographed with a camera, and the alignment adjustment between the substrate 10 and the mask 220 is performed. The alignment adjustment will be described later.

  As described above, according to the present invention, one of the first clamping mechanisms 310L is lowered before the second clamping mechanism 310R, and is brought into contact with the mask 220 from one end side (one long side) of the substrate 10. Thus, since the distortion generated in the substrate 10 is sequentially brought closer to the long side held by the second clamping mechanism 310R, the distortion can be reliably removed by weakening the clamping force of the second clamping mechanism 310R. In addition, since the distortion is brought closer to the second clamping mechanism 310R side, the deviation between the substrate 10 and the mask 220 becomes a deviation in a certain direction, and the reproducibility appears in the deviation amount (amount, direction). As a result, the number of alignment operations can be reduced.

[Embodiment 2]
Next, with reference to FIG. 6, Embodiment 2 of the substrate mounting method of this invention is demonstrated.
In the second embodiment, when the clamping force of the second clamping mechanism 310R is set to a clamping force that allows the clamping position of the clamping substrate 10 to move, the portion bent downward of the substrate 10 contacts the mask 220. It was set from before.
Clamping Step FIG. 6A shows a state in which the substrate 10 that has been transported is received, and is the same as FIG.
FIG. 6B shows a state in which the long sides on both sides of the substrate 10 are clamped by the first clamping mechanism 310L and the second clamping mechanism 310R. This clamping operation is performed by driving the clamp Z actuators 251 of the first clamping mechanism 310L and the second clamping mechanism 310R and moving the plurality of pressing tools 302 toward the support tool 300 via the clamp member 303. Hold with the pinch force.
In the second embodiment, the clamping force to be clamped by the first clamping mechanism 310L is set to such a magnitude that the substrate 10 does not move from the clamping position, and the clamping force of the second clamping mechanism 310R is weaker than that of the first clamping mechanism 310L. The substrate is clamped with a clamping force. This weak clamping force is set to such a magnitude that the substrate 10 moves from the clamping position.
The substrate 10 sandwiched between the long sides on both sides by the first clamping mechanism 310L and the second clamping mechanism 310R is bent by its own weight, and is bent in a form in which the center of the substrate 10 is recessed.

FIG. 6C shows a state in which the first clamping mechanism 310L provided on one long side is first lowered, as in the first embodiment. The other second clamping mechanism 310R also descends with a delay. The second clamping mechanism 310R is lowered in a state where the substrate is clamped with a weaker clamping force than the first clamping mechanism 310L.
The control unit 270 controls the timing at which the first clamping mechanism 310L and the second clamping mechanism are lowered, the time required for the lowering, the lowering speed, and the like.
Thus, the substrate 10 is not located at the center position, but the portion near the first clamping mechanism 310L that has been lowered first comes into contact with the mask 220 and faces the other long side that is clamped by the second clamping mechanism 310R. Then contact each other.
Therefore, the substrate 10 sequentially contacts the mask 220 from one side of the long side to the other, so that the distortion of the substrate 10 can be moved to the other side that contacts the mask 220 later. The warped distortion of the substrate 10 is eliminated by the substrate 10 being displaced between the pressing tool 302 and the support tool 300 of the second clamping mechanism 310R having a weak clamping force.
FIG. 6D shows a state where the substrate 10 is completely in close contact with the mask 220. In this state, similarly to the first clamping mechanism 310L, the clamping force of the second clamping mechanism 310R is set to a magnitude that does not allow the clamping position to be displaced. Then, the alignment mark between the substrate and the mask 220 is photographed with a camera, and the alignment adjustment between the substrate 10 and the mask 220 is performed. The alignment adjustment will be described later.
The first clamping mechanism 310L having a strong clamping force is lowered following the second clamping mechanism 310R having a weak clamping force, thereby intentionally shifting the distortion of the substrate 10 that occurs when the substrate 10 is placed. By eliminating this, reproducibility appears in the amount of deviation (amount, direction). As a result, the number of alignment operations is also reduced.
In each of the above embodiments, one end of the substrate 10 is sandwiched by the first sandwiching mechanism 310L and the second sandwiching mechanism 310R as a support means for supporting the other end. It is good also as a structure only supported by 300. Even in this case, one end side of the supported substrate 10 can be brought into contact with the mask 220, and then the other end side of the substrate 10 can be brought into contact with the mask 220. Moreover, in each said embodiment, although the long side part which opposes is supported as one end and the other end of the board | substrate 10, of course, it is good also as a short side side.

[Alignment adjustment]
Next, alignment adjustment will be described.
The alignment adjustment has a first alignment and a second alignment.
The first alignment is performed before the placing process of placing the substrate 10 on the mask 220.
The first alignment is an alignment process for performing rough alignment, and is also referred to as “rough alignment”. The first alignment is performed, for example, at the stage of FIGS. 5C and 6C.
That is, the camera 260 recognizes a substrate alignment mark provided on the substrate 10 and a mask alignment mark (not shown) provided on the mask 220, measures each XY position and relative displacement in the XY plane, and performs alignment. I do. The camera 260 used for the first alignment is a low-resolution but wide-field camera so that rough alignment is possible. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, or the positions of both the substrate 10 and the mask 220 may be adjusted. Also good.

FIG. 7A to FIG. 7E are diagrams for explaining the second alignment.
The second alignment is an alignment process that performs highly accurate alignment, and is also referred to as “fine alignment”. First, as shown in FIG. 7A, the camera alignment of the substrate alignment mark 101 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 is recognized by the camera 261, and each XY position or XY plane is recognized. Measure the relative displacement within. The camera 261 is a narrow-field but high-resolution camera so that high-precision positioning can be performed. When the measured deviation exceeds the threshold value, alignment processing is performed. Hereinafter, a case where the measured deviation exceeds the threshold will be described.

If the measured deviation exceeds the threshold value, the substrate Z actuator 250 is driven to raise the substrate 10 away from the mask 220 as shown in FIG. 7B.
In FIG. 7C, alignment is performed by driving the XYθ actuator based on the deviation measured by the camera 261. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, or the positions of both the substrate 10 and the mask 220 may be adjusted. Also good.
After that, as shown in FIG. 7D, the substrate 10 is lowered again, and the substrate 10 is placed on the mask 220. Then, as shown in FIG. 7E, the alignment marks of the substrate 10 and the mask 220 are photographed by the camera 261, and the deviation is measured. When the measured deviation exceeds the threshold value, the above-described alignment process is repeated.
When the deviation is within the threshold value, the cooling plate Z actuator shown in FIG. 2 is driven, and the cooling plate 230 is lowered to adhere to the substrate 10. In the present embodiment, the cooling plate 130 also serves as a magnet plate, and the adhesion between the substrate 10 and the mask 220 is enhanced by attracting the mask 220 with a magnetic force.

When the lowering of the cooling plate (magnet plate) is completed, as shown in FIG. 7B, the clamp member 303 is raised to release (unclamp) the long side portion of the substrate 10. Thereafter, as shown in FIG. 7C, the substrate holding unit 210 is lowered.
Through the above steps, the placement process of the substrate 10 on the mask 220 is completed, and the film formation process (evaporation process) by the film formation apparatus is performed.
According to the present embodiment, when the substrate 10 is held by the substrate holding unit 210, one long side is lowered first, and the portion near the first clamping mechanism of the substrate 10 is contacted first, and the contact portion Since the holding position is shifted by releasing the second holding mechanism side from the base point, the direction of the base point and the force is determined. This reduces the amount of alignment, and thus alignment can be completed with high accuracy and in a short time. Furthermore, the film forming process on the substrate can be completed with high accuracy and in a short time.
In addition, the board | substrate mounting method of said each Example is applicable in any scene before 1st alignment, between 1st alignment and 2nd alignment, and after 2nd alignment.

10 Substrate 220 Mask (mounting body)
250 Substrate Z actuator (lifting means)
253 Substrate Z auxiliary actuator (lifting means)
251 Clamp Z actuator (Clamping force variable means)
270 Control unit (control means)
310 clamping mechanism (support means, clamping tool)
300 Supporting Tool, 302 Pressing Tool, 303 Clamp Member 310L First Holding Mechanism (Supporting Means, Holding Tool)
310R second clamping mechanism (supporting means, clamping tool)
60 Organic EL display device

Claims (21)

A supporting step for supporting the periphery of the substrate;
A substrate placement method comprising placing a supported substrate on a placement body,
The previous placement process is
One end side of the supported substrate is brought into contact with the mounting body, and then the other end side of the substrate is brought into contact with the mounting body to place the substrate on the mounting body .
In the supporting step, among a plurality of supporting means for supporting the peripheral edge of the substrate, one end of the substrate is supported by some supporting means, and the other end of the substrate is supported by other supporting means,
In the placing step, the part of the supporting means is lowered before the other supporting means,
The other supporting means is lowered later, and the other supporting means is configured to support the substrate so that the supporting position of the supporting substrate is movable.
The supporting means is a holding tool for holding the periphery of the substrate, and the holding tools constituting the other supporting means hold the substrate with a holding force that can move the holding position of the holding substrate. based on plate mounting置方method shall be the. The substrate mounting method according to claim 1 , wherein the clamping force at which the clamping position is movable is a clamping force at which the clamping position can be moved by a force acting on the substrate from the mounting body. The timing at which the clamping tool of the other supporting means clamps the substrate with a clamping force capable of moving the clamping position of the sandwiched substrate includes a time point when the one end side of the substrate contacts the mounting body, after the contact. The substrate mounting method according to claim 1 or 2 , which is set. The timing at which the clamping tool of the other supporting means clamps the substrate with a clamping force that can move the clamping position of the clamping substrate is set before the one end side of the substrate contacts the mounting body. The substrate mounting method according to claim 1 or 2 . In the placing step, after placing the substrate on the placing body, the sandwiching tool of the some supporting means and the sandwiching tool of the other supporting means sandwich the substrate with the same sandwiching force. The substrate mounting method according to any one of claims 1 to 4 , wherein the substrate is placed on the substrate. In the placing step, after the substrate is placed on the placing body, the sandwiching position where the sandwiching tool of the some supporting means and the sandwiching tool of the other supporting means sandwich the substrate. There substrate mounting置方method according to any one of claims 1 to 5, characterized in that for holding the substrate in a lockable clamping force. The substrate mounting according to any one of claims 1 to 6 , further comprising a first position adjusting step of adjusting a relative position between the substrate and the mounting body before the placing step. Placement method. A substrate mounting mechanism for mounting a substrate on a mounting body,
A plurality of support means for supporting the periphery of the substrate;
Elevating means for elevating and lowering the plurality of support means;
Furthermore, have a, and a control means for said plurality of supporting means controls said elevating means for movement independently,
In the configuration in which one end of the substrate is supported by a part of the plurality of support units and the other end of the substrate is supported by the other support unit.
The part of the support means and the other support means are each a holding tool for holding the substrate,
A substrate mounting mechanism , comprising: a clamping force variable means for independently varying a clamping force of the clamping tool of the part of the supporting means and a clamping force of the clamping tool of the other supporting means . The control means causes the one end side of the substrate to contact the mounting body, and then the lifting means to place the substrate on the mounting body by bringing the other end side of the substrate into contact with the mounting body. The substrate mounting mechanism according to claim 8 to be controlled. The control means causes the one end side of the substrate to contact the mounting body, and then the lifting means to place the substrate on the mounting body by bringing the other end side of the substrate into contact with the mounting body. 9. The substrate according to claim 8 , wherein the holding force variable means is controlled so that the holding tool of the other supporting means holds the substrate with a holding force that can move the holding position of the held substrate. Placement mechanism. Timing for controlling the clamping force variable means by the control means so that the clamping tool of the other supporting means clamps the substrate with a clamping force that can move the clamping position of the sandwiched substrate is the substrate. The substrate mounting mechanism according to claim 10 , wherein the substrate mounting mechanism is set after contact, including a point in time when one end side of the substrate contacts the mounting table. Timing for controlling the clamping force variable means by the control means so that the clamping tool of the other supporting means clamps the substrate with a clamping force that can move the clamping position of the sandwiched substrate is the substrate. The substrate mounting mechanism according to claim 10 , wherein a portion bent downward is set before contacting the mounting table. The substrate mounting mechanism according to any one of claims 8 to 12 , wherein the part of the support means and the other support means each include a plurality of holding tools. The clamping jig is a support for supporting a substrate, mounting board according to the board in any one of claims 8 to 13, characterized in that it has a pressing device for pressing said support Placement mechanism. The board | substrate mounting mechanism as described in any one of Claims 8 thru | or 14 which has a mounting body raising / lowering means for raising / lowering the said mounting body. The substrate mounting mechanism according to any one of claims 8 to 14 , further comprising position adjusting means for adjusting a relative position between the substrate and the mounting body. A film forming method for forming a predetermined pattern on a substrate,
After the substrate is placed on the placement body by the substrate placement method according to any one of claims 1 to 7 , the relative position between the substrate and the placement body is further adjusted. 2 position adjustment steps,
The mounting body is a mask having a predetermined pattern, which is used to form a predetermined pattern on the substrate, and the relative position between the substrate and the mask in the second position adjustment step. A film forming method characterized in that a film having a predetermined pattern is formed on the substrate after adjustment. A film forming apparatus for forming a predetermined pattern on a substrate,
Has a substrate mounting mechanism according to any one of claims 8 to 16, pre-described mounting body is film forming apparatus characterized in that it comprises a mask having a predetermined pattern. A method of manufacturing an electronic device having an organic film formed on a substrate,
The method of manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 17 . A method of manufacturing an electronic device having a metal film formed on a substrate,
The method for manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 17 . The method of manufacturing an electronic device according to claim 19 or 20 , wherein the electronic device is a display panel of an organic EL display device.

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