JP2021073373A - Substrate mounting method, substrate holding device, and method for producing electronic device - Google Patents

Abstract

To provide a substrate mounting device which reduces variations in positions of substrates when mounting the substrates on a mounting body.SOLUTION: A substrate mounting device has support means containing a plurality of support tools 401-405 that support an edge of a substrate 10, and mounting means for mounting the substrate on a mounting body. For the plurality of support tools, a distance between some support tools is different from a distance between other support tools. Alternatively, the substrate mounting device has support means containing a plurality of support tools that support the edge of the substrate, support tool movement means that moves at least some of the plurality of support tools, independently of the other support tools, and mounting means for mounting the substrate on the mounting body.SELECTED DRAWING: Figure 4

Description

The present invention relates to a substrate mounting device, a film forming apparatus, a substrate mounting method, a film forming method, and a method for manufacturing an electronic device.

In recent years, the size and thickness of the substrate have been increasing, and the influence of the deflection due to the weight of the substrate is increasing. Further, since the film formation region is provided in the central portion of the substrate, the substrate can be supported and sandwiched only in the outer peripheral portion (peripheral portion) of the substrate.

In the prior art, a substrate mounting mechanism having a substrate support that supports the outer peripheral portions (four sides) of the substrate and mounting the substrate on a mounting body (for example, a mask) is used. Here, of the outer circumference of the substrate, one of the opposing side portions (for example, the long side portion) sandwiches the substrate, and the other facing side portion (for example, the short side portion) does not sandwich the substrate but only supports it.

JP-A-2009-277655

When the periphery of the substrate is supported as described above, the substrate bends due to its own weight, and the center of the substrate is dented. In addition, the substrate also bends around the area where only the support is provided. At this time, the aspect (deflection method) of the substrate is different for each substrate. Therefore, when the outer periphery of the substrate is supported by a plurality of supports, the contact state between the substrate and the plurality of supports also differs for each substrate. Further, when the substrate is placed on the mounting body (for example, a mask), a deviation occurs, but the deviation is also different for each substrate.

That is, when the substrate is mounted on the mounting body, there is a disadvantage that the position of the substrate on the mounting body is different for each substrate. This leads to an increase in the time required for alignment, which leads to an increase in manufacturing time (tact time).

In consideration of the above problems, it is an object of the present invention to suppress variations in each substrate when the substrate is mounted on the mounting body.

The substrate mounting device according to one aspect of the present invention is
A support means including a plurality of supports for supporting the peripheral edge of the substrate, and
A mounting means for mounting the substrate on the mounting body, and
With
The plurality of supports are characterized in that the distance between some of the supports is different from the distance between other supports.

The substrate mounting device according to one aspect of the present invention is
A support means including a plurality of supports for supporting the peripheral edge of the substrate, and
A support moving means for moving at least a part of the plurality of supports independently of the other supports, and a support moving means.
A mounting means for mounting the substrate on the mounting body, and
To be equipped.

The substrate mounting method according to one aspect of the present invention is
A support process in which the peripheral edge of the substrate is supported by a plurality of supports,
The mounting process of mounting the substrate on the mounting body and
Including
The plurality of supports are characterized in that the distance between some of the supports is different from the distance between other supports.

The substrate mounting method according to one aspect of the present invention is
A support process that supports the periphery of the board with multiple supports,
A support moving step of moving at least a part of the plurality of supports independently of the other supports, and a support moving step.
The mounting process of mounting the substrate on the mounting body and
including.

According to the present invention, it is possible to suppress variations among substrates when the substrate is placed on the mounting body. As a result, the time required for alignment and thus the entire manufacturing time can be shortened.

The upper view which shows a part of the structure of the manufacturing apparatus of an electronic device schematically. The cross-sectional view which shows the structure of the film forming apparatus schematically. The figure which shows the structure of the board holding unit. The figure explaining the substrate support method in Example 1. FIG. The method of mounting the board (reception of the board to support of the board) will be described. The method of mounting the substrate (first alignment) will be described. The method of mounting the substrate (second alignment) will be described. The method of mounting the substrate (second alignment) will be described. The method of mounting the substrate (cooling plate lowering-holding release) will be described. The figure explaining the substrate support method in Example 2. FIG. The figure explaining the substrate support method in Example 3. FIG. The figure explaining the substrate support method in Example 4. FIG. The figure explaining the substrate support method in the modification. The whole view of the organic EL display device and the figure which shows the cross-sectional structure of one pixel of an organic EL electronic device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to those configurations. Further, unless otherwise specified, the hardware configuration and software configuration, processing flow, manufacturing conditions, dimensions, materials, shapes, etc. of the apparatus in the following description are limited to those of the present invention. It is not the purpose.

The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and more particularly to a technique for highly accurate transfer and position adjustment of the substrate. The present invention can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern on the surface of a parallel plate substrate by vacuum deposition. Any material such as glass, resin, and metal can be selected as the substrate material, and any material such as organic material and inorganic material (metal, metal oxide, etc.) can be selected as the vapor deposition material.
Specifically, the technique of the present invention can be applied to manufacturing devices such as organic electronic devices (for example, organic EL display devices and thin film solar cells) and optical members. Among them, the manufacturing apparatus of the organic EL display device is required to further improve the transfer accuracy of the substrate and the alignment accuracy of the substrate and the mask by increasing the size of the substrate or increasing the definition of the display panel. Therefore, the preferred application of the present invention is made. This is one of the examples.

<Manufacturing equipment and manufacturing process>
FIG. 1 is an upper view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to produce a plurality of small-sized panels. To.

As shown in FIG. 1, an electronic device manufacturing apparatus generally has a plurality of film forming chambers 111 and 112 and a transport chamber 110. A transfer robot 119 that holds and conveys the substrate 10 is provided in the transfer chamber 110. The transfer robot 119 is, for example, a robot having a structure in which a robot hand for holding a substrate is attached to an articulated arm, and carries in / out the substrate 10 into each film forming chamber.

Each of the film forming chambers 111 and 112 is provided with a film forming apparatus (also called a vapor deposition apparatus). A series of film forming processes such as delivery of the substrate 10 to the transfer robot 119, adjustment (alignment) of the relative position between the substrate 10 and the mask, fixing of the substrate 10 on the mask, and film formation (deposited film deposition) are performed by a film forming apparatus. It is done automatically. The film forming apparatus in each film forming chamber has a basic configuration, although there are some minor differences such as whether the film forming target is an organic film or a metal film, a difference in a vapor deposition source, and a difference in a mask. (Especially the configuration related to substrate transfer and alignment) is almost the same. Hereinafter, the common configuration of the film forming apparatus in each film forming chamber will be described.

<Film formation equipment>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. In the following description, an XYZ Cartesian coordinate system with the vertical direction as the Z direction is used. The substrate is fixed so as to be parallel to the horizontal plane (XY plane) at the time of film formation, and the lateral direction (direction parallel to the short side) of the substrate at this time is the X direction and the longitudinal direction (direction parallel to the long side). ) Is the Y direction. The angle of rotation around the Z axis is represented by θ.

The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an atmosphere of an inert gas such as nitrogen gas. Inside the vacuum chamber 200, a substrate holding unit 210, a mask 220, a mask stand 221 and a cooling plate 230, and a vapor deposition source 240 are roughly provided. The board holding unit 210 is a means for holding and transporting the board 10 received from the transfer robot 119, and is also called a board holder. The mask 220 is a metal mask having an opening pattern corresponding to the thin film pattern formed on the substrate 10, and is fixed on the frame-shaped mask base 221. At the time of film formation, the substrate 10 is placed on the mask 220. Therefore, the mask 220 also serves as a mounting body on which the substrate 10 is mounted. The cooling plate 230 is a member that adheres to the substrate 10 (the surface opposite to the mask 220) during film formation and suppresses the temperature rise of the substrate 10 to suppress deterioration or deterioration of the organic material. The cooling plate 230 may also serve as a magnet plate. The magnet plate is a member that enhances the adhesion between the substrate 10 and the mask 220 at the time of film formation by attracting the mask 220 by a magnetic force. The thin-film deposition source 240 includes a thin-film deposition material, a heater, a shutter, a drive mechanism for the evaporation source, an evaporation rate monitor, and the like (all not shown).

A substrate Z actuator 250, a clamp Z actuator 251 and a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a θ actuator (not shown) are provided above (outside) the vacuum chamber 200. ing. These actuators are composed of, for example, a motor and a ball screw, a motor and a linear guide, and the like. The board Z actuator 250 is a driving means (board raising / lowering means) for raising / lowering (moving in the Z direction) the entire board holding unit 210. The clamp Z actuator 251 is a driving means for opening and closing the holding mechanism (described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is a driving means for raising and lowering the cooling plate 230. The X actuator, the Y actuator, and the θ actuator (hereinafter collectively referred to as “XY θ actuator”) are driving means for alignment of the substrate 10. The XYθ actuator moves the entire substrate holding unit 210 and the cooling plate 230 in the X direction, moves in the Y direction, and rotates θ. In the present embodiment, the X, Y, and θ of the substrate 10 are adjusted with the mask 220 fixed, but the position of the mask 220 is adjusted or the positions of both the substrate 10 and the mask 220 are adjusted. By adjusting, the substrate 10 and the mask 220 may be aligned.

On the upper side (outside) of the vacuum chamber 200, cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220, respectively, are provided for alignment of the substrate 10 and the mask 220. The cameras 260 and 261 photograph the substrate 10 and the mask 220 through a window provided in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, it is possible to measure each XY position and the relative deviation in the XY plane. In order to achieve high-precision alignment in a short time, the first alignment (also called "rough alignment") that roughly aligns and the second alignment (also called "fine alignment") that performs high-precision alignment It is preferable to carry out the two-step alignment of. In that case, it is preferable to use two types of cameras, a low-resolution but wide-field first alignment camera 260 and a narrow-field but high-resolution second alignment camera 261. In the present embodiment, for each of the substrate 10 and the mask 220, the alignment marks attached to the two opposite sides of the substrate 10 and the mask 220 are measured by two cameras 260 for the first alignment, and the four corners of the substrate 10 and the mask 220 are measured. The alignment mark attached to is measured by four cameras 261 for the second alignment.

The film forming apparatus has a control unit 270. The control unit 270 controls the substrate Z actuator 250, the clamp Z actuator 251 and the cooling plate Z actuator 252, the XYθ actuator, and the cameras 260 and 261, as well as the transfer and alignment of the substrate 10, the control of the vapor deposition source, and the control of the film formation. It has functions such as. The control unit 270 can be configured by, for example, a computer having a processor, memory, storage, I / O, and the like. In this case, the function of the control unit 270 is realized by the processor executing the program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or a built-in computer or a PLC (programmable logical controller) may be used. Alternatively, a part or all of the functions of the control unit 270 may be configured by a circuit such as an ASIC or FPGA. A control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatus.

The components (board holding unit 210, board Z actuator 250, clamp Z actuator 251 and XYθ actuator, cameras 260, 261 and control unit 270, etc.) related to the holding / transporting and alignment of the board 10 are "board mounting devices". , "Board holding device", "Board transfer device" and the like.

<Board holding unit>
The configuration of the substrate holding unit 210 will be described with reference to FIG. FIG. 3 is a perspective view of the substrate holding unit 210.

The substrate holding unit 210 is a means for holding and transporting the substrate 10 by sandwiching the peripheral edge portion of the substrate 10 by a sandwiching mechanism. Specifically, the substrate holding unit 210 is a substrate 10 between a support frame 301 provided with a plurality of supports 300 for supporting each of the four sides of the substrate 10 from below and the support 300 on the long side. It has a clamp member 303 provided with a plurality of pressing tools 302 for sandwiching the support tool 302, and a support tool moving mechanism 304 for moving the support tool 300 on the short side portion. A pair of supports 300 and a pressing member 302 form one holding mechanism. In the example of FIG. 3, three supports 300 are arranged along the short side of the substrate 10, and six holding mechanisms (a pair of the support 300 and the pressing tool 302) are arranged along the long side, and the length is long. It is configured to sandwich two sides. However, the configuration of the sandwiching mechanism is not limited to the example of FIG. 3, and the number and arrangement of the sandwiching mechanisms may be appropriately changed according to the size and shape of the substrate to be processed, the film forming conditions, and the like. The support 300 is also referred to as a "claw" or "finger", and the press 302 is also referred to as a "clamp".

The support tool moving mechanism 304 is a mechanism for moving the support tool 300 on the short side in the vertical direction (Z direction) and the direction along the short side (X direction). The support moving mechanism 304 allows some supports to move independently of the other supports. The support tool moving mechanism 304 is also provided for the support tool on the short side on the front side of the drawing, but the illustration is omitted for the sake of readability of the drawing. Further, in FIG. 3, the support tool moving mechanism 304 is provided only for the support tool 300 at the center of the short side portion, but the support tool moving mechanism 304 may be provided for the support tool 300 other than the center. It doesn't matter.

The transfer of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed, for example, as follows. First, the clamp member 303 is raised by the clamp Z actuator 251 to separate the pressing tool 302 from the support tool 300, thereby releasing the holding mechanism. After the substrate 10 is introduced between the support tool 300 and the pressing tool 302 by the transfer robot 119, the substrate 10 is supported by the support tool 300. By driving the board holding unit 210 by the board Z actuator 250 in this state, the board 10 can be moved up and down (moved in the Z direction). Since the clamp Z actuator 251 moves up / down together with the board holding unit 210, the state of the holding mechanism does not change even if the board holding unit 210 moves up and down.

Reference numeral 101 in FIG. 3 indicates an alignment mark for the second alignment attached to the four corners of the substrate 10, and reference numeral 102 indicates an alignment mark for the first alignment attached to the center of the short side of the substrate 10. Shown.

<Example 1>
4 (a) to 4 (d) show a method of supporting the substrate 10 by the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (mounting body) 220. It is a figure explaining.

FIG. 4A is a view of the substrate holding unit 210 and the substrate 10 as viewed from below. As shown in the figure, the support tool of the substrate holding unit 210 supports the peripheral edge portion 103 (supportable area) of the substrate 10. As described above, the long side of the substrate 10 is sandwiched between the support tool 300 and the pressing tool 302, while the short side of the substrate 10 is only supported by the support tool 300. Here, the supports other than a part of the support on the short side (support 403 in the figure) are located at the same height. This height is simply referred to as the reference height below.

4 (b) to 4 (d) are cross-sectional views of the central portion (FIG. 4 (c)) and the short side portion (FIGS. 4 (b) and (d)) of the substrate 10. In the central portion of the substrate 10, as shown in FIG. 4C, the central portion bends downward due to its own weight. On the other hand, in the short side portion of the substrate 10, as shown in FIGS. 4 (b) and 4 (d), the central support 403 is retracted downward from the reference height. Therefore, between the supports 402 and 404, the substrate 10 bends downward due to its own weight. The deflection of the substrate 10 between the other supports on the short sides is less than the deflection between the supports 402 and 404.

As described above, in this embodiment, the substrate 10 is positively bent at the short side portion by utilizing the weight of the substrate 10. As a result, even if there is a difference in habit for each substrate 10, the aspect (deflection method) of the deflection of the substrate 10 when the substrate holding unit 210 holds the substrate 10 can be made constant.

Although the central support 403 does not support the substrate 10 in the figure, the support 403 may support the substrate 10.

Hereinafter, a series of processes from the substrate holding unit 210 receiving the substrate 10 from the transfer robot and placing it on the mask (mounting body) 220 will be described with reference to FIGS. 5 to 9.

FIG. 5A shows a state in which the substrate 10 held by the robot hand 501 of the transfer robot 119 is delivered to the substrate holding unit 210. The center of the substrate 10 held by the robot hand 501 is bent downward due to its own weight. Therefore, the support 403 at the center of the short side is retracted downward to a position where it does not come into contact with the substrate 10 so that the substrate holding unit 210 can receive the substrate 10 while maintaining this shape of the substrate 10. In this way, by transferring the substrate 10 between the robot hand 501 and the substrate holding unit 210 while maintaining the deflection, it is possible to alleviate the deviation of the substrate at the time of delivery (at the time of receipt).

FIG. 5B shows a state in which the delivery of the substrate 10 is completed and the robot hand 501 is pulled out.

After the delivery is completed, the support 403 at the center on the short side is moved by the support moving mechanism 304 until it comes into contact with the substrate 10. FIG. 5C is a diagram showing a state after movement. The height of the support 403 after movement may be determined in advance, or may be measured and determined by a sensor. The central portion of the substrate 10 is lifted by the support 403, so that the downward bending is alleviated and the substrate 10 is supported by all the supports 401 to 405.

Next, as shown in FIG. 6A, the long side portion of the substrate 10 is sandwiched, and then the substrate 10 is lowered to a position where it does not come into contact with the mask 220. The holding of the long side portion of the substrate 10 is performed by lowering the clamp member 303 and pressing the pressing tool 302 against the supporting tool 300 with a predetermined pressing force. The lowering of the substrate 10 is performed by driving the substrate holding unit 210 by the substrate Z actuator 250. The substrate 10 may be placed on the mask 220 by raising and lowering the mask base 221 by the mounting body elevating means while keeping the height of the board holding unit 210 fixed.

Here, although the substrate 10 is lowered while the long side portion of the substrate 10 is sandwiched, the substrate 10 may be lowered without sandwiching the substrate 10.

FIG. 6B is a diagram showing the first alignment. The first alignment is an alignment process for roughly aligning, and is also called "rough alignment". In the first alignment, the camera 260 recognizes the substrate alignment mark 102 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220, and the respective XY positions and relative deviations in the XY plane are recognized. Is measured and alignment is performed. The camera 260 used for the first alignment is a low-resolution but wide-field camera so that it can be roughly aligned. At the time of alignment, the position of the substrate 10 (board holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, or the positions of both the substrate 10 and the mask 220 may be adjusted. May be good.

When the first alignment process is completed, the substrate 10 is further lowered as shown in FIG. 6C, and the substrate 10 is placed on the mask 220. Here, the state in which the substrate 10 is placed on the mask 220 means a state in which the substrate 10 and the mask 220 are in contact with each other. That is, the state in which the substrate 10 is placed on the mask 220 means that the substrate 10 starts contact with the mask 220, the contact area between the substrate 10 and the mask 220 increases from the contact start time, and the substrate 10 masks. Includes the state at any point in time when fully mounted on 220.

The support 403 at the center of the short side is located at a height lower than the other supports (height lower than the reference height), but when the substrate 10 is placed on the mask 220, FIG. 7 ( As shown in a), it is moved to the same height (reference height) as other supports by the support moving mechanism 304. As a result, distortion when the substrate 10 is placed on the mask 220 can be reduced. The movement of the support 403 may be performed before the substrate 10 and the mask 220 are in contact with each other, or may be performed after the substrate 10 and the mask 220 are in contact with each other.

7 (b) to 8 (c) are diagrams for explaining the second alignment. The second alignment is an alignment process that performs highly accurate alignment, and is also called "fine alignment". First, as shown in FIG. 7B, the camera 261 recognizes the substrate alignment mark 101 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220, and each XY position and XY surface. Measure the relative deviation within. The camera 261 is a camera having a narrow field of view but high resolution so that high-precision alignment can be performed. If the measured deviation exceeds the threshold value, the alignment process is performed. Hereinafter, a case where the measured deviation exceeds the threshold value will be described.

When the measured deviation exceeds the threshold value, as shown in FIG. 7C, the substrate Z actuator 250 is driven to raise the substrate 10 and separate it from the mask 220. At this time, the height of the support 403 may be maintained, that is, the height may be the same as that of other supports, or the height of the support moving mechanism 304 may be adjusted by the support moving mechanism 304.

In FIG. 8A, the XYθ actuator is driven based on the deviation measured by the camera 261 to perform positioning. At the time of alignment, the position of the substrate 10 (board holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, or the positions of both the substrate 10 and the mask 220 may be adjusted. May be good.

Then, as shown in FIG. 8B, the substrate 10 is lowered again, and the substrate 10 is placed on the mask 220. Then, as shown in FIG. 8C, the alignment marks of the substrate 10 and the mask 220 are photographed by the camera 261 to measure the deviation. If the measured deviation exceeds the threshold value, the above-mentioned alignment process is repeated.

When the deviation is within the threshold value, as shown in FIG. 9A, the cooling plate Z actuator is driven to lower the cooling plate 230 and bring it into close contact with the substrate 10. In the present embodiment, the cooling plate 230 also serves as a magnet plate, and by attracting the mask 220 by a magnetic force, the adhesion between the substrate 10 and the mask 20 is enhanced.

When the lowering of the cooling plate (magnet plate) is completed, as shown in FIG. 9B, the clamp member 303 is raised to release (unclamp) the long side portion of the substrate 10. Then, as shown in FIG. 9C, the substrate holding unit 210 is lowered.

By the above steps, the process of placing the substrate 10 on the mask 220 is completed, and the film forming process (depositing process) is performed by the film forming apparatus.

According to the present embodiment, when the substrate 10 is held by the substrate holding unit 210, a part of the support on the short side is positioned lower than the other supports, so that the substrate 10 is downward by its own weight. Bend. As a result, the bending method of the substrate 10 can be the same regardless of the difference in the habit of the substrate 10. Therefore, when the substrate 10 is mounted on the mask 220, it is possible to prevent the mounting position from being different for each substrate. As a result, the alignment can be completed with high accuracy and in a short time. Furthermore, the film formation process on the substrate can be completed with high accuracy and in a short time.

In this embodiment, the height of only one support 403 in the center of the short side is adjusted, but the height of a plurality of supports in the center of the short side may be adjusted. .. At this time, the heights of these plurality of supports do not have to be the same, but may be different.

<Example 2>
In this embodiment, the substrate 10 is provided with a bending method different from that of the first embodiment. 10 (a) to 10 (d) show a method of supporting the substrate 10 by the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (mounting body) 220. It is a figure explaining.

As shown in FIGS. 10B and 10D, in the present embodiment, the supporters 401 and 405 at the ends of the short side of the substrate 10 are retracted downward from the reference height. Therefore, the end side of the substrate 10 is not supported, and the substrate 10 bends more at the end than at the supports 402 and 404 than at other points. Further, the end portion of the substrate 10 bends downward due to its own weight, and the substrate 10 bends upward as a whole.

The bending method of the substrate 10 is different from that of the first embodiment, but also in this embodiment, a uniform bending can be given to the substrate 10 to eliminate the difference in the bending method for each substrate. That is, the same effect as in Example 1 can be obtained.

In FIG. 10, the supports 401 and 405 are not in contact with the substrate 10, but for example, after receiving the substrate 10, the supports 401 and 405 may be raised so as to be in contact with the substrate 10.

<Example 3>
In this embodiment, the substrate 10 is provided with the same bending method as in the second embodiment, but the method is different. 11 (a) to 11 (d) show a method of supporting the substrate 10 by the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (mounting body) 220. It is a figure explaining.

As shown in FIGS. 11 (b) and 11 (d), in the present embodiment, the central support 403 is upward from the height (reference height) of the other supports on the short side of the substrate 10. It has been moved. Therefore, the center of the end portion of the substrate 10 is mechanically lifted, resulting in an upwardly convex bending method.

Also in this embodiment, uniform bending can be given to the substrate 10 to eliminate the difference in the bending method for each substrate. That is, the same effect as in Example 1 can be obtained.

<Example 4>
In this embodiment, the substrate 10 is given the same bending method as in Examples 2 and 3, but the method is different. 12 (a) to 12 (d) show a method of supporting the substrate 10 by the support tool 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (mounting body) 220. It is a figure explaining.

As shown in FIGS. 12 (b) and 12 (d), in the present embodiment, the support is moved laterally (X direction) on the short side of the substrate 10 so that the support is near the center of the short side. Focus. Therefore, the support on the end side of the substrate 10 becomes weak, the end portion of the substrate 10 bends downward due to its own weight, and the substrate 10 bends upward as a whole.

In this embodiment, the support device moving mechanism 304 needs to be configured so that the support device can be moved in the lateral direction (X direction). The support moving mechanism 304 in this embodiment may be able to move the support only in the lateral direction, or may be movable in the lateral and vertical (Z direction) therapy.

Also in this embodiment, uniform bending can be given to the substrate 10 to eliminate the difference in the bending method for each substrate. That is, the same effect as in Example 1 can be obtained.

<Other Examples>
The arrangement of the support is not particularly limited as long as the arrangement is such that a uniform bending method is given to the substrate 10. For example, the substrate 10 may be given a uniform bending method by making the distance between some supports (three-dimensional distance) different from the distance between other supports. The arrangement of the supports that can be adopted can also be specified as an arrangement in which the deflection of the substrate 10 between some of the supports is larger than the deflection between the other supports. Alternatively, the arrangement of the supports that can be adopted can be specified as an arrangement in which the intervals between the supports are unequal. Further, when the arrangement of the supports that can be adopted is such that at least one support is at a position different from the reference position when the virtual position when a plurality of supports are evenly arranged is set as the reference position. It can also be specified as an arrangement.

As such an arrangement of the support, an arrangement as shown in FIGS. 13 (a) and 13 (b) can be adopted in addition to the example described above. In each of FIGS. 13 (a) and 13 (b), a plurality of supports are at the same height, but the distance between the supports at the center is larger than the distance between the supports at the ends. The difference between FIGS. 13 (a) and 13 (b) is that the distance between the supports at the center is different, and the bending method of the substrate 10 can be changed according to this distance.

<Modification example>
In the above description of the embodiment, the movement of the support may be omitted. Therefore, the substrate holding unit 210 does not have to include the support moving mechanism 304. For example, as a modification of the first embodiment, the central support 403 may be fixed at a lower position than the other supports. If the distance between the supports is different, the bending method when the substrate 10 is held can be the same, and the variation in the mounting position when the substrate 10 is mounted on the mask 220 can be suppressed.

In the above description of the embodiment, the spacing between the supports is adjusted on both of the opposing short sides, but the spacing between the supports may be adjusted on only one side. Further, in the above embodiment, an example in which the long side is sandwiched and only the short side is supported is described, but conversely, the short side may be sandwiched and only the long side may be supported. In this case, the spacing between the supports may be adjusted on at least one side that only supports. Further, the distance between the supports may be adjusted on the side to be sandwiched.

In the above description of the embodiment, the timing of sandwiching the long side of the substrate 10 may be changed as appropriate. For example, the substrate 10 may be placed on the mask body in a state where the substrate 10 is released from being sandwiched. Alternatively, the substrate 10 may be re-grasped (released and re-pinched) of the substrate 10 while the substrate 10 is placed on the mask body.

Further, although the first alignment (rough alignment) and the second alignment (two-step alignment of fine alignment 9 are performed, the first alignment may be omitted and only the second alignment may be performed. After the close contact with the above (for example, FIG. 9C), the alignment process may be executed again.

<Example of manufacturing method of electronic device>
Next, an example of a method for manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

First, the organic EL display device to be manufactured will be described. FIG. 14A shows an overall view of the organic EL display device 60, and FIG. 14B shows a cross-sectional structure of one pixel.

As shown in FIG. 14A, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix in the display area 61 of the organic EL display device 60. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel referred to here refers to the smallest unit that enables the display of a desired color in the display area 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is composed of a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and is particularly limited to at least one color. There are no restrictions.

14 (b) is a schematic partial cross-sectional view taken along the line AB of FIG. 14 (a). The pixel 62 has a first electrode (anode) 64, a hole transport layer 65, one of the light emitting layers 66R, 66G, 66B, an electron transport layer 67, and a second electrode (cathode) 68 on the substrate 63. It has an organic EL element comprising. Of these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in a predetermined pattern corresponding to a light emitting element (sometimes referred to as an organic EL element) that emits red, green, and blue, respectively. Further, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrode 64 and the second electrode 68 from being short-circuited by foreign matter. Further, since the organic EL layer is deteriorated by moisture and oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In order to form the organic EL layer in units of light emitting elements, a method of forming a film through a mask is used. In recent years, the definition of display devices has been increasing, and a mask having an opening width of several tens of μm is used to form an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from an evaporation source during film formation and is thermally deformed, the positions of the mask and the substrate are displaced, and a pattern of a thin film formed on the substrate is desired. It will be formed out of position. Therefore, the film forming apparatus (vacuum vapor deposition apparatus) according to the present invention is preferably used for film formation of these organic EL layers.

Next, an example of a method for manufacturing an organic EL display device will be specifically described.

First, a circuit board (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

Acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by a lithography method so that an opening is formed in the portion where the first electrode 64 is formed to form an insulating layer. Form 69. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 in which the insulating layer 69 is patterned is carried into the first film forming apparatus, the substrate is held by the substrate holding unit, and the hole transport layer 65 is a common layer on the first electrode 64 in the display region. As a film. The hole transport layer 65 is formed by vacuum vapor deposition. In reality, the hole transport layer 65 is formed to have a size larger than that of the display region 61, so that a high-definition mask is unnecessary.

Next, the substrate 63 on which the hole transport layer 65 is formed is carried into the second film forming apparatus and held by the substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and the light emitting layer 66R that emits red is formed on the portion of the substrate 63 on which the element that emits red is arranged. According to this example, the mask and the substrate can be satisfactorily overlapped with each other, and high-precision film formation can be performed.

Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G that emits green is formed by the third film forming apparatus, and the light emitting layer 66B that emits blue is further formed by the fourth film forming apparatus. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

The substrate on which the electron transport layer 67 is formed is moved to a sputtering device to form a second electrode 68, and then moved to a plasma CVD device to form a protective layer 70 to complete the organic EL display device 60. To do.

From the time when the substrate 63 in which the insulating layer 69 is patterned is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, when the substrate 63 is exposed to an atmosphere containing moisture or oxygen, a light emitting layer made of an organic EL material is formed. It may be deteriorated by moisture and oxygen. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatus is performed in a vacuum atmosphere or an inert gas atmosphere.

In the organic EL display device thus obtained, a light emitting layer is accurately formed for each light emitting element. Therefore, if the above manufacturing method is used, it is possible to suppress the occurrence of defects in the organic EL display device due to the misalignment of the light emitting layer.

The support tool spacing control and the holding force control described above can be applied in any of the situations before the first alignment, between the first alignment and the second alignment, and after the second alignment.

210 Board holding unit 250 Board Z actuator 300, 401-405 Support device 304 Support tool movement mechanism

Substrate mounting method according to an embodiment of the present invention,
A holding portion that holds a peripheral portion of the substrate from a first surface of the substrate and a second surface opposite to the first surface and an open state that does not sandwich the peripheral portion. It is a substrate mounting method using the equipped device.
A contact step in which the first surface and the mask are brought into contact with each other and the second surface and the member are brought into contact with each other when the holding portion is in the holding state.
After the contact step, a release step of changing the sandwiched portion from the sandwiched state to the released state, and
It is characterized by having.

The method for manufacturing an electronic device according to one aspect of the present invention is as follows.
According to the substrate mounting method of the present invention, the mounting step of mounting the substrate on the mask and the mounting step.
After the above-mentioned setting step, a thin-film deposition step of performing vapor deposition on the first surface via the mask, and a vapor deposition step.
It is characterized by having .

The substrate holding device according to one aspect of the present invention is
A sandwiching portion that sandwiches the peripheral edge portion of the substrate from a first surface of the substrate and a second surface opposite to the first surface, and an open state that does not sandwich the peripheral edge portion. ,
A mask holding portion for arranging the mask on the side of the first surface of the substrate, and
A member arranged on the side of the second surface of the substrate, and
In a substrate holding device including the substrate, the mask, and an elevating means for changing the relative position of the member in the thickness direction of the substrate.
When the sandwiched portion is in the sandwiched state, the first surface and the mask come into contact with each other, and after the second surface and the member come into contact with each other, the sandwiched portion is released from the sandwiched state. It is characterized in that it is provided with a control means for changing to a state.

The electronic device manufacturing apparatus according to one aspect of the present invention is
The substrate holding device of the present invention and
A thin-film deposition source for depositing on the first surface via the mask,
Have .

Claims (1)

A support means including a plurality of supports for supporting the peripheral edge of the substrate, and
A mounting means for mounting the substrate on the mounting body, and
It is a board mounting device equipped with
The plurality of supports are a substrate mounting device, characterized in that the distance between some of the supports is different from the distance between other supports.

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