KR20200000775A - Mask position adjusting apparatus, film forming apparatus, mask position adjusting method, film forming method, and manufacturing method of electronic device - Google Patents

Abstract

A film forming apparatus of the present invention, which film-forms a deposition substance through a mask on a substrate, includes: a vacuum container capable of maintaining the inside in a vacuum state; a substrate support unit for supporting the substrate in the vacuum container; a mask support unit for supporting the mask in the vacuum container; and a mask mounting board on which the mask is mounted in the vacuum container, wherein one of the mask support unit and the mask mounting board can be relatively moved or rotated in a rotating direction with respect to the other one thereof by using a first direction, a second direction intersecting with the first direction, and a third direction intersecting with the first direction and the second direction as axes.

Description

MASK POSITION ADJUSTING APPARATUS, FILM FORMING APPARATUS, MASK POSITION ADJUSTING METHOD, FILM FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE}

The present invention relates to an apparatus and method for positioning a mask relative to a mask mounting table.

Recently, an organic EL display device has been in the spotlight as a flat panel display device. The organic EL display device is a self-luminous display, and has excellent characteristics such as response speed, viewing angle, and thickness reduction than the liquid crystal panel display, and is rapidly replacing the existing liquid crystal panel display in various portable terminals such as monitors, televisions, and smartphones. . In addition, it is expanding its application fields to automotive displays and the like.

The element of the organic EL display device has a basic structure in which an organic material layer for emitting light is formed between two opposite electrodes (cathode electrode and anode electrode). The organic material layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask in which a pixel pattern is formed in the film deposition apparatus. In order to improve the accuracy of such a deposition process, before the deposition on the substrate is performed, The relative position of the mask and the substrate must be precisely aligned.

To this end, marks (which are referred to as alignment marks) are formed on the substrate and the mask, and the alignment marks are measured by a camera provided in the film forming apparatus to measure the relative positional deviation between the substrate and the mask.

Based on the relative positional displacement of the measured substrate and the mask, the relative position of the substrate relative to the mask is adjusted by moving the substrate holder on which the substrate is placed relative to the mask stage on which the mask is placed.

However, before the measurement and positioning of the relative positional shift with respect to the mask of the substrate is carried out, if the mask itself is placed in a position or direction shifted from the reference position on the mask stage, the alignment process with respect to the mask of the substrate takes a long time. Not only can it be caught, but the precision of the substrate alignment process cannot be secured, and the precision of the film forming process is inferior. Therefore, before performing measurement and position adjustment of the relative position shift with respect to the mask of a board | substrate, the mask carried in into the film-forming apparatus is positioned with respect to a mask stand.

Patent Document 1 (Japanese Laid-Open Patent Publication No. 2006-233256) discloses a method of positioning a mask with respect to a mask clamp by forming a fitting hole in the mask, providing a fitting pin in the mask clamp, and fitting the fitting hole and the fitting pin. Is starting.

An object of the present invention is to provide an apparatus and a method for positioning a mask with high precision with respect to a mask mounting table.

A film forming apparatus according to the first aspect of the present invention is a film forming apparatus for depositing a deposition material on a substrate through a mask, and includes: a vacuum vessel capable of keeping the interior in a vacuum state, and a substrate for supporting the substrate in the vacuum vessel. A support unit, a mask support unit for supporting a mask in the vacuum vessel, and a mask holder on which the mask is placed in the vacuum vessel, wherein one of the mask support unit and the mask mount is the other With respect to the first direction, the second direction intersecting the first direction, and the first direction and the third direction intersecting the second direction, and are relatively movable or rotatable in a rotational direction. do.

The film forming method according to the second aspect of the present invention is a film forming method for depositing a deposition material on a substrate through a mask, and includes: a vacuum vessel capable of keeping the interior in a vacuum state, and a substrate support for supporting the substrate in the vacuum vessel; Preparing a film forming apparatus including a unit, a mask support unit for supporting a mask in the vacuum vessel, and a mask mounting table on which the mask is placed in the vacuum vessel, and a mask brought into the vacuum vessel. Supporting by a mask support unit, intersecting a first direction, a second direction crossing the first direction, and the first direction and the second direction of the mask supported by the mask support unit; A first measurement step of acquiring position information in the rotation direction with the third direction as the axis by the first position information acquiring means, and the position of the acquired mask; A first position adjustment step of moving or rotating one of the mask support unit and the mask mounting table relative to the other in the first direction, the second direction, and the rotation direction based on the beam; It is characterized by including.

An electronic device manufacturing method according to a third aspect of the present invention is characterized by manufacturing an electronic device using the film forming method according to the second aspect of the present invention.

According to the present invention, the mask can be positioned with high accuracy with respect to the mask placing table. Thereby, the time taken for the alignment process with respect to the mask of a following board | substrate can be shortened, the precision of the alignment process with respect to the mask of a board | substrate can be improved, and the precision of a film-forming process can be improved.

1 is a schematic diagram of a part of an apparatus for manufacturing an electronic device.
2 is a schematic view of a film forming apparatus according to an embodiment of the present invention.
3 is a flowchart of a mask alignment process according to an embodiment of the present invention.
It is a schematic diagram of the mask mounting stand and mask support unit which concern on one Embodiment of this invention.
5 is a schematic diagram illustrating an electronic device.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment and Example of this invention are described with reference to drawings. However, the following embodiment and examples are only illustrative of the preferable structure of this invention, and the scope of the present invention is not limited to these structures. In addition, in the following description, the hardware configuration, software configuration, processing flow, manufacturing conditions, size, material, shape, etc. of an apparatus are in order to limit the scope of this invention to this unless there is particular notice. no.

The present invention can be preferably applied to an apparatus for forming a thin film (material layer) having a desired pattern by vacuum deposition on the surface of a substrate. As a material of a board | substrate, arbitrary materials, such as glass, a film of a polymeric material, a metal, etc. can be selected, and also arbitrary materials, such as an organic material and a metallic material (metal, a metal oxide, etc.), can also be selected as a vapor deposition material. The technique of this invention is applicable to manufacturing apparatuses, such as an organic electronic device (for example, organic electroluminescent display, a thin film solar cell), an optical member, specifically ,. Especially, in the manufacturing apparatus of an organic electroluminescence display, since the organic electroluminescent display element is formed by evaporating a vapor deposition material and depositing it on a board | substrate through a mask, it is one of the preferable application examples of this invention.

<Electronic device manufacturing apparatus>

1: is a top view which shows typically the structure of a part of manufacturing apparatus of an electronic device.

The manufacturing apparatus of FIG. 1 is used for manufacturing a display panel of an organic EL display device for a smartphone, for example. In the case of a display panel for a smartphone, for example, 4.5 generations of substrates (about 700 mm × about 900 mm), 6 generations of full size (about 1500 mm × about 1850 mm), or half cut size (about 1500 mm × After forming a film for formation of an organic EL element on a substrate of about 925 mm), the substrate is cut out and fabricated into a plurality of small size panels.

The electronic device manufacturing apparatus generally includes a plurality of cluster devices 1 and a relay device that connects the cluster devices 1.

The cluster device 1 includes a plurality of film forming apparatuses 11 for performing a process (for example, film forming) on the substrate S, a plurality of mask stock apparatuses 12 for storing masks before and after use, and a center thereof. The conveyance chamber 13 arrange | positioned is provided.

In the conveyance chamber 13, the conveyance robot 14 which conveys the board | substrate S between the some film-forming apparatuses 11, and conveys a mask between the film-forming apparatus 11 and the mask stock apparatus 12 is provided. The transfer robot 14 may be, for example, a robot having a structure in which a robot hand holding the substrate S or the mask M is mounted on the articulated arm.

In the film forming apparatus 11 (also called a vapor deposition apparatus), the vapor deposition material stored in the vapor deposition source is heated and evaporated by a heater and deposited on the substrate through a mask. A series of film formation such as the exchange of the substrate S with the transfer robot 14, the adjustment of the relative position of the substrate S and the mask (alignment), the fixing of the substrate S onto the mask, and the deposition (deposition). The process is performed by the film forming apparatus.

In the mask stock device 12, a new mask and a used mask to be used in the film forming process in the film forming apparatus 11 are divided and stored in two cassettes. The conveying robot 14 conveys the used mask from the film forming apparatus 11 to the cassette of the mask stock apparatus 12, and transfers the new mask housed in another cassette of the mask stock apparatus 12 to the film forming apparatus 11. Return to

The cluster apparatus 1 includes a pass chamber 15 for transferring the substrate S from the upstream side to the cluster apparatus 1 in the flow direction of the substrate S, and a film forming process completed in the cluster apparatus 1. The buffer chamber 16 for transferring the board | substrate S to another cluster apparatus downstream is connected. The conveyance robot 14 of the conveyance chamber 13 receives the board | substrate S from the upstream pass chamber 15, and is one of the film-forming apparatuses 11 in the said cluster apparatus 1 (for example, the film-forming apparatus 11a). Return to). In addition, the transport robot 14 receives the substrate S on which the film forming process is completed in the cluster device 1 from one of the plurality of film forming apparatuses 11 (for example, the film forming apparatus 11b), and is connected to the downstream side. Transfer to buffer chamber 16 is carried out. The buffer chamber 16 temporarily transfers a plurality of substrates when there is a difference in processing speed in the upstream cluster apparatus and the downstream cluster apparatus, or when the substrate cannot be normally flowed due to the trouble on the downstream side. It is good also as a structure which can be accommodated as a.

The swing chamber 17 which changes the direction of a board | substrate is provided between the buffer chamber 16 and the pass chamber 15. As shown in FIG. The revolving chamber 17 is provided with a transfer robot 18 for receiving the substrate S from the buffer chamber 16, rotating the substrate S 180 degrees, and transporting the substrate S to the pass chamber 15. As a result, the direction of the substrate becomes the same in the upstream cluster apparatus and the downstream cluster apparatus, thereby facilitating substrate processing.

The pass chamber 15, the buffer chamber 16, and the swing chamber 17 are so-called relay devices that connect the cluster devices, and the relay devices provided on the upstream and / or downstream side of the cluster device include a pass chamber and a buffer room. And at least one of the swing rooms.

The film forming apparatus 11, the mask stock apparatus 12, the transfer chamber 13, the buffer chamber 16, the turning chamber 17, and the like are maintained in a high vacuum state during the manufacturing process of the organic EL display panel. Although the pass chamber 15 is normally maintained in a low vacuum state, it may be maintained in a high vacuum state as needed.

In the present embodiment, the configuration of the electronic device manufacturing apparatus has been described with reference to FIG. 1, but the present invention is not limited thereto and may have other types of apparatuses or chambers, and arrangements between the apparatuses and chambers may vary. have. For example, in the relay device connected to a part of cluster devices of the electronic device manufacturing apparatus, a pass chamber may be provided on the upstream side and the downstream side of the swinging chamber 17 without providing the buffer chamber. Moreover, you may provide the board | substrate rotating apparatus which changes the direction of a board | substrate in the pass chamber 15, without providing the turning room 17. As shown in FIG.

Hereinafter, the specific structure of the film-forming apparatus 11 is demonstrated.

<Film forming device>

2 is a schematic diagram showing the configuration of a film forming apparatus 11 including a mask position adjusting device according to an embodiment of the present invention. In the present embodiment, the mask position adjusting device is described on the premise that the film forming apparatus 11 is used. However, the present invention is not limited thereto, and may be used in other apparatuses or chambers of the above-described electronic device manufacturing apparatus.

In the following description, the XYZ Cartesian coordinate system whose vertical direction is Z direction is used. When the substrate S or the mask M is fixed in parallel with the horizontal plane (XY plane) during the film formation, the short side direction (direction parallel to the short side) of the substrate S or the mask M is in the X direction (first Direction) and the long side direction (direction parallel to the long side) is referred to as the Y direction (second direction). Moreover, the rotation angle which made the Z direction (third direction) the axis is represented by (the rotation direction).

The film forming apparatus 11 includes a vacuum container 20 held in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, a substrate support unit 21 provided in the vacuum container 20, a mask support unit 22, And a mask placing table 23, a cooling plate 24, a vapor deposition source 25, and the like.

The board | substrate support unit 21 is also called a board | substrate holder as a means to receive and support the board | substrate S which the conveyance robot 14 provided in the conveyance chamber 13 conveyed.

The mask support unit 22 is also called a mask holder as a means for receiving and supporting the mask M which the conveyance robot 14 installed in the conveyance chamber 13 conveyed. The mask support unit 22 is provided so that the mask M can be supported by the vertical direction lower side of the board | substrate S supported by the board | substrate support unit 21. As shown in FIG.

The mask support unit 22 includes a support tool 221 for supporting the long side peripheral part of the mask M. As shown in FIG. A plurality of supporters 221 are provided along each of the periphery of the long side of the mask M so as to stably support the mask M. As shown in FIG.

The mask M has an opening pattern corresponding to the thin film pattern to be formed on the substrate S. FIG. In particular, a mask used to manufacture an organic EL device for a smartphone is a metal mask having a fine opening pattern, also called a FMM (Fine Metal Mask).

On the lower side in the vertical direction of the support tool 221, a frame-shaped mask mounting table 23 is provided. The mask M transferred to the mask support unit 22 is transferred from the mask support unit 22 to the mask mounting table 23 by lowering the mask support unit 22 after the mask alignment process described later is completed. It is mounted on the mask mounting table 23.

On the long side side periphery of the mask mounting table 23, a support accommodation receiving groove 231 is formed at a position corresponding to the support 221 of the mask support unit 22. When the mask support unit 22 descends to approach the mask holder 23, the support 221 of the mask support unit 22 is an opening 2311 of the support receiving groove 231 of the mask support 23. ) Into the support receiving groove 231, whereby the mask M is transferred from the mask support unit 22 to the mask mounting table 23. A detailed configuration of the mask placing table 23 including the support receiving grooves 231 will be described later with reference to FIG. 4.

 The cooling plate 24 is a cooling means for suppressing the temperature rise of the substrate S, and suppresses the deterioration and deterioration of the organic material formed on the substrate S. For this purpose, the cooling plate 24 is provided to be capable of lifting up and down on the vertical upper surface side of the substrate S supported by the substrate supporting unit 21. When fixing the board | substrate S on the mask M mounted on the mask mounting base 23, the cooling plate 24 presses the upper surface of the board | substrate S to the mask M side by its own weight. (S) and the mask M are brought into close contact.

 Although not shown in FIG. 2, the cooling plate 24 may also function as a magnet plate. The magnet plate pulls up the mask M by magnetic force, and improves the adhesiveness of the board | substrate S and the mask M at the time of film-forming.

In addition, although not shown in FIG. 2, an electrostatic chuck (not shown) for adsorbing and fixing the upper surface of the substrate S by the electrostatic attraction is installed above the vertical direction of the support 221 of the substrate support unit 22. You may also do it. This can effectively solve the problem that the substrate S sags due to its own weight.

The deposition source 25 includes a crucible (not shown) in which the deposition material to be deposited on the substrate is stored, a heater (not shown) for heating the crucible, and the deposition material is scattered onto the substrate until the evaporation rate from the deposition source is constant. Shutters (not shown), etc., for preventing such operations. The deposition source 25 may have various configurations depending on the use, such as a point deposition source or a linear deposition source. In particular, in the film forming apparatus for forming the electrode metal layer, a revolver type deposition source is used in which each of the plurality of crucibles arranged on the circumference rotates to the evaporation position.

Although not shown in FIG. 2, the film forming apparatus 11 further includes a film thickness monitor (not shown) and a film thickness calculating unit (not shown) for measuring the film thickness deposited on the substrate.

On the outer side (atmospheric side) of the vertical direction upper surface of the vacuum container 20, the board | substrate support unit elevating mechanism 26, the mask support unit elevating mechanism 27, the cooling plate elevating mechanism 28, the position adjustment mechanism 29, etc. This is installed.

The board | substrate support unit lifting mechanism 26 is a drive means for raising / lowering the board | substrate support unit 21 (moving Z direction). The mask support unit lifting mechanism 27 is driving means for raising and lowering (moving in the Z direction) the mask support unit 22. The cooling plate elevating mechanism 28 is driving means for raising and lowering (moving in the Z direction) the cooling plate 24. These lifting mechanisms are composed of, for example, a motor and a ball screw, or a motor and a linear guide.

The position adjusting mechanism 29 is a drive means for alignment of the substrate S, the mask M, the cooling plate 24 and the like, and includes a substrate supporting unit elevating mechanism 26, a mask supporting unit elevating mechanism 27, And a stage portion on which the cooling plate elevating mechanism 28 and the like are mounted, and a driving portion for driving the stage portion in the XYθ direction.

The drive section of the positioning mechanism 29 includes two X-direction servo motors (not shown) and one or two Y-direction servo motors (not shown), and by controlling the combination and operation direction of the servo motors operating, The stage portion can be driven in the XYθ direction. As the power transmission means for transmitting the driving force of the servo motor to the stage, for example, a ball screw, a linear guide, or the like can be used.

With respect to the mask placing table 23 in which the substrate support unit 21, the mask support unit 22, and the cooling plate 24 are fixed to the upper surface of the vacuum vessel 20 by the positioning mechanism 29, By moving in the X direction, moving in the Y direction, and / or rotating θ, the substrate S can be aligned with the mask M, the mask M with the mask mounting table 23, or the like. In particular, in this embodiment, since the mask support unit elevating mechanism 27 connected to the mask support unit 22 is mounted on the stage part of the position adjustment mechanism 29, the stage part is driven by the drive part of the position adjustment mechanism 29. By driving in the XYθ direction, the mask mounting table 23 in which the mask M supported on the mask support unit 22, and thus the mask M supported on the mask support unit 22, is fixed to the vacuum vessel 20 of the film forming apparatus 11. You can adjust the position relative to.

In the present embodiment, the mask support unit lifting mechanism 27 connected to the mask support unit 22 through the upper surface of the vacuum vessel 20 has been described as being mounted on the stage portion of the positioning mechanism 29, but the present invention The present invention is not limited to this, and instead of the mask support unit elevating mechanism 27, the mask placing table 23 may be provided so as to be connected to the stage portion of the positioning mechanism 29. In this modification, the mask support unit elevating mechanism 27 is provided separately from the stage portion of the positioning mechanism 29. Thereby, even if the stage part of the position adjustment mechanism 29 moves to XY (theta) direction, the mask support unit elevating mechanism 27 will move (lift) only in the Z direction, without moving with it. On the other hand, since the mask placing table 23 is connected to the stage part of the position adjustment mechanism 29, as the stage part of the position adjustment mechanism 29 moves to XYθ direction, it moves together in an XYθ direction. Thus, in this modification, the mask support unit 22 can move up and down only in the Z direction, and the mask mounting base 23 is movable in the XYθ direction along the stage portion of the positioning mechanism 29, whereby The mask placing table 23 is moved relative to the mask M supported by the mask supporting unit 22 in the XYθ direction, and the relative position of the mask M and the mask placing table 23 in the XYθ direction is adjusted. I can adjust it. In this modification, the elevating mechanism (not shown) for elevating the mask placing table 23 in the Z direction is mounted on the stage portion of the positioning mechanism 29 so that the mask placing table 23 can also be elevated in the Z direction. It may be installed so as to.

On the outer side (atmosphere side) of the vertical direction upper surface of the vacuum container 20, in addition to the above-mentioned lifting mechanism and positioning mechanism, the substrate S and / or the mask M are provided through a transparent window provided on the upper surface of the vacuum container 20. The alignment camera 30 for photographing the alignment mark formed in the) is installed. The alignment camera 30 functions as positional information acquisition means for acquiring positional information of the substrate S and / or the mask M in the XYθ direction. In the present embodiment, the alignment camera 30 is located at a position corresponding to two diagonal corners on one diagonal line or a position corresponding to four rectangular corners on the rectangular substrate S and the mask M. FIG. Is installed.

The alignment camera 30 provided in the film-forming apparatus 11 of this embodiment is a rough alignment camera used for roughly adjusting the relative position of the board | substrate S and the mask M, the board | substrate S, And a fine alignment camera used to adjust the relative position of the mask M with high precision. Fine alignment cameras have a narrow viewing angle but high resolution, while rough alignment cameras have a relatively wide viewing angle and low resolution. In the present embodiment, it has been described that both the rough alignment camera and the fine alignment camera are provided in the film forming apparatus 11, but the present invention is not limited thereto, and for example, the rough alignment camera may not be provided. In this case, the rough alignment process is performed in an apparatus or chamber other than the film forming apparatus 11. For example, the rough alignment of the board | substrate S may be performed in the pass chamber 15, and the mask rough alignment mentioned later may be performed in the mask stock apparatus 12. FIG.

The position adjusting mechanism 29 adjusts the position by relatively moving the substrate S and the mask M based on the positional information of the substrate S and the mask M acquired by the alignment camera 30. Substrate alignment is performed. In this embodiment, in addition to the substrate alignment, a mask alignment for acquiring the positional information of the mask M by the alignment camera 30 and adjusting the relative position of the mask M with respect to the mask mounting table 23 is additionally added. Do it.

The film forming apparatus 11 includes a controller (not shown). The control unit has functions of conveyance of the substrate S, substrate alignment and mask alignment, control of the deposition source, control of film formation, and the like. The control unit can be configured by a computer having, for example, a processor, memory, storage, I / O, and the like. In this case, the function of the controller is realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the controller may be configured by a circuit such as an ASIC or an FPGA. Moreover, the control part may be provided for each film-forming apparatus, and it may be comprised by one control part controlling a some film-forming apparatus.

<Mask Positioning Device and Mask Positioning Method>

Hereinafter, a mask position adjusting device and a mask position adjusting method (mask alignment) for positioning the mask M relative to the mask mounting table M will be described with reference to FIGS. 2 to 4.

In the prior art, the positioning of the mask M with respect to the mask mounting table 23 has been performed by forming the positioning hole in the mask M and providing the positioning pin in the mask mounting table 23. That is, when the mask M is carried into the vacuum vessel 20 of the film forming apparatus 11 by the transfer robot 14 and placed on the mask support unit 22, the mask is positioned in the positioning hole formed in the mask M. The positioning pin provided in the mounting base 23 was inserted, and the positioning of the mask mounting base 23 of the mask M was performed. In the other prior art, instead of the configuration of the positioning holes / positioning pins, a configuration is employed in which the mask M is moved to a predetermined position by applying an external force in the XYθ direction with a pusher or the like.

However, according to this conventional technique in which the mask M is also enlarged in accordance with the enlargement of the substrate S, and the mask M is positioned with respect to the mask placing table 23, the mask M placing table M is mounted with high accuracy. It was difficult to position with respect to (23).

Accordingly, the mask position adjusting device according to the embodiment of the present invention includes a vacuum vessel 20, a mask support unit 22 for receiving and supporting the mask M from the transport robot 14, and a mask M. And a mask mounting table 23 which is finally placed, and which one of the mask supporting unit 22 and the mask mounting table 23 intersects with the other in the XYθ direction (first direction and first direction) The mask M can be positioned with respect to the mask placing table 23 more precisely by installing in such a manner as to be relatively movable in the two directions, the first direction and the third direction intersecting with the second direction. To help.

To this end, in the first embodiment of the present invention, as described with reference to Figure 2, the mask support unit lifting mechanism 27 connected to the mask support unit 22 through the upper surface of the vacuum vessel 20, the position adjustment mechanism ( 29 is mounted on the stage part, and the mask mounting table 23 is installed on the upper surface of the vacuum vessel 20 so as to be fixed in the XYθ direction (that is, not to move). Since the stage portion of the positioning mechanism 29 is movable in the XYθ direction, the mask support unit elevating mechanism 27 mounted thereon and the mask support unit 23 connected thereto are relatively relative to the mask mounting table 23 in the XYθ direction. You can move it.

Hereinafter, a mask alignment process according to the first embodiment of the present invention will be described in detail with reference to FIG. 3.

When the mask M is carried into the vacuum container 20 of the mask position adjusting device by the transfer robot 14 (S1), the mask (M) is supported by the support tool 221 of the mask support unit 22 moved to the mask carrying position. M) is received (S2).

Next, the alignment mark formed in the corner part of the rectangular mask M is image | photographed using the rough alignment camera with a comparatively wide field of view, and the information regarding the position of the mask M is acquired (S3).

The control unit of the mask position adjusting device compares the acquired position of the mask M with the reference position, and the degree to which the mask M is shifted relative to the reference position in the XYθ direction (relative position shift amount, ΔX, ΔY, Δθ). ) Is measured (S4).

Here, the reference position may be set to the position of the center point of the picked-up image of the rough alignment camera. That is, the relative position shift amount between the mask M and the mask placing table 23 is calculated based on the distance from the mask alignment mark to the center point of the photographed image in the photographed image of the rough alignment camera.

However, the present invention is not limited thereto, and the reference position may be set by another method. For example, a reference mark may be formed on a separate reference mark mounting table fixedly installed on the mask mounting table 23 or the vacuum container 20, and the reference position may be determined from an image captured by the reference mark by a rough alignment camera. . In addition, instead of capturing the reference mark with each time of mask alignment and calculating the reference position by image processing, the reference position is calculated at the time of initial setting of the mask position adjusting device or when the mask is replaced, and this is calculated in the memory section of the controller. You may remember. Each time the mask alignment process is performed, the reference position is read out from the memory unit and contrasted with the position of the mask M. FIG.

Thus, by using the camera for rough alignment with a wide field of view, the process of conveying the mask M to the mask position adjusting apparatus by the conveyance robot 14, and transmitting it to the mask support unit 22 of the mask position adjusting apparatus Even in the case where the mask M is shaken and greatly shifted from the reference position, the positional information of the mask M can be obtained.

Based on the measured relative position shift amount, the mask support unit 22 is moved relative to the mask placing table 23 to adjust the relative position of the mask M with respect to the mask placing table 23 (S5). ). That is, the mask support unit drive mechanism mounted on the stage part of the position adjustment mechanism 29 by the control part of the mask position adjustment apparatus moving the stage part of the position adjustment mechanism 29 by the relative position shift amount ((DELTA) X, (DELTA) Y, (DELTA) (theta)). (27) and the mask support unit 22 connected thereto are moved relative to the mask placing table 23. According to the first embodiment of the present invention, the mask support unit driving mechanism 27 connected to the mask support unit 22 is mounted on the stage portion of the positioning mechanism 29, while the mask mounting table 23 is vacuumed. Since the container 20 is fixed in the XYθ direction, the mask support unit 22 and the mask placing table 23 can be relatively moved in the XYθ direction by driving the stage portion of the positioning mechanism 29.

Subsequently, the mask on the mask support unit 22 is picked up by a fine alignment camera having a higher resolution than the rough alignment camera to obtain information on the position of the mask M, and in the same manner as described above, The relative position shift amount of the mask M is calculated (S6). Thus, by measuring the relative position shift amount of the mask M using a fine alignment camera, the relative position shift amount of a mask can be acquired more precisely.

When the relative position shift amount calculated using the fine alignment camera is compared with the predetermined thresholds ΔX _th , ΔY _th , and Δθ _th (S7), when the predetermined threshold value deviates, the stage portion of the positioning mechanism 29 The relative position of the mask support unit 22 with respect to the mask mounting table 23 is adjusted by moving the relative position shift amount (S8). This mask fine alignment process is repeated until the relative positional displacement amount of the mask M enters within a predetermined threshold.

When the relative position shift amount of the mask M with respect to the reference position is within a predetermined threshold, the mask support unit 22 is lowered by the mask support unit drive mechanism 27 toward the mask mounting table 23 to support the mask. The mask M supported by the unit 22 is placed on the mask placing table 23 (S9).

As shown in FIG. 4, in the process of placing the mask M whose position has been adjusted on the mask mounting table 23, the support 221 of the mask supporting unit 22 interferes with the mask mounting table 23. In order to prevent the collision (that is, collision), the support base receiving groove 231 is formed in the mask placing table 23. In other words, the support tool receiving groove 231 is formed at the position corresponding to the position of the support tool 221 of the mask support unit 22 on the XY plane in the vertical direction of the mask placing table 23. Since a plurality of supporters 221 are formed for each of the long side edges of the mask M, a plurality of support tool receiving grooves 231 are also provided in the long side edges of the mask placing table 23.

As shown in FIG. 4, the support tool receiving groove 231 has a sufficient depth in the vertical direction so that the mask support surface of the support tool 221 can be lowered below the mask mounting surface of the mask mounting table 23. Have Thereby, the moment when the mask support surface of the support tool 221 of the mask support unit 22 which supported the mask M descends below the mask mounting surface of the mask mounting base 23 in a perpendicular direction (Z direction), The mask M is transmitted to the mask placing table 23, and even if the mask supporting unit 22 is lowered, the mask M no longer lowers and is placed on the mask placing surface of the mask placing table 23. . In the present embodiment, the support receiving groove 231 has been described as being a groove having a predetermined depth, but the present invention is not limited thereto, and the support 221 of the mask support unit 22 is the mask mounting table 23. As long as it does not interfere with, it can have various shapes and structures. For example, it may have a form of a through hole penetrating the mask placing table 23.

On the other hand, the support tool receiving groove 231 is the mask support unit 22 in the above-described mask alignment process may be positioned in the XY direction with respect to the mask mounting table 23, the mask support unit 22 also in the substrate alignment process described later ) Is formed to have a relatively large dimension in the XY direction compared to the XY direction dimension of the support 221, in consideration of being able to move relative to the mask mounting table (23). More preferably, the maximum amount of movement in which the mask support unit 22 is relatively movable in the XY direction with respect to the mask mounting table 23 in the mask alignment process and the substrate alignment process (the maximum amount of movement is the field of view and position of the rough alignment camera). Even if the position is adjusted by the maximum movable distance of the stage portion of the adjusting mechanism 29, the support tool 221 has a dimension such that it does not interfere with the mask placing table 23. That is, the difference between the dimensions of the support tool receiving groove 231 and the support tool 221 in the XY direction is larger than the maximum movable amount of the mask support unit 22 in the mask alignment process and the substrate alignment process. It is preferable. However, since the mask placing table 23 has a frame shape, if the support receiving groove 231 is formed too large, the area of the mounting surface on which the lower surface of the mask M is placed is relatively reduced, so that the mask M There is a possibility that the mask M may not be stably placed, such as the mask M sagging at the periphery. In consideration of this, it is preferable that the support accommodation groove 231 be formed in an appropriate dimension.

In the above-described first embodiment, the mask mounting table 23 is fixed in the XYθ direction, and the mask support unit 22 is moved in the XYθ direction by the positioning mechanism 29, but according to another embodiment of the present invention In the second embodiment, which is an example, the mask placing table 23 is connected to the position adjusting mechanism 29, and the mask supporting unit 22 is provided separately from the position adjusting mechanism 29 so as to be installed independently. Is relative to the mask support unit 22 in the XYθ direction.

That is, in the second embodiment, the mask support unit 22 separates the mask support unit elevating mechanism 27 from the position adjusting mechanism 29 so as to be capable of only elevating in the vertical direction, and is installed independently. The mask mounting table 23 is connected to the stage portion of the positioning mechanism 29 through the upper surface of the vacuum vessel 20 so that the 23 can move in the XYθ direction. Here, the mask mounting table 23 may be connected to the stage portion of the positioning mechanism 29 to be fixed in the vertical direction, or may be connected to be liftable in the vertical direction. In order to be able to move up and down in the vertical direction, a mask mounting platform elevating mechanism (not shown) can be mounted on the stage portion of the position adjusting mechanism 29.

In this second embodiment, in the mask alignment process of the first embodiment described with reference to FIG. 3, the mask support unit 22 is moved relative to the mask mounting table 23 (for example, step S5, Except for S8), mask alignment can be performed in the same manner as in the mask alignment process of the first embodiment. That is, in the second embodiment, in step S5 and step S8, instead of moving the mask support unit 22 in the XYθ direction, the mask placing table 23 is moved in the XYθ direction.

The third example of the present embodiment will be described below.

In the above-described first and second embodiments, in the state where the mask M carried by the transfer robot 14 is received by the mask support unit 21, the mask M with respect to the mask mounting table 23 is removed. Although positioning was performed, in the third embodiment, mask alignment is performed while the mask M is placed on the robot hand of the transfer robot 14.

That is, when the conveyance robot 14 conveys the mask M to the mask conveyance position in the vacuum container 20 (it corresponds to the mask receiving position by the mask support unit 22), the alignment camera 30 is carried out. Using the above, the alignment mark of the mask M on the robot hand is photographed to measure the relative position shift amount with respect to the reference position. Next, the position of the mask support unit 22 is adjusted by driving the stage of the positioning mechanism 29 in the XYθ direction based on the measured relative position shift amount. When the position adjustment of the mask support unit 22 is completed, the mask support unit 22 receives the mask M from the robot hand of the transfer robot 14.

Thereafter, the mask support unit 22 descends, and the mask M received from the transfer robot 14 is placed on the mask placing table 23.

As described above, according to the embodiments of the present embodiment, either the mask support unit 22 or the mask placing table 23 is precisely used with respect to the other by using the position adjusting mechanism 29 of the film forming apparatus 11. The position can be adjusted, whereby the mask M can be accurately positioned with respect to the mask placing table 23.

In the mask alignment process shown in FIG. 3, both the relative position shift measurement and position adjustment (mask rough alignment) using the rough alignment camera, and the relative position shift measurement and position adjustment (mask fine alignment) using the fine alignment camera are performed. Although the present invention has been described, the present invention is not limited thereto, and one of the mask rough alignment process and the mask fine alignment process may be omitted. For example, only the mask rough alignment process may be performed. Thereby, even when the mask M is transmitted to the mask support unit 22 in a state largely deviated from the reference position, the position misalignment of the mask M can be measured and adjusted by the rough alignment camera with a wide viewing angle, and the mask By omitting the fine alignment process, the time taken for the mask alignment process can be shortened.

<Board alignment>

After the mask alignment process is completed and the mask M is placed on the mask mounting table 23, the substrate S is aligned with respect to the mask M.

In the state where the mask M is placed on the mask placing table 23, the substrate is supported by the substrate supporting unit 21 and spaced apart from the mask M in the vertical direction.

The board | substrate S descend | falls toward the mask M on the mask mounting base 23 by the board | substrate support unit lifting mechanism 26, and is spaced apart from the mask 220 by predetermined height (1st alignment measuring position). Descends. The first alignment is performed in a state where the substrate S is spaced apart from the mask M by a predetermined height in the vertical direction.

The first alignment is a first rough adjustment process that roughly adjusts the relative position of the substrate S and the mask M in the XY plane (direction parallel to the substrate or mask), and is referred to as "rough alignment". Also called. In a 1st alignment, the image of the board alignment mark provided in the board | substrate S and the mask alignment mark provided in the mask M is image-recognized by the rough alignment camera, and the relative position shift | deviation to an XY (theta) direction is measured, and based on this, The position adjustment with respect to the mask M of the board | substrate S is performed.

The rough alignment camera used for the first alignment is a camera having a low resolution but wide viewing angle so that rough alignment is possible.

At the time of position adjustment, the position of the board | substrate support unit 21 may be adjusted by driving the position adjustment mechanism 29 based on the measured relative position shift amount, and the mask mounting stand 23 may be adjusted. The position of the mask M may be adjusted by installing so as to be connected to.

When the first alignment process is completed, the substrate support unit 21 is lowered to the second alignment measurement position. Here, the second alignment measurement position is a position where the substrate S is temporarily placed on the mask M in order to measure the relative shift between the substrate S and the mask M with a fine alignment camera. For example, the board | substrate supporting surface of the board | substrate support unit 21 is a position slightly higher than the mask mounting surface of the mask mounting base 23. At the second alignment measurement position, at least the central portion of the substrate S is in contact with the mask M, and the peripheral portion of the substrate S is slightly separated (floating) from the mask placing surface.

In this state, measurement for the second alignment is performed. The second alignment is an alignment process for precisely positioning the substrate with respect to the mask and is also referred to as "fine alignment".

First, the image of the substrate alignment mark provided in the board | substrate S and the mask alignment mark provided in the mask M is image-recognized by a fine alignment camera, and the relative position shift amount in the XYθ direction is measured. Fine alignment camera 261 has a narrow viewing angle but high resolution to enable high-precision positioning. When the measured relative position shift amount deviates from a predetermined threshold value, the position adjustment process of the board | substrate S with respect to the mask M is performed.

That is, in the case where the measured relative position shift amount is out of the threshold, the substrate support unit elevating mechanism 26 is driven to raise the substrate S so as to be separated from the mask M. In this state, the stage part of the position adjustment mechanism 29 is driven, and the board | substrate support unit 21 is moved by the position shift amount, and the position adjustment with respect to the mask M of the board | substrate S is performed. At the time of position adjustment, the position of the board | substrate S (substrate holding unit 21) may be adjusted, and the position of the mask M (mask mounting base 23) may be adjusted.

Thereafter, the substrate S is lowered to the second alignment measurement position, the alignment marks of the substrate S and the mask M are photographed by a fine alignment camera, and the relative position shift amount is measured again. When the measured position shift amount deviates from the threshold, the above-described position adjustment process is repeated.

When the relative position shift amount is within the threshold, the substrate support unit 21 is lowered to match the height of the mask M with the substrate support surface of the substrate support unit 21. Thereby, the whole board | substrate S is mounted on the mask M. FIG.

By the above process, the mounting process of the board | substrate S on the mask M is completed, and the cooling board 24 and / or the magnet board are lowered to the upper surface of the board | substrate S, and the board | substrate S and the mask ( M) After adhesion / fixation, a film forming step (deposition step) is performed.

After closely contacting / fixing the substrate S and the mask M, and before starting the film forming process, the relative positional displacement between the substrate S and the mask M is measured again with a fine alignment camera, if necessary. You may also do it. This is because the relative positions of the substrate S and the mask M may be displaced again in the process of closely contacting / fixing the substrate S and the mask M to the cooling plate 24 and the magnet plate. As a result of the measurement, when it is confirmed that the relative positional shift has not occurred, the film forming process is performed. When it is determined that the relative positional shift has occurred, the above-described second alignment process is performed.

Film Formation Process

Hereinafter, the film-forming method which employ | adopted the mask alignment process of this embodiment is demonstrated.

The new mask M carried into the vacuum container 20 by the conveyance robot 14 of the conveyance chamber 13 is received by the mask support unit 22.

When the mask M is transferred to the mask support unit 22, as described with reference to FIG. 3, a mask alignment process is performed. That is, the relative position shift of the mask M on the mask support unit 22 and the mask mounting table 23 is measured, and based on the measured relative position shift amount of the mask M and the mask mounting table 23 Adjust the relative position.

Subsequently, the mask M whose relative position is adjusted is mounted on the mask mounting table 23.

In the state where the mask M is placed on the mask mounting table 23 in the vacuum chamber 20, the substrate is transferred into the vacuum chamber 20 of the film forming apparatus 11 by the transfer robot 14 of the transfer chamber 13. It is carried in and is mounted on the support part of the substrate support unit 21.

Subsequently, the substrate S is lowered toward the mask M in order to measure the positional displacement relative to the mask M of the substrate S. Next, as shown in FIG.

When the board | substrate S descend | falls to a measurement position, as mentioned above, a board | substrate alignment process (1st alignment process and 2nd alignment process) is performed. That is, the alignment mark formed in the board | substrate S and the mask M is image | photographed with the alignment camera 30, the relative position shift | offset of a board | substrate and a mask is measured, and the board | substrate S is based on the measured relative position shift | offset amount. And the relative position of the mask (M).

The substrate support unit 21 is lowered, the entire substrate S is placed on the mask M, and the cooling plate 24 and / or the magnet plate are lowered to the upper surface of the substrate S, so that the substrate S and the substrate S are lowered. The mask (M) is closely attached / fixed.

Subsequently, the shutter of the deposition source 25 is opened and the deposition material is deposited on the substrate S through the mask M. FIG.

When film formation is performed to the substrate S to a desired thickness, the shutter of the vapor deposition source 25 is closed.

Next, after raising the cooling plate 24 and / or the magnet plate, the substrate support unit 21 is raised to separate the substrate S and the mask M. As shown in FIG.

The hand of the transfer robot 14 enters into the vacuum vessel 20 of the film forming apparatus 11 and takes out the substrate from which the deposition is completed, from the vacuum vessel 20.

After the film formation process is performed on the predetermined number of substrates S, the used mask M is taken out from the vacuum vessel 20 by the transfer robot 14 and transferred to the mask stock device 12.

<Method of manufacturing electronic device>

Next, an example of the manufacturing method of an electronic device using the film-forming apparatus of this embodiment is demonstrated. Hereinafter, the structure and manufacturing method of an organic electroluminescence display as an example of an electronic device are illustrated.

First, the organic EL display device to be manufactured will be described. FIG. 5A shows an overall view of the organic EL display device 60, and FIG. 5B shows a cross-sectional structure of one pixel.

As shown in Fig. 5A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix form. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel here refers to the minimum unit which enables display of a desired color in the display area 61. In the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B which exhibit different light emission. It is. The pixel 62 is often composed of a combination of a red light emitting device, a green light emitting device, and a blue light emitting device. However, the pixel 62 may be a combination of a yellow light emitting device, a cyan light emitting device, and a white light emitting device. no.

(B) is a partial cross-sectional schematic diagram in the A-B line | wire of (a). The pixel 62 has an organic EL element having an anode 64, a hole transport layer 65, light emitting layers 66R, 66G, 66B, an electron transport layer 67, and a cathode 68 on a substrate 63. . Of these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to organic layers. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red color, the light emitting layer 66G is an organic EL layer emitting green color, and the light emitting layer 66B is an organic EL layer emitting blue color. The light emitting layers 66R, 66G, and 66B are formed in patterns corresponding to light emitting devices (sometimes referred to as organic EL devices) that emit red, green, and blue light, respectively. In addition, the anode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the cathode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. In addition, in order to prevent the anode 64 and the cathode 68 from being short-circuited by foreign matter, an insulating layer 69 is provided between the anodes 64. In addition, since the organic EL layer is degraded by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 5B, the hole transport layer 65 and the electron transport layer 67 are illustrated as one layer. However, according to the structure of the organic EL display device, the hole transport layer 65 and the electron transport layer 67 may be formed of a plurality of layers including the hole block layer and the electron block layer. It may be. In addition, a hole injection layer having an energy band structure capable of smoothly injecting holes from the anode 64 to the hole transport layer 65 may be formed between the anode 64 and the hole transport layer 65. . Similarly, an electron injection layer may be formed between the cathode 68 and the electron transport layer 67.

Next, an example of the manufacturing method of an organic electroluminescence display is demonstrated concretely.

First, a circuit (not shown) for driving an organic EL display device and a substrate 63 on which an anode 64 is formed are prepared.

An acrylic resin is formed by spin coating on the substrate 63 on which the anode 64 is formed, and the insulating layer 69 is formed by patterning the acrylic resin so as to form an opening in a portion where the anode 64 is formed by lithography. This opening corresponds to a light emitting region where the light emitting element actually emits light.

The substrate 63 patterned with the insulating layer 69 is loaded into the first organic material deposition apparatus to hold the substrate with the substrate support unit, and the hole transport layer 65 is formed as a common layer on the anode 64 in the display area. do. The hole transport layer 65 is formed by vacuum deposition. In reality, since the hole transport layer 65 is formed in a larger size than the display area 61, a high-precision mask is not necessary.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second organic material film forming apparatus and held by the substrate support unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a light emitting layer 66R emitting red color is formed in a portion where the red emitting element of the substrate 63 is disposed.

Similar to the formation of the light emitting layer 66R, the light emitting layer 66G emitting green color is formed by the third organic material film forming apparatus, and further, the light emitting layer 66B emitting blue color is formed by the fourth organic material film forming apparatus. After the film formation of the light emitting layers 66R, 66G, 66B is completed, the electron transport layer 67 is formed over the entire display region 61 by the fifth organic material film forming apparatus. The electron transport layer 67 is formed as a layer common to the light emitting layers 66R, 66G and 66B of three colors.

The substrate 68 formed up to the electron transport layer 67 is moved to the film deposition apparatus of the metallic deposition material to form the cathode 68.

According to the present invention, by moving either one of the mask support unit 22 and the mask placing table 23 relative to the other, the mask M can be accurately positioned with respect to the mask placing table 23. .

Thereafter, the protective layer 70 is formed by moving to the plasma CVD apparatus to complete the organic EL display device 60.

The light emitting layer made of an organic EL material is exposed when exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 70 is completed after the substrate 63 in which the insulating layer 69 is patterned is brought into the film forming apparatus. There is a risk of deterioration due to moisture or oxygen. Therefore, in this example, the loading and unloading of the substrate between the film forming apparatuses is performed in a vacuum atmosphere or an inert gas atmosphere.

The said embodiment shows an example of this invention, This invention is not limited to the structure of the said Example, You may modify suitably within the range of the technical thought.

1: cluster device
11: deposition apparatus
12: mask stock device
13: return room
14: Return Robot
20: vacuum container
21: substrate support unit
22: mask support unit
23: mask mount
24: cooling plate
25: deposition source
26: substrate support unit lifting mechanism
27: mask support unit lifting mechanism
28: cold plate elevating mechanism
29: positioning mechanism
30: alignment camera
221: support
231: support receiving groove

Claims (29)

A mask position adjusting device for adjusting the position of the mask,
A vacuum container capable of keeping the interior in a vacuum state,
A mask support unit for supporting a mask in the vacuum container;
A mask mounting table on which the mask is mounted in the vacuum container,
Any one of the mask support unit and the mask mounting table has a first direction, a second direction intersecting the first direction, and a third direction intersecting the first direction and the second direction. A mask position adjusting device, characterized in that it is relatively movable or rotatable in an axis of rotation. The method of claim 1,
The mask mounting table is connected to the vacuum container to be fixed in the first direction, the second direction, and the rotation direction,
And the mask support unit is relatively movable or rotatable in the first direction, the second direction, and the rotational direction with respect to the mask mounting table. The method of claim 1,
It is installed on the atmospheric side of one surface of the said vacuum container in the said 3rd direction, and drives either one of the said mask support unit and the said mask mounting stand in the said 1st direction, the said 2nd direction, and the said rotation direction with respect to the other one Mask position adjusting device further comprises a positioning mechanism capable of. The method of claim 3,
The position adjusting mechanism includes a stage portion that is movable or rotatable in the first direction, the second direction and the rotation direction,
And any one of the mask support unit and the mask mounting table is connected to the stage through the one surface of the vacuum vessel. The method of claim 4, wherein
And a mask support unit driving mechanism connected to the mask support unit through the one surface of the vacuum container and driving the mask support unit in the third direction. The method of claim 5,
And the mask support unit driving mechanism is mounted on the stage. The method of claim 1,
The mask support unit includes a support for supporting a long side peripheral portion of the mask,
On the long side side peripheral portion of the mask mounting base is formed a support receiving groove that can accommodate the support of the mask support unit,
In the third direction, the size of the support receiving groove is larger than the size of the support, the mask position adjusting device. The method of claim 7, wherein
The support is provided with two or more along each of the long side side peripheral portion of the mask,
And two or more support openings are provided on each of the periphery of the long side of the mask mounting table. The method of claim 7, wherein
The dimension of the said 2nd direction of the opening part of the said support opening receiving groove is larger than the dimension of the said 2nd direction of the said support opening, The mask position adjusting apparatus characterized by the above-mentioned. The method of claim 9,
The difference between the dimension of the opening portion and the support in the second direction is larger than the maximum relative movable amount of the mask support unit and the mask mounting table in the second direction. The method of claim 1,
And positional information acquiring means for acquiring information about the position of the mask supported by the mask support unit in the first direction, the second direction, and the rotational direction. The method of claim 11,
And a control unit for calculating a relative position shift amount in the first direction, the second direction, and the rotational direction with respect to the reference position of the mask, based on the positional information of the mask acquired by the positional information acquiring means. Mask positioning device comprising. The method of claim 12,
And the control unit controls one of the mask support unit and the mask mounting table to move relative to the other based on the calculated relative position shift amount. The method of claim 3,
And a substrate support unit for supporting the substrate in the vacuum vessel. The method of claim 14,
And a substrate support unit driving mechanism connected to the substrate support unit through the one surface of the vacuum vessel and driving the substrate support unit in the third direction. The method of claim 15,
And said substrate support unit driving mechanism is mounted on said stage part. A film forming apparatus for depositing a deposition material on a substrate through a mask,
A deposition source in which the deposition material is stored;
Mask positioner to adjust the position of the mask
Including;
The said film position adjusting device is a film position adjusting device as described in any one of Claims 1-16. Mask position adjustment method for adjusting the position of the mask,
Preparing a mask position adjusting device comprising a vacuum vessel capable of keeping the interior in a vacuum state, a mask support unit for supporting a mask in the vacuum vessel, and a mask mounting table on which the mask is placed in the vacuum vessel. Wow,
Supporting the mask brought into the vacuum container by the mask support unit;
In the rotational direction of the mask supported by the mask support unit in a first direction, a second direction crossing the first direction, and a third direction crossing the first direction and the second direction. A first measurement step of acquiring the position information of the first position information acquiring means;
Based on the acquired positional information of the mask, one of the mask support unit and the mask mounting table is relatively moved or rotated relative to the other in the first direction, the second direction, and the rotation direction. The first position adjustment step
Mask position adjustment method comprising a. The method of claim 18,
And the first measuring step of acquiring the positional information includes acquiring, by the first camera, an image of a mask alignment mark formed on the mask. The method of claim 18
The first measuring step of acquiring the positional information includes acquiring a relative positional deviation amount of the mask with respect to a reference position.
The first position adjustment step includes the first direction and the first direction with respect to one of the mask support unit and the mask mounting table based on the relative position shift amount acquired in the first measurement step. And moving or rotating in two directions and in the rotation direction. The method of claim 18
And after the first positioning step, moving the mask support unit in the third direction to mount a mask supported by the mask support unit on the mask mounting table. Way. The method of claim 21,
The mounting of the mask on the mask mounting table may include moving the mask support unit in the third direction to receive the support of the mask support unit in a support receiving groove formed on the mask mounting base. Mask position adjustment method comprising a. The method of claim 22,
And in the receiving step, the support moves into the support receiving groove until the mask supported by the support contacts the mask holder. The method of claim 21,
Between the first position adjusting step and the placing step,
The second positional information acquiring means acquires positional information in the first direction, the second direction, and the rotational direction of the mask supported by the mask support unit, and the mask with respect to the reference position. A second measurement step of calculating a relative displacement amount of
Comparing the relative position shift amount calculated in the second measurement step with a predetermined threshold value;
When the relative position shift amount calculated in the second measurement step deviates from a predetermined threshold, the first direction, the second direction, and the one of the mask support unit and the mask mounting table with respect to the other one. And a second position adjusting step of relatively moving or rotating in a rotational direction. The method of claim 24,
And said first positional information acquiring means used in said first measuring step has a wider viewing angle than said second positional information acquiring means used in said second measuring step. The method of claim 24,
And said second positional information acquiring means used in said second measuring step has a higher resolution than said first positional information acquiring means used in said first measuring step. A film forming method for depositing a deposition material on a substrate through a mask,
A vacuum vessel capable of keeping the interior in a vacuum state, a substrate support unit for supporting a substrate in the vacuum vessel, a mask support unit for supporting a mask in the vacuum vessel, and a mask in the vacuum vessel Preparing a film forming apparatus including a mask mounting table;
Adjusting the position of the mask brought into the container;
Supporting the substrate loaded into the vacuum vessel by the substrate support unit;
Depositing a deposition material on the substrate through the mask,
27. A film forming method according to claim 18, wherein the step of adjusting the position of the mask is performed by the mask position adjusting method of any one of claims 18 to 26. The method of claim 27,
Between supporting the substrate by the substrate supporting unit and depositing the deposition material,
Measuring a relative amount of displacement in the first direction, the second direction, and the rotational direction between the substrate supported by the substrate support unit and the mask placed on the mask mounting table; ,
The substrate support unit is moved or rotated in the first direction, the second direction and the rotational direction with respect to the mask mounting table based on the relative displacement amount between the substrate and the mask, so that the mask of the substrate Adjusting its position relative to,
Depositing the substrate on the substrate support unit on the mask on the mask mounting table. An electronic device is manufactured using the film forming method of claim 27.

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