KR102128888B1 - Film forming apparatus, film forming method and manufacturing method of electronic device - Google Patents

Abstract

The film forming apparatus of the present invention is a film forming apparatus for depositing a deposition material on a substrate through a mask, a vacuum chamber defining a space in which a deposition process is performed, installed in the vacuum chamber, and holding the substrate for holding and transporting the substrate A support unit, installed in the vacuum chamber, the magnetic force applying means for applying a magnetic force to the mask with the substrate held between the substrate holding unit interposed therebetween, and the substrate holding unit intersecting the first direction and the first direction The alignment stage for moving in the second direction or rotating in the rotational direction about the first direction and the third direction intersecting the second direction, and separately installed from the alignment stage, the magnetic force And a third direction driving mechanism for applying magnetic force for driving the applying means in the third direction.

Description

Film forming apparatus, film forming method, and electronic device manufacturing method {FILM FORMING APPARATUS, FILM FORMING METHOD AND MANUFACTURING METHOD OF ELECTRONIC DEVICE}

The present invention relates to a film forming apparatus and a film forming method, and relates to a film forming apparatus having an independent structure by separating a driving mechanism of a cooling plate/magnet plate from an alignment stage and a film forming method using the same.

Recently, an organic EL display device has been spotlighted as a flat panel display device. The organic EL display device is a self-luminous display, and has characteristics such as response speed, viewing angle, and thinning, which are superior to those of the liquid crystal panel display, and thus rapidly replaces the existing liquid crystal panel display in various portable terminals such as monitors, televisions, and smartphones. . In addition, it is expanding its application field to automobile displays.

The element of the organic EL display device has a basic structure in which an organic material layer that emits light is formed between two opposing electrodes (cathode electrode and anode electrode). The organic material layer and the electrode metal layer of the organic EL display device are manufactured by depositing a deposition material on a substrate through a mask on which a pixel pattern is formed in a vacuum chamber. To transfer a pixel pattern on a mask onto a substrate with high precision, Before deposition, the relative position of the mask and substrate must be adjusted with high precision.

To this end, an alignment process is performed by driving an alignment stage on which a substrate holding unit for holding a substrate is mounted, and positioning the substrate held on the substrate holding unit with respect to a mask on a mask stand. By the way, on the conventional alignment stage, since the lifting mechanism of the cooling plate/magnet plate is mounted together with the lifting mechanism of the substrate holding unit, the alignment to adjust the position of the substrate on the substrate holding unit with respect to the position of the mask on the mask. When the stage is moved in the X or Y direction or rotated in the θ direction, not only the substrate but also the cooling plate/magnet plate is moved and/or rotated together.

In a process in which the substrate is carried into the film forming apparatus by the transfer robot, the substrate may move on the hand of the transfer robot, and the position of the substrate on the hand of the transfer robot may deviate from a predetermined position. In this case, the position of the substrate on the substrate holding unit that receives the substrate from the hand of the transportation robot also deviates from the predetermined position due to the transportation error of the substrate by the transportation robot.

The displacement of the substrate from the mask due to the transportation error of the substrate by the transportation robot is corrected by driving the alignment stage to which the substrate holding unit is connected in the XYθ direction. For example, if the substrate is placed on the substrate holding unit with the substrate rotated by 5° about the Z axis from the predetermined position due to the problem of the transport robot (ie, the substrate on the substrate holding unit and the mask on the mask holder are centered on the Z axis) If shifted by 5°), the positional displacement of the substrate with respect to the mask on the mask is corrected by rotating the alignment stage to which the substrate holding unit is connected in the opposite direction by 5°.

However, since the cooling plate/magnet plate lifting mechanism is installed together with the substrate holding unit lifting mechanism on the alignment stage, if the alignment stage is rotated by 5° in the opposite direction to correct the position of the substrate, the cooling plate/magnet plate is also 5° It will rotate in the opposite direction. Therefore, the positional displacement between the substrate and the mask due to the conveyance error of the substrate can be eliminated by driving the alignment stage, but the displacement of the cooling plate/magnet plate and the substrate or the displacement between the cooling plate/magnet plate and the mask remains. .

Moreover, since the degree of the conveying error of the substrate by the conveying robot is different for each conveying operation of the conveying robot, there is a deviation in the positional displacement between the cooling plate/magnet plate and the substrate, and the degree of displacement between the cooling plate/magnet plate and the mask . This deteriorates the final positioning precision between the cooling plate and the substrate that are in contact with the film formation (which causes variations in the cooling action of the cooling plate with respect to the substrate), and the variation in the adhesion between the substrate and the mask that are in close contact with the magnet plate. Results in

The positional deviation between the cooling plate/magnet plate and the substrate/mask due to the conveyance error of the substrate and the deviation in the amount of the positional deviation cause problems such as defective film formation and poor film formation, resulting in product defects or reduced yield.

The present invention mainly provides a film forming apparatus, a film forming method, and an electronic device manufacturing method for preventing the displacement of the cooling plate/magnet plate and the substrate/mask from occurring even when a substrate transportation error occurs by the transportation robot. The purpose.

The film forming apparatus according to the first aspect of the present invention is a film forming apparatus for depositing a deposition material on a substrate through a mask, and is installed in the vacuum chamber, the vacuum chamber defining a space where the deposition process is performed, and holding the substrate. A substrate holding unit for conveying, a magnetic force applying means installed in the vacuum chamber and applying a magnetic force to the mask with the substrate held by the substrate holding unit interposed therebetween, and the substrate holding unit in a first direction and An alignment stage for moving in a second direction intersecting the first direction or rotating in the rotational direction about the third direction intersecting the first direction and the second direction, and independently from the alignment stage It is installed, characterized in that it comprises a magnetic force applying means for driving the magnetic force applying means in the third direction.

The film forming apparatus according to the second aspect of the present invention is a film forming apparatus for depositing a deposition material on a substrate through a mask, and a vacuum chamber defining a space in which a deposition process is performed, and installed in the vacuum chamber, and holds the substrate It is arranged in the vacuum chamber so as to sandwich the substrate held in the substrate holding unit between the substrate holding unit and the mask for conveying, and the contact means for bringing the substrate and the mask into close contact with the substrate. An alignment stage for moving the holding unit in a first direction and a second direction intersecting the first direction, or rotating the first direction and a third direction intersecting the second direction in a rotational direction about the axis; Separately installed from the alignment stage, it is characterized in that it comprises a third means driving mechanism for contact means for driving the contact means in the third direction.

The film forming method according to the third aspect of the present invention is a film forming method for depositing a deposition material on a substrate through a mask, wherein the mask carried into the vacuum chamber of the film forming apparatus according to the first aspect of the present invention is provided to the mask holding unit. Step of placing, for the magnetic force applying means to place the mask placed on the mask holding unit, the first direction, the second direction intersecting the first direction and the first direction and the second direction intersecting the second direction A mask alignment step of adjusting the position in a rotational direction about three directions, placing the position-adjusted mask on a mask stand fixed to the vacuum chamber, and bringing a substrate into the vacuum chamber of the film forming apparatus Step of mounting on the substrate holding unit, substrate alignment to position the substrate placed on the substrate holding unit in the first direction, the second direction and the rotating direction with respect to the mask placed on the mask stand Step, placing a substrate positioned on the mask with respect to the mask placed on the mask stage, moving the magnetic force applying means and the cooling plate in the third direction to contact the substrate, and through the mask And depositing a deposition material on the substrate.

The film forming method according to the fourth aspect of the present invention is a film forming method for depositing a deposition material on a substrate through a mask, and the mask carried into the vacuum chamber of the film forming apparatus according to the second aspect of the present invention is provided to the mask holding unit. A step of placing, and a third direction intersecting the first direction, the second direction intersecting the first direction, and the first direction and the second direction with respect to the contact means for the mask placed in the mask holding unit A mask alignment step of adjusting the position in a rotational direction about an axis; a step of placing a position-adjusted mask on a mask table fixed to the vacuum chamber; and carrying a substrate into the vacuum chamber of the film forming apparatus to hold the substrate. A step of mounting on a support unit, and a substrate alignment step of positioning the substrate mounted on the substrate holding unit in the first direction, the second direction, and the rotational direction with respect to a mask placed on the mask stand. And, placing the substrate positioned on the mask with respect to the mask placed on the mask stage on the mask, moving the adhesion means in the third direction to adhere to the substrate, and through the mask on the substrate. And depositing a deposition material.

A method for manufacturing an electronic device according to a fifth aspect of the present invention is characterized in that the electronic device is manufactured using the film forming method according to the third aspect of the present invention.

A method for manufacturing an electronic device according to a sixth aspect of the present invention is characterized in that the electronic device is manufactured using the film forming method according to the fourth aspect of the present invention.

According to the present invention, by separating and independent of the cooling plate/magnet plate lifting mechanism from the alignment stage, even if the alignment stage is moved in the XYθ direction to correct the transportation error of the substrate by the transfer robot, the cooling plate and the magnet plate are in the XYθ direction. Will not move. Accordingly, it is possible to prevent the relative positional displacement between the cooling plate/magnet and the mask due to XYθ movement of the alignment stage, and it is possible to reduce product defects due to defective film formation.

1 is a schematic view of a part of a manufacturing line of an organic EL display device.
2 is a schematic view of a film forming apparatus.
3 is a schematic view showing the configuration of an alignment stage of the present invention.
4 is a schematic view for explaining the mask alignment.
5 is an overall view of an organic EL display device and a cross-sectional view of elements of the organic EL display device.

Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples are merely illustrative of preferred structures of the present invention, and the scope of the present invention is not limited to these structures. In addition, in the following description, the hardware configuration and software configuration of the apparatus, processing flow, manufacturing conditions, sizes, materials, shapes, and the like are intended to limit the scope of the present invention to this, unless otherwise specified. no.

The present invention can be preferably applied to an apparatus for forming a thin film (material layer) of a desired pattern by vacuum deposition on the surface of a parallel flat substrate. As a material for the substrate, any material such as glass, a polymer material film, or metal can be selected, and any material such as an organic material or a metallic material (metal, metal oxide, etc.) can be selected as the deposition material. The technique of this invention is specifically applicable to manufacturing apparatuses, such as an organic electronic device (for example, an organic EL display device, a thin film solar cell), and an optical member. Among them, in forming an organic EL display element by evaporating a vapor deposition material in an apparatus for manufacturing an organic EL display device, the present invention is one of the preferred applications.

<Electronic device manufacturing line>

1 is a plan view schematically showing a part of a configuration of a manufacturing line of an electronic device. 1 is a manufacturing line, for example, used for manufacturing a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, after forming an organic EL film on a substrate having a size of about 1800 mm x about 1500 mm, the substrate is diced to produce a plurality of small-sized panels.

The manufacturing line of the electronic device generally includes a plurality of film formation chambers 11 and 12 and a transfer chamber 13, as shown in FIG. A transfer robot 14 is provided in the transfer chamber 13 to hold and transfer the substrate 10. The transfer robot 14 is, for example, a robot having a structure in which a robot hand for holding the substrate 10 is mounted on a multi-joint arm, and carries in/out of the substrate 10 into each film formation chamber.

In each of the film formation chambers 11 and 12, a film forming device (also referred to as a deposition device) is provided. A series of film forming processes such as transfer of the substrate 10 with the transfer robot 14, adjustment (alignment) of the relative positions of the substrate 10 and the mask, fixing of the substrate 10 onto the mask, and film formation (deposition) Is performed automatically by the film forming apparatus.

Hereinafter, the configuration of the film forming apparatus in the film forming room will be described.

<film forming device>

2 is a cross-sectional view schematically showing the configuration of a film forming apparatus. In the following description, the XYZ Cartesian coordinate system with the vertical direction as the Z direction is used. Assuming that the substrate is fixed to be parallel to the horizontal plane (XY plane) at the time of film formation, the short length direction (direction parallel to the short side) of the substrate is the X direction (first direction), long length direction (direction parallel to the long side) ) In the Y direction (second direction). In addition, the rotation angle around the Z axis is indicated by θ (rotation direction).

The film forming apparatus 2 includes a vacuum chamber 20 that defines a space in which a film forming process is performed. The inside of the vacuum chamber 20 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas.

In the upper portion inside the vacuum chamber 20 of the film forming apparatus 2, the substrate holding unit 21 for holding and conveying the substrate, the mask holding unit 22 for holding and conveying the mask, and cooling the substrate For cooling plate 23, a magnet plate 24 for applying magnetic force to the mask made of metal, a mask stand 25 for placing a position-adjusted mask, and the like are installed, inside the vacuum chamber 20 of the film forming apparatus. A deposition source 26 or the like in which the deposition material is stored is installed at the bottom.

The substrate holding unit 21 is a means for holding and conveying the substrate 10 received from the conveying robot 14 in the conveying chamber 13 and is also called a substrate holder.

The mask holding unit 22 is a means for holding and conveying the mask until the mask carried into the vacuum chamber 20 of the film forming apparatus 2 is placed on the mask stage 25.

Under the substrate holding unit 21, a mask-shaped mask stand 25 fixed to the vacuum chamber 20 is installed, and the mask stand 25 has an opening corresponding to a thin film pattern to be formed on the substrate 10. A mask 251 having a pattern is placed. The mask used to manufacture the organic EL device for smartphones is a metallic mask formed with a fine opening pattern, and is also called a FMM (Fine Metal Mask).

The cooling plate 23 is installed above the support portion of the substrate holding unit 21 and is in close contact with the mask 251 of the substrate 10 at the time of film formation to adhere to the surface of the substrate 10 at the time of film formation. It is a plate-shaped member that serves to suppress deterioration or deterioration of the organic material by suppressing the rise.

On the cooling plate 23, a magnetic plate (magnetic application means or contact means; 24) is installed to prevent deflection of the mask by applying magnetic force to the metallic mask 251 and to close the mask 251 and the substrate 10. . The magnet plate 24 may be made of a permanent magnet or an electromagnet, and may be divided into a plurality of modules. Further, the magnet plate 24 may be formed integrally with the cooling plate 23.

The deposition source 26 is a crucible (not shown) in which the deposition material to be deposited on the substrate is stored, a heater (not shown) for heating the crucible, and the deposition material scattering to the substrate until the evaporation rate from the deposition source is constant. And a shutter (not shown) that prevents them. The evaporation source 26 may have various configurations according to uses, such as a point evaporation source, a linear evaporation source, and a revolver evaporation source.

Although not shown in FIG. 2, the film forming apparatus 2 includes a film thickness monitor (not shown) and a film thickness calculation unit (not shown) for measuring the film thickness deposited on the substrate.

On the outer upper surface of the vacuum chamber 20 of the film forming apparatus 2, the substrate holding unit 21, the mask holding unit 22, the cooling plate 23/magnet plate 24, and the like are perpendicular (Z direction). , A lifting mechanism for elevating in the third direction, and holding the substrate parallel to the horizontal plane (in the X, Y, and θ directions) for alignment to the mask of the substrate or to the cooling plate/magnet plate of the mask A driving mechanism (alignment stage) or the like for moving the unit 21 and/or the mask holding unit 22 is provided.

In the present invention, as described later with reference to FIG. 3, the lifting mechanism for moving the cooling plate 23 and the magnet plate 24 in the Z direction is for moving the substrate holding unit 21 in the XYθ direction. By separating/independent from the alignment stage, even if the substrate holding unit 21 connected thereto by XYθ movement of the alignment stage moves XYθ, the cooling plate/magnet plate lifting mechanism is fixed in the XYθ direction without XYθ movement.

In addition, the film forming apparatus 2 of the present invention is also provided with an alignment camera (not shown) for photographing alignment marks formed on the substrate and the mask through a window installed on the ceiling of the vacuum chamber 20 for the alignment of the mask and the substrate. .

Hereinafter, each step of the film forming process performed in the film forming apparatus of the present invention will be described.

First, when a new mask is brought into the vacuum chamber 20 of the film forming apparatus and placed on the mask holding unit 22, the position of the mask placed on the mask holding unit 22 is set to the position of the cooling plate 23. The mask alignment process is adjusted. The mask positioned with respect to the cooling plate 23 is lowered by the mask holding unit 22 and placed on the mask stage 25.

The substrate is carried into the vacuum chamber 20 by the transfer robot 14 in the transfer chamber 13 and placed on the substrate holding unit 21. Subsequently, a substrate alignment process is performed in which the relative positions of the substrate 10 and the mask 251 are measured and adjusted. When the substrate alignment process is completed, the substrate holding unit 21 descends by the lifting mechanism to place the substrate 10 on the mask 251, after which the cooling plate 23 and the magnet plate 24 are raised and lowered. By descending by, the substrate 10 and the mask 251 are brought into close contact.

In this state, the shutter of the evaporation source 26 is opened and the evaporation material evaporated from the crucible of the evaporation source 26 is deposited on the substrate through the fine pattern opening of the mask.

When the film thickness of the deposited material deposited on the substrate reaches a predetermined thickness, the shutter of the evaporation source 26 is closed, and thereafter, the transfer robot 14 transfers the substrate from the vacuum chamber 20 to the transfer chamber 13 Take it out. After repeating the process from the substrate carrying in to the substrate carrying out for a predetermined number of substrates, the mask on which the deposition material is deposited and is no longer usable is taken out from the film forming apparatus, and a new mask is brought into the film forming apparatus.

<Alignment stage>

Hereinafter, the configuration of the alignment stage 30 of the present invention will be described with reference to FIG. 3.

On the outer upper surface (first outer surface) of the vacuum chamber 20, the substrate holding unit 21 and the mask are held for adjusting the position of the substrate 10 with respect to the mask and positioning of the mask with respect to the cooling plate/magnet plate. Alignment stage 30 for moving the support unit 22 in the XYθ direction, substrate Z-axis elevating mechanism for elevating the substrate holding unit 21 in the Z-axis direction (31, substrate third direction driving mechanism), and Cooling plate Z-axis elevating mechanism (32, cooling plate third direction driving mechanism) and mask 251 for elevating the cooling plate 23 and/or the magnet plate 24 in the Z-axis direction For the mask Z-axis lifting mechanism (33, the mask third direction driving mechanism) is provided.

The alignment stage 30 receives the driving force in the XYθ direction through the linear guide (first driving force transmission mechanism) from the alignment stage driving motors 301 and the first motor fixed to the outer upper surface of the vacuum chamber. That is, a guide rail (not shown) is fixedly installed on an upper surface outside the vacuum chamber, and a linear block is movably installed on the guide rail. The alignment stage base plate 302 (first base plate) is mounted on the linear block. Alignment stage base plate 302 mounted on the linear block by moving the linear block in the XYθ direction by the driving force from the motor 301 for driving the alignment stage fixed to the outer upper surface of the vacuum chamber, thus, the entire alignment stage 30 Can be moved in the XYθ direction.

The lifting mechanism for lifting the substrate holding unit 21 and the lifting mechanism for lifting the mask holding unit 22 are mounted on the alignment stage 30 as will be described later, so the substrate holding unit 21 and the mask The holding unit 22 moves in the XYθ direction together with the substrate and mask held on each of them, as the alignment stage moves in the XYθ direction.

The substrate Z-axis elevating mechanism 31 is a mechanism for elevating the substrate holding unit 21 in the Z-axis direction, and is provided on the alignment stage base plate 302. The substrate holding unit 21 in the vacuum chamber 20 is connected to the substrate Z-axis lifting mechanism 31 through the outer upper surface of the vacuum chamber 20. The substrate Z-axis elevating mechanism 31 is a substrate elevating driving force transmitting mechanism for transmitting the driving force of the substrate elevating driving motor 311 and the third motor and the substrate elevating driving motor 311 to the substrate holding unit 21 ( And a linear guide 312 as a third driving force transmission mechanism. In the present embodiment, the linear guide 312 is used as a substrate lift driving force transmission mechanism, but the present invention is not limited to this, and a ball screw or the like may be used.

The cooling plate Z-axis elevating mechanism 32 includes a cooling plate elevating driving motor 321 (second motor) and a cooling plate elevating driving force transmission mechanism for driving the cooling plate 23 and/or the magnet plate 24 in the Z direction. (Second driving force transmission mechanism) includes a ball screw 322, and is installed on the cooling plate Z-axis elevating mechanism base plate 323 (second base plate) fixed to the outer upper surface of the vacuum chamber. In the present embodiment, the ball screw 322 is used as a cooling plate elevating driving force transmission mechanism, but the present invention is not limited thereto, and a linear guide or the like may be used.

As such, in the present invention, the cooling plate Z-axis elevating mechanism 32 is not installed on the alignment stage base plate 302 as in the prior art, but is separated/independent from the alignment stage 30 and fixed to the outer upper surface of the vacuum chamber 20. Since the cooling plate Z-axis lifting mechanism base plate 323 is installed, even if the alignment stage 30 moves in the XYθ direction, the cooling plate Z-axis lifting mechanism 32 does not move in the XYθ direction and does not move in the XYθ direction. Is fixed. In the present specification, the fact that the cooling plate Z-axis elevating mechanism 32 is separately installed from the alignment stage 30 is broadly meaning that the cooling plate Z-axis elevating mechanism 32 is on the alignment stage 30. Is not installed, it means that the driving force for movement in the XYθ direction from the alignment stage 30 is not received, and in a narrow sense, the cooling plate Z-axis elevating mechanism 32 is not installed on the alignment stage 30 and XYθ. It means that it is installed to be fixed to the outer upper surface of the vacuum chamber 20 in the direction (that is, fixed without moving or rotating in the XYθ direction).

The mask Z-axis elevating mechanism 33 is a mechanism for elevating the mask holding unit 22 in the Z-axis direction, and is mounted on the alignment stage 30. The mask holding unit 22 in the vacuum chamber 20 is connected to the mask Z-axis lifting mechanism 33 through the outer upper surface of the vacuum chamber 20. The mask Z-axis elevating mechanism 33 includes a mask elevating driving motor 331, a fourth motor, and a ball screw 332, a fourth driving force transmission mechanism, and discharges the used mask to the transport robot when replacing the mask. Then, the mask holding unit 22 is lifted until a new mask is received and the mask is placed on the mask stage 25 through a mask alignment process.

<mask alignment>

The alignment process for the cooling plate 23 / the magnet plate 24 of the mask will be described with reference to FIG. 4.

When it is time to replace the mask, the mask Z-axis lifting mechanism 33 drives the mask holding unit 22 in the Z-axis direction, and the transport robot receives the mask from the deposition position on the mask stage 25 by using the completed mask. It is raised to the discharge position where it can. The transfer robot receives the used mask from the mask holding unit 22 and discharges it out of the vacuum chamber, brings a new mask into the vacuum chamber, and puts a new mask into the mask holding unit 22 staying in the discharge position. To deliver.

Subsequently, as shown in FIGS. 4(a) and 4(b), the lower surface of the cooling plate 23 using the rough alignment camera 40 installed on the outer upper surface of the vacuum chamber 20 Alternatively, the alignment mark 411 of the alignment mark plate 41 provided on the upper surface of the magnet plate 24 and the alignment mark 2511 of the mask 251 placed on the mask holding unit 22 are photographed, and relative between them Measure the location. The alignment mark plate 41 of the present invention has a planar shape of "TT" as shown in Fig. 4(c), and the alignment mark formed on the alignment mark plate 41 is a circular opening, but the present invention is not limited to this. Does not.

As a result of photographing the alignment mark, when it is determined that the relative positions of the cooling plate 23/magnet plate 24 and the mask 251 placed on the mask holding unit 22 are shifted in the XYθ direction, the alignment stage 30 By moving the mask holding unit 22 in the XYθ direction, the mask is positioned relative to the cooling plate 23/magnet plate 24. At this time, since the cooling plate 23/magnet plate 24, the cooling plate Z-axis elevating mechanism 32 is installed separately from the alignment stage 30, the mask held by the mask holding unit 22 With respect to, the cooling plate 23/magnet plate 24 can be moved relative to adjust their positions.

When the alignment mark plate 41 is provided on the upper surface of the magnet plate 24, the installation on the magnet plate 24 is simple and the installation position can be accurately made. On the other hand, in order to install the alignment mark plate 41 on the lower surface of the cooling plate 23, since the alignment mark plate 41 must be embedded on the lower surface side of the cooling plate 23, the installation becomes complicated, but the camera for rough alignment ( Since it can be installed closer to the alignment mark 2511 of the mask 251 in which the focus of 40) is focused, the recognition precision of the alignment mark by the camera 40 for rough alignment can be increased.

When the mask alignment is completed, the mask holding unit 22 is lowered by the mask Z-axis lifting mechanism 33 to lower the mask 251 from the discharge position to the deposition position on the mask stage 25, and then the mask stage ( 25) The mask 251 is placed on the image.

Through the mask alignment process, the positions of the mask 251 and the cooling plate 23 / magnet plate 24 can be relatively adjusted. That is, since the cooling plate Z-axis elevating mechanism 32 was conventionally mounted on the alignment stage 30 together with the mask Z-axis elevating mechanism 33 for elevating the mask holding unit 22, the mask holding unit Although the mask 251 in the state placed on (22) could not be positioned relative to the cooling plate 23/magnet plate 24, in the present invention, the cooling plate Z-axis elevating mechanism 32 is provided. Since it is installed separately/independent from the alignment stage 30, the mask 251 placed in the mask holding unit 22 can be adjusted by moving relative to the cooling plate 23/magnet plate 24. There will be.

<Substrate alignment>

When the substrate 10 is loaded into the vacuum chamber 20 of the film forming apparatus 2 by the transfer robot 14 of the transfer chamber 13 and placed on the substrate holding unit 21 waiting for the transfer position, the substrate Z The substrate holding support unit 21 descends in the Z-axis direction by the axial elevating mechanism 31 and moves to the measurement position at a predetermined height above the mask. Subsequently, the alignment mark of the substrate and the alignment mark of the mask 251 placed on the mask stand 25 are photographed by the rough alignment camera and the fine alignment camera, and the relative positional displacement of the substrate and the mask is measured.

In the process of bringing the substrate into the vacuum chamber 20 of the film forming apparatus 2, when the substrate is incorrectly placed on the substrate holding unit 21 due to the conveying error by the conveying robot 14, the substrate and the mask stand ( The relative positional deviation between the masks 251 placed on 25) occurs. In this case, the alignment stage 30 to which the substrate holding unit 21 is connected is moved in the XYθ direction to adjust the relative positions of the substrate 10 and the mask 251. Even if the alignment stage 30 is moved in the XYθ direction to position the substrate with respect to the mask 251 on the mask stage 25, in the present invention, the cooling plate Z-axis elevating mechanism 32 aligns the alignment stage 30. Since it is separated from and independently fixed to the outer upper surface of the vacuum chamber 20, the cooling plate Z-axis lifting mechanism 32 does not move in the XYθ direction, and the cooling plate 23/magnet plate 24 upon completion of the mask alignment ) And the mask 251 can be maintained.

Further, when the substrate 10 is placed on the substrate holding support unit 21 in a position relatively displaced from the cooling plate 23 due to the transportation error of the substrate by the transportation robot 14, the substrate 10 ) By adjusting the position with respect to the mask 251 on the mask stage 25, thereby allowing the cooling plate 23 and the substrate 10 to be positioned with the mask 251 on the mask stage 25 through the mask alignment process. The position can be adjusted.

When the alignment of the substrate to the mask is completed, the substrate holding unit 21 descends onto the mask by the substrate Z-axis lifting mechanism 31 to place the substrate on the mask.

Subsequently, the cooling plate 23 and the magnet plate 24 are lowered by driving the cooling plate Z-axis elevating mechanism 32 and placed on the upper surface of the substrate 10. At this time, the metallic mask 251 is attracted by the magnetic force of the magnet plate 24, whereby the substrate and the mask are brought into close contact.

According to the present invention, the position of the cooling plate 23 and the substrate is adjusted to each other despite the transportation error of the substrate by the transportation robot 14, so that the cooling action of the substrate by the cooling plate 23 can be maximized. In addition, even when a substrate transport error occurs by the transport robot 14, the variation in the transport error can be minimized, so that the offset for correcting the relative position of the cooling plate and the substrate can be stabilized. In addition, since the relative positions of the magnet plate 24 and the mask 251 are also adjusted, when the substrate and the mask are in close contact with the magnetic force from the magnet plate 24, it is possible to reduce variations in the contact state. As a result, film formation defects can be effectively reduced.

<Method of manufacturing an electronic device>

Next, an example of a method of manufacturing an electronic device using the film forming apparatus of this embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be exemplified as an example of an electronic device.

First, an organic EL display device to be manufactured will be described. Fig. 5(a) shows the overall view of the organic EL display device 60, and Fig. 5(b) shows the cross-sectional structure of one pixel.

As shown in Fig. 5A, a plurality of pixels 62 having a plurality of light emitting elements are arranged in a matrix form in the display area 61 of the organic EL display device 60. Although the details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. In addition, the pixel referred to here refers to a minimum unit that enables a desired color display in the display area 61. In the case of the organic EL display device according to the present embodiment, the pixel 62 is constituted by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B showing different light emission. It is done. The pixel 62 is often composed of a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may be a combination of a yellow light-emitting element, a cyan light-emitting element, or a white light-emitting element. no.

5(b) is a partial cross-sectional schematic view taken along line A-B in FIG. 5(a). The pixel 62 includes a first electrode (anode) 64 on the substrate 63, a hole transport layer 65, light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 ). Of these, the hole transport layer 65, the light emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to the organic layer. In the present embodiment, the light emitting layer 66R is an organic EL layer emitting red, the light emitting layer 66G is an organic EL layer emitting green, and the light emitting layer 66B is an organic EL layer emitting blue. The light emitting layers 66R, 66G, and 66B are formed in a pattern corresponding to light emitting elements (sometimes referred to as organic EL elements) emitting red, green, and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. Further, in order to prevent the first electrode 64 and the second electrode 68 from being shorted by a foreign material, an insulating layer 69 is provided between the first electrode 64. In addition, since the organic EL layer is deteriorated by moisture or oxygen, a protective layer 70 for protecting the organic EL element from moisture and oxygen is provided.

In FIG. 5(b), the hole transport layer 65 or the electron transport layer 67 is shown as one layer. However, depending on the structure of the organic EL display device, it may be formed of a plurality of layers including a hole block layer or an electron block layer. It might be. In addition, between the first electrode 64 and the hole transport layer 65, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 64 into the hole transport layer 65 is provided. It can also form. Similarly, an electron injection layer may be formed between the second electrode 68 and the electron transport layer 67.

Next, an example of a method of manufacturing an organic EL display device will be described in detail.

First, a circuit 63 (not shown) for driving the organic EL display device and a substrate 63 on which the first electrode 64 is formed are prepared.

The insulating layer 69 is formed by forming an acrylic resin on a substrate 63 on which the first electrode 64 is formed by spin coating, and patterning the acrylic resin to form an opening in a portion where the first electrode 64 is formed by lithography. To form. This opening corresponds to a light emitting region in which the light emitting element actually emits light.

The substrate 63 on which the insulating layer 69 is patterned is carried into the first organic material deposition apparatus to hold the substrate with the substrate holding unit, and the hole transport layer 65 is common to the first electrode 64 in the display area. It is formed as a layer. The hole transport layer 65 is formed by vacuum deposition. In practice, since the hole transport layer 65 is formed to have a larger size than the display area 61, a high-precision mask is not required.

Next, the substrate 63 formed up to the hole transport layer 65 is carried into the second organic material film forming apparatus and held by the substrate holding unit. Alignment of the substrate and the mask is performed, the substrate is placed on the mask, and a light emitting layer 66R emitting red color is formed on a portion of the substrate 63 where an element emitting red color is disposed.

According to the present invention, by separating/independent the cooling plate Z-axis elevating mechanism 32 for elevating the cooling plate/magnet plate of the film forming apparatus from the alignment stage 30, in order to solve the conveyance error caused by the conveying robot 14 Even when positioning is performed by driving the alignment stage 30, the relative positions between the cooling plate/magnet plate, the substrate, and the mask can be effectively adjusted, thereby effectively reducing film formation defects.

Similar to the film formation of the light emitting layer 66R, a green light emitting layer 66G is formed by a third organic material film forming apparatus, and further, a blue light emitting layer 66B is formed by a fourth organic material film forming apparatus. After the film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed over the entire display area 61 by the fifth organic material film forming apparatus. The electron transport layer 67 is formed as a common layer for the three color light emitting layers 66R, 66G, and 66B.

The substrate formed up to the electron transport layer 67 is moved to the metal deposition material deposition apparatus to form the second electrode 68.

Then, the protective layer 70 is formed by moving to a plasma CVD apparatus to complete the organic EL display device 60.

The light emitting layer made of an organic EL material is exposed to an atmosphere containing moisture or oxygen from when the substrate 63 on which the insulating layer 69 is patterned is brought into the film forming apparatus until the film formation of the protective layer 70 is completed. There is a risk of deterioration by moisture or oxygen. Therefore, in this example, the substrate is brought in and out between the film forming apparatuses in a vacuum atmosphere or an inert gas atmosphere.

The above embodiment shows an example of the present invention, and the present invention is not limited to the configuration of the above embodiment, and may be appropriately modified within the scope of the technical idea.

10: substrate
14: bounce robot
20: vacuum chamber
21: substrate holding unit
22: mask holding unit
23: cooling plate
24: Magnet version
25: mask stand
30: alignment stage
31: substrate Z-axis lifting mechanism
32: Cooling plate Z-axis lifting mechanism
33: Mask Z-axis lifting mechanism
41: alignment mark plate

Claims (19)

A film forming apparatus for forming a deposition material on a substrate through a mask,
Vacuum chamber that defines the space in which the deposition process takes place,
It is installed in the vacuum chamber, the mask holding unit for holding and conveying the mask,
It is installed in the vacuum chamber, a magnetic force applying means for applying a magnetic force to the mask from the opposite side of the film forming surface of the substrate,
Alignment stage for moving the mask holding unit in a first direction and a second direction intersecting the first direction or in a rotational direction about the third direction intersecting the first direction and the second direction. , And
Separately installed from the alignment stage and installed independently, the magnetic force applying means for driving the magnetic force applying means in the third direction is a third direction driving mechanism
A film forming apparatus comprising a. The film forming apparatus of claim 1, wherein the third direction driving mechanism of the magnetic force applying means is installed to be fixed in the first direction, the second direction, and the rotational direction with respect to the vacuum chamber. The alignment stage of claim 1, wherein the alignment stage comprises a first base plate movable on the first outer surface of the vacuum chamber and movable in the first direction and the second direction and rotatable in the rotational direction. Deposition apparatus. According to claim 3, The magnetic force applying means third direction driving mechanism, the second base plate is installed to be fixed in the first direction, the second direction and the rotational direction on the first outer surface of the vacuum chamber. A film forming apparatus comprising. The film forming apparatus according to claim 4, further comprising: a mask third direction driving mechanism installed on the first base plate and driving the mask holding unit in the third direction. According to claim 3, A substrate holding unit for holding and conveying the substrate, and a substrate installed in the first base plate and a substrate for driving the substrate holding unit in the third direction. The film forming apparatus further comprising. The film forming apparatus according to claim 6, wherein the magnetic force applying means in the third direction driving mechanism drives the cooling plate for cooling the substrate together with the magnetic force applying means in the third direction. The film formation of claim 3, further comprising a first motor fixed on the first outer surface of the vacuum chamber, and a first driving force transmission mechanism that transmits driving force from the first motor to the first base plate. Device. The magnetic force applying means of the third direction driving mechanism is a second motor for generating a driving force for driving the magnetic force applying means in the third direction, and the driving force from the second motor as the magnetic force applying means A film forming apparatus further comprising a second driving force transmission mechanism for transmitting. The substrate holding unit of claim 6, wherein the substrate third direction driving mechanism generates a driving force for driving the substrate holding unit in the third direction, and a driving force from the third motor. The film forming apparatus further comprising a third driving force transmission mechanism for transmitting. The method of claim 5, wherein the mask third direction driving mechanism is a fourth motor for generating a driving force for driving the mask holding unit in the third direction and the driving force from the fourth motor to the mask holding unit. A film forming apparatus comprising a fourth driving force transmission mechanism for transmitting. A film forming apparatus for forming a deposition material on a substrate through a mask,
A vacuum chamber defining a space in which the deposition process takes place,
It is installed in the vacuum chamber, and the mask holding unit for holding and conveying the mask,
It is disposed in the vacuum chamber, and the contact means for adhering the substrate and the mask from the opposite side of the film forming surface of the substrate,
Alignment stage for moving the mask holding unit in a first direction and a second direction intersecting the first direction or in a rotational direction about the third direction intersecting the first direction and the second direction. Wow,
Separately installed from the alignment stage and installed independently, a contact means for driving the contact means in the third direction. A third direction driving mechanism.
A film forming apparatus comprising a. The method of claim 12,
The adhesion means third driving mechanism is provided so as to be fixed in the first direction, the second direction, and the rotational direction with respect to the vacuum chamber. As a deposition method for depositing a deposition material on a substrate through a mask,
A step of placing the mask carried into the vacuum chamber of the film forming apparatus according to any one of claims 1 to 11 into a mask holding unit,
A first direction, a second direction intersecting the first direction, and a third direction intersecting the first direction and the second direction with respect to the magnetic force applying means for the mask placed in the mask holding unit are axial. Mask alignment step of adjusting the position in one rotation direction,
Placing a position-adjusted mask on a mask stand fixed to the vacuum chamber,
Bringing the substrate into the vacuum chamber of the film forming apparatus and placing it on the substrate holding unit,
A substrate alignment step of positioning the substrate placed on the substrate holding unit in the first direction, the second direction, and the rotational direction with respect to the mask placed on the mask stand;
Placing a substrate positioned on the mask with respect to the mask placed on the mask stage,
Moving the magnetic force applying means and the cooling plate in the third direction to contact the substrate, and
Depositing a deposition material on the substrate through a mask,
The deposition method comprising a. The method of claim 14,
In the mask alignment step, the alignment stage of the film forming apparatus is moved or rotated relative to the first direction, the second direction, and the rotation direction with respect to the third direction driving mechanism with the magnetic force applying means on which the magnetic force applying means is mounted. A film forming method for adjusting the position of the mask placed on the mask holding unit connected to the stage with respect to the magnetic force applying means. 16. The method of claim 15, wherein the mask alignment step is mounted on the magnetic force applying means and the mask holding unit by photographing the alignment mark of the mask and the alignment mark on the alignment mark plate installed on the lower portion of the magnetic force applying means or on the cooling plate. And measuring the relative positional displacement between the masks or the relative positional displacement between the magnet plate and the mask placed on the mask holding unit. As a deposition method for depositing a deposition material on a substrate through a mask,
Placing the mask carried into the vacuum chamber of the film forming apparatus according to claim 12 or 13 into a mask holding unit;
The mask in the state placed on the mask holding unit is a first direction, a second direction intersecting the first direction, and a third direction intersecting the first direction and the second direction with respect to the contact means. A mask alignment step of adjusting the position in the rotation direction,
Placing a position-adjusted mask on a mask stand fixed to the vacuum chamber,
Bringing the substrate into the vacuum chamber of the film forming apparatus and placing it on the substrate holding unit;
A substrate alignment step of positioning the substrate placed on the substrate holding unit in the first direction, the second direction and the rotational direction with respect to the mask placed on the mask stand;
Placing a substrate positioned on the mask with respect to the mask placed on the mask stage;
Moving the adhesion means in the third direction to adhere to the substrate;
Depositing a deposition material on a substrate through a mask
The deposition method comprising a. A method of manufacturing an electronic device using the film-forming method according to claim 14. A method of manufacturing an electronic device using the film-forming method according to claim 17.

Images