JP2019060027A - Substrate mounting device, film formation device, substrate mounting method, film formation method, and method for producing electronic device - Google Patents

Abstract

To reduce variations in the positions of substrates when mounting them on a mounting body.SOLUTION: A substrate mounting device has support means containing a plurality of support tools that support the edge of a substrate, and mounting means for mounting the substrate on a mounting body. For the plurality of support tools, the distance between some support tools is different from the distance between other support tools. Alternatively, a substrate mounting device has support means containing a plurality of support tools that support the edge of a substrate, support tool movement means that moves at least some of the plurality of support tools, independently of the other support tools, and mounting means for mounting the substrate on a mounting body.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a substrate mounting apparatus, a film forming apparatus, a substrate mounting method, a film forming method, and a method of manufacturing an electronic device.

  In recent years, the increase in size and thickness of the substrate has progressed, and the influence of the deflection due to the weight of the substrate is increasing. Further, because the film formation region is provided at the center of the substrate, the substrate can be supported and held only at the outer peripheral portion (peripheral portion) of the substrate.

  In the prior art, a substrate support mechanism for supporting the outer peripheral portion (four sides) of the substrate is used, and a substrate mounting mechanism for mounting the substrate on a mounting body (for example, a mask) is used. Here, among the outer periphery of the substrate, the substrate is held at one opposing side (for example, the long side) and only supported at the other opposing side (for example, the short side).

JP, 2009-277655, A

  When the periphery of the substrate is supported as described above, the substrate is bent by its own weight and the center of the substrate is depressed. In addition, bending occurs in the substrate also in the periphery where only support is provided. At this time, the mode of deflection (deflection) of the substrate differs from substrate to substrate. Therefore, when the outer periphery of the substrate is supported by a plurality of supports, the contact state between the substrate and the plurality of supports also differs from substrate to substrate. Furthermore, when the substrate is placed on a mounting body (for example, a mask), a shift occurs, but the manner of the shift also differs depending on the substrate.

  That is, when the substrate is placed on the mounting body, the position of the substrate on the mounting body is disadvantageously different for each substrate. This leads to an increase in the time required for alignment, leading to an increase in manufacturing time (tact time).

  In consideration of the problems as described above, the present invention has an object to suppress variations among substrates when placing the substrates on a mounting body.

The substrate mounting apparatus according to one aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
Placing means for placing the substrate on the placement body;
Equipped with
The plurality of supports are characterized in that the distance between some of the supports is different from the distance between the other supports.

The substrate mounting apparatus according to one aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports;
Placing means for placing the substrate on the placement body;
Equipped with

A substrate mounting method according to an aspect of the present invention is
A supporting step of supporting the peripheral edge of the substrate by a plurality of supports;
Placing the substrate on a carrier;
Including
The plurality of supports are characterized in that the distance between some of the supports is different from the distance between the other supports.

A substrate mounting method according to an aspect of the present invention is
A supporting step of supporting the periphery of the substrate by a plurality of supports;
A support moving step of moving at least a part of the plurality of supports independently of the other supports;
A placement step of placing the substrate on the placement body;
including.

  According to the present invention, it is possible to suppress variation among substrates when placing the substrate on the mounting body. This can reduce the time required for alignment and thus the overall manufacturing time.

The upper view which shows typically a part of structure of the manufacturing apparatus of an electronic device. Sectional drawing which shows the structure of the film-forming apparatus typically. FIG. 2 is a diagram showing the configuration of a substrate holding unit. FIG. 2 is a view for explaining a substrate supporting method in Embodiment 1. The method of placing the substrate (reception of substrate to support of substrate) will be described. The mounting method (first alignment) of the substrate will be described. The mounting method (second alignment) of the substrate will be described. The mounting method (second alignment) of the substrate will be described. The method of mounting the substrate (cooling plate lowering to holding release) will be described. FIG. 7 is a view for explaining a substrate supporting method in the second embodiment. FIG. 7 is a view for explaining a substrate supporting method in the third embodiment. FIG. 14 is a view for explaining a substrate supporting method in the fourth embodiment. The figure explaining the board | substrate support method in a modification. BRIEF DESCRIPTION OF THE DRAWINGS The whole view of an organic electroluminescence display, and the figure which shows the cross-section of 1 pixel of an organic electroluminescent electronic device.

  Hereinafter, preferred embodiments and examples of the present invention will be described with reference to the drawings. However, the following embodiments and examples merely illustrate preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. In the following description, the hardware configuration and software configuration of the device, the process flow, the manufacturing conditions, the dimensions, the materials, the shape, etc. limit the scope of the present invention to only those unless otherwise specified. It is not for the purpose.

The present invention relates to a film forming apparatus for forming a thin film on a substrate and a control method thereof, and more particularly to a technique for highly accurate transport and alignment of the substrate. The present invention is preferably applicable to an apparatus for forming a thin film (material layer) of a desired pattern on a surface of a parallel flat substrate by vacuum deposition. As a material of the substrate, any material such as glass, resin, metal and the like can be selected, and as the vapor deposition material, any material such as an organic material and an inorganic material (metal, metal oxide and the like) can be selected.
Specifically, the technology of the present invention is applicable to manufacturing apparatuses such as organic electronic devices (for example, organic EL display devices, thin film solar cells), optical members and the like. Among them, the manufacturing apparatus of the organic EL display device is required to further improve the substrate transfer accuracy and the alignment accuracy of the substrate and the mask by increasing the size of the substrate or increasing the definition of the display panel. It is one of the examples.

<Manufacturing equipment and manufacturing process>
FIG. 1 is a top view schematically showing a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus of FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smart phone. In the case of a display panel for a smartphone, for example, after forming a film of an organic EL on a substrate having a size of about 1800 mm × about 1500 mm and a thickness of about 0.5 mm, the substrate is diced to produce a plurality of small size panels Ru.

  An electronic device manufacturing apparatus generally has a plurality of film forming chambers 111 and 112 and a transfer chamber 110 as shown in FIG. In the transfer chamber 110, a transfer robot 119 which holds and transfers the substrate 10 is provided. The transfer robot 119 is, for example, a robot having a structure in which a robot hand holding a substrate is attached to an articulated arm, and carries the substrate 10 into and out of each film forming chamber.

  Each of the film forming chambers 111 and 112 is provided with a film forming apparatus (also referred to as a vapor deposition apparatus). A series of film forming processes such as delivery of the substrate 10 with the transport robot 119, adjustment (alignment) of the relative position between the substrate 10 and the mask, fixing of the substrate 10 on the mask, film formation (vapor deposition) It is done automatically. The film forming apparatus in each film forming chamber has a basic configuration, although there are differences in details such as the difference in whether the film formation target is an organic film or a metal film, the difference in evaporation source, the difference in mask, etc. (In particular, the configuration related to substrate transport and alignment) is almost common. Hereinafter, the common configuration of the film forming apparatus in each film forming chamber will be described.

<Deposition apparatus>
FIG. 2 is a cross-sectional view schematically showing the configuration of the film forming apparatus. In the following description, an XYZ orthogonal coordinate system in which the vertical direction is the Z direction is used. At the time of film formation, the substrate is fixed to be parallel to the horizontal plane (XY plane), and the lateral direction (parallel to the short side) of the substrate at this time is the X direction and the longitudinal direction (parallel to the long side) ) In the Y direction. Further, the rotation angle around the Z axis is represented by θ.

  The film forming apparatus has a vacuum chamber 200. The inside of the vacuum chamber 200 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. Inside the vacuum chamber 200, a substrate holding unit 210, a mask 220, a mask base 221, a cooling plate 230, and a deposition source 240 are generally provided. The substrate holding unit 210 is a means for holding and transporting the substrate 10 received from the transport robot 119, and is also called a substrate holder. The mask 220 is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 10, and is fixed on the frame-like mask base 221. At the time of film formation, the substrate 10 is placed on the mask 220. Therefore, the mask 220 also plays a role as a placement body on which the substrate 10 is placed. The cooling plate 230 is a member that adheres to the substrate 10 (the surface opposite to the mask 220) at the time of film formation, and suppresses the temperature increase of the substrate 10 to suppress the deterioration or degradation of the organic material. The cooling plate 230 may double as a magnet plate. The magnet plate is a member that attracts the mask 220 by magnetic force to enhance the adhesion between the substrate 10 and the mask 220 during film formation. The deposition source 240 is composed of a deposition material, a heater, a shutter, a drive mechanism of an evaporation source, an evaporation rate monitor, and the like (all not shown).

A substrate Z actuator 250, a clamp Z actuator 251, a cooling plate Z actuator 252, an X actuator (not shown), a Y actuator (not shown), and a θ actuator (not shown) are provided above (outside) the vacuum chamber 200. ing. These actuators are composed of, for example, a motor and a ball screw, and a motor and a linear guide. The substrate Z actuator 250 is drive means (substrate elevating means) for moving up and down (moving in the Z direction) the entire substrate holding unit 210. The clamp Z actuator 251 is a drive means for opening and closing a holding mechanism (described later) of the substrate holding unit 210. The cooling plate Z actuator 252 is a driving means for moving the cooling plate 230 up and down. The X actuator, the Y actuator, and the θ actuator (hereinafter collectively referred to as “XYθ actuator”) are drive means for alignment of the substrate 10. The XYθ actuator moves the whole of the substrate holding unit 210 and the cooling plate 230 in the X direction, in the Y direction, and in the θ direction. In the present embodiment, X, Y and θ of the substrate 10 are adjusted in a state where the mask 220 is fixed, but the positions of the mask 220 are adjusted or both of the substrate 10 and the mask 220 are adjusted. The substrate 10 and the mask 220 may be aligned by adjustment.

  Cameras 260 and 261 for measuring the positions of the substrate 10 and the mask 220 for alignment of the substrate 10 and the mask 220 are provided above (outside) the vacuum chamber 200. The cameras 260, 261 capture the substrate 10 and the mask 220 through the windows provided in the vacuum chamber 200. By recognizing the alignment mark on the substrate 10 and the alignment mark on the mask 220 from the image, the relative displacement in each XY position or in the XY plane can be measured. In order to realize high-precision alignment in a short time, the first alignment (generally referred to as "rough alignment") which performs rough alignment, and the second alignment (also referred to as "fine alignment") which aligns with high accuracy It is preferable to carry out a two-step alignment of In that case, it is preferable to use two types of cameras, a low resolution but wide view first alignment camera 260 and a narrow view but high resolution second alignment camera 261. In this embodiment, with respect to each of the substrate 10 and the mask 220, alignment marks attached to two places of a pair of opposing sides are measured by two first alignment cameras 260, and the four corners of the substrate 10 and the mask 220 are measured. The alignment marks attached to are measured by four second alignment cameras 261.

  The film forming apparatus has a control unit 270. The control unit 270 controls the transfer and alignment of the substrate 10, the control of the deposition source, and the control of film formation, in addition to the control of the substrate Z actuator 250, the clamp Z actuator 251, the cooling plate Z actuator 252, the XYθ actuator, and the cameras 260 and 261. And other functions. The control unit 270 can be configured by, for example, a computer having a processor, a memory, a storage, an I / O, and the like. In this case, the function of the control unit 270 is realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or programmable logic controller (PLC) may be used. Alternatively, some or all of the functions of the control unit 270 may be configured by circuits such as an ASIC or an FPGA. Note that the control unit 270 may be provided for each film forming apparatus, or one control unit 270 may control a plurality of film forming apparatuses.

  Note that the components related to the holding, transportation, and alignment of the substrate 10 (substrate holding unit 210, substrate Z actuator 250, clamp Z actuator 251, XYθ actuator, cameras 260 and 261, control unit 270, etc.) Also referred to as “substrate holding device”, “substrate transfer device” and the like.

<Board holding unit>
The configuration of the substrate holding unit 210 will be described with reference to FIG. FIG. 3 is a perspective view of the substrate holding unit 210.

  The substrate holding unit 210 is a means for holding and transporting the substrate 10 by holding the peripheral portion of the substrate 10 by the holding mechanism. Specifically, in the substrate holding unit 210, the substrate 10 is provided between the support frame 301 provided with a plurality of supports 300 for supporting the four sides of the substrate 10 from the bottom and the support 300 for the long side. , And a support moving mechanism 304 for moving the support 300 of the short side. One pair of supporting members 300 and the pressing member 302 constitute one holding mechanism. In the example of FIG. 3, three supports 300 are arranged along the short side of the substrate 10, and six holding mechanisms (a pair of the support 300 and the presser 302) are arranged along the long side, It is configured to hold two sides. However, the configuration of the holding mechanism is not limited to the example shown in FIG. 3, and the number and the arrangement of the holding mechanism may be appropriately changed in accordance with the size and shape of the substrate to be treated and film forming conditions. Note that the support 300 is also referred to as a "receiving claw" or a "finger", and the pressing tool 302 is also referred to as a "clamp".

  The support moving mechanism 304 is a mechanism for moving the support 300 of the short side in the vertical direction (Z direction) and the direction along the short side (X direction). The support moving mechanism 304 can move some of the supports independently of the other supports. Although the support moving mechanism 304 is also provided for the support at the short side on the front side of the drawing, illustration thereof is omitted for the sake of easy understanding of the drawing. Moreover, in FIG. 3, although the support tool moving mechanism 304 is provided only with respect to the support 300 of the center of a short side part, even if the support tool moving mechanism 304 is provided with respect to the support 300 other than the center. I do not mind.

  Delivery of the substrate 10 from the transfer robot 119 to the substrate holding unit 210 is performed, for example, as follows. First, the clamp member 303 is raised by the clamp Z actuator 251 to separate the pressing tool 302 from the support 300, thereby bringing the clamping mechanism into the released state. After the substrate 10 is introduced between the support 300 and the press 302 by the transfer robot 119, the substrate 10 is supported by the support 300. By driving the substrate holding unit 210 by the substrate Z actuator 250 in this state, the substrate 10 can be moved up and down (moved in the Z direction). In addition, since the clamp Z actuator 251 moves up and down together with the substrate holding unit 210, the state of the holding mechanism does not change even if the substrate holding unit 210 moves up and down.

  Reference numeral 101 in FIG. 3 denotes alignment marks for second alignment attached to four corners of the substrate 10, and reference numeral 102 denotes alignment marks for first alignment attached to the center of the short side of the substrate 10. It shows.

Example 1
FIGS. 4A to 4D illustrate a method of supporting the substrate 10 by the support 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places the substrate 10 on the mask (placement body) 220. FIG.

  FIG. 4A is a bottom view of the substrate holding unit 210 and the substrate 10. As shown in the figure, the support of the substrate holding unit 210 supports the peripheral portion 103 (supportable area) of the substrate 10. As described above, the long side of the substrate 10 is held by the support 300 and the pressing tool 302, while the short side of the substrate 10 is only supported by the support 300. Here, supports other than a part of supports on the short side (support 403 in the figure) are located at the same height. This height is hereinafter referred to simply as the reference height.

FIGS. 4B to 4D are cross-sectional views of the central portion (FIG. 4C) and the short side portion (FIGS. 4B and 4D) of the substrate 10. At the central portion of the substrate 10, as shown in FIG. 4 (c), the central portion is bent downward by its own weight. On the other hand, at the short side portion of the substrate 10, as shown in FIG. 4B and FIG. 4D, the central support 403 is retracted below the reference height. Thus, between the supports 402 and 404, the substrate 10 deflects downward by its own weight. The deflection of the substrate 10 between the other supports at the short sides is less than the deflection between the supports 402 and 404.

  As described above, in the present embodiment, the substrate 10 is actively flexed at the short side using the weight of the substrate 10. As a result, even if there is a difference in peculiarities between the substrates 10, it is possible to make the mode (the manner of bending) of the bending of the substrate 10 constant when the substrate holding unit 210 holds the substrate 10.

  Although the central support 403 does not support the substrate 10 in the figure, the support 403 may support the substrate 10.

  Hereinafter, with reference to FIGS. 5 to 9, a series of processes from when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places the substrate 10 on the mask (placement body) 220 will be described.

  5A shows a state in which the substrate 10 held by the robot hand 501 of the transfer robot 119 is delivered to the substrate holding unit 210. FIG. The center of the substrate 10 held by the robot hand 501 is bent downward by its own weight. Therefore, the support 403 at the center on the short side is retracted downward to a position not in contact with the substrate 10 so that the substrate holding unit 210 can receive the substrate 10 while maintaining the shape of the substrate 10. As described above, by transferring the substrate 10 between the robot hand 501 and the substrate holding unit 210 while maintaining the bending, it is possible to alleviate the displacement of the substrate at the time of delivery (at the time of reception).

  FIG. 5B shows a state in which the delivery of the substrate 10 is completed and the robot hand 501 is pulled out.

  After the delivery is completed, the short center-side support 403 is moved by the support moving mechanism 304 until it contacts the substrate 10. FIG. 5C is a diagram showing the state after movement. The height of the support 403 after movement may be determined in advance, or may be measured and determined by a sensor. The substrate 10 is lifted at its central portion by the support 403 so that the downward deflection is relaxed and supported by all the supports 401 to 405.

  Next, as shown in FIG. 6A, after the long side portion of the substrate 10 is held, the substrate 10 is lowered to a position not in contact with the mask 220. The holding of the long side portion of the substrate 10 is performed by lowering the clamp member 303 and pressing the pressing tool 302 against the support 300 with a predetermined pressing force. The lowering of the substrate 10 is performed by driving the substrate holding unit 210 by the substrate Z actuator 250. The substrate 10 may be placed on the mask 220 by raising and lowering the mask base 221 by the placement body lifting means while the height of the substrate holding unit 210 is fixed.

  Here, although the substrate 10 is lowered while holding the long side portion of the substrate 10, the substrate 10 may be lowered without being held.

FIG. 6 (b) is a diagram showing a first alignment. The first alignment is an alignment process that performs rough alignment, and is also referred to as “rough alignment”. In the first alignment, the camera 260 recognizes the substrate alignment mark 102 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220 by the camera 260, and the relative displacement between each in the XY position and the XY plane. Measure and align. The camera 260 used for the first alignment is a low resolution but wide field of view camera so that rough alignment can be performed. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, or the positions of both the substrate 10 and the mask 220 are adjusted. It is also good.

  When the first alignment process is completed, the substrate 10 is further lowered to place the substrate 10 on the mask 220 as shown in FIG. 6C. Here, the state in which the substrate 10 is placed on the mask 220 means the state in which the substrate 10 and the mask 220 are in contact with each other. That is, the state in which the substrate 10 is placed on the mask 220 means that when the substrate 10 starts to contact with the mask 220, the contact area of the substrate 10 and the mask 220 increases more than the contact start time, and The state of any point in time when completely placed on 220 is included.

  Although the support 403 at the center of the short side is located at a lower height (lower than the reference height) than the other supports, when the substrate 10 is placed on the mask 220, as shown in FIG. As shown in a), it is moved by the support moving mechanism 304 to the same height (reference height) as the other supports. Thereby, distortion when placing the substrate 10 on the mask 220 can be reduced. The movement of the support 403 may be performed before the substrate 10 and the mask 220 contact, or may be performed after the substrate 10 and the mask 220 contact.

  7 (b) to 8 (c) are diagrams for explaining the second alignment. The second alignment is an alignment process that performs highly accurate alignment, and is also referred to as “fine alignment”. First, as shown in FIG. 7B, the camera 261 recognizes the substrate alignment mark 101 provided on the substrate 10 and the mask alignment mark (not shown) provided on the mask 220, and the respective XY positions and XY planes Measure the relative displacement within. The camera 261 is a narrow-field but high-resolution camera so that highly accurate alignment can be performed. If the measured deviation exceeds a threshold, alignment processing is performed. Below, the case where measured gap exceeds a threshold is explained.

  If the measured deviation exceeds the threshold, as shown in FIG. 7C, the substrate Z actuator 250 is driven to lift the substrate 10 away from the mask 220. At this time, the height of the support 403 may be maintained, that is, the same height as other supports, or the height of the support moving mechanism 304 may be adjusted by the support moving mechanism 304.

  In FIG. 8A, the XYθ actuator is driven based on the displacement measured by the camera 261 to perform alignment. At the time of alignment, the position of the substrate 10 (substrate holding unit 210) may be adjusted, the position of the mask 220 may be adjusted, or the positions of both the substrate 10 and the mask 220 are adjusted. It is also good.

  Thereafter, as shown in FIG. 8B, the substrate 10 is lowered again to place the substrate 10 on the mask 220. Then, as shown in FIG. 8C, the camera 261 captures an image of the alignment mark of the substrate 10 and the mask 220, and measures the deviation. If the measured deviation exceeds the threshold, the above-described alignment processing is repeated.

  When the deviation is within the threshold value, as shown in FIG. 9A, the cooling plate Z actuator is driven to lower the cooling plate 230 and make it adhere to the substrate 10. In the present embodiment, the cooling plate 230 also serves as a magnet plate, and the adhesion between the substrate 10 and the mask 20 is enhanced by attracting the mask 220 by magnetic force.

  When the lowering of the cooling plate (magnet plate) is completed, as shown in FIG. 9B, the clamp member 303 is raised to release the clamping of the long side portion of the substrate 10 (unclamp). Thereafter, as shown in FIG. 9C, the substrate holding unit 210 is lowered.

  By the above steps, the process of placing the substrate 10 on the mask 220 is completed, and the film forming process (vapor deposition process) is performed by the film forming apparatus.

  According to the present embodiment, when holding the substrate 10 by the substrate holding unit 210, the substrate 10 is made to face downward by its own weight by positioning a part of the support on the short side lower than the other supports. Sway. Thereby, regardless of the difference in the peculiarity of the substrate 10, the bending manner of the substrate 10 can be made the same. Therefore, when the substrate 10 is placed on the mask 220, it can be suppressed that the placement position varies among the substrates. Thereby, alignment can be completed with high accuracy and in a short time. Furthermore, the film formation process on the substrate can be completed with high accuracy and in a short time.

  Although in the present embodiment, the height of only one support 403 at the center of the short side is adjusted, the heights of a plurality of supports at the center of the short side may be adjusted. . At this time, the heights of the plurality of supports need not be the same, and may be different.

Example 2
In this embodiment, the substrate 10 is bent in a manner different from that of the first embodiment. 10 (a) to 10 (d), a method of supporting the substrate 10 by the support 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220. FIG.

  As shown in FIGS. 10 (b) and 10 (d), in the short side portion of the substrate 10 in the present embodiment, the supports 401 and 405 at the end portion are retracted below the reference height. Accordingly, the substrate 10 is not supported at the end side, and bends more at the end than at the supports 402 and 404 than at other places. Further, the end of the substrate 10 is bent downward by its own weight, and the substrate 10 is bent upward as a whole.

  The bending manner of the substrate 10 is different from that of the first embodiment, but also in the present embodiment, uniform bending can be given to the substrate 10 and the difference in the bending manner between the substrates can be eliminated. That is, the same effects as in the first embodiment can be obtained.

  Although the supports 401 and 405 are not in contact with the substrate 10 in FIG. 10, for example, the supports 401 and 405 may be lifted and brought into contact with the substrate 10 after the substrate 10 is received.

Example 3
In this embodiment, the same method of bending as in Embodiment 2 is given to the substrate 10, but the method is different. 11A to 11D illustrate a method of supporting the substrate 10 by the support 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places the substrate 10 on the mask (placement body) 220. FIG.

  As shown in FIGS. 11 (b) and 11 (d), in the present embodiment, at the short side of the substrate 10, the center support 403 is above the heights (reference heights) of the other supports. It has been moved. Therefore, the center of the end of the substrate 10 is mechanically lifted and bent upward.

  Also in this embodiment, uniform deflection can be applied to the substrate 10 to eliminate the difference in deflection among substrates. That is, the same effects as in the first embodiment can be obtained.

Example 4
In this embodiment, the substrate 10 is given a different bending method as in the second and third embodiments, but the method is different. 12 (a) to 12 (d) show a method of supporting the substrate 10 by the support 300 when the substrate holding unit 210 receives the substrate 10 from the transfer robot and places it on the mask (placement body) 220. FIG.

  As shown in FIGS. 12 (b) and 12 (d), in the present embodiment, the support is moved in the lateral direction (X direction) of the support at the short side of the substrate 10 to bring the support near the center of the short side. Concentrate. Accordingly, the support on the end portion side of the substrate 10 is weakened, the end portion of the substrate 10 is bent downward by its own weight, and the substrate 10 is bent upward as a whole.

  In the present embodiment, the support moving mechanism 304 needs to be configured to be able to move the support in the lateral direction (X direction). The support moving mechanism 304 in this embodiment may move the support only in the lateral direction, or may move the support in the horizontal and vertical (Z direction) therapy.

  Also in this embodiment, uniform deflection can be applied to the substrate 10 to eliminate the difference in deflection among substrates. That is, the same effects as in the first embodiment can be obtained.

<Other Embodiments>
The arrangement of the support is not particularly limited as long as the arrangement allows the substrate 10 to be uniformly bent. For example, by making the distance (three-dimensional distance) between some of the supports different from the distance between the other supports, the substrate 10 may be uniformly flexed. The support arrangement that can be adopted can also be specified as an arrangement in which the deflection of the substrate 10 between some of the supports is greater than the deflection among the other supports. Alternatively, the arrangement of adoptable supports can be specified as an arrangement in which the spacing between the supports is not equal. In addition, when the arrangement of adoptable supports is based on a virtual position when a plurality of supports are evenly arranged, at least one support is located at a position different from the reference position. It can also be specified as placement.

  As arrangement | positioning of such a support tool, arrangement | positioning as shown to FIG.13 (a) (b) is also employable besides the example demonstrated above. Each of FIGS. 13A and 13B is an arrangement example in which the plurality of supports are at the same height, but the distance between the supports at the center is larger than the distance between the supports at the end. The difference between FIG. 13 (a) and FIG. 13 (b) is that the distance between the supports at the center is different, but the method of bending the substrate 10 can be changed according to this distance.

<Modification>
In the description of the above embodiments, the movement of the support may be omitted. Therefore, the substrate holding unit 210 may not include the support moving mechanism 304. For example, as a modification of the first embodiment, the central support 403 may be fixed at a lower position than the other supports. If the distance between the support members is different, the bending manner when holding the substrate 10 can be made the same, and variations in the mounting position when the substrate 10 is mounted on the mask 220 can be suppressed.

  In the above description of the embodiment, the distance between the supports is adjusted on both of the opposing short sides, but the distance between the supports may be adjusted on only one side. Further, in the above embodiment, although the example in which the long side is held and the short side is supported is described, the short side may be held and the long side may be supported. In this case, the distance between the supports may be adjusted on at least one side that supports only. In addition, the distance between the support members may be adjusted on the side to be held.

In the above description of the embodiment, the timing of holding the long side of the substrate 10 may be changed as appropriate. For example, the substrate 10 may be placed on the mask body in a state in which the substrate 10 is released from being held. Alternatively, in a state where the substrate 10 is placed on the mask body, re-gripping of the substrate 10 (cancellation and re-clamping) may be performed.

  Also, although the first alignment (rough alignment) and the second alignment (fine alignment 9 are performed in two steps), the first alignment may be omitted and only the second alignment may be performed. After close contact (for example, FIG. 9C), alignment processing may be performed again.

<Example of Method of Manufacturing Electronic Device>
Next, an example of a method of manufacturing an electronic device using the film forming apparatus of the present embodiment will be described. Hereinafter, the configuration and manufacturing method of the organic EL display device will be illustrated as an example of the electronic device.

  First, an organic EL display device to be manufactured will be described. FIG. 14 (a) is an overall view of the organic EL display device 60, and FIG. 14 (b) shows a cross-sectional structure of one pixel.

  As shown in FIG. 14A, in the display area 61 of the organic EL display device 60, a plurality of pixels 62 including a plurality of light emitting elements are arranged in a matrix. Although details will be described later, each of the light emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The term “pixel” as used herein refers to the minimum unit capable of displaying a desired color in the display area 61. In the case of the organic EL display device according to the present example, the pixel 62 is configured by a combination of the first light emitting element 62R, the second light emitting element 62G, and the third light emitting element 62B that emit light different from each other. The pixel 62 is often composed of a combination of a red light emitting element, a green light emitting element and a blue light emitting element, but may be a combination of a yellow light emitting element, a cyan light emitting element and a white light emitting element It is not limited.

  FIG. 14B is a schematic partial cross-sectional view taken along line A-B in FIG. The pixel 62 includes a first electrode (anode) 64, a hole transport layer 65, one of light emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68 on a substrate 63. , And an organic EL element comprising Among these, the hole transport layer 65, the light emitting layers 66R, 66G, 66B, and the electron transport layer 67 correspond to the organic layer. Further, in the present embodiment, the light emitting layer 66R is an organic EL layer that emits red, the light emitting layer 66G is an organic EL layer that emits green, and the light emitting layer 66B is an organic EL layer that emits blue. The light emitting layers 66R, 66G, and 66B are formed in predetermined patterns corresponding to light emitting elements (sometimes described as organic EL elements) that emit red, green, and blue, respectively. In addition, the first electrode 64 is formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrode 68 may be formed in common with the plurality of light emitting elements 62R, 62G, and 62B, or may be formed for each light emitting element. An insulating layer 69 is provided between the first electrodes 64 in order to prevent the first electrodes 64 and the second electrodes 68 from being short-circuited by foreign matter. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 70 is provided to protect the organic EL element from moisture and oxygen.

  In order to form the organic EL layer in light emitting element units, a method of forming a film through a mask is used. In recent years, high definition of a display device has been advanced, and a mask having an opening width of several tens of μm is used to form an organic EL layer. In the case of film formation using such a mask, if the mask receives heat from the evaporation source during film formation and is thermally deformed, the position of the mask and the substrate will be shifted, and the thin film pattern formed on the substrate is desired. It will be formed out of position. Then, the film-forming apparatus (vacuum vapor deposition apparatus) concerning this invention is used suitably for film-forming of these organic electroluminescent layers.

  Next, an example of a method of manufacturing an organic EL display device will be specifically described.

First, a circuit 63 (not shown) for driving the organic EL display device and the substrate 63 on which the first electrode 64 is formed are prepared.

  An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so that an opening is formed in the portion where the first electrode 64 is formed. Form 69 The opening corresponds to a light emitting region in which the light emitting element actually emits light.

  The substrate 63 having the insulating layer 69 patterned is carried into the first film forming apparatus, and the substrate is held by the substrate holding unit, and a layer common to the hole transport layer 65 on the first electrode 64 in the display area As a film. The hole transport layer 65 is deposited by vacuum evaporation. In practice, the hole transport layer 65 is formed to have a size larger than that of the display area 61, so a high definition mask is not necessary.

  Next, the substrate 63 having the hole transport layer 65 formed thereon is carried into the second film forming apparatus, and held by the substrate holding unit. Alignment between the substrate and the mask is performed, the substrate is placed on the mask, and the light emitting layer 66R emitting red is formed on the portion of the substrate 63 where the element emitting red is disposed. According to this example, the mask and the substrate can be favorably superimposed, and highly accurate film formation can be performed.

  Similar to the film formation of the light emitting layer 66R, the light emitting layer 66G emitting green is formed by the third film forming apparatus, and the light emitting layer 66B emitting blue is formed by the fourth film forming apparatus. After film formation of the light emitting layers 66R, 66G, and 66B is completed, the electron transport layer 67 is formed on the entire display region 61 by the fifth film forming apparatus. The electron transport layer 67 is formed as a layer common to the three color light emitting layers 66R, 66G, and 66B.

  The substrate on which the electron transport layer 67 is formed is moved to a sputtering apparatus, the second electrode 68 is formed, and then the plasma CVD apparatus is moved to form a protective layer 70, thereby completing the organic EL display 60. Do.

  After the substrate 63 on which the insulating layer 69 is patterned is carried into a film forming apparatus and the film is exposed to an atmosphere containing moisture or oxygen until the film formation of the protective layer 70 is completed, the light emitting layer made of the organic EL material It may be degraded by moisture or oxygen. Therefore, in the present embodiment, the loading and unloading of the substrate between the film forming apparatuses is performed under a vacuum atmosphere or an inert gas atmosphere.

  In the organic EL display device thus obtained, the light emitting layer is formed with high accuracy for each light emitting element. Therefore, the use of the above-described manufacturing method can suppress the occurrence of defects in the organic EL display device due to the displacement of the light emitting layer.

  In addition, the support tool space | interval control and clamping force control which were mentioned above are applicable also in any scene before a 1st alignment, between a 1st alignment and a 2nd alignment, and after a 2nd alignment.

Reference numeral 210 substrate holding unit 250 substrate Z actuator 300, 401 to 405 support 304 support moving mechanism

A substrate support apparatus according to an aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports;
A substrate support apparatus comprising:
Wherein the plurality of support, when receiving the substrate from the conveying means, among a plurality of support for supporting the first side of the substrate, the distance between some of the adjacent support is adjacent the other The distance between the supports is different ,
The plurality of supports, wherein the support moving means is configured to move and move at least a part of the plurality of supports after the support means receives the substrate from the transfer means. Supporting the first side of the substrate by the support of

A substrate support apparatus according to an aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports;
Equipped with
The support moving means may be configured such that, after the support means receives the substrate from the transfer means, the distances between the adjacent supports are equal between the plurality of supports supporting the first side of the substrate. Moving the at least part of the support .
A substrate support apparatus according to an aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports;
Equipped with
The support moving means is configured to support at least a portion of the supports such that a plurality of supports supporting the first side of the substrate are arranged in a straight line after the support receives the substrate from the transfer means. To move.
A substrate support apparatus according to an aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports;
Equipped with
The support moving means is configured such that, after the support means receives the substrate from the transfer means, the support that is not in contact with the substrate of the plurality of supports supporting the first side of the substrate is the substrate Moving the at least part of the support so as to come into contact with
A substrate support apparatus according to an aspect of the present invention is
Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports such that the height in the direction of gravity changes;
And the like.

A substrate supporting method according to an aspect of the present invention is
A substrate support method comprising as support engineering for supporting the periphery of the substrate by a plurality of support,
Wherein the plurality of support, when receiving the substrate from the conveying means, among a plurality of support for supporting the first side of the substrate, the distance between some of the adjacent support is adjacent the other The distance between the supports is different ,
After the support means receives the substrate from the transfer means, the support of at least a part of the plurality of supports is moved, and the support including the moved support is moved by the plurality of supports. Supporting the first side .

A substrate supporting method according to an aspect of the present invention is
A supporting step of supporting the periphery of the substrate by a plurality of supports;
A support moving step of moving at least a part of the plurality of supports independently of the other supports;
Including
In the support moving step, after the plurality of supports receive the substrate from the transfer means, the distance between the adjacent supports is equal among the plurality of supports supporting the first side of the substrate. To move the at least part of the support .
A substrate supporting method according to an aspect of the present invention is
A supporting step of supporting the periphery of the substrate by a plurality of supports;
A support moving step of moving at least a part of the plurality of supports independently of the other supports;
Equipped with
In the support moving step, after the plurality of supports receive the substrate from the transfer means, the at least part of the plurality of supports that support the first side of the substrate are linearly arranged. Moving the support.
A substrate supporting method according to an aspect of the present invention is
A supporting step of supporting the periphery of the substrate by a plurality of supports;
A support moving step of moving at least a part of the plurality of supports independently of the other supports;
Equipped with
In the support moving step, after the plurality of supports receive the substrate from the transfer means, the support which is not in contact with the substrate among the plurality of supports supporting the first side of the substrate is Moving at least a portion of the support so as to be in contact with the substrate.
A substrate supporting method according to an aspect of the present invention is
A supporting step of supporting the periphery of the substrate by a plurality of supports;
A support moving step of moving at least a part of the plurality of supports independently of the other supports;
Including
In the support tool moving step, at least a part of the plurality of support tools are moved independently of the other support tools so that the height in the direction of gravity changes.

Claims (39)

Support means comprising a plurality of supports for supporting the periphery of the substrate;
Placing means for placing the substrate on a placement body;
A substrate mounting apparatus comprising:
The plurality of supports are characterized in that the distance between some of the supports is different from the distance between the other supports.   The plurality of supports support the periphery of the substrate such that the deflection of the substrate between the partial supports is greater than the deflection of the substrate between the other supports. The substrate mounting apparatus according to claim 1, wherein the substrate mounting apparatus is arranged.   Among the supports supporting the same side of the substrate, the plurality of supports are characterized in that the distance between some of the supports is different from the distance between the other supports. The substrate mounting apparatus of claim 1 or 2.   4. The support according to any one of claims 1 to 3, wherein at least one support at the center of the plurality of supports is disposed lower than the other supports on at least one side of the substrate. The board | substrate mounting apparatus as described in a term. Support means comprising a plurality of supports for supporting the periphery of the substrate;
A support moving means for moving at least a part of the plurality of supports independently of the other supports;
Placing means for placing the substrate on the placement body;
A substrate mounting apparatus comprising:   6. The apparatus according to claim 5, wherein the support moving means moves the at least some supports such that the distance between some of the supports is different from the distance between the other supports. Substrate mounting device.   The support moving means is configured such that when the peripheral edge of the substrate is supported by the support, the deflection of the substrate between some of the supports is greater than the deflection of the substrate between the other supports. The substrate mounting apparatus according to claim 5, wherein the at least part of the support is moved.   The support moving means may support at least a portion of the supports such that a distance between some supports is different from a distance between other supports between supports supporting the same side of the substrate. The substrate mounting apparatus according to any one of claims 5 to 7, wherein the tool is moved.   The support moving means moves the at least one support at the center so that at least one support at the center on at least one side of the substrate does not contact the substrate when receiving the substrate from the transfer robot. The substrate mounting apparatus according to any one of claims 5 to 8, characterized in that:   10. The substrate mounting apparatus according to claim 9, wherein the support moving means moves the at least one support at the center to contact the substrate after receiving the substrate from the transfer robot. . 10. The apparatus according to claim 9, wherein the support moving means moves the at least one support at the center to the same height while the substrate is placed on the mounting body. Or the substrate mounting apparatus as described in 10.   The substrate placing apparatus according to any one of claims 1 to 11, wherein the placing means includes a substrate elevating means for raising and lowering the substrate.   The substrate placing apparatus according to any one of claims 1 to 12, wherein the placing means includes a placing body elevating means for raising and lowering the placing body.   The substrate mounting apparatus according to any one of claims 1 to 13, further comprising position adjusting means for adjusting the relative position of the substrate and the mounting body.   The substrate placement apparatus according to any one of claims 1 to 14, wherein the placement body is a mask used to form a film of a predetermined pattern on the substrate. The substrate mounting apparatus according to any one of claims 1 to 15,
Film forming means for forming a film on the substrate;
The film-forming apparatus provided with A supporting step of supporting the peripheral edge of the substrate by a plurality of supports;
Placing the substrate on a carrier;
A substrate mounting method including:
The plurality of supports are characterized in that the distance between some of the supports is different from the distance between the other supports.   The plurality of supports support the periphery of the substrate such that the deflection of the substrate between the partial supports is greater than the deflection of the substrate between the other supports. The substrate mounting method according to claim 17, wherein the method is arranged.   Among the supports supporting the same side of the substrate, the plurality of supports are characterized in that the distance between some of the supports is different from the distance between the other supports. Item 19. The substrate mounting method according to item 17 or 18.   20. The support according to any one of claims 17 to 19, wherein at least one support at the center is disposed lower than the other supports at two opposing sides of the substrate. The substrate mounting method according to item 1 or 2. A supporting step of supporting the periphery of the substrate by a plurality of supports;
A support moving step of moving at least a part of the plurality of supports independently of the other supports;
A placement step of placing the substrate on the placement body;
A substrate mounting method including:   22. The supporting device moving step according to claim 21, wherein the supporting device moving step moves the at least some supporting device so that the distance between some of the supporting devices is different from the distance between the other supporting devices. Substrate mounting method.   In the support moving step, when the peripheral edge of the substrate is supported by the support, the deflection of the substrate between some of the supports is greater than the deflection of the substrate between the other supports. The substrate mounting method according to claim 21, wherein the at least part of the support is moved.   In the support moving step, between the supports supporting the same side of the substrate, the support between the at least parts such that the distance between some of the supports is different from the distance between the other supports. The substrate mounting method according to any one of claims 21 to 23, wherein the tool is moved.   The substrate placement according to any one of claims 21 to 24, wherein the support moving step is performed before the placement step, after the placement step, or before and after the placement step. Method. The support moving step is
A first step of moving the at least part of the support to a position not in contact with the substrate;
Moving the at least part of the support to a position in contact with the substrate;
The substrate mounting method according to any one of claims 21 to 25, comprising:   The support moving step moves the at least one support at the center so that at least one support at the center on at least one side of the substrate does not contact the substrate when the substrate is received from the transfer robot. The substrate mounting method according to any one of claims 21 to 26, comprising a step.   The substrate according to claim 27, wherein the support moving step includes moving the at least one support at the center to contact the substrate after receiving the substrate from the transfer robot. Mounting method.   The step of moving the support includes moving the at least one support at the center to the same height while the substrate is placed on the mounting body. A substrate mounting method according to claim 27 or 28.   The substrate mounting method according to any one of claims 17 to 29, wherein the substrate is moved up and down in the mounting step.   The substrate mounting method according to any one of claims 17 to 30, wherein in the mounting step, the mounting body is moved up and down.   The method further includes a first position adjusting step of adjusting a relative position between the substrate and the mounting body in a direction parallel to the surface of the mounting body before the mounting step. Item 32. The substrate mounting method according to any one of items 17 to 31.   The method according to claim 1, further comprising a second position adjusting step of adjusting a relative position between the substrate and the mounting body in a direction parallel to the surface of the mounting body after the mounting step. The substrate mounting method according to any one of 17 to 32. In the second position adjustment step,
Measuring the relative displacement between the substrate and the mounting body while the substrate is mounted on the mounting body;
Separating the substrate from the carrier;
Adjusting the relative position between the substrate and the mounting body in a direction parallel to the surface of the mounting body based on the measured relative deviation;
The substrate mounting method according to claim 33, further comprising: The substrate mounting method according to any one of claims 17 to 34, wherein the substrate is a mask used to form a film of a predetermined pattern on the substrate. A film forming method for forming a film of a predetermined pattern on a substrate, comprising:
A step of placing the substrate on the support according to the substrate placing method according to any one of claims 17 to 35;
Forming a film on the substrate;
A film forming method including: A method of manufacturing an electronic device having an organic film formed on a substrate, comprising:
A method of manufacturing an electronic device, wherein the organic film is formed by the film forming method according to claim 36. A method of manufacturing an electronic device having a metal film formed on a substrate, comprising:
A method of manufacturing an electronic device, wherein the metal film is formed by the film forming method according to claim 36. The method of manufacturing an electronic device according to claim 37, wherein the electronic device is a display panel of an organic EL display device.

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